CN103633000B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

Info

Publication number
CN103633000B
CN103633000B CN201310364328.7A CN201310364328A CN103633000B CN 103633000 B CN103633000 B CN 103633000B CN 201310364328 A CN201310364328 A CN 201310364328A CN 103633000 B CN103633000 B CN 103633000B
Authority
CN
China
Prior art keywords
substrate
swing
detection
swing member
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310364328.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103633000A (zh
Inventor
末吉秀树
宫迫久显
荻原洁
滨田崇广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN103633000A publication Critical patent/CN103633000A/zh
Application granted granted Critical
Publication of CN103633000B publication Critical patent/CN103633000B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN201310364328.7A 2012-08-22 2013-08-20 基板处理装置 Active CN103633000B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012182964A JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置
JP2012-182964 2012-08-22

Publications (2)

Publication Number Publication Date
CN103633000A CN103633000A (zh) 2014-03-12
CN103633000B true CN103633000B (zh) 2016-05-04

Family

ID=50213886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310364328.7A Active CN103633000B (zh) 2012-08-22 2013-08-20 基板处理装置

Country Status (4)

Country Link
JP (1) JP6000019B2 (enExample)
KR (1) KR101473107B1 (enExample)
CN (1) CN103633000B (enExample)
TW (1) TWI494260B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD800083S1 (en) 2015-02-23 2017-10-17 Samsung Electronics Co., Ltd. Electronic device
CN105107776B (zh) * 2015-08-24 2017-06-27 京东方科技集团股份有限公司 检测装置及工件清洗设备
CN105865495B (zh) * 2016-06-20 2017-12-01 武汉华星光电技术有限公司 位置检知装置
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
CN109142388B (zh) * 2018-08-01 2021-04-13 京东方科技集团股份有限公司 基板检测器、驱动装置以及基板清洁设备
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
USD959424S1 (en) 2020-02-26 2022-08-02 Samsung Electronics Co., Ltd. Mobile telephone
KR102590191B1 (ko) * 2020-06-30 2023-10-16 시바우라 메카트로닉스 가부시끼가이샤 실장 장치 및 실장 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420480A (en) * 2003-04-04 2004-10-16 Mosel Vitelic Inc Wafer transmission system with sensor
CN102253505A (zh) * 2010-05-20 2011-11-23 北京京东方光电科技有限公司 基板位置检测方法及装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737285B2 (ja) * 1993-02-22 1995-04-26 吉田車輌機器株式会社 荷検出装置
JPH10265026A (ja) * 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd ワーク通過検出装置
JPH1111640A (ja) * 1997-06-30 1999-01-19 Okamura Corp ローラコンベヤにおける搬送物検出装置
JP2001057355A (ja) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2002110004A (ja) * 2000-09-29 2002-04-12 Nippon Kentetsu Co Ltd 通過検出スイッチ
JP2003128244A (ja) * 2001-10-30 2003-05-08 Sumitomo Precision Prod Co Ltd 基板検出装置及び基板処理設備
TWM259245U (en) * 2004-05-28 2005-03-11 Jing Bo Technology Co Ltd Magnetically swinging counting controller and resetting structure
JP2007066985A (ja) * 2005-08-29 2007-03-15 Shibaura Mechatronics Corp 基板の検出装置及び処理装置
KR20070048483A (ko) * 2005-11-04 2007-05-09 세메스 주식회사 기판을 처리하는 장치 및 기판을 처리하는 방법
KR101071174B1 (ko) * 2008-11-26 2011-10-10 에프엔에스테크 주식회사 기판 감지장치
JP2010133884A (ja) * 2008-12-08 2010-06-17 Sharp Corp 振り子センサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200420480A (en) * 2003-04-04 2004-10-16 Mosel Vitelic Inc Wafer transmission system with sensor
CN102253505A (zh) * 2010-05-20 2011-11-23 北京京东方光电科技有限公司 基板位置检测方法及装置

Also Published As

Publication number Publication date
KR101473107B1 (ko) 2014-12-16
CN103633000A (zh) 2014-03-12
JP6000019B2 (ja) 2016-09-28
TW201414653A (zh) 2014-04-16
TWI494260B (zh) 2015-08-01
JP2014041897A (ja) 2014-03-06
KR20140026256A (ko) 2014-03-05

Similar Documents

Publication Publication Date Title
CN103633000B (zh) 基板处理装置
CN100533293C (zh) 纸张输送装置、图像形成装置
JP2014041897A5 (enExample)
CN104097965A (zh) 纸张传送用的偏向滚轮装置及改变纸张传送路径的方法
KR102698070B1 (ko) 기판 매핑 장치, 그 매핑 방법 및 매핑 교시 방법
JP6008917B2 (ja) 基板検出装置および基板処理装置
JP4413953B2 (ja) 欠落部分を有する欠落被搬送体の検出方法
JP2003273190A (ja) 真空処理装置、ゲ−トバルブ、および欠落被搬送体の検出方法
JP2013140934A (ja) 垂直移送治具及びこれを用いた湿式処理装置
JP2008254884A (ja) 整列搬送装置
JP2010143708A5 (enExample)
US11721568B2 (en) Substrate transfer apparatus
JP7148289B2 (ja) 基板検出装置及び基板処理装置
JP6857682B2 (ja) 基板処理装置
KR101065324B1 (ko) 기판 감지 장치 및 이를 포함하는 기판 처리 장치
CN102653345B (zh) 工件的搬运装置
TW201306165A (zh) 校準裝置及校準方法
KR101427695B1 (ko) 디스플레이 기판 이송장치
JP2011022395A5 (enExample)
KR101071174B1 (ko) 기판 감지장치
TW201933512A (zh) 薄膜框架把持裝置及薄膜框架把持方法
JP2001217303A (ja) ガラス基板の基板端検出装置
JPH10116878A (ja) 光電式センサ及びウエハ検出装置
CN207242861U (zh) 一种表面摩擦系数差异大的物品的翻面装置
JP2007274349A (ja) 圧電振動片の整列方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant