TWI470097B - 有機蒸鍍材料用蒸鍍裝置以及有機薄膜之製造方法 - Google Patents
有機蒸鍍材料用蒸鍍裝置以及有機薄膜之製造方法 Download PDFInfo
- Publication number
- TWI470097B TWI470097B TW96117925A TW96117925A TWI470097B TW I470097 B TWI470097 B TW I470097B TW 96117925 A TW96117925 A TW 96117925A TW 96117925 A TW96117925 A TW 96117925A TW I470097 B TWI470097 B TW I470097B
- Authority
- TW
- Taiwan
- Prior art keywords
- vapor deposition
- organic
- container
- mounting groove
- thin film
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims description 150
- 239000010409 thin film Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000008020 evaporation Effects 0.000 title claims description 15
- 238000001704 evaporation Methods 0.000 title claims description 15
- 238000007740 vapor deposition Methods 0.000 claims description 290
- 238000003860 storage Methods 0.000 claims description 81
- 239000010408 film Substances 0.000 claims description 39
- 230000015572 biosynthetic process Effects 0.000 claims description 30
- 239000011368 organic material Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- 150000002894 organic compounds Chemical class 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 59
- 238000001816 cooling Methods 0.000 description 6
- 239000000112 cooling gas Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003339 best practice Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5893—Mixing of deposited material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006140793 | 2006-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806802A TW200806802A (en) | 2008-02-01 |
| TWI470097B true TWI470097B (zh) | 2015-01-21 |
Family
ID=38723183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96117925A TWI470097B (zh) | 2006-05-19 | 2007-05-18 | 有機蒸鍍材料用蒸鍍裝置以及有機薄膜之製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8308866B2 (ja) |
| EP (1) | EP2025774B1 (ja) |
| JP (1) | JP4815447B2 (ja) |
| KR (1) | KR101071605B1 (ja) |
| CN (1) | CN101356296B (ja) |
| TW (1) | TWI470097B (ja) |
| WO (1) | WO2007135870A1 (ja) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2008310584A1 (en) * | 2007-10-12 | 2009-04-16 | University Of Delaware | Thermal evaporation sources for wide-area deposition |
| KR101205752B1 (ko) * | 2008-02-26 | 2012-11-28 | 가부시키가이샤 알박 | 성막원, 증착 장치, 유기 ｅｌ 소자의 제조 장치 |
| JP5114288B2 (ja) * | 2008-05-16 | 2013-01-09 | 株式会社アルバック | 成膜装置、有機薄膜形成方法 |
| US7945344B2 (en) * | 2008-06-20 | 2011-05-17 | SAKT13, Inc. | Computational method for design and manufacture of electrochemical systems |
| US9249502B2 (en) * | 2008-06-20 | 2016-02-02 | Sakti3, Inc. | Method for high volume manufacture of electrochemical cells using physical vapor deposition |
| JP5186591B2 (ja) * | 2009-02-24 | 2013-04-17 | 株式会社アルバック | 有機化合物蒸気発生装置及び有機薄膜製造装置 |
| WO2010111084A2 (en) * | 2009-03-24 | 2010-09-30 | Drexel University | Poly(ethylene glycol) and poly(ethylene oxide) by initiated chemical vapor deposition |
| US8357464B2 (en) | 2011-04-01 | 2013-01-22 | Sakti3, Inc. | Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells |
| JP4782219B2 (ja) * | 2009-07-02 | 2011-09-28 | 三菱重工業株式会社 | 真空蒸着装置 |
| DE102009029236B4 (de) | 2009-09-07 | 2023-02-16 | Robert Bosch Gmbh | Verdampfer, Anordnung von Verdampfern sowie Beschichtungsanlage |
| JP5410235B2 (ja) | 2009-10-15 | 2014-02-05 | 小島プレス工業株式会社 | 有機高分子薄膜の形成方法及び形成装置 |
| US8252117B2 (en) * | 2010-01-07 | 2012-08-28 | Primestar Solar, Inc. | Automatic feed system and related process for introducing source material to a thin film vapor deposition system |
| KR101525813B1 (ko) * | 2010-12-09 | 2015-06-05 | 울박, 인크 | 유기 박막 형성 장치 |
| US20120028393A1 (en) * | 2010-12-20 | 2012-02-02 | Primestar Solar, Inc. | Vapor deposition apparatus and process for continuous deposition of a doped thin film layer on a substrate |
| US20120052617A1 (en) * | 2010-12-20 | 2012-03-01 | General Electric Company | Vapor deposition apparatus and process for continuous deposition of a doped thin film layer on a substrate |
| JP5697500B2 (ja) * | 2011-03-16 | 2015-04-08 | 株式会社アルバック | 真空蒸着装置及び薄膜の形成方法 |
| US10770745B2 (en) | 2011-11-09 | 2020-09-08 | Sakti3, Inc. | Monolithically integrated thin-film solid state lithium battery device having multiple layers of lithium electrochemical cells |
| JP5877245B2 (ja) | 2011-06-22 | 2016-03-02 | アイクストロン、エスイー | 気相蒸着方法及び気相蒸着装置 |
| WO2012175124A1 (en) | 2011-06-22 | 2012-12-27 | Aixtron Se | Vapor deposition material source and method for making same |
| WO2012175128A1 (en) | 2011-06-22 | 2012-12-27 | Aixtron Se | Vapor deposition system and supply head |
| DE102011051260A1 (de) | 2011-06-22 | 2012-12-27 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden von OLEDs |
| WO2013005781A1 (ja) * | 2011-07-05 | 2013-01-10 | 東京エレクトロン株式会社 | 成膜装置 |
| US8677932B2 (en) * | 2011-08-03 | 2014-03-25 | First Solar, Inc. | Apparatus for metering granular source material in a thin film vapor deposition apparatus |
| US8301285B2 (en) | 2011-10-31 | 2012-10-30 | Sakti3, Inc. | Computer aided solid state battery design method and manufacture of same using selected combinations of characteristics |
| US20130115372A1 (en) * | 2011-11-08 | 2013-05-09 | Primestar Solar, Inc. | High emissivity distribution plate in vapor deposition apparatus and processes |
| US9127344B2 (en) | 2011-11-08 | 2015-09-08 | Sakti3, Inc. | Thermal evaporation process for manufacture of solid state battery devices |
| US20130220546A1 (en) * | 2011-11-09 | 2013-08-29 | Sakti 3, Inc. | High throughput physical vapor deposition apparatus and method for manufacture of solid state batteries |
| US20120055633A1 (en) * | 2011-11-09 | 2012-03-08 | Sakti3, Inc. | High throughput physical vapor deposition apparatus and method for manufacture of solid state batteries |
| US9627717B1 (en) | 2012-10-16 | 2017-04-18 | Sakti3, Inc. | Embedded solid-state battery |
| KR101461738B1 (ko) * | 2012-12-21 | 2014-11-14 | 주식회사 포스코 | 가열장치 및 이를 포함하는 코팅 시스템 |
| JP6222929B2 (ja) * | 2013-01-15 | 2017-11-01 | 日立造船株式会社 | 真空蒸着装置 |
| JP5728560B2 (ja) * | 2013-11-05 | 2015-06-03 | 小島プレス工業株式会社 | 有機高分子薄膜の形成方法及び形成装置 |
| US9627709B2 (en) | 2014-10-15 | 2017-04-18 | Sakti3, Inc. | Amorphous cathode material for battery device |
| JP6490435B2 (ja) * | 2014-12-26 | 2019-03-27 | 株式会社オプトラン | 成膜方法及び成膜装置 |
| TWI541612B (zh) * | 2014-12-30 | 2016-07-11 | Organic vacuum coating system and film forming method | |
| KR102149172B1 (ko) * | 2015-10-06 | 2020-08-28 | 가부시키가이샤 아루박 | 재료 공급 장치 및 증착 장치 |
| CN116313172A (zh) | 2016-03-08 | 2023-06-23 | 泰拉能源公司 | 裂变产物吸气剂 |
| CN106119781B (zh) | 2016-07-27 | 2018-10-30 | 京东方科技集团股份有限公司 | 蒸发装置、蒸镀设备和蒸镀方法 |
| JP6595421B2 (ja) | 2016-08-24 | 2019-10-23 | 東芝メモリ株式会社 | 気化システム |
| CN207038182U (zh) | 2017-03-29 | 2018-02-23 | 泰拉能源有限责任公司 | 铯收集器 |
| KR20220051165A (ko) | 2019-08-23 | 2022-04-26 | 테라파워, 엘엘씨 | 나트륨 기화기 및 나트륨 기화기의 사용 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3563202A (en) * | 1969-06-25 | 1971-02-16 | Pennwalt Corp | Mobile vbaporative firing source |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3554512A (en) * | 1969-03-24 | 1971-01-12 | George H Elliott | Crucible for holding molten semiconductor materials |
| DE3908265A1 (de) * | 1989-03-14 | 1990-09-20 | Leybold Ag | Chargiervorrichtung fuer schmelzanlagen |
| JP3189038B2 (ja) * | 1997-01-14 | 2001-07-16 | 住友重機械工業株式会社 | 真空成膜装置の材料供給装置 |
| JPH11200014A (ja) * | 1998-01-13 | 1999-07-27 | Kao Corp | 真空成膜方法、及び真空成膜装置 |
| JP4312289B2 (ja) * | 1999-01-28 | 2009-08-12 | キヤノンアネルバ株式会社 | 有機薄膜形成装置 |
| ATE497028T1 (de) * | 2000-06-22 | 2011-02-15 | Panasonic Elec Works Co Ltd | Vorrichtung und verfahren zum vakuum-ausdampfen |
| US6551405B1 (en) * | 2000-09-22 | 2003-04-22 | The Board Of Trustees Of The University Of Arkansas | Tool and method for in situ vapor phase deposition source material reloading and maintenance |
| DE10100670A1 (de) * | 2001-01-09 | 2002-08-14 | Univ Braunschweig Tech | Zuführvorrichtung für eine CVD-Anlage |
| JP4599727B2 (ja) * | 2001-02-21 | 2010-12-15 | 株式会社デンソー | 蒸着装置 |
| TWI264473B (en) * | 2001-10-26 | 2006-10-21 | Matsushita Electric Works Ltd | Vacuum deposition device and vacuum deposition method |
| JP2003160856A (ja) * | 2001-11-27 | 2003-06-06 | Matsushita Electric Ind Co Ltd | 蒸着装置と薄膜形成方法およびそれらを用いた表示装置 |
| JP4153713B2 (ja) * | 2002-04-01 | 2008-09-24 | 株式会社アルバック | 蒸発源及びこれを用いた薄膜形成装置 |
| KR101137901B1 (ko) * | 2003-05-16 | 2012-05-02 | 에스브이티 어소시에이츠, 인코포레이티드 | 박막 증착 증발기 |
| US8123862B2 (en) * | 2003-08-15 | 2012-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Deposition apparatus and manufacturing apparatus |
| US7501151B2 (en) * | 2004-09-21 | 2009-03-10 | Eastman Kodak Company | Delivering particulate material to a vaporization zone |
| US7501152B2 (en) * | 2004-09-21 | 2009-03-10 | Eastman Kodak Company | Delivering particulate material to a vaporization zone |
| FI118803B (fi) * | 2005-04-22 | 2008-03-31 | Beneq Oy | Lähde, järjestely lähteen asentamiseksi sekä menetelmä lähteen asentamiseksi ja poistamiseksi |
-
2007
- 2007-05-11 WO PCT/JP2007/059723 patent/WO2007135870A1/ja active Application Filing
- 2007-05-11 EP EP07743158.3A patent/EP2025774B1/en active Active
- 2007-05-11 CN CN2007800013758A patent/CN101356296B/zh active Active
- 2007-05-11 KR KR1020087012130A patent/KR101071605B1/ko active IP Right Grant
- 2007-05-11 JP JP2007540847A patent/JP4815447B2/ja active Active
- 2007-05-18 TW TW96117925A patent/TWI470097B/zh active
-
2008
- 2008-09-17 US US12/212,030 patent/US8308866B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3563202A (en) * | 1969-06-25 | 1971-02-16 | Pennwalt Corp | Mobile vbaporative firing source |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2025774B1 (en) | 2014-03-05 |
| US8308866B2 (en) | 2012-11-13 |
| CN101356296A (zh) | 2009-01-28 |
| EP2025774A4 (en) | 2012-07-25 |
| KR20080078644A (ko) | 2008-08-27 |
| TW200806802A (en) | 2008-02-01 |
| WO2007135870A1 (ja) | 2007-11-29 |
| JP4815447B2 (ja) | 2011-11-16 |
| US20090061090A1 (en) | 2009-03-05 |
| CN101356296B (zh) | 2011-03-30 |
| JPWO2007135870A1 (ja) | 2009-10-01 |
| EP2025774A1 (en) | 2009-02-18 |
| KR101071605B1 (ko) | 2011-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI470097B (zh) | 有機蒸鍍材料用蒸鍍裝置以及有機薄膜之製造方法 | |
| JP5114288B2 (ja) | 成膜装置、有機薄膜形成方法 | |
| KR101167546B1 (ko) | 증착 장치 | |
| JP5008624B2 (ja) | 成膜方法、蒸着装置 | |
| JP5657029B2 (ja) | コーティング装置及び遮蔽プレートを有するコーティング装置の操作方法 | |
| US6275649B1 (en) | Evaporation apparatus | |
| TW200907078A (en) | Deposition source, deposition apparatus, and film forming method | |
| US20150247234A1 (en) | Method for reloading an evaporation cell | |
| TWI428456B (zh) | 有機材料蒸氣產生裝置，成膜源，成膜裝置 | |
| TW201002840A (en) | Deposition source, deposition device, and device for manufacturing organic electroluminescence device | |
| KR20110005636A (ko) | 성막 장치와 그 증발원 장치 및 그 증발원 용기 | |
| JP4342868B2 (ja) | 成膜装置 | |
| JP2015209593A (ja) | 蒸発セル | |
| JP5203584B2 (ja) | 成膜装置、成膜システムおよび成膜方法 | |
| JP2010111916A (ja) | 真空蒸着装置、蒸着源、成膜室、蒸着容器交換方法 | |
| US6473564B1 (en) | Method of manufacturing thin organic film | |
| KR100518147B1 (ko) | 증착장치,유기증발원및유기박막제조방법 | |
| JP2005179764A (ja) | 蒸着装置 | |
| JPH10158820A (ja) | 蒸着装置、有機蒸発源、有機薄膜製造方法 | |
| TW409150B (en) | Evaporation apparatus, organic material evaporation source and method of manufacturing thin organic film | |
| JP5697500B2 (ja) | 真空蒸着装置及び薄膜の形成方法 | |
| JP2010144212A (ja) | 材料供給装置及び材料供給方法 | |
| JP2013108123A (ja) | 成膜装置及び成膜方法 | |
| JP2003342718A (ja) | 有機膜形成装置 |