TWI465487B - 光半導體密封用樹脂組成物 - Google Patents

光半導體密封用樹脂組成物 Download PDF

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Publication number
TWI465487B
TWI465487B TW099118393A TW99118393A TWI465487B TW I465487 B TWI465487 B TW I465487B TW 099118393 A TW099118393 A TW 099118393A TW 99118393 A TW99118393 A TW 99118393A TW I465487 B TWI465487 B TW I465487B
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TW
Taiwan
Prior art keywords
mass
parts
resin composition
optical semiconductor
group
Prior art date
Application number
TW099118393A
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English (en)
Chinese (zh)
Other versions
TW201105715A (en
Inventor
Manabu Ueno
Hayato Tanaka
Tsutomu Kashiwagi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW201105715A publication Critical patent/TW201105715A/zh
Application granted granted Critical
Publication of TWI465487B publication Critical patent/TWI465487B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
TW099118393A 2009-06-12 2010-06-07 光半導體密封用樹脂組成物 TWI465487B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009141522A JP5305452B2 (ja) 2009-06-12 2009-06-12 光半導体素子封止用樹脂組成物

Publications (2)

Publication Number Publication Date
TW201105715A TW201105715A (en) 2011-02-16
TWI465487B true TWI465487B (zh) 2014-12-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW099118393A TWI465487B (zh) 2009-06-12 2010-06-07 光半導體密封用樹脂組成物

Country Status (4)

Country Link
JP (1) JP5305452B2 (ko)
KR (1) KR101682717B1 (ko)
CN (1) CN101921456B (ko)
TW (1) TWI465487B (ko)

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JP5380325B2 (ja) * 2010-02-18 2014-01-08 日東電工株式会社 光半導体素子封止用熱硬化性樹脂組成物およびその硬化体、ならびにそれを用いて得られる光半導体装置
JP5489280B2 (ja) * 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
KR20120078606A (ko) * 2010-12-31 2012-07-10 제일모직주식회사 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP5781511B2 (ja) 2011-02-04 2015-09-24 株式会社Adeka ヒンダードアミン骨格を有する化合物及び樹脂組成物
JP2012180498A (ja) * 2011-02-10 2012-09-20 Jsr Corp 硬化性組成物、光半導体封止材、レンズ及びブルーレイディスクドライブの光ピックアップ用レンズ
KR101870304B1 (ko) * 2011-02-18 2018-06-22 제이엔씨 주식회사 경화성 수지 조성물 및 이것을 사용한 색 변환 재료
JP6061471B2 (ja) * 2011-09-16 2017-01-18 積水化学工業株式会社 光半導体装置及び光半導体装置の製造方法
KR101905834B1 (ko) * 2012-05-31 2018-10-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 발광장치
JP5958107B2 (ja) * 2012-06-15 2016-07-27 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
US8822593B2 (en) * 2012-06-22 2014-09-02 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
JP2014037528A (ja) * 2012-07-19 2014-02-27 Dexerials Corp 光反射性異方性導電接着剤及び発光装置
CN102964776A (zh) * 2012-10-25 2013-03-13 上纬（上海）精细化工有限公司 一种封装树脂组合物
JP6003763B2 (ja) * 2012-10-30 2016-10-05 デクセリアルズ株式会社 熱硬化性樹脂組成物、光反射性異方性導電接着剤及び発光装置
KR102007194B1 (ko) * 2013-02-14 2019-08-05 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 발광 장치
KR101405532B1 (ko) * 2013-10-29 2014-06-20 주식회사 네패스신소재 에폭시 수지 조성물 및 이를 포함하는 광반도체 장치
JP6115457B2 (ja) * 2013-12-05 2017-04-19 デクセリアルズ株式会社 グリシジルイソシアヌリル変性ポリシロキサンの製造方法
KR101731681B1 (ko) 2014-12-12 2017-05-02 삼성에스디아이 주식회사 에폭시수지 조성물 및 이를 사용하여 제조된 반도체 소자
JP6332636B2 (ja) * 2015-03-26 2018-05-30 豊田合成株式会社 発光装置及び該発光装置用の封止層
JP6483588B2 (ja) * 2015-07-14 2019-03-13 四国化成工業株式会社 イソシアヌレート化合物、樹脂組成物およびその利用
JPWO2017099193A1 (ja) * 2015-12-11 2018-09-27 日本化薬株式会社 エポキシ樹脂組成物、エポキシ樹脂組成物成型体、硬化物および半導体装置
JP7465703B2 (ja) 2020-03-30 2024-04-11 日東電工株式会社 光半導体封止用樹脂成形物およびその製造方法

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JP2005343998A (ja) * 2004-06-02 2005-12-15 Asahi Kasei Corp 発光素子封止用樹脂組成物
JP2007106798A (ja) * 2005-10-11 2007-04-26 Jsr Corp 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法

Also Published As

Publication number Publication date
KR101682717B1 (ko) 2016-12-05
KR20100133898A (ko) 2010-12-22
CN101921456B (zh) 2013-07-03
JP2010285563A (ja) 2010-12-24
JP5305452B2 (ja) 2013-10-02
CN101921456A (zh) 2010-12-22
TW201105715A (en) 2011-02-16

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