TW201105715A - Resin composition for sealing optical semiconductor - Google Patents

Abstract

An epoxy resin for sealing optical semiconductor device has excellent heat resistance, light resistance and mainly crack resistance. The resin for sealing optical semiconductor device of this invention includes following component (A), component (B) and component (C): (A) a silicone modified epoxy compound having two epoxy group or more in one molecular represented by following formula (1), and a dispersion degree is in 1.0 to 1.2 (R1 is independently C1-10 substituent or unsubstituent one valence hydrocarbon group, R2 is a group represented by following formula (2) or formula (3), a, b are more than one integer selected from integers of 0 to 20) (B) a harden agent (C) a harden catalyst.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicon modified epoxy which is excellent for heat resistance test and which is excellent in heat crack resistance for sealing an optical semiconductor element. Resin composition. [Prior Art] Conventionally, a transparent epoxy resin composition has been widely used as an optical semiconductor element sealing resin for sealing an optical semiconductor element. The component of the epoxy resin composition for optical semiconductor sealing usually contains an alicyclic epoxy resin, a curing agent, and a curing catalyst, and is formed by a molding method such as casting molding or transfer molding. The epoxy resin composition for optical semiconductor sealing flows into a mold in which an optical semiconductor element is disposed and is cured to seal the optical semiconductor element (Patent Document 1 and Patent Document 2). However, recently, with the brighter and higher power of blue light-emitting diodes (LEDs) and white LEDs, LED components sealed with conventional transparent epoxy resins appear to have a wavelength change over time. Short blue light or ultraviolet light and discoloration (yellowing). Moreover, problems such as high water absorption rate and poor moisture resistance durability have also been pointed out. Therefore, those skilled in the art have also proposed a resin composition for protecting a photo-semiconductor element, the resin composition for coating protection of the photo-semiconductor element comprising: at least two carbons having reactivity with a SiH group in one molecule - an organic compound having a carbon double bond or a ruthenium resin, which contains 6 201105715 34693pif at least two SiH group ruthenium compounds, and a hydrosilylation catalyst (Patent Document 3, Patent Document 4) 0 However, this The ketone-based cured product has the following disadvantages: if the crack resistance is to be improved, the tacky surface of the cured product usually has a tack, which is liable to adhere to dust and impair the light transmittance. In order to solve these problems, those skilled in the art have proposed to use a high hardness fluorenone resin for protecting a coating (Patent Document 5, Patent Document 6). However, a case type light-emitting semiconductor device in which a light-emitting element is disposed in a ceramic and/or plastic case and filled with an oxime resin inside the case has the following problem, that is, Because these high hardness fluorenone resins have insufficient toughness and adhesion, they are at _4 〇. In the thermal shock test of (:~12〇^:, the fluorenone resin is peeled off from the ceramic or plastic of the casing, or cracks are generated, etc. Further, as a composition having the possibility of compensating for these disadvantages, A composition comprising an epoxy resin and a linaloyl resin (Patent Document 7 and Patent Document 8), but such a composition also has a problem of insufficient adhesion or f-light deterioration and discoloration. Further, in order to improve the strength of the resin , UV resistance, a cation curing catalyst is used to catalyze a siloxane compound having an epoxy group and/or an oxetanylgrupup with a silsesquioxane compound. A method of hardening (Patent Document 9), but there are problems such as corrosion and coloring caused by onium ions or the like generated by the cation hardening catalyst to be used. In addition, a combination of a sesquisesquioxane compound and a hydrogenated epoxy resin is proposed. B-stage 201105715 34693pif (B-Stage) resin composition of resin (Patent Document 1), but this use of hydrogenated epoxy resin The fat composition has a problem of poor ultraviolet resistance. Further, a composition comprising an organopolysiloxane containing an isocyanuric acid derivative group and an epoxy resin is proposed (Patent Document U), an organic polyoxyalkylene oxide. It is generally used as an additive in phenol resin and epoxy resin of the world-sealed semiconductor. However, this epoxy resin composition is not used to transparently seal the LED, and the skeleton of the fluorenone main chain is also limited to In the case of the linear chain, the molecular weight distribution of the anthrone is not mentioned. [Patent Document 1] Japanese Patent No. 3241338 [Patent Document 2] Japanese Patent Laid-Open No. Hei 7-25987 (Patent Document 3) Japanese Patent Laid-Open No. 2002- [Patent Document 4] Japanese Patent Laid-Open Publication No. JP-A-2002-338133 [Patent Document 5] Japanese Patent Laid-Open Publication No. JP-A No. Hei. [Patent Document 8] Japanese Patent No. 3396652 [Patent Document 9] Japanese Patent Laid-Open No. 2004-238589 (Patent Document 10) Japanese Patent Laid-Open No. 2005-263869 number [Patent Document 11] JP-A-2004-99751 SUMMARY OF THE INVENTION The present invention has been studied in the above-described circumstances, and an object of the present invention is to provide heat resistance, light resistance and mainly tortoise resistance. In order to achieve the above object, the inventors of the present invention have intensively studied and found that the fluorenone modified epoxy represented by the following formula (1) is 8 201 i〇m. The compound can form a cured product excellent in heat resistance, light resistance, and crack resistance. In other words, the present invention is a resin composition for sealing a photo-semiconductor, which comprises the following components (A), (B) and (C): (A) having two or more epoxys in one molecule. The base is represented by the following formula, and the fluorenone modified epoxy compound having a degree of dispersion within 丨.〇~丨.2 is 100 parts by mass. [Chem. 1] R1 | R1 , 1 , R1 | Ri III _S ΟΙ - I -Si-O-II -Si-R2 (l) R1 1 R1 a I R2 b 1 R1 (R1 is independent of each other and is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and R2 is represented by the following formula (2) or a group represented by the formula (3), a and b are one or more integers selected from the integers 0 to 20) [Chemical 2]

[化3] 201105715 34693pif

(3) (B) The curing agent is 0.1 parts by mass to 100 parts by mass. (C) The curing catalyst is 0.05 parts by mass to 3 parts by mass based on 100 parts by mass of the total of the components (a) and (B). [Effect of the Invention] The fluorenone-modified epoxy resin composition for optical semiconductor element sealing of the present invention is desired to reduce the thermal expansion strain of the polymer body and the low molecular weight body by controlling the molecular weight distribution of the linaloone. Poor, thereby eliminating the thermal expansion strain of the composition as a whole. As a result, sealing of an optical semiconductor element excellent in crack resistance and excellent in heat and light resistance is achieved. The above description is only an overview of the technical solutions of the present invention. In order to provide a clearer understanding of the technical means of the present invention, and in accordance with the contents of the specification, the following detailed description of the preferred embodiments of the present invention is provided. [Embodiment] In a molecule and a degree of dispersion I. (A) % of mash mash; _ gas compound and method for producing the same The 'special& The above epoxy group is represented by the following formula: 1.0 to 1.2, more preferably 1.0 to 1.1. [4] (1) 201105715 34693pif R1 R1

2 I r I

R2—Si—0—Si—O R1 R1 f I 1 I 2 —Sh-0—Si—R2

i I a r2 Jb ri R2 is represented by the following formula (2) or formula (3). [Chemical 5]

(2) (6) R1 is independently of each other and is a monovalent hydrocarbon group having 1 to 10 carbon atoms, specifically, an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, a cyclopentyl group or a cyclohexyl group. a cycloalkyl group such as a phenyl group or a norbornyl group; an aryl group such as a phenyl group; and the like, and a 3,3,3-trifluoropropyl group or a 3-hydroxy group obtained by substituting these groups with a halogen group or an amino group. Propyl, 3-aminopropyl and the like. Among these monovalent hydrocarbon groups, a mercapto group, a phenyl group, and preferably 90 mol% or more of all R1 are a methyl group.

11 201105715 34693pif In the formula (1), a and b are one or more integers selected from the integers 0 to 20, and preferably a and b are integers of 0 to 10. If a and b exceed the upper limit value, it is difficult to divert, which is not preferable. Examples of the hydrocarbon group having 1 to 12 carbon atoms which may have an organic decyloxy group which may have a substituent include an organomethane alkoxy group which may have a substituent, a methylene group, an ethylene group, and a propylene group. A group formed by bonding such as propylene or butylene. The (A) anthrone-modified epoxy compound is represented, for example, by the following formula. [Chemistry 7]

The compound represented by the formula (1) can be easily produced by controlling the degree of dispersion to 1 to 1.2 with respect to separation distillation or fractional distillation, and is preferably 1 to ι·ι by the following formula (4) ) indicated at the two ends of the hydrosilyl group, which is hydrosilyl, 1 mil, diallyl-3,5-diglycidyl isocyanurate, or ethylene oxide cyclohexene. (vinylcyclohexene monoxide) (ie 1,2-epoxy-4-vinylcyclohexanide) is 1.5 to 2.5 moles, preferably 2.0 to 2.1 moles, and is heated to 80 using a hydrogenation sulfonation catalyst such as a catalyst. . (: ~150Ϊ The compound is reacted. 12 201105715 34693pif [Chemical 8] R1 | R1 | R1 Η—·Si—〇—I —Si-o- I r 1 —Si—Ο R1 IL R1 J a Ι R2 R1

I (4) b Ri where R, R2, a, b are as described above. If 1-allyl-3,5·di-hydrogenate fp Mm曰, ', 'flame glyceryl isocyanurate, or an emulsified vinyl hexene is less than the lower limit is unreacted The hydroquinone alkyl group is used in the use of 曰(4)h in the treatment of the m. When the composition of the escaping Wei is hardened, the second A3? 2 'if the upper limit is exceeded, the unreacted 1-allyl_3,5 - diglycidyl isocyanuric acid vinegar, or oxidized ethylene in the shoulder, because of the cost, the special financial side ^ Platinum catalyst is representative of the gas platinum acid 2% octanol solution, and the use of platinum This amount is in an amount of 5 ppm to 50 Ppm. By reacting at 80 C to 100 C for 1 hour to 8 hours, a compound which can be obtained in high yield can be used. Further, as the solvent for the reaction, a solvent such as an aromatic system can be used. ..., 鲷 As the fluorenone of the two 人 人 = 矽 alkyl group which is controlled by the dispersion used in the present invention, the following fluorenone can be represented as a representative. 3 11 [Chem. 9] 13 201105715 34693pif ch3 HSi-O-

I CH3 ch3 Si—O CH3 ch3 I SiH I CH3 (5) , the degree of dispersion is 1.02 [10] ch3 ch3 ch3 HSi—Ο Si 〇-j ——SiH I Ι ch3 ch3 ch3 n and 4, the dispersion is 1.08 Hb 11] CH3 Si—ΟΙ ch3 ch3 -SiH I ch3 ch3 HSj—〇— _

I ch3 (7) n and 8, the degree of dispersion is 1.06 The two-terminal hydroquinone-containing anthrone of the present invention may be used singly or in combination. In particular, in order to obtain a hard and rigid cured product, the two-terminal hydroquinone-containing anthrone having a controlled degree of dispersion used in the present invention is preferably a compound represented by the above formula (5) or (6). In order to obtain a tough and flexible 201105715 34693pif soft cured product, the compound represented by the above formula (7) is preferred. Further, it is preferred to use an anthrone having a degree of dispersion of l.〇~i 2 at the both ends of the hydroquinone-containing alkyl group. The fluorenone modified epoxy compound of the present invention can be effectively used as a main component of the epoxy saponin composition, and can be effectively used as various additives, a coupling agent (C0Upling agent), and a tackifier (tackifier). ).树脂. Resin composition for optical semiconductor encapsulation Hereinafter, the resin composition for optical semiconductor encapsulation of the present invention will be described. In the resin composition for optical semiconductor sealing of the present invention, the (A) smelting I modified epoxy compound, and a curing agent and a curing accelerator are used as an essential component 0 (B) hardener in order to The reaction forms a crosslinked product and a hardener is used. The modifier may be any of an amine-based curing agent, a curing agent, and an acid-healing agent which are generally used, and is preferably an acid anhydride-based curing agent from the viewpoints of light transmittance and heat resistance. Examples of the acid anhydride-based hardener include succinic anhydride, phthalic anhydride, maleic anhydride, trimellitic anhydride, and pyromidoic dianhydride. ), hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, or 4-methyl-hexahydrophthalic anhydride Mixture of hexahydrophthalic anhydride, tetrahydrophthalic anhydride, mercapto-tetrahydrophthalic acid needle, nadic anhydride, methyl nadic anhydride, 15 201105715 34693pif norbornene _ 2,3 · dicarboxylic acid if, methyl norbornene burned dimercaptocyclohexene dicarboxylic acid if and so on. The amount of the hardener (8) is 〇.5 equivalents to Μ equivalent per 1 equivalent of the base, and the amount of the vehicle is preferably 0.8 eq to 2 i. This corresponds to 100 parts by mass of the mass of the component (A), preferably 100 parts by mass, preferably 20 parts by mass to 8 parts by mass. 71 (C) Hardening catalyst A hardening catalyst is used in order to make the hardening reaction smoothly and in a short time. The hardening catalyst is preferably one or two or more of the quaternary scale salts. It is particularly preferable to use a quaternary scale salt comprising a chemical group represented by the following formula (8) and/or a compound represented by the following formula (9); One or two or more. Thereby, it is possible to produce a cured product which is transparent, has no surface adhesion, and does not change color due to reflow. Specific examples of the quaternary scale salt other than the compound represented by the following formula ((8) and (9)) include "U-CAT 5003" manufactured by San_Apr〇 Co., Ltd., which is a tetrabasic scale hydrobromide salt (bromidesalt). ”[Chemistry 12] 窖9 /〇C4Hg-p-cH3 (CHaOJzP^

When 9 S C4H9~|Bu C4H9 (〇2Η5〇) 2 "Θ (9) c4h9 s can also be used together with other hardening catalysts. The 201105715 34693pif type hardening catalyst can be exemplified by an organophosphine-based hardening catalyst such as triphenyiphosphine or diphenylphosphine, and 1,8-diazabicyclo(5,4,fluorene). Diazabicycl〇(5,4,0)undecen-7 ), triethanolamine, benzyldimethylamine, etc., second amine-based hardening catalyst, 2·methylimidaz〇le, 2_phenyl- 4-Methyl i u sit and wait for saliva and so on. The amount of the curing catalyst (C) is preferably 5 parts by mass to 3 parts by mass based on 100 parts by mass of the total of the components (A) and (B). If the hardening catalysis is less than the lower limit, it may not be sufficient to promote the effect of the oxygen resin and the hardened bottle. Further, if the amount of the catalyst is more than the above upper limit, it may cause discoloration during the hardening or reflow test. (D) Epoxy resin μ 八#目* Wei resin material county _, added: + 现有 from the eight or more base of the existing epoxy resin. Such a ring; 罅: Α :: The epoxy resin having two epoxy groups in the ^ can be exemplified by bisphenol/lact resin, bisphenol F-type epoxy resin novolac type epoxy resin, wpnen (resin, naphthalene ( Naphthalene) type two two coffee 1^0^) type ring 苯 benzene fragrant fiber biphenyl type epoxy resin, aroma ring gasification; two::, species ring, purpose (four) (dicyclopentadiene) type epoxy proud t day a ring Ethyl uric acid triglycidyl clear aromatic dioxane = only = 201105715 34693pif The presence of at least two epoxy groups is not limited to the resin. These poplar trees can be used alone or in combination of two or more. In the case of 1st, when the second = light ί conductor is placed, in order to prevent deterioration due to light, it is suitable for non-aromatics such as weathering epoxy resin, cycloaliphatic epoxy resin or diglycidyl isocyanurate. Epoxy resin. The amount of the epoxy resin is 100 parts by mass based on the total of the components (4) and (8) (U mass parts to 90 parts by mass, preferably 3 parts by mass to 30 parts by mass. If the amount of the curing catalyst is adjusted) When the amount is less than the lower limit, the hardening becomes slow. Further, if the amount of the curing catalyst exceeds the upper limit, discoloration is caused. (Ε) Antioxidant In the present invention, in order to heat resistance of the resin The antioxidant may be blended in an amount of from 1 part by mass to 1.0 part by mass per part by mass of the component (B). The antioxidant is preferably a hindered phenol type anti-oxidant. The oxidizing agent may, for example, be exemplified by: tetra[3_(3,5_di-dibutyl 4-perphenyl)propionic acid] pentaerythritol vinegar, n,N,·bis(3-(3,5-di-t-butyl) _4_hydroxyphenyl)propane-l,3-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphe nyl)propionamide], sulfur Substituted bis(ethylene)bis[3·(3 5•di-tert-butyl_4·Rory basic) propionic acid g] (thiodiethylene bis[3-(3,5-di-tert-butyl-4- Hydroxyphenyl)propionate]), 3- (8,5-di-t-butyl-4-hydroxyphenyl)propionic acid octadecyl ester, 6,6,_di-t-butyl-2,2'-thio-double-pair, N , N'-bis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propanyl) hexamethylenediamine, 3,5-di-t-butyl-4- hydroxyphenylpropionic acid 201105715 34693pif Octyl ester (561^卩1'〇?&11〇匕 to (1,3,5-1^(1,1-out 11^1^ to 1^1)· 4-hydroxy_, C7- 9-branched alkyl ester), [[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphonic acid diethyl ester, 2,2,-ethylene double [4,6-di-t-butylphenol], 3,3',3'',5,5,,5,,-hexa-tert-butyl-a,a,,a,,-(all three Benzo-2,4,6-triyl)tri-p-nonylphenol, bis[[[3,5-bis(1,1-didecylethyl)-4-hydroxyphenyl]methyl]diethyl Calcium phosphonate, 4,6-bis(octylthiomethyl)-o-nonylphenol, 4,6-bis(dodecylsulfanyl)-o-nonylphenol, ethylene bis(oxyethylene) Bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-t-butyl- 4-hydroxyphenyl) Propionate, iota, 3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6- Triketone, 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)indenyl]-1,3,5-triazine-2,4,6 ( 111,311,511)-trione, 6,6'-di-t-butyl-4,4'-thiobis(m-cresol), diphenylamine, N-phenylaniline and 2,4, Reaction product of 4-tridecylpentene, 2,6-di-t-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino) ,3,4-dihydro-2,5,7,8-tetradecyl-2-(4,8,12-trimethyltridecyl)-2Η-1-benzopyran-6-ol , 2',3-bis[[3-[3,5-di-t-butyl-4-hydroxyphenyl]propanyl]]propane, 3,3'-thiodipropionate Alkyl ester, di-octadecyl 3,3'-thiodipropionate, and the like. The antioxidant may also be a filler-based antioxidant, and for example, triphenyl phosphite, bis[2,4-di(1,1-dimethylethyl)-6-nonylphenyl]phosphite ethyl acrylate , tris(2,4·di-t-butylphenyl)phosphite, 4,4′-[1,1′-biphenyl]subunit diphosphonic acid-tetra[2,4-di 3rd Phenyl] ester (tetrakis(2,4-di-tert-butylphenyl)-1,1-biphenyl-4,4'-diylbisph osphonite), 2,2',2"-nitrilo[triethyl-trisyl] [3,3',5,5'_tetrabutylbutyl 19 201105715 34693pif -1,1,-Lian-2,2'-diyl]phosphite, [[3,5-di(1, (1-dimercaptoethyl)-dihydroxyphenyl]methyl]phosphoric acid diethyl ester, etc. (F) The ultraviolet absorber can be used in combination with the (β) component and the (β) component in order to improve the light resistance of the resin. 100 parts by mass of 0.01 parts by mass to 1.0 part by mass of a hindered amine-based ultraviolet absorber. The heat-resistant deterioration agent can be exemplified by 2,2,4,4-tetramethyl-7-oxa-3 ,20-diazabispiro[5.1.11.2]-hexadecane-21-one, 2,2,4,4-tetramethyl-21-oxo-7-oxa-3,20-di Aza-bispiro[5.1.11.2]-docosane-20-propionic acid 3,2,4,4-tetradecyl-21-oxo-7-oxa-3,20-diazaspiro[5.1.11.2]-docosane-20-propionic acid Tetradecyl ester, [{3,5-di(1 dimethylenediethyl)-4-hydroxyphenyl}indolyl]butylmalonic acid di(1,2,2,6,6-five Methyl-4-acridinyl) ester, bis(2,2,6,6-tetramethyl-4-acridinyl) sebacate, poly[{6-(1,1,3,3- Tetramethyl butyl)amino-1,3,5-triazine_2,4_diyl} {(2,2,6,6·tetramethyl-4-° melon) imino}hexamethylene Base {(2,2,6,6_tetradecyl-4-acridinyl)iminoindole], 2-(2H-phenylbendazole-3-yl)-4,6-bis(1·methyl -1-phenylethyl)benzene, 2,2',2,--nitro-[triethyl-tris[3,3',5,5,-tetradecyl-1,1, -biphenyl-2,2,-diyl]]phosphite, 2-(2H-benzotriazol-2yl)-4,6-di-p-pentylphenol, etc. (G) Phosphor In order to convert the light-emitting wavelength of a blue LED or an ultraviolet LED (Ultraviolet LED 'UVLED) to the resin, V is added with various well-known campsite powders. As a representative yellow glory, it is particularly advantageous to contain a general formula. A3B5〇〇12[3m (wherein component A has a choice from 钇20 201105715 34693pif (Υ), 釓 (Gd), money (Tb), 镧 (La), cast (Lu), 砸 (Se) and 钐 (Sm) at least one element of the group, component B has the choice At least one element 'component Μ from a group consisting of aluminum (A1), gallium (Ga), and indium (in) has a composition selected from the group consisting of (Ce), 镨(ρΓ), 铕(Eu), and chromium (cr). A phosphor particle composed of a group of garnets of at least one element selected from the group consisting of N(Nd) and E(Er). A phosphor for use in a light-emitting diode element containing a white-emitting diode that emits blue light is suitable for a Y3Al5012〇Ce phosphor and/or (Y, Gd, Tb) 3 (Al, Ga). 5〇i[2[]Ce glory body. Examples of other phosphors include CaGa2S4 [HCe3+ and SrGa2S4C]Ce3+, YA103|HCe3+, YGa03[I]Ce3+, Y(Al,Ga)03[HCe3+, Y2Si05[HCe3+, and the like. Further, in order to form a mixed color of light, an aluminate doped with a rare earth group or an orthosilicate doped with a rare earth group is suitable in addition to these phosphors. The phosphor may be blended in an amount of 0.1 part by mass to 1 part by mass based on 100 parts by mass of the total of the component (a) and the component (B). (H) The tackifier may be added in an amount of 0.01 part by mass to 0% by mass based on 100 parts by mass of the total of the component (A) and the component (B), in order to increase the adhesive strength of the resin. . (I) The inorganic filler can be blended with 100 parts by mass of the total amount of the component (A) and the component (b) in order to obtain the effect of the LED light diffusing effect and the effect of preventing precipitation of the phosphor, and to reduce the expansion coefficient. 1 part by mass of 1 part by mass of 21 201105715 34693pif inorganic filler. As the inorganic filler, cerium oxide silica, titanium oxide, zinc oxide, aluminum oxide, calcium carbonate or the like can be suitably added. The lipid composition of the present invention (10) can be used by coating a protective material for protecting a photo-semiconductor element with a cord. In this case, the element can be listed as a light-emitting diode (LED), an organic electroluminescence element (organic EL), a laser diode, an LED array or the like. The composition of the present invention is suitable for use in a box-type light-emitting semiconductor device, that is, a composition in which the light-emitting element is disposed in a ceramic and/or plastic housing to cover the element disposed in the housing. It is filled into the casing (10) and hardened for use. Alternatively, the LED may be protected by printing, transfer molding, injection molding, or compression molding by applying the composition of the present invention to an LED mounted on a matrix substrate. When the light-emitting semiconductor device such as LED is covered by potting, injection or the like, the resin composition of the present invention is preferably liquid. The viscosity of the resin composition is preferably 25. The measured value of the rotational viscosity s ten under the armpit is 1 〇 mPa mpa · s, particularly preferably 100 mPa·s~l, 〇〇〇, 〇〇〇mPa·s or so. On the other hand, when a light-emitting semiconductor device is manufactured by transfer molding or the like, it can be formed not only by using a liquid resin as described above, but also by solidifying a liquid resin (B-staged). The particles are shaped. In the present invention, the curing condition of the coating protective material can be selected in consideration of the balance between the productivity and the heat resistance of the light-emitting element or the casing in consideration of the balance between the productivity and the heat resistance of the light-emitting element or the casing at 25 C to 2 Torr (TCt 3 minutes). In the case of transfer molding or injection molding, a light-emitting semiconductor device can be easily fabricated by forming at a temperature of 150 ° C to 180 Ϊ:, 22 201105715 34693 pif 20 kgf / cm 2 to 50 kgf / cm 2 ! minutes to 5 minutes. Post-hardening (secondary hardening or post-curing) under conditions of 〇ΐ5〇ΐ to 200 ° C for 1 hour to 4 hours. [Examples] Hereinafter, the present invention will be specifically described by way of examples, but The invention is not limited by the following examples. [Example 1] 1-allyl-3,5-diglycidyl isocyanurate 200 g (0.71 mol), and the following formula [ 13] ch3 I 3 HSi-ΟΙ ch3 ch3 ! Si-〇-CH, ch3 I -$iH I CH, n and 3, hydroperoxy oxane (hydrogen oxane A) with a dispersion of 102 131.7 g (0.37 Moor) was placed in a 0.5 liter separable flask and added with a solution of 25% octanol in gas platinum (Pt) (20 pp) m), after reacting at 8 ° C to 100 ° C for 6 hours, the unreacted product was distilled off under reduced pressure to obtain a colorless transparent liquid (referred to as ''compound oxime) 312 g. The yield was 94%. The physical properties of Compound 1 are as follows: Epoxy equivalent (using automatic titration cracking GT-100 manufactured by Mitsubishi Chemical Corporation): 245 g/mol 23 201105715 34693pif Refractive index (25°c, using digital refractometer RX5000 manufactured by ATAGO Corporation) ) : 1.47857 calculus analysis value C: 0.432C0.442), Si: 0.1517 (0.1528), 〇: 0.2555 ( 0.2437), N : 0.0888 (0.0914), Η : 0.0720 (0.0680) 'where () is the theoretical value . Specific gravity (23 ° C) : U1 Viscosity (60 ° C) : 5.02 Pa · s Dispersity: 1.02 (Using HLC-8220GPC from Tosoh Corporation 'tetrahydrofuran (THF) solvent) [ Example 2] 200.0 g (1.61 mol) of ethylene oxide cyclohexene (i.e., 1,2-epoxy-4-vinylcyclohexane), and hydroquinone of the formula (hydroquinone a 259.8 g (0.73 mol) was placed in a 5 liter separable flask, and a 2% octanol solution of oxytetramate (20 ppm of pt) was added. 'Reaction at 80 ° C to 100 ° C for 7 hours. Thereafter, the unreacted product was distilled off under reduced pressure to obtain 423 g of a colorless transparent liquid (referred to as "Compound II"). The yield was 92%. The physical properties of Compound II are as follows. Epoxy equivalent (using automatic titrator GT-100 manufactured by Mitsubishi Chemical Corporation): 245 g/mol refractive index (25 ° C, using digital refractometer RX5000 manufactured by ATAGO): 1.47857 Elemental analysis value C : 0.4965 ( 0.5070 ) , Si: 0.2490 ( 0.2541 ), 〇: 0, 1550 (0.1447), Η : 0.0995 (0.0942) ' where () is the theoretical value. 24 201105715 34693pif Specific gravity (23°C) : 1.10 Viscosity (60°C) : 2.03 Pa · s Dispersity: 1.02 (using HLC-8220GPC manufactured by Tosoh Corporation, THF solvent) [Example 3 and Example 4] Instead of hydroquinone As the oxane A and the amounts shown in the following Table 1, the following hydroquinone B and hydrooxane C were used, and respectively, Compound III and Compound IV were obtained in the same manner as in Example 1. Hydroquinone B [Chemical 14]

CH 13 HSi—ΟΙ ch3 ch3 ,! -rSi 〇· ch3 CH3 SiH I ch3 n and 4, the degree of dispersion is 1.08 hydroquinone C [Chemical 15] ch3 HSi—ΟΙ CH,

Ch3 Si—ΟΙ CH 丨3 ch3 I 3 SiH I ch3 n and 8, dispersion degree 1.06 25 201105715 34693pif Table 1 Example 3 " Hydrogensiloxane species BC _ Amount (g) 370 483 1-allyl-3 ,5-diglycidyl isocyanurate amount (g) 200 201 Synthetic compound III IV Appearance colorless transparent liquid colorless transparent liquid Λ Dispersity 1.08 1.06 Epoxy equivalent g/mol 249 322 Elemental analysis value bracketed: theory Value C 0.4267 (0.4352) 0.3904 (0.4096) Si 0.1155 (0.1696) 0.2033 (0.2177) 0 0.2556 (0.2416) 0.2662 Γ 0.2356) N 0.0812 (0.0846) 0.0613 C 0.0651) H 0.0710 (0.0690) 0078F (0.0719) [Example 5~ Example 15 and Comparative Example 1 to Comparative Example 7 Preparation of Compositions Compounds I to IV and the compositions (parts by mass) shown in Table 2, Table 3, and Table 4 below were prepared using a planetary mixer. The hardener or the like is sufficiently mixed to prepare a hardened resin composition. The components in these tables are as follows. Chemical Industry Co., Ltd.)) Compound obtained by addition reaction (dispersion: 1.35) Epoxy I: in the same manner as in Example 1, allyl- 3,5-diglycidyl isocyanuric acid S Dimethyl sulphide 16_M L with a hydrogen-burning beauty at both ends has an average molecular weight of 160, dispersion "Epoxy 26 201105715 34693pif Epoxy II: Triglycidyl isocyanurate (TEPIC-S: Nissan Chemical Industry Co., Ltd. Made by the company) Hardener: 4-methylhexahydrophthalic anhydride (Rikacid μη: manufactured by Nippon Chemical and Chemical Co., Ltd.) Hardening catalyst: quaternary phosphonium salt (U-CAT 5003: manufactured by San-Apro Co., Ltd.) Antioxidant I: Tetra[3-(3,5-di-t-butyl-4-yl-hydroxyphenyl)propanoic acid] Pentaerythritol ester antioxidant II: Triphenyl phosphite UV absorber: 2, 2, 4, 4 -tetradecyl-21-oxo-7-oxa-3,20-aza-helix [5.1.11.2]·21-burning-20-propionic acid tetradecyl vinegar phosphor: 钇• Aluminum garnet (YAG) tackifier: γ-mercaptopropyltrimethoxy decane (KBM8〇3) (manufactured by Shin-Etsu Chemical Co., Ltd.) Inorganic filler : Evaluation of characteristics of cured product of the examples of the oxidized stone and the comparative example The viscosity of the composition and the characteristics of the cured product were evaluated by the following methods. The resin composition was heated at 100 ° C for 1 hour and then heated at 150 ° C for 4 hours to be hardened. The results are shown in Table 2 to Table 4. (1) Appearance of cured product The appearance of the cured product was visually observed, and the presence or absence of discoloration and transparency was visually evaluated. (2) Hardness The rod-shaped cured product was measured (d hardness) in accordance with JIS K6301.

(3) Viscosity X 27 201105715 34693pif The measurement was carried out using a BM type rotational viscometer manufactured by Toki Sangyo Co., Ltd. (4) Glass transition point and expansion coefficient Cut a width of 5 mm, a thickness of 4 mm, and a length of 15 mm from the hardened material

Test piece using thermal analysis device EXSTAR6000TMA (SII

The NanoTechnology company manufactures the inflection point of the expansion coefficient as a glass transition point (Tg) at a heating rate of 5 °c/min from _1 〇 () to 300 °C. Further, the average expansion coefficient was obtained from the elongation of the sample before and after the glass transition point. (5) Bending strength and flexural modulus A test piece having a width of 5 mm, a thickness of 4 mm, and a length of 1 mm was cut out from the cured product using an automatic drawing measuring device AGS_5 (manufactured by Shimadzu Corporation) in accordance with JIS K6911. Determination. (6) Light penetration The light transmittance (T0) of a 1 mm thick cured product at a wavelength of 8 〇〇 nm to 3 〇〇 nm was measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation). Further, the cured product was measured in the same manner at 15 Torr.光 光 Light penetration after heating for 400 hours (τι ), and Ti/To ( % ) was obtained. 28 201105715 34693pif Table 2 Formulation composition (parts by mass) Example Comparative Example 5 6 7 8 1 2 Compound I 59.3 Compound II 65.9 Compound III 59.7 Compound IV 65.7 Epoxy I 66.2 Epoxy II 37.1 Hardener 40.7 40.3 40.3 34.3 33.8 62.9 Hardening catalyst 0.32 0.32 0.32 0.32 0.32 0.32 Tackifier 0.25 0.25 0.25 0.25 0.25 0.25 Appearance Colorless Transparent Colorless Transparent Colorless Transparent Colorless Transparent Colorless Transparent Colorless Transparent Hardness (D Hardness) 75 72 50 50 74 87 Viscosity (Pa · s/25°c ) 0.5 0.5 0.3 0.3 0.9 0.5 Glass transition temperature (°C) 129 120 110 110 137 165 Expansion coefficient (below Tg) 129 131 160 160 138 58 Expansion coefficient (above Tg) 203 205 204 204 215 130 Bending strength (MPa) 50 51 44 44 40 110 Flexural modulus (MPa) 936 915 900 900 760 1700 Light penetration (initial) % 99 99 98 98 98 98 Light penetration (150 ° C / after 400 hours) % 92 90 92 92 89 55 Brightness (after 85°C/l〇〇〇 hours) 86 82 83 83 85 30

29 201105715 34693pif Table 3 Formulation composition (parts by mass) Example Comparative Example 9 10 11 12 13 4 5 Compound I 59.3 69.3 59.3 59.3 69.3 Epoxy I 66.2 66.2 Hardener 40.7 40.7 40.7 40.7 40.7 33.8 33.8 Hardening Catalyst 0.32 0.32 0.32 0.32 0.32 0.32 0.32 Antioxidant I 0.3 0.3 0.3 0.3 Antioxidant II 0.3 0.3 UV Absorber 0.3 0.3 0.3 0.3 Adhesive 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Appearance Colorless, Colorless, Colorless, Colorless, Colorless, Colorless, Clear, Colorless, Clear, Clear, Clear ( D hardness) 76 75 74 74 73 94 94 Viscosity (25 ° C) 0.5 0.5 0.6 0.6 0.6 1.0 1.0 Glass transition temperature (°C) 129 130 132 129 127 133 136 Expansion coefficient (below Tg) 133 129 134 129 131 137 139 Expansion coefficient (above Tg) 201 203 200 204 201 216 210 Bending strength (MPa) 50 51 48 50 46 44 41 Flexural modulus (MPa) 931 933 919 922 919 733 711 Light penetration (initial) % 99 98 97 98 97 97 97 Light penetrability 94 93 95 96 95 92 93 (after l5〇°C/4〇〇 hours) % Degree 90 89 93 95 94 89 91 (85 ° C / 1000 hours later) 30 201105715 34693pif Table 4 Formulation composition (parts by mass) Example Comparative Example 14 15 6 7 Compound I 59.3 59.3 Epoxy I 66.2 66.2 Hardener 40.7 40.7 33.8 33.8 Hardening catalyst 0.32 0.32 0.32 0.32 Phosphor 30 30 Inorganic filler 30 30 Tackifier 0.25 0.25 0.25 0.25 Appearance Yellow colorless transparent yellow Colorless transparent hardness (D hardness) 76 76 87 88 Viscosity (25 ° C) 18.2 15.1 21.1 14.9 Glass Transformation temperature (°c) 130 128 167 171 Expansion coefficient (below Tg) 132 123 130 122 Expansion coefficient (above Tg) 201 195 200 201 Bending strength (MPa) 51 55 40 47 Flexural modulus (MPa) 930 971 701 780 Light penetration (initial)% 35 99 30 97 Light penetration (150°C/400 hours) 〇/〇25 94 19 93 Brightness _ (85°C/1000 W, a volume, 91 90 89 89 LED device fabrication and evaluation In the bottom edge of a silver-plated LED pre-molded package (3 mm x 3 mm x min, 2.6 mm in diameter), silver paste (silver P) is used to fix InGaN. Blue light-emitting element . Then, the three elements are connected to the electrode by a metal wire. Thereafter, each of the composition-filled body portions was hardened for 1 hour under kktc, and the new layer was hardened at 15 2 2 = when the π portion was sealed. 2 () difficult (8 ) / jnL degree cycle test, high temperature and high humidity down lighting test 31 201105715 34693pif were used for each composition, and 10 of the LEDs obtained by the method were used for temperature cycle test (_4〇) °C~125°C, 2000 cycles and 3000 cycles), observe the appearance. In addition, another 10 LEDs were used to illuminate the LEDs at 50 mA for 500 hours under high temperature and high humidity (65 ° C, 950% RH), and then observe whether the package interface is poorly adhered, cracked, and presence or absence. Discoloration. The results are shown in Tables 5 and 6. 32 201105715 34693pif Table 5 Resin Composition Example 5 Example 6 Example 7 Example 12 Example 14 Example 15 Temperature Cycling Test [-40 ° C ~ 125 ° C) 2000 cycles without defects, no defects, no defects, no defects, no defects, no defects, 3,000 times Cycling micro cracks micro cracks no bad micro cracks no bad no bad high temperature high humidity lighting test [65 ° C / 95% RH, 50 mA, placed for 500 hours) No bad no bad no bad, no bad no bad no bad Table 6 Resin Composition Comparative Example 1 Comparative Example 2 Comparative Example 4 Comparative Example 6 Comparative Example 7 Temperature Cycling Test [-4 (TC~125t:) 2000 cycles of a part of the cracked crack, part of the crack, a part of the crack, no bad 3,000 times Circulating crack cracking crack cracking crack high temperature high humidity lighting test [65 ° C / 95% RH, 50 mA, no bad discoloration, no bad, no bad, no bad 500 hours) According to the table, we can see The epoxy resin composition of the present invention comprising an anthrone-modified epoxy compound having a controlled molecular weight distribution is resistant to cracking in a temperature cycle test as compared with the resin composition of the comparative example. Excellent. Moreover, it is also good in the lighting test under high temperature and high humidity, and is excellent in heat resistance. [Industrial Applicability] The resin composition for optical semiconductor sealing of the present invention is excellent in heat resistance and crack resistance, and is suitable for sealing an optical semiconductor element. [S1 33 201105715 34693pif clarified as any IKS issued ==:= not in the hair of the present invention, without departing from the scope of the technical solution of the present invention, f = professional technical personnel: and a little change or modification to the technical essence of the invention To the above: according to the present, and the modification, still belong to the technical scheme of the present invention, the second modification, the specialization change [the simple description of the schema] _ circumference. None [Key component symbol description] Benefit #«»> 34

Claims (1)

201105715 34693pif VII. Patent Application Range · 1 · A resin composition for optical semiconductor sealing, which comprises the following components (A), (B) and (C): (A) Two molecules in one molecule The above epoxy group is represented by the following formula (!), and the fluorenone modified epoxy compound having a degree of dispersion of 1.0 to 1.2 is 1 part by mass. R1 R1 R1 r2—si~~ΟΙ R1 I rl i - Si-O- 1 ~Si—Ο — Ι I R1 a R2 [Chemical 1] R1 'S'~R2 (1) 'b R1 (R—independent of each other, carbon number 丨~1() is replaced or not a substituted-valent hydrocarbon group, R2 is a group represented by the following formula (2) or (3), and a and b are one or more integers selected from the integer 〇 20 20) (2) [Chemical 3] (3) ^ One inner T knife, ~1 (K} quality Jin (6) hardening catalyst", the total amount of 100 parts by mass of the above-mentioned (4) two above 201105715 34693pif components is 质量 5 parts by mass to 3 parts by mass. The material of the above-mentioned (b) component is the following: (E) Antioxidant (F) Ultraviolet absorber (G) Phosphor (H) Tackifier (I) Inorganic filler (D) - Molecular weight of epoxy resin having two or more epoxy groups 0.1 parts by mass to 90 parts by mass 0. 01 parts by mass to 1.0 part by mass of 〇. 〇 1 part by mass to 1.0 part by mass of 0. 1 part by mass to 1 part by mass of 0.01 part by mass to 丨〇 part by mass., ^ 0, 01 parts by mass to 100 parts by mass 3. If the patent application scope is 1, the seal tree is used for the secret, the above (=^ item of the light semiconductor 4, Α^ 逑 (Β) hardener is an acid anhydride. 4. If the patent scope of the application of the fourth paragraph to a resin composition for semiconductor encapsulation, wherein the photo-scale salt described in the above paragraph is: (c) the hardening catalyst is 5; as claimed in the second item to the semiconductor sealing The epoxy resin having two or more epoxy groups as described in any one of the above items is an epoxy resin having a ring of cyanuric acid S in the molecule. And a resin composition for semiconductor sealing according to the second patent application, which is a photo-resistance phenol-based antioxidant according to the above item: (E) an antioxidant is a patent. The invention is the resin composition for semiconductor encapsulation, wherein the (E) antioxidant is a phosphorus-based antioxidant. 8. In the second to seventh items of the patent application, the scope of the invention is as described in any one of claims 2 to 36. The resin composition for sealing a photo-semiconductor according to any one of claims 2 to 8, wherein the (F) ultraviolet absorber is a hindered amine-based ultraviolet absorber. A resin composition for sealing a photo-semiconductor, wherein the (G) tackifier is a fluorenyl-based Shixia coupling agent. 37 201105715 34693pif IV. Designated representative map: (1) The designated representative figure of the case. None (2) The symbolic symbol of the representative figure is simple: No. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: R1 I R1 I R1 I , Ri I _ I R2-Si—0— | I ~Si 〇-1 I -Si-O- ] I ^ Si R2 (I ) I R1 1 R1 a I R2 I b R1 201105715 34693ριίΊ Japanese Patent Specification No. 99118393 No-line correction page Revision date: August 23, 1999. VI. Description of the Invention: The present invention relates to a method for sealing an optical semiconductor element, which is excellent for the heat test. In particular, 矽_(siHc〇ne) modified epoxy resin composition excellent in crack resistance. [Prior Art] Conventionally, a transparent epoxy resin composition has been widely used as an optical semiconductor element sealing resin for sealing an optical semiconductor element. The component of the epoxy resin composition for photo-semiconductor encapsulation usually contains an alicyclic epoxy resin, a hardener, and a hardening catalyst, and is formed by a molding method such as Casing Molding or Transfer Molding. The optical semiconductor sealing epoxy resin composition is introduced into the light semiconducting layer and hardened, and the optical semiconductor element is sealed (patent 2). However, recently, as the brightness and power of the blue-emitting diode (light_emkting (hode'LED) and white LED are getting higher and higher, the LED element sealed with the conventional transparent epoxy resin appears to have a wavelength over time. A problem of short blue light or ultraviolet light discoloration (yellowing), and high water absorption and moisture durability durability are also pointed out. U. Therefore, those skilled in the art have also proposed coating protection of an optical semiconductor element. The resin composition for coating and protecting the optical semiconductor element comprises: an organic compound or an egg resin containing at least two carbon-carbon double bonds and a brain-based compound in the molecule, and the molecule contains 201105715 34〇yjpirl is the Chinese manual of No. 99118393. There is no scribe correction page. Revision date: August 23, 1999 R1 R1 R2—Si—Ο—Si—Ο R1 R1 a R1 I. SH〇· I kR2 R1i 2 —Si— R2 lb R1 (1) R2 is expressed by the following formula (2) or formula (3). (2) [Chem. 6] (3) R1 is independent of each other and is a monovalent hydrocarbon group having 1 to 10 carbon atoms, specifically, an alkyl group such as an alkyl group, an ethyl group, a propyl group or a butyl group, a cyclopentyl group, a cyclohexyl group, a phenyl group, and a borneol group ( Orbornyl group, an aryl group such as a phenyl group, etc., and 3,3,3-trifluoropropyl, 3-hydroxypropyl, 3-aminopropane which are substituted by a halogen group, an amino group or the like. Base. Among these monovalent hydrocarbon groups, a methyl group, a phenyl group, and preferably 90 mol% or more of all R1 are a mercapto group. 11 201105715 34693piil is the Chinese manual of No. 99118393. There is no scribe correction page. Correction date: In the formula (1) of August 23, 1999, a and b are one or more integers selected from the integer 〇 〜 20, preferably a and b are integers of 0 to 1 。. If a and b exceed the above upper limit value, it is difficult to distinguish the Germans, which is not preferable. Examples of the hydrocarbon group having 1 to 12 carbon atoms which may have an organic hydrazine alkoxy group which may have a substituent include an organomethane alkoxy group which may have a substituent, a methylene group, an ethylene group, and the like. A group formed by bonding such as propylene or butyiene. The (A) anthrone-modified epoxy compound is represented, for example, by the following formula. [Chemistry 7] The compound represented by the formula (1) can be easily produced by the following method. The phase is controlled by the separation of the vapor (four), and the degree of dispersion of the scale is controlled to 1.2, and the two ends of the formula (4) of the ideal 岐W have Hydrosilyl oxime} Mohr, allyl diglycidyl isocyanurate, or ethylene cyanohexene m〇n〇xide (ie, epoxy propylene) Cyclohexene) is 1.5 to 2.5 moles, preferably 2 Å to 21 moles, and is hydrogenated with a sulfonation catalyst such as a surface catalyst, and heated to the temperature to cause the compound to react. 12 201105715 The Chinese patent scope of No. 99118393 is not underlined. This revision date: August 23, 1999, 颦*, uc| _ 1.- kinds of light semi-conducting _ sealing the following (A) components, (B) Zhongba lining, which is characterized by having two or two in (a) molecules, ., . . to indicate 'and the degree of dispersion is 1.0~, % oxy, with the following formula mass parts. · Shi Xi _ Modified epoxy compound [1] R1 | R1 | . R1 R2-Si—Ο ~Si—Ο — I rf Ι Ι -Sj-〇. R1 R1” ai R2 b R1 I '|i—R2 R1 (1) R is independent of each other; is 5; charcoal-valent hydrocarbon group; R2 is a substituted or unsubstituted b which is selected from the group consisting of an integer of 0 to 20 or a group represented by the formula (3), a, More than one integer in 2] (2) [Chemical 3] (3) (B) Hardening j 0.1 parts by mass to 100 parts by mass (6) Hardening catalysis for the above (A) component and the above (B) 35 20U05715 Revision date, year 23 34 34by3pitV is the 991 hang No. 3 In the Chinese patent range, 100 parts by mass of the total amount of the components is corrected to be 0.05 parts by mass to 3 parts by mass. 2. The composition of the optical semiconductor sealing according to the first aspect of the invention, wherein the total amount of the component (A) and the component (B) is 100 parts by mass, and the following parts are contained in the following parts by mass; (D) Component ^ (I) Component: (D) - Epoxy resin having two or more epoxy groups in the molecule ! · parts by mass to 90 parts by mass (E) Antioxidant 〇. 〇 1 part by mass - 1.0 Parts by mass (G) Phosphor (H) Adhesive (I) Inorganic filler (F) Ultraviolet absorber 0.01 parts by mass to 1. 〇 Parts by mass 〇 0.1 parts by mass to 100 parts by mass 0.01 parts by mass to 1.0 parts by mass 0.01 parts by mass to 100 parts by mass. The resin composition for optical semiconductor sealing according to the first or second aspect of the invention, wherein the hardener is an acid anhydride. 4. The photo-sealing tree test composition of claim 2, wherein the (c) hardening catalyst is a scale. 5. The optical enthalpy according to the second aspect of the patent, wherein two of the above (D) molecules have an epoxy resin as an alicyclic epoxy resin or a rubber-containing resin. Wei Shu U heart has a disordered urine _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Apply for the bismuth agent in item 2 of the patent scope. Composition 2: r (8) Antioxidant. The resin for sealing the light-spinning body described in item 2 of the second paragraph 201105715 Moyjpifl is the Chinese patent scope of No. 99118393. No slash correction. Revision date: August 23, 1999 Composition The above (F) ultraviolet absorber is a hindered amine-based ultraviolet absorber. 9. The resin composition for optical semiconductor sealing according to claim 2, wherein the (G) tackifier is a fluorenyl decane coupling agent. 〇❹ 37 201105715 . 34t) yipifl Ά is the Chinese manual of No. 99118393. There is no scribe correction page. Revision date: August 23, 1999 ·J ·-. Λν .· IV. Designated representative map: (1) Designated representative map of the case : None (2) A brief description of the symbol of the representative figure: Benefit 5: If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: R1 R1 R1 R1 R2-SI—0_ | Ll -Si-cH I rl -Si-O- I I 2 —Si—R2 I I R1 I lr1 a f R2 I b R1