TWI458057B - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof Download PDF

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Publication number
TWI458057B
TWI458057B TW098112219A TW98112219A TWI458057B TW I458057 B TWI458057 B TW I458057B TW 098112219 A TW098112219 A TW 098112219A TW 98112219 A TW98112219 A TW 98112219A TW I458057 B TWI458057 B TW I458057B
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TW
Taiwan
Prior art keywords
wiring
layer
insulating layer
semiconductor wafer
pads
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TW098112219A
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English (en)
Chinese (zh)
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TW201010025A (en
Inventor
岡田三香子
石川智和
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瑞薩電子股份有限公司
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Publication of TW201010025A publication Critical patent/TW201010025A/zh
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Publication of TWI458057B publication Critical patent/TWI458057B/zh

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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
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    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Production Of Multi-Layered Print Wiring Board (AREA)
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US20090294945A1 (en) 2009-12-03
TW201010025A (en) 2010-03-01

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