TWI431026B - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- TWI431026B TWI431026B TW98106388A TW98106388A TWI431026B TW I431026 B TWI431026 B TW I431026B TW 98106388 A TW98106388 A TW 98106388A TW 98106388 A TW98106388 A TW 98106388A TW I431026 B TWI431026 B TW I431026B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- weight
- layer
- polyurethane foam
- isocyanate
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 122
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 55
- 239000011496 polyurethane foam Substances 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 47
- 150000001875 compounds Chemical class 0.000 claims description 44
- 239000012948 isocyanate Substances 0.000 claims description 31
- 150000002513 isocyanates Chemical class 0.000 claims description 31
- 230000006835 compression Effects 0.000 claims description 30
- 238000007906 compression Methods 0.000 claims description 30
- 229920001610 polycaprolactone Polymers 0.000 claims description 29
- 239000004632 polycaprolactone Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 18
- 125000000524 functional group Chemical group 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 239000004814 polyurethane Substances 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 13
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- 230000008859 change Effects 0.000 claims description 12
- 238000005187 foaming Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 9
- 150000002009 diols Chemical class 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
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- 239000000853 adhesive Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 72
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- -1 alcohol amine Chemical class 0.000 description 19
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- 239000006260 foam Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 16
- 238000000227 grinding Methods 0.000 description 15
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 10
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Landscapes
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- Chemical Kinetics & Catalysis (AREA)
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2008063034A JP4593643B2 (ja) | 2008-03-12 | 2008-03-12 | 研磨パッド |
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| JP (1) | JP4593643B2 (enExample) |
| KR (1) | KR101455218B1 (enExample) |
| CN (1) | CN101952943B (enExample) |
| TW (1) | TWI431026B (enExample) |
| WO (1) | WO2009113399A1 (enExample) |
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| CN101724167B (zh) * | 2005-07-15 | 2013-06-26 | 东洋橡胶工业株式会社 | 层叠片及其制造方法 |
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| WO2008029538A1 (en) * | 2006-09-08 | 2008-03-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| MY144784A (en) * | 2006-09-08 | 2011-11-15 | Toyo Tire & Rubber Co | Method for manufacturing a polishing pad |
| MY157714A (en) * | 2007-01-15 | 2016-07-15 | Rohm & Haas Elect Mat | Polishing pad and a method for manufacturing the same |
| JP4593643B2 (ja) * | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5528169B2 (ja) * | 2010-03-26 | 2014-06-25 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
| JP5350309B2 (ja) * | 2010-03-31 | 2013-11-27 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
| JP5839162B2 (ja) * | 2010-07-12 | 2016-01-06 | Jsr株式会社 | 化学機械研磨パッドおよび化学機械研磨方法 |
| KR101356402B1 (ko) * | 2010-11-30 | 2014-01-28 | 한국타이어 주식회사 | 폴리우레탄 폼 및 이를 포함하는 공기입 타이어 |
| JP5687118B2 (ja) * | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP5853408B2 (ja) * | 2011-05-09 | 2016-02-09 | 旭硝子株式会社 | 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板 |
| US9079289B2 (en) | 2011-09-22 | 2015-07-14 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP5759888B2 (ja) * | 2011-12-28 | 2015-08-05 | 東洋ゴム工業株式会社 | 研磨パッド |
| US9144880B2 (en) | 2012-11-01 | 2015-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad |
| US9238295B2 (en) | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| US9233451B2 (en) | 2013-05-31 | 2016-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad stack |
| US9238296B2 (en) | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
| US20150306731A1 (en) | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| JP2016014637A (ja) * | 2014-07-03 | 2016-01-28 | 東洋ゴム工業株式会社 | クッションパッドの変形を検出するシステムおよびその製造方法 |
| CN104385122A (zh) * | 2014-11-04 | 2015-03-04 | 无锡市华明化工有限公司 | 一种具有散热结构的研磨机 |
| US9484212B1 (en) | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
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- 2009-02-26 WO PCT/JP2009/053481 patent/WO2009113399A1/ja not_active Ceased
- 2009-02-27 TW TW98106388A patent/TWI431026B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009113399A1 (ja) | 2009-09-17 |
| CN101952943B (zh) | 2012-07-11 |
| CN101952943A (zh) | 2011-01-19 |
| KR20100131419A (ko) | 2010-12-15 |
| JP4593643B2 (ja) | 2010-12-08 |
| US20100317263A1 (en) | 2010-12-16 |
| TW200942557A (en) | 2009-10-16 |
| KR101455218B1 (ko) | 2014-10-31 |
| JP2009218500A (ja) | 2009-09-24 |
| US8476328B2 (en) | 2013-07-02 |
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