TWI378864B - - Google Patents

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Publication number
TWI378864B
TWI378864B TW098129409A TW98129409A TWI378864B TW I378864 B TWI378864 B TW I378864B TW 098129409 A TW098129409 A TW 098129409A TW 98129409 A TW98129409 A TW 98129409A TW I378864 B TWI378864 B TW I378864B
Authority
TW
Taiwan
Prior art keywords
resin
weight
epoxy resin
compound
hardened
Prior art date
Application number
TW098129409A
Other languages
English (en)
Chinese (zh)
Other versions
TW201012652A (en
Inventor
Masaru Heishi
Nobuhiro Goto
Hiroshi Kouyanagi
Reona Yokota
Toshiaki Tanaka
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201012652A publication Critical patent/TW201012652A/zh
Application granted granted Critical
Publication of TWI378864B publication Critical patent/TWI378864B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW098129409A 2008-09-01 2009-09-01 Laminate and method for producing laminate TW201012652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008223494 2008-09-01

Publications (2)

Publication Number Publication Date
TW201012652A TW201012652A (en) 2010-04-01
TWI378864B true TWI378864B (enExample) 2012-12-11

Family

ID=41721554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098129409A TW201012652A (en) 2008-09-01 2009-09-01 Laminate and method for producing laminate

Country Status (6)

Country Link
US (1) US20110217512A1 (enExample)
JP (2) JP4911795B2 (enExample)
KR (1) KR101148225B1 (enExample)
CN (1) CN102137758B (enExample)
TW (1) TW201012652A (enExample)
WO (1) WO2010024391A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596005B (zh) * 2013-03-25 2017-08-21 Sekisui Chemical Co Ltd A laminated body, a method of manufacturing the laminated body, and a multilayer substrate

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EP2604639A4 (en) * 2010-08-10 2017-02-01 Hitachi Chemical Co., Ltd. Resin composition, cured resin product, wiring board, and manufacturing method for wiring board
CN101967264A (zh) * 2010-08-31 2011-02-09 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
JP5476284B2 (ja) * 2010-09-27 2014-04-23 積水化学工業株式会社 エポキシ樹脂材料及び多層基板
JP5552075B2 (ja) * 2011-02-17 2014-07-16 Ｊｆｅケミカル株式会社 熱硬化性樹脂組成物およびその硬化物
JP4938910B1 (ja) 2011-03-31 2012-05-23 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
TWI401271B (zh) * 2011-04-01 2013-07-11 Sekisui Chemical Co Ltd Pre-hardened, coarsened pre-hardened and laminated
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US10645804B2 (en) 2011-07-07 2020-05-05 Hitachi Chemical Company, Ltd. Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
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WO2013061478A1 (ja) * 2011-10-26 2013-05-02 味の素株式会社 樹脂組成物
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TWI694109B (zh) * 2013-06-12 2020-05-21 日商味之素股份有限公司 樹脂組成物
JP6217165B2 (ja) * 2013-06-20 2017-10-25 住友ベークライト株式会社 プライマー層付きプリプレグ、プライマー層付き金属箔、金属張積層板、プリント配線基板、半導体パッケージおよび半導体装置
JP5915610B2 (ja) * 2013-09-18 2016-05-11 味の素株式会社 樹脂組成物
EP3048655B1 (en) 2013-09-20 2019-05-08 Dai Nippon Printing Co., Ltd. Packaging material for cell
JP5704272B1 (ja) * 2013-09-20 2015-04-22 大日本印刷株式会社 電池用包装材料
WO2015041281A1 (ja) * 2013-09-20 2015-03-26 大日本印刷株式会社 電池用包装材料
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JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
JP6413444B2 (ja) * 2014-07-31 2018-10-31 味の素株式会社 樹脂シート、積層シート、積層板及び半導体装置
CN106715108A (zh) * 2014-08-22 2017-05-24 欧姆龙株式会社 接合构造体以及接合构造体的制造方法
JP6287897B2 (ja) * 2014-08-22 2018-03-07 オムロン株式会社 照明装置、電子機器、フレーム構造、フレーム構造の製造方法
CN106553360B (zh) * 2015-09-25 2020-03-31 比亚迪股份有限公司 一种金属树脂复合体及其制备方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
US11053593B2 (en) 2016-01-27 2021-07-06 Advanced Technologies, Inc. Copper or copper alloy article comprising surface-modified polyester-based resin and manufacturing method
KR102475942B1 (ko) * 2016-12-28 2022-12-08 에이지씨 가부시키가이샤 적층체, 실리콘 수지층이 부착된 지지 기재, 실리콘 수지층이 부착된 수지 기판, 전자 디바이스의 제조 방법
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CN110431003A (zh) * 2017-03-17 2019-11-08 汉高股份有限及两合公司 多层制品的工作寿命改善及其制备方法和用途
CN108693709A (zh) * 2017-03-29 2018-10-23 株式会社田村制作所 感光性树脂组合物
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596005B (zh) * 2013-03-25 2017-08-21 Sekisui Chemical Co Ltd A laminated body, a method of manufacturing the laminated body, and a multilayer substrate

Also Published As

Publication number Publication date
JP4911795B2 (ja) 2012-04-04
KR101148225B1 (ko) 2012-05-21
CN102137758A (zh) 2011-07-27
JP2012035631A (ja) 2012-02-23
JPWO2010024391A1 (ja) 2012-01-26
WO2010024391A1 (ja) 2010-03-04
US20110217512A1 (en) 2011-09-08
KR20110055587A (ko) 2011-05-25
TW201012652A (en) 2010-04-01
CN102137758B (zh) 2014-08-06

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