TWI360183B - - Google Patents
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- Publication number
- TWI360183B TWI360183B TW094136612A TW94136612A TWI360183B TW I360183 B TWI360183 B TW I360183B TW 094136612 A TW094136612 A TW 094136612A TW 94136612 A TW94136612 A TW 94136612A TW I360183 B TWI360183 B TW I360183B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat treatment
- storage unit
- loading
- unit
- unloading
- Prior art date
Links
- 238000003860 storage Methods 0.000 claims description 122
- 238000010438 heat treatment Methods 0.000 claims description 92
- 230000032258 transport Effects 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 26
- 239000000969 carrier Substances 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 9
- 238000002397 field ionisation mass spectrometry Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007803 itching Effects 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Furnace Charging Or Discharging (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004303614A JP4266197B2 (ja) | 2004-10-19 | 2004-10-19 | 縦型熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200633069A TW200633069A (en) | 2006-09-16 |
| TWI360183B true TWI360183B (enExample) | 2012-03-11 |
Family
ID=36202925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094136612A TW200633069A (en) | 2004-10-19 | 2005-10-19 | Vertical heat treatment device and application method thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8177550B2 (enExample) |
| EP (1) | EP1811558A4 (enExample) |
| JP (1) | JP4266197B2 (enExample) |
| KR (1) | KR100780206B1 (enExample) |
| CN (1) | CN100403509C (enExample) |
| TW (1) | TW200633069A (enExample) |
| WO (1) | WO2006043509A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4266197B2 (ja) * | 2004-10-19 | 2009-05-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
| JP4313401B2 (ja) * | 2007-04-24 | 2009-08-12 | 東京エレクトロン株式会社 | 縦型熱処理装置及び被処理基板移載方法 |
| KR101077566B1 (ko) | 2008-08-20 | 2011-10-28 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
| EP2353797B1 (en) * | 2008-10-07 | 2014-08-06 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer robot and system |
| JP4720932B2 (ja) * | 2009-02-10 | 2011-07-13 | ムラテックオートメーション株式会社 | 移載装置 |
| JP5212165B2 (ja) * | 2009-02-20 | 2013-06-19 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP4973675B2 (ja) * | 2009-02-26 | 2012-07-11 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP2012054392A (ja) * | 2010-09-01 | 2012-03-15 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
| JP5625981B2 (ja) * | 2011-02-10 | 2014-11-19 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
| US8888434B2 (en) | 2011-09-05 | 2014-11-18 | Dynamic Micro System | Container storage add-on for bare workpiece stocker |
| TWI447059B (zh) * | 2012-01-10 | 2014-08-01 | Inotera Memories Inc | 晶圓倉儲系統 |
| JP5610009B2 (ja) * | 2013-02-26 | 2014-10-22 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6211938B2 (ja) * | 2014-01-27 | 2017-10-11 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
| JP2015141915A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
| CN107851594B (zh) * | 2015-08-28 | 2021-06-22 | 株式会社国际电气 | 基板处理装置以及半导体装置的制造方法 |
| JP6704423B2 (ja) * | 2018-01-17 | 2020-06-03 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法およびプログラム |
| JP7090513B2 (ja) * | 2018-09-06 | 2022-06-24 | 東京エレクトロン株式会社 | 基板処理装置及びパージ方法 |
| JP7412137B2 (ja) * | 2019-11-06 | 2024-01-12 | 東京エレクトロン株式会社 | 基板処理装置及び基板収納容器保管方法 |
| CN114435813A (zh) * | 2020-11-04 | 2022-05-06 | 沈阳芯源微电子设备股份有限公司 | 一种片盒保管搬运系统 |
| CN114435935A (zh) * | 2020-11-04 | 2022-05-06 | 沈阳芯源微电子设备股份有限公司 | 一种片盒保管搬运设备 |
| CN113086468B (zh) * | 2021-03-26 | 2022-07-05 | 东方电气集团科学技术研究院有限公司 | 一种平行布置的恒温固化塔存取料方法 |
| JP2025174396A (ja) * | 2024-05-17 | 2025-11-28 | 東京エレクトロン株式会社 | メンテナンス装置、基板処理システム及びメンテナンス方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
| JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
| KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
| JP2952748B2 (ja) | 1994-11-24 | 1999-09-27 | 光洋リンドバーグ株式会社 | 熱処理装置 |
| JP3478364B2 (ja) | 1995-06-15 | 2003-12-15 | 株式会社日立国際電気 | 半導体製造装置 |
| JPH10326818A (ja) | 1997-05-26 | 1998-12-08 | Kokusai Electric Co Ltd | 半導体製造装置 |
| US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
| JP4229497B2 (ja) | 1998-09-07 | 2009-02-25 | 株式会社日立国際電気 | 基板処理装置および基板の処理方法 |
| KR100646906B1 (ko) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
| US6435330B1 (en) * | 1998-12-18 | 2002-08-20 | Asyai Technologies, Inc. | In/out load port transfer mechanism |
| US6506009B1 (en) | 2000-03-16 | 2003-01-14 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
| JP4383636B2 (ja) | 2000-06-29 | 2009-12-16 | 株式会社日立国際電気 | 半導体製造装置および半導体装置の製造方法 |
| KR20020019414A (ko) * | 2000-09-05 | 2002-03-12 | 엔도 마코토 | 기판 처리 장치 및 기판 처리 장치를 이용한 반도체디바이스 제조 방법 |
| JP2003007800A (ja) * | 2001-06-21 | 2003-01-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| US6726429B2 (en) * | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
| FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
| JP4184018B2 (ja) * | 2002-09-25 | 2008-11-19 | 株式会社日立国際電気 | 半導体製造装置、半導体製造システムおよび半導体製造方法 |
| JP4358077B2 (ja) * | 2004-09-21 | 2009-11-04 | 株式会社東芝 | 成膜装置及び成膜方法 |
| JP4266197B2 (ja) * | 2004-10-19 | 2009-05-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
| JP4904995B2 (ja) * | 2006-08-28 | 2012-03-28 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
| US7740437B2 (en) * | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
-
2004
- 2004-10-19 JP JP2004303614A patent/JP4266197B2/ja not_active Expired - Lifetime
-
2005
- 2005-10-17 CN CNB2005800014450A patent/CN100403509C/zh not_active Expired - Lifetime
- 2005-10-17 KR KR1020067015461A patent/KR100780206B1/ko not_active Expired - Lifetime
- 2005-10-17 US US11/665,645 patent/US8177550B2/en active Active
- 2005-10-17 WO PCT/JP2005/019039 patent/WO2006043509A1/ja not_active Ceased
- 2005-10-17 EP EP05793489A patent/EP1811558A4/en not_active Withdrawn
- 2005-10-19 TW TW094136612A patent/TW200633069A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20090053665A1 (en) | 2009-02-26 |
| TW200633069A (en) | 2006-09-16 |
| JP2006120658A (ja) | 2006-05-11 |
| JP4266197B2 (ja) | 2009-05-20 |
| CN1906748A (zh) | 2007-01-31 |
| US8177550B2 (en) | 2012-05-15 |
| EP1811558A4 (en) | 2008-09-10 |
| KR20070047732A (ko) | 2007-05-07 |
| KR100780206B1 (ko) | 2007-11-27 |
| CN100403509C (zh) | 2008-07-16 |
| EP1811558A1 (en) | 2007-07-25 |
| WO2006043509A1 (ja) | 2006-04-27 |
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