CN100403509C - 立式热处理装置及其使用方法 - Google Patents

立式热处理装置及其使用方法 Download PDF

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Publication number
CN100403509C
CN100403509C CNB2005800014450A CN200580001445A CN100403509C CN 100403509 C CN100403509 C CN 100403509C CN B2005800014450 A CNB2005800014450 A CN B2005800014450A CN 200580001445 A CN200580001445 A CN 200580001445A CN 100403509 C CN100403509 C CN 100403509C
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CN
China
Prior art keywords
heat treatment
loading
storage unit
unloading
vertical heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB2005800014450A
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English (en)
Chinese (zh)
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CN1906748A (zh
Inventor
原木健次郎
山本博之
植村聪
角田勇二
竹内靖
酒井裕史
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN1906748A publication Critical patent/CN1906748A/zh
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Publication of CN100403509C publication Critical patent/CN100403509C/zh
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Furnace Charging Or Discharging (AREA)
CNB2005800014450A 2004-10-19 2005-10-17 立式热处理装置及其使用方法 Expired - Lifetime CN100403509C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP303614/2004 2004-10-19
JP2004303614A JP4266197B2 (ja) 2004-10-19 2004-10-19 縦型熱処理装置

Publications (2)

Publication Number Publication Date
CN1906748A CN1906748A (zh) 2007-01-31
CN100403509C true CN100403509C (zh) 2008-07-16

Family

ID=36202925

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800014450A Expired - Lifetime CN100403509C (zh) 2004-10-19 2005-10-17 立式热处理装置及其使用方法

Country Status (7)

Country Link
US (1) US8177550B2 (enExample)
EP (1) EP1811558A4 (enExample)
JP (1) JP4266197B2 (enExample)
KR (1) KR100780206B1 (enExample)
CN (1) CN100403509C (enExample)
TW (1) TW200633069A (enExample)
WO (1) WO2006043509A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
JP4313401B2 (ja) * 2007-04-24 2009-08-12 東京エレクトロン株式会社 縦型熱処理装置及び被処理基板移載方法
KR101077566B1 (ko) 2008-08-20 2011-10-28 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
EP2353797B1 (en) * 2008-10-07 2014-08-06 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and system
JP4720932B2 (ja) * 2009-02-10 2011-07-13 ムラテックオートメーション株式会社 移載装置
JP5212165B2 (ja) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2012054392A (ja) * 2010-09-01 2012-03-15 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP5625981B2 (ja) * 2011-02-10 2014-11-19 東京エレクトロン株式会社 熱処理装置及び熱処理方法
US8888434B2 (en) 2011-09-05 2014-11-18 Dynamic Micro System Container storage add-on for bare workpiece stocker
TWI447059B (zh) * 2012-01-10 2014-08-01 Inotera Memories Inc 晶圓倉儲系統
JP5610009B2 (ja) * 2013-02-26 2014-10-22 東京エレクトロン株式会社 基板処理装置
JP6211938B2 (ja) * 2014-01-27 2017-10-11 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
JP2015141915A (ja) * 2014-01-27 2015-08-03 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
JP6704423B2 (ja) * 2018-01-17 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
JP7090513B2 (ja) * 2018-09-06 2022-06-24 東京エレクトロン株式会社 基板処理装置及びパージ方法
JP7412137B2 (ja) * 2019-11-06 2024-01-12 東京エレクトロン株式会社 基板処理装置及び基板収納容器保管方法
CN114435813A (zh) * 2020-11-04 2022-05-06 沈阳芯源微电子设备股份有限公司 一种片盒保管搬运系统
CN114435935A (zh) * 2020-11-04 2022-05-06 沈阳芯源微电子设备股份有限公司 一种片盒保管搬运设备
CN113086468B (zh) * 2021-03-26 2022-07-05 东方电气集团科学技术研究院有限公司 一种平行布置的恒温固化塔存取料方法
JP2025174396A (ja) * 2024-05-17 2025-11-28 東京エレクトロン株式会社 メンテナンス装置、基板処理システム及びメンテナンス方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016055A (ja) * 2000-06-29 2002-01-18 Hitachi Kokusai Electric Inc 半導体製造装置
US6468021B1 (en) * 1998-12-18 2002-10-22 Asyst Technologies, Inc. Integrated intra-bay transfer, storage, and delivery system
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
US20040047714A1 (en) * 2002-09-06 2004-03-11 Recif, Societe Anonyme System for the conveying and storage of containers of semiconductor wafers, and transfer mechanism
JP2004119614A (ja) * 2002-09-25 2004-04-15 Hitachi Kokusai Electric Inc 半導体製造装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
JP3218488B2 (ja) * 1993-03-16 2001-10-15 東京エレクトロン株式会社 処理装置
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP2952748B2 (ja) 1994-11-24 1999-09-27 光洋リンドバーグ株式会社 熱処理装置
JP3478364B2 (ja) 1995-06-15 2003-12-15 株式会社日立国際電気 半導体製造装置
JPH10326818A (ja) 1997-05-26 1998-12-08 Kokusai Electric Co Ltd 半導体製造装置
JP4229497B2 (ja) 1998-09-07 2009-02-25 株式会社日立国際電気 基板処理装置および基板の処理方法
KR100646906B1 (ko) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US6506009B1 (en) 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
KR20020019414A (ko) * 2000-09-05 2002-03-12 엔도 마코토 기판 처리 장치 및 기판 처리 장치를 이용한 반도체디바이스 제조 방법
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6726429B2 (en) * 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
JP4358077B2 (ja) * 2004-09-21 2009-11-04 株式会社東芝 成膜装置及び成膜方法
JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
US6468021B1 (en) * 1998-12-18 2002-10-22 Asyst Technologies, Inc. Integrated intra-bay transfer, storage, and delivery system
JP2002016055A (ja) * 2000-06-29 2002-01-18 Hitachi Kokusai Electric Inc 半導体製造装置
US20040047714A1 (en) * 2002-09-06 2004-03-11 Recif, Societe Anonyme System for the conveying and storage of containers of semiconductor wafers, and transfer mechanism
JP2004119614A (ja) * 2002-09-25 2004-04-15 Hitachi Kokusai Electric Inc 半導体製造装置

Also Published As

Publication number Publication date
US20090053665A1 (en) 2009-02-26
TW200633069A (en) 2006-09-16
JP2006120658A (ja) 2006-05-11
JP4266197B2 (ja) 2009-05-20
TWI360183B (enExample) 2012-03-11
CN1906748A (zh) 2007-01-31
US8177550B2 (en) 2012-05-15
EP1811558A4 (en) 2008-09-10
KR20070047732A (ko) 2007-05-07
KR100780206B1 (ko) 2007-11-27
EP1811558A1 (en) 2007-07-25
WO2006043509A1 (ja) 2006-04-27

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Granted publication date: 20080716