JP2006120658A - 縦型熱処理装置及びその運用方法 - Google Patents
縦型熱処理装置及びその運用方法 Download PDFInfo
- Publication number
- JP2006120658A JP2006120658A JP2004303614A JP2004303614A JP2006120658A JP 2006120658 A JP2006120658 A JP 2006120658A JP 2004303614 A JP2004303614 A JP 2004303614A JP 2004303614 A JP2004303614 A JP 2004303614A JP 2006120658 A JP2006120658 A JP 2006120658A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- storage unit
- loading
- storing
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000003860 storage Methods 0.000 claims abstract description 152
- 238000012546 transfer Methods 0.000 claims abstract description 40
- 230000001965 increasing effect Effects 0.000 abstract description 26
- 230000032258 transport Effects 0.000 description 52
- 239000000969 carrier Substances 0.000 description 30
- 239000000872 buffer Substances 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 28
- 238000002397 field ionisation mass spectrometry Methods 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Furnace Charging Or Discharging (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
Abstract
【解決手段】 複数枚の被処理体wを収納した運搬容器2を搬入搬出するための搬入搬出部3,4と、該搬入搬出部3,4から搬入された複数の運搬容器2を保管する第1保管部5と、多数枚の被処理体wを多段に保持した保持具6を収容して被処理体wに所定の熱処理を施す熱処理炉7と、前記保持具6と運搬容器2との間で被処理体wの移載を行うために運搬容器2を載置する移載部8とを備えた縦型熱処理装置1であって、前記搬入搬出部3,4を上下2段設けると共に、上段と下段の搬入搬出部3,4間に運搬容器2を保管する第2保管部20を設けている。前記搬入搬出部3,4の何れかが運搬容器2を保管する第3保管部30とされる。
【選択図】 図1
Description
1 縦型熱処理装置
2 キャリア(運搬容器)
3,4 ロードポート(搬入搬出部)
5 キャリアステージ(第1保管部)
6 ボート(保持具)
7 熱処理炉
8 FIMSポート(移載部)
20 第2保管部
22 制御部
30 第3保管部
40 第4保管部
Claims (7)
- 複数枚の被処理体を収納した運搬容器を搬入搬出するための搬入搬出部と、該搬入搬出部から搬入された複数の運搬容器を保管する第1保管部と、多数枚の被処理体を多段に保持した保持具を収容して被処理体に所定の熱処理を施す熱処理炉と、前記保持具と運搬容器との間で被処理体の移載を行うために運搬容器を載置する移載部とを備えた縦型熱処理装置であって、前記搬入搬出部を上下2段設けると共に、上段と下段の搬入搬出部間に運搬容器を保管する第2保管部を設けたことを特徴とする縦型熱処理装置。
- 前記搬入搬出部の何れかが運搬容器を保管する第3保管部とされていることを特徴とする請求項1記載の縦型熱処理装置。
- 前記移載部が運搬容器を保管する第4保管部とされることを特徴とする請求項1記載の縦型熱処理装置。
- 複数枚の被処理体を収納した運搬容器を搬入搬出するための搬入搬出部と、該搬入搬出部から搬入された複数の運搬容器を保管する第1保管部と、多数枚の被処理体を多段に保持した保持具を収容して被処理体に所定の熱処理を施す熱処理炉と、前記保持具と運搬容器との間で被処理体の移載を行うために運搬容器を載置する移載部とを備えた縦型熱処理装置であって、前記搬入搬出部を上下2段設けると共に、上段と下段の搬入搬出部間に運搬容器を保管する第2保管部を設け、前記搬入搬出部の何れかを運搬容器を保管する第3保管部とし、運搬容器の搬入個数に応じて第1保管部、第2保管部、第3保管部を組み合わせて使用する制御部を備えたことを特徴とする縦型熱処理装置。
- 前記移載部を運搬容器を保管する第4保管部とし、前記制御部が運搬容器の搬入個数に応じて第1保管部、第2保管部、第3保管部、第4保管部を組み合わせて使用するように設定されていることを特徴とする請求項4記載の縦型熱処理装置。
- 複数枚の被処理体を収納した運搬容器を搬入搬出するための搬入搬出部と、該搬入搬出部から搬入された複数の運搬容器を第1保管部と、多数枚の被処理体を多段に保持した保持具を収容して被処理体に所定の熱処理を施す熱処理炉と、前記保持具と運搬容器との間で被処理体の移載を行うために運搬容器を載置する移載部とを備えた縦型熱処理装置の運用方法であって、前記搬入搬出部を上下2段設けると共に、上段と下段の搬入搬出部間の筐体内側に運搬容器を保管する第2保管部を設け、前記搬入搬出部の何れかを運搬容器を保管する第3保管部とし、運搬容器の搬入個数に応じて第1保管部、第2保管部、第3保管部を組み合わせて使用することを特徴とする縦型熱処理装置の運用方法。
- 前記移載部を運搬容器を保管する第4保管部とし、運搬容器の搬入個数に応じて第1保管部、第2保管部、第3保管部、第4保管部を組み合わせて使用することを特徴とする請求項6記載の縦型熱処理装置の運用方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303614A JP4266197B2 (ja) | 2004-10-19 | 2004-10-19 | 縦型熱処理装置 |
PCT/JP2005/019039 WO2006043509A1 (ja) | 2004-10-19 | 2005-10-17 | 縦型熱処理装置及びその運用方法 |
KR1020067015461A KR100780206B1 (ko) | 2004-10-19 | 2005-10-17 | 종형 열처리 장치 및 그 운용 방법 |
EP05793489A EP1811558A4 (en) | 2004-10-19 | 2005-10-17 | VERTICAL HEAT TREATMENT DEVICE AND OPERATING METHOD THEREFOR |
CNB2005800014450A CN100403509C (zh) | 2004-10-19 | 2005-10-17 | 立式热处理装置及其使用方法 |
US11/665,645 US8177550B2 (en) | 2004-10-19 | 2005-10-17 | Vertical heat treatment apparatus and method for operating the same |
TW094136612A TW200633069A (en) | 2004-10-19 | 2005-10-19 | Vertical heat treatment device and application method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303614A JP4266197B2 (ja) | 2004-10-19 | 2004-10-19 | 縦型熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006120658A true JP2006120658A (ja) | 2006-05-11 |
JP4266197B2 JP4266197B2 (ja) | 2009-05-20 |
Family
ID=36202925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004303614A Active JP4266197B2 (ja) | 2004-10-19 | 2004-10-19 | 縦型熱処理装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8177550B2 (ja) |
EP (1) | EP1811558A4 (ja) |
JP (1) | JP4266197B2 (ja) |
KR (1) | KR100780206B1 (ja) |
CN (1) | CN100403509C (ja) |
TW (1) | TW200633069A (ja) |
WO (1) | WO2006043509A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010050458A (ja) * | 2008-08-20 | 2010-03-04 | Semes Co Ltd | 基板処理装置及び基板移送方法 |
JP2010212648A (ja) * | 2009-02-10 | 2010-09-24 | Muratec Automation Co Ltd | 移載装置 |
JP2013102235A (ja) * | 2013-02-26 | 2013-05-23 | Tokyo Electron Ltd | 基板処理装置 |
US8851819B2 (en) | 2009-02-20 | 2014-10-07 | Tokyo Electron Limited | Substrate processing apparatus |
JP2015141915A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
JP2015141916A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4266197B2 (ja) * | 2004-10-19 | 2009-05-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP4313401B2 (ja) * | 2007-04-24 | 2009-08-12 | 東京エレクトロン株式会社 | 縦型熱処理装置及び被処理基板移載方法 |
US8882431B2 (en) * | 2008-10-07 | 2014-11-11 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer robot and substrate transfer system |
JP4973675B2 (ja) * | 2009-02-26 | 2012-07-11 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP2012054392A (ja) * | 2010-09-01 | 2012-03-15 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
JP5625981B2 (ja) * | 2011-02-10 | 2014-11-19 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
US8888434B2 (en) | 2011-09-05 | 2014-11-18 | Dynamic Micro System | Container storage add-on for bare workpiece stocker |
TWI447059B (zh) * | 2012-01-10 | 2014-08-01 | Inotera Memories Inc | 晶圓倉儲系統 |
CN107851594B (zh) * | 2015-08-28 | 2021-06-22 | 株式会社国际电气 | 基板处理装置以及半导体装置的制造方法 |
JP6704423B2 (ja) * | 2018-01-17 | 2020-06-03 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
JP7090513B2 (ja) * | 2018-09-06 | 2022-06-24 | 東京エレクトロン株式会社 | 基板処理装置及びパージ方法 |
JP7412137B2 (ja) * | 2019-11-06 | 2024-01-12 | 東京エレクトロン株式会社 | 基板処理装置及び基板収納容器保管方法 |
CN114435813A (zh) * | 2020-11-04 | 2022-05-06 | 沈阳芯源微电子设备股份有限公司 | 一种片盒保管搬运系统 |
CN114435935A (zh) * | 2020-11-04 | 2022-05-06 | 沈阳芯源微电子设备股份有限公司 | 一种片盒保管搬运设备 |
CN113086468B (zh) * | 2021-03-26 | 2022-07-05 | 东方电气集团科学技术研究院有限公司 | 一种平行布置的恒温固化塔存取料方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
JP2952748B2 (ja) | 1994-11-24 | 1999-09-27 | 光洋リンドバーグ株式会社 | 熱処理装置 |
JP3478364B2 (ja) | 1995-06-15 | 2003-12-15 | 株式会社日立国際電気 | 半導体製造装置 |
JPH10326818A (ja) | 1997-05-26 | 1998-12-08 | Kokusai Electric Co Ltd | 半導体製造装置 |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
JP4229497B2 (ja) | 1998-09-07 | 2009-02-25 | 株式会社日立国際電気 | 基板処理装置および基板の処理方法 |
KR100646906B1 (ko) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
US6481558B1 (en) * | 1998-12-18 | 2002-11-19 | Asyst Technologies, Inc. | Integrated load port-conveyor transfer system |
US6506009B1 (en) | 2000-03-16 | 2003-01-14 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
JP4383636B2 (ja) * | 2000-06-29 | 2009-12-16 | 株式会社日立国際電気 | 半導体製造装置および半導体装置の製造方法 |
KR20020019414A (ko) * | 2000-09-05 | 2002-03-12 | 엔도 마코토 | 기판 처리 장치 및 기판 처리 장치를 이용한 반도체디바이스 제조 방법 |
JP2003007800A (ja) * | 2001-06-21 | 2003-01-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
US6726429B2 (en) * | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
JP4184018B2 (ja) | 2002-09-25 | 2008-11-19 | 株式会社日立国際電気 | 半導体製造装置、半導体製造システムおよび半導体製造方法 |
JP4358077B2 (ja) * | 2004-09-21 | 2009-11-04 | 株式会社東芝 | 成膜装置及び成膜方法 |
JP4266197B2 (ja) * | 2004-10-19 | 2009-05-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP4904995B2 (ja) * | 2006-08-28 | 2012-03-28 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
US7740437B2 (en) * | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
-
2004
- 2004-10-19 JP JP2004303614A patent/JP4266197B2/ja active Active
-
2005
- 2005-10-17 KR KR1020067015461A patent/KR100780206B1/ko active IP Right Grant
- 2005-10-17 US US11/665,645 patent/US8177550B2/en active Active
- 2005-10-17 EP EP05793489A patent/EP1811558A4/en not_active Withdrawn
- 2005-10-17 WO PCT/JP2005/019039 patent/WO2006043509A1/ja active Application Filing
- 2005-10-17 CN CNB2005800014450A patent/CN100403509C/zh active Active
- 2005-10-19 TW TW094136612A patent/TW200633069A/zh unknown
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010050458A (ja) * | 2008-08-20 | 2010-03-04 | Semes Co Ltd | 基板処理装置及び基板移送方法 |
US8702365B2 (en) | 2008-08-20 | 2014-04-22 | Semes Co., Ltd. | Substrate processing apparatus and method for transferring substrate for the apparatus |
JP2010212648A (ja) * | 2009-02-10 | 2010-09-24 | Muratec Automation Co Ltd | 移載装置 |
JP4720932B2 (ja) * | 2009-02-10 | 2011-07-13 | ムラテックオートメーション株式会社 | 移載装置 |
US8851819B2 (en) | 2009-02-20 | 2014-10-07 | Tokyo Electron Limited | Substrate processing apparatus |
US9305818B2 (en) | 2009-02-20 | 2016-04-05 | Tokyo Electron Limited | Substrate processing apparatus |
JP2013102235A (ja) * | 2013-02-26 | 2013-05-23 | Tokyo Electron Ltd | 基板処理装置 |
JP2015141915A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
JP2015141916A (ja) * | 2014-01-27 | 2015-08-03 | 東京エレクトロン株式会社 | 基板熱処理装置、基板熱処理装置の設置方法 |
KR20150089947A (ko) | 2014-01-27 | 2015-08-05 | 도쿄엘렉트론가부시키가이샤 | 기판 열 처리 장치, 기판 열 처리 장치의 설치 방법 |
US9716021B2 (en) | 2014-01-27 | 2017-07-25 | Tokyo Electron Limited | Substrate heat treatment apparatus, method of installing substrate heat treatment apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR100780206B1 (ko) | 2007-11-27 |
CN1906748A (zh) | 2007-01-31 |
US20090053665A1 (en) | 2009-02-26 |
WO2006043509A1 (ja) | 2006-04-27 |
CN100403509C (zh) | 2008-07-16 |
EP1811558A4 (en) | 2008-09-10 |
TWI360183B (ja) | 2012-03-11 |
KR20070047732A (ko) | 2007-05-07 |
EP1811558A1 (en) | 2007-07-25 |
TW200633069A (en) | 2006-09-16 |
JP4266197B2 (ja) | 2009-05-20 |
US8177550B2 (en) | 2012-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100780206B1 (ko) | 종형 열처리 장치 및 그 운용 방법 | |
JP2020188255A (ja) | ウェハボートハンドリング装置、縦型バッチ炉および方法 | |
JP5689483B2 (ja) | 基板処理装置、基板支持具及び半導体装置の製造方法 | |
JPH06267873A (ja) | 処理装置 | |
JP3543996B2 (ja) | 処理装置 | |
JP7105751B2 (ja) | 処理装置 | |
US9716021B2 (en) | Substrate heat treatment apparatus, method of installing substrate heat treatment apparatus | |
TW201512412A (zh) | 磁性退火裝置(一) | |
US9548229B2 (en) | Substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device | |
JP2018198305A (ja) | 真空搬送モジュール及び基板処理装置 | |
JP2003037107A (ja) | 処理装置及び処理方法 | |
JP2696265B2 (ja) | 半導体装置の製造装置 | |
JP5797176B2 (ja) | スペーサ、スペーサの搬送方法、処理方法、及び、処理装置 | |
JP2005277049A (ja) | 熱処理システム及び熱処理方法 | |
TWI390653B (zh) | 磊晶製程系統及其製程方法 | |
JP4358690B2 (ja) | 縦型熱処理装置及びその運用方法 | |
JP6000038B2 (ja) | スペーサ、スペーサの搬送容器、スペーサの搬送方法、処理方法、及び、処理装置 | |
CN107689336B (zh) | 盖体和使用了该盖体的基板处理装置 | |
US20150214080A1 (en) | Substrate heat treatment apparatus, method of installing substrate heat treatment apparatus | |
JP4071313B2 (ja) | ウエーハ熱処理装置 | |
JP2016157712A (ja) | 冷却装置及びこれを用いた熱処理装置、並びに冷却方法 | |
KR20180109725A (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
JP2001284278A (ja) | 基板処理装置および基板処理方法 | |
JP2001156009A (ja) | 熱処理装置 | |
JP2002043389A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080708 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080806 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20080806 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080806 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080909 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081107 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20081107 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090210 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090213 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4266197 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120227 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150227 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |