KR100780206B1 - 종형 열처리 장치 및 그 운용 방법 - Google Patents

종형 열처리 장치 및 그 운용 방법 Download PDF

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Publication number
KR100780206B1
KR100780206B1 KR1020067015461A KR20067015461A KR100780206B1 KR 100780206 B1 KR100780206 B1 KR 100780206B1 KR 1020067015461 A KR1020067015461 A KR 1020067015461A KR 20067015461 A KR20067015461 A KR 20067015461A KR 100780206 B1 KR100780206 B1 KR 100780206B1
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South Korea
Prior art keywords
heat treatment
storage
carrying
treatment apparatus
carry
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Expired - Lifetime
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KR1020067015461A
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English (en)
Korean (ko)
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KR20070047732A (ko
Inventor
겐지로오 하라끼
히로유끼 야마모또
사또시 우에무라
유우지 쯔노다
야스시 다께우찌
히로후미 가네꼬
Original Assignee
도쿄 엘렉트론 가부시키가이샤
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Publication of KR20070047732A publication Critical patent/KR20070047732A/ko
Application granted granted Critical
Publication of KR100780206B1 publication Critical patent/KR100780206B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
KR1020067015461A 2004-10-19 2005-10-17 종형 열처리 장치 및 그 운용 방법 Expired - Lifetime KR100780206B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004303614A JP4266197B2 (ja) 2004-10-19 2004-10-19 縦型熱処理装置
JPJP-P-2004-00303614 2004-10-19

Publications (2)

Publication Number Publication Date
KR20070047732A KR20070047732A (ko) 2007-05-07
KR100780206B1 true KR100780206B1 (ko) 2007-11-27

Family

ID=36202925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067015461A Expired - Lifetime KR100780206B1 (ko) 2004-10-19 2005-10-17 종형 열처리 장치 및 그 운용 방법

Country Status (7)

Country Link
US (1) US8177550B2 (enExample)
EP (1) EP1811558A4 (enExample)
JP (1) JP4266197B2 (enExample)
KR (1) KR100780206B1 (enExample)
CN (1) CN100403509C (enExample)
TW (1) TW200633069A (enExample)
WO (1) WO2006043509A1 (enExample)

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JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
JP4313401B2 (ja) * 2007-04-24 2009-08-12 東京エレクトロン株式会社 縦型熱処理装置及び被処理基板移載方法
KR101077566B1 (ko) 2008-08-20 2011-10-28 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
EP2353797B1 (en) * 2008-10-07 2014-08-06 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and system
JP4720932B2 (ja) * 2009-02-10 2011-07-13 ムラテックオートメーション株式会社 移載装置
JP5212165B2 (ja) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2012054392A (ja) * 2010-09-01 2012-03-15 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP5625981B2 (ja) * 2011-02-10 2014-11-19 東京エレクトロン株式会社 熱処理装置及び熱処理方法
US8888434B2 (en) 2011-09-05 2014-11-18 Dynamic Micro System Container storage add-on for bare workpiece stocker
TWI447059B (zh) * 2012-01-10 2014-08-01 Inotera Memories Inc 晶圓倉儲系統
JP5610009B2 (ja) * 2013-02-26 2014-10-22 東京エレクトロン株式会社 基板処理装置
JP6211938B2 (ja) * 2014-01-27 2017-10-11 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
JP2015141915A (ja) * 2014-01-27 2015-08-03 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
JP6704423B2 (ja) * 2018-01-17 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
JP7090513B2 (ja) * 2018-09-06 2022-06-24 東京エレクトロン株式会社 基板処理装置及びパージ方法
JP7412137B2 (ja) * 2019-11-06 2024-01-12 東京エレクトロン株式会社 基板処理装置及び基板収納容器保管方法
CN114435813A (zh) * 2020-11-04 2022-05-06 沈阳芯源微电子设备股份有限公司 一种片盒保管搬运系统
CN114435935A (zh) * 2020-11-04 2022-05-06 沈阳芯源微电子设备股份有限公司 一种片盒保管搬运设备
CN113086468B (zh) * 2021-03-26 2022-07-05 东方电气集团科学技术研究院有限公司 一种平行布置的恒温固化塔存取料方法
JP2025174396A (ja) * 2024-05-17 2025-11-28 東京エレクトロン株式会社 メンテナンス装置、基板処理システム及びメンテナンス方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016055A (ja) * 2000-06-29 2002-01-18 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004119614A (ja) * 2002-09-25 2004-04-15 Hitachi Kokusai Electric Inc 半導体製造装置

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US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
JP3218488B2 (ja) * 1993-03-16 2001-10-15 東京エレクトロン株式会社 処理装置
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP2952748B2 (ja) 1994-11-24 1999-09-27 光洋リンドバーグ株式会社 熱処理装置
JP3478364B2 (ja) 1995-06-15 2003-12-15 株式会社日立国際電気 半導体製造装置
JPH10326818A (ja) 1997-05-26 1998-12-08 Kokusai Electric Co Ltd 半導体製造装置
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
JP4229497B2 (ja) 1998-09-07 2009-02-25 株式会社日立国際電気 基板処理装置および基板の処理方法
KR100646906B1 (ko) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US6435330B1 (en) * 1998-12-18 2002-08-20 Asyai Technologies, Inc. In/out load port transfer mechanism
US6506009B1 (en) 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
KR20020019414A (ko) * 2000-09-05 2002-03-12 엔도 마코토 기판 처리 장치 및 기판 처리 장치를 이용한 반도체디바이스 제조 방법
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6726429B2 (en) * 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
JP4358077B2 (ja) * 2004-09-21 2009-11-04 株式会社東芝 成膜装置及び成膜方法
JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016055A (ja) * 2000-06-29 2002-01-18 Hitachi Kokusai Electric Inc 半導体製造装置
JP2004119614A (ja) * 2002-09-25 2004-04-15 Hitachi Kokusai Electric Inc 半導体製造装置

Also Published As

Publication number Publication date
US20090053665A1 (en) 2009-02-26
TW200633069A (en) 2006-09-16
JP2006120658A (ja) 2006-05-11
JP4266197B2 (ja) 2009-05-20
TWI360183B (enExample) 2012-03-11
CN1906748A (zh) 2007-01-31
US8177550B2 (en) 2012-05-15
EP1811558A4 (en) 2008-09-10
KR20070047732A (ko) 2007-05-07
CN100403509C (zh) 2008-07-16
EP1811558A1 (en) 2007-07-25
WO2006043509A1 (ja) 2006-04-27

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