TW200902415A - Substrate treatment apparatus - Google Patents

Substrate treatment apparatus Download PDF

Info

Publication number
TW200902415A
TW200902415A TW097108014A TW97108014A TW200902415A TW 200902415 A TW200902415 A TW 200902415A TW 097108014 A TW097108014 A TW 097108014A TW 97108014 A TW97108014 A TW 97108014A TW 200902415 A TW200902415 A TW 200902415A
Authority
TW
Taiwan
Prior art keywords
substrate
transfer
holding
substrates
support
Prior art date
Application number
TW097108014A
Other languages
Chinese (zh)
Other versions
TWI378894B (en
Inventor
Akio Shiomi
Yoshihiro Nishina
Toru Sato
Ryo Muramoto
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200902415A publication Critical patent/TW200902415A/en
Application granted granted Critical
Publication of TWI378894B publication Critical patent/TWI378894B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

A substrate treatment apparatus includes a container holder which holds a container for containing multiple substrates vertically stacked in horizontal postures, a substrate treatment section which collectively applies treatment to multiple substrates horizontally stacked in vertical postures, a main conveyance mechanism which conveys multiple substrates horizontally stacked in vertical postures between a substrate delivery position and the substrate treatment section, a carrying in/out mechanism which carries in/out the multiple substrates with respect to the container and changes postures of the multiple substrates between the horizontal postures and the vertical postures, and a sub conveyance mechanism which receives and delivers multiple substrates in vertical postures from and to the carrying in/out mechanism at a transferposition, receives and delivers multiple substrates in vertical postures from and to the main conveyance mechanism at the substrate delivery position, and conveys multiple substrates in vertical postures between the transfer and substrate delivery positions.

Description

200902415 九、發明說明： 【發明所屬之技術領域】 本發明關於一種對多片《基板—起施加處理之基板處 裝置成為處理對象之基板包含有例如半導體晶圓、液 晶顯示裝置用基板、電漿顯示器用基板、FED(Fieid。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Display substrate, FED (Fieid

Emlssi〇n Display)用基板、光碟用基板、磁碟用基板、 光磁碟用基板、和光罩用基板等。 【先前技術】 壯在使用藥液對半導體晶圓等基板施加處理之基板處理 =置中’包含有對多片基板—起施加處理之成批方式者。 板處理裝置之一實例被揭示在曰本專利特開 =—354604號公報。該基板處理震置具備有：載體載 平移載機器人、姿勢變換機構、推進器 構、和基板處理部。 疋拽 能置部可以載置以水平姿勢在垂直方向疊層之狀 心、’、、寺夕片基板的載體（收容器）。 可;ί : Τι =器人由多關節臂型之搬運機器人構成，構成 式，^縮，且圍繞敍直轴線旋轉。利用此種方 在垂直方向載體，水平姿勢 臂朝向姿勢變載體出入’更使多關節 Μ換機構’使以水平姿勢在垂直方向疊 土板對該姿勢變換機構進行交接。 夕 垂換機構對於多片疊層之基板-起在水平姿勢和 -之間進行姿勢變換。在多關節臂之基板搬運中^ 97108014 200902415 ίΐίίΐ生基板位置偏移之問題’為消除該問題，在姿 勢變換機構具傷有基板排列機構。 在妾 推進器具備有可以上· 姿勢變換機搆之間，可以f::動之固持器’在與 在與搬運機構之間二一姿勢之多片基板， ί 機構所保持之多片基板之間距之-接^# 板。例如’在從姿勢變換機構龍持器交 移動微小距離。在該狀;在_;祕板$層方向之水平方向 25 μ # ^ ^心、下，仉妾勢變換機構將另外之 ==固持器。後來交給之25片基板進入先前： :“間’在固持器上形成合計5〇片基板之成 批。如此，將組合多個之基板群 , 組合。當從始推哭收甘， ^又万式％為成批 所#拉夕^ D :土板交給姿勢變換機構時，將固持器 片A軛，.片基板中之25片交給姿勢變換機構，該25 心板，變換姿勢成為水平姿勢之後，交給水平 禮，將固持器上之其餘25 :構如:經:，水平姿勢之後，由水平二： 其f / 來’ 5 〇片基板被分離成為各2 5片之2個之 土板群。如此，將成批形成之多 群之方式稱為成批解除。 板刀離成為多個基板 搬運機構具有以垂直姿勢保持成批形成之 :板央盤’經由使該基板央盤在水平方 ：： 板失盤’例如，在推進器和搬運機構之間::板 97108014 200902415 之下方，設置夾盤洗淨單元。 基板處理部具有沿著搬運機構之移動方向配置之多個 處理槽。處理槽包含有藥液槽、水洗槽和乾燥槽。藥液槽 將垂直姿勢之多片基板浸潰到被儲存在槽内之藥液中，對 多片之基板一起施加藥液處理。水洗槽將垂直姿勢之多片 基板浸潰到被儲存在槽内之純水（去離子水）中，對多片之 基板一起施加水洗（沖洗）處理。乾燥槽對多片之基板一起 施加供給有機溶劑（例如，異丙醇）或甩去液成分之處理。 上述習知技術之基板處理裝置之主要問題是第丨基板 處理速度（生產量）較低，和第2價格高昂。 具體而言，水平移載機器人因為是多關節臂型，所以由 於其機械強度之限制，在一起保持多片基板之狀態下，無 法提高動作速度。且，多關節臂型機器人本身高價格。更 進一步，因為需要多關節臂旋轉所需之空間，所以實質上 之佔用面積很大成為其問題。 另卜在夕關節#之水平旋轉移動時，因為多片基板之 相對位置之偏移’所以如上所述，在姿勢變換機構需要具 備基板排賴構。職板㈣機構之動料㈣迫基板處 理速度。另外，姿勢變換機構，除基板排列機構外 用以保持水平姿勢之基板的水平基板導件，用以保持 +安勢之基板的垂直基板導件，和基板之 旋轉機構’因此成為非常高價之機器人。 、用之 m2’推進器具備有上下移動機構、水平移動機構和旋 籌’同樣地成為非常高價格之機器人。 97108014 200902415 如此，推進器（收容器）和搬運機構之間之基板搬運需要 時間’成為阻礙生產量之提高之一原因。另外，載體（收 容器）和搬運機構之間之基板搬運用之構造昂貴，因此會 ·- 妨礙基板處理裝置之成本降低。 : 另外，在上述之習知技術之基板處理裝置中，因為從載 體到搬運機構之基板搬運路徑為丨個系統，所以在將未處 理基板送入到主搬運機構時，無法從搬運機構將處理過基 『板排出到載體，又在排出處理過基板時，無法將未處理基 '板送入。另外，在將未處理基板送入搬運機構時，因為需 要推進器之固持器上之成批組入動作，所以至處理過基板 排出之等待時間很長。同樣地，在排出處理過基板時，因 為茜要推進益之固持器上之成批解除動作，所以至成為可 以送入未處理基板之狀態的等待時間亦很長。此成為使基 板處理速度降低之另一要因。 更進一步，在基板交接位置當其被保持在推進器時，搬 (運機構無法將經乾燥槽處理之處理過基板排出到基板交 接位置。因此，搬運機構首先在基板交接位置收取未處理 之基板，將其搬入到藥液槽。然後，搬運機構在夾盤洗淨 單元洗淨基板夾盤之後，收取來自乾燥槽之處理過基板， 在基板交接位置將其交給推進器。由於在保持有未處理基 :板之基板夾盤轉移有未處理基板之表面異物，所以為防止 :該異物轉移到處理過之基板，而不得不在保持處理過基板 之韵洗淨基板夾盤。因此成為基板處理速度降低之另一要 因0 97108014 9 200902415 的是提供一種可以 提高基板處理速度之基 【發明内容】 本發明之目 板處理裝置。 本發明之另一目 置。 的是提供可以 降低成本之基板處理裝 本發明之第1態樣之基板處㈣置 持部，用來保持收容器藉以收容以水平姿勢上 二：片幻反，基板處理部，用來對以垂直姿勢在水平方 :且上之夕片基板—起施加處理；主搬運機構，在既定之 ^板父接位置和上述基板處理部之間，—起搬運以垂直姿 勢在水平方向疊層之多片之基板；搬人/搬出機構，對由 ^述收容器保持部所保持之收容器，將多片基板一起搬入 搬出/並使該多片基板在水平姿勢和垂直姿勢之間一起 變換姿勢；和副搬運機構，於既定之移載位置處在盥上述 搬入/搬出機構之間，一起交接垂直姿勢之多片基板，於 上述基板父接位置處在與上述主搬運機構之間，一起交接 垂直安勢之多>|基板’在上述移載位置和上述基板交接位 置之間，一起搬運垂直姿勢之多片基板。 依照此種構造時，以水平姿勢被收容在收容器内之多片 基板，被搬入/搬出機構一起搬出，進而被該搬入/搬出機 構變換姿勢成為垂直姿勢。該垂直姿勢之多片基板，在移 載位置被移載到副搬運機構，然後被搬運到基板交接位 置，在該基板父接位置處交給主搬運機構。主搬運機構將 垂直安勢之多片基板搬運到基板處理部。在基板處理部處 97108014 200902415 Γΐ 1 : 構，從基板處理部搬運到基板交接 立置，父給副搬運機構。副搬運機構從基板交接位置將ί =運到移載位置，交給搬人/搬出機構。搬人/搬出機ς 到收容器。 、文勢成為水平姿勢之後，將其搬入 依照此種方式，在本發明Φ h 收容器之基板搬人和㈣ 2 機構，進行對 ^ 以及基板之姿勢變更。因此， :/、使用夕關節臂型機器人進行基板之搬入/搬出，進而 =板之安勢變更用之專用姿勢變更機構之習知 比較4 ’可以使構造簡化。 j進一步’搬入/搬出機構因為可以進行對收容器之基 =/搬出動作、和姿勢變換動作，所以 t. 關節臂水平旋轉。因此，動作時間可以縮短。利 ^此财式’可以縮短基板搬運所需要之時間，可提高每 2位㈣可處理之基板片數。亦即，可以提高基板處理速 ，好使上述搬入/搬出機構包含有：多片保持手柄，用 手持多片f板；手柄進退機構，用來使該多片保持 —、上述收容器保持部保持之收容器，沿水平方向之 方向進退；和手柄旋轉機構，用來使上述多片保 、 /α上述進退方向之錯直面至少旋轉g〇度。 二々：此種構造時’搬入/搬出機構使多片J寺手柄對收 =進行進退，用來從收容器-起搬出多片之基板，沿著 退方向之錯直面使多片保持手柄旋轉9〇度，可以用來 97108014 11 200902415 將基板姿勢從水平姿勢變換成為垂直姿勢。另外，當將基 板搬入到收容器時，可以在使多片保持手柄從垂直姿勢變 換姿勢成為水平姿勢之後，朝向收容器進退。如此一來， 因為可利用包含多片保持手柄之進退方向㈣直面内手 柄旋轉動作來進行基板之姿勢變換，所以可使搬入/搬出 機構之構造簡化。亦即，不需要習知技術之多關節臂之水 平旋轉。因此’可·速地進行對收容器之多片保持手柄 之進退和姿勢變更。 亦可以使上述多片保持手柄具備有多個手柄元件，分別 用來保持1 Η基板’❿亦可錢各個手柄元件在手柄元件 排列方向之-側具有w i基板保持部，在手柄排列方向之 另-側具有第2基板保持部。在此種情況，最好使上述搬 入/搬出機構更包含有以使上述手柄元件之表面/背面反 轉之方式，使上述多片保持手柄圍繞既定之旋轉軸 手柄旋轉機構。 依照此種構造時，利用手柄旋轉機構使多片保持手柄旋 轉，可以用來使第i基板保持部或第2基板保持部之任一 者=面側。利用此種方式，可以變換第！基板保持部 口苐土板保持部，使其用在基板保制。因此，例如， 當一基板保持部用在未處理基板之保持用時，可以使另一 基板保持部用在處理過基板之保持用。利用此種方式，可 以抑制或^未處理基板之表面之異物轉移到處理過基 板。 最好使上述搬入/搬出 裝置更包含有支持導件，用來從 97108014 22 200902415 下方支持垂直姿勢之多片之基板。依照此種構造時，可 7用支持導件A持垂直姿勢之基板。與其—併地，當使多 丙成為垂直姿勢時，可以利用支持導件同時排列 夕片之基板。利用此種方式可以廉價之構造排列多片其 ，而且，因為可以同時完成基板之姿勢變更和基板之ς 广所以可更進一步地縮短收容器和主搬運機構間之基板 搬運所需要之時間。 丞板 r 最好使上述支持導件對各個手柄元件具有一對 持溝。在此種情況’最好使上述搬入/搬出機構更包含有 ::驅動上述支持導件來選擇上述一對基板保持溝之任 以保持基板之導件驅動機構。依照此種構造時，因 利用導引驅動機構可以選擇—對基板保持溝中之任二 者’所以當將該等—對之基板保持溝中之任—者用在 理基板之保持時，可以將另-者用在處理過基板之保持 1... ^利用此種方式可以抑制或防止未處理基板之表面^里 物轉移到處理過基板。 /、 :可以使上述副搬運機構包含有：移載機構，具有移載 mm:持以垂直姿勢在水平方向疊層的狀態 夕片基板’使该移載支持部上下移動，利用該上下移 ===搬入/搬出機構之間’於上述移載位置-起 又接垂直安勢之夕片基板；和水平搬運機構’具有水平搬 =持部用來:呆持垂直姿勢之多片基板使其在水平方向 排列’而在上述移载位置，於上述移載支持部和上述水平 搬運保持部之間-起交接垂直姿勢之多片基板，在上述基 97108014 13 200902415 板乂接位置，於上述主搬運機構和上述水平搬運保持邻之 間一起交接垂直姿勢之多片基板，在上述移载位置和 基板交接位置之間使上述水平搬運保持部進行水平移動。 依照此種構造時，經由使移載機構之移載支持部上下移 動，可進行與搬入/搬出機構之基板交接、及與水平搬運 2構之基板交接。因此，透過簡單構造之移載機構之仲 介，可在搬入/搬出機構和水平搬運機構之間交接基板。 另外，因為水平搬運機構可在移載位置和基 :二 間水平搬運基板，所以同樣地使構造不會複 來，亦可抑制副搬運機構之成本。 最好將上述移載機構對於上述多片保持手柄之進退方 向配置在上述搬入/搬出機構之相反側。 依照此種構造時，搬入/搬出機構可使多片保持手柄進 二方，收谷益搬入/搬出基板，並可依沿其進退方向之移 構造：：移：位置。利用此種方式可使搬入/搬出機構之 構以更進一步地簡化而達到成本之降低。 水平搬運機構亦可以播读_ + 之進退方向正交LIZ成： 片保持手柄 搬運機構亦可在對多片=，年存，移載位置。亦即^ 方m 持手柄之進退方向正交之水平 之存取方2搬運保持部移動。利用此種構造，對收容器 基板交接位置之搬運方向間之基板搬運 二多：臂可以達成更進一步之構造簡化。另外，當 即#之旋轉進行基板搬運方向之轉換之習知 97108014 14 200902415 、Ί t*車又時，因為可以使基板搬運速度格外快速，所以可 以更進一步提高基板處理速度。 最好使上述移㈣構更包含有支持部水平移動機構，用 二使上述移载支持部沿疊層有垂直姿勢之基板的水平方 Π如手柄進退方向)在既定之距離範圍移動。依照此種 構7枯，在從移載支持部將第1基板群移載到水平搬運保 寺P後以移载支持部收取來自搬入/搬出機構之第2基 r 板群，可將第2基板群移載到水平搬運保持部之從上述^ 1基板群偏離之位置。制此種方式，可以在水平搬運保 持°^呆持第1和第2基板群，可以組合由第1和第2基板 群構成之成批。 例如，在將第丨基板群移載到水平搬運保持部之後，亦 可以使移載支持部水平移動帛i基板群之基板保持間距 之-半距離（半間距），將第2基板群移制水平搬運保持 部。利用此種方式，第i基板群和第2基板群，成為以各 ，之構成基板互不相同重疊狀態被保持在水平搬運保持 部^。利用此種方式，水平搬運料部可以較小之空間保 持多片之基板。另彳’處理此種狀態之成批之基板處理部 可以較小之空間處理多片基板。 取好使上述移載支持部包含有—對之支持導引軸，用來 從兩側保持以垂直姿勢在水平方向疊層之多片基板；上述 支持導引軸最好具有：抵接部，在周方向不同位置處抵接 在基板；和退離部’用來在該—對支持導引㈣確保既定 之間隔’以使基板可以通過上述—對支持導引軸間；上述 97108014 15 200902415 移載機構更包含有導引轉動機構，用來使上述一對支持導 引軸圍繞各軸方向轉動。該基板處理裝置最好更包含有栌 制單元’用來控制上述導引轉動機構，而在基板支持狀^ (使上述一對支持導引軸之抵接部間互相對向），和美 過狀態（使上述一對支持導引軸之退離部間互相對土向）之 間變換。 依照此種構造時’經由成為使—對支持㈣軸之抵接部 間成為相對向之基板支持狀態，可以收取並支持來自搬入 /搬出機構或水平搬運機構之垂直姿勢之多片基板。另外 -方面’在未支持基板時’經由成為退離部間對向之基板 通過狀態，可以用來避免與由搬入/搬出機構或水平搬運 機構所保持基板之干涉，可以使—對支持導引軸 =。利用此種方式，例如，在將基板交給水平 : =可以使-對支持導引轴退離到既定之 不會妨礙水平搬運保持部之水平移動之位置），ι構二 變為簡單。 J /、構\亦 最好使上述抵接部包含有被配置在上4支 周方向之不同位置處之第丨抵接部和第2 ' 種構造，因為可以選擇第1抵接立 > _ 。。利用此 而用…… 弟2抵接部之任-者 理過基板之支持來變換第^第由二:板之支持和處 式，可以抑制或防止未處理基板第之利用此種方 基板。 表面異物轉移到處理過 最好使上述水平搬運機構更包含有水平旋轉機構，用來 97108014 16 200902415 使上述水平搬運保持部圍繞鉛直轴在至少9〇度之範圍旋 轉（最好是圍繞水平搬運保持部之重心之水平旋轉）。 主搬運機構例如包含有：基板一起保持手段，用來一起 保持在搬入/搬出機構之手柄進退方向之垂直的水平方向 上疊層之垂直姿勢之多片基板；和橫行手段，用來使該基 板一起保持手段在上述手柄進退方向之平 : 移動。在此種冑況，基板處理部例如包含有沿上述橫二向 排列之多個處理單元。 、 在此種情況，經由使水平搬運機構之水平搬運保持 ^錯直軸旋轉90度’可用來使多片基板之疊層方向在移 載機構之疊層方向和主搬運機構之疊層方向之間變換。美 =層：向之變換在習知技術中是利用多關節臂之水； 二ί二臂水平旋轉需要長時間。對此，在本發明 …搬運保持部旋轉即可，所以可以使該旋轉 亦為簡單。利用此種方式，可以提高基板 u又，又達到基板處理裝置之成本降低。 平旋轉機構最好使上述水平搬運保持部圍繞# 部之重二tr:度之範圍旋轉(最好是圍繞水平搬運保持 :保持部所保持的垂直姿勢之基板: 使由::搬 基板群之構成二 述成批組合時，可使第1 面（形成有基板群之構成基板之裝置形成 形成面（未形成有裝置側使以之非裝置 】之表面）間互相對向。利用此種方 97108014 17 200902415 將成批浸潰到處理液中進行處理時，可以抑 制或防止異物從鄰㈣板之麵 置形成面之問題。 丹度附者在裹 基=平部具，上述移載支持部之 =二水平搬運保持部可以較小空間保持多片基板，在 5亥水平搬運保持部上可以組合成批。 f 持水平搬運保持部包含有：第1導件，用來支 用來去拄在ΐ平方向4層之多片基板；和第2導件， 、，、以垂直安勢在水平方向疊層之多片基板；上述水 平搬運機構更包含有導件升降機構，使上述第i導件對上 j第2導件進行相對升降。利用此種構造， 件τ導件相對升降，可以利用第以件或第： 任一者保持基板。此處，使用第i和第2導件來分開未處 理基板和處理過基板，可㈣u 開+處 異物轉移到處理過基板彻或防止未處理基板之表面之 第搬運機構在既定之第1基板交接位置及 =基板父接位置，與上述基板處理部之間，一起搬運多 持:二央亡ί副搬運機構包含有：移載機構’具有移載支 恭口/起保持多片基板’在上述移載位置處於上述移 ΐ :Γ:Λ述搬入/搬出機構之間，-起交接多片基 1板私動機構，具有第1搬運保持部用來保持多 運在上述移載位置於上述移載支持部和上述第1搬 運保持权間-起交接多片基板，在上述第ί基板交接位 97108014 18 200902415 主搬運機構和上述第1搬運保持部之間-起 乂，夕片基板，在上述移載位置和上述第i基板交接位置 用：t述第1搬運保持部移動；第2基板移動機構， 保持多片基板之第2搬運保持部，在上述移載位 、逑移載支持部和上述第2搬運保持部之間，一起交 ^ 板’在上述第2基板交接位置於上述主搬運機 構和上述第2搬運保持部之間，一起交接多片之基板^ f 上述移载位置和上述第2基板交接位置 運保持部移動。 弟Z搬 上述第1搬運支持部亦可用來將垂直 :列和保持在水平方向之第！水平搬運保持部/上片述基第， 動機構可在上述移載位置處於上述移載支持部和 :弟纟平搬運保持部之間，一起交接垂直姿勢之多片 =可在第1基板交接位置處於上述主搬運機構和 保持部之間，一起交接垂直姿勢之多片基板，在 处移載位置和上述第1基板交接位置之間，可使上述第 I水平搬運保持部水平移動。另外上述第2搬運支持部亦 1'是用來將垂直姿勢之多片基板排列和保持在水平方 蘇：：2水平搬運保持部。在此種情況下，上述第2基板 、構亦可為以了帛2水平搬運機構：可在上述移載位 ^處一於上述移載支持部和上述第2水平搬運保持部之 ^一起交接垂直姿勢之多片基板’可在第2基板交接位 置於上述主搬運機構和第2水平搬運保持部之間，一起交 接垂直姿勢之多片基板，在上述移載位置和上述第2基板 97108014 19 200902415 交接位置之間’可使上述第2水平搬運保持部水平移動。 依照此種構造時，主搬運機構可以存取第丨和第2其 行基板之交接。而且，利用第1基板移ί機 ，進仃第1基板交接位置和移載機構間之基板搬運，利用 第2基板移動機構進行第2基板交接位置和移載位置間之 基板搬運。如此一來’因為可以使移載機構和主搬運機構 :之基板搬運路徑成為2個系統，所以為透過搬入/搬出 、構從收容器取出未處理基板而將其送人主搬運機構，故 使用有另-基板搬運路徑之情況下，亦可經由另—基板搬 運路控’將處理過基板從主搬運機構朝移载機構排出。因 此二可以使等待時間減少，提高基板處理速度。 取好使上述第1基板移動機構在上述第丨基板交接位置 處從上述主搬運機構收取由上述基板處理部處理後之基 板，在上述移載位置處交給上述移載機構；上述第2基板 移動機構在上述移載位置處從上述移載機構收取由上述 處理部處理前之基板，在上述第2基板交接位置交給上述 主搬運機構。 ，照此種構造時，主搬運機構所進行之動作是在第2基 板又接位置處收取來自第2基板移動機構之未處理基 板，將其搬運到基板處理部，在第丨基板交接位置處將處 理過基板排出到第丨基板移動機構。經由將未處理基板之 &人和處理過基板之排出之路徑分離’當與基板搬入時和 基板排出時共用基板搬運路徑之習知技術比較時，可以縮 紐等待時間，提高基板處理速度。 97108014 20 200902415 亦可以使上述主搬運機構包含有基板夾盤用來一起保 持多片基板。在此種情況最好使上述基板處理裝置更包含 有：夾盤洗淨單元，用來洗淨上述主搬運機構之基板夾 盤；和搬運控制單元，用來控制上述主搬運機構之動作， 以將在上述基板處理部處理後之基板搬運到上述第丨基 板父接位置後（最好不利用上述夾盤洗淨單元洗淨上述基 板夾盤），從上述第2基板交接位置將基板搬運到上述基 板處理部，然後，利用上述夾盤洗淨單元洗淨上述基板夾 盤。 依照此種構造時，即使未處理基板在第2基板交接位置 成為等待之狀況，主搬運機構亦可首先將處理過基板從基 板處理部排出到第丨基板交接位置，然後將第2基板交接 位置之未處理基板搬運到基板處理部。亦即，不需要在主 搬運機構搬出處理過基板之前，使基板夾盤抵接未處理基 板，所以在處理過基板之排出前不需要進行基板夾盤之洗 淨。因此，基板夾盤之洗淨次數可減少。另外，基板夾盤 之洗淨因為利用在排出處理過基板，將未處理基板搬入到 基板處理部後之空餘時間進行，所以利用此種方式可以更 進一步地提高基板處理速度。 最好使上述基板處理裝置更包含有移載控制單元，其實 行：控制上述搬入/搬出機構、上述移載機構和上述第工 基板移動機構之步驟，以將由上述第丨搬運保持部所保持 之多片基板中一部份之第丨基板群交給上述移載支持 部，從該移載支持部將上述第丨基板群交給上述搬入/搬 97108014 21 200902415 另將由上述第1搬運保持部所保持之多片基 … 卜邛份（例如其餘部份）之第2其;链六认 述移載支持部，從該移載支持部將上 述搬入/搬出機構；和控制上述搬入/搬出機才;^、°上 :構和上述第2基板移動機構之步驟，以將第3基板^載 持上述移載支持部，從上_: 從上” 群交給上述第2搬運保持部，芦後， 部=人⑽出機構將第4基板群交給上述移载支持 :搬二^述移載支持部將該第4基板群交給上述第 和第4基板1。在該第2搬運保持部保持上述第3基板群 依照此種構造時’將由第工搬運保持部所保持 :分成第1基板群和第2基板群地移載到移載支㈣，； 移==解除動作。另外，從移載支持部將第3基板群 ^載運保持部，職，從移載支持部將第4基板 ^夕^弟2搬運保持部，用來進行成批組合動作。依昭 成=二第i基第板移動機構(第1搬運保持卿 側進mu 2基板移動機構(第2搬運保持部） 可以。因此，即使在成批解除動作中，亦 基板移動機構將成批之多片未處理基板交仏 2運機構。另外，即使在成批組 = r如T?處理過基板交給第1基板移動機= 為在成批解除動作中或成批組合動作中 场^糾間，所以可以更進—步地提高基板處理逮 97108014 22 200902415 度。 最好使上述基板處理裝置更包含有 接位置處仲介上述第2 以2基板交 間之基板交接之仲介機構。運保持朴上述主搬運機構之 依照此種構造時，因為可以經由仲介機 搬運機構和主搬運機構間之基板交接，所以用J 2:平 ::妾之第2水平搬運機構和主搬運機構之： 产。另外更進一步地提高基板處理逮 父接位置之另一單元 2基板 構，用夾#其把+ 有基板方位排列機 齊。 土板之方位（例如半導體日日日圓之結晶方位）對 ，好使上述移載機構之移載支持部—起保持以垂直姿 平方向疊層的狀態之多片基板’上述移載機構在上 ^夕位置處於上述移載支持部和上述搬入/搬 =一起交接垂直姿勢之多片基板；上述第i搬運保持部 用來保持垂直姿勢之多片基板使其在水平方向排列，第1 基，移動機構在上述移載位置處於上述移載支持部和上 述第1搬運保持部之間，—起交接垂直姿勢之多片基板， 在上述第1基板交接位置處於上述主搬運機構和上述第1 搬運保持部之間’—起交接垂直姿勢之多片基板；上述第 2搬運保持部用來保持垂直姿勢之多片基板使其在水平方 向排列，第2基板移動機構在上述移載位置處於上述移載 支持u卩和上述第2搬運保持部之間一起交接垂直姿勢之 97108014 23 200902415 二’9在上述第2基板交接位置處於上述主搬運機構 :反…2搬運保持部之間一起交接垂直姿勢之多片基 本發明之第2態樣之基板處理裝 部，用來保持收容器藉以收容多片保持 夾斟叹合夕月丞扳，基板處理部，用 、土板—起施加處理；主搬運機構，在既定之第i Α 及第2基板交接位置、與上述基板處理部之 ί 写伴持；所2片基板；搬入/搬出機構，對由上述收容 起保持多片基板之移載支持部，在既定之 二:立起置丄處於;^述移载支持部和上述搬入/搬出機構之 持多片2接多/基板；第1基板移動機構，具有用以保 持夕片基板之弟丨搬運保持部，在上述移載位 移載支持部和上述第i搬運保持部之間，—起交ς多片丄 第基板交接位置處於上述主搬運機構和上i :二;！部之間，一起交接多片之基板，在上述移載 σ述弟1基板交接位置之間，使上述第1搬運 和第2基板移動機構，具有用以保== 弟運保持部，在上述移载位置處於上述移載支持部和 ^第^般運保持部之間，—起交接多片基板，在上述第 部上述主搬運機構和上述第2搬運保持 基板 6乂接夕片基板’在上述移载位置和上述第2 % = /m ’使上述第2搬運保持部進行移動。 依照此種構造時，域·射存取第ί和第2基板交 97108014 24 200902415 接1立置進灯基板之交接。另外，透過第^基板移動機構 進行第1基板交接位置和移載機構之間之基板搬運，透過 第2基板移動機構進行第2基板交接位置和移載位置之間 之基板搬運。如此—來’因為移載機構和主搬運機構之間 之基板搬運路徑成為2個系統，所以即使在透過搬入/搬 出機構從收容H取出未處絲板，將其送人主搬運機構， 而使用有另=基板_路徑之情況下，亦可錢由另一方 土板搬運路;U從主搬運機構將處理過之基板朝向移載機 構排出因此’可以減少等待時間，可提高基板處理速度。 最好使上述第！基板移動機構在上述第丨基板交接位置 處從上述主搬運機構收取經上述基板處理部處理後之基 板’在上述移載位置處交給上述移載機構；最好使上述第 2基板移動機構在上述移載位置處，從上述移載機構收取 由上述基板處理部處理前之基板，在上述第 置處交給上述主搬運機構。 依照此種構造時，主搬運機構所進行之動作是在第2基 板交接位置處收取來"2基板移動機構之未處理： 板’將其搬運到基板處理部，在第！基板交接位置處將^ 理過基板排出到帛！基板移動機構。、經由將未處理基板 =和處理過基板之排出之路徑分離，當與基板搬入時和 土板排出時共用基板搬運路徑之習知技術比較 短等待時間，可以提高基板處理速度。 鈿 最好使上述主搬運機構包含有用來一起保持多片其 之基板夾盤。在此種情況最好使上述基板處理衷置更2含 97108014 25 200902415 有：夾盤洗淨單元’用來洗淨上述主搬運機構之基板夾 盤；和搬運控制單元，用來控制上述主搬運機構之動作， 以將在上述基板處理部處理後之基板搬運到上述第1基 板交接位置之後（最好不利用上述夾盤洗淨單元洗淨上述 基板夾盤）’從上述第2基板交接位置將基板搬運到上述 基板處理部，然後，利用上述夾盤洗淨單元洗淨上述基板 夾盤。 依照此種構造時，即使未處理基板在第2基板交接位置 成為等待之情況，主搬運機構亦可首先將處理過基板從基 板處理部排出到f 1基板交接位然後將帛2基板交接 位置之未處理基板搬運到基板處理部。亦即，不需要在主 搬運機構搬出處理過基板之前，使基板爽盤抵接未處理具 板，所以在處理過基板之排出前不需要進行基板夾盤之^ 淨。因此，基板夾盤之洗淨次數可減少。另外，基板夹盤 =洗淨因為藉在排出處理過基板而將未處理基板搬入到 基板處理部後之空餘時間進行，所以利用此種方式可 進一步地提高基板處理速度。 —最好使上述基板處理裝置更包含有移載控制單元，“ =丁：控制上述搬人/搬出機構、上述移裁機構和 】基板移動機構之步驟，以將由上述第〗搬 弟 持之多片基板中一部份之第丨基板 给°所保 部，從該移载支持部將上述第^ 述移載支持 出機構，然後，將由上述第丨搬土 父、、上述搬入/搬 板中之另外一部糊如其餘部份);第部; 97108014 26 200902415 述移載支持部，從纟 述搬入/搬出機構；控制上If搬部入將^述第2基板群交給上 構和上述第2基板移 /搬出機構、上述移裁機 :述搬入/搬出機構交仏上、^驟，以將第3基板群從上 :部將上述第3基板群tit裁第切部’從上述移載切 上述搬入/搬出機構將二運保持部，進而，從 然後’從上述移载支持部將該第：二：上述移载支持部， 運保持部’在該第2搬運保持^反辟，給上述第2搬 4基板群。 、’、夺上述第3基板群和第 依照此種構造時，將 板分成第1基板群和第 進行成批解除動作。另外^多载到移載支持部，來 載到第2搬運保持部，舞後 2部將第3基板群移 移載到第2搬運保持部， 載f持部將第4基板群 方式，在第1基板移動二?二=。依照此種 解除動作，在第2基板移動機構（第=== 進f成批 2基板移動機構將成批之多片里于中’亦可從第 構。另外，即使在成批組合動作中，搬運機 構將處理過基板交給第1基板移動機構之動丁：。=: $’士因為在成批解除動作中或成批組合動作中可以缩°料 “間，所以可以更進一步地提高基板處理速产/ 接：基板處理裝置更包含有在上述第2基板交 接位置處料上述第2搬魏持部和上述主搬運機構間 97108014 27 200902415 之基板交接之仲介機構。 依照此種構造時，因為可經由仲介機構進行第2基 動機構和主搬運機槿門 土 移 交接之第板之交接’所以用以進行基板 ^. 土板移動機構或主搬運機構之受限時間可以 縮短。利用j：卜鍤古彳π j j u 工，可以更進一步地提高基板處理速 ί 又。另外’利用仲介機構可以將基板交給被配置在第2基 =接位置之另—單元。此種單元之實例有基板㈣ 用來使基板之方位(例如半㈣日曰日圓之結晶方;立; =Υ 、成為使上述收容器保持部用來保持收容器藉以 理二：：姿勢在上下方向疊層之多片基板’上述基板處 理利來對以垂直姿勢在水平方向 起施加處^上述主搬運機構用來—起搬運以垂直=在 尺平方向立層之夕片基板’上述搬入/搬出機構用來對由 上乂收备器保持部保持之收容器—^搬人/搬出多片基板 1使肩夕片之基板在水平姿勢和垂直姿勢之間一起變換 安勢、’上述移載機構在上述移載位置，於上述移載支持部 ’上述搬入/搬出機構之間，一起交接垂直姿勢之多片基 板’上述第1搬運保持部用來將垂直姿勢之多片之基板排 列和保持在水平，第丨基板移動機構在上述移載位 置’於上述移載支持部和上述第i搬運保持部之間，一起 交接垂直姿勢之多片之基板，在上述第1基板交接位置處 於上述主搬運機構和第1搬運保持部之間，-起交接垂直 姿勢之多片基板’上述第2搬運保持部用來將垂直姿勢之 97108014 28 200902415 多片基板排列並保持在水平方向，第2基板移動機構在上 述移載位置處於上述移載支持部和上述第2搬運保持部 之間，-起交接垂直姿勢之多片基板，在上述第2基板交 接位置，於上述主搬運機構和第2搬運保持 交接垂直姿勢之多片之基^ 4 依照此種構造時，以水平姿勢被收容在收容器内之多片 基板由搬入/搬出機構一起搬出，和利用該搬入/搬出機構 變換安勢成為垂直姿勢。該垂直姿勢之多片基板在移載位 置被移載到第1或第2搬運保持部，被搬運到第丨或第2 基板交接位置，在該第丨或第2基板交接位置交給主搬運 機構。主搬運機構將垂直姿勢之多片基板搬運到基板處理 邰。基板處理部處理後之基板，利用主搬運機構從基板處 理部被搬運到第1或第2基板交接位置，交給第丨或第2 基板移動機構。第1或第2基板移動機構將基板從第i或 第2基板交接位置搬運到移載位置，交給移載機構。然後 移載機構將該等基板交給搬入/搬出機構。搬入/搬出機構 在將基板從垂直姿勢變換姿勢成為水平姿勢之後，將其搬 入到收容器。 ^ 依照此種方式，在搬入/搬出機構進行對收容器之基板 =搬入和搬出、及基板之姿勢變更。因此，當與使用多關 即臂型機器人進行餘之搬入/搬出，當與使用基板之姿 勢變更用之專用姿勢變更機構的習知技術比較時，可以使 構造簡化。 另外，因為搬入/搬出機構可進行對收容器之基板搬入/ 97108014 29 200902415 搬出動作和姿勢變換動作’ 臂水平旋轉。因此，可输…：要“技術使多關節 了縮短動作時間。利用此種方忒， 以縮短基板搬運所需要之 ° 理之其扨Η叙备 叮以如冋母早位時間可處 土 亦即，可以提高基板處理速度。 另外，經由使移賴構之移載支持部上下移動，可以推 订與搬入/搬出機構之基板交接 r \ 動機構之基板交接。乐Ζ基板移 介，可以在搬入= 二”單構造之移载機構之仲 間交接基板。 機構與弟1和第2基板移動機構之 附^ it上述和/或其他之目的，特徵和效果經由參昭 圖下列所述之實施形態之說明可以明白。 【實施方式】 [第1實施形態之整體構造] 圖解式之俯視圖，用來說明本發明 2基板處縣置之整體構造。《域” i := 幾ΓΓ"、,板處 2 k 移載機構5、第1水平搬運機構6、第 處理裝置?。之/配置在俯視形成大致長方形的基板 ^ θ+ 之—角部。該傳送盒保持部1為收容写伴持 部’用來保持作為收容写之㈣AP W 持 下方向，垂吉古Α 傳 猎以在Ζ方向(上 基板L以對向^ ΐ層之狀態下’收容水平姿勢之多片 之一短邊）土板處理裝置10之前面l〇a(對應到俯視 工，配置有二點鏈線所示之自動傳送盒搬 97108014 30 200902415 運裝置11。自動傳送盒搬運裝置u具有： 理之基板W的傳送盒"共給到傳送盒保持部备有未處 欲收容處理過之基板w的傳送盒F ;將 送含保持部k功用；和為交換被傳送盒保给到傳 傳达盒，使由傳送盒保持部！所保持之傳送:持之 用。基板W在本實施形態中為如半導體晶圓：圓功 基板處理部2具備有於沿著基板 二板。 f (對應到俯視之—長邊M〇b之在γ方向&二10 = 則面 多個處理部20(處理單元)。多個處理部 ”二之 藥液梓？1、黎1、丄丄 已3有.苐1 液二===_ 槽 23, Μ分別二=π 1藥液槽21和第2藥液槽 =二藥液中用來進行藥液處理。第二= 液槽24分別儲存沖洗液（例如 50片)之基板卜起浸潰到該沖洗液中乂來將二(= 沖洗處理。 用术對表面施加 在本實施形態中，第1筚潘 洗液槽^* Μ 與其鄰接之第1沖 槽24成對η 樂液槽23和與其鄰接之第2沖洗液 器27,用來將 借有：作為專用搬運機構之第1升降 第1 m描在第1藥液槽21經藥液處理之基板w移到 用來將在第\\f、、，和作為專用搬運機構之第2升降器28， 洗液槽24。第：=經藥液處理之基板W移到第2沖 部，用來1Λ=:降器27、2 °方向（水平方向）疊層之狀態下支持垂直姿 97108014 31 200902415 二片（例如5G片）基板w ;彳降驅動機構，用來使該 二反持部上下移動；和橫行驅動機構，用來使該基板支 寺/沿者Y方向橫行。另外’ χ方向為沿著基板處理裝置 1〇之前面IGa的水平方向，為與γ方向正交之方向。 利用此種構造，第i升降器27 —起收取由主搬運機構 以垂直2勢在/方向疊層之多片基板w，使該多片基板 下降到第1藥液槽21中，浸潰在藥液中。更進一步， 在等待既定藥液處理時間之後，帛丨升降器27使基板支 持4上升’攸藥液中將多片基板w提起而朝向第工沖洗液 ，22使基板支持部橫行’進而，使該基板支持部下降到 第1沖洗液槽22内，浸潰在沖洗液中。在等待既定之沖 洗處理時間之後’第1升降器27使基板支持部上升，從 沖洗液中將基板w提起。然後，從第i升降器27將多片 基板W—起交給主搬運機構3。第2升降器28亦同樣地， 一起收取由主搬運機構3以垂直姿勢在乂方向疊層之多片 f板W，使該多片基板w下降到第2藥液槽23中，被浸 潰在藥液中。更進一步地，在等待既定之藥液處理時間之 後，第2升降器28使基板支持部上升，從藥液中將多片 基板W提起而朝向第2沖洗液槽24使基板支持部橫行， 更進一步，使該基板支持部下降到第2沖洗液槽24内， /叉潰在沖洗液中。在等待既定之沖洗處理時間後，第2升 降器28使基板支持部上升，從沖洗液中將基板w提起。 然後，從第2升降器28將多片基板w 一起交給主搬運機 構3。 97108014 32 200902415 乾燥處理部25具有在垂直姿勢依χ方向疊層之狀離下 保持多片（例如50片）基板W之基板保持機構，係在減壓 環境中將有機溶劑（異丙醇等）供給到基板w，或利用離心 力甩去基板w表面之液體成分，而使基板w乾燥。該乾燥 處理部25可在與主搬運機構3之間進行基板⑶之交接。 主搬運機構3具備有：作為基板—料持手段之一對基 板夾盤（夾持機構）3G，可以在χ方向疊層之狀態一起保二 垂直姿勢之多片（例如50片）基板w;夾盤驅動機構，用 來使該基板夾盤30進行動作；橫行驅動機構，用來使基 =夾盤3。沿著γ方向水平作移動(橫行)；和升降驅動機 用來使基板夹盤3〇沿著2方向升降。—對基板爽盤 为別具備有在X方向延伸之軸狀一對支持導件31，在 31互相對向之側，形成有在軸方向隔開之 =土板支持溝，用來從下方支持承接之垂直姿勢之多片 土板W。夾盤驅動機構經由使一對基板失盤在箭頭犯 動’而使—對支持導件31間之距離擴大/縮小。 為水姓 式，基板夾盤3〇可以進行開閉動作，變換成 除狀能1基板W之保持狀態’或解除基板W之爽持之解 利用該開閉動作和和第2升降器27、28之 下：可以在^和第2升降器Η和基板夹盤 之多片基板/起父接依垂直姿勢在Χ方向疊層狀態下 主搬運機構3所進行之動作是在第丨基板交接位置ρι 97108014 33 200902415 收取以垂直姿勢在X方向疊層之多片未處理基板w，並在 第2基板父接位置P2交出依垂直姿勢在χ方向叠層之多 片處理過基板W。 :失盤洗淨單元8被配置在第1基板交接位置Pk下方。 :夾盤洗淨單元8具有被—對基板夾盤30分別插入之一對 基板爽盤30(特別是支’使用洗淨液來洗淨該 經乾燥處理部25乾焊声理之_ ^搬運機構3在搬運 r板交接位置n，mn前，在第】基 土板夾盤3 〇下降’插入到夹盤洗潘 =洗淨槽35。然後，當在洗淨槽35内洗淨= 二=搬Γ構3進行一起交接來自乾燥處理部25 之處理過基板W之動作。 在 s _ 有快門15， 16。快門15 置:2之搬入/搬出機構4側設有快門 置pi時開放，在機構6存取第1基板交接位 ，其他期間保持閉合 水平搬運機構7存取第？其此4 。間16在弟2 之期間則保持閉合:置P2時開放，其他 基板處理部2側之藥液環境之鴻漏。 卩制或防止 [基板搬運用之構造] 圖2是立體圖，用| 3間之基板搬運之傳送盒F和主搬運機構 圖卜 彳關構粒。下面合併參照該圖2和上述 在基板處理裝置 之别面10a之接近之—角部附近， 97108014 34 200902415 设定上述第2基板交接位置p2，在 角部配置有搬入/搬出機構4。對該搬口 :面叫之另一 γ方向之傳送盒保持部1之相反側配置有移=:4,在 該移載機構5和第！基板交接位置ρι之間^冓5。在 被配置在移載位置:有^ 移載機構5之間之基板，交接移载機構：構4和 機構6之間之基板，和交接移載機構 2搬運 構7之間之基板。 7弟2水千搬運機 [搬入/搬出機構之構造] 圖3是用來說明搬入/搬出機構4之構 到之立體圖。搬入/搬出機 看 為多片保持手柄，可以-起保持//狀^批/柄成 :柄支持部41，用來支持該成批手柄心轉塊雜板二; =塊體43;和手柄進退機㈣。在旋轉塊體 有 作為手柄旋轉機構之手柄旋轉馬達45， 有 達:5之旋轉軸結合有手柄支持部41。利用：種=轉： =部41在圍繞成批手柄40之中心軸4 圍：’可以對旋轉塊體42進行相對旋轉，經由驅= 二馬達45可以產生相對旋轉。利用此 4所，，可以使成批手柄4。圍繞其中心軸46旋轉。 方疋轉塊體4 2經由有沿菩γ古& > + = 結合到進退塊體 w灰轉。砰§之，進退塊體43在 97108014 35 200902415 X方向對向之兩端部上 W。在該-對腕部48之^配有//方向延伸之-對腕部 42之X方向一端呷 #旋轉塊體42，旋轉塊體 42之X方向之另：結合到-腕部48。旋轉塊體 方白之另一端部結合到 馬達50之旋轉勒。坊#絲、 丁仍妖锝械構的旋轉 因此，經由驅動旋轉^達:達5〇被固定在另一腕部仏。 為中心…面内以使旋轉塊體42以轴^ 柄…心㈣沿著二用:::式，構成使成批手 / 口香u面方疋轉之手柄旋韓機 該手柄旋轉機構，可以使多=作機構。利用 子古-欠轨,a 便夕片基板w之姿勢在水平姿勢和 垂直安勢（參照圖5)之間變換。 文努矛 =進退機構44具備有：一對直 導引進退塊體43使苴於、、儿基v 士 a + 用孓 (具有齒之向直線移動；隨動滑輪 近；驅動滑輪（具有齒之诉於W f導件53之一端附 ^ ^ . 輪）56，破配置在直線導件53 之另一&附近，皮帶（具有齒 、 在該等滑輪55、56之@.&^4’&#1^向懸掛 心間，皮朮按壓件58，用來使進退媸 體43結合到皮帶57;和 用木使進退塊 動滑輪56。利用該構迕動進轉轴結合到驅 ±± 埯驅動進退馬達60使皮帶57迴 來使進退塊體叫方向水平移動，卿 傳送=吏成批手柄40對由傳送盒保持部1保持之 構圖Λΐ立用來說明使成批手柄4〇上下移動用之 構k，顯不具備在手柄支持部41之内部的構造。手柄支 持部具備有：固定基座62、移動基座63、和致動器 97108014 36 200902415 仍。成批手柄4G被固定在移動基座⑽。該移動基座 結合到移動塊體64,該移動塊體64被致動器65驅動。 移動基座63沿著未圖示之直線導件，在成批手柄之 柄元件排列方向69被導引，同時可對固定基座Μ 動。致動器65例如以電動馬達作為驅動源 料沿著手柄元件排列方向69直線移動。利用此種^體 f 動致動器65，可以使成批手柄40沿著手柄元件排 列方向69移動。利用此種方式，可以將被收容 F内人之多片基板W措起’或將多片基板w放置在形成“ F内之多個基板收器容架。 、二二是立體圖’用來說明成批手柄4〇和與其相 :。成批手柄40具備有沿著手柄元件排列 多：手柄元件70。各個手柄元件7〇為在手柄支持= 表面之法線方向延伸之薄板梁，俯視形成大致楔 件豐層成為在各2根互相離開既定距離之對 =鬲。成批手…中心…過全部= 定義。：成柄元件7〇之平行方向的假想直線被 ^丰f M —對手柄元件列繼，，其隔_心轴46 :在手柄元件排列方肖69排列之多個手柄 70可以保持1片基板w，因 69疊層之狀態下，一起保持 ，在一個傳送盒F可以在z 利用對向之2根手柄元件 此可以在手柄元件排列方向 多片基板W。在本實施形態中 97108014 37 200902415 2疊層之狀態下保持25片水平姿勢之基板w，與其對 :層配手盒柄F内件基板W之相互間隔相同之間隔， 子手柄疋件70 。因此，成批手柄40可一 起保持傳送盒F内之全部基板w 。 之ST ::不，各個手柄元件70具備有互為相反側表面 柄和第2支持面72。在手柄元件7〇之手 1支持*起：Γ而部之基端部’在第1支持面71具備有第 ^另外部Γ在第2支持面”具備有第2支持突起 具備有第1導引突起部75,在;;二在第1支持面71 導引突起部76HM1^2支持面72具備有第2 73和第1導引持面71之第1支持突起部 第2支持面72之第^ 成$ 1基板保持部，被設在 76係構成第2基板保㈣起部74和第2導引突起部 經由控制成批手柄4〇圍繞 第1支持面π朝上時，則第 之方疋轉位置，若使 突起部75抵接在基板起❹和第1導引 2支持面72朝上時，射將板卜另外’若使第 引突她抵接在基㈣，可以部74和第2導 板研時，支持突起部73、74抵接=该基板卜在支持基 側之基板”面，導引突起部牛7〇之基端部 之：=基板？之周端面和下面周緣部 元件7〇 手柄方疋轉馬達45控制成例如在欲 理過之基板取時，使第2支持面U成批手柄40保持處 97108014 成為上面，在欲以成 38 200902415 批手柄40保持未處理之基板W時，使第丨支持面7ι成為 上面利用此種方式，在未處理基板W和處理過基板/ 可以變換抵接在基板W之支持突起部73、74和導引突起 部75、7一6。其結果是可以抑制或防止附著在未處理基^ 之異物經由成批手柄4〇轉移到處理過基板w。 —如圖4、圖5和圖7等所示’在手柄支持部“ 疋件70靠近基端部之位置處，具備有3根轴狀之支持 ==根軸狀之支持導件8〇在手柄元件排列方向69被 =成平行’在一手柄元件列術之外方（成批手柄中心 軸46之相反側）配置有i根支持導件8〇，在另一 2件列7°B之外方配置有$ 1根支持導件80,在手柄元 件列70Α、70Β之間之大致φ門仿罢老 仕千柄το 支持導㈣。 財間位置處，配置殘留之1根 3根之支持導件8()被共通較在㈣基座 '之前部。導編8“吉合到移動基座63 (= 沿耆成批手柄中心軸46之方向上直線移動。在導 81之後部固定有大致L字形之支架79， 土座 =到支持導㈣之相反惻。在該支架;9:移=3 持V件80相反側之凸輪隨動器82。另外、朝向支 基座63設有凸輪84，其具有斑’在移動 輪面83 。凸輪84位於對移動基座妾之凸 之相反侧’在支持導件8〇 3持導件別 Μ包含有對手柄元件排列方向69傾斜^面该凸輪面 被安裝成為對移動基座63可以 ^^。凸輪84 J以/口者手柄几件排列方向69 97108014 39 200902415 直線移動。 凸輪84結合到凸 驅動。氣缸86袖t 該凸輪基座85被氣缸86 著手柄元件排列方二在移動基座63，使凸輪基座85沿 J方向69直線移動。凸於其 動被直線導件66(來凸輪基座85之直線移 線移動使凸輪隨動=9圖）導引。利用凸輪基座85之直 導引美座81 * 在凸料83上移_動），而使 座以沿成批手柄中心軸 ί 持導件80亦沿成拙^ ”具對應地，支 支持導㈣_元==丨料機構87,用來使 在導引基座81之兩相丨丨培L 該等通孔77、78成& =有—對通孔77、78° 形。以穿通該等通t 7;口二手排列方向69之長方 持構件67、68。ml 設置有手柄元件支 几牛支持構件67、68之後部被固定 移動基座63。另外，在手柄元件支持構件π、μ之前 2別固定有構成手柄元件列m、之多個手柄元件 ί U ° 經由驅動導引進退機構87使支持導件80對成批手柄 4〇之前端侧前進，而可利用支持導件8〇和導引突起部 75、76從前後夾持基板W。該夾持狀態在使成批手柄4〇 於水平姿勢和垂直姿勢之間變換姿勢時所使用。利用此種 方式，在姿勢變換中可以穩定地保持基板⑺，可以抑制或 防止基板W之落下。 如圖8所示，各個支持導件80具有多個基板保持溝別， 97108014 40 200902415 其在被手相元件70支持的基板w之方向開放 元件排列方向6 9 Ρ Π戸弓ίΤ s , 並在手柄 ^開間隔。更具體者，對各個手柄元件 且二有弟广保持溝州和第2基板保持溝咖。而 ，、備有導引驅動機構89,用來 而 導件80之軸方向爲叙m 钕引基座81在支持 爻釉方向移動。利用此種構 動機構89，可以# ® τ # 1 、·工由控制導弓丨驅 溝_〜 基板保持溝88A和第2基板伴持 溝88B定位在被手柄 土枚保持 此種方式，例如，可以使用第之端面。利用 理基板捭 土板保持溝88A作為未處 土伋w之保持用，使用第2 基板W之保持用。 板保持溝88B作為處理過 [移載機構之構造] 圖9疋立體圖，用來說明移 5具備有在γ方向延伸之一對去：f5之構造。移載機構 導引轴⑴儿著乂方:二!支持導引抽91’該一對支持 于w /口者λ方向互相對向。 載支持部之功处，用决一4 7該支持蛉引軸91具有移 月匕 末起保持以垂直姿勢在y古 之多片基板W。 直文勢在Υ方向璧層 引轴91被^支持部92支持。導引支持部 w被女裝在本體部93之上端 又荷冲 往復移動微小距離。本體部= 向直線 件’組裝在基板處理裝置!。成：n向延伸之柱狀零 動。 為可以者z方向上下移 如圖10所示，在本體部93之 機構之致動器95。該致動器95:二&有作為上下驅動 使驅動源馬達94-體化之驅動^直料件和螺栓一起 力零件，用來使本體部93沿 97108014 200902415 著ζ方向上下移動。 圖u是立體圖，表示用來使一對支持導引軸91沿 向移動之構造，顯示從圖g後方看到之構造。導引支 邛92破安裝在於z方向延伸的本體部之上端部，j 本體4 93上，被直線導件97導引，並可以在γ方向移: 在本體部93上面，經由支架98安裝有導引移動馬達1〇〇。° ί 移動馬彡1〇0之旋轉軸1〇1刻有螺紋，該旋轉軸 立沿y方向配置。旋轉軸ιοί螺合在被固定於導引支持 :"2之側方的塊體99之螺紋孔。依照此種構造，經由驅 立Λ ‘引移動馬達100使其正轉/逆轉，而可與導引支持 :92 —起使一對支持導引軸91在γ方向進退。如此一 來’利用導引移動馬達⑽等構成使支持導引軸91水平 移動之支持導引水平移動機構1〇2(支持部水平移動機 構）。 一在導引支持部92更具備有導引轉動機構105,用來使 一對支持導引轴91圍繞各個軸轉動。—對支持導引軸91 分別被安裝在導引支持部92,成為可以圍繞其軸轉動。 在各個支持導引# 91之基端部分別岐有滑輪106、 1〇7。另外一方面，在導引支持部92安裝有導引轉動馬達 11〇和拉伸滑輪108。在導引轉動馬$ 11G之旋轉轴固定 有=輪109。另外，在滑輪1〇6、1〇7、1〇9張掛有皮帶（具 有回之皮帶）111，從該皮帶111之外側經拉伸滑輪108施 加張力U用此種構造’驅動導引轉動馬達工i 〇可以使一 對支持導引軸91目繞各個軸連動地轉動。 97108014 42 200902415 導Γ見圖，用來說明支持導引車由91之構造。支持 不同位詈）Γ方向之不同位置（在本實施形態中為180度 )八備有第1抵接部113和第2抵接部114，該 處成為退離部115。第1和第2抵接部⑴^ 二構成使在與支持導引軸91之軸方向正交之方向突出 的夕個齒狀突起部116,在 突起111R ϋ 在軸方向排列配置。在各個齒狀 U116之刚端部形成有支持溝，用來承受支持基板w 之^緣部。在退離部115未形成有齒狀突起部116。 利用導引轉動機構105使支持導引轴91 使一對支持導引軸91 J成為 1支捭4抵接部113fs1互相對向之第 1又待狀恶（參照圖1 2 )、#筮9 第2支持狀態，或使退心=5=接部114間互相對向之 照圖13)。 °卩115間互相對向之退離狀態（參 在第1支持狀態下，一對支持導引軸91 113間之距離小於基 -接邛 軸可一起保持垂直姿勢\直二=_ 一對支持導引 支持狀態下，一對支二勢:：片基板W。同樣地’在第2 距雜,〇 f支持導引軸91之第2抵接部114間 距離小於基板w之直徑。 μ間之 可以-起保持垂直姿勢之多板-=持導引軸91 處理基板W時為第彳基板W。例如’以保持未 9 , 支持狀悲，保持處理過基板W時A笛 =狀態之方式來控制導引轉動馬達ιι〇，：:= 基板W和處理過基板w以第 ，處理 換和保持。 罘Z抵接邛113、114切 在退離狀態，如圖13所示，_對支持導引轴Μ間之距 97108014 43 200902415 離大於基板w之直徑。因此，垂直姿勢之基板w可以通過 一對支持導引軸91間。 [第1水平搬運機構之構造] ^圖14是立體圖，用來說明第丨水平搬運機構^之構造。 第1水平搬運機構6具備有：第i水平搬運保持部^別， 用來一起保持垂直姿勢之多片基板w;本體部121，在可 圍9繞錯直軸旋轉之狀態下支持該第1水平搬運保持部 =移動基錢2，搭載有該本體部121，·和水平驅動機 構m，使該移動基座122沿著x方向水平移動。本體部 具有沿著z方向之柱狀形態，在其上端部安裝有第1 水平搬運保持部12〇，其下端部被固定在移動基座122。 Μ 5驅動機構125具備有-對直線導件126，用來導引 2私動基座122之X方向的水平移動。在直線導件 之一端部側方配置有隨動滑輪127，在直線導件126之另 ,τ ± 喟動，月輪128，在驅動滑輪128結合有 f平搬運馬達130之旋轉軸。在滑輪m、m張掛有皮 =㈣齒之皮帶）129’因此，皮帶129具有在直線導件 ^ =方於X方向延伸之直線部。在該皮帶129之直線 I二 在移動基座122之皮帶按壓件⑶。利用 經由驅動水平搬運馬達13〇使其正 ， 搬運保持…X方向動’因此，可以使水平 來地和是前視圖（從χ方向相之前視圖），用 擴大地表示第1水平撤運保持部之構造。水平搬運 97108014 200902415 保持部120具備有第1導件135和第2導件136。 第1 具有沿水平方向平行配置之3根支持構件 構件^、咖、咖之各上面，多個（例如，5〇 個）基板保持溝排列和形成在各支持構件伽、腿、⑽ 之長度方向。沿著與支持構件135a、135卜服之長度 二?直面的3個基板保持溝(分別形成在支持構 r 片基板'下緣之不同位置，用來保持該垂直姿勢之基板 I。如此一來，第1導件135可-起保持多個垂直姿勢之 幻反W。基板保持溝依傳送盒F内之基Μ之保持間隔之 一半間隔（半間距）配置。 同樣地，第2導件136具有沿水平方向平行配置之3根 支持構件136a、136b、136c，該等支持在第2 38。在3根支持構件之各上面多個 =如，50個）基板保持溝排列形成在各個支持構件 a: :、136c之長度方向。沿著與支持構件咖、 、C之長度方向正交之鉛直面的3個美板保掊、盖 別形成在支持構件136a、跡136c之基板V溝/， 抵接於垂直姿勢之1片基板⑺下緣之不同位置，用來保持 5亥垂直姿勢之基板W。如此一來，第2導件可一起保 持多個垂直姿勢之基板⑻。基板保持溝依傳送盒F内基板 W之保持間隔之一半間隔（半間距）配置。 土 第2導件136之-個支持構件136c直接安裝在第2導 97108014 45 200902415 引基座138 ’其餘二個支持構件136a、136b支持在副導 引基座139，該副導引基座139經由支持轴14〇支持在第 2導引基座138。第2導引基座138位於第i導引基座137 之下方，支持抽140插穿形成在第！導引基座137之插穿 孔’達到第2導引基座138。 在第2 ‘引基座！ 38之下面固定有2個線性抽承 咖bUSh)145、146。在一線性軸承145插穿有旋轉 由147 ’在另-線性軸承146插穿有抽。旋轉轴m ^軸148之上端均被固定在第1導引基座i37。透過線性 *承J45、146沿著Z方向導引旋轉軸147和軸148，藉 HI:導引基座137可以在2方向對第2導引基座13: 降。亦即可以使第1導件135對第2導請 第1導彳| /外，當使旋㈣147圍繞其軸^旋轉時，則 麵土座137圍繞旋轉車由147旋轉，該旋轉經由線性 =46和軸148，傳動到第2導引基座138。如此一來， 使弟1和第2導件135、136連動旋轉。 而吏第1導件135對第2導件136相對地上下移動， 上支持狀態(圖15之狀態，將第刚 3=配置在第2導件136之基板支持位置之上方） 位L (參照圖16，將第2導件136之基板支持Emssi〇n Display) substrate, optical disk substrate, magnetic disk substrate, optical disk substrate, and photomask substrate. [Prior Art] A substrate process in which a chemical liquid is applied to a substrate such as a semiconductor wafer. The "in-place" includes a batch method in which a plurality of substrates are applied. An example of a plate processing apparatus is disclosed in Japanese Patent Laid-Open No. 354604. The substrate processing apparatus includes a carrier-loaded translation robot, a posture changing mechanism, a thruster, and a substrate processing unit. The 疋拽 capable portion can mount a carrier (receiving container) in which the center of the slab is stacked in a vertical direction in a horizontal posture. ί : Τι = The person is composed of a multi-joint arm type handling robot, which is configured to rotate and rotate around the straight axis. By using such a square in the vertical direction, the horizontal posture arm is moved toward the posture-changing carrier, and the multi-joint switching mechanism is placed to vertically transfer the posture changing mechanism in the vertical direction. In the case of a plurality of laminated substrates, the switching mechanism performs a posture change between a horizontal posture and a state. In the substrate conveyance of the multi-joint arm ^ 97108014 200902415 ΐ ΐ 问题 问题 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ Between the 妾 pusher and the position change mechanism, the f:: mover's distance between the plurality of substrates held by the mechanism and the multi-piece substrate between the transfer mechanism and the transport mechanism - Connect ^ # board. For example, 'moving a small distance from the posture changing mechanism. In the shape; in the horizontal direction of the _; secret layer $ 25 μ # ^ ^ heart, down, the potential transformation mechanism will be another == holder. Later, the 25 substrates were handed over to the previous:: "Inter' formed a batch of 5 基板 substrate on the holder. Thus, a plurality of substrate groups will be combined and combined. When crying from the beginning, ^ 10,000% is a batch of #拉夕^D: When the soil plate is given to the posture changing mechanism, the retainer piece A yoke. 25 pieces of the sheet substrate are given to the posture changing mechanism. After the 25-heart plate is changed into a horizontal posture, the horizontal posture is given to the horizontal ceremony, and the remaining 25 on the holder is configured as follows: after the horizontal posture, by the horizontal two : The f / ' ' 5 基板 substrate is separated into two groups of 2 pieces each of the two. Thus, the way in which a plurality of groups are formed in batches is called batch release. The knives are separated into a plurality of substrate transport mechanisms that are formed in batches in a vertical position: the plate central disk 'via the substrate plate at the horizontal side:: the plate is lost", for example, between the pusher and the transport mechanism: Below the board 97108014 200902415, set the chuck cleaning unit. The substrate processing unit has a plurality of processing grooves arranged along the moving direction of the transport mechanism. The treatment tank contains a chemical tank, a water washing tank and a drying tank. The drug solution tank dipped a plurality of substrates in a vertical posture into the chemical liquid stored in the tank, and applied a chemical solution to the plurality of substrates. The washing tank dries a plurality of substrates in a vertical posture into pure water (deionized water) stored in the tank, and applies a water washing (rinsing) treatment to the plurality of substrates. The drying tank applies a treatment for supplying an organic solvent (e.g., isopropyl alcohol) or a mashing component to a plurality of substrates. The main problem of the above-described substrate processing apparatus of the prior art is that the second substrate processing speed (production amount) is low, and the second price is high. Specifically, since the horizontal transfer robot is a multi-joint arm type, the movement speed cannot be increased in a state in which a plurality of substrates are held together due to the limitation of mechanical strength. Moreover, the multi-joint arm type robot itself has a high price. Further, since the space required for the rotation of the multi-joint arm is required, the substantial occupied area becomes a problem. Further, in the case of the horizontal rotation of the joint joint #, since the relative position of the plurality of substrates is shifted, it is necessary to have the substrate arrangement structure in the posture changing mechanism as described above. (4) The dynamics of the substrate (4) forced substrate processing speed. Further, the posture changing mechanism, the horizontal substrate guide for holding the substrate in the horizontal posture in addition to the substrate array mechanism, the vertical substrate guide for holding the substrate of the security, and the rotating mechanism of the substrate are thus very expensive robots. The m2' thruster is equipped with a robot that has a very high price in the same manner as the vertical movement mechanism, the horizontal movement mechanism, and the rotation. 97108014 200902415 As such, the time required for substrate transfer between the pusher (receiving container) and the transport mechanism is one of the reasons for hindering the increase in throughput. Further, since the structure for transporting the substrate between the carrier (receiving container) and the transport mechanism is expensive, the cost of the substrate processing apparatus is hindered. Further, in the above-described substrate processing apparatus of the prior art, since the substrate transport path from the carrier to the transport mechanism is one system, when the unprocessed substrate is fed to the main transport mechanism, the processing cannot be performed from the transport mechanism. When the substrate is discharged to the carrier and the substrate is discharged, the untreated base plate cannot be fed. Further, when the unprocessed substrate is fed into the transport mechanism, since the batch assembly operation on the stopper of the pusher is required, the waiting time until the substrate is discharged is long. Similarly, when the processed substrate is discharged, since the batch release operation on the retainer is promoted, the waiting time until the unprocessed substrate can be fed is also long. This is another factor in reducing the processing speed of the substrate. Further, when the substrate is held in the pusher at the substrate transfer position, the transport mechanism cannot discharge the processed substrate processed by the drying tank to the substrate transfer position. Therefore, the transport mechanism first collects the unprocessed substrate at the substrate transfer position. Then, it is carried into the liquid tank. Then, after the chuck cleaning unit cleans the substrate chuck, the transport mechanism picks up the processed substrate from the drying tank and delivers it to the pusher at the substrate transfer position. Untreated base: The substrate chuck of the board transfers the foreign matter on the surface of the untreated substrate. Therefore, in order to prevent the foreign matter from being transferred to the processed substrate, it is necessary to wash the substrate chuck while maintaining the processing of the substrate. Another factor for the speed reduction is 0 97108014 9 200902415, which provides a substrate processing apparatus capable of improving the processing speed of the substrate. SUMMARY OF THE INVENTION Another object of the present invention is to provide a substrate processing apparatus capable of reducing cost. The substrate (four) holding portion of the first aspect of the present invention is for holding the container for accommodation in a horizontal posture : a film reversal, a substrate processing unit for applying a process in a horizontal position on a horizontal side: and a top substrate; a main transport mechanism between a predetermined parenting position and the substrate processing unit; - transporting a plurality of substrates stacked in a horizontal direction in a vertical direction; and moving/unloading means, loading and unloading a plurality of substrates together with the container held by the container holding portion The substrate is changed in a posture between the horizontal posture and the vertical posture; and the sub-transporting mechanism transfers the plurality of substrates in the vertical posture between the loading/unloading mechanisms at the predetermined transfer position, and the parenting position of the substrate is Between the main transport mechanism and the main transport mechanism, a plurality of vertical perpendiculars are transferred together. The substrate 'transports between the transfer position and the substrate transfer position to transport a plurality of substrates in a vertical posture. The plurality of substrates accommodated in the container in a horizontal posture are carried out by the loading/unloading mechanism, and the posture of the loading/unloading mechanism is changed to a vertical posture. The sheet substrate is transferred to the sub-transporting mechanism at the transfer position, then transported to the substrate transfer position, and delivered to the main transport mechanism at the substrate parenting position. The main transport mechanism transports the multi-plate substrate of the vertical mount to the substrate. The processing unit is disposed at the substrate processing unit at 97108014 200902415 Γΐ 1 : from the substrate processing unit to the substrate transfer standing, and the parent to the sub-transport mechanism. The sub-transport mechanism transports ί = to the transfer position from the substrate transfer position, and delivers it to the transfer position. Moving/unloading mechanism. Moving/unloading the machine to the container. After the posture is in the horizontal position, it is carried in. In this way, the substrate is moved and the (4) 2 mechanism of the Φ h container of the present invention is performed. ^ and the change of the posture of the substrate. Therefore, the structure can be simplified by using the conventional comparison of the special posture changing mechanism for the change of the board's security posture. j Further, the loading/unloading mechanism can perform the base/removal operation and the posture change operation on the container, so t.  The articulated arm rotates horizontally. Therefore, the action time can be shortened. This financial formula can shorten the time required for substrate handling and increase the number of substrates that can be processed every two (four). That is, the substrate processing speed can be increased, so that the loading/unloading mechanism includes: a plurality of holding handles, a hand-held multi-piece f plate; a handle advancing and retracting mechanism for holding the plurality of pieces - the container holding portion is held The receiving container advances and retreats in the horizontal direction; and the handle rotating mechanism is configured to rotate the misalignment of the plurality of sheets and the above-mentioned advance and retreat directions by at least g degrees. Second 々: In this structure, the 'loading/unloading mechanism enables multiple pieces of J temple handles to advance and retreat, and is used to carry out a plurality of substrates from the container, and to rotate the plurality of holding handles along the wrong direction of the retreating direction. 9 degrees, can be used for 97108014 11 200902415 to change the substrate posture from a horizontal posture to a vertical posture. Further, when the substrate is carried into the container, the plurality of holding handles can be moved forward and backward toward the container after the posture is changed from the vertical posture to the horizontal posture. In this way, since the posture of the substrate can be changed by the rotation of the handle in the forward and reverse directions (four) of the plurality of holding handles, the structure of the loading/unloading mechanism can be simplified. That is, the horizontal rotation of the multi-joint arm of the prior art is not required. Therefore, the advancement and retreat and the posture change of the plurality of holding handles of the container can be quickly performed. Alternatively, the plurality of holding handles may be provided with a plurality of handle members for respectively holding one Η substrate ❿, and each of the handle members may have a wi substrate holding portion on the side of the arrangement direction of the handle members, and another direction in the direction of the handle arrangement The second side has a second substrate holding portion. In this case, it is preferable that the loading/unloading mechanism further includes the plurality of holding handles surrounding the predetermined rotating shaft handle rotating mechanism so that the surface/back surface of the handle member is reversed. According to this configuration, the plurality of holding handles can be rotated by the handle rotating mechanism, and any one of the i-th substrate holding portion or the second substrate holding portion can be used. In this way, you can change the number! The substrate holding portion is used for the substrate holding portion. Therefore, for example, when one substrate holding portion is used for holding the unprocessed substrate, the other substrate holding portion can be used for holding the processed substrate. In this manner, foreign matter on the surface of the substrate which is not treated or removed can be prevented from being transferred to the treated substrate. Preferably, the loading/unloading device further includes a support guide for supporting a plurality of substrates in a vertical posture from below 97108014 22 200902415. According to this configuration, the substrate in which the support member A is held in a vertical posture can be used. In contrast to this, when the polypropylene is made to be in a vertical posture, the substrate on which the support piece is simultaneously arranged can be used. In this way, a plurality of sheets can be arranged in an inexpensive structure, and since the posture change of the substrate and the widening of the substrate can be simultaneously performed, the time required for substrate transportation between the container and the main transport mechanism can be further shortened. The jaws r preferably have the support members described above having a pair of grooves for each of the handle members. In such a case, it is preferable that the loading/unloading mechanism further includes a guide driving mechanism for holding the substrate to drive the support guide to select the pair of substrate holding grooves. According to this configuration, since the guiding drive mechanism can be selected - either of the substrate holding grooves, so when the substrate is held in the groove, it can be used for holding the substrate. The other one is used to maintain the substrate. . .  ^ In this way, it is possible to suppress or prevent the transfer of the surface of the untreated substrate to the processed substrate. /, : The sub-transport mechanism may include: a transfer mechanism having a transfer load: a state in which the substrate is stacked in a horizontal direction in a vertical direction, and the transfer support portion is moved up and down, and the up-and-down shift is used. == between the loading/unloading mechanism 'at the above-mentioned transfer position--and the vertical security substrate; and the horizontal transport mechanism' has a horizontal transfer=holding portion for: holding a plurality of substrates in a vertical posture Arranging in the horizontal direction, and at the transfer position, a plurality of substrates are transferred between the transfer support portion and the horizontal transfer holding portion in a vertical posture, and the plate is connected to the base at the base 97108014 13 200902415 The transport mechanism and the horizontal transport holding and holding a plurality of substrates in a vertical posture are transferred together, and the horizontal transport holding portion is horizontally moved between the transfer position and the substrate transfer position. According to this configuration, by transferring the transfer support portion of the transfer mechanism up and down, it is possible to transfer the substrate to the loading/unloading mechanism and to the substrate of the horizontal transfer structure. Therefore, the substrate can be transferred between the loading/unloading mechanism and the horizontal conveying mechanism through the intermediary of the transfer mechanism of a simple structure. Further, since the horizontal transport mechanism can transport the substrate horizontally at the transfer position and the base, the structure can be prevented from coming back in the same manner, and the cost of the sub transport mechanism can be suppressed. Preferably, the transfer mechanism is disposed on the opposite side of the loading/unloading mechanism with respect to the advancing and retracting direction of the plurality of holding handles. According to this configuration, the loading/unloading mechanism can move the plurality of holding handles into the two sides, and the loading and unloading of the substrate can be carried out in the direction of advancement and retreat:: shift: position. In this way, the loading/unloading mechanism can be further simplified to achieve cost reduction. The horizontal handling mechanism can also read the _ + advancing and reversing direction of the orthogonal LIZ into: the piece holding handle The handling mechanism can also be in the multi-piece =, annual storage, transfer position. In other words, the access side 2 carrying the holding portion moves in a horizontal direction in which the advance and retreat directions of the handle are orthogonal. With this configuration, the substrate conveyance between the conveyance directions of the receiving substrate transfer positions is more than two: the arm can achieve further structural simplification. Further, when the rotation of the substrate is changed to the conventional transfer direction of the substrate, 97108014 14 200902415 and Ίt*, since the substrate transfer speed can be made extremely fast, the substrate processing speed can be further improved. Preferably, the above-mentioned shifting structure (4) further includes a supporting portion horizontal moving mechanism for moving the transfer supporting portion along a horizontal direction of the substrate in which the vertical posture is stacked, such as the handle advancing and retracting direction, within a predetermined distance range. According to this configuration, after the first substrate group is transferred from the transfer support unit to the horizontal transporting temple P, the second base r-plate group from the loading/unloading mechanism is collected by the transfer support unit, and the second base group can be obtained. The substrate group is transferred to a position where the horizontal conveyance holding portion is deviated from the above-mentioned substrate group. In this manner, the first and second substrate groups can be held in a horizontal manner, and the first and second substrate groups can be combined in a batch. For example, after the second substrate group is transferred to the horizontal transport holding portion, the transfer support portion may be horizontally moved by a half distance (half pitch) of the substrate holding pitch of the 帛i substrate group, and the second substrate group may be shifted. Carry the holder horizontally. In this manner, the i-th substrate group and the second substrate group are held in the horizontal conveyance holding portion in a state in which the constituent substrates are not overlapped with each other. In this way, the horizontal transfer material portion can hold a plurality of substrates in a small space. In addition, a batch of substrate processing units that handle such a state can process a plurality of substrates in a small space. Preferably, the transfer support portion includes a pair of support guide shafts for holding a plurality of substrates stacked in a horizontal direction from both sides in a horizontal direction; the support guide shaft preferably has an abutting portion. Abutting the substrate at different positions in the circumferential direction; and the retreating portion 'for ensuring a predetermined interval in the pair of supporting guides (4) so that the substrate can pass through the above-mentioned pair of supporting guide shafts; the above-mentioned 97108014 15 200902415 The carrier mechanism further includes a guiding rotation mechanism for rotating the pair of support guiding shafts around the respective axes. Preferably, the substrate processing apparatus further includes a tanning unit 'for controlling the guiding rotation mechanism, and the substrate supporting shape (the abutting portions of the pair of supporting guiding shafts are opposed to each other), and the US state (Transition between the retracting portions of the pair of support guide shafts and the earth direction). According to this configuration, the plurality of substrates from the vertical posture of the loading/unloading mechanism or the horizontal conveying mechanism can be received and supported by the substrate supporting state between the abutting portions of the supporting and the supporting (four) axes. In addition, the 'in the case of the unsupported substrate' can be used to avoid the interference with the substrate held by the loading/unloading mechanism or the horizontal transport mechanism by the state of the substrate passing between the retracting portions, and the support can be guided. Axis =. In this manner, for example, when the substrate is placed at the level: = the position of the support guide shaft can be retracted to a position that does not hinder the horizontal movement of the horizontal conveyance holding portion, the structure becomes simple. It is preferable that the abutting portion includes the second abutting portion and the second 'th structure which are disposed at different positions in the upper four circumferential directions, since the first abutting can be selected> _. . With this, it is possible to use the support of the substrate to change the support and the mode of the second board: the support and the mode of the board, and it is possible to suppress or prevent the unprocessed substrate from using the square substrate. The surface foreign matter is transferred to the treatment so that the horizontal transport mechanism further includes a horizontal rotating mechanism for the 97108014 16 200902415 to rotate the horizontal transport holding portion around the vertical axis by at least 9 degrees (preferably around horizontal transport). The horizontal shift of the center of gravity of the Ministry). The main transport mechanism includes, for example, a substrate holding means for holding a plurality of substrates in a vertical posture stacked in a horizontal direction perpendicular to a direction in which the handle of the loading/unloading mechanism is moved forward and backward, and a traveling means for making the substrate Keep the means together in the direction of the advance and retreat of the above handle: move. In such a case, the substrate processing unit includes, for example, a plurality of processing units arranged in the horizontal direction. In this case, by rotating the horizontal conveyance mechanism of the horizontal conveyance mechanism by 90 degrees, the stacking direction of the plurality of substrates can be used in the lamination direction of the transfer mechanism and the lamination direction of the main conveyance mechanism. Change between. Beauty = layer: change to the conventional technique is to use the water of the multi-joint arm; the horizontal rotation of the two arms requires a long time. On the other hand, in the present invention, the conveyance holding portion can be rotated, so that the rotation can be made simple. In this way, the substrate u can be increased and the cost of the substrate processing apparatus can be reduced. Preferably, the flat rotating mechanism rotates the horizontal conveyance holding portion around the range of the weight of the # portion (preferably around the horizontal conveyance holding: the substrate in the vertical posture held by the holding portion: by:: moving the substrate group) When the two batches are combined, the first surface (the surface on which the device forming the substrate of the substrate group is formed) (the surface on which the device side is not formed) can be opposed to each other. 97108014 17 200902415 When the batch is immersed in the treatment liquid for treatment, it is possible to suppress or prevent the problem of foreign matter forming a surface from the surface of the adjacent (four) plate. The Dandian attached to the base = flat part, the above transfer support portion The two horizontal conveyance holding portions can hold a plurality of substrates in a small space, and can be combined into a batch at the 5 HM horizontal conveyance holding portion. f The horizontal conveyance holding portion includes: a first guide member for supporting the squatting a plurality of substrates of four layers in a flat direction; and a second guide, a plurality of substrates stacked in a horizontal direction in a vertical direction; the horizontal transport mechanism further includes a guide lifting mechanism for the ith guide Pieces on the second guide of j With this configuration, the pieces of τ are relatively lifted and lowered, and the substrate can be held by either the first member or the first: Here, the i-th and second guides are used to separate the unprocessed substrate and the processed substrate. (4) u can be transferred to the first substrate transfer position and the substrate support position at the predetermined first substrate transfer position and the substrate support position, and transferred to the substrate processing unit. Holding: Eryang ί 副 搬运 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副 副- transferring a plurality of base 1 plate private movement mechanisms, and having a first conveyance holding portion for holding a plurality of substrates at the transfer position between the transfer support portion and the first transfer holding right The first substrate transfer position 97108014 18 200902415 is between the main transport mechanism and the first transport holding unit, and the first transfer holding unit is used for the transfer position and the i-th substrate transfer position. Move; 2nd The plate moving mechanism holds the second conveyance holding portion of the plurality of substrates, and the transfer plate is disposed between the transfer position, the transfer support portion, and the second transfer holding portion at the second substrate transfer position. Between the main transport mechanism and the second transport holding unit, a plurality of substrates are transferred together, and the transfer position and the second substrate transfer position transport unit are moved. The first transfer support unit may be used to transfer the first transfer support unit. Vertical: the column and the horizontally held horizontal! The horizontal transport holding portion/the upper sheet base, and the movable mechanism can be placed between the transfer support portion and the transfer handle holding portion at the transfer position described above, and the vertical transfer is performed together The plurality of postures can be placed between the main conveyance mechanism and the holding portion at the first substrate transfer position, and the plurality of substrates in the vertical posture can be transferred together, and the above-described transfer position and the first substrate transfer position can be made The first horizontal conveyance holding portion moves horizontally. Further, the second conveyance support portion 1' is for arranging and holding a plurality of substrates in a vertical posture at a horizontal level:: 2 horizontal conveyance holding portion. In this case, the second substrate or the structure may be a horizontal transfer mechanism that can be transferred to the transfer support portion and the second horizontal transfer holding portion at the transfer position. The plurality of substrates in the vertical posture can be transferred between the main conveyance mechanism and the second horizontal conveyance holding portion at the second substrate transfer position, and the plurality of substrates in the vertical posture are transferred together, and the transfer position and the second substrate 97108014 19 200902415 The second horizontal conveyance holding portion can be horizontally moved between the delivery positions. According to this configuration, the main transport mechanism can access the intersection of the second and second rows of substrates. Further, the substrate transport between the first substrate transfer position and the transfer mechanism is performed by the first substrate transfer machine, and the substrate transfer between the second substrate transfer position and the transfer position is performed by the second substrate moving mechanism. In this way, since the substrate transport path of the transfer mechanism and the main transport mechanism can be made into two systems, the unloaded substrate is taken out from the container and transported to the main transport mechanism by the loading/unloading and transporting. In the case of another substrate transport path, the processed substrate may be discharged from the main transport mechanism to the transfer mechanism via another substrate transport path. Therefore, the waiting time can be reduced and the substrate processing speed can be increased. The first substrate moving mechanism picks up the substrate processed by the substrate processing unit from the main transport mechanism at the transfer position of the second substrate, and delivers the substrate to the transfer mechanism at the transfer position; the second substrate The moving mechanism picks up the substrate before being processed by the processing unit from the transfer mechanism at the transfer position, and delivers the substrate to the main transport mechanism at the second substrate transfer position. According to this configuration, the main transport mechanism performs an operation of taking an unprocessed substrate from the second substrate moving mechanism at a position where the second substrate is attached, and transporting the substrate to the substrate processing unit at the second substrate transfer position. The processed substrate is discharged to the second substrate moving mechanism. By separating the path of the unprocessed substrate from the person who has processed the substrate, the conventional technique of sharing the substrate transfer path when the substrate is loaded and when the substrate is discharged can reduce the waiting time and increase the substrate processing speed. 97108014 20 200902415 It is also possible to have the main transport mechanism include a substrate chuck for holding a plurality of substrates together. In this case, it is preferable that the substrate processing apparatus further includes: a chuck cleaning unit for cleaning the substrate chuck of the main transport mechanism; and a transport control unit for controlling the operation of the main transport mechanism. After the substrate processed by the substrate processing unit is transported to the second substrate parenting position (preferably, the substrate chuck is not washed by the chuck cleaning unit), the substrate is transferred from the second substrate transfer position to In the substrate processing unit, the substrate chuck is then washed by the chuck cleaning unit. According to this configuration, even if the unprocessed substrate is in a waiting state at the second substrate transfer position, the main transport mechanism may first discharge the processed substrate from the substrate processing portion to the second substrate transfer position, and then transfer the second substrate to the position. The unprocessed substrate is transported to the substrate processing unit. That is, it is not necessary to bring the substrate chuck into contact with the unprocessed substrate before the main transport mechanism carries out the processed substrate, so that it is not necessary to clean the substrate chuck before the discharge of the processed substrate. Therefore, the number of times the substrate chuck is washed can be reduced. Further, since the cleaning of the substrate chuck is performed by the vacant time after the unprocessed substrate is discharged and the unprocessed substrate is carried into the substrate processing portion, the substrate processing speed can be further improved by this means. Preferably, the substrate processing apparatus further includes a transfer control unit that controls the loading/unloading mechanism, the transfer mechanism, and the first substrate moving mechanism to be held by the first conveyance holding unit. The second substrate group of the plurality of substrates is transferred to the transfer support portion, and the second substrate group is transferred from the transfer support portion to the carry-in/transfer 97108014 21 200902415 and held by the first transport holding portion. a plurality of bases (for example, the remaining part); the chain 6 describes the transfer support unit, the loading/unloading mechanism is carried out from the transfer support unit; and the loading/unloading machine is controlled; And a step of constructing the second substrate moving mechanism to carry the transfer support portion on the third substrate 2, and handing the upper transfer group to the second transfer holding portion from the upper group to the second transfer holding portion. The human (10) output mechanism delivers the fourth substrate group to the transfer support: the transfer support portion supplies the fourth substrate group to the fourth and fourth substrates 1. The third substrate is held by the second transport holding portion. When the group is constructed according to this structure The first conveyance and holding unit holds the first substrate group and the second substrate group and transfers them to the transfer support (four), and shifts to the release operation. The third substrate group carries the holding unit from the transfer support unit. In the transfer support unit, the fourth substrate is used to carry out the batch-and-combination operation of the fourth substrate. 2. The substrate moving mechanism (second transport holding unit) is possible. Therefore, even in the batch releasing operation, the substrate moving mechanism transfers a plurality of unprocessed substrates in batches to each other. Further, even in the batch group = r such as T? The substrate is transferred to the first substrate moving machine = In the batch release operation or in the batch combination operation, the substrate processing can be further improved, and the substrate processing can be further improved. 97108014 22 200902415 degrees. Preferably, the substrate processing apparatus further includes an intervening mechanism for transferring the substrate at the second substrate to the second substrate at the position of the substrate. The main transport mechanism is configured according to the configuration, because the carrier can be transported via the intermediary. Substrate intersection between main handling mechanisms Therefore, the second horizontal transport mechanism and the main transport mechanism of J 2: flat:: 妾: production. In addition, the substrate processing is further improved by the other unit 2 substrate structure, and the clamp # The orientation of the substrate is aligned. The orientation of the soil plate (for example, the crystal orientation of the semiconductor day and day) is such that the transfer support portion of the transfer mechanism maintains a plurality of substrates in a state of being stacked in a vertical orientation. The transfer mechanism is in a plurality of substrates in which the transfer support portion and the loading/unloading are transferred together in a vertical posture, and the i-th transport holding portion is configured to hold the plurality of substrates in a vertical posture in a horizontal direction. Arranging, in the first base, the moving mechanism is between the transfer support portion and the first conveyance holding portion at the transfer position, and the plurality of substrates are transferred in a vertical posture, and the main substrate is placed at the first substrate transfer position. a plurality of substrates are disposed between the mechanism and the first conveyance holding portion in a vertical posture; and the second conveyance holding portion is configured to hold the plurality of substrates in a vertical posture and arranged in a horizontal direction. The second substrate moving mechanism is in the vertical transfer position between the transfer support unit and the second transfer holding unit at the transfer position. 97108014 23 200902415 Two '9 at the second substrate transfer position is the main transport mechanism: In the second embodiment, the substrate processing unit of the second aspect of the basic invention is used to hold the container together to accommodate the plurality of holding clips, and the substrate processing unit The main transport mechanism is associated with the substrate processing unit at the predetermined i-th and second substrate transfer positions; the two substrates; the loading/unloading mechanism, The transfer support portion for holding the plurality of substrates is placed in a predetermined number of two places: the transfer support portion and the loading/unloading mechanism hold the plurality of substrates 2/multiple substrates; the first substrate moves The mechanism includes a sister conveyance holding unit for holding the matte substrate, and between the transfer displacement carrier support portion and the i-th conveyance holding portion, the plurality of sheets of the substrate transfer position are in the main conveyance position. Configuration and the i: II;! Between the portions, a plurality of substrates are transferred together, and between the transfer position and the substrate transfer position, the first transfer and the second substrate moving mechanism are provided to protect the body. The transfer position is between the transfer support portion and the general transfer holding portion, and a plurality of substrates are transferred, and the first main transport mechanism and the second transfer holding substrate 6 are connected to each other. The transfer position and the second % = /m ' move the second conveyance holding unit. According to this configuration, the domain/radio access and the second substrate are connected to the lamp substrate. Further, the substrate transfer between the first substrate transfer position and the transfer mechanism is performed by the second substrate moving mechanism, and the substrate transfer between the second substrate transfer position and the transfer position is performed by the second substrate moving mechanism. In this way, since the substrate transport path between the transfer mechanism and the main transport mechanism is two systems, even if the unloaded wire is taken out from the storage H through the carry-in/out mechanism, it is sent to the main transport mechanism and used. In the case where there is another substrate_path, the road can be transported by the other earth plate; U discharges the processed substrate from the main transport mechanism toward the transfer mechanism, so that the waiting time can be reduced and the substrate processing speed can be increased. It is best to make the above! The substrate moving mechanism receives the substrate processed by the substrate processing unit from the main transport mechanism at the transfer position of the second substrate, and delivers the transfer to the transfer mechanism at the transfer position; preferably, the second substrate moving mechanism is At the transfer position, the substrate before being processed by the substrate processing unit is received from the transfer mechanism, and is delivered to the main transport mechanism at the first place. According to this configuration, the main transport mechanism performs the operation of picking up the second substrate transfer position "2 the unprocessed substrate moving mechanism: the board' is transported to the substrate processing unit, at the first! At the substrate transfer position, the substrate is discharged to the crucible! Substrate moving mechanism. By separating the unprocessed substrate = from the path of the processed substrate, the conventional technique of sharing the substrate transfer path when the substrate is loaded and when the earth plate is discharged is shorter than the waiting time, so that the substrate processing speed can be increased.最好 It is preferable to have the above-described main transport mechanism include a substrate chuck for holding a plurality of sheets together. In this case, it is preferable to make the above-mentioned substrate processing more suitable. 2: 97108014 25 200902415 There are: a chuck cleaning unit 'a substrate chuck for cleaning the main transport mechanism; and a handling control unit for controlling the above main handling The operation of the mechanism is such that after the substrate processed by the substrate processing unit is transferred to the first substrate transfer position (preferably, the substrate chuck is not washed by the chuck cleaning unit) 'from the second substrate transfer position The substrate is transported to the substrate processing unit, and then the substrate chuck is washed by the chuck cleaning unit. According to this configuration, even if the unprocessed substrate is waiting at the second substrate transfer position, the main transport mechanism may first discharge the processed substrate from the substrate processing portion to the f 1 substrate transfer position and then transfer the 帛 2 substrate to the position. The unprocessed substrate is transported to the substrate processing unit. That is, it is not necessary to cause the substrate refresher to abut the unprocessed panel before the main transport mechanism carries out the processed substrate, so that it is not necessary to clean the substrate chuck before the discharge of the processed substrate. Therefore, the number of times the substrate chuck is washed can be reduced. Further, since the substrate chuck = cleaning is performed by vacating the unprocessed substrate into the substrate processing portion after discharging the processed substrate, the substrate processing speed can be further improved by this means. Preferably, the substrate processing apparatus further includes a transfer control unit, "= D: controlling the transfer/removal mechanism, the transfer mechanism, and the substrate moving mechanism" to increase the number of the above-mentioned a part of the second substrate in the sheet substrate is supplied to the portion to be protected, and the transfer support mechanism is transferred from the transfer support portion, and then the first and second substrates are transferred to and from the board. The other part is the same as the rest); the first part; 97108014 26 200902415 The transfer support unit, from the description of the loading/unloading mechanism; the control of the If part, the second substrate group is handed over to the upper structure and the above (2) The substrate transfer/removal mechanism and the transfer machine: the loading/unloading mechanism is transferred to the third substrate group, and the third substrate group is cut from the upper portion by the third substrate group The second loading and holding unit is cut, and the second: the transfer support unit is transported from the transfer support unit. The second moving 4 substrate group, ', and the third substrate group and the first According to this configuration, the board is divided into the first substrate group and the first batch releasing operation is performed. Further, the load is carried to the transfer support portion, and is carried to the second transport holding portion, and the second substrate group is moved after the dance. Transfer to the second transport holding unit, and the fourth substrate group is moved by the second substrate group to the second substrate. The second substrate moving mechanism is in accordance with the release operation (the === The batch 2 substrate moving mechanism will be in the middle of multiple batches. It is also possible to pass the first structure. In addition, even in the batch combination operation, the transport mechanism transfers the processed substrate to the first substrate moving mechanism. : $'s can be further reduced in the batch release operation or in the batch combination operation, so the substrate processing can be further improved. The substrate processing apparatus further includes the second substrate transfer position. The intermediate mechanism for transferring the substrate between the second moving and holding portion and the main transporting mechanism 97108014 27 200902415 is disposed. According to the configuration, the second base moving mechanism and the main moving machine can be transferred by the intermediary mechanism. The transfer of the first board Carry out the substrate ^.  The limited time for the earth moving mechanism or the main handling mechanism can be shortened. By using j: 卜锸古彳π j j u, the substrate processing speed can be further improved. In addition, the substrate can be handed over to the other unit disposed at the second base = junction position. An example of such a unit is a substrate (4) for making the orientation of the substrate (for example, the radius of the half (four) sundial; the vertical; = 、, so that the container holding portion is used to hold the container for the second reason: the posture is up and down The plurality of substrates stacked in the direction 'the substrate processing is applied to the horizontal direction in a vertical position. The main transport mechanism is used to transport the vertical substrate = the vertical substrate in the horizontal direction. The unloading mechanism is used to transfer the multi-piece substrate 1 to the container held by the upper container holding portion, and the substrate of the shoulder piece is changed together between the horizontal posture and the vertical posture, and the above-mentioned transfer is performed. At the transfer position, the plurality of substrates in the vertical posture are transferred between the transfer support unit and the loading/unloading mechanism. The first transport holding unit is configured to arrange and hold a plurality of substrates in a vertical posture. In the horizontal direction, the second substrate moving mechanism transfers the plurality of substrates in the vertical posture between the transfer support portion and the i-th transfer holding portion at the transfer position, and the first substrate is transferred to the first substrate. The position is between the main conveyance mechanism and the first conveyance holding portion, and the plurality of substrates are transferred to the vertical posture. The second conveyance holding portion is configured to arrange and hold the plurality of substrates in the vertical posture of 97108014 28 200902415 in the horizontal direction. The second substrate moving mechanism is disposed between the transfer support portion and the second conveyance holding portion at the transfer position, and serves to transfer a plurality of substrates in a vertical posture, and the main transfer mechanism is disposed at the second substrate transfer position. In the second structure, the plurality of substrates that are placed in the container in a horizontal position are carried out by the loading/unloading mechanism, and the loading/unloading mechanism is used to transfer the substrate. The multi-piece substrate in the vertical posture is transferred to the first or second conveyance holding portion at the transfer position, and is transported to the second or second substrate transfer position, and is transferred to the second or second substrate. The position is delivered to the main transport mechanism. The main transport mechanism transports the multi-piece substrate in the vertical posture to the substrate processing cassette. The substrate processed by the substrate processing unit is used by the main transport mechanism. The board processing unit is transported to the first or second substrate transfer position and delivered to the second or second substrate moving mechanism. The first or second substrate moving mechanism transports the substrate from the i-th or second substrate transfer position to the transfer position. And the transfer mechanism supplies the substrate to the loading/unloading mechanism. The loading/unloading mechanism moves the substrate into a horizontal posture after changing the posture from the vertical posture, and then carries it into the container. ^According to this In the loading/unloading mechanism, the substrate of the container is loaded and unloaded, and the posture of the substrate is changed. Therefore, when the arm robot is used, the arm robot is used to carry in and out, and the posture of the substrate is changed. In the comparison of the conventional techniques of the dedicated posture changing mechanism, the structure can be simplified. In addition, the loading/unloading mechanism can perform the substrate loading/removing operation of the container/97108014 29 200902415 and the posture changing operation 'arm horizontal rotation. Therefore, you can lose...: "Technology makes multiple joints shorten the movement time. Use this method to shorten the need for substrate handling." In other words, the processing speed of the substrate can be increased. Further, by moving the transfer support portion of the transfer mechanism up and down, the substrate transfer with the substrate of the loading/unloading mechanism can be estimated. The transfer of the substrate can be performed. Move in the secondary transfer substrate of the transfer structure of the two-single structure. The above and/or other objects, features and effects of the mechanism and the first and second substrate moving mechanisms are apparent from the description of the embodiments described below. [Embodiment] [Overall structure of the first embodiment] A plan view of a schematic view for explaining the overall structure of a county in accordance with the present invention. The "domain" i := several ΓΓ", the board 2 k transfer mechanism 5, the first horizontal transport mechanism 6, and the first processing device are disposed in a corner portion of the substrate ^θ+ which is formed in a substantially rectangular shape in plan view. The transport box holding portion 1 is for accommodating the write companion portion 'for holding the (4) AP W holding direction as the accommodating write, and the yoke is in the Ζ direction (the upper substrate L is in the opposite direction) One of the multiple sides of the horizontal posture is accommodated) The front surface of the soil treatment device 10 is l〇a (corresponding to the overhead view, the automatic transfer box is arranged with a two-point chain line. 97108014 30 200902415 Transport device 11. Automatic transfer box The transport device u has: a transfer cassette for the substrate W; a common transfer to the transfer cassette holding unit; the transfer cassette F having the substrate w not to be processed; the transfer holding unit k function; and the transfer The cassette is provided to the transfer cassette so that the transfer held by the transfer cassette holding unit can be held. The substrate W is in the present embodiment, such as a semiconductor wafer: the round work substrate processing unit 2 is provided along the substrate. Two plates. f (corresponding to the top view - the long side M〇b in the γ direction & 20 (processing unit) processing a plurality of surface portions plurality of processing portions "of the two chemical Zi? 1, Li 1, 3 have been Shang Shang. 苐1 Liquid 2 ===_ Slot 23, Μ2 = π 1 solution tank 21 and 2nd liquid tank = 2 liquid solution for chemical treatment. Second = the liquid tank 24 stores the rinsing liquid (for example, 50 sheets), and the substrate is immersed in the rinsing liquid to be immersed (= rinsing treatment. The surface is applied to the surface in the present embodiment, the first 筚pan The washing tank ^* 成 is adjacent to the first groove 24 adjacent to the η Lok tank 23 and the second flushing liquid 27 adjacent thereto for use as the first lifting and lowering 1 m as a dedicated transport mechanism The substrate w that has been treated with the chemical solution in the first chemical solution tank 21 is moved to the second lifter 28 for the \\f, , and the special transport mechanism, and the washing tank 24. The processed substrate W is moved to the second punching portion, and is used to support the vertical posture 97108014 31 200902415 in a state in which the stacker 27 is stacked in the 2° direction (horizontal direction), and the second sheet (for example, a 5G sheet) substrate w; a driving mechanism for moving the two opposing portions up and down; and a horizontal driving mechanism for traversing the substrate in the Y direction of the substrate. The 'χ direction is the level along the front surface IGa of the substrate processing device 1 The direction is the direction orthogonal to the γ direction. With this configuration, the i-th lifter 27 is charged vertically by the main transport mechanism a plurality of substrates w stacked in the direction/direction, the plurality of substrates are lowered into the first chemical solution tank 21, and are immersed in the chemical solution. Further, after waiting for a predetermined chemical treatment time, the sputum is lifted and lowered. The substrate 27 raises the substrate support 4, and the plurality of substrates w are lifted toward the rinsing liquid, and the substrate supporting portion is traversed. Further, the substrate supporting portion is lowered into the first rinsing liquid tank 22, and the immersion is performed. After the predetermined rinsing treatment time is waited, the first lifter 27 raises the substrate support portion, and lifts the substrate w from the rinsing liquid. Then, the plurality of substrates W are lifted from the i-th lifter 27. In the same manner, the second lifter 28 receives a plurality of f-plates W stacked in the vertical direction by the main transport mechanism 3, and lowers the plurality of substrates w to the second chemical liquid. In the tank 23, the liquid crystal is immersed in the chemical liquid. Further, after waiting for a predetermined chemical liquid processing time, the second lifter 28 raises the substrate support portion, and lifts the plurality of substrates W from the chemical liquid to face the first 2 rinsing liquid tank 24 makes the substrate supporting portion run horizontally, and further, the substrate supporting The holding portion is lowered into the second rinse liquid tank 24, and the fork is broken in the rinse liquid. After waiting for a predetermined rinse processing time, the second lifter 28 raises the substrate support portion and lifts the substrate w from the rinse liquid. The plurality of substrates w are transferred together from the second lifter 28 to the main transport mechanism 3. 97108014 32 200902415 The drying processing unit 25 has a plurality of (for example, 50) substrates W held downward in a vertical posture in a stacking direction. The substrate holding mechanism supplies an organic solvent (isopropyl alcohol or the like) to the substrate w in a reduced pressure environment, or removes the liquid component on the surface of the substrate w by centrifugal force to dry the substrate w. The drying treatment portion 25 can be The substrate (3) is transferred to and from the main transport mechanism 3. The main transport mechanism 3 is provided with a plurality of (for example, 50) substrates w which are held in a vertical posture with respect to the substrate chuck (clamping mechanism) 3G as one of the substrate-holding means; A chuck driving mechanism for operating the substrate chuck 30; a horizontal driving mechanism for making the base = chuck 3. Moving horizontally along the gamma direction (traverse); and the lift driver is used to raise and lower the substrate chuck 3 in two directions. - for the substrate plate, a pair of support guides 31 having a shaft shape extending in the X direction are provided, and on the side opposite to each other, 31 is formed in the axial direction = soil support groove for supporting from below A plurality of soil plates W in a vertical posture. The chuck drive mechanism expands/retracts the distance between the support guides 31 by causing the pair of substrates to be lost in the arrow. In the case of the water name type, the substrate chuck 3 can be opened and closed, and converted into a state in which the substrate W can be held or the solution of the substrate W can be released. The opening and closing operation and the second lifters 27 and 28 can be used. Bottom: The main transport mechanism 3 can be operated at the second substrate transfer position ρι10801080 in the state in which the plurality of substrates and the substrate holders of the substrate and the substrate chuck are stacked in the vertical direction. 33 200902415 A plurality of unprocessed substrates w stacked in the X direction in a vertical posture are taken, and a plurality of processed substrates W stacked in the vertical direction in a vertical posture are placed at the second substrate parent position P2. The lost disk cleaning unit 8 is disposed below the first substrate transfer position Pk. The chuck cleaning unit 8 has a pair of substrate chucks 30 inserted into the pair of substrate plates 30 (in particular, the use of the cleaning liquid to wash the dried processing portion 25 dry welding sounds _ ^ handling The mechanism 3 is lowered into the chuck washing pan = washing tank 35 before the transfer of the r-plate transfer position n, mn. Then, when washing in the washing tank 35 = two The moving mechanism 3 performs the operation of transferring the processed substrate W from the drying processing unit 25. The shutters 15 and 16 are provided in s _. The shutter 15 is opened when the shutter is placed on the side of the loading/unloading mechanism 4; The mechanism 6 accesses the first substrate transfer position, and during the other periods, the closed horizontal transport mechanism 7 is kept accessing the fourth. The middle 16 remains closed during the second period: when the P2 is placed, the other substrate processing unit 2 is opened.药 或 防止 防止 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板2 and the above-mentioned near the corner 10a of the substrate processing apparatus - near the corner, 97108014 34 200902415 setting In the second substrate transfer position p2, the carry-in/out mechanism 4 is disposed at a corner portion. The transfer port is disposed on the opposite side of the transfer cassette holding portion 1 in the other γ direction, and has a shift =:4. The carrier mechanism 5 and the ... substrate transfer position ρι are between 冓 5. In the transfer position: the substrate between the transfer mechanisms 5, the transfer transfer mechanism: the substrate between the structure 4 and the mechanism 6, And the substrate between the transfer mechanism 2 and the transfer mechanism. 7. The structure of the loading/unloading mechanism is shown in Fig. 3. Fig. 3 is a perspective view for explaining the structure of the loading/unloading mechanism 4. Seen as a multi-piece holding handle, it can be held in a / handle / handle / handle into: handle support portion 41, used to support the batch of handles to turn the block 2; = block 43; and handle forward and backward machine (four). The rotary block has a handle rotation motor 45 as a handle rotation mechanism, and a rotation shaft of up to 5 is coupled with a handle support portion 41. With the following: ==: The portion 41 is surrounded by the central axis 4 of the batch handle 40: 'The relative rotation of the rotating block 42 can be made, and relative rotation can be generated via the drive=two motor 45. With this 4, In order to rotate the batch of handles 4 around its central axis 46. The square block 4 4 is coupled to the advance and retreat block w via a gamma gamma & + = = = 砰§, the advance and retreat block 43 At 97108014 35 200902415, the opposite ends of the X direction are W. The end of the pair of wrists 48 is extended in the / direction - the end of the wrist portion 42 in the X direction 呷 #旋转块42, the rotating block The other of the X directions of 42 is coupled to the wrist 48. The other end of the rotating block is coupled to the rotation of the motor 50. Square #丝,丁 still 锝 锝 锝 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此Centering on the inside of the body, so that the rotating block 42 is made up of the shaft shank...the heart (four) along the second:::, the handle is made to rotate the handle of the batch hand / mouth fragrant u face. Can make more = as a mechanism. With the sub-ancient-under-track, the posture of the a-pad substrate w is changed between the horizontal posture and the vertical anomaly (refer to Fig. 5). Wennu spear = advance and retreat mechanism 44 is provided with: a pair of direct guides to introduce the ejecting body 43 to make the cymbal, and the babies base v a a + for 孓 (with the tooth moving in a straight line; the follower pulley is near; the driving pulley (with the tooth) Appeal to the end of the W f guide 53 ^ ^ .  Wheel) 56, broken configuration near the other & straight line guide 53, belt (with teeth, @. &^4'&#1^ is suspended from the center, and the leather pressing member 58 is used to couple the advancing and retracting body 43 to the belt 57; and the wooden block is used to advance and retreat the block 56. With this configuration, the rotating shaft is coupled to the drive to drive the advance/retract motor 60 so that the belt 57 comes back to cause the advance and retreat blocks to move horizontally. The transfer of the batch handle 40 to the frame held by the transfer cassette holder 1 The structure k for explaining that the batch handle 4 is moved up and down is not provided, and the structure inside the handle support portion 41 is not provided. The handle support portion is provided with: a fixed base 62, a moving base 63, and an actuator 97108014 36 200902415. The batch handle 4G is fixed to the moving base (10). The moving base is coupled to a moving block 64 that is driven by an actuator 65. The moving base 63 is guided along the linear guides (not shown) in the direction in which the handle elements of the batch handles are arranged 69, while being movable to the fixed base. The actuator 65 linearly moves in the direction in which the handle elements are arranged 69, for example, with an electric motor as a driving source. With such a body actuator 65, the batch of handles 40 can be moved in the direction of the handle member arrangement 69. In this way, the plurality of substrates W that are housed in the F can be taken up or the plurality of substrates w can be placed in a plurality of substrate receptacles that form "F. The second is a perspective view" The batch of handles 4〇 and the phase: the batch of handles 40 are provided with a plurality of handle elements arranged along the handle element 70. Each of the handle elements 7 is a thin plate beam extending in the normal direction of the handle support = surface, and is formed in a plan view. The wedge layer becomes the pair of two separated from each other by a predetermined distance = 鬲. Batch of hands... center... over all = definition.: The imaginary straight line of the parallel direction of the shank element 7〇 is feng f M — the handle element In the following, the plurality of handles 70 arranged in the handle element arrangement square 69 can hold one substrate w, and are held together in the state of 69 lamination, and can be held in a transfer box F. With the two handle elements facing each other, a plurality of substrates W can be arranged in the direction in which the handle elements are arranged. In the present embodiment, the substrate w of 25 horizontal postures is held in the state of lamination of 97108014 37 200902415 2, and the pair: the matching box The handle F inner substrate W is spaced apart from each other The spacing, the sub-handle member 70. Therefore, the batch of handles 40 can hold all the substrates w in the transfer box F together. ST :: No, each handle element 70 is provided with opposite side surface handles and second support surface 72. The support member 7 supports the hand 1; the base end portion of the Γ part is provided with the second support portion on the first support surface 71, and the second support projection is provided with the second support projection. 1 guide projections 75, and second support faces of the first support projections including the second 73 and the first guide faces 71 on the support surface 72 of the first support surface 71. When the second substrate holding portion 74 and the second guiding protrusion portion are arranged to surround the first supporting surface π upward by the control batch handle 4, the substrate holding portion of the first substrate is formed in the 76 system. When the first portion is rotated, the protrusion 75 is brought into contact with the substrate gusset and the first guide 2 support surface 72 is upward, and the slab is additionally "if the first projection is brought into contact with the base (four), When the portion 74 and the second guide are ground, the supporting projections 73 and 74 abut the surface of the substrate on the support base side, and guide the base end portion of the projection portion: = substrate. The peripheral end surface and the lower peripheral portion member 7 are controlled so that, for example, when the substrate to be treated is taken, the second support surface U is held in the batch handle 40 at 97108014 as above, in the batch of 38 200902415 When the handle 40 holds the unprocessed substrate W, the second support surface 7i is made into the upper surface. In this manner, the unprocessed substrate W and the processed substrate/the support protrusions 73, 74 and the guide which can be changed to abut against the substrate W are guided. The projections 75, 7 to 6. As a result, it is possible to suppress or prevent the foreign matter adhering to the untreated base from being transferred to the processed substrate w via the batch handle 4 . - as shown in Fig. 4, Fig. 5 and Fig. 7, etc., at the position of the handle support portion near the base end portion, the support member 8 having three axial support == root axis is provided. The handle element arrangement direction 69 is = parallel" with one support member 8〇 disposed outside the handle member array (on the opposite side of the batch handle central axis 46), and 7°B in the other 2 columns The outer side is equipped with $1 support guide 80, and the roughly φ door between the handle element rows 70Α and 70Β supports the guide (4). At the financial position, the residual one is supported by three. The guides 8() are common to the front of the (four) pedestal'. Guide 8 "Jihe to the moving base 63 (= linearly moves in the direction of the central axis 46 of the batch handle. The rear of the guide 81 is fixed The substantially L-shaped bracket 79, the earth seat = the opposite of the support guide (four). In the bracket; 9: shift = 3 the cam follower 82 on the opposite side of the V-piece 80. In addition, a cam is provided toward the support base 63. 84, which has a spot 'on the moving wheel surface 83. The cam 84 is located on the opposite side of the convex base of the moving base'. The support member 8〇3 holds the guide member and includes the pair of handle members. The column direction 69 is inclined. The cam surface is mounted to the movable base 63. The cam 84 J is moved linearly by the direction of the handle of the mouth 69 97108014 39 200902415. The cam 84 is coupled to the convex drive. t The cam base 85 is arranged on the moving base 63 by the cylinder 86 with the handle member, so that the cam base 85 linearly moves in the J direction 69. The movement is guided by the linear guide 66 (the straight line from the cam base 85) The movement of the line moves to guide the cam follower = 9). The direct guide 81* of the cam base 85 is moved over the protrusion 83, and the seat is guided along the center axis of the batch handle. The member 80 is also formed along the 拙^ ′′, the support guide (4) _ yuan == the sputum mechanism 87, which is used to make the two phases of the guide pedestal 81 into the through holes 77, 78 into &; = Yes - for the through hole 77, 78 ° shape. To pierce the pass t 7; the second-hand holding member 67, 68 of the second-hand arrangement direction 69. ml is provided with the handle member supporting the rear support members 67, 68 The movable base 63 is fixed. In addition, before the handle element supporting members π, μ, two handle elements constituting the handle element row m are fixed. ί U ° The support guide 80 is advanced to the front end side of the batch handle 4 by driving the lead-in mechanism 87, and the substrate W can be held from the front and the rear by the support guide 8 and the guide protrusions 75, 76. The gripping state is used when the batch handle 4 is changed between the horizontal posture and the vertical posture. In this manner, the substrate (7) can be stably held in the posture changing, and the falling of the substrate W can be suppressed or prevented. As shown in FIG. 8, each of the support guides 80 has a plurality of substrate holding grooves, 97108014 40 200902415 which is in the direction of the substrate w supported by the hand phase member 70 to open the component arrangement direction 6 9 Π戸 Π戸 bow Τ s s , and in the handle ^ Open interval. More specifically, for each handle element and two have a brother to keep the groove and the second substrate to maintain the ditch. Further, a guide driving mechanism 89 is provided for guiding the axis of the guide member 80 to move in the direction of supporting the glaze. With such a mechanism 89, it is possible to control the guide groove _ _ 〜 the substrate holding groove 88A and the second substrate accommodating groove 88B to be held by the handle soil, for example, The end face can be used. The substrate substrate retaining groove 88A is used for the maintenance of the soil layer w, and the second substrate W is used for holding. The plate holding groove 88B is treated as a structure of the [transfer mechanism]. Fig. 9 is a perspective view for explaining that the movement 5 has a structure in which one pair is extended in the γ direction: f5. Transfer mechanism Guide shaft (1) with the side: 2! Support guide pumping 91' This pair supports the w / mouth λ direction opposite each other. In the work of the support portion, the support shaft 91 has a plurality of substrates W which are held in a vertical posture at the end of the transition. The straight text is in the Υ direction, and the lead shaft 91 is supported by the support portion 92. The guide support portion w is reciprocated by a woman's upper end of the body portion 93 by a small distance. The body portion = is assembled to the substrate processing device! In: n-direction extension of the columnary zero. The actuator 95 of the mechanism of the main body portion 93 is shown as shown in Fig. 10 as it is movable up and down in the z direction. The actuator 95: two & has a drive member that is driven up and down to drive the drive source motor 94 and a bolt together for moving the body portion 93 up and down in the direction of the 97108014 200902415. Fig. u is a perspective view showing a structure for moving the pair of support guide shafts 91 in the direction of the movement, and showing the structure as seen from the rear of Fig. g. The guiding support 92 is broken and installed at the upper end portion of the body portion extending in the z direction, and the j body 4 93 is guided by the linear guide 97 and can be moved in the γ direction: on the main body portion 93, the bracket 98 is mounted thereon. Guide the moving motor 1〇〇. ° ί The rotation axis of the moving horse 1彡0 is engraved with a thread, and the rotation axis is arranged along the y direction. The rotating shaft ιοί is screwed into a threaded hole of the block 99 that is fixed to the side of the guide support: "2. According to this configuration, the pair of support guide shafts 91 can be advanced and retracted in the γ direction by the guide : 'moving the motor 100 so that it is rotated forward/reversely. In this manner, the guide movement motor (10) or the like is used to constitute the support guide horizontal movement mechanism 1〇2 (support portion horizontal movement mechanism) for horizontally moving the support guide shaft 91. The guide support portion 92 is further provided with a guide rotation mechanism 105 for rotating the pair of support guide shafts 91 around the respective axes. - The support guide shafts 91 are respectively mounted on the guide support portion 92 so as to be rotatable about their axes. Pulleys 106, 1〇7 are respectively attached to the base ends of the respective support guides #91. On the other hand, a guide rotation motor 11A and a tension pulley 108 are attached to the guide support portion 92. The rotating shaft of the guide turning horse $11G is fixed with the wheel 109. In addition, a belt (with a belt back) 111 is hung on the pulleys 1〇6, 1〇7, 1〇9, and a tension U is applied from the outer side of the belt 111 via the tension pulley 108. The pair of support guide shafts 91 can be rotated in conjunction with each other. 97108014 42 200902415 The guide is shown in the figure to illustrate the configuration of the support guide car from 91. The different positions (180 degrees in the present embodiment) of the different positions are supported. The first abutting portion 113 and the second abutting portion 114 are provided, and the portion is the retreating portion 115. The first and second abutting portions (1) are configured such that the ridge-like projections 116 projecting in the direction orthogonal to the axial direction of the support guide shaft 91 are arranged in the axial direction of the projections 111R ϋ. A support groove is formed at the end of each of the toothed U116 for receiving the edge portion of the support substrate w. The toothed projection 116 is not formed in the escape portion 115. The support guide shaft 91 is used to make the support guide shaft 91 a pair of support guide shafts 91 J. The first support member 113fs1 is opposite to each other (see FIG. 1 2 ) and #筮9. The second support state, or the retreat = 5 = the contrast between the joints 114 is shown in Fig. 13). °卩115 mutually retreating from each other (in the first support state, the distance between a pair of supporting guide shafts 91 113 is smaller than the base-connecting axis can maintain a vertical posture together) In the guided support state, a pair of two potentials: the substrate W. Similarly, in the second distance, the distance between the second abutting portions 114 of the guiding shaft 91 is smaller than the diameter of the substrate w. It is possible to maintain a plurality of plates in a vertical posture -= when the substrate W is processed by the guide shaft 91, it is the second substrate W. For example, 'to maintain the 9th, the support is sad, and the way to maintain the substrate W when the A flute = state To control the guiding rotation motor ιι〇, ::: = substrate W and processed substrate w to the first, processing change and hold. 罘Z abutting 邛 113, 114 cut in the retreat state, as shown in Figure 13, _ support The distance between the guide shaft turns 97108014 43 200902415 is larger than the diameter of the substrate w. Therefore, the substrate w in the vertical posture can pass between the pair of support guide shafts 91. [Configuration of the first horizontal transport mechanism] Fig. 14 is a perspective view, The structure for explaining the second horizontal transport mechanism ^. The first horizontal transport mechanism 6 is provided with: i-th horizontal transport The plurality of substrates w for holding the vertical posture together; the main body portion 121 supports the first horizontal conveyance holding portion = the mobile base 2 in a state in which it is rotatable about a straight axis 9; The main body portion 121 and the horizontal drive mechanism m horizontally move the moving base 122 in the x direction. The main body portion has a columnar shape along the z direction, and the first horizontal conveyance holding portion 12 is attached to the upper end portion thereof. The lower end portion is fixed to the moving base 122. The driving mechanism 125 is provided with a pair of linear guides 126 for guiding the horizontal movement of the 2 private base 122 in the X direction. At one end of the linear guide The side is provided with a follower pulley 127, and the other of the linear guides 126, τ ± ,, the moon wheel 128, the drive pulley 128 is coupled with the rotary shaft of the f-transport motor 130. The pulleys m and m are hung with skin = (4) Tooth belt) 129' Therefore, the belt 129 has a straight portion extending in the X direction in the linear guide. A straight line I on the belt 129 is placed on the belt pressing member (3) of the moving base 122. By driving the horizontal conveyance motor 13 〇 to make it positive, the conveyance is maintained in the X direction. Therefore, the horizontal and the front view (the front view from the χ direction) can be enlarged, and the first horizontal evacuation holding portion can be enlarged. Construction. Horizontal conveyance 97108014 200902415 The holding portion 120 is provided with a first guide 135 and a second guide 136. The first one has three support member members arranged in parallel in the horizontal direction, and each of the plurality of (for example, five) substrate holding grooves is arranged and formed in the longitudinal direction of each of the support members, the legs, and the (10). . The substrate I is held at a different position along the lower edge of the support structure r-substrate, respectively, along the three substrates facing the length of the support members 135a, 135. The substrate I is used to maintain the vertical posture. The first guide 135 can be configured to hold a plurality of vertical postures. The substrate holding grooves are arranged at one-half intervals (half pitch) of the holding intervals of the bases in the transfer cassette F. Similarly, the second guide 136 There are three support members 136a, 136b, 136c arranged in parallel in the horizontal direction, and the support is at the second 38. A plurality of, for example, 50) substrate holding grooves are arranged on each of the three support members to form respective support members. a: :, the length direction of 136c. The three Veneers are placed along the vertical faces perpendicular to the longitudinal direction of the support members, C, and the cover is formed on the substrate V groove of the support member 136a and the trace 136c, and the substrate is in contact with the vertical posture. (7) Different positions of the lower edge, the substrate W for maintaining the vertical position of 5 hai. In this way, the second guide member can hold the plurality of substrates (8) in a vertical posture together. The substrate holding grooves are arranged at one-half intervals (half pitch) of the holding intervals of the substrates W in the transfer cassette F. The support member 136c of the soil second guide 136 is directly mounted on the second guide 97108014 45 200902415. The other two support members 136a, 136b are supported by the sub guide base 139, which is supported by the sub guide base 139. The second guide base 138 is supported via the support shaft 14A. The second guiding base 138 is located below the i-th guiding base 137, and the supporting pumping 140 is inserted in the first! The insertion hole ' of the guide base 137 reaches the second guide base 138. At the 2nd ‘pushing pedestal! There are 2 linear pumping coffees bUSh) 145, 146 fixed under 38. When a linear bearing 145 is inserted through, there is a rotation by 147' inserted in the other-linear bearing 146. The upper ends of the rotating shaft m^shaft 148 are fixed to the first guiding base i37. The rotation axis 147 and the shaft 148 are guided in the Z direction by the linearity *J45, 146. By the HI: the guiding base 137 can lower the second guiding base 13 in the two directions. In other words, when the first guide 135 is rotated to the second guide 147 with respect to the second guide, the surface mount 137 is rotated about the rotary vehicle 147 by the rotation of the first guide 135. 46 and shaft 148 are transmitted to the second guide base 138. In this way, the brother 1 and the second guides 135 and 136 are rotated in conjunction. On the other hand, the first guide 135 relatively moves up and down with respect to the second guide 136, and is in the upper support state (the state of FIG. 15 is the first 3 = disposed above the substrate support position of the second guide 136). Figure 16, the substrate support of the second guide 136

=置配置在第1導件135之基板支持位置之上方)U 換。利用jf锸士念, 叮灿置 < 上万）之間變 第1支#^2 ’可以在支持未處理基板w時依 :支=:第1導件135支持基板…-方面’ 過基板W依第2支持狀態利用第2導件136 97108014 46 200902415 支持基板w。 另外’經由使第i和第2莲 平旋轉（例如90度），而 、136圍繞鉛直軸水 ., 而了在移載機構5上基板& 方向和主搬運機構3上基板w之排列方向之;板=列 排列方向。另外，可進行在從移 文換基板 25片基板f後，使第〗 收取保持例如 第1水平搬運保持部12 〇 (導件彳 136)圍繞鉛直軸水平旋 丨扣、 外25片基板W之動作。在此錄^更從移載機構5收取另 之構成基板W和後來π H夕|此被 片基板群 同之方h 板群之構成基板W互不相 120在^、、，人^平方向璺層而保持在水平搬運保持部 板w所广F因為對齊裝置形成面之方向保持多個基 板w，所以水平搬運保持部12G上之5Q片基板w鄰接， 但使裝置形成面間或非裝置形成面間對向保持。 圖^是立體圖，用來說明第丨水平搬運保持部12〇之 水平旋轉和第1導引基座137之升降用之構造，圖18為 其側視圖。在本體部121内收容有：㈣旋轉馬達15〇， 作為用以使旋轉軸147旋轉之水平旋轉機構；和氣缸 ，作為使該導引旋轉馬達150上下作移動之導引升降 機構。在本體部121之内壁配置有沿z方向之直線導件 152，沿該直線導件152，使導引單元153可在z方向移 動。在該導引單元153安裝有導引旋轉馬達15〇，旋轉轴 I47插穿導引單元153。另外一方面，在本體部i21之上 面安裝有輛承154(圖18中省略），對本體部121可圍繞 銘直軸旋轉，同時被旋轉轴147插穿。在該軸承154之旋 97108014 47 200902415 承146。則此種構造，經由驅動氣缸 151 了使導引旋轉馬達15〇和旋轉轴147上 此：方式’可使第1導件135”2導件136升降用 2由驅動導引旋轉料15G使旋轉軸丨 搬運保持部120水平旋轉。 胃了使水千 [第2水平搬運機構之構造] 圖19是立體圖，用來說明笛 構水平搬運機構6類似之 直姿勢 之肤能下^ 本體邛U卜以可圍繞鉛直軸旋轉 載搬運保持部⑽;旋轉基請，搭 2该本體部⑴，·移動基座163，支持該旋轉基座 軸旋轉’·和水平驅動機構165’用來使 :丄163沿X方向水平移動。本體部161具有沿z Γ6〇二狀形態’在其上端部安裝有水平搬運保持部 ，/、下知部被固定在旋轉基座162。 弓機構165具備有一對之直線導件166，用來導 -：部：：，63」“方向之水平移動。在直線導件166之 圖亍；於—對直線導件166間，配置有隨動滑輪(未 ::)6之:直線導請之另一端部側方，於一對直線導 有水平搬，軍：己置有驅動滑輪168。在驅動滑輪168結合 ^ I千搬運馬遠丨7 η 168之間，丄二 隨動滑輪和驅動滑輪 張掛有皮帶（具有齒之皮帶）169，因此，皮帶 97108014 48 200902415 169在一對直線導件166之間具有在χ方向延伸之直線 邛。在該皮帶16 9之直線部結合有被固定在移動基座^ 3 之皮帶按壓件171。利用此種構造，經由驅動水平搬運馬 達170使其正轉/逆轉，可使移動基座163沿χ方向直線 移動，因此可使第2水平搬運保持部16〇沿χ方向直線移 動。 旋轉基座162被安裝在移動基座163成為可以圍繞鉛直 軸線172旋轉。在移動基座163固定有旋轉馬達164，該 旋轉馬達164之旋轉軸結合在旋轉基座162。利用此種構 ，，經由驅動旋轉馬達164,可與旋轉基座162 —起，使 第2水平搬運保持部16〇圍繞鉛直軸線172旋轉。旋轉基 座162形成大致l字形，在偏離鉛直轴線172之位置處搭 載本體部16卜因此，利用旋轉基座162之旋轉，可使水 平搬運保持部160在俯視下成為直線導件166之一侧和另 外一側之間移動。 圖2〇是立體圖，用來表示第2水平搬運保持部16〇位 於基板處理裝置1G之前面側1Ga時之情況。直線導件⑽ 被配置在較該直線導件126#基板處縣置10之前面⑽ 側丄成為與第1水平搬運機構6之直線導件126平行。當 ，第2水平搬運保持部⑽#直線導件166成為位於基^ 置1〇之前面们〇a時’第2水平搬運保持部160 在對弟2基板交接位置p2為在χ方向對向之狀能下，可 沿χ方向，動，可移動至第2基板交接位置ρ2。 圖21疋立體圖’用來表示第2水平搬運保持部160對 97108014 49 200902415 直線導件166成為位於基板處理部2側時 部160在對移載位置P3成為X方:= placed above the substrate support position of the first guide 135) U change. By using jf gentleman's mind, 叮 置 & 上 上 # # # # # ^ ^ ^ 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持 支持W supports the substrate w by the second guide 136 97108014 46 200902415 in the second support state. In addition, by rotating the i-th and the second lotus (for example, 90 degrees), 136 surrounds the vertical axis water, and the substrate & direction on the transfer mechanism 5 and the arrangement direction of the substrate w on the main transport mechanism 3 ; board = column arrangement direction. In addition, after the substrate f is replaced by the substrate 25, the first horizontal conveyance holding portion 12 〇 (the guide 彳 136) can be horizontally rotated around the vertical axis, and the outer 25 substrates W can be held. action. In this case, the transfer substrate 5 is charged with another constituent substrate W and later π H | 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 构成 构成 构成 构成 构成 构成 构成 构成 构成The 璺 layer is held in the horizontal conveyance holding portion plate w. Since the plurality of substrates w are held in the direction in which the aligning device is formed, the 5Q substrate w on the horizontal conveyance holding portion 12G is adjacent to each other, but the device is formed between the surfaces or the non-devices. Form the face to face to maintain. Fig. 18 is a perspective view for explaining the horizontal rotation of the second horizontal conveyance holding portion 12 and the structure for lifting and lowering the first guide base 137, and Fig. 18 is a side view thereof. The main body portion 121 houses (4) a rotary motor 15A as a horizontal rotation mechanism for rotating the rotary shaft 147, and a cylinder as a guide lift mechanism for moving the guide rotary motor 150 up and down. A linear guide 152 in the z direction is disposed on the inner wall of the body portion 121, along which the guide unit 153 is movable in the z direction. A guide rotation motor 15A is attached to the guide unit 153, and the rotation shaft I47 is inserted through the guide unit 153. On the other hand, a carrier 154 (omitted in Fig. 18) is mounted on the upper surface of the main body portion i21, and the main body portion 121 is rotatable about the straight axis while being inserted through the rotating shaft 147. The bearing 154 is circulated 97108014 47 200902415. Then, in such a configuration, the guide rotary motor 15A and the rotary shaft 147 are driven via the drive cylinder 151: the mode "can be used to lift and lower the first guide 135"2 guide member 136 by the drive guide rotary material 15G. The shaft conveyance holding portion 120 is horizontally rotated. The stomach is made of water [The structure of the second horizontal conveyance mechanism] Fig. 19 is a perspective view for explaining the shape of the straight posture of the flute horizontal conveyance mechanism 6 The carrier holding portion (10) is rotatable about a vertical axis; the rotating base is provided, the body portion (1) is moved, and the rotating base 163 is supported to support the rotating base shaft rotation '· and the horizontal driving mechanism 165' is used to: 丄163 The main body portion 161 has a horizontal conveyance holding portion attached to the upper end portion thereof, and the lower portion is fixed to the rotary base 162. The bow mechanism 165 is provided with a pair of straight lines. The guide member 166 is used to guide the -:::, 63" "horizontal movement of the direction. In the figure of the linear guide 166; between the linear guide 166, the follower pulley (not::) 6 : The other side of the straight line guide is horizontally moved on a pair of straight lines. Army: There is a drive pulley 168. Between the drive pulley 168 and the ^1 thousand transport horses 丨7 η 168, the second follower pulley and the drive pulley are hanged with a belt (belt with teeth) 169, therefore, the belt 97108014 48 200902415 169 has a straight line 延伸 extending in the χ direction between the pair of linear guides 166. A belt pressing member 171 fixed to the moving base 3 is coupled to the straight portion of the belt 169. With this configuration, the drive is performed. The horizontal conveyance motor 170 is rotated forward/reversely, and the movement base 163 can be linearly moved in the z-direction. Therefore, the second horizontal conveyance holding portion 16 can be linearly moved in the z-direction. The rotary base 162 is mounted on the moving base. 163 is rotatable about a vertical axis 172. A rotating motor 164 is fixed to the moving base 163, and a rotating shaft of the rotating motor 164 is coupled to the rotating base 162. With this configuration, the rotating motor 164 can be used to rotate the base. The seat 162 is rotated to rotate the second horizontal conveyance holding portion 16 around the vertical axis 172. The rotary base 162 is formed in a substantially l-shape, and the body portion 16 is mounted at a position deviated from the vertical axis 172. Thus, by the rotation of the spin base 162, the horizontal conveyance holding portion 160 can be moved between one side and the other side of the linear guide 166 in plan view. Fig. 2A is a perspective view showing the second horizontal conveyance and retention. The portion 16 is located at the front surface side 1Ga of the substrate processing apparatus 1G. The linear guide (10) is disposed on the side of the linear guide 126# substrate before the county 10 (10) side becomes the line with the first horizontal transport mechanism 6 The guides 126 are parallel. When the second horizontal conveyance holding portion (10) # linear guide 166 is located before the base 1 〇 a, the second horizontal conveyance holding portion 160 is at the second substrate transfer position p2. When the χ direction is opposite to the direction, it can move in the χ direction and move to the second substrate transfer position ρ2. Fig. 21 is a perspective view showing a second horizontal conveyance holding unit 160. 97108014 49 200902415 When the linear guide 166 is positioned on the substrate processing unit 2 side, the portion 160 becomes the X side at the transfer position P3:

It二:方向移動，可移動至移載位置P3。 因此，第2水平搬運保持部16〇可進 及，直軸線丨72之旋轉移動，利用此種二= 絲2接位置P2和移載位置P3之間_起水平搬運多片 、另外，第2水平搬運制7之細部構造係與第 運機構β相同，以下視需要亦將 γ 說明有關之附加在圖面之元件;號:1 用水:第之 機構7之說明。 。使用在弟2水平搬運 [弟2水+料冑料缝職叙 :是圖解圖’用來表示在第2交接位置接 機造。在第2交接位置Ρ2設有構成仲介 :="中介機器人175和第2仲介機器 门機态人176 —起收取來自第1仲 1 仲 姿勢在X方向疊層之多片(例如50片機):：175::垂直 構3進行-起收取來自第2仲介機器==運： 在X方向豐層之多片基板Ψ之動作。 *安 第圖 體：’用來表示第1仲介機器人175之構造。 m、175包含有：形成軸狀之-對支持導件 支持該支持導件177之導引支持部m、在 97108014 50 200902415 定有該導引支持部178之本體部179、和用來使該本體部 I79上下移動之致動器180。一對支持導件177具有比水 平搬運保持部160大且比基板W之直徑小的間隔在γ方向 對向，在5亥等間可一起保持垂直姿勢之多片（例如5〇片） 土板W本體部179形成在鉛直方向延伸。致動器1以 馬達181作為驅動源來使本體部179上下作動。利用此種 構造，可一起從下撈起收取以垂直姿勢保持在第2水平搬 運保持部1 60之多片基板w。 圖24疋立體圖，用來表示第2仲介機器人176之構造。 第2仲介機器人176包含有：―對支持導件183、支持該 1支持導件183之導引支持部184、在上端固定有該導 支持σ|Μ 84之本體部1 85、和用來使該本體# 185上下 二動之致動器186。—對之支持導件183㈣等之間可一 寺垂直姿勢之多片（例如5〇片）之基板本體部185 =二錯直方向延伸。致動器186以馬達18 使本體部185上下作動。剎田沐蚀姐j m胸、 持來自第1仲介機器人175之垂直 叉 其交接給主搬運機構3。 土板w，將 在本體部185之上端部亦可搭载基板 以代替支持導件183。^ 钾歹i機構，用 在半導雕曰圓夕植广土板方位排列機構，例如經由形成 ί : : : Γ在二，等)之方向對齊，而排列多片A 板之方位(在丰體晶圓情況時為結晶方位)。經由且 1仲介機器人Π5和第2仲介機器人i76兩者由弟 備有基板方位排列機構之情況和未具備之任一情況:在： 97108014 200902415 不需要大幅變更構造，可以在第？ 板之交接動作。 纟第2 乂接位置進行基 [基板處理裝置之動作] 其次，說明基板處理裝置1 〇之動作。 該動作之實現是藉由控制器9控制基板 運機構3、搬入/搬出機構4、移 σ 、主搬 機構6、第2搬運機構7和央盤洗載爭 及第1和第2水平搬運機構Η之移载控制單元^5 又具有控制主搬運機構3之動作的搬運控==之=施， [未處理基板W從傳送搬出] 工]早兀之功能。 處盒保持部1保持有收容多片(例如25片）之未 傳送：F内之Λ送盒F時’搬入/搬出機構4 -起搬出在 Γ。更姿勢在ζ方向疊層之多片未處理基ί F之蓋子。的門且ί达盒保持部1配置有用來打開傳送盒 子的開具。在利用該開具打 以感測器確認傳送盒F内之基板冗片數LF之蓋子後， 批手柄40朝傳、英利用手柄進退機構44使成 分別進」:W W方向進出，使多個手柄元件7。 柄元件7。\第二間。此時，成批手柄4〇被控制成使手 鈔_ U之弟1支持面71朝上方之姿勢。 用2方:用^器65使成批手柄4〇上升微小距離。利 方式成抵手柄40將多片未處理基板w同時榜起。 97108014 52 200902415 在該狀態下，剎田# t 盒F退離到姿退機構44使成批手柄⑼從傳送 盒？内之多片基L、。，利用此種方式，—起搬出傳送 [未處理基板w之姿勢變更] 平姿勢内搬出之基板w由成批手柄4G保持在以水 50了而祛车4肖疊層之狀態。藉由從該狀態驅動旋轉馬達 種方式丙支持部41沿著YZ平面旋轉90度。利用此It two: direction movement, can be moved to the transfer position P3. Therefore, the second horizontal conveyance holding portion 16 is movable, and the linear axis 72 is rotated, and the plurality of sheets are horizontally conveyed by the two-wire 2 connection position P2 and the transfer position P3. The detail structure of the horizontal transport system 7 is the same as that of the transport mechanism β, and γ is also referred to as the component attached to the drawing as needed; No.: 1 Water: The description of the mechanism 7 is used. . It is used to convey the level at the 2nd handover position by using the 2nd level of the 2nd transfer. At the 2nd handover position Ρ2, there is a composition intermediary: =" intermediary robot 175 and the second intermediary machine door state person 176 to collect a plurality of pieces (for example, a 50-piece machine) stacked in the X direction from the 1st intermediate 1st position. )::175::Vertical structure 3 is carried out - from the second intermediary machine == transport: The action of the multi-layer substrate in the X direction. *Anthogram: ' is used to indicate the structure of the first intermediary robot 175. m, 175 includes: a shaft forming portion - a guiding support portion m for supporting the guiding member 177, a body portion 179 having the guiding support portion 178 at 97108014 50 200902415, and The body portion I79 moves the actuator 180 up and down. The pair of support guides 177 have a larger interval than the horizontal conveyance holding portion 160 and smaller than the diameter of the substrate W in the γ direction, and a plurality of sheets (for example, 5 〇 pieces) which can maintain a vertical posture together at 5 Hz or the like The W body portion 179 is formed to extend in the vertical direction. The actuator 1 uses the motor 181 as a drive source to move the main body portion 179 up and down. With such a configuration, the plurality of substrates w held in the second horizontal transport holding portion 1 60 in a vertical posture can be collected together from the bottom. Fig. 24 is a perspective view showing the configuration of the second intermediary robot 176. The second intermediary robot 176 includes: a pair of support guides 183, a guide support portion 184 that supports the one support guide 183, a body portion 185 that has the guide support σ|Μ 84 fixed at the upper end, and The body #185 has an actuator 186 that moves up and down. - The substrate body portion 185 of the plurality of sheets (for example, 5 turns) which can be vertically oriented between the support guides 183 (four) and the like can be extended in the wrong direction. The actuator 186 operates the body portion 185 up and down with a motor 18. The brake field is eclipsed by the j m chest, and the vertical fork from the first intermediary robot 175 is handed over to the main transport mechanism 3. In the earth plate w, a substrate may be mounted on the upper end portion of the main body portion 185 instead of the support guide 183. ^ Potassium 歹i mechanism, used in the orientation of the semi-guided engravings, such as the formation of ί : : : Γ in the direction of the second, etc., and the orientation of the multiple A-plates (in Feng In the case of a bulk wafer, it is a crystal orientation). In the case where both the intermediary robot Π5 and the second intermediary robot i76 are provided with the substrate orientation alignment mechanism and none of the cases are provided: 9797014 200902415 It is not necessary to significantly change the structure, and can be in the first place. The handover of the board.纟The second splicing position is performed. [Operation of the substrate processing apparatus] Next, the operation of the substrate processing apparatus 1 will be described. This operation is realized by the controller 9 controlling the substrate transport mechanism 3, the loading/unloading mechanism 4, the shift σ, the main transport mechanism 6, the second transport mechanism 7, and the central disk wash to compete with the first and second horizontal transport mechanisms. The transfer control unit ^5 further has a function of controlling the operation of the main transport mechanism 3, the transfer control, the unprocessed substrate W, and the unloaded substrate W. When the cassette holding unit 1 holds a plurality of sheets (for example, 25 sheets) that are not transported: the cassette F in the F is carried out, the loading/unloading mechanism 4 is carried out. More than one cover of the unprocessed base 叠层 F stacked in the ζ direction. The door and the utmost box holding portion 1 are provided with an opening for opening the transfer case. After the cover is used to confirm the number of the substrate redundancy LF in the transport cassette F by the sensor, the batch handle 40 is moved forward and backward by the handle advance and retract mechanism 44 to enter and exit in the WW direction to make the plurality of handles Element 7. Handle element 7. \Second room. At this time, the batch handle 4 is controlled so that the supporter 71 of the banknote _ U supports the face 71 upward. Use 2 squares: Use the device 65 to raise the batch handle 4〇 by a small distance. The method is to form a plurality of unprocessed substrates w at the same time as the handle 40. 97108014 52 200902415 In this state, the brake field #t box F retreats to the posture retracting mechanism 44 to make the batch handle (9) from the transfer box? The multiple bases L,. In this way, the transport is carried out. [The posture of the unprocessed substrate w is changed.] The substrate w carried out in the flat posture is held by the batch handle 4G in a state where the water is 50 and the brakes 4 are stacked. By driving the rotary motor from this state, the C support portion 41 is rotated by 90 degrees along the YZ plane. Use this

元/7η手柄4G成為使支持導件8Q成為下方，手柄 ::7〇之前端朝向上方。其結果是多片基板w變換姿勢 多二ϋ勢在γ方向疊層之狀態。經該姿勢變換，將 土板W導引至移載位置ρ3 〇 ^勢變換前，支持導件㈣湘導引驅動機構⑽，押 未處理基板w保持用之第1基板保持溝88A，使其位於 各手柄π件7G之基板保持位置之後方。然後，導弓^進退 機構87使支持導件8G朝向手柄元件冗之前端側前進。 利用此種方式’在支持導件8G和手柄元件7Q之前端之第 1導引犬起部75之間夾持基板w。在此種狀態下進行上述 姿勢變換動作。在姿勢變換結束後，導5丨進退機構们使 支持導件80後退微小距離到達手柄元件7〇之後方，解除 基板W之夾持。依照此種方式，利用支持導件8〇之基板 保持溝88,使基板W成為以垂直姿勢保持之狀態。此時， 因為基板w由重力被按壓到基板保持溝88，所以可同時 達成基板W之排列。 ' [未處理基板移載動作] 97108014 53 200902415 在利用搬入/搬出機構4之姿勢變換動作之期間，移 機構5使支持導引轴91等待在手柄支持部41之_^方之下 方位置處。此時’導引轉動機構105控制支持導引軸Μ 之轉動位置’使-對支持導引軸91之第i抵接部ιΐ3間 對向。 ，勢變換動作結束，解除基板W之夾持時，利用致動 器95使支持導引軸91上升到成批手柄4〇之上方之上方 (:立置。在該上升之過程，❹片基板w —起從成批手柄 移載至支持導引軸91。手柄支持部41之χ方向寬产小 =一對支持導引轴91之間之間隔。因此，在支持導^轴 91之上升時，不會有產生與手柄支持部41干涉之虞。 在基板w移載後，搬入/搬出機構4驅動旋轉馬達5〇, 使成批手柄40回到朝向傳送盒保持 成為等待狀態。 U十妥勢，而 第2水平搬運機構7使第2水平搬運 :==Γ3。此時’例如使第1導件135成為位 於第2導件136上方之第】支持狀態。 方：=狀態下，移載機構5使支持導引軸91移動到下 方位置處。在該過程中，φ 91之多片其扨w 彳重直女勢被保持在支持導引軸 适 片基板W’一起被移载至第2水平搬運仵持邱1fin 第2水平搬運保持部_ /十搬運保持#⑽。 件成為>著\ W吏導件135、136之支持構 向疊層之夕片其：之文勢，成為可保持依垂直姿勢在Y方 持部:60:X = W的狀態。此種狀態之第2水平搬運保 之X方向之寬度小於-對支持導引軸91間之間 97108014 54 200902415 隔。因此’在支持導引軸91之下降時，不會有產生與第 2水平搬運保持部160干涉之問題。 在該移載後’移載機構5之導引轉動機構1〇5使一對支 持導引軸91轉動’而使退離部1丨5間對向。在該狀態下， 移載機構5使支持導引軸91上升退離到上方位置處。一 對支持導引軸91之退離部115間之距離，因為比基板w 之直從長，所以支持導引軸91不會干涉到由水平搬運保 持部160所保持之基板w，可退離到上方位置處。’、 在支持導引軸91之退離後，帛2水平搬運機構7使第 2水平搬運保持部160圍繞鉛直軸旋轉，從移載位置 來在水平搬運保持部⑽退離後，移載機構5使 、導引軸91下降到下方位置進行等待。另外，利用導 =動機構1G5控制-對支持導引軸91之轉動位置 弟1抵接部113間對向。 文 [成批組合動作] =平搬運機構7將最初25片之基板"呆 =35之母隔一個之基板保持溝。由 個基板保持溝收取其次25片之基板w，=; 片基板”成之抵。將此稱為成批組合。 攸移载位置P3退離之筮 要由導引旋轉馬達15Gj=水平搬運保持部⑽，視需 另冰 + 力作’進行180度水平旋榦。 面’搬入/搬出機千： 97108014 置η之動作’從被配置在傳送盒保持部= ^ 55 200902415 F —起搬出多片之基板W。然後，與上述情形同樣地，使 該多片基板W從水平姿勢變換姿勢成為垂直姿勢，藉由支 持導件80支持在移載位置p3。 在此種狀態，搬入/搬出機構4利用致動器65與移動基 座6 3 —起地使支持導件8 〇沿著γ方向移動基板ff之保二 間隔之一半距離（半間距）。另外一方面，移載機構5經由 驅動導引移動馬達1〇〇，而使支持導引軸91纟與支持導 件80之移動方向相同方向（γ方向），移動基板？之保持 間隔之一半距離。利用此種方式，支持導件80和支持導 引軸91之基板保持位置排列在垂直方向，且與保持最初 25片基板W時比較下’係沿著γ方向偏移半間距。 由此種狀態下’移載機構5使支持導引軸91上升，將 其導引到上位置。在該過程，支持導引轴91將支持 80上之多片基板w 一起榜起。 平構4使成批手柄40變換姿勢成為水 十安勢’從移載位置Ρ3退離。 在此種狀態下，第2此n、富μ u β . 持部160旋轉移_移載 冑2水平搬運保 -對支持導引二==後:移載機搆5使 持導引軸91保持之2心:方，，。在該過程，被支 運保持部⑽之。=; 交接在第2水平搬 入到已被第2水平搬該25片基板W嗜合進 間’利用此種方式，片基板= 層之狀態下，被伴牲户结0 在Y方向豐 ’、、在第2水平搬運保持部16〇。 97108014 56 200902415 然後’第2水平搬運機構7使第2水平搬運保持部⑽ 圍繞鉛直軸線172旋轉，對向於第2基板交接位置p2， 利用導引旋轉馬達150圍繞旋轉車由147自轉，進而在χ方 向扒平移動，移動到第2基板交接位置p2(參照圖2〇)。 此時’第2水平搬運機構7使第2水平搬運保持部16〇水 平旋轉，成為垂直姿勢之多片基板W在X方向疊層之狀態。 [第2基板交接位置p2之基板交接] 在第2水平搬運機構7之第2水平搬運保持部16〇移動 到第2基板交接位置？2前，第i仲介機器人175使支持 導件Π7在第2水平搬運保持部16〇下方之下方位置進行 等待。在第2水平搬運保持部⑽移動到第2基板交接位 置P2後，第1仲介機器人175使支持導件177上升到比 第2〃水平搬運保持部16〇高之上方位置處。在該過程中， 從第2水平搬運保持部16〇往支持導件177 一起交接依一 半間距疊層之垂直姿勢之多片（50片）基板W。 d後第2水平搬運機構7從第2基板交接位置p2使 第2水平搬運保持部16〇退離，準備好用來收 理基板W。 另外一方面，第！仲介機器人175使支持導件177下降 到在第/仲介機176之支持導# 183下方之下方位 置在遠過程中，從第！仲介機器人i 75往第2仲介機器 176起交接多片（50片）基板。當在第2仲介機器人 ⑺具備有基板方位排列_之情況時，更進行基板方位 排列動作。 97108014 57 200902415 [主搬運機構之動作] 主搬運機構3透過基板夾盤30夾持收取以垂直姿勢保 持在第2仲介機器人176之支持導件183的多片（5〇 “ 未處理基板W。主搬運機構3使基板爽盤3〇上升到高於 處理槽2卜25之位置處，更進-步，沿著γ方向使基板夹 盤30移動到第！藥液槽21或第2藥液槽23，將多片⑼ 片）基板w—起交接在第i升降器27或第2升降器28。 r 然後’利用第1或第2升降器27、28之動作，將多片（5〇 =)基板w -域浸潰到藥液槽2卜23中之藥液，然後浸 續到沖洗液槽22、24中之沖洗液中。在經儲存於第工藥 f槽21之第！藥液的基板處理之後，當更需要經儲存在 ^藥液槽23之第2藥液處理之情況時，或在第2藥液 处理，需要經第1藥液處理之情況時，主搬運機構3在第 和弟2升降器27、28之間一起搬運多片⑸片)基板卜 "X在中二液’曰22、24之沖洗處理後經乾燥處理之基板W， 伽升降器28交接在主搬運機構3，由該主搬運機構3 理二L乾燥處理部25。然後’經乾燥處理部25處理之處 = =W，透過主搬運機構3從乾燥處理部25搬出， 搬運到弟1基板交接位置ρι。 乂主搬運機構3在從乾燥處理部25搬出處理過基板w之 盤洗it到ί盤洗ί早凡8 ’使基板夾盤30插入到該爽 二你之洗淨槽35 ’用來洗淨基板爽盤3G。而且， 水ΐ搬、^過基板1基板交接位置P1交接於第1 ’構6後，不洗淨基板夾盤3〇，在第2基板交 97108014 58 200902415 Γ立置心第2仲介機器人176收取未處理基板W之動 [處理過基板之排出] 第1水平搬運機構6在使第1水平搬運保持邻1?n 第1基板交接位置pi進行等待時(參照圖^ 搬運機構3將被基板夾盤30保持之多片處理 主 起交給第1水平搬運保持部12〇。 化土板W — 收取到處理過基板W之第i水平 平移動’並使第丨水平搬運保持部12二者= 9〇度’配合移载機構5之基板w之保持‘2 ρ3。 第1水千搬運保持部以〇移動到移載位置 運移載機構5使支持導引軸91在第1水平搬 運保持π 120下方之下方位置進行等待。此時，導引轉動 機構1G5控制支持導引軸91之轉動位置，使—對之 導引轴91之第2抵接部114間互相面對。 、 移载機構5利用致動器95使支持導引轴91上升到第工 ^平夕搬運保持部120上方之上方位置處。在該上升過程 中’夕片基板w從第}水平搬運保持部12〇 一起移載到支 持導引轴91。此時，帛丨水平搬運保持部⑽保持著以 半間距在Y方向§層5〇片基板w之狀態，但是一起移載 到支料引軸91之基板W是其中之每隔i片之25片。如 此來由50片基板W構成之成批被解除成為各25片之 基板群。將此稱為成批解除。在成批解除動作之後，第1 97108014 59 200902415 =搬運機構6使第1水平搬運保持部120朝向X方向(第 1基板交接位置P1側）退離。 從===在姿勢變換位置使成批手柄⑼ 足欠千文勢變換成為垂直姿勢。利用此種方式， 以垂直姿勢被配置在移载位置P3。這時，成批手柄4〇 先控制成在水平姿勢時使第2支持面72成為上方。 第？其f持導件80被控制成為m祕處理過基板w之 弟2基板保持溝88β位 之後方。當缺，支持導：二㈣70之基板保持位置 軸91之AM姓 基板支持位置和支持導引 土支持位置被控制成俯視下成為一致。The element/7n handle 4G is such that the support guide 8Q is turned downward, and the front end of the handle ::7〇 faces upward. As a result, the plurality of substrates w are in a state in which the postures are stacked in the γ direction. After the posture change, the soil plate W is guided to the transfer position ρ3, and the guide member (4) is guided by the drive mechanism (10), and the first substrate holding groove 88A for holding the unprocessed substrate w is held. It is located behind the substrate holding position of each handle π piece 7G. Then, the guide arch retracting mechanism 87 advances the support guide 8G toward the front end side of the handle member. In this manner, the substrate w is sandwiched between the support guide 8G and the first guide dog portion 75 at the front end of the handle member 7Q. The above-described posture changing operation is performed in this state. After the posture change is completed, the guide roller retracting mechanism causes the support guide 80 to retreat a small distance to reach the handle member 7A, thereby releasing the clamping of the substrate W. In this manner, the substrate holding groove 88 is supported by the support guide 8A so that the substrate W is held in a vertical posture. At this time, since the substrate w is pressed by the gravity to the substrate holding groove 88, the arrangement of the substrates W can be simultaneously achieved. [Unprocessed substrate transfer operation] 97108014 53 200902415 During the posture changing operation by the loading/unloading mechanism 4, the transfer mechanism 5 causes the support guide shaft 91 to wait at a position below the handle support portion 41. At this time, the "guide rotation mechanism 105 controls the rotational position of the support guide shaft ’" to oppose the ith abutment portion ι3 of the support guide shaft 91. When the potential conversion operation is completed and the clamping of the substrate W is released, the support guide shaft 91 is raised above the batch handle 4 by the actuator 95 (: standing. During the ascending process, the slab substrate w is transferred from the batch handle to the support guide shaft 91. The width of the handle support portion 41 is small and small = the interval between the pair of support guide shafts 91. Therefore, when the support guide shaft 91 rises There is no interference with the handle support portion 41. After the substrate w is transferred, the loading/unloading mechanism 4 drives the rotary motor 5〇, and the batch handle 40 is returned to the transfer cassette to be in a waiting state. The second horizontal conveyance mechanism 7 conveys the second horizontal conveyance: ==Γ3. At this time, for example, the first guide 135 is in the first support state above the second guide 136. The carrier mechanism 5 moves the support guide shaft 91 to the lower position. In the process, the plurality of pieces of φ 91 are held by the support guide shaft substrate W' to be transferred to the support guide shaft substrate W'. The second horizontal conveyance holding Qiu 1fin 2nd horizontal conveyance holding part _ / 10 handling and holding # (10). The piece becomes > The guiding members 135, 136 support the constituting of the laminated sheet, which is the state in which the vertical position can be maintained in the Y-side holding portion: 60: X = W. The second level of transportation in this state is maintained. The width in the X direction is smaller than - the support between the guide shafts 91 is 97108014 54 200902415. Therefore, when the support guide shaft 91 is lowered, there is no problem of interference with the second horizontal conveyance holding portion 160. After the transfer, the guide rotating mechanism 1〇5 of the transfer mechanism 5 rotates the pair of support guide shafts 91 to align the retreat portions 1丨5. In this state, the transfer mechanism 5 supports the guide. The lead shaft 91 rises and retreats to the upper position. The distance between the pair of the retracting portions 115 supporting the guide shaft 91 is longer than the straight length of the substrate w, so that the support guide shaft 91 does not interfere with being held by the horizontal conveyance. The substrate w held by the portion 160 can be retracted to the upper position. ' After the support guide shaft 91 is retracted, the 帛2 horizontal transport mechanism 7 rotates the second horizontal transport holding portion 160 around the vertical axis. After the carrying position is retracted from the horizontal conveyance holding portion (10), the transfer mechanism 5 lowers the guide shaft 91 to the lower side. In addition, it is controlled by the guide mechanism 1G5 - the rotation position of the support guide shaft 91 is opposed to the abutment portion 113. [Batch combination operation] = the flat transport mechanism 7 will be the first 25 pieces The substrate "stay = 35 mother is separated by a substrate to maintain the groove. The substrate holding groove is used to collect the next 25 pieces of substrate w, =; the substrate is formed. This is called a batch combination. 攸 Transfer position P3 After the retreat, the guide rotation motor 15Gj=horizontal conveyance holding unit (10), if necessary, another ice + force for '180 degree horizontal rotation. Surface 'loading/unloading machine thousand: 97108014 η action 'from being configured Transfer box holding portion = ^ 55 200902415 F - Take out a plurality of substrates W. Then, similarly to the above, the multi-piece substrate W is changed from the horizontal posture to the vertical posture, and is supported by the transfer guide 80 at the transfer position p3. In this state, the loading/unloading mechanism 4 moves the support guide 8 — by one half distance (half pitch) of the holding interval of the substrate ff in the γ direction by the actuator 65 together with the moving base 63. On the other hand, the transfer mechanism 5 guides the movement motor 1 经由 to move the substrate in the same direction (γ direction) as the support guide shaft 91 纟 and the movement direction of the support guide 80. One hundred and a half distances of the interval. In this manner, the substrate holding positions of the support guide 80 and the support guide shaft 91 are arranged in the vertical direction, and the lower portion is shifted by the half pitch in the γ direction as compared with the case where the first 25 substrates W are held. In this state, the transfer mechanism 5 raises the support guide shaft 91 to guide it to the upper position. In this process, the support guide shaft 91 will stand up together with the plurality of substrates w on the support 80. The flat structure 4 causes the batch handle 40 to change its posture into water ten amperage 'retracted from the transfer position Ρ3. In this state, the second n, the rich μ β β. The rotation of the holding portion 160 _ transfer 胄 2 horizontal transport guarantee - the support guide two = = after: the transfer mechanism 5 holds the guide shaft 91 to maintain 2 hearts: square,,. In this process, the holding unit (10) is carried out. =; The transfer is carried out at the second level until the second substrate has been moved by the second level. In this way, in the state of the substrate = layer, the associated animal is 0 in the Y direction. The conveyance unit 16 is conveyed at the second level. 97108014 56 200902415 Then, the second horizontal conveyance mechanism 7 rotates the second horizontal conveyance holding portion (10) around the vertical axis 172, and is rotated by the guide rotating motor 150 around the rotating vehicle by the guide rotating motor 150, and further The χ direction moves flat and moves to the second substrate transfer position p2 (see FIG. 2A). At this time, the second horizontal conveyance mechanism 7 rotates the second horizontal conveyance holding portion 16 horizontally, and the plurality of substrates W in the vertical posture are stacked in the X direction. [Substrate delivery at the second substrate transfer position p2] The second horizontal transfer holding portion 16 of the second horizontal transfer mechanism 7 moves to the second substrate transfer position. Before the second stage, the i-th robot 175 waits for the support guide Π7 to be positioned below the second horizontal conveyance holding portion 16A. After the second horizontal conveyance holding portion (10) has moved to the second substrate transfer position P2, the first intermediary robot 175 raises the support guide 177 to a position higher than the second horizontal conveyance holding portion 16A. In this process, a plurality of (50) substrates W which are vertically stacked in a half pitch are transferred from the second horizontal conveyance holding portion 16 to the support guide 177. After d, the second horizontal conveyance mechanism 7 retracts the second horizontal conveyance holding portion 16 from the second substrate transfer position p2, and is prepared to receive the substrate W. On the other hand, the first! The intermediary robot 175 lowers the support guide 177 to the lower position below the support guide # 183 of the second/intermediate machine 176. In the far process, from the first! The intermediary robot i 75 transfers a plurality of (50) substrates to the second intermediary machine 176. When the second intermediary robot (7) is provided with the substrate orientation arrangement _, the substrate orientation alignment operation is further performed. 97108014 57 200902415 [Operation of main transport mechanism] The main transport mechanism 3 grips and receives a plurality of sheets (5" of unsupported substrates W held by the second guide robot 176 in a vertical posture through the substrate chuck 30. The transport mechanism 3 raises the substrate tray 3 to a position higher than the processing tank 2, and further moves the substrate chuck 30 to the second solution tank 21 or the second liquid tank along the γ direction. 23, a plurality of (9) pieces of the substrate w are transferred to the i-th lifter 27 or the second lifter 28. r Then 'using the action of the first or second lifter 27, 28, multiple pieces (5 〇 = The substrate w-domain is immersed in the liquid medicine in the liquid medicine tank 2, and then immersed in the rinsing liquid in the rinsing liquid tanks 22, 24. The liquid medicine stored in the first medicine f-slot 21 After the substrate processing, when it is more necessary to process the second chemical solution stored in the chemical solution tank 23, or when the second chemical liquid treatment is required to be treated by the first chemical liquid, the main transport mechanism 3 is The first and second brothers 27 and 28 are transported together with a plurality of (5) sheets of substrate. The substrate is dried after the rinsing treatment of the two liquids 曰22, 24. The plate W and the hoisting lifter 28 are transferred to the main transport mechanism 3, and the main transport mechanism 3 controls the L drying processing unit 25. Then, the portion processed by the drying processing unit 25 ==W, and is dried by the main transport mechanism 3 The portion 25 is carried out and transported to the first substrate transfer position ρι. The main transport mechanism 3 carries out the disk wash from the drying process unit 25 to the substrate w, and then inserts the substrate chuck 30 into the disk holder 30. Shuang 2, your cleaning tank 35 ' is used to clean the substrate slab 3G. Moreover, after the shovel is transferred to the substrate 1 and the substrate transfer position P1 is transferred to the first '6', the substrate chuck 3 is not washed. In the second substrate, the intersection of the second substrate is 97108014 58 200902415. The second intermediate robot 176 receives the movement of the unprocessed substrate W. [The discharge of the processed substrate] The first horizontal conveyance mechanism 6 holds the first horizontal conveyance adjacent to the first 1 n. When the substrate transfer position pi is waited (refer to FIG. 2, the transport mechanism 3 lifts the multi-piece process main held by the substrate chuck 30 to the first horizontal transport holding unit 12A. The slab W is collected to the processed substrate W. The i-th horizontal movement 'and the second horizontal conveyance holding portion 12 both = 9 degrees 'coordinated shift The substrate w of the carrier mechanism 5 is held at '2 ρ3. The first water transporting and holding unit moves to the transfer position to transport the transport mechanism 5 so that the support guide shaft 91 is held below the first horizontal conveyance π 120. At this time, the guiding and rotating mechanism 1G5 controls the rotational position of the supporting guide shaft 91 so that the second abutting portions 114 of the guiding shaft 91 face each other. The transfer mechanism 5 utilizes the actuator 95. The support guide shaft 91 is raised to a position above the upper portion of the work conveyance holding portion 120. During this ascending process, the wafer substrate w is transferred from the first horizontal conveyance holding portion 12A to the support guide shaft 91. At this time, the horizontal conveyance holding portion (10) maintains the state of the wafer substrate w at a half pitch in the Y direction, but the substrate W transferred to the support shaft 91 together is 25 of each of the i pieces. sheet. Thus, a batch of 50 substrates W is released into a group of 25 substrates. This is called batch release. After the batch release operation, the 1970108014 59 200902415 = transport mechanism 6 retracts the first horizontal transport holding portion 120 in the X direction (the first substrate delivery position P1 side). From the === position change position, the batch handle (9) is transformed into a vertical posture. In this way, it is placed at the transfer position P3 in a vertical posture. At this time, the batch handle 4 is first controlled so that the second support surface 72 is raised upward in the horizontal posture. The first? The f holding guide 80 is controlled so that the substrate 2 is treated as the substrate w and the substrate holding groove 88? When missing, support guide: two (four) 70 substrate holding position Axis 91 AM name Base support position and support guide The soil support position is controlled to be uniform in plan view.

在此種狀態下，移載機才盖R 置:降到手柄支持部41下方之下方:置處位 =了片（25片）基板w從支持導引軸91 ―起交、給支持導件 8 01 ’搬：/搬出機構4之導引進退機構8 7使支持導件 。1用此種方式，在支持導件 =…導引突起部76之間夹持基板w。在：二7: 驅動;ί疋轉馬達5 〇，# a 月心 平姿勢。如此—步柄4〇從垂直姿勢旋轉成為水 Λ ，25片基板W從垂直姿勢變換姿勢成 二在姿勢變換結束後’導引進退機構打使支 w之夾持/退锨小距離到手柄元件70後方，而解除基板 方向前進。出此機二4自更朝向傳送盒F使成批手柄4°沿著Υ 寺則自動傳送盒搬運裝置11將欲收容處理 97108014 200902415 =二板W之工傳运盒F配置在傳送盒保持部卜 40在進入到傳-各p 取批乎柄 H… 後，利用致動器65之動作，下 同又。利用此種方式，在形成於傳送盒F 基板保持架，分別收容基板w。 夕 到傳送盒F外，準備好㈣立/ 手柄4〇後退 早備好收取其次之25片基板w。 在移載位置P3，等待移載機構5使 120再度進入移載位晉 、上α士 , 、 ^ Q1 ^ 戰置P3。廷時，移载機構5使支持導与丨 軸91在Y方向移動半間距，以使第 2持導引 所保持之並餘25 #搬運保持部120 :餘25片基板w之位置和基板支持 另外’與其對應地，搬入/搬屮嬙搂Z+ 置正σ 動基座6 3 一起在Υ ==機構4使支持導件8 °和移 I仕Υ方向移動半間距。 =第1水平搬運保持部12G再度進人 態下’移載機構5使支持導引軸91 之狀 :持她之上方之上方位置。在該過== 1.. ^運保持部120保持之25片基板w 一起交給支持㈣軸 12。從移載:置P3==機：6:第1水平搬運保持部 4〇從水平姿勢變換/I:，搬出機構4使成批 置p3。從此種狀能為垂直姿勢，將其導人移載位 <此種狀心，移載機構5使支 手柄支持部41下 夺引㈣下降到 引軸91將25另其士 置處。在該過程中從支持導 導件^將w基板w—起交給成批手柄4Q下方之支持 97108014 61 200902415 然後，搬入/搬出機構4之導引進退機構87使支持導件 =珂進。利用此種方式，在支持導件80和手柄元件70 别端之第2導引突起部76之間夾持基板W。在此狀態下， 驅，旋轉馬達5G ’使成批手柄從垂直姿勢旋轉成為水 平姿勢。如此一來，25片基板w從垂直姿勢變換姿勢成 為水平安勢。在姿勢變換結束後，導引進退機構87使支 持導件80後退微小距離到手柄元件7〇之後方，而解除基 板W之夾持。 搬入/搬出機構4更朝向傳送盒F使成批手柄4G沿著γ 方向前進。此時前自動傳送盒搬運裝i 11將欲收容處理 過基板W之空傳送盒F配置在傳送盒保持部卜成批手柄 40在進人到傳送盒F内之後，下降微小高度。利用此種 :二在形成於傳送盒F内之多個基板保持架，分別 基板W。 [第2實施形態] 卢】二是，圖，用來表示本發明另-實施形態之基板 :人二2“。圖26是圖解式之立體圖’用來表示傳 运益和父接位置之間之構造。 位ΐΐι:第乂實施形態令’主搬運機構3在第1基板交接 處理過基板w交給第〗水平搬運機構6，在第2 理基板^對此平運機構7搬運之未處 將第2皮 貝⑪夕心之基板處理裝置200尹， ，水平搬㈣ί機構7省略’只設置—個水平搬運機構6。 該水千搬運_6_進行之動作是在基板錢位£ρί 97108014 62 200902415 將未處理基板W交給主搬運機構3，相同地在基板交接位 置P1收取來自主搬運機構3之處理過基板w。另外，水 平搬運機構6除了成批解除動作外，亦進行在上述之第i 貫施形態中之第2水平搬運機構7所進行之成批組合動 作。 水平搬運機構6在保持未處理基板ψ時，使第1導件 135之基板保持位置高於第2導件丨36之基板保持位置， 在該第1導件135保持未處理基板¥。另外，水平搬運機 構6在保持處理過基板w時，使第丨導件135之基板保持 位置低於第2導件136之基板保持位置，在第2導件j 36 保持處理過基板W。 在上述第1實施形態與第2基板交接位置P2對應之位 置P4，亦可配置基板方位排列機構。在此種情況，主搬 運機構3在基板交接位置P1從第丨水平搬運機構6收取 未處理基板W彳4 ’在位置P4之基板方位排列機構交接該 未處理基板W。然;後，在基板方位排列動作後，主搬運機 構3從基板方位排列機構收取基板w，將其搬運到基 理部2。 [其他之實施形態] 在第1實施形態中，第！和第2水平搬運機構6、7且 備有第1和第2導件135、136，具備有用來變換該等^ 。但是’在第1實施形態之動作中’因為第1水平搬 ^構6專Η用來保持搬運處理過基板w，第2水平搬運 構7專門用來保持和搬運未處理基板W，所以不需要設 97108014 63 200902415 置一個基板保持導件和其變換用之構造，只要具倩常用之 -個基板保持導件即可。然而，為提高基板搬運速度，亦 可以使第1和第2水平搬運機構6、7之任—進行處理過 基板W和未處理基板w任一者之搬運動作。在此種情況， :利用處理過基板W和未處理基板w切換使用第丨和第2導 件135、136，可抑制或防止異物轉移到處理過基板w。 另外，在上述第1實施形態中是為了第2水平搬運機構 广Μ口主搬運機構3間之基板交接’而具備有第i和第2仲 ”機器人175、176，但是，亦可以將該等省略，使第2 ，平搬運機構6和主搬運機構3直接進行基板交接。但 疋，從可以選擇設定基板方位排列機構且縮短第2水平搬 運機構6之第2基板交接位置p2之等待時間之觀點來 看，最好構成設置有第工和第2仲介機器人175、176。 ^進一步，亦可以使上述第丨實施形態中第丨和第2基 ，乂接位置PI、P2互換，將未處理基板w用之第2基板 (又接位置配置在靠近基板處理部2之側。 另外，在上述之實施形態中，搬入/搬出機構4為成批 組合而使支持導件8〇移動半間距。但是，在將基板⑺交 給移载機構5之後，進行移載機構5之支持導引軸91之 '移動，然後，若從該支持導引軸91將基板ψ交接 :給第2水平搬運機構7，則可進行成批組合。 ，情況亦可同樣進行，所以未需要支持導件8〇之= 移動。 更進步，在上述實施形態中，用以收容基板w之收容 97108014 64 200902415 器是使用以密閉狀態收容基板w之傳送盒（1；'01^ . Opening Unified Pod) ’但是收容器並不只限於傳送盒， 亦可以使用 SMIF(Standard Mechanical inte]r Face)盒， 〇C(Open Cassette)等。 另外，在上述之實施形態中，所示之一實例是基板w使 用如半導體晶圓之圓形基板，但是亦可以如液晶面板用之 方形基板之其他種類之基板作為處理對象。 上面已詳細說明過本發明之實施形態，但是該等只不過 是用來明白本發明之技術内容之具體例，本發明不被解釋 成只限於該等具體例，本發明之精神和範圍只由所附之申 請專利範圍限定。 本申請案對應到2007年3月9日對日本國專利局提出 之日本專利特願2〇〇7_6〇779號和特願删卜⑽78〇號及 ^7年12月12日對日本國專利局提出之特願 7 321 142號，該等申請案之全部揭示經引用編入於此。 【圖式簡單說明】 是圖解式之俯視圖’用來說明本發明之—實施形態 之基板處理裝置之整體構造。 = '是立_，用來擴大表示傳送盒和主搬運機構之間 之基板搬運之有關構造。 圖3是搬入/搬出機構之立體圖。 3 4是立體圖’用來說明成批手柄之旋轉。 勢變更。豆圖，用來說明利用搬入/搬出機構之基板姿 97108014 65 200902415 造圖6是立體圖，用來說明使成批手柄上下移動用之構 體圖’用來說明成批手柄和與其相關之構造。 圖8疋圖解圖，用來說明手柄元件和支持導件 。 圖9是立體圖，用來說明移載機構之構造。 以 造圖1〇是立體圖’用來表示使支持導引軸上下移動之構 < 圖η疋立體圖，用來表示使支持導引軸 〔移動用之構造。 …I軸在軸方向水平 圖12是用以說明支持導引站拔 狀態）。 科引軸構造之俯視圖（基板支持 圖13疋用以於况明支持導^丨* 過狀態）。 {持^引軸構造之俯視圖（基板通 圖14是立體圖，用來說明第！水平搬運機構之構造。 圖15是前視圖，用來擴大表示水平搬運保持部之構造。 圖16是前視圖，用來擴大表示水平搬運保持部之構造。 圖17是立體圖，用决# ^Τ1Α 用來5兄明水平搬運保持部之水平旋轉 和弟1V引基座之升降用之構造。 圖18是側視圖’用來說 和第工導引基座之升降用之^造t搬運保持部之水平旋轉 圖19是立體圖’用來說明第2水平搬運機構之構造。 圖20是立體圖，用央矣—卜^ p ^ ^ ^ ^ + 末表不水平搬運保持部位於基板處 理裝置之則面側時之情況。 圖21是立體圖，用步主_ f 用末表不水平搬運保持部對直線導件 97108014 66 200902415 成為位於基板處理部側時之情況。 圖22是圖解圖，用來表千太货 水衣不在弟2交接位置— 板之相關構造。 直起父接基 圖23疋立體圖，用來表示第"中介機 圓24是立體圖’用來表示第2::。In this state, the transfer machine is placed on the cover R: it is lowered below the handle support portion 41: the position = the piece (25 pieces) of the substrate w from the support guide shaft 91 - the support guide 8 01 'Move: / Guide to the removal mechanism 4 to introduce the retreat mechanism 8 7 to support the guide. In this manner, the substrate w is sandwiched between the support guides = ... guide projections 76. In: 2:7: drive; 疋 疋 turn motor 5 〇, # a month heart posture. In this way, the step handle 4〇 is rotated from the vertical posture to the water raft, and the 25 substrates W are changed from the vertical posture to the second position. After the posture change is completed, the guide is pushed and pulled to make the support w to hold/retract the small distance to the handle member. 70 rear, while lifting the direction of the substrate. Out of this machine 2 4 from the more toward the transfer box F to make the batch handle 4 ° along the 寺 temple, the automatic transfer box handling device 11 will be accommodated processing 97108014 200902415 = the second board W work transport box F is placed in the transport box holding portion After entering the transmission - each p takes the handle H..., the action of the actuator 65 is used again. In this manner, the substrate holders are formed in the transfer case F, and the substrates w are accommodated. On the evening of the transfer box F, prepare (four) stand / handle 4 〇 back and prepare for the next 25 pieces of substrate w. At the transfer position P3, the transfer mechanism 5 is waited for 120 to enter the transfer position, the upper alpha, and the Q1^ battle P3. At the time of the rotation, the transfer mechanism 5 moves the support guide and the cymbal 91 in the Y direction by a half pitch so that the second holding guide holds the remaining 25 # transport holding portion 120: the position of the remaining 25 substrates w and the substrate support In addition, correspondingly, the loading/removing Z+ is set to the σ moving base 6 3 together with the Υ == mechanism 4 to move the supporting guide 8 ° and the moving direction by a half pitch. = The first horizontal conveyance holding portion 12G is again in the human state. The transfer mechanism 5 is configured to support the guide shaft 91: holding the upper position above her. The 25 substrates W held by the transport holding unit 120 are handed over to the support (four) axis 12 at the same time. Transfer from: P3 == Machine: 6: First horizontal conveyance holding unit 4〇From horizontal posture/I: The carry-out mechanism 4 sets the batch p3. From this state, the vertical position can be guided to the transfer position < such a center, the transfer mechanism 5 causes the support support portion 41 to be lowered (4) down to the guide shaft 91 to place 25 others. In the process, the support substrate ^ is transferred from the w substrate w to the support under the batch handle 4Q. 97108014 61 200902415 Then, the introduction/retraction mechanism 87 of the loading/unloading mechanism 4 causes the support guide to be pushed forward. In this manner, the substrate W is sandwiched between the second guide projections 76 at the ends of the support guide 80 and the handle member 70. In this state, the drive, rotary motor 5G' rotates the batch of handles from a vertical position to a horizontal position. As a result, the 25 substrates w are changed from the vertical posture to the horizontal level. After the posture change is completed, the lead-in and pull-out mechanism 87 causes the support guide 80 to retreat a small distance to the rear of the handle member 7 to release the holding of the substrate W. The loading/unloading mechanism 4 advances the batch handle 4G in the γ direction toward the transport cassette F. At this time, the front automatic transfer cassette transporting unit 11 arranges the empty transport cassette F for accommodating the processed substrate W in the transport cassette holding portion, and the batch handle 40 is lowered to a minute height after entering the transport box F. This is used to: a plurality of substrate holders formed in the transfer case F, respectively, a substrate W. [Second Embodiment] Lu is a diagram for showing a substrate of another embodiment of the present invention: a human 2". Fig. 26 is a perspective view of a schematic diagram for indicating between a transfer benefit and a parent position. In the first embodiment, the main transport mechanism 3 delivers the substrate w to the first horizontal transport mechanism 6 on the first substrate, and the second transport substrate is transported to the flat transport mechanism 7 The 2nd Pibe 11th substrate processing device 200 Yin, horizontally moving (4) ί mechanism 7 omitting 'only one horizontal transport mechanism 6 is set. The water thousand transport _6_ action is on the substrate money position £ρί 97108014 62 200902415 The unprocessed substrate W is delivered to the main transport mechanism 3, and the processed substrate w from the main transport mechanism 3 is received at the substrate transfer position P1. The horizontal transport mechanism 6 is also subjected to the above-described batch release operation. The batch transfer operation by the second horizontal transport mechanism 7 in the i-th embodiment is performed. The horizontal transport mechanism 6 maintains the substrate holding position of the first guide 135 higher than the second guide while holding the unprocessed substrate ψ丨36 substrate holding position, in the first The guide member 135 holds the unprocessed substrate ¥. Further, when the horizontal transfer mechanism 6 holds the substrate w, the substrate holding position of the second guide 135 is lower than the substrate holding position of the second guide 136, and the second guide is provided. j 36. The substrate W is processed. The substrate orientation alignment mechanism may be disposed at the position P4 corresponding to the second substrate transfer position P2 in the first embodiment. In this case, the main transport mechanism 3 is at the substrate transfer position P1. The horizontal conveyance mechanism 6 collects the unprocessed substrate W彳4'. The substrate orientation alignment mechanism at the position P4 transfers the unprocessed substrate W. Then, after the substrate orientation operation, the main conveyance mechanism 3 receives the substrate from the substrate orientation alignment mechanism. w. The first and second guides 135 and 136 are provided in the first and second horizontal transport mechanisms 6 and 7 in the first embodiment. It is used to change the above. However, in the operation of the first embodiment, the first horizontal transport mechanism 7 is used to hold and transport the substrate w, and the second horizontal transport structure 7 is specifically used for holding and transporting. Processing substrate W, so no need 97108014 63 200902415 A substrate holding guide and a structure for changing the same are provided, as long as the substrate holding guide is commonly used. However, in order to increase the substrate transport speed, the first and second horizontal transport mechanisms 6 can also be used. 7: The handling operation of any of the substrate W and the unprocessed substrate w is processed. In this case, the second and second guides 135 and 136 are switched by the processed substrate W and the unprocessed substrate w. It is possible to suppress or prevent the transfer of the foreign matter to the processed substrate w. In the first embodiment, the second and second intermediates are provided for the second horizontal transfer mechanism to transfer the substrate between the main transport mechanisms 3. The robots 175 and 176 may be omitted, and the second, flat transport mechanism 6 and the main transport mechanism 3 may be directly transferred to the substrate. However, it is preferable to provide the first and second intermediary robots 175 and 176 from the viewpoint of selecting the substrate orientation mechanism and shortening the waiting time of the second substrate transfer position p2 of the second horizontal transport mechanism 6. Further, in the second embodiment, the second substrate and the second substrate may be interchanged, and the second substrate (for the unprocessed substrate w) may be placed on the side closer to the substrate processing portion 2. Further, in the above-described embodiment, the loading/unloading mechanism 4 is a batch combination, and the support guide 8 is moved by a half pitch. However, after the substrate (7) is delivered to the transfer mechanism 5, the transfer mechanism 5 is performed. Supporting the movement of the guide shaft 91, and then transferring the substrate 从 from the support guide shaft 91: to the second horizontal transport mechanism 7, the batch combination can be performed. The same can be said, so no support is required. Further, in the above embodiment, the housing for accommodating the substrate w is 97108014 64 200902415, which is a transfer case for housing the substrate w in a sealed state (1; '01^. Opening Unified Pod) 'But the container is not limited to the transfer box, and SMIF (Standard Mechanical inte) r Face) box, 〇C (Open Cassette), etc. may be used. In addition, in the above embodiment, one example is shown as the substrate w. Semiconductor wafer Although it is a circular substrate, it is also possible to treat other types of substrates such as a square substrate for a liquid crystal panel. The embodiments of the present invention have been described in detail above, but these are merely specific to understand the technical contents of the present invention. The present invention is not to be construed as limited to the specific examples, and the spirit and scope of the present invention is limited only by the scope of the appended claims. This application corresponds to the Japanese filed by the Japanese Patent Office on March 9, 2007. The Patent's special wishes 2〇〇7_6〇779 and the special wish to delete the (10)78〇 and December 12, 2017 to the Japanese Patent Office's special offer No. 7 321 142, the entire disclosure of which is incorporated by reference. The following is a schematic plan view for explaining the overall structure of the substrate processing apparatus of the present invention. Fig. 3 is a perspective view of the loading/unloading mechanism. Fig. 3 is a perspective view for explaining the rotation of the batch of handles. The potential change. The bean map is used to explain the use of loading/unloading. Substrate posture 97108014 65 200902415 Drawing 6 is a perspective view for explaining the structure of the batch handle for moving up and down to illustrate the batch handle and its associated structure. Figure 8 is a diagram illustrating the handle Fig. 9 is a perspective view for explaining the configuration of the transfer mechanism. Fig. 1 is a perspective view 'for a view showing a configuration for supporting the guide shaft to move up and down. The support guide shaft is configured [moving structure. The I axis is in the axial direction. FIG. 12 is for explaining the support guide station pull-out state). Top view of the structure of the guide shaft (substrate support Figure 13 is used to support the state of the guide). The top view of the substrate structure is shown in Fig. 15 is a front view for expanding the configuration indicating the horizontal conveyance holding portion. Fig. 16 is a front view. It is used to enlarge the structure which shows the horizontal conveyance holding part. Fig. 17 is a perspective view which is used for the horizontal rotation of the horizontal conveyance holding part of the 5 brothers and the structure for raising and lowering the 1V lead base. FIG. 19 is a perspective view for explaining the structure of the second horizontal transport mechanism. FIG. 20 is a perspective view, and is used for the purpose of explaining the horizontal rotation of the second transport mechanism. ^ p ^ ^ ^ ^ + The case where the final table is not placed on the side of the substrate processing apparatus. The Fig. 21 is a perspective view, and the step is used to convey the holding portion to the linear guide 97108014 66. 200902415 is the case when it is located on the side of the substrate processing unit. Fig. 22 is a diagrammatic view showing the structure of the board in the position where the bridge is not in the 2nd position of the bridge. The straight-up parent base diagram is shown in Fig. 23, which is used to indicate the first ; intermediary machine circle 24 FIG perspective 'is used to indicate a second ::.

圖25是俯視圖，用來表 1之構I 板處理裝置之構造。 月之另—貫施形態之基 圖26是圖解式之立體圖， 之間之構造。 ^表不傳送盒和交接位置 【主要元件符號說明】 傳送盒保持部 '基板處理部 1 主搬運機構 搬入/搬出機構 移載機構 第1水平搬運機構 第2水平搬運機構 8 夾盤洗淨單元 9 控制器 10 基板處理裝置 10a 基板處理裝置之前面 10b 基板處理裝置之側面 11 自動傳送盒搬運裝置 15 快門 97108014 67 200902415 16 20 21 22 23 24 25 27 28 30 31 33 35 40 41 42 43 44 45 46 47 48 50 53、 快門 處理部 第1藥液槽 第1沖洗液槽 第2藥液槽 第2沖洗液槽 乾燥處理部 第1升降器 第2升降器 基板夾盤 支持導件 箭頭 洗淨槽 成批手柄 手柄支持部 旋轉塊體 進退塊體 手柄進退機構 手柄旋轉馬達 成批手柄中心軸 軸 腕部 旋轉馬達 54 直線導件 97108014 68 200902415 55 隨動滑輪 56 驅動滑輪 57 皮帶 58 皮帶按壓件 60 進退馬達 62 固定基座 63 移動基座 64 移動塊體 ί 65 致動器 66 直線導件 67、68 手柄元件支持構件 69 手柄元件排列方向 70 手柄元件 70Α 、 70Β 手柄元件列 71 第1支持面 72 第2支持面 i · 73 第1支持突起部 74 第2支持突起部 75 第1導引突起部 76 第2導引突起部 77、78 通孔 79 支架 80 支持導件 81 導引基座 97108014 69 200902415 82 凸輪隨動器 83 凸輪面 84 凸輪 85 凸輪基座 86 氣缸 87 導引進退機構 88 基板保持溝 88A 第1基板保持溝 88B 第2基板保持溝 89 導引驅動機構 91 支持導引轴 92 導引支持部 93 本體部 94 馬達 95 致動器 97 直線導件 98 支架 99 塊體 100 導引移動馬達 101 旋轉軸 102 支持導引水平移動機構 105 導引轉動機構 106 、 107 滑輪 108 拉伸滑輪 97108014 70 200902415 109 滑輪 110 導引轉動馬達 111 皮帶 113 第1抵接部 114 第2抵接部 115 退離部 116 齒狀突起部 120 第1水平搬運保持部 121 本體部 122 移動基座 125 水平驅動機構 126 直線導件 127 (隨動）滑輪 128 驅動滑輪 129 皮帶 130 水平搬運馬達 131 皮帶按壓件 135 第1導件 135a、 135b、 135c 支持構件 136 第2導件（支持導件） 136a、 136b、 136c 支持構件 137 第1導引基座 138 第2導引基座 139 副導引基座 97108014 71 200902415 140 145 147 148 150 151 152 153 (154 160 161 162 163 164 165 c 166 168 169 170 171 . 172 175 176 177 支持軸 146 線性推進器 旋轉軸 轴 導引旋轉馬達 氣缸 直線導件 導引單元 軸承 第2水平搬運保持部 本體部 旋轉基座 移動基座 旋轉馬達 水平驅動機構 直線導件 驅動滑輪 皮帶 水平搬運馬達 皮帶按壓件 鉛直軸線 第1仲介機器人 第2仲介機器人 支持導件 97108014 72 200902415 178 導引支持部 179 本體部 180 致動器 181 183 184 185 186 f 187 200 F P1 P2 P3 馬達 支持導件 導引支持部 本體部 致動器 馬達 基板處理裝置 傳送盒 第1基板交接位置 第2基板交接位置 移載位置 P4 位置 W 基板 97108014 73Figure 25 is a plan view showing the configuration of the I-plate processing apparatus of Table 1. The other part of the month - the basis of the form of the figure Figure 26 is a perspective view of the diagram, the structure between them. ^Formation cassette and delivery position [Description of main component symbols] Conveyor cartridge holding portion 'Substrate processing unit 1 Main transport mechanism Loading/unloading mechanism Transfer mechanism First horizontal transport mechanism Second horizontal transport mechanism 8 Chuck cleaning unit 9 Controller 10 Substrate processing apparatus 10a Substrate processing apparatus front side 10b Side of substrate processing apparatus 11 Automatic transfer cassette handling apparatus 15 Shutter 97108014 67 200902415 16 20 21 22 23 24 25 27 28 30 31 33 35 40 41 42 43 44 45 46 47 48 50 53. Shutter processing unit 1st chemical tank first rinse tank 2nd liquid tank 2nd rinse tank drying treatment unit 1st lift 2nd lifter substrate chuck support guide arrow cleaning tank batch Handle handle support part rotating block body advance and retreat block handle forward and backward mechanism handle rotating motor batch handle center shaft shaft wrist rotation motor 54 linear guide 97108014 68 200902415 55 follower pulley 56 drive pulley 57 belt 58 belt pressing member 60 forward and backward motor 62 fixed Base 63 Moving base 64 Moving block ί 65 Actuator 66 Linear guides 67, 68 Handle member support 69 Handle element arrangement direction 70 Handle element 70Α, 70Β Handle element row 71 First support surface 72 Second support surface i · 73 First support protrusion 74 Second support protrusion 75 First guide protrusion 76 Second guide Projection 77, 78 through hole 79 bracket 80 support guide 81 guide base 97108014 69 200902415 82 cam follower 83 cam surface 84 cam 85 cam base 86 cylinder 87 guide introduction mechanism 88 substrate holding groove 88A first substrate Holding groove 88B 2nd substrate holding groove 89 Guide drive mechanism 91 Supporting guide shaft 92 Guide support portion 93 Main body portion 94 Motor 95 Actuator 97 Linear guide 98 Bracket 99 Block 100 Guide moving motor 101 Rotary shaft 102 Supporting guide horizontal moving mechanism 105 guiding rotating mechanism 106, 107 pulley 108 stretching pulley 97108014 70 200902415 109 pulley 110 guiding rotating motor 111 belt 113 first abutting portion 114 second abutting portion 115 retreating portion 116 toothed Projection portion 120 first horizontal conveyance holding portion 121 main body portion 122 moving base 125 horizontal drive mechanism 126 linear guide 127 (slave) pulley 128 drive pulley 129 belt 130 horizontal transport motor 131 belt pusher 135 first guide 135a, 135b, 135c support member 136 second guide (support guide) 136a, 136b, 136c support member 137 1 Guide base 138 2nd guide base 139 Secondary guide base 97108014 71 200902415 140 145 147 148 150 151 152 153 (154 160 161 162 163 164 165 c 166 168 169 170 171 . 172 175 176 177 Support shaft 146 Linear Thruster Rotary Shaft Shaft Guide Rotary Motor Cylinder Linear Guide Guide Unit Bearing 2nd Horizontal Transport Holder Body Rotary Base Move Base Rotary Motor Horizontal Drive Mechanism Linear Guide Drive Pulley Belt Horizontal Transport Motor Belt Presser Vertical axis first intermediary robot second intermediary robot support guide 97108014 72 200902415 178 guide support portion 179 body portion 180 actuator 181 183 184 185 186 f 187 200 F P1 P2 P3 motor support guide guide support body portion Actuator motor substrate processing device transfer cassette first substrate transfer position second substrate transfer position The position of the substrate W loading position P4 9710801473

Claims (1)

200902415 申請專利範圍： 1.:種基板處理裝置，係包含有： 保持部，用來保持收容器藉以收容 上下方向叠層之多片基板； 卞-勢在 基板處理部，用來對垂 基板一起施加處理；在水千方向豐層之多片 之=㈣Γ構’在既定之基板交接位置和上述基板處理部 (、 搬運以垂直姿勢在水平方向疊層之多片基板. 器搬:/多搬出機構’對由上述收容器保持部所保持之:容 夕 '"板一起搬入/搬出，並使該多片基板在水平 女勢和垂直姿勢之間一起變換姿勢；和 Μ搬運機構’於既定之移載位置處在與上述搬入/搬出 機構之間，一起交接垂直姿勢之多月基板，於上述基板交 ，位置處在與上述主搬運機構之間，一起交接垂直姿勢之 多片基板，在上述移載位置和上述基板交接位置之間，一 I:起搬運垂直姿勢之多片基板。 2·如申請專利範圍第丨項之基板處理裝置，其中， 上述搬入/搬出機構包含有： 多片保持手柄’用來一起保持多片基板； 手柄進退機構，用來使該多片保持手柄對由上述收容器 保持。卩保持之收容器，沿水平方向之既定進退方向進退； 和 手柄旋轉機構，用來使上述多片保持手柄沿上述進退方 向之鉛直面至少旋轉90度。 97108014 74 200902415 3·如申請專利範園第2項之基板處 上述多月保持手柄具備有多個柄 、、， 1片基板，而各個手知_ 手柄70件，分別用來保持 有第1基板保持部，在：:牛在手柄疋件排列方向之-側具 2基板保持部； 丙70件排列方向之另-側具有第 上述搬入/搬出機播由—人 背面反轉之方式，it 旋轉之手柄旋轉機構。片保持手柄圍繞既定之旋轉軸 4.如申請專利_第2項之基板處縣置， 上述搬入/搬出t置更包含有支持導件，用來從 持垂直姿勢之多片基板。 方支 5·如申請專利範圍第4項之基板處理裝置，其中， ίί”對各個手柄元件’具有-對基板保持溝； 二入/搬出機構更包含有經由驅動上 ::上述-對基板保持溝之任一者以保 ：： 動機構。 < 夺仟驅 6·如申請專利範圍第2項之基板處理 副搬運機構包含有： 八中上述 移載機構，具有移載支持部用來一起保持以垂直姿勢在 平方向噎層的狀悲之多片基板，使該移載支持部上下移 動、，利用該上下移動，在與上述搬入/搬出機構之間，於 上述移载位置一起交接垂直姿勢之多片基板；和 、 水平搬運機構，具有水平搬運保持部用來保持垂直姿勢 之多片基板使其在水平方向排列，而在上述移載位置於上 97108014 75 200902415 述移載支持部和上述水平搬運保持部之間一起交接垂直 文勢之夕片基板，在上述基板交接位置，於上述主搬運機 構和上述水平搬運保持部之間一起交接垂直姿勢之多片 基板’在上述移載位置和上述基板交接位置之間使上述水 平搬運保持部進行水平移動。 7. 如申請專利範圍第6項之基板處理裝置，苴中， 上述移載機構對於上述多片保持手柄之進退；向，被配 置在上述搬入/搬出機構之相反側。 8. 如申請專利範圍第6項之基板處理裝置，其中， 述^ 構更包含有支持部水平移動機構用來使上 ===沿疊層有垂直姿勢之基板的水平方向在既 疋之距離乾圍移動。 9·如申請專利範圍第6項之基板處理裝置， 上述移载支持部包含有一對之支 、 保持以垂直姿勢在水平 、丨軸，用來從兩侧 、且文羿在水千方向疊層之多片基板； 上述支持導引軸具有：抵接部， 接在基板;和退離部，用來在二 =方向不同位置處抵 定之間隔，以… 對支持導引軸間確保既 上述移載機禮ί^可以通過上述—對支持導引轴間； 支持導引軸圍繞各轴方向^轉動機構’用來使上述一對 置，其中， 引軸之周方向 置，其中， 1〇·如申請專利範圍第9項之基板處理裝 上述抵接部包含有被配置在上述支 不同位置處之第1抵接部和第2抵接部。導 U·如申請專利範圍第6項之基板處理裝 97108014 76 200902415 =水平搬運機構更包含有水平旋轉機構，用來使上述 保持部圍繞錯直轴在至少如度之範圍旋轉。 12.如申請專利範圍第u項之基板處理裝置，苴中， 上述水平搬運機構更包含有用來使上述水平搬運伴持 部圍繞錯直軸在至少⑽度之範圍旋轉者/千搬運保持 13·如申請專利範圍第6項之基板處理|置，其中， 持持部具有以上述移載支持部：基板保 持間距之一 +間距形成之多個基板保持溝。 14.如申請專利範圍第6項之基板處理裝置，立中， 直C保持部包含有：第1導件，用來支持以垂 直安勢在t平方向疊層之多片基板；和第2導件，用來支 持以垂直安勢在水平方向疊層之多片基板； 上述水平搬運機構更包含有導引升降機構，使 導件對上述第2導件進行相對升降。 15.如申請專利範圍第丨項之基板處縣置，其中， 上述主搬運機構在既定之第板交接位置 交=匕與上述基板處理部之間，—起搬運多;板 上述副搬運機構包含有： 狀 起保持多片基板，在 上述搬入/搬出機構 移載機構，具有移載支持部用來一 上述移載位置處於上述移載支持部和 之間’一起交接多>1基板； 第1基板移動機構，具有第i搬運保持部用 在上述移載位置於上述移載支持部和上述第！搬二 保持部H錢W基板，在上述第u板交接 97108014 77 200902415 二上=搬二構和上述第1搬運保持部之間-起交 == 移载位置和上述第1基板交接位置之 間，使上述第1搬運保持部移動； 第2基板移動機構，且 佴拄郝.L 八有用來保持多片基板之第2搬運 運保持部=载交移載支持部和上述第2搬 搬運 父接多片之基板，在上诚孩并200902415 Patent application scope: 1. A substrate processing apparatus comprising: a holding portion for holding a plurality of substrates stacked in a vertical direction by a receiving container; and a substrate processing portion for using the vertical substrate together Application processing; a plurality of sheets in the water-throwing layer = (four) structure" at a predetermined substrate transfer position and the substrate processing portion (to carry a plurality of substrates stacked in a horizontal direction in a vertical direction. The mechanism 'moves in and out of the container held by the container holding portion, and moves the multi-piece substrate together between the horizontal female body and the vertical posture; and the Μ handling mechanism is in the established state a transfer substrate is disposed between the loading/unloading mechanism and the multi-month substrate in a vertical posture, and a plurality of substrates in a vertical posture are transferred between the substrate and the main transport mechanism. Between the transfer position and the substrate transfer position, a substrate is used to transport a plurality of substrates in a vertical posture. The loading/unloading mechanism includes: a plurality of holding handles for holding a plurality of substrates together; a handle advancing and retracting mechanism for holding the plurality of holding handle pairs by the receiving container. The holding container is held in a horizontal direction And the handle rotation mechanism is used to rotate the above-mentioned plurality of holding handles at least 90 degrees along the vertical direction of the advancing and retracting direction. 97108014 74 200902415 3. If the substrate of the patent application No. 2 is maintained for more than one month, The handle is provided with a plurality of handles, and one substrate, and each of the handles 70 is used to hold the first substrate holding portion, and the substrate is held on the side of the side of the handle. The other side of the arrangement of the 70 pieces of C has the above-mentioned carry-in/out machine broadcast--the reverse of the person's back, the iterative rotation mechanism of the handle. The piece hold handle surrounds the predetermined rotation axis 4. As for the patent _ The substrate of the two items is placed at the county level, and the above-mentioned loading/unloading t-position further includes a supporting guide for holding a plurality of substrates in a vertical posture. The substrate processing apparatus of the present invention, wherein each of the handle elements has a pair of substrate holding grooves; and the second input/removal mechanism further includes: via the drive:: the above-mentioned pair of substrate holding grooves: The substrate processing auxiliary transport mechanism of the second aspect of the patent application scope includes: the above-mentioned transfer mechanism of the eighth medium, having a transfer support portion for maintaining the vertical direction in a vertical direction a plurality of substrates having a sad shape, wherein the transfer support portion is moved up and down, and the plurality of substrates in a vertical posture are transferred to the transfer position together with the loading/unloading mechanism by the vertical movement; and horizontal conveyance a mechanism having a plurality of substrates for holding a vertical posture in a horizontal conveyance holding portion to be arranged in a horizontal direction, and a vertical transfer between the transfer support portion and the horizontal conveyance holding portion in the transfer position at the above-mentioned transfer position At the substrate transfer position, the interactive substrate substrate is transferred to the vertical posture between the main transport mechanism and the horizontal transport holding portion. The plurality of substrates 'the horizontal movement of the horizontal conveyance holding portion between the transfer position and the substrate transfer position. 7. The substrate processing apparatus according to claim 6, wherein the transfer mechanism advances and retracts the plurality of holding handles; and is disposed on a side opposite to the loading/unloading mechanism. 8. The substrate processing apparatus according to claim 6, wherein the structure further comprises a support portion horizontal moving mechanism for causing the upper=== along the horizontal direction of the substrate in which the vertical posture is laminated at an adjacent distance Dry and move. 9. The substrate processing apparatus according to claim 6, wherein the transfer support portion includes a pair of supports, and is held in a vertical posture at a horizontal and a 丨 axis, and is used for lamination from both sides and the document is in the water direction. a plurality of substrates; the support guiding shaft has: an abutting portion connected to the substrate; and a retreating portion for abutting at different positions in the two directions, to ensure the above movement between the supporting guiding shafts The carrier ί^ can be used to make the above-mentioned pair by the above-mentioned pair of support guide shafts; the support guide shaft is arranged around the respective shaft directions ^, wherein the guide shaft is circumferentially disposed, wherein, 1〇· The substrate processing apparatus according to claim 9 is characterized in that the abutting portion includes a first abutting portion and a second abutting portion which are disposed at different positions of the branch. U.S. Patent Application Apparatus No. 6 of the Patent Application No. 6 is incorporated by reference. The horizontally-transporting mechanism further includes a horizontal rotating mechanism for rotating the holding portion around at least a range of degrees around the wrong axis. 12. The substrate processing apparatus according to claim 5, wherein the horizontal transporting mechanism further comprises: rotating the horizontal transporting companion portion by at least (10) degrees around the wrong axis. The substrate processing method according to claim 6, wherein the holding portion has a plurality of substrate holding grooves formed by the transfer support portion: one of the substrate holding pitches + pitch. 14. The substrate processing apparatus according to claim 6, wherein the vertical C holding portion includes: a first guide member for supporting a plurality of substrates laminated in a t-flat direction with a vertical anomaly; and a second The guiding member is configured to support a plurality of substrates stacked in a horizontal direction by vertical amperage; and the horizontal conveying mechanism further comprises a guiding lifting mechanism for causing the guiding member to relatively lift and lower the second guiding member. 15. The substrate according to the ninth aspect of the invention, wherein the main transport mechanism is disposed between the predetermined first board transfer position and the substrate processing unit; and the sub-transport mechanism includes There is: a plurality of substrates are held in a shape, and the transfer/removal mechanism transfer mechanism has a transfer support unit for transferring the plurality of substrates together with the transfer support portion and the transfer unit; A substrate moving mechanism having an i-th transport holding unit for the transfer position at the transfer support unit and the first! Moving the holding portion H, the W substrate, between the transfer of the u-th board, 97108014 77 200902415, between the second transfer structure and the first conveyance holding portion - the intersection == between the transfer position and the first substrate transfer position The first transport holding unit is moved, and the second substrate moving mechanism has a second transport transport unit for holding a plurality of substrates, a transfer transfer support unit, and the second transfer carrier. Connect multiple pieces of substrate, and take it on ………在上这移載位置和上述第2基板交接位 置之間使上述弟2搬運保持部移動。 16.如申請專利範圍第15項之基板處理裝置，盆中， ^第1基板移動機構在上述第}基板交接位置處從上 这搬運機構收取經上述基板處理部處理後之基板，在上 述移载位置處交給上述移載機構； 上述第2基板移動機構在上述移載位置處從上述移載 機構收取由上述基板處理部處理前之基板，在上述第2基 板父接位置交給上述主搬運機構。 1 7.如申明專利範圍第〗6項之基板處理裝置，其中， 上述主搬運機構包含有基板夾盤，用來一起保持多 板； 上述基板處理裝置更包含有：夾盤洗淨單元，用來洗淨 上述主搬運機構之基板夾盤；和搬運控制單元，用來控制 上述主搬運機構之動作以將在上述基板處理部處理後之 基板搬運到上述第丨基板交接位置後，從上述第2基板交 接位置將基板搬運到上述基板處理部，然後，利用上述夹 97108014 78 200902415 盤洗淨單元洗淨上述基板夾盤。 板= = 多片其把士 將由上述第1搬運保持部所保姓 夕片基板中一部份之第板群交 y所保持之 該移载支持部將上述第！ 二，移载支持部’從 構，然後，將由上 〇 乂⑺述搬入/搬出機 之另-部份之第2='持部所保持之多片基板中 支持部將上述第2二上述移载支持部，從該移載 控m 基板群父給上述搬入/搬出機構；和 板移動機=驟搬出機構、上述移載機構和上述第2基 構交給Sin/將第3基板群從上述搬入/搬出機 板群^ 支持部，從上述移載支持部將上述第3其 群父、、·δ上述第2搬運保持 機構將第上述搬入/搬出 載支持㈣ί Ϊ 述㈣支持部，進而’從上述移 第2搬運保:4基板群交給上述第2搬運保持部，在該 ^運保持部保持上述第3基板群和第4基板群。 包人如申請專利範圍帛15項之基板處理裝置，其中，更 ^ 3有在上述第2基板交接位置處仲介上述第2搬運保持 。D上述主搬運機構之間之基板交接之仲介機構。 20.如申睛專利範圍第15項之基板處理裝置，其中， 、，上述=多載機構之移載支持部一起保持以垂直姿勢在水 ^方向宜層的狀態之多片基板，上述移載機構在上述移載 立置處於上述移载支持部和上述搬入/搬出機構之間，一 97108014 79 200902415 起交接垂直姿勢之多片基板； 上述第1搬運保持部用來保持垂直姿勢之多片基板使 其在水平方向排列，第丨基板移動機構在上述移載位置處 -·於上述移載支持部和上述第1搬運保持部之間，一起交接 :垂直姿勢之多片基板，在上述第！基板交接位置處於上述 主搬運機構和上述第i搬運保持部之間，一起交接垂直姿 勢之多片基板； 上述第2搬運保持部用來保持垂直姿勢之多片基板使 = 排列’第2基板移動機構在上述移載位置處 部和上述第2搬運保持部之間一起交接 二搬運機：ί片基板，在上述第2基板交接位置處於上述 勢之多片基板。 搬運保持权間一起交接垂直姿 21. —種基板處理裝置，係包含有·· 收容器保持部，用來保持收容器藉以收容 κ =處理部，用來對多片基板一起施加處理/ ， 主搬運機構，在既定之第 接位置、鱼上述其起走“ 父接位置及第2基板交 搬入/搬二板對處，運多片基板； 器，-起搬入/搬二上:收谷器保持部所保持之收容 移載機構，具有一起保持多片 定之移载位置處於上述 移載支持部’在既 之間，-起交接多月基板；、朴上述搬入/搬出機構 第 97108014 200902415 :持部’在上述移載位置處於上述移載支 搬運保持部之間，一起交接多片基板，在上述第1λ板弟交 Γ-置把處:·?主搬運機構和上述第1搬運保^部ί 又接多片之基板，在上述移載位置和上述美 板交接位置之間，使上述第1搬運保持部移動；和土 保=基Π動機構，具有用以保持多片基板之第2搬運 #、。纟上㈣載位置處於上述移載 搬運保持部之間，一起交接多片基板，在上述第2Α板第六 ί位置^於^述主搬運機構和上述第2搬運保持土‘ 起乂接多片基板，在上述移載位 交接位置之間，使上述第2搬運保持部移動。基板 22:如/請專利範圍第21項之基板處理裝置，其中， 上述第1基板移動機構在上述第！基板交接位 上述主搬運機構收取經上述基板處理部處理後之基 上述移載位置處交給上述移载機構； 土 機H2基板移動機構在上述移載位置處，從上述移載 幾構收取由上述基板處理部處理前之基板，在上述第2基 板父接位置處交給上述主搬運機構。 土 23·如申請專利範圍第22項之基板處理裝置 ， 央^述主搬運機構包含有用來—起保持多片基板之基板 上述基板處理裝置更包含H H M A 上述主搬運機構之基板夹盤；和搬運控制單元綱 上述主搬運機構之動作，以將在上述基板處理部處理後工之 97108014 81 200902415 基板搬運到上述第1基板交接位置之後，從上述笛9 交接位置將基板搬運到上述基板處理 弟2基板 炎盤洗淨單元洗淨上述基板炎盤。 …、後’利用上述 24.如申請專利範圍第22項之基板處理 包含有移餘料元，相實行： 其令，更 :制上述搬入/搬出機構、上述移載機構 =構之步驟，以將由上述第1搬運保持二; 夕片基板中-部份之第i基板群交給上 呆持之 該移載支持部將上述第！基板群交紙上^支持部，從 之另搬運保持部所保持之多片基板中 口 P份之第2基板群交給上述移载 土 載支持部將上述第2其 戟支持。卩，從該移 控制m 搬入/搬出機構； 制上述搬入/搬出機構、上 板移動機構之步驟，以將第3基板;^冓和上述第2基 構交給上述移載支持部，從上述移=搬入/搬出機 板群交給上述第2搬運保持部，4二將上述第3基 载支持部將該第4基板群交給上述第“；搬:而，從上述移 第2搬運保持部保持±^3 f ^運保持部，在該 25.如申請專利範圍第基板群。 包含有在上述第2基板交接位置處仲:王裳置，其中，更 部和上述主搬運機構間之基板交接之；；介=請運保持 97108014 82The middle 2 transport holding portion is moved between the transfer position and the second substrate transfer position. 16. The substrate processing apparatus according to claim 15, wherein the first substrate moving mechanism receives the substrate processed by the substrate processing unit from the upper transfer mechanism at the substrate transfer position; The second substrate moving mechanism receives the substrate before being processed by the substrate processing unit from the transfer mechanism at the transfer position, and delivers the substrate to the main substrate at the second substrate Handling mechanism. 1 . The substrate processing apparatus of claim 6 , wherein the main transport mechanism includes a substrate chuck for holding a plurality of plates together; and the substrate processing device further includes: a chuck cleaning unit. a substrate chuck for cleaning the main transport mechanism; and a transport control unit for controlling the operation of the main transport mechanism to transport the substrate processed by the substrate processing unit to the second substrate transfer position, (2) The substrate transfer position transports the substrate to the substrate processing unit, and then the substrate chuck is cleaned by the disk cleaning unit of the above-mentioned clip 97108014 78 200902415. The board == a plurality of pieces of the driver. The transfer support unit held by the first board group in the first carrier holding unit is held by the first board holding unit. Second, the transfer support unit 'reconstructed, and then the support portion of the plurality of substrates held by the second=' holding portion of the other part of the loading/unloading machine of the upper jaw (7) shifts the second and second above a loading support unit that supplies the loading/unloading mechanism from the transfer control m substrate group parent; and a plate moving machine=step discharging mechanism, the transfer mechanism, and the second base member to the Sin/the third substrate group from the above The loading/unloading machine group group ^ support unit, the third group of the parent, the δ, the second transport and holding mechanism, the above-mentioned loading/unloading support (four) ( (4) support unit, and further The second transport group is transported to the second transport holding unit, and the third substrate group and the fourth substrate group are held by the transport holding unit. In the case of the substrate processing apparatus of claim 15 of the patent application, the second substrate is held at the second substrate transfer position. D The intermediary mechanism for the substrate transfer between the main transport mechanisms. [20] The substrate processing apparatus of claim 15, wherein the transfer support portion of the multi-carrier mechanism holds a plurality of substrates in a state in which a vertical posture is in a water direction, and the transfer is performed. The mechanism is configured to transfer a plurality of substrates in a vertical posture from the transfer support portion and the loading/unloading mechanism between the transfer support portion and the loading/unloading mechanism; the first transfer holding portion is configured to hold a plurality of substrates in a vertical posture The second substrate moving mechanism is disposed at the transfer position at the transfer position between the transfer support portion and the first transfer holding portion, and the plurality of substrates in the vertical posture are delivered together. The substrate transfer position is between the main conveyance mechanism and the i-th conveyance holding portion, and the plurality of substrates in the vertical posture are transferred together; and the second conveyance holding portion is configured to hold the plurality of substrates in the vertical posture to make the arrangement of the second substrate The mechanism transfers the two transporters between the transfer position portion and the second transport holding portion: a plurality of substrates, and the plurality of substrates are placed at the second substrate transfer position. A substrate handling device is disposed between the handling and holding functions. The substrate processing device includes a container holding portion for holding the container to accommodate the κ = processing portion for applying processing to the plurality of substrates. The transport mechanism transports a plurality of substrates at a predetermined first position, and the fish picks up the "parent position and the second substrate transfer/transporting board; the device, the loading/moving two: the harvester The storage and transfer mechanism held by the holding unit has a plurality of fixed transfer positions held together in the transfer support portion ′, and the transfer of the substrate for a plurality of months; and the above-described carry-in/out mechanism 97108014 200902415: The portion 'between the transfer carrier transport holding portions at the transfer position, and a plurality of substrates are transferred together, and the first λ plate is placed at the handle: the main transport mechanism and the first transport protector Further, the plurality of substrates are connected to each other, and the first conveyance holding portion is moved between the transfer position and the transfer position of the US plate; and the soil protection=base swing mechanism has the second substrate for holding the plurality of substrates Handling #,.纟The upper (four) load position is between the transfer conveyance holding portions, and a plurality of substrates are transferred together, and the plurality of substrates are connected to the main conveyance mechanism and the second conveyance holding soil at the second side of the second jaw. The second processing and transporting unit is moved between the transfer position and the transfer position. The substrate processing device of the second aspect of the invention, wherein the first substrate moving mechanism is transferred to the first substrate The main transport mechanism is disposed at the transfer position after being processed by the substrate processing unit, and is transferred to the transfer mechanism. The earth moving machine H2 substrate moving mechanism receives the substrate from the transfer structure at the transfer position. The substrate before the processing by the processing unit is delivered to the main transport mechanism at the parenting position of the second substrate. The soil processing apparatus according to the 22nd aspect of the patent application, wherein the main transport mechanism includes a holding mechanism for holding The substrate processing apparatus of the plurality of substrates further includes a substrate chuck of the HHMA main transport mechanism; and the operation of the main transport mechanism of the transport control unit to be After the substrate processing unit has been processed, the substrate is transported to the first substrate transfer position, and then the substrate is transported from the transfer position of the flute 9 to the substrate processing 2 substrate thermal disc cleaning unit to clean the substrate. ..., after 'Using the above 24. The substrate processing according to Item 22 of the patent application scope includes a residual material element, and the phase is implemented: the order of the above-mentioned loading/unloading mechanism, the above-mentioned transfer mechanism = construction, And the transfer support portion that is held by the first i-substrate group in the first substrate, and the transfer support portion of the first substrate group is transferred to the support portion, and is held by the other transfer holding portion. The second substrate group of the port P in the plurality of substrates is transferred to the transfer earth support portion to support the second electrode.卩, the loading/unloading mechanism is moved from the shift control m; and the loading/unloading mechanism and the upper plate moving mechanism are configured to transfer the third substrate and the second base structure to the transfer support unit, The shifting/removing/unloading machine group is delivered to the second transport holding unit, and the fourth base supporting unit supplies the fourth substrate support unit to the first “moving unit” and is held by the second transport holding unit. a ^^3 f ^ transport holding portion, as in the patent application range of the substrate group. The second substrate is disposed at the intersection of the second substrate: Wang Shuang, wherein the portion is transferred to the substrate between the main transport mechanism ;; 介= please keep 97108014 82
TW097108014A 2007-03-09 2008-03-07 Substrate treatment apparatus TWI378894B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007060779 2007-03-09
JP2007060780 2007-03-09
JP2007321142A JP4824664B2 (en) 2007-03-09 2007-12-12 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200902415A true TW200902415A (en) 2009-01-16
TWI378894B TWI378894B (en) 2012-12-11

Family

ID=39981808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097108014A TWI378894B (en) 2007-03-09 2008-03-07 Substrate treatment apparatus

Country Status (4)

Country Link
JP (2) JP4824664B2 (en)
KR (1) KR100989279B1 (en)
CN (1) CN101261935B (en)
TW (1) TWI378894B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4350749A1 (en) * 2022-09-22 2024-04-10 SCREEN Holdings Co., Ltd. Substrate treating apparatus

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101181560B1 (en) 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate conveying apparatus for use in the same
JP5290890B2 (en) * 2008-09-12 2013-09-18 大日本スクリーン製造株式会社 Substrate processing equipment
JP5218000B2 (en) * 2008-12-12 2013-06-19 株式会社Ｉｈｉ Substrate storage and supply system
JP5330031B2 (en) * 2009-03-05 2013-10-30 大日本スクリーン製造株式会社 Substrate processing equipment
CN103688348B (en) * 2011-08-10 2016-08-17 川崎重工业株式会社 End effector device and possess the board carrying manipulator of this end effector device
JP5875901B2 (en) * 2012-03-09 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
CN105336651B (en) * 2014-06-10 2018-03-23 北大方正集团有限公司 Chip transposition system
ITUA20163368A1 (en) * 2016-05-12 2017-11-12 Marchesini Group Spa STABILIZATION DEVICE FOR STABILIZING ITEMS DURING THEIR LIFTING AND GROUPING
TW201839890A (en) * 2017-02-13 2018-11-01 日商東京威力科創股份有限公司 Transfer device, transfer method, and storage medium
JP6917846B2 (en) * 2017-09-25 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス Board reversing device, board processing device and board holding device
CN109226010A (en) * 2018-09-28 2019-01-18 昆山市和博电子科技有限公司 A kind of substrate cleaning machine and basal plate cleaning system
CN109127587B (en) * 2018-10-22 2021-03-19 安徽深泽电子股份有限公司 PCB cleaning tool
CN113195159B (en) * 2018-12-19 2024-02-27 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method
KR20200102612A (en) * 2019-02-21 2020-09-01 세메스 주식회사 Substrate treating apparatus and substrate treating method
CN110176390B (en) * 2019-05-31 2022-02-18 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Batch wafer fixing and driving device in cassette-free cleaning equipment and using method
JP7156547B2 (en) * 2019-09-02 2022-10-19 村田機械株式会社 Wafer delivery device, wafer storage container, and wafer storage system
CN111769064B (en) * 2020-06-18 2023-07-14 无锡先导智能装备股份有限公司 Loading and unloading device
CN112757079B (en) * 2020-12-31 2022-05-17 泉州市海恩德机电科技发展有限公司 Intelligent stone material equipment of polishing
CN115893002B (en) * 2022-11-15 2023-07-28 浙江矽盛电子有限公司 Inspection device for photovoltaic monocrystalline silicon piece after production molding
CN117819154A (en) * 2024-03-04 2024-04-05 成都环龙智能机器人有限公司 Automatic handling device of robot

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2824951B2 (en) * 1992-09-25 1998-11-18 大日本スクリーン製造株式会社 Substrate delivery device in substrate processing equipment
JP3521330B2 (en) * 1997-01-21 2004-04-19 東京エレクトロン株式会社 Substrate transfer processing equipment
JP3974985B2 (en) 1997-12-02 2007-09-12 大日本スクリーン製造株式会社 Substrate transfer device
JP3577204B2 (en) * 1997-12-02 2004-10-13 大日本スクリーン製造株式会社 Substrate attitude converter
JP3413567B2 (en) * 1998-02-18 2003-06-03 東京エレクトロン株式会社 Substrate transfer processing apparatus and substrate transfer processing method
JP3938436B2 (en) 1998-06-05 2007-06-27 大日本スクリーン製造株式会社 Substrate transfer apparatus and substrate processing apparatus using the same
JP3905658B2 (en) * 1999-02-08 2007-04-18 大日本スクリーン製造株式会社 Substrate transfer device
JP4069236B2 (en) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 Liquid processing equipment
JP2002076094A (en) * 2000-08-31 2002-03-15 Daikin Ind Ltd Board carrying apparatus
JP3979804B2 (en) * 2001-08-17 2007-09-19 大日本スクリーン製造株式会社 Substrate processing equipment
KR100459335B1 (en) * 2002-04-08 2004-12-03 한국디엔에스 주식회사 Method and system for wafer array
KR100466296B1 (en) * 2002-07-18 2005-01-13 한국디엔에스 주식회사 Transfer robot and wafer array system using this robot
JP4401285B2 (en) * 2004-12-24 2010-01-20 大日本スクリーン製造株式会社 Substrate processing equipment
JP4688637B2 (en) * 2005-10-28 2011-05-25 東京エレクトロン株式会社 Substrate processing apparatus, batch knitting apparatus, batch knitting method, and batch knitting program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4350749A1 (en) * 2022-09-22 2024-04-10 SCREEN Holdings Co., Ltd. Substrate treating apparatus

Also Published As

Publication number Publication date
CN101261935B (en) 2010-12-01
TWI378894B (en) 2012-12-11
JP2008258570A (en) 2008-10-23
KR20080082905A (en) 2008-09-12
JP4824664B2 (en) 2011-11-30
JP2011238945A (en) 2011-11-24
CN101261935A (en) 2008-09-10
JP5054218B2 (en) 2012-10-24
KR100989279B1 (en) 2010-10-20

Similar Documents

Publication Publication Date Title
TW200902415A (en) Substrate treatment apparatus
TWI334189B (en) Substrate processing apparatus and substrate transfer method
TWI360183B (en)
JP4727500B2 (en) Substrate transfer apparatus, substrate processing system, and substrate transfer method
TWI600106B (en) Substrate processing apparatus, substrate processing method, and memory medium
TWI320022B (en) Treatment system
TWI381477B (en) Substrate processing system
TW200843021A (en) Substrate processing apparatus
TW200901357A (en) Substrate processing apparatus and substrate processing method
TW200834805A (en) Substrate processing apparatus
TW200915470A (en) Substrate processing apparatus
JP2020109784A (en) Substrate processing apparatus and substrate transportation method
JP6314161B2 (en) Substrate transfer system and method
JP2020109786A (en) Substrate processing apparatus and substrate transportation method
JP5279554B2 (en) Substrate processing equipment
JP2013069916A (en) Substrate processing apparatus and substrate processing method and storage medium
JP5330031B2 (en) Substrate processing equipment
TWI426044B (en) Substrate processing apparatus and substrate conveying apparatus for use in the same
JP5002050B2 (en) Substrate processing system and substrate transfer method
JP5490860B2 (en) Substrate transport apparatus and substrate processing apparatus having the same
TWI529843B (en) Substrate processing apparatus
JP5075246B2 (en) Substrate transfer apparatus, substrate processing system, and substrate transfer method
KR20240041248A (en) Substrate treating apparatus
JP3730803B2 (en) Substrate attitude changing apparatus and method
JP2024046366A (en) Substrate processing equipment