KR20240041248A - Substrate treating apparatus - Google Patents

Abstract

By reviewing the configuration of the device including a batch module and a single wafer module, a substrate processing device is provided that reliably transports substrates and maintains high quality of substrates and final products based thereon. In the present invention, the hand that takes out one substrate (W) from a plurality of substrates (W) arranged in liquid is a clamping hand (87) that holds the substrate (W). The clamping hand 87 has a pair of arms that abut against the periphery of the substrate W on one side of the substrate W and abut against the periphery of the substrate W on the other side of the substrate W. Therefore, the clamping hand 87 of the present invention can clamp and take out the substrate W that is to be clamped without entering the interior of the substrate array.

Description

Substrate processing device {SUBSTRATE TREATING APPARATUS}

The present invention provides a method for subjecting various substrates such as semiconductor substrates, substrates for FPD (Flat Panel Display) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, substrates for optical disks, etc. to a predetermined process. It relates to a substrate processing device.

Conventionally, this type of device includes a batch type module and a single wafer type module (for example, see Patent Document 1). A batch-type module performs predetermined processing on a plurality of substrates at once. In a single-wafer module, a predetermined process is performed on each substrate. Batch-type modules and single-fed modules each have their own advantages. A substrate processing apparatus equipped with a batch type module and a single wafer type module has the advantages of both, thereby realizing a configuration that has advantages over a batch type substrate processing apparatus or a single wafer type substrate processing apparatus.

The device of Patent Document 1 has a configuration in which a plurality of substrates that have undergone batch processing are held in liquid. Since sheet wafer processing basically consists of processing substrates one by one, it is necessary to temporarily wait for substrates that have completed batch processing and then perform sheet wafer processing on the substrates sequentially. Therefore, in the conventional configuration, a configuration is adopted in which a plurality of substrates that have completed batch processing are temporarily held in a waiting position, and the held substrates are taken out one by one by a transfer arm and transferred to a single wafer type module. The transfer arm configured in Patent Document 1 is inserted into a gap between a plurality of substrates arranged, and takes out the substrate by holding the substrate with a tab formed on the transfer arm.

Japanese Patent Publication No. 2021-64654

However, the conventional device having this configuration has the following problems.

That is, according to the conventional configuration, the transfer arm is inserted into the gap between the plurality of waiting substrates. This configuration causes several problems. For example, in a conventional configuration, the possibility that the transfer arm interferes with the substrate increases. This is because, in a configuration where the transfer arm is inserted into the gap between the substrates, there is a possibility that the transfer arm collides with a pair of substrates located at both ends of the gap. In order to prevent the transfer arm from colliding with the substrate, high-precision control of the transfer arm is required, making it difficult to configure the device. If the transport arm is made narrow in the direction in which the substrate is arranged in order to suppress the collision of the transport arm with the substrate, the transport arm is bent accordingly, which may actually worsen the situation.

The present invention has been made in consideration of such circumstances, and aims to provide a substrate processing device that reliably transports substrates and maintains high quality by reviewing the configuration of the device including a batch-type module and a single-wafer module. .

In order to achieve this object, the present invention adopts the following configuration.

A substrate processing apparatus that continuously performs batch processing to process a plurality of substrates at once and sheetfed processing to process substrates one by one, comprising: a stocker block, a transfer block adjacent to the stocker block, and the transfer material. A processing block is provided adjacent to the block, wherein the stocker block accommodates at least one carrier that stores a plurality of substrates in a vertical direction at a predetermined interval in a horizontal position, and the carrier blocks the substrates for entry and exit from the carrier. An acquisition handling mechanism comprising a carrier placing shelf for taking out and storing at least one substrate on which a substrate is placed, wherein the transfer block collectively takes out a plurality of substrates from a carrier placed on the carrier placing shelf. and a substrate posture change mechanism that changes the posture of a plurality of substrates in a horizontal posture collectively to a vertical posture, and a substrate holding unit that holds a plurality of substrates in a vertical posture collectively at a predetermined substrate transfer position, The processing block includes a batch processing area on one end adjacent to the transfer block and on the other end extending in a direction away from the transfer block, and a sheet-fed processing area adjacent to the transfer block and spaced apart from the batch processing area; , a sheet wafer substrate transport area interposed between the batch processing area and the sheet wafer processing area, and formed along the batch processing area, one end of which extends to the transfer block, and the other end of which extends in a direction away from the transfer block. A batch substrate transfer area is provided, and in the batch processing area, a plurality of batch processing tanks for immersing a plurality of substrates in batches are aligned in a direction extending from the area, and are aligned vertically at a position closest to the transfer block. A holding tank is formed to hold a plurality of substrates in an attitude position in a liquid, and in the sheet wafer processing area, at least one sheet wafer processing chamber is formed to individually process the substrates one by one, and in the sheet wafer substrate transfer area, With respect to one substrate to be transported among the plurality of substrates held in the liquid of the holding tank, a lateral position away from the peripheral edge of the substrate in the radial direction, and a radial inward position from two opposing lateral positions via the substrate. a clamping hand having a pair of arms that clamp the peripheral portion of the substrate in the liquid by respectively approaching toward each other, a lifting mechanism that raises and lowers the clamping hand to expose the substrate from the liquid surface of the holding tank, and the clamping hand A sheet wafer substrate transport mechanism is formed, including a rotation mechanism that rotates a hand to change the posture of the substrate from a vertical posture to a horizontal posture, and a horizontal movement mechanism that horizontally moves the clamping hand to convey the substrate to the sheet wafer processing area. A batch substrate transfer mechanism is formed in the batch substrate transfer area to transfer a plurality of substrates in batches between the substrate transfer position and each of the batch processing tanks and the holding tank, and the transfer block further includes the processing tank. A mechanism interposed between the sheetfed processing area in the block and the carrier placing shelf in the stocker block, comprising a return handling mechanism for transporting a substrate in a horizontal position from the sheetfed processing area to the carrier placing shelf. Characterized by a substrate processing device.

[Action/Effect] According to the invention related to (1) described above, it is possible to provide a substrate processing device that reliably transports a substrate and maintains high quality of the substrate or the final product based thereon. That is, a clamping hand that transports the substrate from the batch processing area to the sheetfed processing area of the present invention, and each mechanism that drives it, are formed, and the clamping hand is a pair of mutually approachable and separable pairs that clamp one sheet of substrate. It has arms. With this configuration, the pair of arms themselves hold the substrate directly rather than through the tabs. That is, the clamping hand of the present invention is not inserted into the gap between the substrate to be clamped and the neighboring substrate facing the substrate, but the clamping hand grips the outer peripheral portion of the substrate to be clamped from the outside of the substrate array. In other words, the clamping hand of the present invention does not need to be configured to insert an arm into the gap between the substrates. According to the present invention, collision of the transport arm with the substrate is suppressed, so it is possible to provide a substrate processing apparatus that reliably transports the substrate and maintains high quality of the substrate and the final product based on the substrate.

The present invention also has the following features.

(2) In the substrate processing apparatus described in (1), the clamping hand of the sheet substrate transport mechanism is provided with a V-shaped groove in cross-section extending in an arc shape to imitate the shape of the substrate.

[Action/Effect] According to the invention related to (2) described above, when the clamping hand clamps the substrate, the peripheral portion of the substrate is inserted into a V-shaped groove in cross section extending in an arc shape. Therefore, according to the configuration of (2), it is possible to provide a substrate processing device provided with a clamping hand that can more firmly grip the substrate.

(3) In the substrate processing apparatus according to (1), the handling mechanism for acquisition of the transfer block is comprised of a robot that is also used as the handling mechanism for return, and the transfer block is further configured to maintain the substrate posture. A mechanism interposed between the conversion mechanism and the substrate transfer position, comprising a pusher mechanism that changes the arrangement pitch of the plurality of substrates across the predetermined interval and a narrow interval narrower than the predetermined interval, the arrangement in the processing block The substrate transport mechanism transports a plurality of substrates arranged at narrow intervals.

[Action/Effect] According to the invention related to (3) described above, the handling mechanism for picking up a transfer block is comprised of a robot that also serves as the handling mechanism for returning. With this configuration, a space for arranging a mechanism for changing the array pitch of a plurality of sheets can be reliably secured in the transfer block.

(4) In the substrate processing apparatus according to (1), the acquisition handling mechanism and the return handling mechanism in the transfer block are composed of individual robots formed adjacent to each other, and the stocker block further comprises: an acquisition shelf that is a carrier placement shelf on which a carrier (C) accessible to the acquisition handling mechanism is placed, a return shelf that is a carrier placement shelf on which a carrier (C) accessible to the return handling mechanism is placed, and the acquisition It is provided with a carrier transfer mechanism that moves the carrier placed on the shelf to a return shelf, and the batch substrate transfer mechanism in the processing block transfers a plurality of substrates arranged at the predetermined interval.

[Action/Effect] According to the invention related to (4) described above, the handling mechanism for acquisition and the handling mechanism for return in the transfer block are comprised of individual robots formed adjacent to each other. With this configuration, control of the handling mechanism is simplified, and a substrate processing device capable of reliable substrate transfer can be provided.

(5) In the substrate processing apparatus according to (1), a plurality of the sheet wafer processing chambers are formed in the vertical direction in the sheet wafer processing area.

[Action/Effect] If a plurality of sheet wafer processing chambers are formed as in the invention related to (5) described above, a decrease in throughput due to sheet wafer processing, which tends to cause processing stagnation, can be suppressed as much as possible. Additionally, if a plurality of sheet wafer processing chambers are stacked in the vertical direction, and the positions of each sheet wafer processing chamber are identical in places other than the vertical direction, loading and unloading of substrates into and out of each sheet wafer processing chamber can be realized by the same transport mechanism. Therefore, according to the present invention, it is possible to provide a substrate processing apparatus that performs sheet wafer processing on a plurality of substrates in parallel without changing the layout of the apparatus in which one sheet wafer processing chamber is formed.

(6) In the substrate processing apparatus according to (1), the sheet wafer processing chamber is capable of performing a water-repellent treatment on the surface of the substrate.

[Action/Effect] According to the invention related to (6) described above, a substrate processing device with high throughput can be provided by reliably performing water-repellent processing on the substrate surface in a sheet wafer processing chamber and simultaneously using batch processing. .

(7) In the substrate processing apparatus according to (1), the sheet wafer processing chamber is capable of drying a substrate.

[Action/Effect] According to the invention related to (7) described above, a substrate processing apparatus with high throughput can be provided by reliably performing drying processing of the substrate in a sheet wafer processing chamber and simultaneously using batch processing.

According to the present invention, a substrate processing apparatus can be provided. That is, in the present invention, the hand that takes out one substrate from a plurality of substrates arranged in liquid is a clamping hand that holds the substrate. That is, the clamping hand of the present invention is a lateral position away from the peripheral edge of the substrate in the radial direction with respect to one substrate to be transported among a plurality of substrates held in the liquid of the holding tank, and has two lateral positions opposing each other with the substrate interposed therebetween. It has a pair of arms that hold the peripheral part of the substrate in the liquid by each approaching radially inward from the bottom. Therefore, the clamping hand of the present invention can clamp and take out the substrate to be clamped without entering the interior of the substrate array. Therefore, the possibility that the clamping hand in the present invention comes into contact with the substrate is only around the periphery of the substrate, and even if the clamping hand comes into contact with this area, it does not affect the device formed on the surface of the substrate. In this way, according to the present invention, collision of the transport arm with the substrate is suppressed, and thus it is possible to provide a substrate processing apparatus that reliably transports the substrate and maintains high quality of the substrate and the final product based thereon.

1 is a plan view explaining the overall configuration of the substrate processing apparatus according to Example 1.
Figure 2 is a perspective view specifically explaining the posture change unit.
Figure 3 is a schematic diagram explaining the operation of the posture change unit.
Figure 4 is a perspective view specifically explaining the clamping arm and its surrounding mechanism.
Fig. 5 is a perspective view explaining the rotation mechanism of the clamping arm.
Figure 6 is a cross-sectional view explaining the operation of the clamping arm.
Fig. 7 is a cross-sectional view explaining the operation of the clamping arm.
Fig. 8 is a cross-sectional view explaining the operation of the clamping arm.
Figure 9 is a flow chart explaining the flow of substrate processing.
Fig. 10 is a schematic diagram explaining the flow of substrate processing.
Figure 11 is a schematic diagram explaining the flow of substrate processing.
Fig. 12 is a schematic diagram explaining the flow of substrate processing.
Fig. 13 is a plan view explaining the overall configuration of the substrate processing apparatus according to Example 2.
Figure 14 is a flow chart explaining the flow of substrate processing.
Figure 15 is a schematic diagram explaining the flow of substrate processing.
Figure 16 is a schematic diagram explaining the flow of substrate processing.
Figure 17 is a schematic diagram explaining the flow of substrate processing.
Figure 18 is a schematic diagram explaining one modification of the present invention.
Figure 19 is a schematic diagram explaining one modification of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The substrate processing apparatus of the present invention is an apparatus that continuously performs batch processing, which processes a plurality of substrates W at a time, and sheet processing, which processes the substrates W one by one.

[Example 1]

<1. Full configuration>

The substrate processing apparatus 1 has each block partitioned by partition walls, as shown in FIG. 1 . That is, the substrate processing apparatus 1 includes a loading/unloading block 3, a stocker block 5 adjacent to the loading/unloading block 3, a transfer block 7 adjacent to the stocker block 5, and a transfer material block 7. There is a processing block (9) adjacent to the block (7). The stocker block 5 corresponds to the stocker block of the present invention, the transfer block 7 corresponds to the transfer block of the present invention, and the processing block 9 corresponds to the processing block of the present invention.

The substrate processing apparatus 1 performs various treatments, such as chemical treatment, cleaning treatment, and water-repellent treatment, on the disc-shaped substrate W, for example. The substrate processing apparatus 1 is a processing method that combines both a batch processing method for processing a plurality of substrates W at a time and a sheet processing method for processing substrates W one by one (so-called hybrid processing method) method) is adopted. The batch processing method is a processing method in which a plurality of substrates W arranged in a vertical position are processed at once. The single wafer processing method is a processing method in which the substrates W in a horizontal position are processed one by one.

In this specification, for convenience, the direction in which the loading/unloading block 3, the stocker block 5, the transfer block 7, and the processing block 9 are arranged is called the “front-back direction (X direction).” The front-back direction (X direction) extends horizontally. Among the front-back directions (X direction), the direction from the stocker block 5 toward the loading/unloading block 3 is called “forward”, and the direction opposite to the front is called rear. The direction extending horizontally orthogonal to the front-back direction (X direction) is called the “width direction (Y direction).” One side of the width direction is called “right side” for convenience, and the other side is called “left side” for convenience. The height direction orthogonal to the front-back direction (X direction) and the width direction (Y direction) is called the “vertical direction (Z direction)” for convenience. In each drawing, front, back, left, right, top, and bottom are shown appropriately for reference.

<2. Import/exit block>

The loading/unloading block 3 includes an input portion 11, which is an entrance at which the carriers C, which store a plurality of substrates W in the vertical direction at predetermined intervals in a horizontal position, are loaded into the block, and a carrier C ) is provided with an exit section (13), which is an exit when the unit is sent out of the block. The input portion 11 and the output portion 13 are formed on the outer wall of the loading/unloading block 3 extending in the width direction (Y direction). The input portion 11 is formed on the right side when viewed from the central portion in the width direction (Y direction) of the substrate processing apparatus 1, and the output portion 13 is formed in the width direction (Y direction) of the substrate processing apparatus 1. It is formed on the left side, opposite to the right side, when viewed from the center (Y direction).

A plurality of substrates W (for example, 25 sheets) are stacked and stored in a horizontal position at regular intervals in one carrier C. The carrier C containing the unprocessed substrate W to be brought into the substrate processing apparatus 1 is first placed in the input unit 11 . The input unit 11 is provided with two mounting tables 15 on which the carrier C is placed, for example. The carrier C is formed with a plurality of grooves (not shown) extending in the horizontal direction to accommodate the surfaces of the substrate W spaced apart from each other. One substrate W is inserted into each of the grooves. The carrier (C) includes, for example, a sealed FOUP (Front Opening Unify Pod). In the present invention, an open container may be employed as the carrier (C).

The delivery unit 13 sends out the carrier C containing the processed substrate W to be delivered from the substrate processing apparatus 1. The dispensing portion 13, which functions in this way, is provided with, like the input portion 11, two mounting tables 17 for placing the carrier C, for example. The input portion 11 and the output portion 13 are also called load ports.

<3. Stalker Block>

The stocker block 5 is disposed adjacent to the rear of the loading/unloading block 3. The stocker block 5 is provided with a conveyance storage section (ACB) for stocking and managing the carrier C. The conveyance storage section (ACB) is provided with a carrier conveyance mechanism 19 for conveying the carrier C and a shelf 21 for placing the carrier C. The number of carriers (C) that the stocker block (5) can stock is, for example, 1 or more.

The shelf 21 of the stocker block 5 is for mounting the carrier C, and is formed on a partition separating the stocker block 5 and the transfer block 7. The shelf 21 includes a shelf 21b for stock on which the carrier C is simply temporarily placed, and a carrier for acquiring and returning substrates accessed by the first transport mechanism (HTR) included in the transfer block 7. There is a wit shelf (21a). The carrier placing shelf 21a corresponds to a carrier placing shelf for taking out and storing substrates on which the carrier C is placed for loading and unloading the substrate W from the carrier C of the present invention. The carrier C, which is the object of substrate extraction, is placed on the carrier placing shelf 21a, and an empty carrier C remains on the carrier placing shelf 21a after the operation of taking out the substrate W. The taken-out substrate W is subjected to various processes in the processing block 9. The processed substrates (W) are returned one by one to the original carrier (C) on the carrier placing shelf 21a. In this example, only one carrier placement shelf 21a is provided, but a configuration in which a plurality of carrier placement shelves 21a are formed instead of this may be used.

The carrier transport mechanism 19 takes in the carrier C containing the unprocessed substrate W from the input unit 11 and places it on the carrier placing shelf 21a. At this time, the carrier transport mechanism 19 may temporarily place the carrier C on the stock shelf 21b before placing it on the carrier placement shelf 21a. Additionally, the carrier transfer mechanism 19 receives the carrier C accommodating the processed substrate W from the carrier placing shelf 21a and places it on the dispensing portion 13. At this time, the carrier transport mechanism 19 may temporarily place the carrier C on the stock shelf 21b before placing it on the dispensing portion 13.

<4. Material block>

The transfer block 7 is disposed adjacent to the rear of the stocker block 5. The transfer block 7 includes a first transfer mechanism (HTR) accessible to the carrier C on the carrier placement shelf 21a on which the carrier C from which the substrate W is taken out is placed, and a plurality of substrates W. an attitude changer 20 that collectively changes the posture from a horizontal posture to a vertical posture, and a configuration that collectively receives a plurality of substrates W in a vertical posture from the posture changer 20, and a substrate transfer position (P) ) and is provided with a pusher mechanism (22) that can be held in place. The first transport mechanism (HTR) corresponds to the acquisition handling mechanism of the present invention, the posture change section 20 corresponds to the substrate posture change mechanism of the present invention, and the pusher mechanism 22 corresponds to the substrate holding section of the present invention. Additionally, a substrate transfer position P is set in the transfer block 7 for passing a plurality of substrates W to the second transfer mechanism WTR formed in the placement substrate transfer area R4. The first transport mechanism (HTR), the attitude change part 20, and the pusher mechanism 22 are arranged in the left and right direction (Y direction) in this order. The substrate transfer position P is set on the side of the pusher mechanism 22 and on the opposite side of the posture change unit 20.

The first transport mechanism (HTR) is formed on the right side of the rear of the transport storage section (ACB) of the stocker block 5. The first transfer mechanism (HTR) takes out, for example, 25 substrates (W) in batches from the carrier (C) placed on the carrier placing shelf 21a for obtaining and returning substrates, or removes the processed substrates (W). It is a mechanism for returning one piece at a time to the carrier (C). The first transfer mechanism HTR is provided with, for example, 25 acquisition hands 71a for collectively acquiring a plurality of unprocessed substrates W. One acquisition hand 71a is composed of a pair of arms and is capable of supporting one substrate W. The 25 acquisition hands 71a are used to acquire 25 substrates W from the carrier C. The first transfer mechanism (HTR), separately from the acquisition hand 71a, is provided with a return hand 71b used when returning the processed substrate W to the carrier C. The return hand 71b is composed of a pair of arms. In this example, for example, only one return hand 71b is provided in the first transport mechanism HTR, but instead of this, a plurality of return hands 71b may be provided. This configuration is advantageous when it is desired to transport the processed substrates W from each of a plurality of sheet wafer processing chambers (CMB) at once. The acquisition hand 71a and the return hand 71b appear to overlap when viewed from the vertical direction (Z direction). At this point, in Fig. 1, the uppermost acquisition hand 71a is shown as a representative of each hand. The return hand 71b is a hand formed below the 25 acquisition hands 71a and is the lowest level hand. By forming the acquisition hand 71a and the return hand 71b, control of the first transfer mechanism HTR becomes easy.

The first transport mechanism HTR can transport the 25 substrates W held by the acquisition hand 71a to the support 20A of the attitude change unit 20. The posture conversion unit 20 converts the plurality of substrates W received in a horizontal posture into a vertical posture. The pusher mechanism 22 is capable of receiving a plurality of substrates W in a vertical posture from the posture change unit 20 and moving the plurality of substrates W up, down, left and right.

In addition, the first transfer mechanism HTR uses the return hand 71b to receive the processed substrates W in the horizontal position one by one from the processing block 9 described later. Then, the first transport mechanism HTR returns the received substrate W to the empty carrier C on the carrier placement shelf 21a while maintaining the posture of the substrate W. The return hand 71b can advance and retreat in the direction in which the arm constituting the return hand 71b extends. In short, the return hand 71b advances from an aligned state in which it overlaps the acquisition hand 71a in the vertical direction (Z direction) to a protruding state where it protrudes relative to the acquisition hand 71a, and from the protruding state. It may retreat, returning to its original alignment. When the first transfer mechanism (HTR) transfers a plurality of substrates W using the acquisition hand 71a, the state of the return hand 71b is in the aligned state, and the state of the return hand 71b is in the aligned state, and the state of the return hand 71b is in the aligned state, and the state of the return hand 71b is aligned. does not interfere with In addition, when the first transfer mechanism (HTR) uses the return hand 71b to transfer one substrate W, the return hand 71b is in a protruding state, and the acquisition hand 71a is in a protruding state. , it does not interfere with return using the return hand 71b. In addition, in the first transfer mechanism (HTR) of this example, the return hand 71b is formed below the acquisition hand 71a, but the return hand 71b is formed above the acquisition hand 71a. You can use this configuration. The first transport mechanism (HTR) corresponds to the handling mechanism for return of the present invention. The first transport mechanism (HTR) is a mechanism interposed between the sheetfed processing area (R2) in the processing block 9 and the carrier placing shelf 21a in the stocker block 5, and is located in the sheetfed processing area (R2). ) to the carrier placing shelf 21a to transport the substrate W in a horizontal position. The handling mechanism for acquisition in the transfer block 7 is composed of a robot that serves both as a handling mechanism for return.

Fig. 2 explains the posture change unit 20 of Example 1. The posture change unit 20 is provided with a pair of horizontal holding parts 20B and a pair of vertical holding parts 20C extending in the vertical direction (Z direction). The support stand 20A has a support surface extending in the XY plane that supports the horizontal holding portion 20B and the vertical holding portion 20C. The rotation drive mechanism 20D is configured to rotate the horizontal holding portion 20B and the vertical holding portion 20C by 90° while holding the support 20A. By this rotation, the horizontal holding part 20B and the vertical holding part 20C become in an attitude extending in the left and right direction (Y direction). 3 is a schematic diagram explaining the operation of the posture change unit 20. Next, the configuration of each part will be described with reference to FIGS. 2 and 3.

The horizontal holding portion 20B supports a plurality of substrates W in a horizontal position from below. That is, the horizontal holding portion 20B has a comb-shaped structure having a plurality of protrusions corresponding to the substrate W as the support object. Between the adjacent protrusions, there is an elongated concave portion where the peripheral portion of the substrate W is located. When the peripheral part of the substrate W is inserted into this concave portion, the lower surface of the substrate W in a horizontal position contacts the upper surface of the projection, and the substrate W is supported in a horizontal position.

The vertical holding portion 20C supports a plurality of substrates W in a vertical position from below. That is, the vertical holding portion 20C has a comb-shaped structure having a plurality of protrusions corresponding to the substrate W as the support object. Between the adjacent protrusions, there is an elongated V-groove where the peripheral portion of the substrate W is located. When the peripheral part of the substrate W is inserted into this V groove, the substrate W is held in the V groove and supported in a vertical position. Since two vertical holding portions 20C are formed on the support stand 20A, the two peripheral points of the substrate W are held by different V grooves.

In Fig. 2, a pair of horizontal holding portions 20B and a pair of vertical holding portions 20C extending in the vertical direction (Z direction) surround the substrate W to be held so as to support the substrate W in a horizontal position. ) is formed along a virtual circle corresponding to . A pair of horizontal holding portions 20B are spaced apart by the diameter of the substrate W and hold both ends of the substrate W in the radial direction. In this way, the pair of horizontal holding portions 20B supports the substrate W in the horizontal position. On the other hand, a pair of vertical holding portions 20C are spaced apart by a distance shorter than the diameter of the substrate W, and support two portions of one peripheral edge of the substrate W. In this way, the pair of vertical holding portions 20C supports the substrate W in the vertical position. A pair of horizontal holding portions 20B are arranged to face each other in the X direction. The pair of vertical holding portions 20B are arranged to face each other in the X direction at a position slightly to the left in the Y direction compared to the pair of horizontal holding portions 20B.

The rotation drive mechanism 20D supports the support 20A rotatably by at least 90° around a horizontal axis AX2 extending in the front-back direction (X direction). When the horizontal support 20A is rotated 90°, the support 20A becomes vertical, and the posture of the plurality of substrates W held by the vertical holding portions 20B and 20C changes from horizontal to vertical. converted.

As shown in FIG. 3(f), the pusher mechanism 22 includes a pusher 22A on which a substrate W in a vertical position can be mounted, a lifting and lowering rotary portion 22B that rotates and raises the pusher 22A, and It is provided with a horizontal moving part 22C that moves the pusher 22A in the left and right direction (Y direction), and a rail 22D extending in the left and right direction (Y direction) that guides the horizontal moving part 22C. The pusher 22A is configured to support the lower portions of a plurality of (for example, 50) substrates W in a vertical position. The lifting/lowering rotary unit 22B is formed below the pusher 22A and is provided with a freely expandable mechanism for lifting/lowering the pusher 22A in the vertical direction. The lifting and lowering rotation unit 22B is also capable of rotating the pusher 22A by at least 180° around the vertical axis. The horizontal moving part 22C is configured to support the lifting and rotating part 22B and horizontally moves the pusher 22A and the lifting and rotating part 22B. The horizontal movement unit 22C is guided by the rail 22D and can move the pusher 22A from a pickup position close to the posture change unit 20 to the substrate delivery position P. In addition, the horizontal movement unit 22C can also shift the substrate W in the vertical position by a distance corresponding to the half pitch in the substrate arrangement by pushing the pusher 22A in the arrangement direction of the substrate W.

Here, the operation of the posture change unit 20 and the pusher mechanism 22 will be explained. The posture change unit 20 and the pusher mechanism 22 move a total of 50 substrates W, for example, accommodated in two carriers C, in a face-to-back manner at a predetermined interval (for example, 5 ㎜) are arranged. The 25 substrates W in the first carrier C are explained as the first substrate W1 belonging to the first substrate group. Similarly, the 25 substrates W in the second carrier C are explained as second substrates W2 belonging to the second substrate group. 3(a) to 3(f), for the sake of drawing, the number of first substrates W1 is three, and the number of second substrates W2 is three.

FIG. 3(a) shows a state in which the first substrates W1 in a horizontal posture are collectively delivered to the posture change unit 20 by the first transport mechanism HTR. At this time, the device surface (circuit pattern formation surface) of the first substrate W1 is facing upward. The 25 first substrates W1 are arranged at predetermined intervals (for example, 10 mm). This spacing of 10 mm is called full pitch (normal pitch). The first substrate W1 in this state is held by the horizontal holding portion 20B. Additionally, the pusher 22A at this time is in a pickup position below the support stand 20A.

FIG. 3(b) shows a state when the support base 20A of the posture change unit 20 is rotated by 90° by the rotation drive mechanism 20D. In this way, in the posture conversion unit 20, the posture of the 25 first substrates W1 is converted from the horizontal posture to the vertical posture. The first substrate W1 in this state is held by the vertical holding portion 20C.

FIG. 3(c) shows a state in which the pusher 22A rises from the pickup position and moves to a position immediately above the pickup position. This upward movement is performed by the lifting/lowering rotary unit 22B. In this way, when the pusher 22A moves from the lower side to the upper side of the first substrate W1, the first substrate W1 supported by the vertical holding portion 20C of the posture change portion 20 is maintained vertically. It is pulled out from section 20C and moves onto pusher 22A. A groove into which the substrate W is caught is formed on the upper surface of the pusher 22A. The first substrate W1 is supported in these grooves arranged at equal intervals. Since the grooves are arranged at half pitch, which is half of the full pitch, and the first substrate W1 is arranged at full pitch in the attitude change part 20, the upper surface of the pusher 22A located immediately above has the first substrate W1. 1 Grooves containing the substrate W1 and empty grooves not supporting the substrate W are arranged alternately.

FIG. 3(d) shows the operation of the pusher 22A moving by the half pitch width and the operation when the support 20A of the posture change unit 20 is reversely rotated by 90° by the rotation drive mechanism 20D. It is showing. The posture change unit 20 in this state can support the second substrate W2. In Fig. 3(d), a state when the second substrate W2 has already been transported to the posture change unit 20 is shown. Additionally, in Fig. 3(d), the second substrate W2 is supported by the horizontal holding portion 20B.

In the state shown in Fig. 3(d), when the pusher 22A in the immediately upper position returns to the original pickup position, the posture change unit 20 can rotate the support 20A by 90° again.

FIG. 3(e) shows what the support 20A looks like when it is actually rotated again. At this time, the pusher 22A is moved by the half pitch width, so when the pusher 22A is moved again to the immediately above position as shown in FIG. 3(f), the second substrate W2 is moved to the first substrate ( It enters the empty groove between the first substrates W1 on the upper surface of the pusher 22A without interfering with W1). In this way, a lot in which the first substrate W1 and the second substrate W2 are arranged alternately is formed. Additionally, in Fig. 3(e), the second substrate W2 is supported by the vertical holding portion 20C. Since the lot is configured by arranging the substrates W in a face-to-back manner, the device surfaces of the substrates W constituting the lot all face toward the left in FIG. 3(f). In this way, on the pusher 22A, 50 substrates W are arranged face-to-back at half pitch.

FIG. 3(f) shows the state when the pusher 22A moves again to the immediately above position. Then, the lot generated by the pusher 22A is conveyed in the left direction (Y direction) by the horizontal moving part 22C and moved to the substrate delivery position P.

As described above, the pusher mechanism 22 corresponds to a substrate holding portion that holds a plurality of substrates in the vertical posture of the present invention at a predetermined substrate transfer position P. The pusher mechanism 22 is a mechanism interposed between the posture change unit 20 and the substrate transfer position P, and changes the array pitch of the plurality of substrates between a full pitch and a half pitch narrower than the full pitch. Full pitch corresponds to the predetermined spacing of the present invention, and half pitch corresponds to the narrow spacing of the present invention.

<5. Processing Block>

See Figure 1. The processing block 9 performs various processes on a plurality of substrates W. The processing block 9 is divided into a batch processing area R1, a sheet wafer processing area R2, a sheet substrate transport area R3, and a batch substrate transport area R4 arranged in the width direction (Y direction). The batch processing area R1 and the batch substrate transfer area R4 extend in the front-back direction (X direction). The sheet wafer processing area R2 and the sheet wafer substrate transport area R3 are formed on the front side of the processing block 9 so as to be adjacent to the transfer block 7. In detail, the batch processing area R1 is formed on the left side of the processing block 9. The sheet wafer processing area R2 is formed to the right of the processing block 9. The sheet wafer substrate transport area R3 is disposed at a position sandwiched between the batch processing area R1 and the sheet processing area R2, that is, at the central portion of the processing block 9. The batch substrate transfer area R4 is located at the extreme left of the processing block 9.

<5.1. Batch processing area>

The batch processing area R1 in the processing block 9 is a rectangular area extending in the front-back direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the transfer block 7. The other end of the batch processing area R1 extends in a direction away from the transfer material block 7 (rear side).

The batch processing area R1 is provided with a batch processing unit that mainly performs batch processing. Specifically, in the batch processing area R1, a plurality of batch processing units BPU1 to BPU4 are arranged to collectively immerse a plurality of substrates W in the direction in which the batch processing area R1 extends. In addition, the batch processing area R1 is provided with an underwater holding unit 25 that holds a plurality of substrates W in a vertical position underwater.

The underwater holding unit 25 is adjacent to the transfer block 7 from the rear. The underwater holding unit 25 is provided with a holding tank 43 for immersing the lot in liquid and a lifter LF5 for raising and lowering the lot. The holding tank 43 contains pure water, for example, and prevents the substrate W in the tank from drying out. The lifter LF5, which receives the lot (for example, 50 substrates W) from the second transfer mechanism WTR at the transfer position above the holding tank 43, is at the immersion position (batch chemical solution described later) The substrate W is lowered to a position (corresponding to the processing position in the treatment tank CHB1), and the entire substrate W is immersed in pure water. The liquid contained in the holding tank 43 is not limited to pure water, and may be, for example, IPA diluted with water. The holding tank 43 holds in the liquid a plurality of substrates W in a vertical position at the position closest to the transfer block 7 in the batch processing area R1. The holding tank 43 corresponds to the holding tank of the present invention.

The arrangement of the batch processing units (BPU1 to BPU4) will be described in detail. The first batch processing unit (BPU1) is adjacent to the underwater holding unit 25 from the rear. The second batch processing unit (BPU2) is adjacent to the first batch processing unit (BPU1) from the rear. The third batch processing unit (BPU3) is adjacent to the second batch processing unit (BPU2) from the rear. The fourth batch processing unit (BPU4) is adjacent to the third batch processing unit (BPU3) from the rear. Accordingly, the first batch processing unit (BPU1), the second batch processing unit (BPU2), the third batch processing unit (BPU3), and the fourth batch processing unit (BPU4) move away from the transfer block 7 in that order. In this way, the underwater holding unit 25, the first batch processing unit (BPU1), the second batch processing unit (BPU2), the third batch processing unit (BPU3), and the fourth batch processing unit (BPU4) are operated in this order. The batch processing area R1 is arranged in the direction in which it extends (front-back direction: X direction).

Specifically, the first batch processing unit (BPU1) is provided with a batch rinsing tank (ONB) that rinses the lot in batches and a lifter (LF1) that raises and lowers the lot. The batch rinse treatment tank (ONB) performs rinse treatment on the lot. The batch rinse treatment tank (ONB) contains pure water and is formed for the purpose of cleaning the chemical liquid adhering to the plurality of substrates (W). In the batch rinse treatment tank (ONB), when the resistivity of the pure water in the tank rises to a predetermined value, the cleaning process is completed.

The second batch processing unit (BPU2) is a portion where a plurality of substrates W are transported before reaching the first batch processing unit (BPU1), and specifically, the batch chemical liquid processing tank (CHB1) and the lot are raised and lowered. It is equipped with a lifter (LF2). The batch chemical liquid treatment tank (CHB1) accommodates a chemical liquid such as a phosphoric acid solution. A lifter LF2 that moves the lot up and down is installed in the batch chemical treatment tank CHB1. For example, the batch chemical treatment tank (CHB1) supplies the chemical liquid from downward to upward to cause convection of the chemical liquid. The lifter LF2 moves up and down in the vertical direction (Z direction). Specifically, the lifter LF2 is raised and lowered across a processing position corresponding to the inside of the batch chemical processing tank CHB1 and a delivery position corresponding to the upper part of the batch chemical processing tank CHB1. The lifter LF2 holds the lot comprised of the substrate W in a vertical position. The lifter LF2 transfers the lot to and from the second transport mechanism WTR at the delivery position. When the lifter LF2 is lowered from the delivery position to the processing position while holding the lot, the entire substrate W is positioned below the liquid level of the chemical liquid. When the lifter LF2 rises from the processing position to the delivery position while holding the lot, the entire area of the substrate W is positioned on the liquid level of the chemical liquid. The chemical treatment is specifically an acid treatment. An example of the acid treatment is phosphoric acid treatment, but treatment using another acid may also be used. In the phosphoric acid treatment, an etching process is performed on a plurality of substrates W constituting the lot. The etching treatment, for example, chemically etches the nitride film on the surface of the substrate W. A rinsing treatment is performed on a plurality of substrates W on which the batch chemical treatment has been performed by the batch rinsing treatment tank ONB in the first batch processing unit BPU1 described above.

Specifically, the third batch processing unit (BPU3) includes a batch chemical liquid processing tank (CHB2) and a lifter (LF3) that raises and lowers the lot. The batch chemical treatment tank (CHB2) has the same configuration as the batch chemical treatment tank (CHB1) described above. That is, the batch chemical liquid treatment tank CHB2 contains the chemical liquid described above, and a lifter LF3 is installed. The batch chemical treatment tank (CHB2) performs the same treatment on the lot as the batch chemical treatment tank (CHB1). The substrate processing apparatus 1 of this example is provided with a plurality of processing tanks capable of processing the same chemical solution. This is because phosphoric acid treatment requires more time than other treatments. Phosphoric acid treatment requires a long time (eg, 60 minutes). Therefore, the apparatus of this example allows acid treatment to be performed in parallel using a plurality of batch chemical treatment tanks. Therefore, the lot is acid treated by either the batch chemical treatment tank (CHB1) or the batch chemical treatment tank (CHB2). With this configuration, the throughput of the device increases. Specifically, the fourth batch processing unit (BPU4) includes a batch chemical liquid processing tank (CHB3) and a lifter (LF4) that raises and lowers the lot. The batch chemical treatment tank (CHB3) has the same configuration as the batch chemical treatment tank (CHB1) described above.

In this way, the batch chemical treatment tank (CHB1), the batch chemical treatment tank (CHB2), and the batch chemical treatment tank (CHB3) in Example 1 are located further away from the transfer block 7 than the batch rinse treatment tank (ONB). It is in That is, the batch chemical treatment tanks (CHB1 to CHB3) of Example 1 are formed at a position separated from the transfer block 7 by the width of the holding tank 43 and the batch rinse treatment tank ONB. By configuring in this way, it is possible to prevent each mechanism of the dissimilar material block 7 from being corroded by the acid solution held by the batch chemical treatment tanks (CHB1 to CHB3). The same effect is also exhibited for the sheet wafer substrate transport mechanism (SPR) described later.

<5.2. Sheetfed processing area>

The sheet-fed processing area R2 in the processing block 9 is a rectangular area adjacent to the transfer block 7 in the front-back direction (X direction). The area faces the underwater holding unit 25 in the batch processing area R1 in the width direction (Y direction). In the sheet wafer processing region R2, a sheet wafer processing chamber CMB1 is formed to individually perform a predetermined process on each substrate W. In the substrate processing apparatus 1 of this example, a sheet wafer processing chamber (CMB2) is formed in the lower part of the sheet wafer processing chamber (CMB1), and a sheet wafer processing chamber (CMB3) is formed in the lower part of the sheet wafer processing chamber (CMB2), and three The sheetfed processing chambers are configured to be stacked in the height direction (Z direction). Although sheetfed processing chambers with different functions may be stacked to form the sheetfed processing region R2, in this example, the sheetfed processing chamber CMB2 and the sheetfed processing chamber CMB3 have the same configuration as the sheetfed processing chamber CMB1. I have it. In this example, three chambers are stacked to form the sheet wafer processing region R2, but the number of stacked chambers may be increased or decreased depending on the purpose of substrate processing.

The sheet wafer processing chamber CMB1 includes a rotation processing unit 33 that rotates the substrate W in a horizontal position, and a nozzle 35 that supplies processing liquid toward the substrate W. The rotation processing unit 33 rotates the substrate W within the XY plane (horizontal plane). The nozzle 35 can pivot between a standby position away from the rotation processing unit 33 and a supply position located above the rotation processing unit 33. The treatment liquid may be IPA (isopropyl alcohol), pure water, a mixture thereof, or a silane coupling agent that creates a water-repellent protective film on the surface of the substrate. Although the sheet wafer processing chamber CMB1 in FIG. 1 has a single nozzle 35, it may be provided with a plurality of nozzles 35 depending on the type of solution or pure water to be supplied.

The sheet wafer processing chamber CMB1 is provided with a housing that can seal the substrate W when processing the substrate W, and has the shape of a hexahedron with each face being rectangular. An inlet is formed on the side of the housing to guide the substrate W into the housing, and an outlet is formed on the other side of the housing to let the substrate W out of the housing. Shutters capable of blocking the openings are formed at the inlet and outlet, respectively. When the sheet wafer processing chamber CMB1 receives the substrate W, the entrance shutter is open and the exit shutter is closed. When the sheet wafer processing chamber CMB1 is processing, the shutters at the inlet and outlet are closed. When the sheet wafer processing chamber CMB1 exports the substrate W, the entrance shutter is closed and the exit shutter is open.

The positions of the inlet and outlet in the housing will be described. On the side of the housing, there is a holding unit opposing surface that faces the underwater holding unit 25 in the batch processing area R1. The entrance of the housing is provided on the surface opposite the holding unit. Additionally, on the side of the housing, there is a different material block opposing surface that faces the different material block 7. The outlet of the housing is provided on the face opposite to the transfer block. Accordingly, the substrate W held by the underwater holding unit 25 moves in the width direction (Y direction) and enters the sheet wafer processing chamber CMB1. The substrate W in the sheet wafer processing chamber CMB1 moves in the omni direction (X direction) and is expelled out of the sheet wafer processing chamber CMB1.

Since the sheetfed processing chamber (CMB2) and the sheetfed processing chamber (CMB3) have the same configuration as the sheetfed processing chamber (CMB1), both chambers have the same rotation processing unit 33 and nozzle 35 as the sheetfed processing chamber (CMB1). In each chamber, an entrance to the housing is formed on a surface opposite the holding unit, and an outlet of the housing is formed on a surface opposite the transfer material block.

<5.3. Sheet wafer substrate transfer area>

The sheet substrate transport area R3 in the processing block 9 is a rectangular area adjacent to the transfer block 7 in the front-back direction (X direction). The area is at a position sandwiched between the underwater holding unit 25 in the batch processing area R1 and the sheet wafer processing chamber CMB1 in the sheet wafer processing area R2, and the underwater holding unit 25 A sheet wafer substrate transport mechanism (SPR) capable of transporting the substrates W held in the sheet one by one to the sheet wafer processing chamber CMB1 is disposed. The sheet wafer substrate transport mechanism (SPR) can transport the substrate W held in the underwater holding unit 25 to the sheet wafer processing chamber CMB2 and the sheet wafer processing chamber CMB3 in addition to the sheet wafer processing chamber CMB1.

Fig. 4 explains the configuration of the sheet wafer substrate transport mechanism (SPR) of this example. As the figure shows, the sheet wafer substrate transport mechanism SPR is configured to transport one substrate W among the plurality of substrates W held in the liquid of the holding tank 43 in the batch processing area R1. In contrast, at a lateral position radially outwardly away from the periphery of the substrate W, the peripheral portion of the substrate W is approached radially inward from two opposing lateral positions via the substrate W, respectively. a clamping hand (87) having a pair of arms (87a) held in the liquid, and a lifting mechanism (82) for lifting the clamping hand (87) to expose the substrate (W) from the liquid surface of the holding tank (43); , a strut 81 that supports the lifting mechanism 82 movably in the height direction, and a rotatable clamp that rotates the clamp hand 87 to change the posture of the substrate W from a vertical posture to a horizontal posture. The hand base 85a and the clamping hand base rotation mechanism 85, the first rod 83a for conveying the substrate W that horizontally moves the clamping hand 87 to the sheetfed processing area R2, and the first rod is rotated. It is provided with a mechanism 83, a second rod 84a, and a second rod rotation mechanism 84. The clamping hand base 85a and the clamping hand base rotating mechanism 85 correspond to the rotating mechanism of the present invention and include a first rod 83a, a first rod rotating mechanism 83, a second rod 84a, and a second rod 84a. The two-rod rotation mechanism 84 corresponds to the horizontal movement mechanism of the present invention.

The sheet wafer substrate transport mechanism (SPR) is for removing only one substrate W held in a vertical position in the liquid of the holding tank 43 and transporting it to the sheet wafer processing area R2 while changing the orientation to a horizontal position. It has several configurations. That is, the sheet wafer substrate transport mechanism (SPR) has a cylindrical support 81 extending in the vertical direction (Z direction), as shown in FIG. 4 . The lifting mechanism 82 has a cylindrical member supported by a strut 81 so as to be able to move up and down freely. The first rod rotation mechanism 83 is a member that can rotate around an imaginary line AX3 extending in a direction perpendicular to the lifting mechanism 82 (Z direction) as a rotation axis. The first rod rotation mechanism 83 is provided with a first rod 83a extending in a direction perpendicular to the vertical direction (Z direction). Accordingly, the proximal end of the first rod 83a is connected to the first rod rotation mechanism 83. When the first rod rotation mechanism 83 rotates, the first rod 83a rotates about the support post 81 with the vertical direction (Z direction) as the rotation axis accordingly.

The second rod 84a is a member formed to extend the first rod 83a and extending in a direction perpendicular to the vertical direction (Z direction). Accordingly, the second rod 84a is formed at the tip of the first rod 83a. The second rod rotation mechanism 84 is a joint formed between the first rod 83a and the second rod 84a, and rotates the second rod 84a in a direction perpendicular to the first rod 83a (Z direction). It is a mechanism that rotates using the virtual line (AX4) extending to as the rotation axis.

The clamping hand base 85a is a member formed at the distal end of the second rod 84a and extending in a predetermined direction. The clamping hand base rotation mechanism 85 is a joint formed between the second rod 84a and the clamping hand base 85a, and rotates the clamping hand base 85a in the stretching direction and the vertical direction of the second rod 84a ( It is a mechanism that rotates an imaginary line (AX5) extending in a direction perpendicular to the Z direction as the rotation axis.

The nipper hand base 85a can rotate around the virtual line AX6, which is a virtual extension of the nip hand base 85a, as a central axis. And, at the tip of the clamping hand base 85a, a clamping hand 87 for supporting the substrate W is provided. The clamping hand 87 includes a pair of arms 87a that can sandwich the substrate W from both sides, and an arm support member 87b that movably supports the arms 87a. Therefore, the gripping hand base 85a is connected to the arm support member 87b.

The control unit that controls each mechanism will be described. The clamping hand lifting control unit 91 is configured to control the raising and lowering of the lifting mechanism 82, and functions, for example, when lowering the clamping hand 87 into the liquid of the holding tank 43. The clamping hand horizontal movement control unit 92 is a configuration that controls the rotation of the first rod rotating mechanism 83 and the second rod rotating mechanism 84, and for example, positions the clamping hand 87 in the placement processing area R1. It functions when moving from to the sheet wafer processing area (R2). The clamping hand rotation control unit 93 is a configuration that controls the rotation of the clamping hand base rotation mechanism 85 and the clamping hand base 85a, and functions, for example, when the substrate W from the vertical posture is changed to the horizontal posture. . The arm movement control unit 94 is a mechanism that brings a pair of arms 87a closer to each other and puts them in a closed state, or separates them from each other and puts them in an open state, and includes an arm movement mechanism 94a combined with the arm support member 87b. ) is a configuration that controls . The control section functions, for example, when transferring the substrate W held by the clamping hand 87 to the sheet wafer processing chamber CMB1.

FIG. 5 specifically explains the rotation style of the clamping hand 87 by the clamping hand rotation control unit 93. When the clamping hand 87, which is holding the substrate W in a vertical position (see Fig. 5(A)), is rotated by the clamping hand base rotation mechanism 85, as shown in Fig. 5(B), The clamping hand 87 is extended in the extending direction of the second rod 84a. Then, when the gripping hand base 85a is rotated from this state, the substrate W becomes in a horizontal posture, as shown in Fig. 5(C). In this way, the sheet wafer substrate transport mechanism (SPR) converts the posture of the single substrate W taken out from the holding tank 43 from the vertical posture to the horizontal posture.

6, 7, and 8 show how the holding hand 87 holds the substrate W in the vertical position in the holding tank 43. FIG. 6 shows a lateral position where the clamping hand 87 in an open state for transporting the substrate W held underwater in the holding tank 43 is spaced radially outward from the periphery of the substrate W, The state when moved to two opposing lateral positions via the substrate W is shown. That is, when the clamping hand 87 in the open state in the vertical position is lowered to the inside of the holding tank 43, the cross section of the clamping hand 87 becomes as shown in FIG. 6.

From this state, as shown in FIG. 7, when the clamping hand 87 is brought closer to the radial inner side of the substrate W and placed in a closed state, the substrate W to be clamped has both ends of a pair of arms 87a. It is inserted into each and held by the clamping hand 87. Additionally, as shown in FIGS. 6 and 7, the pair of arms 87a constituting the holding hand 87 are formed with V grooves through which the substrate W is sandwiched. The substrate W held by the clamping hand 87 is prevented from moving in the direction perpendicular to the surface of the substrate W by being inserted into these V grooves. The V groove in the arm 87a extends in an arc shape to imitate the shape of the substrate W.

FIG. 8(a) illustrates a state in which the arm 87a curved along the substrate W is in a closed state and clamps the substrate W that is to be clamped. Since the pair of arms 87a is formed with a V groove for positioning the peripheral portion of the substrate W, the peripheral portion of the substrate W to be clamped is hidden inside the arms. FIG. 8(b) illustrates a state in which the arm 87a is in an open state and the substrate W, which was the object of clamping, is opened. At this time, the pair of arms 87a are sufficiently spaced apart so that the arm 87a does not collide with the peripheral edge of the substrate W even if the arm 87a is moved from the tip of the arm 87a to the base end. It is written as . The width of the arm 87a with respect to the arrangement direction of the substrate W will be described later because it is easier to understand when explained along with the flow of substrate processing.

<5.4. Placement substrate transfer area>

The batch substrate transfer area R4 in the processing block 9 is a rectangular area extending in the front-back direction (X direction). The batch substrate transfer area R4 is formed along the outer edge of the batch processing area R1, one end extends to the transfer block 7, and the other end extends in a direction away from the transfer block 7.

In the batch substrate transfer area R4, a second transfer mechanism WTR is formed to transfer a plurality of substrates W in batches. The second transfer mechanism (WTR) transfers a plurality of substrates (W) between a substrate transfer position (P) determined within the transfer block 7, each batch processing unit (BPU1 to BPU4), and the underwater holding unit 25. (Specifically, lots) are returned in batches. The second transport mechanism WTR is configured to be capable of reciprocating in the front-back direction (X direction) across the transfer block 7 and the processing block 9. The second transfer mechanism WTR can move to the substrate transfer position P in the transfer block 7 in addition to the batch substrate transfer area R4 in the processing block 9 . The second transport mechanism (WTR) corresponds to the batch substrate transport mechanism of the present invention. The second transport mechanism WTR is configured to collectively transport a plurality of substrates W arranged at half pitch.

The second transport mechanism (WTR) is provided with a pair of placement hands 23 for transporting the lot. The placement hand 23 has, for example, a rotation axis facing the width direction (Y direction), and swings around this rotation axis. A pair of placement hands 23 holds both ends of a plurality of boards W arranged at half pitch constituting the lot. The second transport mechanism WTR includes a pusher 22A located at the substrate transfer position P in the transfer block 7, each lifter LF1 to LF4 belonging to the batch processing units BPU1 to BPU4, and underwater A lot consisting of a plurality of substrates W arranged at half pitch is delivered between lifters LF5 belonging to the holding unit 25.

In this way, the substrate processing apparatus 1 of the present example has an elongated batch substrate transfer region R4 extending in the front-back direction (X direction) from left to right, respectively, and an elongated substrate transfer region R4 extending in the front-back direction (X direction). Each region is arranged in the following order: an elongated batch processing area (R1), a sheet wafer substrate transport area (R3) formed on the transfer block 7 side, and a sheet wafer processing area (R2) formed on the transfer block 7 side. .

The substrate processing apparatus 1 of this example stores, in addition to the parts described above, a CPU (Central Processing Unit) 75 that controls each mechanism and each processing part, and various information necessary for the processing process, such as programs and setting values. It is provided with a memory unit 76 that does the following. Additionally, the specific configuration of the CPU is not particularly limited. The entire device may be provided with one CPU, or each block may be provided with one or multiple CPUs. This point is the same for the storage unit 76. Controls performed by the CPU include, for example, the carrier transport mechanism 19, the first transport mechanism (HTR), the second transport mechanism (WTR), the attitude change unit 20, the pusher mechanism 22, and the sheet wafer substrate. Each mechanism is related to the transfer mechanism (SPR).

＜Substrate processing flow＞

Fig. 9 is a flowchart explaining the flow of substrate processing in this example. The substrate processing in this example involves, for example, performing etching and water-repellent processing on the surface of the substrate W in the semiconductor device manufacturing process. Hereinafter, the flow of substrate processing will be described in detail according to the flow chart.

Step S11: The carrier C storing the unprocessed substrate W is set on the table 15 of the input unit 11. After that, the carrier C is received into the device from the input portion 11 and placed on the carrier placing shelf 21a for delivery formed in the stocker block 5 by the carrier transport mechanism 19 (FIG. 10 reference). The first transport mechanism HTR formed on the transfer block 7 takes out a plurality of substrates W at a time from the carrier C on the carrier placing shelf 21a. Then, the first transport mechanism HTR delivers a plurality of substrates W in a horizontal posture to the posture change unit 20 .

Step S12: The posture conversion unit 20 converts the posture of the plurality of substrates W from the horizontal posture to the vertical posture and transmits the plurality of substrates W to the pusher mechanism 22. In the pusher 22A of the pusher mechanism 22, grooves into which the substrate W is inserted and empty grooves are alternately arranged. Since each groove is arranged at half pitch, the substrate W is arranged on the pusher 22A at the same full pitch as when stored in the carrier C.

Step S13: The pusher mechanism 22 receives another set of substrate groups different from the group of substrates being held from the posture conversion unit 20 and performs half-pitch processing. The subsequent group of substrates received by the pusher 22A is inserted into each of the empty grooves in step S12. In this way, the substrate W associated with the first carrier C and the substrate W associated with the second carrier are alternately inserted into each groove of the pusher 22A arranged at half pitch. Considering that 25 boards W are stored in one carrier C, two carriers (50 sheets) of boards W are arranged in the pusher 22A.

Step S14: After that, batch processing is performed on a plurality of substrates W. Specifically, the lot waiting at the substrate delivery position P is lifted in a batch in the vertical direction (Z direction) by the second transport mechanism WTR and then transported in the front-back direction (X direction). A plurality of substrates W in a vertical position are arranged in the width direction (Y direction) and are connected to lifters LF2 to lifters belonging to the second batch processing unit (BPU2) to the fourth batch processing unit (BPU4). LF4) is delivered to any of them. Lifters LF2 to LF4 that receive the substrate W are in the delivery position. In this way, the lot is positioned on the liquid level of any one of the batch chemical liquid treatment tank (CHB1) to the batch chemical liquid treatment tank (CHB3). FIG. 10 illustrates a lot being processed in a batch chemical treatment tank (CHB1). The lifter LF2, which has received the lot, descends to immerse the lot in the chemical liquid in the batch chemical liquid treatment tank CHB1. In this way, chemical treatment for the lot is performed.

When the chemical treatment is completed, the lifter LF2 exposes the lot from the batch chemical treatment tank CHB1 to the liquid level. The lot is then collectively lifted in the vertical direction (Z direction) by the second transport mechanism (WTR) and then transported in the front-back direction (X direction). The substrate W in the vertical position is transferred to the lifter LF1 of the first batch processing unit BPU1 while being arranged in the width direction (Y direction). At this time, the lifter LF1 is in the delivery position. In this way, the lot is positioned on the liquid level in the batch rinse treatment tank (ONB). The lifter LF1 that receives the lot descends and immerses the lot in the batch rinse treatment tank (ONB). In this way, the cleaning process for the lot is performed (see Fig. 10).

When the cleaning process is completed, the lifter LF1 exposes the lot from the batch rinse treatment tank ONB to the liquid level. The lot is then lifted in the vertical direction (Z direction) by the second transport mechanism (WTR) and then transported in the front-back direction (X direction). A plurality of substrates W in a vertical position are delivered to the underwater holding unit 25 in a state in which they are arranged in the width direction (Y direction) (see Fig. 10). At this time, the lifter LF5 of the underwater holding unit 25 is in the delivery position.

As described above, in step S14, the second transfer mechanism WTR collectively receives a plurality of substrates W in a vertical position at the substrate transfer position P of the transfer block 7, and the received plurality of substrates WTR is The sheet of substrate W is transferred in that order to the second batch processing unit BPU2 related to chemical treatment, the first batch processing unit BPU1 related to rinsing processing, and the underwater holding unit 25.

Step S15: The lot delivered to the lifter LF5 of the underwater holding unit 25 is moved to a waiting position (corresponding to the processing position in the lifter LF1 of the first batch processing unit BPU1) by the lifter LF5. ) is lowered to . A plurality of substrates (W) in the standby position are below the water surface of pure water. This prevents the surface of the substrate W from drying out.

Step S16: As shown in FIG. 11, one sheet of the substrate W held underwater in the underwater holding unit 25 is held by the single wafer substrate transport mechanism (SPR) formed in the single wafer substrate transport region R3. It is pulled upward in the vertical direction (Z direction) from the tank 43. The pulled out substrate W is changed in orientation as described later and then transported to the sheet wafer processing chamber. The sheet wafer substrate transport mechanism (SPR) performs this operation until the substrate W held by the underwater holding unit 25 disappears. The sheet wafer substrate transport mechanism (SPR) completes the unloading of the lot held in the holding tank 43 by carrying out 50 substrate transfers. As a method of pulling out the substrate W at this time, the single wafer substrate transport mechanism (SPR) may be used to pull out a plurality of substrates W forming a lot in order from the end. Among the plurality of substrates W forming the lot, the substrate W stored in one carrier C may be pulled out with priority over the substrate W stored in the other carrier C.

Among the above two methods, when the method of setting the priority in units of carriers (C) is adopted, the clamping hand 87 is used to hold the front substrate W and the rear substrate W among the substrates W arranged at half pitch. The intermediate substrates (W) sandwiched between the substrates (W) are held and taken out from the lot. According to this example, since the clamping hand 87 is configured to directly clamp the substrate W, which is the clamping target, there is no need to insert the clamping hand 87 into the gap between the substrate W. The clamping hand 87 can sufficiently clamp the substrate W as long as it can come into contact with the periphery of the substrate W. And, the width of the clamping hand 87 in the arrangement direction of the plurality of substrates W may be less than twice the half pitch. This is because the clamping hand 87 grips the substrate W by moving to the same position as the substrate W to be clamped in the arrangement direction of the plurality of substrates W in the vertical position in the holding tank 43. am. In other words, the arm 87a may be configured so that it does not contact the substrate W located in front of the substrate W to be clamped, and does not contact the substrate W located behind the substrate W to be clamped. The distance from the substrate W to be clamped to the front substrate W is a distance equivalent to half pitch, and the distance from the substrate W to be clamped to the rear substrate W is a distance equivalent to half pitch. Accordingly, the arm 87a may be thick enough to not reach half pitch forward from the substrate W to be clamped, and may be thick enough to not reach half pitch backward from the substrate W to be clamped. According to this example, since the width of the clamping hand 87 is sufficiently secured, the substrate W can be reliably transported without the clamping hand 87 bending and vibrating significantly when moved.

Among the above two methods, when a method is adopted in which the sheet wafer substrate transport mechanism (SPR) pulls out a plurality of substrates W forming a lot in order from the end, the arm 87a of the clamping hand 87 is clamped. The thickness may be sufficient to not reach half pitch with respect to the substrate side adjacent to the target substrate W. On the side opposite to the side of the adjacent substrate from the substrate W to be clamped, the arm 87a may be thick enough to not collide with the holding tank 43, or may be thicker than half pitch.

Step S17: The vertical posture substrate W pulled out from the holding tank 43 in the underwater holding unit 25 is converted to the horizontal posture by the sheet wafer substrate transport mechanism (SPR). After that, the sheet wafer substrate transport mechanism SPR horizontally moves the substrate W in the horizontal position and transports it to the entrance of the sheet wafer processing chamber CMB1 in the sheet wafer processing area R2. A shutter is formed at the entrance of the sheet wafer processing chamber (CMB1) to open/close the entrance, but the shutter at this time is in an open state. The clamping hand 87 enters the sheet wafer processing chamber CMB1 from the entrance, places the substrate W on the rotation processing unit 33, and exits the sheet wafer processing chamber CMB1. FIG. 11 shows a state in which the substrate W is transported to the sheet wafer processing chamber CMB1 among the sheet wafer processing chamber CMB1, the sheet wafer processing chamber CMB2, and the sheet wafer processing chamber CMB3. Additionally, the sheet wafer substrate transport mechanism (SPR) may be configured to perform an attitude change while moving the substrate W horizontally. In this case, the substrate W is moved horizontally while changing the inclination angle with respect to the horizontal plane.

Step S18: The substrate W transported to the inside of the sheet wafer processing chamber CMB1 is subjected to sheet wafer processing there. Specifically, the substrate W is subjected to, for example, a surface water-repellent treatment. The inlet and outlet formed in the sheet wafer processing chamber CMB1 during processing are each blocked by a shutter. As a result, the processing liquid in the sheet wafer processing chamber CMB1 does not scatter out of the chamber.

Step S19: The substrate W on which the sheetfed process has been completed is returned to the carrier C by the first transport mechanism HTR. That is, when the sheet wafer processing is completed, the shutter of the sheet wafer processing chamber CMB1 is controlled, and the exit of the sheet wafer processing chamber CMB1 is opened. The return hand 71b of the first transport mechanism (HTR) enters the sheet wafer processing chamber CMB1 from the exit, lifts the substrate W on the rotation processing unit 33, and in that state enters the sheet wafer processing chamber CMB1. eject from In that state, the first transfer mechanism HTR returns one substrate W to the carrier C placed on the carrier placement shelf 21a.

Steps S16 to S19 described above are explanations that focus on one substrate W held underwater, and in each of these steps S16 to Step S19, the entire substrate W is transferred from the underwater holding unit 25 to the carrier ( C) is repeated until returned. Finally, as shown in FIG. 12, the carrier C accommodating the processed substrate W is moved from the carrier placement shelf 21a to the placement table 17 of the dispensing portion 13. This movement of the carrier C is performed by the carrier conveyance mechanism 19. This concludes the substrate processing of the present invention.

As described above, according to the substrate processing apparatus 1 of this example, the substrate W can be transported reliably, and the substrate W and the final product based thereon can be maintained at high quality. That is, a clamping hand 87 for conveying the substrate from the batch processing area R1 to the sheetfed processing area R2 of the present invention and each mechanism for driving this are formed, and the clamping hand 87 holds one sheet of substrate. It has a pair of arms 87a that pinch and can approach and separate from each other. With this configuration, the pair of arms 87a themselves directly hold the substrate W, rather than via a tab. That is, the clamping hand 87 of the present invention is not inserted into the gap between the substrate W to be clamped and the neighboring substrate W opposing the substrate W. Rather, the clamping hand 87 grips the outer peripheral portion of the substrate W that is to be clamped from the outside of the array of the substrates W. That is, the clamping hand 87 of the present invention does not need to be configured to insert an arm into the gap between the substrates. According to the present invention, collision of the transport arm with the substrate W is suppressed, so the substrate W is reliably transported, and the substrate W and the final product based thereon are maintained at high quality. 1) can be provided.

[Example 2]

Next, the substrate processing apparatus 2 according to Example 2 will be described. The substrate processing device 2 related to this example is mainly a substrate return robot that returns the substrates W to the carrier C, separately from the substrate acquisition robot that takes out a plurality of substrates W from the carrier C. It differs from the device of Example 1 in that it has a dragon robot. That is, the handling mechanism for acquisition and the handling mechanism for return in the transfer material block 7 are composed of individual robots formed adjacent to each other in the left and right direction (Y direction).

FIG. 13 explains the overall configuration of the substrate processing apparatus 2. The loading and unloading block 3 and the processing block 9 in the substrate processing apparatus 2 are the same as those of the apparatus in Example 1. In the apparatus of this example, the first transport mechanism HTR in the transfer block 7 takes out a plurality of substrates W from the carrier C. On the other hand, the apparatus of the present invention is configured so that the substrate return mechanism DR returns the processed substrates W to the carrier C one by one. The device of this example is distinctive in this respect.

<Stalker Block>

The stocker block 5 of this example has two carrier placing shelves 21c and two carrier placing shelves 21d for loading and unloading substrates into and out of the carrier C. The carrier placement shelf 21c is adjacent to the carrier placement shelf 21d, is located more centrally in the width direction (Y direction) than the carrier placement shelf 21d, and is the first in the transfer block 7. It faces the transport mechanism (HTR) in the anteroposterior direction (X direction). The carrier placement shelf 21d is located at the right end of the carrier placement shelf 21c in the width direction (Y direction), and extends from the front-back direction (X direction) to the substrate return mechanism DR in the transfer block 7. They are facing each other. The carrier transport mechanism 19 is capable of moving the empty carrier C placed on the carrier placing shelf 21c to the carrier placing shelf 21d. The carrier placement shelf 21c corresponds to the acquisition shelf of the present invention, and the carrier placement shelf 21d corresponds to the return shelf of the present invention.

<Ijae Block>

The transfer block 7 in this example has two transport mechanisms for acquiring the substrate to the carrier C and returning the substrate. The two transfer mechanisms are a first transfer mechanism (HTR) that acquires the substrate W from the carrier C, and a substrate return mechanism DR that returns the substrate W to the carrier C. The first transfer mechanism (HTR) and the substrate return mechanism (DR) are composed of two robots that are independent of each other.

The first transport mechanism (HTR) of Example 2 has the same structure as the first transport mechanism (HTR) of Example 1, but is characterized by not having a return hand. The configuration having the acquisition hand 71a for collectively holding 25 substrates W is the same as that of Example 1. That is, the first transfer mechanism (HTR) accesses the carrier placing shelf 21c from all directions (X direction), and carries out 25 substrates (W) stored in the carrier C placed on the carrier placing shelf 21c. ) It is possible to grasp them in batches. The first transport mechanism (HTR) corresponds to the handling mechanism for acquisition of the present invention. The first transport mechanism HTR can access the carrier C placed on the carrier placing shelf 21c.

The device of Example 2, like Example 1, includes an attitude changer 20 that changes the postures of a plurality of substrates and a pusher mechanism 22 that lifts the substrate W in a vertical posture from the posture changer 20. has The attitude change part 20 and the pusher mechanism 22 of the present invention do not necessarily have to have a configuration related to half pitch. Therefore, the arrangement pitch of the grooves of the pusher 22A of the pusher mechanism 22 may be a length corresponding to the full pitch.

The substrate return mechanism DR is located at the right end of the transfer block 7, is accessible to each sheetfed processing chamber CMB1, sheetfed processing chamber CMB2, and sheetfed processing chamber CMB3, and is provided on the carrier loading shelf 21d. ) It is also possible to access the carrier (C) placed in . The substrate return mechanism DR has a return hand 78, enters from the exit of the sheetfed processing chamber CMB1, the sheetfed processing chamber CMB2, or the sheetfed processing chamber CMB3, and lifts the substrate W. It is possible to advance and retreat so that this is possible. Additionally, the return hand 78 can enter the inside of the carrier C and store the substrate W inside the carrier C. That is, the return hand 78 can be turned to face the processing block 9 side, and can be turned to face the stocker block 5 side. In this example, for example, only one return hand 71b is provided in the substrate return mechanism DR, but instead of this, a plurality of return hands 71b may be provided. This configuration is advantageous when it is desired to transfer the processed substrates W all at once from each of a plurality of sheet wafer processing chambers (CMB). The substrate return mechanism DR corresponds to the carrier placing shelf 21d of the present invention. The substrate return mechanism DR can access the carrier C placed on the carrier placing shelf 21d.

<Processing block>

The second transport mechanism WTR in the processing block 9 is configured to transport a plurality of substrates W arranged at full pitch. Additionally, the lifters formed in the batch chemical treatment tank (CHB), batch rinse treatment tank (ONB), and holding tank 43 are capable of holding a lot composed of a plurality of substrates W arranged at full pitch.

The clamping hand 87 of this example lifts a plurality of boards W arranged at full pitch from the holding tank 43 in order from the end. Therefore, the arm 87a of the clamping hand 87 may be thick to the extent that it does not reach full pitch with respect to the side of the substrate W adjacent to the clamping target. On the side opposite to the side of the adjacent substrate from the substrate W to be clamped, the arm 87a may be thick enough to not collide with the holding tank 43, or may be thicker than half pitch. Additionally, the clamping hand 87 may be given a function of lifting the substrate W located in the middle of the plurality of substrates W arranged at full pitch from the holding tank 43. In this case, the arm 87a may have a thickness that does not reach full pitch forward from the substrate W to be clamped, and has a thickness that does not reach full pitch backward from the substrate W to be clamped. . If the arm 87a is configured in this way, a plurality of substrates W arranged at full pitch can be lifted from the holding tank 43 in order from not only one end but also the other end.

＜Substrate processing flow＞

FIG. 14 is a flowchart explaining the flow of the substrate processing apparatus of this example. The substrate processing in this example involves, for example, performing etching and water-repellent processing on the surface of the substrate W in the semiconductor device manufacturing process. Hereinafter, the flow of substrate processing will be described in detail according to the flow chart.

Step S20: The carrier C storing the unprocessed substrate W is set on the table 15 of the input unit 11. After that, the carrier C is received into the device from the input portion 11 and placed on the carrier placing shelf 21a for delivery formed in the stocker block 5 by the carrier transport mechanism 19 (FIG. 15 reference). The first transport mechanism HTR formed on the transfer block 7 takes out a plurality of substrates W at a time from the carrier C on the carrier placing shelf 21a. Then, the first transport mechanism HTR delivers a plurality of substrates W in a horizontal posture to the posture change unit 20 .

Step S21: The empty carrier C placed on the carrier placing shelf 21c is conveyed to the adjacent carrier placing shelf 21d. This carrier is transported by the carrier transport mechanism 19 (see Fig. 15).

Step S22: As shown in FIG. 15, the posture conversion unit 20 converts the posture of the plurality of substrates W from the horizontal posture to the vertical posture and transmits the plurality of substrates W to the pusher mechanism 22. . Since the pusher mechanism 22 in this example is at the substrate transfer position P even without moving in the width direction (Y direction), the second transfer mechanism WTR can transfer a plurality of substrates W by accessing the pusher mechanism 22. can be lifted reliably. With this configuration, the configuration and control of the pusher mechanism 22 can be simplified.

Step S23: Batch processing is performed on a plurality of substrates W (see Fig. 15). This step is the same as step S14 in Example 1. That is, the second transport mechanism WTR first transports the plurality of substrates W at the substrate transfer position P all at once to the batch chemical treatment tank CHB1. After that, the second transfer mechanism (WTR) transfers the plurality of substrates (W) from the batch chemical treatment tank (CHB1) to the batch rinse treatment tank (ONB), and from the batch rinse treatment tank (ONB) to the underwater holding unit 25. Return in order.

Step S24: The plurality of substrates W are held underwater in the underwater holding unit 25. This step is the same as step S15 in Example 1. A plurality of substrates (W) in the standby position are below the water surface of pure water. This prevents the surface of the substrate W from drying out.

Step S25: One sheet of the substrate W held underwater in the underwater holding unit 25 is vertically moved from the holding tank 43 by the sheet wafer substrate transport mechanism (SPR) formed in the sheet substrate transport region R3. (Z direction) is pulled upward. This step is the same as step S16 in Example 1.

Step S26: The vertical posture substrate W pulled from the holding tank 43 in the underwater holding unit 25 is converted to the horizontal posture by the sheet wafer substrate transport mechanism (SPR). After that, the sheet wafer substrate transport mechanism SPR horizontally moves the substrate W in the horizontal position and transports it to the entrance of the sheet wafer processing chamber CMB1 in the sheet wafer processing area R2. This step is the same as step S17 in Example 1.

Step S27: The substrate W transported to the inside of the sheet wafer processing chamber CMB1 is subjected to sheet wafer processing there. Specifically, the substrate W is subjected to, for example, a surface water-repellent treatment. This step is the same as step S18 in Example 1.

Step S28: The substrate W on which the sheetfed process has been completed is returned to the carrier C by the substrate return mechanism DR. That is, when the sheet wafer processing is completed, the shutter of the sheet wafer processing chamber CMB1 is controlled, and the exit of the sheet wafer processing chamber CMB1 is opened. The return hand 71b of the substrate return mechanism DR enters the sheet wafer processing chamber CMB1 from the exit, lifts the substrate W on the rotation processing unit 33, and leaves the sheet wafer processing chamber CMB1 in that state. Exit. In that state, the substrate return mechanism DR returns one substrate W to the carrier C placed on the carrier placement shelf 21d. FIG. 16 shows how one substrate W is transported in each step from step S24 to step S28.

Steps S25 to S28 described above are explanations focusing on one substrate W held underwater, and each of these steps S25 to Step S28 is performed by transferring the entire substrate W from the underwater holding unit 25 to the carrier ( C) is repeated until returned. Finally, as shown in FIG. 17, the carrier C accommodating the processed substrate W is moved from the carrier placement shelf 21a to the placement table 17 of the dispensing portion 13. This movement of the carrier C is performed by the carrier conveyance mechanism 19. This concludes the substrate processing of the present invention.

As described above, according to the substrate processing apparatus 2 of this example, in addition to the effects of the apparatus of Example 1 described above, the following effects are achieved. That is, in the device of this example, the first transport mechanism (HTR) for acquiring substrates and the substrate return mechanism (DR) for returning substrates in the transfer block 7 are composed of individual robots formed adjacent to each other. With this configuration, control of each mechanism is simplified, and a substrate processing device capable of reliable substrate transfer can be provided. That is, the first transport mechanism HTR in this example simply repeats the simple transport of taking out a plurality of substrates W from the carrier C and passing them to the attitude change unit 20. In addition, the substrate return mechanism DR of this example performs a simple transfer of receiving the substrate W from the sheet wafer processing chamber CMB1, the sheet wafer processing chamber CMB2, and the sheet wafer processing chamber CMB3 and handing it to the carrier C. Just repeat.

The present invention is not limited to the configuration described above, and the following modifications are possible.

(1) Although Example 1 and Example 2 described above were configured in that the sheet wafer processing chamber CMB1 performed water repellent treatment on the substrate W, the present invention is not limited to this configuration. The sheet wafer processing chamber CMB1 may be, for example, a supercritical fluid chamber that performs drying processing. The supercritical fluid chamber performs a drying process on the substrate W using, for example, carbon dioxide that has become a supercritical fluid. A fluid other than carbon dioxide may be used as the supercritical fluid. The supercritical state is obtained by subjecting carbon dioxide to its own critical pressure and temperature. The specific pressure is 7.38 MPa and the temperature is 31°C. In a supercritical fluid, the surface tension of the fluid is zero, so the circuit pattern on the surface of the substrate W is not affected by the gas-liquid interface. Therefore, when the substrate W is dried using the supercritical fluid, the occurrence of so-called pattern collapse, in which the circuit pattern collapses on the substrate W, can be prevented.

(2) In the above-described modification (1), the sheet wafer processing chamber CMB1 was a supercritical fluid chamber, but the present invention is not limited to this configuration. Chambers other than the sheetfed processing chamber (CMB1) may be supercritical fluid chambers. Additionally, all of the plurality of chambers formed in the sheet wafer processing region R2 may be supercritical fluid chambers, and the supercritical fluid chamber and the substrate water repellent treatment may be performed in the plurality of chambers formed in the sheet wafer processing region R2. It can also be configured so that chambers coexist.

(3) For example, 50 substrates W arranged at half pitch in Example 1 were arranged face-to-back with the device surfaces facing the same direction, but the present invention is not limited to this configuration. , for example, it may be configured in such a way that 50 boards (W) are arranged face to face. The advantage of arranging 50 substrates W face-to-face is that the device side of the first substrate W in the lot can be turned toward the second substrate W, and the device side of the first substrate W in the lot can be turned toward the second substrate W. The device surface of the 49th substrate (W) can be directed toward the 49th substrate (W). In this way, when the device surfaces of the substrates W at both ends of the lot face inward, the lot is conveyed with the device surfaces of the substrates W protected. Therefore, by arranging the substrate W in a face-to-face manner, a desired circuit pattern can be reliably formed on the substrate W.

The face-to-face lot is formed by the posture change unit 20 and the pusher mechanism 22 in the transfer block 7. To form the lot, first, for example, 25 first substrates W1 in a horizontal posture are brought into a vertical posture by the posture change unit 20. Then, the first substrate W1 whose posture has been changed is lifted by the pusher 22A. After this, the first substrate W1 is flipped left and right, and the device surface of the first substrate W1 is inverted. Then, for example, the 25 second substrates W2, where the posture changer 20 is in a horizontal posture, are set to a vertical posture. Finally, the pusher 22A lifts the second substrate W2 to complete the lot. In this way, the first substrate W1 is inverted and assembled into the lot, while the second substrate W2 is not inverted and assembled into the lot. Accordingly, the direction of the device surface is different between the first substrate W1 and the second substrate W2. Since the first substrate W1 and the second substrate W2 are arranged alternately, the resulting lot is face-to-face, with the device surfaces of adjacent substrates W facing each other.

Hereinafter, each process related to lot formation will be described in detail with reference to FIGS. 18 and 19. During the lot forming process, the operation of the pusher 22A lifting the first substrate W1 is the same as in FIGS. 3(a) to 3(c) in Example 1, so description is omitted. Figure 18 explains the subsequent operation. FIG. 18(a) is a diagram corresponding to FIG. 3(d) described above, showing that the pusher 22A does not shift in the Y direction as in Example 1, but instead rotates 180°. . By this operation, all of the device surfaces of the first substrate W1 that were facing to the left are turned to the right. Also, at this time, the phase of the arrangement of the first substrate W1 is shifted by half pitch. In order to realize this shift operation, the rotation center of the pusher 22A is shifted only slightly (by half the half pitch width) in the arrangement direction from the center of the arrangement of the first substrate W1.

FIG. 18(b) is a diagram corresponding to FIG. 3(e) described above, and shows the state when the support stand 20A holding the second substrate W2 is rotated by 90°. At this time, since the device surface of the second substrate W2 in the horizontal position was facing upward, the device surface was all facing left.

FIG. 19 is a diagram corresponding to FIG. 3(f) described above and shows the state when the pusher 22A is moved again to the immediately above position. Since the first substrate W1 is rotated by 180°, the phase of the array is shifted by half pitch, the second substrate W2 is held by the vertical holding portion 20C, as in the case of FIG. 3(f). ) enters the empty groove sandwiched between the first substrates W1 on the upper surface of the pusher 22A without interfering with the first substrate W1. In this way, a face-to-face lot is formed in which the first substrate W1 with the device surface facing the right direction and the second substrate W2 with the device surface facing the left are alternately arranged.

(4) The arm 87a constituting the clamping hand 87 according to Examples 1 and 2 had a V groove, but the present invention is not limited to this configuration. A groove that can introduce the periphery of the substrate W may be formed on the contact surface of the arm 87a with the substrate W, and the cross-sectional shape of the groove does not necessarily have to be V-shaped. The V groove is only an example of a suitable groove. As for the specific configuration of the cross-sectional shape of the groove, the width may be gradually narrowed as the groove becomes deeper. As these tapered grooves progress inward, the width of the groove becomes smaller. Accordingly, when the peripheral portion of the substrate W is introduced into the groove, it eventually comes into contact with both sides of a pair of wall portions constituting the groove. In this way, the end of the substrate W is inserted into the groove and fixed with respect to the direction perpendicular to the groove. Since this event occurs in both of the pair of arms 87a, the substrate W does not slip off any of the arms 87a. In this way, the substrate W is securely held by the clamping hand 87.

(5) The processing block 9 according to Examples 1 and 2 had a configuration in which the holding tank 43 was formed separately from the batch rinse treatment tank ONB, but the present invention is not limited to this configuration. The batch rinse treatment tank ONB may be disposed closer to the sheet substrate transfer area R3 so that the batch rinse treatment tank ONB has the function of the holding tank 43. In this case, the sheet wafer substrate transport mechanism (SPR) can access the batch rinse treatment tank (ONB).

(6) In the processing block 9 related to Examples 1 and 2, the batch rinse treatment tank (ONB) was located on the transfer block 7 side rather than the batch chemical treatment tank (CHB1), but the present invention has this configuration. It is not limited to The number and context of the batch rinse treatment tank and the batch chemical treatment tank can be changed appropriately according to the processing purpose of the device. For example, a batch chemical treatment tank may be formed in front of the transfer block 7 and a batch rinse treatment tank may be formed inside, and the batch chemical treatment tank and the batch rinse treatment tank may be arranged alternately to form the treatment block 9. You may do so.

5: Stalker Block
7: Transfer block
9: Processing block
19: Carrier transport mechanism
20: Posture conversion unit (posture conversion mechanism)
21a: wit shelf (carrier wit shelf)
21c: Acquisition shelf (carrier receptacle shelf)
21d: Return shelf (carrier receptacle shelf)
22: Pusher mechanism (substrate holding part)
43: maintenance tank
82: lifting mechanism
83: Horizontal movement mechanism (first rod rotation mechanism)
84: Horizontal movement mechanism (second rod rotation mechanism)
85: Narrow hand base rotation mechanism (rotation mechanism)
87: Narrow finger hand
C: Carrier
CHB: Batch chemical treatment tank
CMB: Sheetfed Processing Chamber
DR: Substrate return mechanism (handling mechanism for return)
HTR: 1st transfer mechanism (handling mechanism for acquisition, handling mechanism for return)
P: Substrate transfer position
R1: Batch processing area
R2: Sheetfed processing area
R3: Sheet wafer substrate transport area
R4: Batch substrate transfer area
W: substrate
WTR: Second transfer mechanism (batch transfer mechanism)

Claims (7)

A substrate processing device that continuously performs batch processing, which processes a plurality of substrates in batches, and sheet-fed processing, which processes substrates one by one, comprising:
A stocker block, a transfer block adjacent to the stocker block, and a processing block adjacent to the transfer block,
The stocker block accommodates at least one carrier that stores a plurality of substrates in a vertical direction at a predetermined interval in a horizontal position, and takes out and stores at least one substrate on which the carrier is placed for the entry and exit of the substrate from the carrier. Equipped with a dragon carrier wit shelf,
The transfer block is,
an acquisition handling mechanism for collectively removing a plurality of substrates from a carrier placed on the carrier placing shelf;
A substrate posture change mechanism that changes the posture of a plurality of substrates in a horizontal posture collectively to a vertical posture;
A substrate holding unit is provided to hold a plurality of substrates in a vertical position at a predetermined substrate transfer position,
The processing block is,
a batch processing area on one end adjacent to the transfer block and on the other end extending in a direction away from the transfer block;
a sheet wafer processing area adjacent to the transfer block and spaced apart from the batch processing area;
a sheet wafer substrate transport area interposed between the batch processing area and the sheet wafer processing area;
a batch substrate transfer area formed along the batch processing area, one end of which extends to the transfer block, and the other end of which extends in a direction away from the transfer block;
In the batch processing area, a plurality of batch processing tanks are arranged to immerse a plurality of substrates in batches in the direction extending the area, and a plurality of substrates in a vertical position are liquidated at the position closest to the transfer block. A holding tank is formed in the middle,
In the sheet wafer processing area, at least one sheet wafer processing chamber is formed to individually process each substrate,
The sheet substrate transfer area is a lateral position radially outward from the peripheral edge of the substrate with respect to one substrate to be transferred among the plurality of substrates held in the liquid of the holding tank, and has two lateral positions facing each other with the substrate interposed therebetween. A clamping hand provided with a pair of arms that clamps the peripheral portion of the substrate in the liquid by each approaching radially inward from the position, and a lifting mechanism that lifts the clamping hand to expose the substrate from the liquid surface of the holding tank. and a rotation mechanism for rotating the clamping hand to change the posture of the substrate from a vertical posture to a horizontal posture, and a horizontal movement mechanism for horizontally moving the clamping hand to convey the substrate to the sheet wafer processing area. A conveying mechanism is formed,
In the batch substrate transfer area, a batch substrate transfer mechanism is formed to transfer a plurality of substrates in batches between the substrate transfer position and each of the batch processing tanks and the holding tank,
The transfer block is also,
A mechanism interposed between the sheetfed processing area in the processing block and the carrier placing shelf in the stocker block is provided with a return handling mechanism for transporting a substrate in a horizontal position from the sheetfed processing area to the carrier placing shelf. A substrate processing device characterized in that. According to claim 1,
A substrate processing device characterized in that the clamping hand of the sheet wafer substrate transport mechanism is provided with a V-shaped groove in cross section extending in an arc shape to imitate the shape of the substrate. According to claim 1,
The acquisition handling mechanism in the transfer block is composed of a robot that is also used as the return handling mechanism,
The transfer block is also,
A mechanism interposed between the substrate posture change mechanism and the substrate transfer position, comprising a pusher mechanism that changes the arrangement pitch of the plurality of substrates across the predetermined interval and a narrow interval narrower than the predetermined interval,
A substrate processing apparatus, wherein the batch substrate transport mechanism in the processing block transports a plurality of substrates arranged at the narrow intervals. According to claim 1,
The acquisition handling mechanism and the return handling mechanism in the transfer block are composed of separate robots formed adjacent to each other,
The stalker block also,
an acquisition shelf that is a carrier placement shelf accessible to the acquisition handling mechanism;
a return shelf that is a carrier placement shelf accessible to the return handling mechanism;
Provided with a carrier transfer mechanism that moves the carrier placed on the acquisition shelf to the return shelf,
A substrate processing apparatus, wherein the batch substrate transport mechanism in the processing block transports a plurality of substrates arranged at the predetermined interval. According to claim 1,
A substrate processing device characterized in that, in the sheet wafer processing area, a plurality of the sheet wafer processing chambers are formed in a vertical direction. According to claim 1,
A substrate processing device characterized in that the sheet wafer processing chamber is capable of performing water-repellent treatment on the surface of the substrate. According to claim 1,
A substrate processing device characterized in that the sheet wafer processing chamber is capable of drying a substrate.

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