CN101261935B - Substrate treatment apparatus - Google Patents
Substrate treatment apparatus Download PDFInfo
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- CN101261935B CN101261935B CN200810085228XA CN200810085228A CN101261935B CN 101261935 B CN101261935 B CN 101261935B CN 200810085228X A CN200810085228X A CN 200810085228XA CN 200810085228 A CN200810085228 A CN 200810085228A CN 101261935 B CN101261935 B CN 101261935B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Abstract
A substrate treatment apparatus includes a container holder which holds a container for containing multiple substrates vertically stacked in horizontal postures, a substrate treatment section which collectively applies treatment to multiple substrates horizontally stacked in vertical postures, a main conveyance mechanism which conveys multiple substrates horizontally stacked in vertical postures between a substrate delivery position and the substrate treatment section, a carrying in/out mechanism which carries in/out the multiple substrates with respect to the container and changes postures of the multiple substrates between the horizontal postures and the vertical postures, and a sub conveyance mechanism which receives and delivers multiple substrates in vertical postures from and to the carrying in/out mechanism at a transfer position, receives and delivers multiple substrates in vertical postures from and to the main conveyance mechanism at the substrate delivery position, and conveys multiple substrates in vertical postures between the transfer and substrate delivery positions.
Description
Technical field
The present invention relates to many substrates are implemented the substrate board treatment handled in the lump.Substrate as the object of handling comprises for example semiconductor crystal wafer, base plate for liquid crystal display device, plasma display substrate, FED (Field Emission Display: field launcher) with substrate, CD substrate, disk substrate, optomagnetic base-board for plate, base board for optical mask etc.
Background technology
In the substrate board treatment of the processing of substrates such as semiconductor crystal wafer being implemented used soup, have many substrates are implemented the batch processing formula device handled in the lump.An example of batch processing formula substrate board treatment is disclosed in the flat 11-354604 communique of TOHKEMY.This substrate board treatment possesses the vehicle supporting part, moves horizontally the place machine people, posture changing mechanism, pusher, transport mechanism and processing substrate portion.
The vehicle supporting part can be placed vehicle (Container), and this vehicle keeps many substrates that are in vertical direction upper strata overlapping state with horizontal attitude.
Move horizontally the place machine people and be made of the conveyance robot of multi-joint arm type, multi-joint arm can stretch and can rotate around the vertical axis.Thus, move horizontally the place machine people with multi-joint arm towards vehicle, make horizontal attitude at many stacked substrates of vertical direction vehicles of coming in and going out, further, multi-joint arm is towards posture changing mechanism, relatively this posture changing mechanism handing-over horizontal attitude at many stacked substrates of vertical direction.
Posture changing mechanism is used for many stacked substrates are carried out posture changing in the lump between horizontal attitude and perpendicular attitude.In order to eliminate the substrate dislocation that in the process of multi-joint arm conveyance substrate, might on substrate, produce, in posture changing mechanism, possesses the substrate arrange agencie.
Pusher possesses can be up and down and the retainer that moves horizontally, can and posture changing mechanism between join many substrates of perpendicular attitude in the lump, and can and transport mechanism between join many substrates of perpendicular attitude in the lump.Half spacing of the spacing of many substrates that retainer can keep with posture changing mechanism keeps substrate.For example, after posture changing mechanism delivers to 25 substrates on the retainer, retainer is along only being moved slight distance on the horizontal direction of substrate stacked direction.Under this state, other 25 substrates are delivered on the retainer from posture changing mechanism.After 25 substrates sending here be inserted between 25 substrates sending here earlier, thereby on retainer, form by adding up to criticizing that 50 substrates form.A plurality of substrate in batch of combination and the operation that forms batch is called batch combination like this.When posture changing mechanism transmitted substrate, 25 that are maintained in 50 substrates on the retainer were sent to posture changing mechanism from propeller, and these 25 substrates are converted to after the horizontal attitude by attitude, are sent to and move horizontally the place machine people.Thereafter, 25 substrates staying on the retainer are sent to posture changing mechanism, and are converted to after the horizontal attitude, are sent by moving horizontally the place machine people.Like this, 50 substrates are separated into 2 substrate in batch in 25 one group mode.Like this, the operation that many substrates that form batch is separated into a plurality of substrate in batch is called and batch removes.
Transport mechanism has the substrate chuck that forms many substrates of criticizing with the perpendicular attitude maintenance, moves in the horizontal direction by making this substrate chuck, moves into or takes out of constituting the relative processing substrate of many substrates portion that criticizes.For the cleaning base plate chuck, for example, below the substrate transfer position between propeller and the transport mechanism, be provided with the chuck cleaning unit.
Processing substrate portion has along a plurality of treatment troughs of the moving direction configuration of transport mechanism.Treatment trough comprises dipper, rinsing bowl and dry slot.Dipper is that many substrates with perpendicular attitude are immersed in the soup that retains in the groove, and many substrates are implemented the device that soup is handled in the lump.Rinsing bowl is that many substrates with perpendicular attitude are immersed in the pure water (deionized water) that retains in the groove, many substrates is implemented in the lump the device of washing (flushing) processing.Dry slot is the device that many substrates are implemented to supply with organic solvent (for example, isopropyl alcohol) in the lump or removed the processing of liquid component.
The subject matter of described substrate board treatment of the prior art, the firstth, processing substrate speed (productivity ratio) is low, and the secondth, the price height.
Specifically, move horizontally the place machine people, owing to be the multi-joint arm type,, can not improve and keeping many responsivenesses under the substrate state in the lump so its mechanical strength is restricted.And, the price height of multi-joint arm humanoid robot own.Also have, owing to need the space of multi-joint arm rotation, area occupied becomes big problem so also exist in fact.
In addition, utilizing multi-joint arm to horizontally rotate when mobile, the relative position of many substrates can misplace, so as mentioned above, the substrate arrange agencie need be set in posture changing mechanism.Oppress processing substrate speed the operate time of this substrate arrange agencie.In addition, posture changing mechanism is except the substrate dressing mechanism, also need to be provided with: be used to keep horizontal attitude substrate-guided of level of base plate, be used to keep perpendicular attitude substrate the vertical substrate guiding piece and be used for the rotating mechanism of the posture changing of substrate, be very expensive robot.
In addition, propeller possesses reciprocating mechanism, horizontal mobile mechanism and rotating mechanism, and is still very expensive.
Like this, the conveyance substrate needs the time just to become a factor that stops productivity ratio to improve between vehicle (Container) and transport mechanism.In addition, the structure costliness that the conveyance substrate is used between vehicle (Container) and transport mechanism has hindered the reduction of the cost of substrate board treatment.
In addition, in described substrate board treatment of the prior art, is first system from vehicle to the substrate transferring route of transport mechanism, therefore with untreatment base during to main transport mechanism conveyance, can't send into the substrate of finishing processing to vehicle from transport mechanism, in addition, when sending the substrate of finishing processing, can't send into untreatment base.And when untreatment base was sent into transport mechanism, batch combination action on angle of rake retainer was necessary, and therefore the stand-by period till the sending of the substrate of finishing processing is elongated.Equally, when sending the substrate of finishing processing, batch releasing action on angle of rake retainer is necessary, and is therefore elongated to the stand-by period that becomes the state that can send into untreatment base.This is another factor that processing substrate speed is reduced.
Also have, at substrate transfer position, when untreatment base was maintained on the propeller, transport mechanism can not be taken out of the substrate of the processing in dry slot that is through with to substrate transfer position.Transport mechanism at first will be accepted untreated substrate and move into to dipper at substrate transfer position.Thereafter, transport mechanism has been accepted to have finished the substrate handled and has been transmitted to propeller at substrate transfer position from dry slot after chuck cleaning unit cleaning base plate chuck.The foreign matter on the surface of untreatment base is transferred on the substrate chuck that kept untreatment base, therefore, has finished on the substrate of handling in order to prevent that this foreign matter from transferring to, so must before keeping having finished the substrate of handling the substrate chuck be cleaned.This also is another factor that reduces processing substrate speed.
Summary of the invention
The object of the invention is, the substrate board treatment that can improve processing substrate speed is provided.
Another purpose of the present invention is, the substrate board treatment that can reduce cost is provided.
The substrate board treatment of first aspect present invention comprises: the Container maintaining part, and it keeps ccontaining Container with horizontal attitude many stacked substrates on above-below direction; Processing substrate portion, it is handled implementing in the lump with many stacked in the horizontal direction substrates of perpendicular attitude; Main transport mechanism, it is between given substrate transfer position and described processing substrate portion, to carrying out conveyance in the lump with many stacked in the horizontal direction substrates of perpendicular attitude; Move into and take out of mechanism, its Container that many substrates are kept with respect to described Container maintaining part is moved in the lump and is taken out of, and makes these many substrates carry out posture changing in the lump between horizontal attitude and perpendicular attitude; Secondary transport mechanism, its on given mobile placement location and described move into to take out of join many substrates of perpendicular attitude between the mechanism in the lump, many substrates of perpendicular attitude joining on the described substrate transfer position and between the described main transport mechanism in the lump, many substrates of conveyance perpendicular attitude in the lump between described mobile placement location and described substrate transfer position.
Constitute according to this, in Container, take out of mechanism and taken out of in the lump by moving into, and then move into by this and to take out of mechanism and be transformed to perpendicular attitude with ccontaining many substrates of horizontal attitude.Many substrates of this plumbness are moved at mobile placement location and are placed on the secondary transport mechanism, to the substrate transfer position conveyance, and are given main transport mechanism at this substrate transfer position.Main transport mechanism with many substrates of perpendicular attitude to the conveyance of processing substrate portion.Substrate after processing substrate portion handles, by main transport mechanism from processing substrate portion to the substrate transfer position conveyance, give secondary transport mechanism.Secondary transport mechanism with substrate from substrate transfer position to mobile placement location conveyance, give to move into and take out of mechanism.Move into and take out of mechanism substrate is transformed to horizontal attitude from perpendicular attitude, send into Container then.
Like this, in the present invention, carry out the attitude change that substrate is moved into Container and taken out of Container and substrate in the mechanism moving into to take out of.Therefore compare with the prior art of using multi-joint arm to carry out moving into of substrate or to take out of and use the attitude that is exclusively used in the change of substrate attitude to change mechanism, can simplified structure.
And then, take out of mechanism and can carry out moving into or take out of action and posture changing action owing to move into respect to the substrate of Container, therefore do not need to make as prior art multi-joint arm to horizontally rotate.Therefore, can the time under reach.Thus, can shorten the substrate transferring required time, improve accessible substrate number of unit interval.That is, can improve processing substrate speed.
Preferred described moving into taken out of mechanism and contained: a plurality of maintenance operators, and it keeps many substrates in the lump; The operator driving and reversing mechanism, it makes these a plurality of maintenance operators with respect to the Container that keeps on described Container maintaining part, advances and retreat on the given advance and retreat direction that is on the horizontal direction; The operator rotating mechanism, it makes described a plurality of maintenance operator revolve at least along the vertical face on the described advance and retreat direction of being in and turn 90 degrees.
According to this formation, move into and take out of mechanism and advance and retreat with respect to Container by making a plurality of maintenance operators, many substrates are sent in the lump from Container, and a plurality of maintenance operators are revolved along the vertical face on the described advance and retreat direction of being in turn 90 degrees, thereby can make the substrate attitude be transformed to perpendicular attitude from horizontal attitude.In addition, when substrate is sent into Container, a plurality of maintenance operators are advanced and retreat after being transformed to horizontal attitude from perpendicular attitude towards Container.Like this, can carry out the posture changing of substrate by in vertical of the advance and retreat direction that comprises a plurality of maintenance operators, carrying out the operator spinning movement, therefore can simplify and move into the formation of taking out of mechanism.Certainly the horizontally rotating of multi-joint arm of prior art also is unwanted.Therefore, can carry out of advance and retreat and the attitude change of a plurality of maintenance operators fast with respect to Container.
Described a plurality of maintenance operator, have a plurality of operator elements that keep a substrate respectively, each operator element has the first substrate maintaining part in side's side of operator element arrangements direction, the opposing party's side in operator element arrangements direction has the second substrate maintaining part, and described moving into taken out of mechanism and also comprised and make described a plurality of maintenance operator around the rotation of given rotating shaft and make the operator rotating mechanism of described operator element table back of the body upset.
According to this formation, make a plurality of maintenance operator rotations by the operator rotating mechanism, any one party becomes upper face side in the first substrate maintaining part or the second substrate maintaining part thereby can make.Thus, can switch to be used for the substrate maintenance the first substrate maintaining part and the second substrate maintaining part.Therefore, for example a side substrate maintaining part can be used for the maintenance of untreatment base, and the opposing party's substrate maintaining part be used to finish the maintenance of the substrate of processing.Thus, the foreign matter that can suppress or prevent the untreatment base surface is transferred on the substrate of finishing processing.
Preferred described moving into taken out of mechanism and also comprised from the supporting guiding piece of many substrates of below supports vertical attitude.Constitute according to this, can be by the substrate of supporting guiding piece supports vertical attitude.And, when a plurality of maintenance operators become perpendicular attitude, can arrange many substrates simultaneously by the supporting guiding piece.Thus, can arrange many substrates by the structure of cheapness.And,, therefore can further shorten between Container and main transport mechanism and carry out the required time of substrate transferring owing to can finish the attitude change of substrate and the arrangement of substrate simultaneously.
Preferred described supporting guiding piece has a pair of substrate with respect to each operator element and keeps groove.In this case, described moving into taken out of mechanism and also comprised by driving described supporting guiding piece and select described a pair of substrate to keep any one party in the groove to keep the guiding piece driving mechanism of substrate.Constitute according to this, can pass through any one party in a pair of substrate maintenance groove of guiding piece driving mechanism selection, thereby substrate that can this is a pair of keeps the side in the groove to be used to keep untreatment base, and the opposing party is used to keep finishing the substrate of processing.Thus, the foreign matter that can suppress or prevent the untreatment base surface is transferred on the substrate of finishing processing.
Described secondary transport mechanism comprises: mobile placement mechanism, it has in the lump the mobile placement support that many substrates that are in the stacked in the horizontal direction state of perpendicular attitude are kept, and this is moved place support and move up and down, by this move up and down and described many substrates of taking out of between the mechanism of moving into perpendicular attitude on described mobile placement location, join in the lump; Horizontal transport mechanism, it has the horizontal conveyance maintaining part that many substrates of perpendicular attitude are arranged in the horizontal direction and kept, on described mobile placement location, between described mobile placement support and described horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, on described substrate transfer position, between described main transport mechanism and described horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, described horizontal conveyance maintaining part is moved horizontally.
Constitute according to this, move up and down, can carry out and move into the substrate delivery/reception of taking out of mechanism by the mobile placement support that makes mobile placement mechanism, and with the substrate delivery/reception of horizontal transport mechanism.Therefore, the mobile placement mechanism by simple formation carries out intermediary, thereby can take out of conveyance substrate between mechanism and the horizontal transport mechanism moving into.And, as long as horizontal transport mechanism can be between mobile placement location and substrate transfer position horizontal conveyance substrate, therefore can not become complicated formation yet.The cost that like this, also can suppress secondary transport mechanism.
Preferred described mobile placement mechanism is disposed at the described opposition side of taking out of mechanism of moving on the advance and retreat direction of described a plurality of maintenance operators.
According to this formation, move into and take out of mechanism and can make a plurality of maintenance operators advance and retreat and move into or take out of substrate with respect to Container, and can be by visit mobile placement location along its advance and retreat direction mobile.Thus, can further simplify and move into the formation of taking out of mechanism and reduce cost.
Horizontal transport mechanism for example can constitute and can visit mobile placement location from the horizontal direction vertical with the advance and retreat direction of a plurality of maintenance operators.That is, horizontal transport mechanism can make horizontal conveyance maintaining part move towards the horizontal direction vertical with the advance and retreat direction of a plurality of maintenance operators.Constitute according to this, can be in of the mobile placement action of mobile placement location via mobile placement mechanism, realize with respect to the direction of closing of Container with towards the conversion of the substrate transferring direction between the conveyance direction of substrate transfer position.Thus, further simplified structure.In addition, compare, can significantly improve substrate transferring speed, thereby can further improve processing substrate speed with the prior art of carrying out the conversion of substrate transferring direction by the rotation of multi-joint arm.
Preferred described mobile placement mechanism also comprises the support horizontal mobile mechanism that described mobile placement support is moved in given distance range along the stacked horizontal direction of the substrate of perpendicular attitude (for example, operator advance and retreat direction).According to this formation, can with first substrate in batch from move to place support move be positioned over horizontal conveyance maintaining part after, take out of mechanism and accept second substrate in batch move placing on the support, this second substrate in batch is moved on the position of staggering with described first substrate in batch that is placed on horizontal conveyance maintaining part from moving into.Thus, can on horizontal conveyance maintaining part, keep first and second substrate in batch, and composition comprises criticizing of first and second substrate in batch.
For example, can first substrate in batch is moved be positioned on the horizontal conveyance maintaining part after, make move to place substrate that support moves horizontally first substrate in batch keep spacing half distance (half spacing) and second substrate in batch moved be positioned over horizontal conveyance maintaining part.Thus, first substrate in batch and second substrate in batch are maintained on the horizontal conveyance maintaining part under the formation substrate of each group overlapping state interlaced with each other.Thus, horizontal conveyance maintaining part can keep many substrates with less space.In addition, to batch processing substrate portion that handles of this state, can be with many substrates of less spatial manipulation.
Preferred described mobile placement support contains from a pair of supporting leading axle of both sides maintenance with many stacked in the horizontal direction substrates of perpendicular attitude, preferred described supporting leading axle has: the abutting part of diverse location in a circumferential direction and substrate butt and, in order to make substrate by between the described a pair of supporting leading axle and guarantee the portion of keeping out of the way at given interval between this a pair of supporting leading axle, preferred described mobile placement mechanism also comprises the guiding piece rotating mechanism that described a pair of supporting leading axle is rotated around each direction of principal axis.Preferably, this substrate board treatment also comprises control unit, this control unit is controlled described guide rotating mechanism, switches between the portion of keeping out of the way of the butt parts of described a pair of supporting leading axle substrate supporting state opposite to one another and described a pair of supporting leading axle substrate opposite to one another is by state.
According to this structure, by becoming the abutting part substrate supporting state opposite to one another that makes a pair of supporting leading axle, can be from moving into many substrates of taking out of mechanism or acceptance of horizontal transport mechanism and supports vertical attitude.In addition, when not having supporting substrates, make the portion's of keeping out of the way substrate opposite to one another by state, can avoid and take out of the interference between the substrate that keeps on mechanism or the horizontal transport mechanism and a pair of supporting leading axle is moved up and down moving into by becoming.Thus, for example, can be after substrate be delivered to horizontal transport mechanism, a pair of supporting leading axle is kept out of the way to given retreating position (for example the position that moves horizontally that can the horizontal conveyance maintaining part of obstruction), thus also can simplified structure.
Preferred described abutting part comprises first abutting part and second abutting part on the diverse location on the circumferencial direction that is configured in described supporting leading axle.Constitute by this, can select any one party in first abutting part and second abutting part to be used for the supporting of substrate, therefore first and second abutting parts are switched in supporting that for example can be by untreatment base and the supporting of finishing the substrate of processing.Thus, the foreign matter that can suppress or prevent the untreatment base surface is transferred on the substrate of finishing processing.
Preferred described horizontal transport mechanism also comprises makes the horizontal rotary mechanism of described horizontal conveyance maintaining part around vertical axle rotation in 90 degree scopes at least (preferably horizontally rotating around the center of gravity of horizontal conveyance maintaining part).
Main transport mechanism for example comprises: the substrate holding device in the lump that remains on many substrates of perpendicular attitude stacked on the horizontal direction vertical with moving into the operator advance and retreat direction of taking out of mechanism in the lump; And, make this substrate holding device mobile horizontal mobile device on the horizontal moving direction parallel in the lump with described operator advance and retreat direction.In this case, processing substrate portion for example comprises a plurality of processing units of arranging along described horizontal moving direction.
In this case, turn 90 degrees, the stacked direction of many substrates can be carried out conversion between the stacked direction of the stacked direction of mobile placement mechanism and main transport mechanism by horizontal conveyance maintaining part is revolved around vertical axle.The conversion of substrate stacked direction is to realize by horizontally rotating of multi-joint arm in the prior art, and this mechanical arm horizontally rotates very time-consuming.Relative therewith, in the present invention, owing to can make horizontal conveyance maintaining part rotation, thus can make the very fast end of this rotation and simple in structure.Thus, can improve substrate transferring speed, and reduce the cost of substrate board treatment.
Preferred described horizontal rotary mechanism makes described horizontal conveyance maintaining part around the rotation (preferably horizontally rotating around horizontal conveyance maintaining part center of gravity) in 180 degree scopes at least of vertical axle.Constitute according to this, can make the substrate of the perpendicular attitude that on horizontal conveyance maintaining part, keeps horizontally rotate 180 degree.Thus, for example can the time make the device of the formation substrate of the formation substrate of first substrate in batch and second substrate in batch form face (forming the surface of a side of device) toward each other, and make their non-device form face (not forming the surface of a side of device) toward each other described batch of combination.Thus, for example impregnated in when handling in the treatment fluid will criticizing, can suppress or prevent that foreign matter from forming face from the non-device of abuts substrate and being attached on the device formation face again.
Preferred described horizontal conveyance maintaining part has a plurality of substrates that keep half spacing of spacing to form with the substrate on the described mobile placement support and keeps grooves.According to this formation, horizontal conveyance maintaining part can keep many substrates with less space, and combination is criticized on this horizontal conveyance maintaining part.
Preferred described horizontal conveyance maintaining part comprises: supporting is with first guiding piece of many stacked in the horizontal direction substrates of perpendicular attitude, and, supporting is with second guiding piece of many stacked in the horizontal direction substrates of perpendicular attitude, and described horizontal transport mechanism also comprises the guiding piece elevating mechanism that makes described first guiding piece carry out relative lifting with respect to described second guiding piece.According to this formation, by making first guiding piece with respect to the second guiding piece lifting, thus can be by either party keeps substrate in first guiding piece or second guiding piece.Therefore, by untreatment base and the substrate of finishing processing are separately used first and second guiding pieces, can suppress or prevent that the foreign matter on untreatment base surface from transferring on the substrate of finishing processing.
Preferred described main transport mechanism the first given substrate transfer position and second substrate transfer position, and described processing substrate portion between many substrates of conveyance in the lump, described secondary transport mechanism comprises: mobile placement mechanism, it has the mobile placement support that keeps many substrates in the lump, and at described mobile placement location, described mobile placement support and described move into to take out of join many substrates between the mechanism in the lump; The first substrate travel mechanism, it has the first conveyance maintaining part that is used to keep many substrates, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates in the lump, at described first substrate transfer position, between described main transport mechanism and the described first conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described first substrate transfer position, move the described first conveyance maintaining part; The second substrate travel mechanism, it has the second conveyance maintaining part that is used to keep many substrates, and at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described second substrate transfer position, move the described second conveyance maintaining part.
The described first conveyance support can be to be used for the first horizontal conveyance maintaining part that many substrates of perpendicular attitude are arranged in the horizontal direction and kept.The described first substrate travel mechanism, can be at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, can be at first substrate transfer position, between the described main transport mechanism and the described first horizontal conveyance maintaining part, join many substrates in the lump, can between described mobile placement location and described first substrate transfer position, move horizontally the described first horizontal conveyance maintaining part.In addition, the described second conveyance support can be to be used for the second horizontal conveyance maintaining part that many substrates of perpendicular attitude are arranged in the horizontal direction and kept.In this case, the described second substrate travel mechanism, can be at described mobile placement location, between the described mobile placement support and the described second horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at second substrate transfer position, between the described main transport mechanism and the described second horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, can between described mobile placement location and described second substrate transfer position, move horizontally the described second horizontal conveyance maintaining part.
Constitute according to this, main transport mechanism can be visited first and second substrate transfer positions and be carried out the handing-over of substrate.In addition, the substrate transferring between first substrate transfer position and the mobile placement mechanism can be undertaken by the first substrate travel mechanism, and the substrate transferring between second substrate transfer position and the mobile placement location can be undertaken by the second substrate travel mechanism.Like this, can make the substrate transferring path between mobile placement mechanism and the main transport mechanism become two systems, even thereby for by move into take out of mechanism with untreatment base when Container takes out and sends into main transport mechanism and use a side substrate transferring path, also can send to mobile placement mechanism from main transport mechanism via the substrate that processing will be finished in the opposing party's substrate transferring path.Therefore, can reduce the stand-by period, thereby improve processing substrate speed.
The preferred described first substrate travel mechanism, substrate after described first substrate transfer position is accepted from described main transport mechanism to handle by described processing substrate portion, and give described mobile placement mechanism with this substrate at described mobile placement location, the preferred described second substrate travel mechanism, substrate before described mobile placement location is accepted from described mobile placement mechanism to handle by described processing substrate portion, and give described main transport mechanism with this substrate at described second substrate transfer position.
According to this formation, main transport mechanism carries out following action: accept untreatment base and to the conveyance of processing substrate portion at second substrate transfer position from the second substrate travel mechanism, and send the substrate of finishing processing at first substrate transfer position to the first substrate travel mechanism.By sending into the path of sending of the substrate of finishing processing of untreatment base separated, thereby compare, can shorten the stand-by period and improve processing substrate speed with the prior art of sending into common substrate conveyance path when sending at substrate with substrate.
Described main transport mechanism can contain the substrate chuck that keeps many substrates in the lump.In this case, preferred described substrate board treatment also comprises: be used for the chuck cleaning unit that the substrate chuck to described main transport mechanism cleans; And conveyance control unit, its action to described main transport mechanism is controlled, substrate transferring after will implementing to handle by described processing substrate portion (does not preferably use described chuck cleaning unit that described substrate chuck is cleaned) behind described first substrate transfer position, from described second substrate transfer position to described processing substrate portion conveyance substrate, by described chuck cleaning unit described substrate chuck cleaned thereafter.
According to this formation, even at untreatment base under the state of the second substrate transfer position standby, main transport mechanism also can at first be sent from processing substrate portion the substrate of finishing processing to first substrate transfer position, then with the untreatment base of second substrate transfer position to the conveyance of processing substrate portion.That is, main transport mechanism needn't make substrate chuck contact untreatment base before sending the substrate of finishing processing, therefore needn't clean the substrate chuck before sending the substrate of finishing processing.Therefore, can reduce the wash number of substrate chuck.In addition, the cleaning of substrate chuck can utilize to be sent the substrate of finishing processing and untreatment base is sent into free time after the processing substrate portion, therefore can further improve processing substrate speed.
Preferred described substrate board treatment, also comprise the mobile placement control unit of carrying out following steps, that is: described the moving into of control taken out of mechanism, described mobile placement mechanism and the described first substrate travel mechanism, part in many substrates that will keep on the described first conveyance maintaining part i.e. first substrate in batch is delivered to described mobile placement support, described first substrate in batch moved from this place support and deliver to described moving into and take out of mechanism, thereafter, another part (for example nubbin) i.e. in many substrates that will keep on the described first conveyance maintaining part second substrate in batch is delivered to described mobile placement support, described second substrate in batch is moved the placement support from this deliver to the described step of taking out of mechanism of moving into; Control described moving into and take out of mechanism, described mobile placement mechanism and the described second substrate travel mechanism, the 3rd substrate in batch is taken out of mechanism and delivered to described mobile placement support from described moving into, described the 3rd substrate in batch is delivered to the described second conveyance maintaining part from described mobile placement support, thereafter, the tetrabasal group is taken out of mechanism and delivered to described mobile placement support from described moving into, and then this tetrabasal group delivered to the described second conveyance maintaining part from described mobile placement support, and on this second conveyance maintaining part, keep the step of the 3rd substrate in batch and tetrabasal group.
Constitute according to this, be divided into first substrate in batch and second substrate in batch by many substrates that the first conveyance maintaining part is kept and move to be positioned over to move and place support, move from carrying out batch to remove.In addition, by the 3rd substrate in batch is moved and is positioned over the second conveyance maintaining part from move placing support, thereafter, the tetrabasal group is placed support and moved and be positioned over the second conveyance maintaining part from moving, thereby can carry out batch combination action.Like this, can criticize in the first substrate travel mechanism (the first conveyance maintaining part) side and remove action, criticize the combination action in the second substrate travel mechanism (the second conveyance maintaining part) side.Therefore, even in batch releasing action, the action that many untreatment bases that can carry out that also formation is criticized transmit to main transport mechanism from the second substrate travel mechanism.In addition, even in batch combination action, also can carry out to finish the substrate of processing from of the action of main transport mechanism to the transmission of the first substrate travel mechanism.Like this, can shorten the stand-by period in batch releasing action or batch combination action, thereby further improve processing substrate speed.
Preferred described substrate board treatment also is included in the intermediary that on described second substrate transfer position substrate delivery/reception between described second conveyance maintaining part and the described main transport mechanism is carried out intermediary.
Constitute according to this, can carry out substrate delivery/reception between the second horizontal transport mechanism and the main transport mechanism via intermediary, thereby can shorten the time that takies the second horizontal transport mechanism or main transport mechanism for substrate delivery/reception.Thus, can further improve processing substrate speed.In addition, also substrate can be delivered to other unit that on second substrate transfer position, dispose by intermediary.The example of this unit is the consistent substrate orientation arrange agencie in orientation (for example crystal orientation of semiconductor crystal wafer) that makes substrate.
The mobile placement support of preferred described mobile placement mechanism, keep many substrates in the lump with the stacked in the horizontal direction state of perpendicular attitude, described mobile placement mechanism is at described mobile placement location, described mobile placement support and described move into to take out of join many substrates of perpendicular attitude between the mechanism in the lump, the described first conveyance maintaining part is used to make many substrates of perpendicular attitude to arrange in the horizontal direction and keep, the first substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described first substrate transfer position, between described main transport mechanism and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, the described second conveyance maintaining part is used to make many substrates of perpendicular attitude to arrange in the horizontal direction and keep, the second substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump.
The substrate board treatment of second aspect present invention comprises: the Container maintaining part, and its Container to ccontaining many substrates keeps; Processing substrate portion, it implements to handle to many substrates in the lump; Main transport mechanism, its first given substrate transfer position and second substrate transfer position, and described processing substrate portion between, many substrates are carried out conveyance in the lump; Move into and take out of mechanism, its Container that many substrates are kept with respect to described Container maintaining part is moved in the lump and is taken out of; Mobile placement mechanism, it has the mobile placement support that keeps many substrates in the lump, and at given mobile placement location, described mobile placement support and described move into to take out of join many substrates between the mechanism in the lump; The first substrate travel mechanism, it has the first conveyance maintaining part that is used to keep many substrates, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates in the lump, at described first substrate transfer position, join many substrates between described main transport mechanism and the described first conveyance maintaining part in the lump, between described mobile placement location and described first substrate transfer position, move the described first conveyance maintaining part; The second substrate travel mechanism, it has the second conveyance maintaining part that is used to keep many substrates, at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described second substrate transfer position, move the described second conveyance maintaining part.
Constitute according to this, main transport mechanism can be visited first and second substrate transfer positions and be carried out the handing-over of substrate.In addition, the substrate transferring between first substrate transfer position and the mobile placement mechanism can be undertaken by the first substrate travel mechanism, and the substrate transferring between second substrate transfer position and the mobile placement location can be undertaken by the second substrate travel mechanism.Like this, can make the substrate transferring path between mobile placement mechanism and the main transport mechanism become two systems, even thereby in order to take out of mechanism and substrate to be taken out and sends into from Container under the situation in substrate transferring path that main transport mechanism uses a side, also can send to mobile placement mechanism from main transport mechanism via the substrate that processing will be finished in the opposing party's substrate transferring path by moving into.Therefore, can reduce the stand-by period, thereby improve processing substrate speed.
The preferred described first substrate travel mechanism, substrate after described first substrate transfer position is accepted from described main transport mechanism to handle by described processing substrate portion, and give described mobile placement mechanism with this substrate at described mobile placement location, the preferred described second substrate travel mechanism, substrate before described mobile placement location is accepted from described mobile placement mechanism to handle by described processing substrate portion, and give described main transport mechanism with this substrate at described second substrate transfer position.
According to this formation, main transport mechanism carries out following action: accept untreatment base and to the conveyance of processing substrate portion at second substrate transfer position from the second substrate travel mechanism, and the substrate that will finish processing at first substrate transfer position is sent to the first substrate travel mechanism.By sending into sending of the substrate of finishing processing of untreatment base separated the path, thereby the prior art in common substrate conveyance path is compared when sending with substrate when substrate is sent into, and can shorten the stand-by period and improves processing substrate speed.
Preferred described main transport mechanism contains the substrate chuck that keeps many substrates in the lump.Under this situation, preferred described substrate board treatment also comprises: the chuck cleaning unit, and it is used for the substrate chuck of described main transport mechanism is cleaned; And conveyance control unit, its action to described main transport mechanism is controlled, substrate transferring after will implementing to handle by described processing substrate portion is behind described first substrate transfer position, (preferably described substrate chuck not being cleaned) by described chuck cleaning unit from described second substrate transfer position to described processing substrate portion conveyance substrate, by described chuck cleaning unit described substrate chuck cleaned thereafter.
According to this formation, even at untreatment base under the state of the second substrate transfer position standby, main transport mechanism also can at first be sent from processing substrate portion the substrate of finishing processing to first substrate transfer position, then with the untreatment base of second substrate transfer position to the conveyance of processing substrate portion.That is because main transport mechanism need not make substrate chuck contact untreatment base before sending the substrate of finishing processing, therefore need be before not sending the substrate of finishing processing the cleaning base plate chuck.Therefore, can reduce the wash number of substrate chuck.In addition, the cleaning of substrate chuck can utilize to be sent the substrate of finishing processing and untreatment base is sent into free time after the processing substrate portion, thereby can further improve processing substrate speed.
Preferred described substrate board treatment, also comprise the mobile placement control unit of carrying out following steps, that is: described the moving into of control taken out of mechanism, described mobile placement mechanism and the described first substrate travel mechanism, part in many substrates that will keep on the described first conveyance maintaining part i.e. first substrate in batch is delivered to described mobile placement support, described first substrate in batch moved from this place support and deliver to described moving into and take out of mechanism, thereafter, another part (for example remainder) i.e. in many substrates that will keep on the described first conveyance maintaining part second substrate in batch is delivered to described mobile placement support, described second substrate in batch is moved the placement support from this deliver to the described step of taking out of mechanism of moving into; Control described moving into and take out of mechanism, described mobile placement mechanism and the described second substrate travel mechanism, the 3rd substrate in batch is taken out of mechanism and delivered to described mobile placement support from described moving into, described the 3rd substrate in batch is delivered to the described second conveyance maintaining part from described mobile placement support, thereafter, the tetrabasal group is taken out of mechanism and delivered to described mobile placement support from described moving into, and then this tetrabasal group delivered to the described second conveyance maintaining part from described mobile placement support, and on this second conveyance maintaining part, keep the step of the 3rd substrate in batch and tetrabasal group.
Constitute according to this, be divided into first substrate in batch and second substrate in batch by many substrates that the first conveyance maintaining part is kept and move to be positioned over to move and place support, move thereby can criticize releasing.In addition,, thereafter, the tetrabasal group is placed support and moved and be positioned over the second conveyance maintaining part from moving, move thereby can criticize combination by the 3rd substrate in batch is moved and is positioned over the second conveyance maintaining part from move placing support.Like this, can criticize in the first substrate travel mechanism (the first conveyance maintaining part) side and remove action, and criticize the combination action in the second substrate travel mechanism (the second conveyance maintaining part) side.Therefore, even in batch releasing action, the action that many untreatment bases that can carry out that also formation is criticized transmit to main transport mechanism from the second substrate travel mechanism.In addition, even in batch combination action, also can carry out to finish the substrate of processing from of the action of main transport mechanism to the transmission of the first substrate travel mechanism.Like this, can shorten in batch releasing action or the stand-by period in batch combination action, thereby further improve processing substrate speed.
Preferred described substrate board treatment also is included in the intermediary that on described second substrate transfer position substrate delivery/reception between described second conveyance maintaining part and the described main transport mechanism is carried out intermediary.
Constitute according to this, can carry out substrate delivery/reception between the second substrate travel mechanism and the main transport mechanism via intermediary, thereby can shorten the time that takies the second substrate travel mechanism or main transport mechanism for substrate delivery/reception.Thus, can further improve processing substrate speed.In addition, can substrate be transmitted to other unit that dispose on second substrate transfer position by intermediary.The example of this unit is the consistent substrate orientation arrange agencie in orientation (for example crystal orientation of semiconductor crystal wafer) that makes substrate.
Described Container maintaining part is used for keeping with the Container of horizontal attitude at many stacked substrates of above-below direction ccontaining, described processing substrate portion handles implementing in the lump with many stacked in the horizontal direction substrates of perpendicular attitude, described main transport mechanism in the lump conveyance with many stacked in the horizontal direction substrates of perpendicular attitude, described moving into taken out of Container that mechanism kept with respect to described Container maintaining part and moved in the lump and take out of many substrates, and make these many substrates between horizontal attitude and perpendicular attitude, carry out posture changing in the lump, the mobile placement support of described mobile placement mechanism keeps many substrates with the stacked in the horizontal direction state of perpendicular attitude in the lump, described mobile placement mechanism is at described mobile placement location, described mobile placement support and described move into to take out of join many substrates of perpendicular attitude between the mechanism in the lump, the described first conveyance maintaining part is used for horizontal direction is arranged and remained in to many substrates of perpendicular attitude, the first substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described first substrate transfer position, between described main transport mechanism and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, the described second conveyance maintaining part is used for horizontal direction is arranged and remained in to many substrates of perpendicular attitude, the second substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump.
Constitute according to this, can use to move into and take out of mechanism and will in Container, send in the lump, and then move into by this that to take out of mechanism alternation be perpendicular attitude with many ccontaining substrates of horizontal attitude.Many substrates of this perpendicular attitude are moved at mobile placement location and are positioned over the first or second conveyance maintaining part, the conveyance to the first or second substrate transfer position, and be sent to main transport mechanism at this first or second substrate transfer position.Main transport mechanism, with many substrates of perpendicular attitude to the conveyance of processing substrate portion.Substrate after processing substrate portion has implemented to handle, by main transport mechanism from processing substrate portion to the first or second substrate transfer position conveyance, and deliver to the first or second substrate travel mechanism.First or the second substrate travel mechanism to mobile placement location conveyance substrate, and delivers to mobile placement mechanism from first or second substrate transfer position.Mobile then placement mechanism is delivered to these substrates to move into and is taken out of mechanism.Move into and take out of mechanism substrate is sent into Container after perpendicular attitude is transformed to horizontal attitude.
Like this, can carry out moving into and taking out of and the attitude change of substrate in the mechanism moving into to take out of with respect to the substrate of Container.Therefore, carry out moving into of substrate with use multi-joint arm humanoid robot and take out of and use the prior art of the special-purpose attitude change mechanism of substrate attitude change to compare, can simplified structure.
In addition, move into and take out of mechanism and can carry out moving into or take out of action and posture changing action, therefore do not need to make as prior art multi-joint arm to horizontally rotate with respect to the substrate of Container.Therefore, can the time under reach.Thus, can shorten the required time of substrate transferring, improve accessible substrate number of unit interval.That is, can improve processing substrate speed.
In addition, move up and down by the mobile placement support that makes mobile placement mechanism, can carry out and move into the substrate delivery/reception of taking out of between the mechanism and and the first and second substrate travel mechanisms between substrate delivery/reception.Therefore, can carry out intermediary, thereby take out of transferring substrates between the mechanism and the first and second substrate travel mechanisms moving into by the mobile placement mechanism of simple formation.
Of the present invention above-mentioned or and then other purpose, feature and effect, further specify following execution mode with reference to accompanying drawing.
Description of drawings
Fig. 1 is used to illustrate the integrally-built vertical view of substrate board treatment of an execution mode of this invention.
Fig. 2 will enlarge the stereogram that shows in the relevant structure of conveyance substrate between wafer transport case and the main transport mechanism.
Fig. 3 moves into the stereogram of taking out of mechanism.
Fig. 4 is the stereogram that is used to illustrate the rotation of batch operation hand.
Fig. 5 is used to illustrate move into the stereogram of taking out of the substrate attitude change that mechanism carries out.
Fig. 6 is used to illustrate the stereogram that makes batch operation descend the structure of action on hand.
Fig. 7 is the schematic diagram that is used to illustrate batch operation hand and the structure related with it.
Fig. 8 is the schematic diagram that is used for the structure of description operation hand element and supporting guiding piece.
Fig. 9 is the stereogram that is used to illustrate the structure of mobile placement mechanism.
Figure 10 is that expression will be supported the stereogram that leading axle moves up and down the structure of usefulness.
Figure 11 is that expression will be supported the stereogram that leading axle moves horizontally the structure of usefulness.
Figure 12 is the vertical view (substrate supporting state) that the structure of explanation supporting leading axle is used.
Figure 13 is the vertical view (substrate passes through state) that the structure of explanation supporting leading axle is used.
Figure 14 is the stereogram that the structure of the explanation first horizontal transport mechanism is used.
Figure 15 is the front view that enlarges the structure of the horizontal conveyance maintaining part of expression.
Figure 16 is the front view that enlarges the structure of the horizontal conveyance maintaining part of expression.
Figure 17 is that explanation is used for the stereogram that the structure of the horizontally rotating of horizontal conveyance maintaining part and the lifting of the first guiding piece pedestal is used.
Figure 18 is that explanation is used for the end view that the structure of the horizontally rotating of horizontal conveyance maintaining part and the lifting of the first guiding piece pedestal is used.
Figure 19 is the stereogram that the explanation second horizontal transport mechanism is used.
Figure 20 is the stereogram of the appearance of the horizontal conveyance maintaining part of expression when being positioned at the front face side of substrate board treatment.
Figure 21 is the stereogram of the appearance of the relative straight line guiding piece of the horizontal conveyance maintaining part of expression when being positioned at processing substrate portion side.
Figure 22 is expression and join the schematic diagram of the relevant structure of substrate in the lump at second delivery position.
Figure 23 is the stereogram of expression first intermediary's robot construction.
Figure 24 is the stereogram of expression second intermediary's robot construction.
Figure 25 is the vertical view of the structure of the expression substrate board treatment relevant with other execution modes of this invention.
Figure 26 is the schematic isometric that is illustrated in the structure between wafer transport case and the main transport mechanism.
Embodiment
[overall structure of first execution mode]
Fig. 1 is used to illustrate the integrally-built vertical view of substrate board treatment of an execution mode of this invention.This substrate board treatment 10 possesses front open type wafer transport case (FOUP) maintaining part 1, processing substrate portion 2, main transport mechanism 3, moves into and take out of mechanism 4, mobile placement mechanism 5, first horizontal transport mechanism 6, the second horizontal transport mechanism 7, chuck cleaning unit 8 and controller 9 (control unit).
Front open type wafer transport case maintaining part 1 is configured in overlooks on one jiao that roughly forms rectangular substrate board treatment 10.This front open type wafer transport case maintaining part 1 as with many substrate W of horizontal attitude to carry out ccontaining Container at the stacked state of Z direction (above-below direction, vertical direction), be the Container maintaining part that can keep wafer transport case F.With with the mode of front surface 10a (corresponding) subtend of substrate board treatment 10, the automatic wafer transport case 11 that the configuration double dot dash line is represented with a minor face of overlooking.Automatically wafer transport case 11 has: will be ccontaining the function supplied with to wafer transport case maintaining part 1 of the wafer transport case F of untreated substrate W, will ccontainingly finish the substrate W that handles wafer transport case F (the wafer transport case of sky) to the function of wafer transport case maintaining part 1 supply, in order to exchange the wafer transport case that wafer transport case maintaining part 1 is kept, and the function that the wafer transport case F that remains on the wafer transport case maintaining part 1 is kept out of the way.Substrate W in the present embodiment, is the such circular substrate of semiconductor crystal wafer.
Processing substrate portion 2 possesses a plurality of handling parts 20 (processing unit) along Y direction (horizontal direction) configuration of the side 10b (corresponding with a minor face of overlooking) along substrate board treatment 10.A plurality of handling parts 20 comprise first dipper 21, first flushed channel 22, second dipper 23, second flushed channel 24 and dried portion 25.First dipper 21 and second dipper 23 are to retain of the same race or different types of soup respectively, many substrate W are impregnated into together carry out the device that soup is handled in this soup.First flushed channel 22 and second flushed channel 24 are to store flushing liquor (for example pure water) respectively, and many substrate W (for example 50) are impregnated in this flushing liquor together, and processing is washed on the surface.
In this embodiment, first dipper 21 and first flushed channel 22 that is adjacent become a pair of, and second dipper 23 and second flushed channel 24 that is adjacent become a pair of.And, have: first lifter 27 and second lifter 28, first lifter 27 as special-purpose transport mechanism be used for will carry out at first dipper 21 the substrate W that handles of soup move to first flushed channel, 22, the second lifters 28 and be used for carrying out the substrate W that soup handles as special-purpose transport mechanism and move to second flushed channel 24 at second dipper 23.First and second lifter 27,28 possesses: with many (for example 50) substrate W of perpendicular attitude in the substrate supporting portion of supporting along the stacked state of directions X (horizontal direction), make the lift drive mechanism that this substrate supporting portion moves up and down, the horizontal mobile driving mechanism that substrate supporting portion is laterally moved along the Y direction.In addition, directions X makes along the horizontal direction of the front surface 10a of substrate board treatment 10, is the direction with Y direction quadrature.
According to this structure, first lifter 27 is accepted with perpendicular attitude at many stacked substrate W of directions X in the lump from main transport mechanism 3, these many substrate W are descended in first dipper 21 and is immersed in the soup.And, only given soup in the processing time standby after, first lifter 27 rises substrate supporting portion and mention many substrate W from soup, towards first flushed channel 22 substrate supporting portion is laterally moved, then, this substrate supporting portion is descended in first flushed channel 22 and be immersed in the flushing liquor.Only in the given flushing processing time standby after, first lifter 27 rises substrate supporting portion and mention many substrate W from flushing liquor.From first lifter 27 to main transport mechanism 3 in the lump transmit many substrate Ws thereafter.Second lifter 28 is same, accepts in the lump with perpendicular attitude stacked many substrate W on directions X from main transport mechanism 3, makes these many substrate W drop in second dipper 23 and is immersed in the soup.Then, only given soup in the processing time standby after, second lifter 28 rises substrate supporting portion and mention many substrate W from soup, towards second flushed channel 24 substrate supporting portion is laterally moved, then, this substrate supporting portion is descended in second flushed channel 24 and be immersed in the flushing liquor.Only given flushing liquor in the processing time standby after, second lifter 28 rises substrate supporting portion and mention many substrate W from flushing liquor.Then, from second lifter 28 many substrate W are delivered to main transport mechanism 3 in the lump.
Dried portion 25 has the substrate holding mechanism that many (for example 50) substrate W are kept under the stacked state of directions X with perpendicular attitude, by in the reduced pressure atmosphere gaseous environment, supplying with organic solvent (isopropyl alcohol etc.) to substrate W, perhaps, make substrate W drying by utilizing centrifugal force to get rid of the liquid component on substrate W surface.This dried portion 25 can and main transport mechanism 3 between handing-over substrate W.
Main transport mechanism 3 has: substrate chuck 30, chuck drive mechanism, horizontal mobile driving mechanism and lift drive mechanism, wherein, this substrate chuck 30 is a pair of member, as substrate holding device in the lump, can be with many (for example 50) substrate W of perpendicular attitude to keep in the lump at the stacked state of directions X; Chuck drive mechanism moves this substrate chuck 30; Horizontal mobile driving mechanism makes substrate chuck 30 move horizontally (laterally moving) along the Y direction; Lift drive mechanism makes substrate chuck 30 along the lifting of Z direction.A pair of substrate chuck 30 possesses respectively along a pair of supporting guiding piece 31 of the axle shape of directions X extension, in the side of mutual subtend of each supporting guiding piece 31, the empty vertically standard width of a room in an old-style house every and be formed for receiving many substrate W of perpendicular attitude and many substrate supporting grooves that it supported from the below.Chuck drive mechanism rotates along arrow 33 directions by making a pair of substrate chuck 30, enlarges the distance of dwindling between a pair of supporting guiding piece 31.Thus, substrate chuck 30 can carry out seize on both sides by the arms and keep substrate W hold mode and, the on-off action that switches of the disarm state of seizing on both sides by the arms of liberation substrate W.By this on-off action and, the knee-action of first and second lifter 27,28, can between first and second lifter 27,28 and substrate chuck 30, carry out giving and accepting of substrate W.Main transport mechanism 3 can also and dried portion 25 between, with in perpendicular attitude along many substrate W of the stacked state one of directions X handing-over.
Chuck cleaning unit 8 is configured in the below of the first substrate transfer position P1.Chuck cleaning unit 8 has a pair of rinse bath 35 that is inserted with a pair of substrate chuck 30 respectively.In this a pair of rinse bath 35, utilize cleaning fluid cleaning base plate chuck 30 (particularly supporting guiding piece 31).Main transport mechanism 3, descended substrate chuck 30 and puts it into the rinse bath 35 of chuck cleaning unit 8 at the first substrate transfer position P1 before the substrate W that handles that has been through with finishing of dried of dried portion 25 in conveyance.And, in rinse bath 35, having cleaned after the substrate chuck 30, main transport mechanism 3 moves, to have accepted to finish the substrate W that handles in the lump from dried portion 25.
Mobile placement mechanism 5 one sides at the first substrate transfer position P1 are provided with gate 15, take out of mechanism's 4 one sides moving into of the second substrate transfer position P2 and are provided with gate 16.Gate 15 is opened when the first horizontal transport mechanism 6 is visited the first substrate transfer position P1, keeps closed condition during other.Gate 16 is opened when the second horizontal transport mechanism 7 is visited the second substrate transfer position P2, keeps closed condition during other.Thus, suppress or prevent the leakage of the soup environmental gas of processing substrate portion 2 one sides.
[structure that is used for the conveyance substrate]
Fig. 2 will enlarge the stereogram that shows in the relevant structure of conveyance substrate between wafer transport case F and the main transport mechanism 3.This Fig. 2 and described Fig. 1 reference of coming together.
The front surface 10a of substrate board treatment 10 near a bight near set the described second substrate transfer position P2, take out of mechanism 4 along setting to move near another bight of front surface 10a.Move into respect to this and to take out of mechanism 4,, dispose mobile placement mechanism 5 in the opposite side of Y direction and front open type wafer transport case maintaining part 1.Move at this and to dispose the first horizontal transport mechanism 6 between the placement mechanism 5 and the first substrate transfer position P1.In addition, dispose the second horizontal transport mechanism 7 between the mechanism 4 and the second substrate transfer position P2 moving into to take out of.Mobile placement mechanism 5 be configured in move into take out of join between mechanism 4 and the mobile placement mechanism 5 substrate, join between the mobile placement mechanism 5 and the first horizontal transport mechanism 6 substrate and between the mobile placement mechanism 5 and the second horizontal transport mechanism 7 handing-over substrate mobile placement location P3.
[moving into the structure of taking out of mechanism]
Fig. 3 is used to illustrate move into the structure of taking out of mechanism 4 and from the being seen stereogram of oblique upper.Move into and take out of mechanism 4 and have: a plurality of maintenance operators that many substrate W can be kept in the lump with stacked state, promptly the batch operation hand 40; Support the operator support 41 of this batch operation hand 40; Rotation block 42; Advance and retreat block 43; Operator driving and reversing mechanism 44.Be fixed with operator rotation motor 45 at rotation block 42, be connected with operator support 41 at the rotating shaft of this operator rotation motor 45 as the operator rotating mechanism.Thus, operator support 41 in the scopes of 360 degree of the central shaft 46 of batch operation hand 40, can rotate block 42 rotations relatively, by driving operator rotation motor 45, can produce this relative rotation.Thus, as shown in Figure 4, can make batch operation hand 40 around these central shaft 46 rotations.
Operator driving and reversing mechanism 44 possesses: a pair of straight line guiding piece 53,54 that makes the mode channeling conduct that advance and retreat block 43 moves along Y direction straight line; Be configured near the driven pulley (band gear) 55 of an end of a side straight line guiding piece 53; Be configured near the driving wheel (band gear) 56 of the other end of straight line guiding piece 53; Hang over described conveyer belt (band tooth conveyer belt) 57 of taking turns between 55,56 along the Y direction; Advance and retreat block 43 is combined in conveyer belt press device 58 on the conveyer belt 57; Rotating shaft is combined in advance and retreat motor 60 on the driving wheel 56.According to this structure, make conveyer belt 57 turnovers by driving advance and retreat motor 60, advance and retreat block 43 is moved horizontally in the Y direction, thus, the wafer transport case F that batch operation hand 40 is maintained on the wafer transport case maintaining part 1 relatively advances and retreat.
Fig. 6 is used in the stereogram that explanation makes the structure that batch operation hand 40 moves up and down, and has represented the structure that has in the inside of operator support 41.Operator support 41 has fixed pedestal 62, mobile foundation 63, brake 65.Batch operation hand 40 is fixed on the mobile foundation 63.This mobile foundation 63 combines with mobile block 64, and this moves block 64 and is driven by brake 65.Mobile foundation 63 is directed on the operator element arrangements direction 69 of batch operation hand 40 along not shown straight line guiding piece, and can relatively move by relative fixed pedestal 62.Brake 65 for example be with electro-motor as drive source, make mobile block 64 carry out the parts that straight line moves along operator element arrangements direction 69.According to this structure,, batch operation hand 40 is moved along operator element arrangements direction 69 by driving brake 65.Utilize this, many substrate W that are contained in the wafer transport case F can be taken out, perhaps in wafer transport case F, be formed on and place many substrate W on a plurality of substrate containing racks.
Fig. 7 is used to that batch operation hand 40 is described and the stereogram of the structure that is associated therewith.Batch operation hand 40 possesses a plurality of operator elements 70 of arranging along operator element arrangements direction 69.Each operator element 70 is the lamellar light beams that extend along a normal to a surface direction of operator support 41, overlooks forming approximate wedge shape.A plurality of operator elements 70, with per two mutual empty standard widths of a room in an old-style house every and the state of subtend, with the operator element permutation direction 69 empty standard widths of a room in an old-style house of its subtend direction quadrature every and stacked.The central shaft 46 of batch operation hand 40 is by the center of gravity of whole operation hand element 70, defines according to the imaginary line along the direction parallel with operator element 70.Across central shaft 46, be formed on a pair of operator element line 70A, the 70B of a plurality of operator elements 70 formations of arranging on the operator element permutation direction 69.
2 operator elements 70 by subtend keep a substrate W, therefore, many substrate W can be kept together at operator element permutation direction 69 stacked states.At this execution mode, can be in a wafer transport case F with the substrate W of 25 horizontal attitudes to keep at the stacked state of Z direction, relative therewith, 25 pairs of operator elements 70 come laminated configuration with substrate W space identical distance in wafer transport case F.Therefore, batch operation hand 40 can keep all substrate W in the wafer transport case F together.
As shown in Figure 8, each operator element 70 possesses lip-deep first bearing-surface 71 and second bearing-surface 72 that is positioned at mutual subtend one side.Be positioned at the base end part of operator support 41 1 side ends of operator element 70, possess first support projection 73, possess second support projection 74 at second bearing-surface 72 at first bearing-surface 71.In addition,, possess first guide protrusion 75, possess second guide protrusion 76 at second bearing-surface 72 at first bearing-surface 71 in the top ends of operator element 70.First support projection 73 that is provided with on first bearing-surface 71 and first guide protrusion 75 constitute the first substrate maintaining part, and second support projection 74 that is provided with on second bearing-surface 72 and second guide protrusion 76 constitute the second substrate maintaining part,
By the position of rotation of control,, make first support projection 73 and first guide protrusion 75 just can support this substrate W up with substrate W butt if with first bearing-surface 71 around the central shaft 46 of batch operation hand 40.In addition, if, make second support projection 74 and second guide protrusion 76 just can support this substrate W up with substrate W butt with second bearing-surface 72.During supporting substrates W, support projection 73,74 is at base end part one side of operator element 70 and the lower surface butt of substrate W, and guide protrusion 75,76 is at the tip side of operator element 70 and all end faces and the lower surface periphery butt of substrate W.
Shown in Fig. 4, Fig. 5 and Fig. 7 etc., on operator support 41,, has the supporting guiding piece 80 of 3 axle shapes in the position of the base end part that passes through operator element 70.3 supporting guiding pieces 80 are in operator element permutation direction 69 configured in parallel, foreign side's (with batch operation hand central shaft 46 opposite sides) at a side operator element line 70A disposes 1 supporting guiding piece 80, foreign side at the opposing party's operator element line 70B disposes another supporting guiding piece 80, and the roughly centre position between operator element line 70A, 70B disposes remaining 1 supporting guiding piece 80.
3 supporting guiding pieces 80 commonly are fixed on the front portion of guide base 81 (with reference to Fig. 7).Guide base 81 relatively moves pedestal 63 with along carrying out the mode combination that straight line moves on the direction of batch operation hand central shaft 46.At the rear portion of guide base 81, be fixed with carriage 79 to the side-prominent approximate L font of relatively move pedestal 63 and supporting guiding piece 80 opposite.On this carriage 79, cam follower 82 is installed towards a side opposite with supporting guiding piece 80.And mobile foundation 63 is provided with the cam 84 that has with the cam surface 83 of cam follower 82 butts.Cam 84 is positioned at relatively move pedestal 63 and supporting guiding piece 80 opposite sides, has cam surface 83 in supporting guiding piece 80 1 sides.This cam surface 83 comprises the inclined plane that relative operator element permutation direction 69 tilts.Cam 84 pedestal 63 that relatively moves is installed in the mode that can carry out straight line along operator element permutation direction 69 and move.
Near the dual-side of guide base 81, be formed with a pair of through hole 77,78.These through holes 77,78 make along the rectangle of operator element permutation direction 69.Be provided with operator element support unit 67,68 in the mode that connects these through holes 77,78.The rear portion of operator element support unit 67,68 is fixed on the mobile foundation 63.In addition, be fixed with a plurality of operator elements 70 that constitute operator element line 70A, 70B respectively in the front portion of operator element support unit 67,68.
By driving guiding piece driving and reversing mechanism 87 supporting guiding piece 80 is advanced to the tip side of batch operation hand 40, can seize substrate W on both sides by the arms from front and back by supporting guiding piece 80 and guide protrusion 75,76.This is seized state on both sides by the arms and uses when batch operation hand 40 carries out posture changing between horizontal attitude and perpendicular attitude.Thus, can in the posture changing process, stably keep substrate W, suppress or prevent falling of substrate W.
As shown in Figure 8, each supporting guiding piece 80 has in the direction upper shed by the substrate W of operator element 70 supporting, the operator element permutation direction 69 overhead standard widths of a room in an old-style house every and many substrates forming keep grooves 88.Specifically, each operator element 70 forms first substrate maintenance groove 88A and second substrate maintenance groove 88B relatively.And, make the axially movable guiding piece driving mechanism 89 of guide base 81 at supporting guiding piece 80.According to this structure,, first substrate can be kept the groove 88A or second substrate keep groove 88B on the end face that is maintained at the substrate W on the operator element 70, to carry out contraposition by control guiding piece driving mechanism 89.Thus, for example, can keep groove 88A to utilize in the maintenance of untreatment base W first substrate, and second substrate can be kept groove 88B utilize in the maintenance of having finished the substrate W that handles.
[structure of mobile placement mechanism]
Fig. 9 is used in the stereogram of the structure of the mobile placement mechanism 5 of explanation.Mobile placement mechanism 5 possesses a pair of supporting leading axle 91 that extends in the Y direction, and this a pair of supporting leading axle 91 is along the mutual subtend of directions X.These supporting leading axle 91 performances keep in the lump with the function of perpendicular attitude at the mobile placement support of many stacked substrate W of Y direction.
A pair of supporting leading axle 91 is by 92 supportings of guiding support.Guiding support 92 is carrying out the upper end that mode that linear reciprocation moves is installed in main part 93 along the only mobile slight distance of Y direction.Main part 93 is at the parts of the column of Z direction extension, is assembled on the substrate board treatment 10 in the mode that can move up and down along the Z direction.
As shown in figure 10, on the lower end of main part 93 is combined with brake 95 as driving mechanism up and down.Brake 95 is with motor 94 and straight line guiding piece and the incorporate driver part of ball nut as drive source, and main part 93 is moved up and down along the Z direction.
Figure 11 is that expression is moved the stereogram of the structure of usefulness with a pair of supporting leading axle 91 along the Y direction, and expression is from the being seen structure in the rear of Fig. 9.Guiding piece support 92 is installed in along on the upper end of the main part 93 of Z direction extension, on this main part 93, is directed by straight line guiding piece 97, can move along the Y direction.Upper surface at main part 93 is equipped with the mobile motor 100 of guiding via carriage 98.Be carved with screw thread on the rotating shaft 101 of the mobile motor 100 of guiding, this rotating shaft 101 disposes along the Y direction.Rotating shaft 101 is screwed in the screwed hole of block 99 of the side that is fixed on guiding piece support 92.According to this structure,, a pair of supporting leading axle 91 is advanced and retreat in the Y direction with guiding piece support 92 by mobile motor 100 is just changeing, inversion driving to guiding.Like this, the supporting guiding horizontal mobile mechanism 102 (support horizontal mobile mechanism) by guiding formations such as mobile motor 100 that supporting leading axle 91 is moved horizontally.
On guiding piece support 92, have and make a pair of supporting leading axle 91 rotate the guiding piece rotating mechanism 105 of usefulness around axle separately.A pair of supporting leading axle 91 is installed in respectively on the guiding piece support 92 in the mode that can sway.On the base end part of each supporting leading axle 91, guiding rotation motor 110 and regulating wheel 108 are installed.On the rotating shaft of guiding rotation motor 110, be fixed with wheel 109.And volume hangs with conveyer belt (band tooth conveyer belt) 111 on wheel 106,107,109, gives tension force from the outside of this conveyer belt 111 by regulating wheel 108.According to this structure,, a pair of supporting leading axle 91 is rotated around each in linkage by driving guiding rotation motor 110.
Figure 12 is the vertical view that is used to illustrate the structure that supports leading axle 91.Supporting leading axle 91 have first abutting part 113 and second abutting part 114 at the diverse location of circumferencial direction (in this embodiment for differing 180 position), and two places between them becomes the portion of keeping out of the way 115.First and second abutting part 113,114 will be constituting in the mode of direction of principal axis alignment arrangements with outstanding a plurality of dentations 116 on the direction of direction of principal axis quadrature of supporting leading axle 91.Be formed with the support slot of the periphery that is used to receive substrate W in the top ends of each dentation 116.Do not form dentation 116 in the portion of keeping out of the way 115.
By utilizing guiding piece rotating mechanism 105 to make the rotation of supporting leading axle 91, can become for first abutting part 113 that makes a pair of supporting leading axle 91, first bearing state (with reference to Figure 12) opposite to one another, make second abutting part 114, second bearing state opposite to one another or make the portion of keeping out of the way 115 opposite to one another keep out of the way state (with reference to Figure 13).
Under first bearing state, the distance between first abutting part 113 of a pair of supporting leading axle 91 is less than the diameter of substrate W.Therefore, the enough a pair of supporting leading axles 91 of energy keep many substrate W of perpendicular attitude in the lump.Similarly, under second bearing state, the distance between second abutting part 114 of a pair of supporting leading axle 91 is less than the diameter of substrate W.Therefore, the enough a pair of supporting leading axles 91 of energy keep many substrate W of perpendicular attitude in the lump.For example, when keeping untreatment base W is first bearing state, when keeping having finished the substrate W that handles is second bearing state, control guiding rotation motor 110 by such mode, can and finish the substrate W that handles with untreatment base W thus and between first and second abutting part 113,114, switch and keep.
Keeping out of the way under the state, as shown in figure 13, the distance between a pair of supporting leading axle 91 is greater than the diameter of substrate W.Therefore, the substrate W of perpendicular attitude can be by between a pair of supporting leading axle 91.
[structure of the first horizontal transport mechanism]
Figure 14 is the stereogram that is used to illustrate the structure of the first horizontal transport mechanism 6.The first horizontal transport mechanism 6 possesses: the first horizontal conveyance maintaining part 120 that keeps many substrate W of perpendicular attitude in the lump; The main part 121 that can support this first horizontal conveyance maintaining part 120 around the state of vertical axle rotation with this first horizontal conveyance maintaining part 120; The mobile foundation 122 that this main part 121 is loaded; Make this mobile foundation 122 along horizontal drive mechanism 125 that directions X moves horizontally.Main part 121 has along the form of the column of Z direction, and the end is equipped with the first horizontal conveyance maintaining part 120 thereon, and its bottom is fixed on the mobile foundation 122.
Figure 15 and Figure 16 are the front views (from the being seen front view of directions X) that the structure of the expansion first horizontal conveyance maintaining part 120 is represented.Horizontal conveyance maintaining part 120 possesses first guiding piece 135 and second guiding piece 136.
First guiding piece 135 has 3 support unit 135a, 135b, the 135c of along continuous straight runs configured in parallel, and these are by 137 supportings of first guide base.On each upper surface of 3 support unit 135a, 135b, 135c, many (for example 50) substrates keep groove to arrange and form along the length direction of each support unit 135a, 135b, 135c.Keep grooves (substrate that is respectively formed on support unit 135a, 135b, the 135c keeps groove) along 3 substrates of vertical with the length direction quadrature of support unit 135a, 135b, 135c, 1 substrate W of relative perpendicular attitude, with the diverse location butt of its lower edge, and keep the substrate W of this perpendicular attitude.Like this, first guiding piece 135 can keep the substrate W of many perpendicular attitude in the lump.Substrate keeps groove half interval (half at interval) to dispose at interval with the maintenance of the substrate W in the wafer transport case F.
Similarly, second guiding piece 136,3 support unit 136a, 136b, 136c with along continuous straight runs configured in parallel, these are by 138 supportings of second guide base.On each upper surface of 3 support unit 136a, 136b, 136c, many (for example 65) substrates keep groove to arrange and form along the length direction of each support unit 136a, 136b, 136c.Keep grooves (substrate that is respectively formed on support unit 136a, 136b, the 136c keeps groove) along 3 substrates of vertical with the length direction quadrature of support unit 136a, 136b, 136c, 1 substrate W of relative perpendicular attitude, with the diverse location butt of its lower edge, and keep the substrate W of this perpendicular attitude.Like this, second guiding piece 136 can keep the substrate W of many perpendicular attitude in the lump.Substrate keeps groove half interval (half at interval) to dispose at interval with the maintenance of the substrate W in the wafer transport case F.
A support unit 136c of second guiding piece 136 is directly installed on second guide base 138, but remaining two support unit 136a, 136b are by secondary guide base 139 supportings, and this pair guide base 139 is supported by second guide base 138 via bolster 140.Second guide base 138 is compared first guide base 137 and is positioned at the below, and bolster 140 is inserted in the inserting hole that forms on first guide base 137 and arrives second guide base 138.
Lower surface in second guide base 138 is fixed with two straight line sleeves 145,146.In a side straight line sleeve 145, be inserted with rotating shaft 147, in the straight line sleeve 146 of other party, be inserted with axle 148.The upper end of rotating shaft 147 and axle 148 all is fixed on first guide base 137.Guide rotation axis 147 and axle 148 by utilizing straight line sleeve 145,146 along the Z direction, thus, first guide base 137, relative second guide base 138 can relatively be carried out lifting in the Z direction.That is, first guiding piece, 135 relative second guiding pieces 136 are moved up and down.In addition, when making rotating shaft 147 around the rotation of its axle center, first guide base 137 is around rotating shaft 147 rotations, and this rotation is via straight line sleeve 146 and spools 148 and be delivered on second guide base 138.Like this, can make 135, the 136 interlock rotations of first and second guiding piece.
By making first guiding piece, 135 relative second guiding pieces 136 carry out relative moving up and down, can first bearing state (state of Figure 15) above the substrate supporting position of the substrate supporting position configuration of first guiding piece 135 being compared second guiding piece 136 and, the substrate supporting position configuration of second guiding piece 136 compared between second bearing state (with reference to Figure 16) above the substrate supporting position of first guiding piece 135 and switching.Thus, for example, when supporting untreatment base W, be when first bearing state is used first guiding piece, 135 supporting substrates W, when the substrate W that handles has been finished in supporting, be second bearing state, second guiding piece, 136 supporting substrates W.
In addition, rotate (for example 90 degree) around vertical axle horizontal by making first and second guiding piece 135,136, can conversion substrate orientation between the orientation of the substrate W of the orientation of the substrate W of mobile placement mechanism 5 and main transport mechanism 3.And, accept and for example keep after 25 substrate W from mobile placement mechanism 5, make the first horizontal conveyance maintaining part 120 (guiding piece 135,136) only horizontally rotate 180 degree, then moving from the mode that mobile placement mechanism 5 is accepted other 25 substrate W around vertical axle.At this moment, the formation substrate W of the formation substrate W of 25 initial substrate in batch and 25 substrate in batch afterwards remains on the horizontal conveyance maintaining part 120 in the horizontal direction in the mode that staggers mutually stackedly.In wafer transport case F, the direction that forms face towards device keeps many substrate W, thus though 50 substrate W on the horizontal conveyance maintaining part 120 are adjacent, make device form face each other or non-device formation face be held opposite to one anotherly.
Figure 17 is that explanation is used for the stereogram that the structure of the horizontally rotating of the first horizontal conveyance maintaining part 120 and the lifting of the first guiding piece pedestal 137 is used.Figure 18 is its end view.In main part 121, be equipped with: be used to make rotating shaft 147 rotations as the guiding rotation motor 150 of horizontal rotary mechanism and, air cylinder 151 that this guiding rotation motor 150 is moved up and down as the guiding piece elevating mechanism.The Z direction disposes straight line guiding piece 152 in the inwall upper edge of main part 121, and along this straight line guiding piece 152, guidance unit 153 can move in the Z direction.Guiding rotation motor 150 is installed on this guidance unit 153, and rotating shaft 147 inserts in the guidance unit 153.And,, main part 121 relatively also is inserted with rotating shaft 147 in the time of vertical axle rotation bearing 154 (having omitted diagram in Figure 18) is installed at the upper surface of main part 121.On the rotating part of this bearing 154, be fixed with straight line sleeve 146.According to this structure, by driving air cylinder 151, rotating shaft 147 is moved up and down with guiding rotation motor 150, thus, can make 136 liftings of first guiding piece, 135 relative second guiding pieces.In addition, make rotating shaft 147 rotations, horizontal conveyance maintaining part 120 is horizontally rotated by driving guiding rotation motor 150.
[structure of the second horizontal transport mechanism]
Figure 19 is the stereogram that a part of structure of the explanation second horizontal transport mechanism 7 is used.Together with reference to this Figure 19 and described Fig. 2.
The second horizontal transport mechanism 7 has and the first horizontal transport mechanism 6 similar structures, possesses: the second horizontal conveyance maintaining part 160 that keeps many substrate W of perpendicular attitude in the lump; With the main part 161 that this horizontal conveyance maintaining part 160 is supported the second horizontal conveyance maintaining part 160 around vertical state that rotates; Be equipped with the rotating basis 162 of this main part 161; So that this rotating basis 162 can be around vertical mobile foundation 163 that supports rotatably; Make this mobile foundation 163 along horizontal drive mechanism 165 that directions X moves horizontally.Main part 161 has along the form of the column of Z direction, and the end is equipped with horizontal conveyance maintaining part 160 thereon, and its bottom is fixed on the rotating basis 162.
Figure 20 is the stereogram of the appearance of the expression second horizontal conveyance maintaining part 160 when being positioned at front surface 10a one side of substrate board treatment 10.Straight line guiding piece 166 is configured in abreast with the straight line guiding piece 126 of the first horizontal transport mechanism 6 and compares front surface 10a one side of this straight line guiding piece 126 near substrate board treatment 10.When making the second horizontal conveyance maintaining part 160 relative straight line guiding pieces 166 be positioned at front surface 10a one side of substrate board treatment 10, the second horizontal conveyance maintaining part 160, at the state of the relative second substrate transfer position P2 in the directions X subtend, can move along directions X, and can move to till the second substrate transfer position P2.
Figure 21 is the stereogram of the appearance of the expression second horizontal conveyance maintaining part 160 relative straight line guiding pieces 166 when being positioned at processing substrate portion 2 one sides.Under this state, horizontal conveyance maintaining part 160 at the state of placement location P3 in the directions X subtend that relatively move, can move along directions X, and can move to till the mobile placement location P3.
Therefore, the second horizontal conveyance maintaining part 160 can move along directions X, also can move around vertical axes 172 rotation, thus, can be between the second substrate transfer position P2 and mobile placement location P3 many substrate W of horizontal in the lump conveyance.
In addition, the detailed structure of the second horizontal transport mechanism 7 is identical with the first horizontal transport mechanism 6, below as required, also might use the Reference numeral relevant with the first horizontal transport mechanism 6 when the horizontal transport mechanism 7 of explanation second.
[structure that the second horizontal transport mechanism and main transport mechanism handing-over substrate are used]
Figure 22 is illustrated in the second substrate transfer position P2 to join the schematic diagram of structure of substrate W in the lump.Be provided with first robot of intermediary 175 and second robot of intermediary 176 that constitutes intermediary at the second substrate transfer position P2.First robot of intermediary 175 accepts with perpendicular attitude at many stacked (for example 50) substrate W of directions X in the lump from the second horizontal transport mechanism 7.Second robot of intermediary 176 accepts with perpendicular attitude at many stacked (for example 50) substrate W of directions X in the lump from first robot of intermediary 175.Main transport mechanism 3 moves along the mode of many stacked substrate W of directions X to accept perpendicular attitude from this robot of second intermediary 176.
Figure 23 is the stereogram of the structure of expression first robot of intermediary 175.First robot of intermediary 175 comprises: a pair of supporting guiding piece 177 that forms a shape; Support the guiding piece support 178 of this supporting guiding piece 177; This guiding piece support 178 is fixed on the main part 179 of upper end; Be used to brake 180 that this main part 179 is moved up and down.A pair of supporting guiding piece 177 skies are opened the interval wide and narrower than the diameter of substrate W than horizontal conveyance maintaining part 160, subtend on the Y direction, and can between them, keep many (for example 50) substrate W of perpendicular attitude in the lump.Main part 179 is formed extended at both sides along vertical direction.Brake 180 as drive source, moves up and down main part 179 in motor 181.According to this structure, many substrate W that remain on the second horizontal conveyance maintaining part 160 with perpendicular attitude upwards can be taken out from the below in the lump.
Figure 24 is the stereogram of the structure of expression second robot of intermediary 176.Second robot of intermediary 176 comprises: a pair of supporting guiding piece 183; Support the guiding piece support 184 of this a pair of supporting guiding piece 183; This guiding piece support 184 is fixed on the main part 185 of upper end; Be used to brake 186 that this main part 185 is moved up and down.A pair of supporting guiding piece 183 can keep many (for example 50) substrate W of perpendicular attitude in the lump between them.Main part 185 is formed extended at both sides along vertical direction.Brake 186 as drive source, moves up and down main part 185 in motor 187.According to this structure, can accept also many substrate W of supports vertical attitude together from first robot of intermediary 175, and it is delivered to main conveyance structure 3.
In the upper end of main part 185, replace supporting guiding piece 183, also can mounted board orientation arrange agencie.So-called substrate orientation arrange agencie for example by being organized in the direction of the otch (recess etc.) that forms on the semiconductor crystal wafer, makes the device of orientation (crystal orientation under the situation of semiconductor crystal wafer) the alignment arrangement of many substrates.Still do not possess substrate orientation arrange agencie by having 176 liang of sides of first robot of intermediary 175 and second robot of intermediary, no matter possessing, structure does not need very big change, just can carry out the substrate delivery/reception action at the second substrate transfer position P2.
[action of substrate board treatment]
The action of substrate board treatment 10 then, is described.
This action, be by controller 9 control basal plate handling parts 2, main transport mechanism 3, the action of moving into each several parts such as taking out of mechanism 4, mobile placement mechanism 5, the first horizontal transport mechanism 6, second transport mechanism 7, chuck cleaning unit 8 realizes.Particularly, controller 9 is moved into the effect of taking out of mechanism 4, mobile placement mechanism 5 and first and second transport mechanism 6,7 as moving placement control unit performance control, in addition, also bring into play the effect of the action of the main transport mechanism 3 of control as the conveyance control unit.
[take out of from wafer container F be untreatment base W]
When on wafer transport case maintaining part 1, having maintained the wafer transport case F of many (for example 25) untreatment base W ccontaining, move into and take out of mechanism 4, many untreatment base W that will be in wafer transport case F be laminated in the Z direction with horizontal attitude send in the lump.Particularly, wafer transport case maintaining part 1 is provided with the opener of the lid that is used to take off wafer transport case F.After taking off the lid of wafer transport case F, can confirm the number of the substrate W in the wafer transport case F by transducer by this opener.
When wafer transport case F sends untreatment base W, move into and take out of mechanism 4 and make batch operation hand 40 be horizontal attitude, and batch operation hand 40 is passed in and out towards wafer transport case F along the Y direction by operator driving and reversing mechanism 44, a plurality of operator elements 70 are entered respectively between the substrate W.At this moment, batch operation hand 40 is controlled to be attitude towards the top with first bearing-surface 71 of operator element 70.
In addition, by actuator 65, make batch operation hand 40 slight distance that only rises.Thus, batch operation hand 40 promotes many untreatment base W simultaneously.Under this state, by operator driving and reversing mechanism 44 batch operation hand 40 is kept out of the way to the posture changing position from wafer transport case F, thereby many substrate W in the wafer transport case F can be sent in the lump.
[the attitude change of untreatment base W]
Substrate W from wafer transport case F sends keeps under the state that is laminated in the Z direction with horizontal attitude by batch operation hand 40.From this state, rotation motor 50 is driven, and operator support 41 is revolved along the YZ plane turn 90 degrees.Thus, batch operation hand 40 rises and makes supporting guiding piece 80 be positioned at the below, and the top that makes operator element 70 is towards the top.Its result, many substrate W posture changings are for being laminated in the state of Y direction with perpendicular attitude.By this posture changing, many substrate W are directed to mobile placement location P3.
Before posture changing, supporting guiding piece 80 is controlled to be and is used in the rear, substrate holding position that first substrate maintenance groove 88A that keeps untreatment base W is positioned at each operator element 70 by guiding piece driving mechanism 89.In addition, guiding piece driving and reversing mechanism 87 makes supporting guiding piece 80 advance to the tip side of operator element 70.Thus, clamping substrate W between first guide protrusion on the top of supporting guiding piece 80 and operator element 70.Under this state, carry out aforesaid posture changing action.After posture changing finished, guiding piece driving and reversing mechanism 87 made supporting guiding piece 80 retreat with slight distance at operator element 70 rears, removes the clamping of substrate W.Thus, the substrate maintenance groove 88 by supporting guiding piece 80 becomes the state that keeps substrate W with perpendicular attitude.At this moment, substrate W is urged on substrate keeps groove 88 by gravity, thus proper alignment substrate W side by side.
[untreatment base moves and places action]
Take out of mechanism 4 and carry out in the process of posture changing action moving into, mobile placement mechanism 5 makes supporting leading axle 91 be positioned at the 41 below standbies of operator support.At this moment, guiding piece rotating mechanism 105 makes first abutting part 113 of a pair of supporting leading axle 91 control the turned position of supporting leading axle 91 relative to one another.
After the posture changing release and removing the clamping of substrate W, make supporting leading axle 91 rise to the last position of batch operation hand 40 tops by actuator 95.In this uphill process, many substrate W move placement to supporting leading axle 91 in the lump from batch operation hand 40.The width of the directions X of operator support 41 is littler than the interval between a pair of supporting leading axle 91.Therefore, needn't worry to support leading axle 91 when rising with 41 interference of operator support.
After substrate W moves placement, move into and take out of mechanism 4 and drive rotation motors 50, make batch operation hand 40 recover and become holding state towards the horizontal attitude of wafer transport case maintaining part 1.
Then, the second horizontal transport mechanism 7 makes the second horizontal conveyance maintaining part 160 move to mobile placement location P3.At this moment, for example, first guiding piece 135 becomes compares first bearing state that second guiding piece 136 is positioned at the top.
Under this state, mobile placement mechanism 5 makes supporting leading axle 91 move to upper/lower positions.In this process, many substrate W that keep with perpendicular attitude on supporting leading axle 91 move placement to the second horizontal conveyance maintaining part 160 in the lump.The second horizontal conveyance maintaining part becomes along the attitude of Y direction the support unit of guiding piece 135,136 160 this moments, and becomes the state that can keep being laminated in perpendicular attitude many substrate W of Y direction.The width of the directions X of the second horizontal conveyance maintaining part 160 is littler than the interval between a pair of supporting leading axle 91 under this state.Therefore, needn't worry to support leading axle 91 when descending with second horizontal conveyance maintaining part 160 interference.
After this moved placement, the guiding piece rotating mechanism 105 of mobile placement mechanism 5 rotated a pair of supporting leading axle 91 in the portion's of keeping out of the way 115 modes respect to one another.Under this state, mobile placement mechanism 5 upwards rises supporting leading axle 91 on the position and keeps out of the way.Therefore distance between the portion of keeping out of the way 115 of a pair of supporting leading axle 91 is longer than the diameter of substrate W, supports leading axle 91 position that can make progress and keeps out of the way and avoid interfering with the substrate W that keeps on horizontal conveyance maintaining part 160.
After supporting leading axle 91 was kept out of the way, the second horizontal transport mechanism 7 made the second horizontal conveyance maintaining part 160 around vertical axle rotation, and kept out of the way from mobile placement location P3.
After horizontal conveyance maintaining part 160 was kept out of the way, mobile placement mechanism 5 made supporting leading axle 91 drop to upper/lower positions and standby like this.In addition, by guiding rotating mechanism 105, control the turned position of a pair of supporting leading axle 91 in first abutting part, 113 modes respect to one another.
[batch combination action]
The second horizontal transport mechanism 7, each substrate that 25 initial substrate W is remained in first guiding piece 135 keeps in the groove.From this state, and then in each vacant substrate maintenance groove, accept 25 follow-up substrate W, comprise criticizing of 50 substrate W thereby form.This operation is called batch combination.
The second horizontal conveyance maintaining part 160 from mobile placement location P3 keeps out of the way horizontally rotates 180 degree as required and by the action that guides rotation motor 150.
In addition, move into and take out of mechanism 4 and send many untreatment base W in the lump from another wafer transport case F that is disposed at wafer transport case maintaining part 1 by the action of automatic wafer transport case carrying device 11.In addition, with aforesaid situation similarly, make these many substrate W be transformed to perpendicular attitude from horizontal attitude, by the supporting guiding piece 80 be supported on mobile placement location P3.
Under this state, move into and take out of mechanism 4, make supporting guiding piece 80 along the maintenance of the Y direction moving substrate W distance (half at interval) of half at interval in the lump by actuator 65 and mobile foundation 63.In addition, mobile placement mechanism 5 by driving the mobile motor 100 of guiding, makes supporting leading axle 91 maintenance of moving substrate W distance of half at interval only on the direction (Y direction) identical with the moving direction of supporting guiding piece 80.Thereby the substrate holding position that makes supporting guiding piece 80 and supporting leading axle 91 is proper alignment in vertical direction, and only is offset half at interval along the Y direction when keeping initial 25 substrate W.
From this state, mobile placement mechanism 5 rises supporting leading axle 91 and the position that makes progress is directed.In this process, many substrate W that supporting leading axle 91 will support on the guiding piece 80 mention in the lump.
Then, move into and take out of mechanism 4 to make batch operation hand 40 posture changings be horizontal attitude, and keep out of the way from mobile placement location P3.
Under this state, the second horizontal transport mechanism 7 makes the second horizontal conveyance maintaining part 160 move to mobile placement location P3 rotation.Then, mobile placement mechanism 5 makes a pair of supporting leading axle 91 descend towards upper/lower positions.In this process, 25 substrate W that keep on supporting leading axle 91 are sent on first guiding piece 135 of the second horizontal conveyance maintaining part 160 in the lump.These 25 substrate W enter between 25 substrate W that remain on the second horizontal conveyance maintaining part 160 with engagement system, thereby make 50 substrate W remain in the second horizontal conveyance maintaining part 160 under the state that is laminated in the Y direction with half spacing.
Then, the second horizontal transport mechanism 7, make the second horizontal conveyance maintaining part 160 around vertical axes 172 rotation and with the second substrate transfer position P2 subtend, by guiding rotation motor 150 around rotating shaft 147 rotations, and then, on directions X, move horizontally, move horizontally (with reference to Figure 20) to the second substrate transfer position P2.At this moment, the second horizontal transport mechanism 7, many substrate W that form perpendicular attitude are laminated in the state of directions X, and the second horizontal conveyance maintaining part 160 is horizontally rotated.
[substrate delivery/reception on the second substrate transfer position P2]
The second horizontal conveyance maintaining part 160 of the second horizontal transport mechanism 7 moves to before the second substrate transfer position P2, and first robot of intermediary 175 makes the upper/lower positions standby of supporting guiding piece 177 below the second horizontal conveyance maintaining part 160.After the second horizontal conveyance maintaining part 160 moved to the second substrate transfer position P2, first robot of intermediary 175 made supporting guiding piece 177 rise to the last position higher than the second horizontal conveyance maintaining part 160.In this process, many (50) substrates with the stacked perpendicular attitude of half spacing are joined in the lump to supporting guiding piece 177 from the second horizontal conveyance maintaining part 160.
After this, the second horizontal transport mechanism 7 makes the second horizontal conveyance maintaining part 160 keep out of the way from the second substrate transfer position P2, prepares to accept follow-up untreatment base W.
In addition, first robot of intermediary 175 makes supporting guiding piece 177 drop to the upper/lower positions of supporting guiding piece 183 belows of second robot of intermediary 176.In this process, join many (50) substrates in the lump to second robot of intermediary 176 from first robot of intermediary 175.In second robot of intermediary 176, have under the situation of substrate orientation arrange agencie, and then carry out the substrate orientation and arrange action.
[action of main transport mechanism]
The flushing of end in abacus 22,24 handled and the substrate W of needs enforcement dried, is handed off to main transport mechanism 3 from lifter 27,28, and sends into dried portion 25 by this main transport mechanism 3.In addition, the substrate W that finishes processing of the processing of using dried portion 25 of being through with is sent from dried portion 25 by main transport mechanism 3, and to the first substrate transfer position P1 by conveyance.
[finishing the sending of substrate of processing]
The first horizontal transport mechanism 6 is when making the first horizontal conveyance maintaining part 120 in the first substrate transfer position P1 standby (with reference to Figure 20, Figure 21), and many substrate W that finish processing that main transport mechanism 3 will keep on substrate chuck 30 are handed off to the first horizontal conveyance maintaining part 120 in the lump.
The first horizontal transport mechanism of having accepted to finish the substrate W of processing moves horizontally along directions X, and make the first horizontal conveyance maintaining part 120 around vertical axes from turning 90 degrees, and cooperate with the maintenance direction (Y direction) of substrate W on the mobile placement mechanism 5.In addition, make the first horizontal conveyance maintaining part 120 of this attitude move to mobile placement location P3.
Before this, mobile placement mechanism 5 make the supporting leading axle 91 below the first horizontal conveyance maintaining part 120 standby in upper/lower positions.At this moment, guiding piece rotating mechanism 105, the turned position of control supporting leading axle 91 and second abutting part 114 that makes a pair of supporting leading axle 91 are toward each other.
Mobile placement mechanism 5 makes supporting leading axle 91 rise to the last position of the first horizontal conveyance maintaining part, 120 tops by actuator 95.In this uphill process, many substrate W move placement to supporting leading axle 91 in the lump from the first horizontal conveyance maintaining part 120.At this moment, the first horizontal conveyance maintaining part 120 keeps 50 substrate W under the state that is laminated in the Y direction with half spacing, and the substrate W that move to place in the lump on supporting leading axle 91, is 25 of each group wherein.Like this, comprising batch removing of 50 substrate W is 25 one group substrate in batch.This operation is called batch releasing.After batch releasing action, the first horizontal transport mechanism 6 makes the first horizontal conveyance maintaining part 120 keep out of the way towards directions X (the first substrate transfer position P1 side) temporarily.
Then, move into and take out of mechanism 4, make batch operation hand 40 be transformed to perpendicular attitude in the posture changing position from horizontal attitude.Thus, batch operation hand 40 is disposed at mobile placement location P3 with perpendicular attitude.At this moment, batch operation hand 40 is controlled to be second bearing-surface 72 upwards in advance when horizontal attitude.In addition, supporting guiding piece 80 is controlled to be second substrate that is used in the substrate W that keeps finishing processing and keeps groove 88B to be positioned at the rear, substrate holding position of each operator element 70.Certainly, the substrate supporting Position Control of the substrate supporting position of supporting guiding piece 80 and supporting leading axle 91 is consistent when overlooking.
Under this state, mobile placement mechanism 5 makes supporting leading axle 91 from the upper upper/lower positions that drops to operator support 41 belows that deposits.In this process, many (25) substrate W transmit to supporting guiding piece 80 from supporting leading axle 91 in the lump.
Then, moving into the guiding piece driving and reversing mechanism 87 of taking out of mechanism 4 advances supporting guiding piece 80.Thus, clamping substrate W between second guide protrusion 76 on supporting guiding piece 80 and operator element 70 tops.Under this state, drive rotation motor 50, batch operation hand 40 rotates to be horizontal attitude from perpendicular attitude.Like this, 25 substrate W are transformed to horizontal attitude from perpendicular attitude.After posture changing finished, guiding piece driving and reversing mechanism 87 made supporting guiding piece 80 in the only mobile slight distance in the rear of operator element 70, removes the clamping of substrate W.
Move into and take out of mechanism 4, and then batch operation hand 40 is advanced along the Y direction towards wafer transport case F.Heretofore, automatically wafer transport case carrying device 11 disposes the wafer transport case F of the sky that is used for the ccontaining substrate W that finishes processing on wafer transport case maintaining part 1.The back is by the effect of actuator 65 in entering wafer transport case F for batch operation hand 40, and little height only descends.Thus, the ccontaining substrate W of difference on a plurality of substrate retainers that in wafer transport case F, form.Thereafter, batch operation hand 40 retreats into outside the wafer transport case F, prepares to accept 25 follow-up substrate W.
At mobile placement location P3, mobile placement mechanism 5 waits for that supporting leading axle 91 drops to upper/lower positions, and the first horizontal transport mechanism 6 makes the first horizontal conveyance maintaining part 120 enter mobile placement location P3 once more.At this moment, mobile placement mechanism 5 will support leading axle 91 only mobile half pitch on the Y direction, make on the first horizontal conveyance maintaining part 120 position and the substrate supporting position consistency of remaining 25 substrate W of keeping.In addition, corresponding therewith, move into and take out of mechanism 4 and will support guiding piece 80 with mobile foundation 63 only mobile half pitch on the Y direction.
Enter once more under the state of mobile placement location P3 in the first horizontal conveyance maintaining part 120, mobile placement mechanism 5 will support the last position that leading axle 91 rises to the first horizontal conveyance maintaining part, 120 tops.In this process, 25 substrate W that keep on the first horizontal conveyance maintaining part 120 are sent to supporting leading axle 91 in the lump.
After this, the first horizontal transport mechanism 6 makes horizontal conveyance maintaining part 120 keep out of the way from mobile placement location P3, then moves into to take out of mechanism 4 batch operation hand 40 is transformed to perpendicular attitude from horizontal attitude, and is directed to mobile placement location P3.From this state, mobile placement mechanism 5 makes supporting leading axle 91 drop to the upper/lower positions of operator support 40 belows.In this process, from supporting leading axle 91 to the supporting leading axle 80 of batch operation hand 40 belows 25 substrates of conveyance in the lump.
Thereafter, moving into the guiding piece driving and reversing mechanism 87 of taking out of mechanism 4 advances supporting guiding piece 80.Thus, clamping substrate W between second guide protrusion 76 on supporting guiding piece 80 and operator element 70 tops.Under this state, drive rotation motor 50, make batch operation hand 40 rotate to be horizontal attitude from perpendicular attitude.Like this, 25 substrate W are transformed to horizontal attitude from perpendicular attitude.After posture changing finished, guiding piece driving and reversing mechanism 87 made supporting guiding piece 80 only retreat slight distance at the rear of operator element 70, removes the clamping of substrate W.
Move into and take out of mechanism 4, and then batch operation hand 40 is advanced along the Y direction towards wafer transport case F.Heretofore, automatic wafer transport case carrying device 11, configuration is used for the wafer transport case F of the sky of the ccontaining substrate W that finishes processing on wafer transport case maintaining part 1.Batch operation hand 40 in entering wafer transport case F after, little height only descends.Thus, the ccontaining substrate W of difference on a plurality of substrate retainers that in wafer transport case F, form.
[second execution mode]
Figure 25 be expression this invent the vertical view of formation of the substrate board treatment of other execution modes.In addition, Figure 26 is the stereogram of the formation between expression wafer transport case and the substrate transfer position.
In described first execution mode, main transport mechanism 3 is delivered to the first horizontal transport mechanism 6 at the first substrate transfer position P1 with substrate W, accepts to pass through the untreatment base W of second horizontal transport mechanism 7 conveyances at the second substrate transfer position P2.Relative therewith, in the substrate board treatment 200 of second execution mode, omitted the second horizontal transport mechanism 7, and only be provided with a horizontal transport mechanism 6.This horizontal transport mechanism 6 carries out following action: at substrate transfer position P1 untreatment base W is delivered to main transport mechanism 3, and similarly accept to finish the substrate W of processing at substrate transfer position P1 from main transport mechanism 3.And then horizontal transport mechanism 6 also can be carried out batch combination of being carried out by the second horizontal transport mechanism 7 and move except batch releasing action in described first execution mode.
With described first execution mode in the corresponding position P4 of the second substrate transfer position P2, can constitute substrate orientation arrange agencie.In the case, main transport mechanism 3 joins substrate orientation arrange agencie to position P4 with this untreatment base W after substrate transfer position P1 obtains untreatment base W from the first horizontal transport mechanism 6.Then, after action was arranged in the substrate orientation, main transport mechanism 3 was obtained substrate W and to 2 conveyances of processing substrate portion from substrate orientation arrange agencie.
[other execution modes]
In the first embodiment, the first and second horizontal transport mechanisms 6,7 have first and second guiding pieces 135,136, and have the structure that is used for it is switched use.But in the action of first execution mode, the first horizontal transport mechanism 6, be exclusively used in and keep also conveyance to finish the substrate W of processing, the second horizontal transport mechanism 7 is exclusively used in and keeps and conveyance untreatment base W, therefore two substrates maintenance guiding pieces needn't be set and, only need a substrate that continues to use to keep guiding piece to get final product its structure of switching.In addition, in order to improve substrate transferring speed, also can make the first and second horizontal transport mechanisms 6,7 all finish the such action of conveyance of the substrate W and the untreatment base W of processing.In the case, first and second guiding pieces 135,136 are switched use between substrate W that finishes processing and untreatment base W, thereby can suppress or prevent that foreign matter from transferring on the substrate W that finishes processing.
In addition, in described first execution mode, in order to carry out substrate delivery/reception between the second horizontal transport mechanism 6 and the main transport mechanism 3, be provided with first and second robots of intermediary 175,176, but also can omit it and directly handing-over between the second horizontal transport mechanism 6 and main transport mechanism 3.In addition, substrate orientation arrange agencie is as optional setting, and from shortening the viewpoint in the stand-by time of the second substrate transfer position P2 of the second horizontal transport mechanism 6, and first and second robots of intermediary 175,176 preferably are set.
And then, also can exchange the first and second substrate transfer position P1, P2 in described first execution mode, and second substrate transfer position that will be used for untreatment base W is disposed at the side near processing substrate portion 2.
In addition, in said embodiment, move into and take out of mechanism 4 and make supporting guiding piece 80 only mobile half pitch for batch combination.But, after substrate W is sent to mobile placement mechanism 5, carry out the moving of half pitch of the supporting leading axle 91 of mobile placement mechanism 5, thereafter,, then can criticize combination if make substrate W be handed off to the second horizontal transport mechanism 7 from this supporting leading axle 91.Under batch situation about removing, also can similarly carry out, also there is no need necessarily move half pitch mobile of supporting guiding piece 80.
And then, in said embodiment, Container as ccontaining substrate W, use ccontaining wafer transport case (FOUP:Front Opening Unified Pod) under the state of airtight substrate W, but Container is not limited to the wafer transport case, also can use SMIF (Standard Mechanical Inter Face: the machinery standard interface) box, OC (Open Cassette: open cassette) etc.
In addition, in said embodiment, showing an example of the circular substrate of semiconductor crystal wafer as substrate W, can certainly be the process object of other kind substrates such as square substrate of using of liquid crystal panel.
Though embodiment of the present invention is had been described in detail, understand that as being used for the object lesson of understanding the technology of the present invention content is not a limitation of the invention, the spirit and scope of the present invention are according to claims.
The application is willing to 2007-60779 number and 2007-60780 number corresponding to the spy who proposed in the Japan special permission Room on March 9th, 2007, and is willing to 2007-321142 number the spy that the Japan special permission Room proposes on December 12nd, 2007, and it all openly is incorporated in this.
Claims (24)
1. substrate board treatment comprises:
The Container maintaining part, it keeps ccontaining Container with horizontal attitude many stacked substrates on above-below direction,
Processing substrate portion, it is handled implementing in the lump with many stacked in the horizontal direction substrates of perpendicular attitude,
Main transport mechanism, its between given substrate transfer position and described processing substrate portion, to carrying out conveyance in the lump with many stacked in the horizontal direction substrates of perpendicular attitude,
Move into and take out of mechanism, its Container that many substrates are kept with respect to described Container maintaining part is moved in the lump and is taken out of, and makes these many substrates carry out posture changing in the lump between horizontal attitude and perpendicular attitude,
Secondary transport mechanism, its on given mobile placement location and described move into to take out of join many substrates of perpendicular attitude between the mechanism in the lump, many substrates of perpendicular attitude joining on the described substrate transfer position and between the described main transport mechanism in the lump, many substrates of conveyance perpendicular attitude in the lump between described mobile placement location and described substrate transfer position;
Described moving into taken out of mechanism and contained:
A plurality of maintenance operators, it keeps many substrates in the lump,
The operator driving and reversing mechanism, it makes these a plurality of maintenance operators with respect to the Container that keeps on described Container maintaining part, along the given advance and retreat direction advance and retreat that are on the horizontal direction,
The operator rotating mechanism, it makes described a plurality of maintenance operator revolve at least along the vertical face on the described advance and retreat direction of being in and turn 90 degrees.
2. according to the substrate board treatment of claim 1 record, it is characterized in that,
Described a plurality of maintenance operator, have a plurality of operator elements that keep a substrate respectively, each operator element has the first substrate maintaining part in side's side of operator element arrangements direction, has the second substrate maintaining part in the opposing party's side of operator element arrangements direction
Described moving into taken out of mechanism and also comprised and make described a plurality of maintenance operator around the rotation of given rotating shaft and make the operator rotating mechanism of described operator element table back of the body upset.
3. according to the substrate board treatment of claim 1 record, it is characterized in that,
Described moving into taken out of mechanism and also comprised from the supporting guiding piece of many substrates of below supports vertical attitude.
4. according to the substrate board treatment of claim 3 record, it is characterized in that,
Described supporting guiding piece has a pair of substrate with respect to each operator element and keeps groove,
Described moving into taken out of mechanism and also comprised by driving described supporting guiding piece and select described a pair of substrate to keep any one party in the groove to keep the guiding piece driving mechanism of substrate.
5. according to the substrate board treatment of claim 1 record, it is characterized in that,
Described secondary transport mechanism comprises:
Mobile placement mechanism, it has the mobile placement support that many substrates that are in the stacked in the horizontal direction state of perpendicular attitude are kept in the lump, and this is moved place support and move up and down, by this move up and down and described many substrates of taking out of between the mechanism of moving into perpendicular attitude on described mobile placement location, join in the lump;
Horizontal transport mechanism, it has the horizontal conveyance maintaining part that many substrates of perpendicular attitude are arranged in the horizontal direction and kept, on described mobile placement location, between described mobile placement support and described horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, on described substrate transfer position, between described main transport mechanism and described horizontal conveyance maintaining part, join many substrates of perpendicular attitude in the lump, described horizontal conveyance maintaining part is moved horizontally.
6. according to the substrate board treatment of claim 5 record, it is characterized in that,
Described mobile placement mechanism is disposed at the described opposition side of taking out of mechanism of moving on the advance and retreat direction of described a plurality of maintenance operators.
7. according to the substrate board treatment of claim 5 record, it is characterized in that,
Described mobile placement mechanism also comprises the support horizontal mobile mechanism that described mobile placement support is moved in given distance range along the stacked horizontal direction of the substrate of perpendicular attitude.
8. according to the substrate board treatment of claim 5 record, it is characterized in that,
Described mobile placement support contains from a pair of supporting leading axle of both sides maintenance with many stacked in the horizontal direction substrates of perpendicular attitude,
Described supporting leading axle diverse location in a circumferential direction has: with the abutting part of substrate butt; In order to make substrate by between the described a pair of supporting leading axle and between this a pair of supporting leading axle, guarantee the portion of keeping out of the way at given interval,
Described mobile placement mechanism also comprises the guiding piece rotating mechanism that described a pair of supporting leading axle is rotated around each direction of principal axis.
9. the substrate board treatment of putting down in writing according to Claim 8 is characterized in that,
Described abutting part comprises first abutting part and second abutting part on the diverse location on the circumferencial direction that is configured in described supporting leading axle.
10. according to the substrate board treatment of claim 5 record, it is characterized in that,
Described horizontal transport mechanism also comprises the horizontal rotary mechanism that described horizontal conveyance maintaining part is rotated at least around vertical axle in the scope of 90 degree.
11. the substrate board treatment according to claim 10 record is characterized in that,
Described horizontal rotary mechanism makes described horizontal conveyance maintaining part rotate in the scope of 180 degree at least around vertical axle.
12. the substrate board treatment according to claim 5 record is characterized in that,
Described horizontal conveyance maintaining part has a plurality of substrates that keep half spacing of spacing to form with the substrate on the described mobile placement support and keeps grooves.
13. the substrate board treatment according to claim 5 record is characterized in that,
Described horizontal conveyance maintaining part comprises: to first guiding piece that supports with many stacked in the horizontal direction substrates of perpendicular attitude; And, to second guiding piece that supports with many stacked in the horizontal direction substrates of perpendicular attitude,
Described horizontal transport mechanism also comprises the guiding piece elevating mechanism that makes described first guiding piece carry out relative lifting with respect to described second guiding piece.
14. the substrate board treatment according to claim 1 record is characterized in that,
Described main transport mechanism, the first given substrate transfer position and second substrate transfer position, and described processing substrate portion between many substrates of conveyance in the lump,
Described secondary transport mechanism comprises:
Mobile placement mechanism, it has the mobile placement support that keeps many substrates in the lump, and at described mobile placement location, described mobile placement support and described move into to take out of join many substrates between the mechanism in the lump;
The first substrate travel mechanism, it has the first conveyance maintaining part that is used to keep many substrates, and at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates in the lump, at described first substrate transfer position, between described main transport mechanism and the described first conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described first substrate transfer position, move the described first conveyance maintaining part;
The second substrate travel mechanism, it has the second conveyance maintaining part that is used to keep many substrates, and at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described second substrate transfer position, move the described second conveyance maintaining part.
15. the substrate board treatment according to claim 14 record is characterized in that,
The described first substrate travel mechanism, the substrate after described first substrate transfer position is accepted from described main transport mechanism to be handled by described processing substrate portion, and give described mobile placement mechanism with this substrate at described mobile placement location,
The described second substrate travel mechanism, the substrate before described mobile placement location is accepted from described mobile placement mechanism to be handled by described processing substrate portion, and give described main transport mechanism with this substrate at described second substrate transfer position.
16. the substrate board treatment according to claim 15 record is characterized in that,
Described main transport mechanism contains the substrate chuck that keeps many substrates in the lump,
Described substrate board treatment also comprises:
The chuck cleaning unit, it is used for the substrate chuck of described main transport mechanism is cleaned;
The conveyance control unit, its action to described main transport mechanism is controlled, substrate transferring after will implementing to handle by described processing substrate portion is behind described first substrate transfer position, from described second substrate transfer position to described processing substrate portion conveyance substrate, by described chuck cleaning unit described substrate chuck cleaned thereafter.
17. the substrate board treatment according to claim 15 record is characterized in that, also comprises moving placing control unit, this moves places control unit execution following steps:
Control described moving into and take out of mechanism, described mobile placement mechanism and the described first substrate travel mechanism, part in many substrates that will keep on the described first conveyance maintaining part i.e. first substrate in batch is delivered to described mobile placement support, described first substrate in batch moved from this place support and deliver to described moving into and take out of mechanism, thereafter, another part in many substrates that will keep on the described first conveyance maintaining part i.e. second substrate in batch is delivered to described mobile placement support, described second substrate in batch is moved the placement support from this deliver to the described step of taking out of mechanism of moving into;
Control described moving into and take out of mechanism, described mobile placement mechanism and the described second substrate travel mechanism, the 3rd substrate in batch is taken out of mechanism and delivered to described mobile placement support from described moving into, described the 3rd substrate in batch is delivered to the described second conveyance maintaining part from described mobile placement support, thereafter, the tetrabasal group is taken out of mechanism and delivered to described mobile placement support from described moving into, and then this tetrabasal group delivered to the described second conveyance maintaining part from described mobile placement support, and on this second conveyance maintaining part, keep the step of the 3rd substrate in batch and tetrabasal group.
18. the substrate board treatment according to claim 14 record is characterized in that,
Also be included in the intermediary that on described second substrate transfer position substrate delivery/reception between described second conveyance maintaining part and the described main transport mechanism is carried out intermediary.
19. the substrate board treatment according to claim 14 record is characterized in that,
The mobile placement support of described mobile placement mechanism, keep many substrates in the lump with the stacked in the horizontal direction state of perpendicular attitude, described mobile placement mechanism is at described mobile placement location, described mobile placement support and described move into to take out of join many substrates of perpendicular attitude between the mechanism in the lump
The described first conveyance maintaining part is used to make many substrates of perpendicular attitude to arrange in the horizontal direction and it is kept, the first substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described first substrate transfer position, between described main transport mechanism and the described first conveyance maintaining part, join many substrates of perpendicular attitude in the lump
The described second conveyance maintaining part is used to make many substrates of perpendicular attitude to arrange in the horizontal direction and it is kept, the second substrate travel mechanism, at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates of perpendicular attitude in the lump.
20. a substrate board treatment comprises:
The Container maintaining part, its Container to ccontaining many substrates keeps,
Processing substrate portion, it implements to handle to many substrates in the lump,
Main transport mechanism, its first given substrate transfer position and second substrate transfer position, and described processing substrate portion between, many substrates are carried out conveyance in the lump,
Move into and take out of mechanism, its Container that many substrates are kept with respect to described Container maintaining part is moved in the lump and is taken out of,
Mobile placement mechanism, it has the mobile placement support that keeps many substrates in the lump, and at given mobile placement location, described mobile placement support and described move into to take out of join many substrates between the mechanism in the lump,
The first substrate travel mechanism, it has the first conveyance maintaining part that is used to keep many substrates, at described mobile placement location, between described mobile placement support and the described first conveyance maintaining part, join many substrates in the lump, at described first substrate transfer position, join many substrates between described main transport mechanism and the described first conveyance maintaining part in the lump, between described mobile placement location and described first substrate transfer position, move the described first conveyance maintaining part
The second substrate travel mechanism, it has the second conveyance maintaining part that is used to keep many substrates, at described mobile placement location, between described mobile placement support and the described second conveyance maintaining part, join many substrates in the lump, at described second substrate transfer position, between described main transport mechanism and the described second conveyance maintaining part, join many substrates in the lump, between described mobile placement location and described second substrate transfer position, move the described second conveyance maintaining part;
Described moving into taken out of mechanism and contained:
A plurality of maintenance operators, it keeps many substrates in the lump,
The operator driving and reversing mechanism, it makes these a plurality of maintenance operators with respect to the Container that keeps on described Container maintaining part, along the given advance and retreat direction advance and retreat that are on the horizontal direction,
The operator rotating mechanism, it makes described a plurality of maintenance operator revolve at least along the vertical face on the described advance and retreat direction of being in and turn 90 degrees.
21. the substrate board treatment according to claim 20 record is characterized in that,
The described first substrate travel mechanism, the substrate after described first substrate transfer position is accepted from described main transport mechanism to be handled by described processing substrate portion, and give described mobile placement mechanism with this substrate at described mobile placement location,
The described second substrate travel mechanism, the substrate before described mobile placement location is accepted from described mobile placement mechanism to be handled by described processing substrate portion, and give described main transport mechanism with this substrate at described second substrate transfer position.
22. the substrate board treatment according to claim 21 record is characterized in that,
Described main transport mechanism contains the substrate chuck that keeps many substrates in the lump,
Described substrate board treatment also comprises:
The chuck cleaning unit, it is used for the substrate chuck of described main transport mechanism is cleaned;
The conveyance control unit, its action to described main transport mechanism is controlled, substrate transferring after will implementing to handle by described processing substrate portion is behind described first substrate transfer position, from described second substrate transfer position to described processing substrate portion conveyance substrate, by described chuck cleaning unit described substrate chuck cleaned thereafter.
23. the substrate board treatment according to claim 21 record is characterized in that, also comprises moving placing control unit, this moves places control unit execution following steps:
Control described moving into and take out of mechanism, described mobile placement mechanism and the described first substrate travel mechanism, part in many substrates that will keep on the described first conveyance maintaining part i.e. first substrate in batch is delivered to described mobile placement support, described first substrate in batch moved from this place support and deliver to described moving into and take out of mechanism, thereafter, another part in many substrates that will keep on the described first conveyance maintaining part i.e. second substrate in batch is delivered to described mobile placement support, described second substrate in batch is moved the placement support from this deliver to the described step of taking out of mechanism of moving into;
Control described moving into and take out of mechanism, described mobile placement mechanism and the described second substrate travel mechanism, the 3rd substrate in batch is taken out of mechanism and delivered to described mobile placement support from described moving into, described the 3rd substrate in batch is delivered to the described second conveyance maintaining part from described mobile placement support, thereafter, the tetrabasal group is taken out of mechanism and delivered to described mobile placement support from described moving into, and then this tetrabasal group delivered to the described second conveyance maintaining part from described mobile placement support, and on this second conveyance maintaining part, keep the step of the 3rd substrate in batch and tetrabasal group.
24. the substrate board treatment according to claim 20 record is characterized in that,
Also be included in the intermediary that on described second substrate transfer position substrate delivery/reception between described second conveyance maintaining part and the described main transport mechanism is carried out intermediary.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-060779 | 2007-03-09 | ||
| JP2007060780 | 2007-03-09 | ||
| JP2007-060780 | 2007-03-09 | ||
| JP2007060779 | 2007-03-09 | ||
| JP2007060779 | 2007-03-09 | ||
| JP2007060780 | 2007-03-09 | ||
| JP2007-321142 | 2007-12-12 | ||
| JP2007321142 | 2007-12-12 | ||
| JP2007321142A JP4824664B2 (en) | 2007-03-09 | 2007-12-12 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101261935A CN101261935A (en) | 2008-09-10 |
| CN101261935B true CN101261935B (en) | 2010-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810085228XA Active CN101261935B (en) | 2007-03-09 | 2008-03-10 | Substrate treatment apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP4824664B2 (en) |
| KR (1) | KR100989279B1 (en) |
| CN (1) | CN101261935B (en) |
| TW (1) | TWI378894B (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5290890B2 (en) * | 2008-09-12 | 2013-09-18 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR101181560B1 (en) | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate processing apparatus and substrate conveying apparatus for use in the same |
| JP5218000B2 (en) * | 2008-12-12 | 2013-06-19 | 株式会社Ｉｈｉ | Substrate storage and supply system |
| JP5330031B2 (en) * | 2009-03-05 | 2013-10-30 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| TWI538789B (en) * | 2011-08-10 | 2016-06-21 | Kawasaki Heavy Ind Ltd | A end effector device, and a substrate transport robot including the end effector device |
| JP5875901B2 (en) * | 2012-03-09 | 2016-03-02 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| CN105336651B (en) * | 2014-06-10 | 2018-03-23 | 北大方正集团有限公司 | Chip transposition system |
| ITUA20163368A1 (en) * | 2016-05-12 | 2017-11-12 | Marchesini Group Spa | STABILIZATION DEVICE FOR STABILIZING ITEMS DURING THEIR LIFTING AND GROUPING |
| TW201839890A (en) * | 2017-02-13 | 2018-11-01 | 日商東京威力科創股份有限公司 | Transfer device, transfer method, and storage medium |
| JP6917846B2 (en) * | 2017-09-25 | 2021-08-11 | 株式会社Ｓｃｒｅｅｎホールディングス | Board reversing device, board processing device and board holding device |
| CN109226010A (en) * | 2018-09-28 | 2019-01-18 | 昆山市和博电子科技有限公司 | A kind of substrate cleaning machine and basal plate cleaning system |
| CN109127587B (en) * | 2018-10-22 | 2021-03-19 | 安徽深泽电子股份有限公司 | PCB cleaning tool |
| JP7170748B2 (en) * | 2018-12-19 | 2022-11-14 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| KR20200102612A (en) * | 2019-02-21 | 2020-09-01 | 세메스 주식회사 | Substrate treating apparatus and substrate treating method |
| CN110176390B (en) * | 2019-05-31 | 2022-02-18 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Batch wafer fixing and driving device in cassette-free cleaning equipment and using method |
| JP7156547B2 (en) * | 2019-09-02 | 2022-10-19 | 村田機械株式会社 | Wafer delivery device, wafer storage container, and wafer storage system |
| CN111769064B (en) * | 2020-06-18 | 2023-07-14 | 无锡先导智能装备股份有限公司 | Loading and unloading device |
| CN112757079B (en) * | 2020-12-31 | 2022-05-17 | 泉州市海恩德机电科技发展有限公司 | Intelligent stone material equipment of polishing |
| JP2024046369A (en) * | 2022-09-22 | 2024-04-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| CN115893002B (en) * | 2022-11-15 | 2023-07-28 | 浙江矽盛电子有限公司 | Inspection device for photovoltaic monocrystalline silicon piece after production molding |
| CN117819154A (en) * | 2024-03-04 | 2024-04-05 | 成都环龙智能机器人有限公司 | Automatic handling device of robot |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2824951B2 (en) * | 1992-09-25 | 1998-11-18 | 大日本スクリーン製造株式会社 | Substrate delivery device in substrate processing equipment |
| JP3521330B2 (en) * | 1997-01-21 | 2004-04-19 | 東京エレクトロン株式会社 | Substrate transfer processing equipment |
| JP3974985B2 (en) | 1997-12-02 | 2007-09-12 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| JP3577204B2 (en) * | 1997-12-02 | 2004-10-13 | 大日本スクリーン製造株式会社 | Substrate attitude converter |
| JP3413567B2 (en) * | 1998-02-18 | 2003-06-03 | 東京エレクトロン株式会社 | Substrate transfer processing apparatus and substrate transfer processing method |
| JP3938436B2 (en) | 1998-06-05 | 2007-06-27 | 大日本スクリーン製造株式会社 | Substrate transfer apparatus and substrate processing apparatus using the same |
| JP3905658B2 (en) * | 1999-02-08 | 2007-04-18 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| JP4069236B2 (en) * | 2000-06-05 | 2008-04-02 | 東京エレクトロン株式会社 | Liquid processing equipment |
| JP2002076094A (en) * | 2000-08-31 | 2002-03-15 | Daikin Ind Ltd | Board carrying apparatus |
| JP3979804B2 (en) * | 2001-08-17 | 2007-09-19 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR100459335B1 (en) * | 2002-04-08 | 2004-12-03 | 한국디엔에스 주식회사 | Method and system for wafer array |
| KR100466296B1 (en) * | 2002-07-18 | 2005-01-13 | 한국디엔에스 주식회사 | Transfer robot and wafer array system using this robot |
| JP4401285B2 (en) * | 2004-12-24 | 2010-01-20 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP4688637B2 (en) * | 2005-10-28 | 2011-05-25 | 東京エレクトロン株式会社 | Substrate processing apparatus, batch knitting apparatus, batch knitting method, and batch knitting program |
-
2007
- 2007-12-12 JP JP2007321142A patent/JP4824664B2/en active Active
-
2008
- 2008-02-29 KR KR1020080018770A patent/KR100989279B1/en active IP Right Grant
- 2008-03-07 TW TW097108014A patent/TWI378894B/en active
- 2008-03-10 CN CN200810085228XA patent/CN101261935B/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101261935A (en) | 2008-09-10 |
| JP2008258570A (en) | 2008-10-23 |
| TWI378894B (en) | 2012-12-11 |
| KR100989279B1 (en) | 2010-10-20 |
| KR20080082905A (en) | 2008-09-12 |
| JP5054218B2 (en) | 2012-10-24 |
| TW200902415A (en) | 2009-01-16 |
| JP2011238945A (en) | 2011-11-24 |
| JP4824664B2 (en) | 2011-11-30 |
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