KR100257281B1 - Substrate transfer apparatus, substrate processing apparatus using the same, and substrate holding apparatus for use in the apparatuses - Google Patents

Abstract

A low cost substrate transfer apparatus, a substrate processing apparatus using the same, and a substrate fitting mechanism that can be used therewith, without contaminating a substrate and with a simple configuration. When the unprocessed substrate row LW is transferred from the carrier carrier TC to the processing carrier PC, the pusher 14 supports the substrate row LW by the guide 141 while the guide 142 is lowered. In addition, the substrate row LW pushed up by the pusher 14 in that state is fitted by the inner chuck 15. On the contrary, when transferring the substrate row LW processed by the carrier carrier from the processing carrier PC, the pusher 14 supports the substrate row LW by the guide 142 while the guide 142 is raised. do. In addition, the substrate row LW pushed up by the pusher 14 in that state is fitted by the outer chuck 16.

Description

Substrate transfer apparatus, substrate processing apparatus using the same, and substrate fitting apparatus usable therein

1 is a diagram showing a configuration of a substrate processing apparatus of a first embodiment of the present invention.

2 is a perspective view of the substrate transfer portion in the first embodiment.

3 is a front cross-sectional view of the substrate transfer part.

4 is a view showing a support form of a substrate row of a first guide and a second guide of a pusher.

5 is a projection view in three directions of the inner chuck.

6 is a projection view in three directions of the outer chuck.

7 is a view showing a drive mechanism of an inner chuck and an outer chuck.

8 is a view showing the fitted state of the substrate rows of the inner chuck and the outer chuck.

9 is a view showing a processing procedure of the substrate transfer device.

10 is a view showing a processing procedure of the substrate transfer device.

FIG. 11 is a view showing a fitted state of a substrate row of substrate fitting portions in the second embodiment; FIG.

12 is a perspective view of a substrate transfer part in a modification.

13 is a view showing a drive mechanism of an upper chuck and a lower chuck in a modification.

14 is a diagram showing a process of the conventional apparatus.

* Explanation of symbols for main parts of the drawings

1 substrate processing apparatus 10 substrate transfer unit

12: 1st conveyance part 14: pusher

15: inner chuck 16: outer chuck

17: 2nd conveyance part 60: treatment tank

141, 142, 153, 163: guide 151, 161: rotary motion shaft

152,162: rotating arm CW: substrate fitting

LW: Substrate Row PC: Processing Carrier

TC: Carrier Carrier R1 ~ R4: 1st Carrier Robot ~ 4th Carrier Robot

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device for transferring a substrate string composed of a plurality of aligned substrates (liquid crystal glass substrates, semiconductor wafers, etc.) between carriers, a substrate processing apparatus using the same, and a substrate fitting mechanism usable therefor. will be.

2. Description of the Related Art [0002] Conventionally, a technique for performing a substrate transfer process for transferring substrate rows in two rows in parallel between a carrier carrier for storing the substrate rows and a processing carrier for storing the substrate rows during substrate processing (hereinafter, [2 carrier processing]). Japanese Patent Laid-Open Publication No. 94-95548. In this technique, the unprocessed substrate row pushed up on the carrier carrier is transferred to the processing carrier by chucking, or conversely, the processed substrate row pushed up from the processing carrier is put on the same chuck and returned to the carrier carrier. Therefore, when the treated substrate is inserted into the chuck, contaminants such as particles that have been attached to the chuck before the untreated substrate are attached to the treated substrate and contaminate the treated substrate.

Therefore, there is a substrate transfer device as shown in Fig. 14 to solve the problem.

The apparatus transfers the unprocessed substrate row NW stored in the carrier carrier 901 to the processing carrier 902 or, conversely, transfers the processed substrate row PW stored in the processing carrier 902 to the carrier carrier 901. It is an apparatus for transferring, and substrate transfer is performed as follows.

First, before the substrate transfer process, the carrier carrier 901 and the process carrier 902 are located at the first stop position P91 and the fourth stop position P94, respectively. When the unprocessed substrate row NW stored in the carrier carrier 901 is transferred to the process carrier 902, the carrier carrier 901 is stored in the state in which the unprocessed substrate row NW is stored as shown by arrow A91 of FIG. 14A. ) Moves to the second stop position P92 above the preprocess pusher 907 by the movement of the carrier carrier conveyance unit 903, and the unprocessed substrate accommodated by the rise of the preprocess pusher 907. Heat NW is pushed up. Then, the pushed-up raw column NW is sandwiched by a preprocess clamper 905. Thereafter, after the carrier carrier 901 moves to the first stop position P91 in accordance with the movement of the carrier carrier conveyance unit 903, the empty process carrier 902 moves in accordance with the movement of the process carrier conveyance unit 904. It moves to the 2nd stop position P92 like (A92). Then, as the preprocess pusher 907 is raised to open the preprocess clamper 905, the unprocessed substrate row NW is held down on the preprocess pusher 907 and lowered to be stored in the process carrier 902. And the 4th stop position 902 of the process carrier 902 returns by the movement of the process carrier conveyance part 904 again.

On the contrary, when transferring the processed substrate row PW stored in the processing carrier 902 to the carrier carrier 901, the processed carrier row is stored in the state in which the processed substrate row PW is stored as shown by arrow A93 in Fig. 14B. 902 moves to the third stop position P93 above the post-process pusher 908 by the movement of the process carrier conveyance unit 904, and then is received by the rise of the post-process pusher 908. The processed substrate row PW is pushed up. The pushed-up processed substrate row PW is then sandwiched by the post process clamper 906. Thereafter, after the process carrier 902 is moved to the fourth stop position P94 in accordance with the movement of the process carrier conveyance unit 904, the empty conveyance carrier 901 is moved in accordance with the movement of the conveyance carrier conveyance unit 903. It moves to the 3rd stop position P93 like arrow A94. Subsequently, the substrate row PW processed by the post process pusher 908 is raised to open the post process clamper 906 is lowered while being kept on the post process pusher 908 and stored in the carrier carrier 901. . And the carrier carrier 901 returns to the 1st stop position P91 by the movement of the carrier carrier conveyance part 903 again.

By transferring the substrate in this manner, the contact portions of the unprocessed substrate rows NW and the treated substrate rows PW are different so that the contaminants attached to the unprocessed substrates do not adhere to the processed substrate. Substrate contamination is prevented. However, in the conventional apparatus of FIG. 14, since the four stop positions of the 1st stop position P91-the 4th stop position 94 are provided, the whole apparatus is enlarged.

In addition, the conveyance carrier conveyance part 903 must convey between three stop positions of the 1st stop position P91, the 2nd stop position P92, and the 3rd stop position P93, and also the process carrier Since the conveyance part 904 must convey between three stop positions of the 2nd stop position P92, the 3rd stop position P93, and the 4th stop position P94, an air cylinder etc. are used as a drive mechanism. Simple drive mechanism was not available.

In addition, two sets of pre-process clampers 905, pre-process pushers 907 and post-process clampers 906, and post-process pushers 908 as pushers and clampers cannot be installed, resulting in a large number of parts. It was supposed to cost.

The present invention is intended to overcome the above-mentioned problems in the prior art, and does not contaminate a substrate, and provides a low cost substrate transfer apparatus, an engine processing apparatus using the same, and a substrate fitting mechanism usable therewith. It aims to do it.

In order to achieve the above object, the apparatus of claim 1 of the present invention is a substrate transfer apparatus for transferring a substrate string consisting of a plurality of aligned substrates between a first carrier and a second carrier, wherein A substrate holding means having a first holding mechanism and a second holding mechanism for selectively holding, and a first guide and a second guide positioned under the substrate holding means and selectively supporting the substrate row. And substrate transfer means for moving each of the first carrier and the second carrier between a plurality of stop positions including a stop position below the substrate holding means.

Further, the apparatus of claim 2 of the present invention is the substrate transfer apparatus of claim 1, wherein the substrate transfer means includes a first substrate transfer mechanism for horizontally moving the first carrier, and a second substrate for horizontal movement of the second carrier. And a conveying mechanism.

Further, the apparatus of claim 3 of the present invention is the substrate transfer apparatus of claim 1, wherein the substrate transfer means holds each of the first carrier and the second carrier on one member and simultaneously moves them horizontally. .

In addition, the apparatus of claim 4 of the present invention includes a substrate transfer part including a plurality of substrate transfer devices of any one of claims 1 to 3, a substrate transfer part for processing the substrate string, the substrate transfer part, It is a substrate processing apparatus characterized by including the board | substrate conveyance part which conveys the said board | substrate heat between the said board | substrate process parts.

Moreover, the apparatus of Claim 5 of the present invention is a substrate tilting mechanism for sandwiching a row of substrates comprising a plurality of aligned substrates, wherein the pair of guide mechanisms for sandwiching the row of substrates are arranged so that the inner chuck and the outer chuck are arranged side by side. The inner chuck is provided between the pair of guide mechanisms of the outer chuck so as to be superimposed therein.

In addition, the apparatus of claim 6 of the present invention is the substrate fitting mechanism of claim 5, wherein each of the pair of guide mechanisms has an 'L' shaped rotary motion arm having a rotary motion axis at one end thereof, and the rotary motion arm. It is provided with a guide member facing the substrate row provided at the other end of the, and since the guide member side of the outer chuck is formed longer than the guide member of the inner chuck to fit the substrate row at a position higher than the inner chuck It features.

Furthermore, the apparatus of claim 7 of the present invention is a substrate fitting mechanism for sandwiching a row of substrates composed of a plurality of aligned substrates, wherein the pair of guide mechanisms for sandwiching the row of substrates are arranged so that the upper and lower chucks are disposed in parallel with each other. And the upper chuck is installed above the lower chuck.

[One. Substrate Processing Apparatus of First Embodiment]

FIG. 1: is a figure which shows the planar structure of the substrate processing apparatus 1 of 1st Embodiment of this invention, and has shown each part of the substrate processing apparatus 1 typically. Hereinafter, the apparatus arrangement | positioning of this substrate processing apparatus 1 is demonstrated using FIG. 1 to 3, a three-dimensional coordinate system X-Y-Z having a horizontal plane as an X-Y plane and a vertical direction as a Z direction is defined.

The substrate processing apparatus 1 of this embodiment mainly includes a substrate transfer portion 10, a carrier loading / unloading portion 20, a carrier stocker 30, a shuttle 40, a carrier buffer 50, 70 ), A processing tank 60 corresponding to the substrate processing unit, first to fourth transport robots R1 to R4 corresponding to the substrate transport unit, and a control unit (not shown). Hereinafter, the schematic structure and operation | movement of these each part are demonstrated.

The substrate transfer section 10 has a configuration in which the substrate transfer device, which will be described later, is arranged side by side on both sides of the Y axis and on the negative side, so that the substrate transfer process of the unprocessed substrate row LW from the carrier carrier TC to the processing carrier PC is performed. Subsequently, a substrate transfer process of the processed substrate row LW from the processing carrier PC to the transfer carrier TC is performed.

In the carrier loading / unloading unit 20, the carrier carrier TC is carried in or taken out by an operator.

The carrier stocker 30 is a receiving portion for temporarily holding the transfer carrier TC and the processing carrier PC in each step of the substrate transfer process.

The first transport robot R1 is provided with two open and close arms that sandwich the transport carrier TC and the processing carrier PC, which are movable in the positive direction of the X-axis and the Y-axis, and arranged in the Y-axis direction. Are inserted at the same time to transfer between the substrate transfer portion 10, the carrier loading / unloading portion 20, and the carrier stocker 30.

Similar to the first transport robot R1, the second transport robot R2 has two openable arms that fit the processing carrier PC. The second transport robot R2 can move in the positive direction along the X axis as shown by the arrow A1. As shown in (A2), the Z-axis direction is rotatable at an angle of 90 °, and two carriers are simultaneously sandwiched by the arm and transferred from the substrate transfer portion 10 to the shuttle 40.

The shuttle 40 holds the processing carrier PC and moves the conveyance path TR1 as shown by arrow A3.

The third transport robot R3 has an arm for holding the processing carrier PC from above, and can move in the positive direction along the Y axis as shown by arrow A4, and as shown by arrow A5. It is possible to rotate at an angle of 90 degrees with respect to the Z axis direction at the center, and simultaneously hold two processing carriers PC by the arm and convey them from the shuttle 40 to the carrier buffer 50.

The carrier buffers 50 and 70 have the same structure, and are provided with the carrier conveyance mechanism not shown below. Then, the raised processing carrier PC is sequentially moved in the negative direction of the X axis.

Similar to the first transport robot R1, the fourth transport robot R4 has an arm that fits the processing carrier PC, and is movable in the positive direction of the X axis as shown by arrow A6. PC) is inserted at the same time and conveyed from the carrier buffer 50 to the processing tank 60.

The processing tank 60 is a processing tank of a size that can accommodate two processing carriers PC in parallel in the Y-axis direction, and the processing liquid is stored therein.

Each part of the above structure performs the following processes by control of the control part which is not shown in figure.

First, the carrier carrier TC, in which the unprocessed substrate row LW is stored, is loaded into the carrier carrying-in / out part 20 by the operator, and then the first carrier robot R1 receives the carrier carrier TC to carry the carrier. It conveys to the predetermined position of the stocker 30.

Next, the first transfer robot R1 receives the transfer carrier TC held at another predetermined position of the carrier stocker 30, and the first transfer portion 12 of the substrate transfer portion 30 (described later). Set). In addition, the first transfer robot R1 transfers the empty processing carrier PC held at another predetermined position of the carrier stocker 30 to the second transfer unit 17 (described later) of the substrate transfer unit 10. Set. Subsequently, the substrate transfer section 10 transfers the unprocessed substrate row LW in the carrier carrier TC set in the first transfer section 12 to the processing carrier PC in the order described later.

Then, the carrier carrier TC in which the first carrier robot R1 becomes empty is evacuated to the retracted position of the carrier stocker 30. Moreover, the 2nd conveyance robot R2 conveys the process carrier PC of the 2nd conveyance part 17 of the board | substrate transfer part 10 to the shuttle 40. FIG.

Then, after the shuttle 40 moves the conveyance path TR1 in the positive direction of the X axis and is moved to both ends of the x axis of the conveyance path TR1, the third conveyance robot R3 located there is The process carrier PC on the shuttle 40 is conveyed to the carrier buffer 50.

Next, the fourth transport robot R4 processes the processing carrier PC transferred to the negative end of the X axis of the carrier buffer 50 by the carrier transport mechanism of the carrier buffer 50 through the transport path TR2. After conveying to the tank 60, it is immersed in the process liquid in the process tank 60, and a process is performed to the unprocessed board | substrate row LW accommodated in the process carrier PC.

Next, the 4th transfer robot R4 takes out the process carrier PC which accommodated the processed board | substrate row LW from the process tank 60, and conveys it to the carrier buffer 70. FIG.

Next, the second carrier robot R2 conveys the processing carrier PC moved in the negative direction of the X axis by the carrier transport mechanism in the carrier buffer 70, and the second carrier of the substrate transfer part 10. It sets to (17). In addition, during the above processing, the first transport robot R1 transports the empty transport carrier TC and sets it in the first transport section 12 of the substrate transfer section 10.

Next, the substrate row LW processed by the substrate transfer portion 10 is transferred from the processing carrier PC to the transfer carrier TC.

Thereafter, the carrier carrier TC of the substrate row LW in which the first carrier robot R1 has been processed is stored in the first carrier 12 of the substrate transfer part 10. It conveys to a position, and also the 1st conveyance robot R1 conveys the conveyance carrier TC of the processed substrate row LW to the carrier carrying-in / out part 20. FIG.

And an operator carries out the conveyance carrier TC which accommodated the board | substrate row LW processed last.

The above is the structure and the process of the substrate processing apparatus 1 of 1st Embodiment.

[2. Mechanical Configuration in Substrate Transfer Part of First Embodiment]

Next, the substrate transfer part 10 will be described in more detail.

2 is a perspective view of the substrate transfer part 10. 3 is a front sectional view of the substrate transfer part 10. The substrate transfer portion 10 has an inner chuck corresponding to the first conveying portion 12, the first conveying table 121, the pusher 14, the first holding mechanism and the second holding mechanism inside the box 11. The board | substrate transfer apparatus which consists of the 15 and the outer chuck 16, the 2nd conveyance part 17, and the 2nd table drive part 18 is provided in the both sides and the negative side of a Y-axis one by one with the same structure.

(In the above, the 1st conveyance part 12 and the 2nd conveyance part 17 correspond to the 1st board | substrate conveyance mechanism and the 2nd conveyance mechanism, and the combination of both corresponds to the board | substrate conveyance means.)

The following describes only the substrate transfer apparatus on the negative side of the Y axis. 3 is a cross-sectional view of the substrate transfer apparatus on the negative side of the Y-axis of the substrate transfer portion 10.

The box 11 is a box in which both sides and the negative side of the Y axis have a U-shape, and the upper surface is provided with openings 11h and 11h for moving the carrier carrier TC and the processing carrier PC.

In addition, the separating plate 111 is provided in the X-Z surface inside the middle of the opening 11h, 11h, and the pusher 14 is provided in the both surfaces.

In the 1st conveyance part 12, the conveyance table 121 is a flat plate in which the opening 12 through which the guide 141 mentioned later penetrates was provided. And while being supported horizontally by the support member 122 provided in the lower surface, the conveyance carrier TC can be raised and fixed upward. Moreover, the conveyance table 121 is fitted to the rail which is not shown in the edge part of the both sides and the negative side of the Y-axis of the opening 11h of the upper surface of the box 11 in the both sides and the negative side surface of the Y-axis, and X It is free to move in the positive and negative direction of the axis. In addition, a shaft 123 is provided below the support member 122, and is connected to the shaft 131 of the first table drive unit 13.

In the first table driving unit 13, the shaft 131 is connected to the air cylinder 132. Then, the driving force of the air cylinder 132 is transmitted to the first conveying portion 12 via the shaft 131, whereby the conveying table 121 horizontally moves in the X-axis direction as shown by arrow AA. Thereby, the 1st conveyance part 12 conveys conveyance carrier TC between 1st stop position P1 (equivalent to 1st position), and 2nd stop position P2 (equivalent to 2nd position). .

The pusher 14 is provided with a first guide 141 and a second guide 142 at the tip of the shaft 144. In addition, an elastic member having grooves having the same number of grooves as the number of substrates of the substrate row LW is provided on the first guide 141 and the second guide 142, thereby supporting the substrate row LW.

Moreover, the support | pillar 142a provided in the lower end of the 2nd guide 142 is connected to the air cylinder 143 under the 1st guide 141 through the through-hole 141h (refer FIG. 4). And the main body of the air cylinder 143 is provided in the upper end of the shaft 144, and the 2nd guide 142 moves up and down like arrow AF by the expansion and contraction of this air cylinder 143. As shown in FIG.

4 is a diagram illustrating a support state of the substrate row LW in the first guide 141 and the second guide 142 of the pusher 14.

4A illustrates a state in which the substrate is supported by the first guide 141, and the air cylinder 143 is in a reduced state. In this state, since the upper portion of the second guide 142 is located below the upper portion of the first guide 141, the substrate row LW supported by the first guide 141 faces the second guide 142. I am not in contact.

On the contrary, as shown in FIG. 4B, when the substrate row LW is supported by the second guide 142, the air cylinder 143 extends so that the upper part of the second guide 142 is the upper part of the first guide 141. In a higher state, the substrate row supported by the second guide 142 does not face the first guide 141.

The lower end of the shaft 144 having such a first guide 141 and the second guide 142 is provided with a slide portion 146, is fitted to the rail 145 is installed vertically, As shown by the arrow AB, the lifting and lowering is free.

In addition, a ball screw 147 including the motor 148 is vertically installed in the separating plate 111 provided in the center of the box 11 in the Y-axis direction and connected to the slide portion 146.

The first and second guides 141 and 142 are moved up and down by the motor 148 and the ball screw 147, so that the substrate row LW supported by any one of them is the second substrate position. It moves up and down between WP2 and the 3rd board | substrate position WP3 or the 4th board | substrate position WP4 which are retreat positions.

In addition, the substrate transfer device is provided with a substrate fitting portion CW corresponding to the substrate holding means including the inner chuck 15 and the outer chuck 16.

FIG. 5 is a projection view in three directions of the inner chuck 15a corresponding to the guide mechanism, FIG. 5A is a front view, FIG. 5B is a side view, and FIG. 5C is a plan view.

7 is a figure which shows the drive mechanism of the inner side chuck 15 and the outer side chuck 16.

On the other hand, although the drive mechanism of the inner chuck 15 is provided in the concave portion of the box 11 on the Y-axis negative side, and the drive mechanism of the outer chuck 16 is provided in the concave portion of the boxes 11 on both Y-axis sides, In order to understand the positional relationship of each drive mechanism, it shows in the same figure. Hereinafter, the inner chuck 15 will be described with reference to these drawings.

In the inner chuck 15, as shown in FIG. 5, a guide 153 is provided at an end opposite to the end where the rotary motion shaft 151 of the rotary motion arm 152 provided on the rotary motion shaft 151 is provided. It is. In addition, as shown in FIG. 7, the crank mechanism 154 is connected to the rotational operation shaft 151 on both sides of the box 11 in the Y-axis direction and on the negative side, and the center of the crank mechanism 154. The shaft 155 is vertically provided at one end thereof, and an air cylinder 156 is provided at the end of the shaft. In addition, the driving force due to the expansion and contraction of the air cylinder 156 is transmitted to the crank mechanism 154 to rotate the rotation operation shaft 151 so that the rotation operation arm 152 and the guide 153 rotate the rotation operation shaft 151. As shown in the arrow AC of FIG. 3, the row of substrates LW is fitted or released at the third substrate position WP3.

In addition, as shown in FIG. 5, the elastic members 153g and 153g are provided in the guide 153. The elastic members 153g and 153g are provided with the same number of fitting grooves ID as the number of substrates in the substrate row LW. The fitting grooves ID of the elastic members 153g and 153g are formed so that the edges of the respective substrates of the substrate rows LW are fitted.

FIG. 6 is a projection view in three directions of the outer chuck 16 corresponding to the guide mechanism, FIG. 6A is a front view, FIG. 6B is a side view, and FIG. 6C is a plan view.

The outer chuck 16 has a configuration substantially the same as that of the inner chuck 15, and includes a rotation operation shaft 161, a rotation operation arm 162, a guide 163, a crank mechanism 164, a shaft 165, and an air cylinder ( 166). Similarly to the inner chuck 15, the elastic members 163g and 163g are provided in the guide 163, and the same number of fitting grooves ID as the number of substrates in the substrate row LW is provided. The outer chuck 16 is different from the inner chuck 15 in that the rotary arm 162 has a long, L-shaped guide 163 provided at an end opposite to the end where the rotary shaft 161 is provided. ) Is facing each other in a state that protrudes inward.

As shown in FIG. 3, the pair of inner chucks 15 is covered on the outer side of the pair of inner chucks 15, that is, a pair of boxes that can be nested in order of size. The outer chuck 16 is provided in the box 11 in a state in which the outer chuck 16 is opposed. Then, as shown by the arrow AD, the substrate row LW is inserted or released at the fourth substrate position WP4. FIG. 8 is a view showing a state in which the substrate rows LW are sandwiched between the inner chuck 15 and the outer chuck 16.

As shown in the drawing, the guide 163 of the outer chuck 16 is provided in a state where it protrudes inward, and when the inner chuck 15 sandwiches the substrate row LW with the outer chuck 16 closed. The fourth substrate position WP4 is slightly lower than the third substrate position WP3. Moreover, when the guide 163 of the outer chuck 16 protrudes inward, even when the outer chuck 16 is closed and the substrate row LW is inserted, the guide 153 of the inner chuck 15 is the substrate. Do not face the column (LW).

Moreover, the 2nd conveyance part 17 is the same structure as the 1st conveyance part 12, and is the conveyance table 171, the support member 172, and the shaft 173. As shown in FIG.

The second table drive unit 18 also has the same configuration as the first table drive unit 13, has an axis 181, an air cylinder 182, and is symmetrical with respect to the YZ plane with respect to the first table drive unit 13. Is connected to the second conveyance unit 17. Then, by the driving of the second table driving unit 18, the second conveying unit 17 moves the processing cage PC like the arrow AE to the second stopping position P2 and the second stopping position P2. It conveys between 3rd stop positions P3.

Although the above is the structure of the board | substrate transfer apparatus of the negative side of the Y-axis of the board | substrate transfer part 10, the board | substrate transfer apparatus of both sides of a Y-axis is the same structure.

[3. Processing Procedure in Substrate Transfer Part of First Embodiment]

9 and 10 are diagrams showing the processing sequence of the substrate transfer apparatus of the substrate transfer unit 10, and FIG. 9 is the substrate transfer processing sequence of the unprocessed substrate row LW from the carrier carrier to the processing carrier PC. 10 shows a substrate transfer processing procedure of the substrate row LW processed from the processing carrier PC to the transfer carrier TC.

The processing procedure of the substrate transfer processing in this substrate transfer apparatus will be described below with reference to these drawings.

First, the substrate transfer processing procedure of the unprocessed substrate row LW from the carrier carrier TC to the processing carrier PC will be described.

As shown in FIG. 9A as an initial state, the carrier carrier TC is located in the 1st stop position P1, and the process carrier PC is located in the 3rd stop position P3. The unprocessed substrate row LW is stored in the carrier carrier TC and positioned at the first substrate position WP1. Subsequently, as shown in FIG. 9B, the carrier carrier TC moves in the positive direction of the X axis to move to the second stop position P2 in accordance with the movement of the first carrier 12, and the substrate row LW. Is located at the second substrate position WP2.

Next, as shown in FIG. 9C, although the pusher 14 is raised, the positional relationship of the guides 141 and 142 installed in the pusher 14 is in a state where the air cylinder 143 is extended, that is, FIG. 4B. And guide 142 are in a raised state. As the pusher 14 rises in this state, the substrate row LW is pushed up while being supported by the guide 142, whereby the substrate row LW rises and is positioned at the third substrate position WP3. Thereafter, the inner chuck 15 is closed to sandwich the substrate row LW as described above. Then, the pusher 14 descends after that.

Then, as shown in Fig. 9D, after the carrier carrier TC is moved in the negative direction of the X axis in accordance with the movement of the first carrier 12, it stops at the first stop position P1.

Next, as shown in FIG. 9E, the process carrier PC moves in the negative direction of the X axis in accordance with the movement of the second conveyance unit 17 and stops at the second stop position P2.

Then, as shown in FIG. 9F, the pusher 14 rises again. At this time, as shown in FIG. 4B, the guide 142 is in a raised state. Then, after the pusher 14 supports the substrate row LW by the guide 142, the inner chuck 15 releases the substrate row LW, and then the pusher 14 descends to thereby lower the second. The substrate row LW is stored in the processing carrier PC located at the stop position P2 and is located at the second substrate position WP2.

Finally, as shown in FIG. 9G, the processing carrier PC moves in both directions along the X axis in accordance with the movement of the second conveying unit 17 to stop at the third stop position P3, and the substrate row LW is It is located in the fifth substrate position WP5. This completes the substrate transfer process from the carrier carrier TC to the process carrier PC.

Next, the substrate transfer processing procedure of the processed substrate row LW from the processing carrier PC to the transfer carrier TC will be described.

As shown in Fig. 10A as the initial state, the carrier carrier TC is located at the first stop position P1, and the process carrier PC is located at the third stop position P3. The substrate row LW is stored in the processing carrier PC and positioned at the fifth substrate position WP5.

Then, as shown in FIG. 10B, the processing carrier PC moves in the negative direction of the X axis in accordance with the movement of the carrying section 17 of FIG. 2, and is located at the second stop position P2, and the substrate row LW is housed in the processing carrier PC and is located at the fifth substrate position WP5.

Next, as shown in FIG. 10B, the pusher 14 is raised, but the positional relationship of the guides 141 and 142 provided in the pusher 14 is in a state where the air cylinder 143 is reduced, that is, as shown in FIG. 4A. Similarly, the guide 142 is in a down state.

As the pusher 14 rises in this state, the substrate row LW is pushed up while being supported by the guide 141, whereby the substrate row LW rises and is positioned at the fourth substrate position WP4. Thereafter, the outer chuck 16 is closed to sandwich the substrate row LW as described above. Then, the pusher 14 is lowered.

Then, as shown in FIG. 10D, the processing carrier PC is moved in the positive direction of the X axis in accordance with the movement of the second conveying unit 17, and then stops at the third stop position P3.

Then, as shown in FIG. 10E, the carrier carrier TC moves in the positive direction of the X axis in accordance with the movement of the first carrier 12 to stop at the second stop position P2.

Then, as shown in FIG. 10F, the pusher 14 rises again. Also at this time, as shown in FIG. 4A, the guide 142 is in a lowered state. After the pusher 14 supports the substrate row LW by the guide 141, the outer chuck 16 releases the substrate row LW, and after that, the pusher 14 descends to thereby stop the second stop. The board | substrate row LW is accommodated in the conveyance carrier TC located in the position P2, and is located in the 2nd board | substrate position WP2.

Finally, as shown in FIG. 10G, the conveyance carrier TC moves in the negative direction of the X-axis and stops at the first stop position P1 in accordance with the movement of the first conveyance unit 12. This completes the substrate transfer process from the processing carrier PC to the transfer carrier TC.

Although the processing procedure of the substrate transfer apparatus has been described above, the substrate transfer unit 10 includes one substrate transfer apparatus on both sides of the Y axis and a sound axis, and performs the above processes in parallel in each of the substrate transfer apparatuses. .

As described above, in the substrate processing apparatus 1 of the first embodiment, the substrate transfer apparatus includes a first guide 141 and a second guide 142 to which the pusher 14 can be switched, and at the same time, sandwiches the substrate. The portion CW includes a switchable inner chuck 15 and an outer chuck 16 so that, in the case of substrate transfer, the portion facing the substrate row LW is transferred from the carrier carrier to the processing carrier PC. The guide 153 and the guide 142 are used to transfer the substrate row LW, and the guide 163 and the guide 141 are used to transfer the substrate row LW from the processing carrier PC to the transfer carrier TC. Since it is made to be different, the contaminants such as particles adhered to the portion facing the unprocessed substrate row LW do not adhere to the treated substrate row LW and become contaminated.

In addition, since the 1st conveyance part 12, the inner side chuck 15, the outer chuck 16, and the 2nd conveyance part 17 operate only between two positions with respect to the translation or rotation operation, respectively, Simple driving mechanisms such as cylinders can be used to reduce the overall size of the device and to reduce the number of parts, making it possible to make the device inexpensive and to easily adjust the position during manufacturing or maintenance of the device. .

In addition, since the stop position of the carrier becomes small as described above, the transfer distance of the carrier carrier TC and the process carrier PC by the first carrier part 12 and the second carrier part 17 is shortened, so that the yield is improved. do.

In addition, since the conveyance of the conveyance carrier TC is conveyed by the 1st conveyance part 12 and the process carrier PC in the 2nd conveyance part 17, since these carriers can be conveyed separately from each other, Efficient conveyance can be performed without unnecessary carrier movement.

In addition, since the inner chuck 15 is provided inside the outer chuck 16 so as to be nested inside, the entire apparatus can be made small.

Moreover, since only one pusher 14 and one board | substrate fitting part CW are provided, respectively, since maintenance is performed in those places, the maintenance is good.

[4. 2nd Embodiment]

FIG. 11: is a figure which shows the engagement state of the board | substrate row of the board | substrate fitting part CW of the board | substrate transfer part 10 in the substrate processing apparatus 1 of 2nd Embodiment. As shown in the drawing, the Y of the box 11 is disposed such that the pair of flat plate members FP and FP having the rotational motion RA in the Y-axis direction in the longitudinal direction at the center of the substrate fitting portion CW face each other. It is provided between both side surfaces of the shaft and both side surfaces of the negative side. In addition, a motor (not shown) is provided on the rotational operation shaft RA, and the controller 180 is capable of rotating by 180 ° at a predetermined timing under the control of the controller. Further, two sets of fitting grooves ID of the substrate row LW are arranged side by side in the Y-axis direction at positions that are rotationally symmetrical to the front and rear surfaces of the plate-like member FP.

When the unprocessed substrate row LW or the processed substrate row LW are sandwiched by the substrate fitting portion CW having the above-described configuration, the plate-like members FP and FP are rotated by 180 ° to face the surfaces thereof. The fitting groove ID facing the substrate row LW is switched by switching whether the recognition back surface is in the opposite state. Thereby, the particle etc. which adhered to the unprocessed board | substrate row LW do not adhere to the board | substrate row LW processed through the board | substrate fitting part CW.

The other structure is the same as that of the board | substrate transfer part 10 of 1st Embodiment.

In the substrate processing apparatus 1 of this second embodiment, since the substrate fitting portion CW can switch the fitting portion ID by rotating the flat plate member FP, as in the first embodiment, a crank mechanism or the like is used. No complicated drive mechanism is required, and since the constituent members are small, further low cost devices can be obtained.

[5. Modification]

In the above-described first and second embodiments, the lifting and lowering drive of the pusher 14 is not limited to a configuration in which the ball screw 147 is rotated by the motor 148, and may be configured to be driven by an air cylinder or the like. In addition, the translation drive of the 1st conveyance part 12 and the 2nd conveyance part 17 is not limited to the structure by an air cylinder, and may be made by a motor etc., on the contrary.

In addition, in the said 1st and 2nd embodiment, it is not limited to the structure provided with the 1st conveyance part 12 and the 2nd conveyance part 17, Even if one conveyance table which moves to two stop positions may be provided. In the state of approaching the negative side of X axis 3, that is, the carrier carrier TC is set when moving to the first stop position P1 and the second stop position P2, and on the contrary, both sides of the X axis approach, That is, it is good also as a structure etc. which set the process carrier PC when it moves to the 2nd stop position P2 and the 3rd stop position P3, and is located.

In addition, although the air cylinder was used as a drive mechanism of the board | substrate fitting part CW in the said 1st Embodiment, you may make it the structure etc. which provide a rotary actuator directly to the drive shaft of each chuck, and to operate it directly. In the second embodiment, a motor is used, but as in the first embodiment, the motor may be driven by an air cylinder using a crank mechanism.

Further, in the first and second embodiments, the substrate transfer section 10 includes a substrate transfer device, one on each side of the Y-axis and one on the negative side of FIG. 2, for placing the carrier carrier and the processing carrier, respectively. Although it has a conveyance table, you may make common the conveyance table of each board | substrate transfer apparatus as shown in FIG. 12 is a perspective view of the substrate transfer part in the modification. The board | substrate transfer part 10 has the conveyance carrier conveyance table 121a, and the opening 121ah for the 14th conveyance of the conveyance carrier conveyance table 121a is opened. This conveyance carrier conveyance table 121a is driven by the same mechanism as the 1st table drive part 13 of FIG. 3, and can move to the positive direction of the X-axis. Similarly, the substrate transfer part 10 has a process carrier conveyance table 171a, and the process carrier conveyance table 171a has an opening through which the pusher 14 passes. And the said process carrier conveyance table 171a is driven by the same mechanism as the 2nd table drive part 18 of FIG. 3, and can move to the positive direction of an X-axis. Other than that is the same as the board | substrate transfer apparatus in 1st Embodiment of FIG. When the transfer tables of the two substrate transfer apparatuses are shared in this manner, one drive mechanism for driving each transfer table is provided, thereby reducing the manufacturing cost of the apparatus.

In addition, in said 1st Embodiment, although the inner chuck 15 was provided in the inside of the outer chuck 16 inside, the lower chuck 16a was replaced instead of the outer chuck 16 as shown in FIG. Instead of the inner chuck, the upper chuck 15a may be provided in two upper and lower stages, respectively. FIG. 13: is a figure which shows the drive mechanism of the upper side chuck 15a and the lower side chuck 16a. On the other hand, the driving mechanism of the upper chuck 15a is provided in the convex portion of the box 11 on the Y-axis negative side, and the driving mechanism of the lower chuck 16a is provided in the recesses of the box 11 on both sides of the Y-axis, respectively. In order to make the positional relationship of the drive mechanism of the figure clear, it is shown in the same figure. In the upper chuck 15a, as shown in Fig. 13, a guide 153a is provided at the end opposite to the end where the rotary motion shaft 151 of the rotary motion arm 152a provided on the rotary motion shaft 151a is provided. . In addition, as shown in FIG. 6, the crank mechanism 154a is connected to the rotational operation shaft 151a on both sides of the box 11 in the Y-axis direction and on the negative side, and the center of the crank mechanism 154a. The shaft 155a is vertically provided at one end thereof, and an air cylinder 156 is provided at the other end of the shaft 155. Then, the driving force due to the expansion and contraction of the air cylinder 156 is transmitted to the crank mechanism 154a to rotate the rotation operation shaft 151a so that the rotation operation arm 152a and the guide 153a move the rotation operation shaft 151a. It rotates around the center and inserts or opens the substrate row.

In addition, the elastic member is provided in the guide 153a. The elastic member is provided with fitting grooves equal to the number of substrates in the substrate row. The peripheral end portions of the respective substrates of the substrate rows are fitted in the fitting grooves of the elastic members.

The lower chuck 16a has a configuration substantially the same as that of the upper chuck 15a, and includes a rotation operation shaft 161a, a rotation operation arm 162, a guide 163a, a crank mechanism 164a, a shaft 165a, and an air cylinder ( 166). In addition, the guide 163a is provided with an elastic member similarly to the upper chuck 15a, and is provided with the same number of fitting grooves as the number of substrates in the substrate row.

Other than that is the same as that of the board | substrate transfer apparatus of 1st Embodiment. According to this structure, since the upper side chuck 15a and the lower side chuck 16a can be manufactured by the member of substantially the same form, respectively, manufacturing cost can be held down. In addition, since the upper chuck 15a is provided above the lower chuck 16a, the occupied area of the substrate transfer device or the like using this substrate fitting mechanism can be reduced.

As described above, in the substrate transfer apparatus of claim 1 and claim 2 and the substrate processing apparatus of claim 4 using the same, the substrate pushing means includes a substrate having a first guide and a second guide for selectively supporting the substrate row. Since the holding means is configured to include a first holding mechanism and a second holding mechanism for selectively holding the substrate row, when the substrate row is transferred from the first carrier to the second carrier and when the substrate is transferred from the second carrier to the first carrier, Contaminants such as particles attached to the part facing each other on the substrate row in one transfer may be attached to the substrate row when transferring the heat, so that the part facing the substrate may be different when transferring heat. There is no

In addition, since the above two kinds of substrate transfer processing can be performed at the stop position below the substrate holding means, the stop position of the first carrier and the second carrier becomes small, so that the drive mechanism of the substrate transfer means is simple. Since the apparatus can be used, the apparatus can be miniaturized and the number of parts can be reduced, so that the apparatus can be made at a low cost.

In addition, since the stop position becomes small, the movement distance between the first carrier and the second carrier by the substrate transport means is short, so that the yield is improved.

Further, the substrate transfer device of claim 2 has a structure in which the substrate conveying means is provided with respective conveying mechanisms of the first carrier and the second carrier, so that these carriers can be conveyed separately from each other, thereby efficiently conveying without unnecessary carrier movement. Can be done.

In the substrate transfer apparatus of claim 3, since the substrate transfer means holds each of the first carrier and the second carrier on one member and moves them horizontally at the same time, the drive mechanism becomes simpler and the number of parts is smaller. Furthermore, manufacturing cost is low.

Furthermore, in the substrate fitting mechanisms of claims 5 and 6, the inner chuck is arranged between the pair of guide mechanisms of the outer chuck so that the inner chuck is nested therein. Since two sets of chucks do not need to be installed in parallel when the substrate rows are fitted at different timings, the substrate transfer device or the like using this substrate fitting mechanism can be made small.

In the substrate transfer mechanism of claim 7, since the upper chuck is provided above the lower chuck, the occupied area of the substrate transfer device or the like using the substrate fitting mechanism can be reduced.

Claims (7)

A substrate transfer apparatus for transferring a substrate string consisting of a plurality of aligned substrates between a first carrier and a second carrier, comprising: a first holding mechanism and a second holding mechanism for selectively holding the substrate rows at substantially the same position; A substrate holding means comprising: a substrate holding means, a first guide and a second guide positioned under the substrate holding means and selectively supporting the substrate row; and the first carrier and the second guide. And a substrate transfer means for moving each of the carriers between a plurality of stop positions including a stop position below the substrate holding means. The substrate transfer apparatus according to claim 1, wherein the substrate transfer means comprises a first substrate transfer mechanism for horizontally moving the first carrier and a second substrate transfer mechanism for horizontally moving the second carrier. . The substrate transfer apparatus according to claim 1, wherein the substrate transfer means keeps each of the first carrier and the second carrier on one member and simultaneously moves them horizontally. A substrate transfer unit comprising the substrate transfer device according to any one of claims 1 to 3, a substrate processing unit for processing the substrate row, and a substrate transfer unit between the substrate transfer unit and the substrate processing unit. Substrate processing apparatus comprising a substrate transfer unit. A substrate fitting mechanism for sandwiching a row of substrates comprising a plurality of aligned substrates, the pair of guide mechanisms for sandwiching the row of substrates having an inner chuck and an outer chuck arranged in a state facing each other, wherein the pair of said pairs of said outer chucks A substrate fitting mechanism, wherein the inner chuck is provided between the guide mechanisms so as to be superimposed therein. 6. The apparatus of claim 5, wherein each of the pair of guide mechanisms includes a 'L' shaped rotating arm having a rotating shaft at one end thereof and a guide member facing the substrate row provided at the other end of the rotating arm. And the guide member side of the outer chuck is formed longer than the guide member of the inner chuck, so that the outer chuck sandwiches the substrate row at a position higher than the inner chuck. A substrate fitting mechanism for sandwiching a row of substrates comprising a plurality of substrates to be aligned, wherein a pair of guide mechanisms for sandwiching substrate rows have an upper chuck and a lower chuck arranged in a state facing each other, and the upper side of the lower chuck above the upper chuck. A substrate fitting mechanism comprising a chuck.

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