JPH1012705A - Method and device for changing substrate arrangement and substrate treatment device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-size substrate arrangement changing device which is capable of changing substrate arrangement of two carriers so as to oppose substrates by face sides or back sides, without damaging the substrate. SOLUTION: A stand-by substrate row is held by a half-substrate chuck 15 at a fourth substrate position WP4. The residual substrate row is housed in a carrier TC by lowering of a reverse pusher 13, then shifted to a first stop position P1 by a first carrier portion 12, then raised by the reverse pusher 13, and reversed at a second substrate position WP2. After that, the residual substrate row is returned into the carrier TC at the first stop position P1 and shifted to a second stop position P2, and then raised by a lift pusher 14 so that the residual substrates are inserted between the substrates of the stand-by substrate row, respectively. After that, all the substrate arrays are housed in a processing carrier PC located in advance at the second stop position P2, and returned to a third stop position P3 by a second carrier portion 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of reversing the direction of a part of a substrate row composed of a plurality of substrates (a glass substrate for liquid crystal, a semiconductor wafer, etc.), thereby enabling the face surfaces (mirror surfaces) of the substrates to be opposed to each other. The present invention relates to a substrate array conversion method for converting an array into an array in which surfaces are opposed to each other, a substrate array conversion apparatus, and a substrate processing apparatus using the same.

[0002]

2. Description of the Related Art A conventionally used CVD apparatus for forming a thin film on the surface of a plurality of substrates and a substrate processing apparatus for immersing a plurality of substrates in a processing tank storing a processing liquid such as a cleaning liquid to process the substrates. In the state described above, the plurality of substrates are arranged so that the face surfaces on which the element patterns are formed or the back surfaces which are the back sides of the face surfaces are opposed to each other, and are aligned so as to be aligned with each other (hereinafter referred to as “face”). (Referred to as "surface-facing arrangement").

A technique for arranging the substrates in this manner is disclosed in Japanese Patent Laid-Open Publication No. Hei.
The one disclosed in Japanese Patent Application Laid-Open No. 2-9727 is known. Hereinafter, the former will be described as an example. FIG. 8 is a side view of this conventional device. In FIG. 8, the horizontal plane is an XY plane,
A three-dimensional coordinate system XYZ that defines the vertical direction as the Z direction is defined.

In this apparatus, first, a substrate W accommodated in a carrier 920 is pushed up and supported by a push-up plate 962 of a wafer push-up rotating device 960 provided below the carrier 920. Next, every other substrate W is held by the chucks 948 of the chuck device 940, and the chucks 948 are raised in this state. This raises the sandwiched substrate W and removes it from between the non-sandwiched substrates W. Thereafter, the chuck device 94
As the 0 moves on the rail 950 in the Y-axis direction, the chuck 948 also moves in the Y-axis direction, which is the direction in which the substrates W are arranged, and retreats from above the carrier 920.

[0005] Next, the substrate W left on the push-up plate 962 is
The push-up plate 962 is turned 980 degrees so that the back surface is turned in the direction in which the face surface was turned. Then, as the chuck device 940 moves in the direction opposite to the above-described movement direction of the Y axis, the chuck 948 holding the substrate W comes above the carrier 920 and then descends. Further, as the lifting plate 962 is raised, the lifting plate 9
A chuck 94 is provided in a gap between the plurality of substrates W supported on
The substrate W sandwiched by 8 is inserted. Thereafter, the chuck W 948 is opened and the sandwiched substrate W is pushed up by the push-up plate 96.
By supporting the substrate W, the substrates W can be erected and aligned with the face surfaces facing each other or the back surfaces facing each other.

Although the conversion to the face-facing arrangement is not performed, the transfer of the substrate row between the carrier for storing the row of substrates and the processing carrier for storing the row of substrates is performed. A technique of performing loading in two rows in parallel (hereinafter referred to as “two-carrier processing”) is disclosed in Japanese Patent Publication No. 6-95548.

[0007]

By the way, in the conventional apparatus shown in FIG. 8, when the chuck 948 clamps every other substrate W supported on the push-up plate 962, or pushes up the substrate W clamped by the chuck 948. When inserting the plurality of substrates W on the plate 962 into the gap between the substrates W, the chuck 948 is moved in the direction in which the substrates W are arranged, and the chuck 94 is moved to an appropriate position.
8 is positioned. If the positioning accuracy at this time is low, the chuck 948 fails to clamp the substrate W, or the substrate W clamped by the chuck 948 contacts the substrate W supported on the push-up plate 962, and the substrate W is damaged. There is fear.

Further, the substrate W extracted by the chuck 948
Is held in the direction in which the substrates W are arranged in order to retreat from above the substrates W supported on the push-up plate 962, so that a space for the movement must be secured. There has been a problem that it becomes larger.

Further, considering that the transfer to the face-facing arrangement is performed by a two-carrier process, another wafer lifting / rotating device 960 is disposed on the negative side of the X-axis of the wafer lifting / rotating device 960 in FIG. It is also conceivable to perform the transfer to the face-facing arrangement by the two-carrier processing by further providing the chuck in the X-axis direction. In this case, the chuck device 940 is used to hold the substrate. In addition to the positioning of the arm 946 in the Y-axis direction, the positioning of the arm 946 in the X-axis direction is required, and it is considered that the positioning accuracy may be further deteriorated.
However, there is a problem that the size of the substrate transfer apparatus becomes larger and the size of the entire substrate transfer apparatus becomes larger accordingly.

[0010] The present invention is intended to overcome the above-mentioned problems in the prior art, and it is possible to perform a substrate arrangement conversion process in which face surfaces or back surfaces face each other in parallel without damaging the substrate. It is an object of the present invention to provide a method for converting a substrate arrangement that can be performed, a small-sized substrate arrangement conversion device using the same, and a substrate processing apparatus using the same.

[0011]

In order to achieve the above object, a method according to a first aspect of the present invention is directed to a method of forming a substrate by reversing the direction of a part of a substrate included in an array of substrates contained in a carrier. A board arrangement conversion method for converting an arrangement in which face faces or back faces face each other,
A clamping step of clamping a standby substrate, which is a part of the substrate row, by a chuck at the clamping position where the substrate row is located, and a substrate other than the standby substrate in the substrate row as a remaining substrate; A retreating step of retreating the remaining substrate to a retreat position not interfering with the standby substrate, an inversion step of reversing the remaining substrate at the retreat position so that the directions of the face surface and the back surface are switched, and Aligning the substrates together to form a set of substrate rows again.

According to a second aspect of the present invention, in the substrate arrangement conversion method of the first aspect, the retreating step lowers the remaining substrate from a clamping position, stores the remaining substrate in a carrier, and then moves the remaining substrate horizontally with the carrier. After that, the remaining substrate is retracted to the retreat position by being lifted out of the carrier, and the aligning step further includes storing the residual substrate after the reversing step in the carrier. And move it horizontally with
Further, thereafter, the remaining substrate is raised again and returned to the holding position, whereby the remaining substrate and the standby substrate are combined to form a set of substrate rows again.

According to a third aspect of the present invention, there is provided an arrangement in which the face surfaces of the substrates or the back surfaces thereof are opposed to each other by reversing the direction of a part of the substrates included in the substrate row accommodated in the carrier. A carrier transfer device for transferring the carrier between a first position and a second position separated in a substantially horizontal direction;
A substrate push-up unit that pushes up a substrate from the carrier transported from the first position to the second position by the carrier transport unit; and a part of the substrate row at a height pushed up by the substrate push-up unit. A first chuck for holding the substrate, and when the carrier is returned from the second position to the first position by the carrier transport means, the remaining substrate is pushed up from the carrier to be inverted, and Elevating and reversing means for lowering the remaining substrate and storing it in the carrier again, and the carrier is conveyed again from the first position to the second position by the carrier conveying means, and the remaining substrate after the inversion is removed from the carrier. When pushed up by the substrate pushing up means, the remaining substrate after the inversion and the partial substrate Even without clamping the former at said height,
A second chuck that obtains a converted substrate row in which the directions of the face surface and the back surface of the substrate row are switched.

According to a fourth aspect of the present invention, in the substrate arrangement converting apparatus of the third aspect, a third position is defined substantially horizontally from the first position across the second position. And further comprising another carrier transporting means for transporting another carrier between the second position and the third position, wherein the converted substrate row is lowered by the elevating means and accommodated in the another carrier. After that, the converted substrate row is transported to the third position by the separate carrier transport means.

According to a fifth aspect of the present invention, there is provided a substrate transfer unit including a plurality of the substrate arrangement converting apparatuses according to the third or fourth aspect, and a substrate for performing processing on each substrate belonging to the substrate row. A processing unit; and a substrate transport unit that transports the substrates between the substrate transfer unit and the substrate processing unit.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

[0017]

[1. FIG. 1 shows a mechanical configuration and an arrangement of the apparatus according to the embodiment.
FIG. 1 is a diagram illustrating a planar configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention, and schematically illustrates each unit of the substrate processing apparatus 1. Hereinafter, the arrangement of the substrate processing apparatus 1 will be described with reference to FIG. In FIGS. 1 to 3, a three-dimensional coordinate system XYZ in which a horizontal plane is an XY plane and a vertical direction is a Z direction is defined.

The substrate processing apparatus 1 of this embodiment mainly includes a loader-side substrate transfer section 10, a loader-side transfer robot 20,
Loader buffer 30, processing carrier transport robot 4
0, a first processing tank 50, a second processing tank 60, an unloader-side buffer 70, an unloader-side transfer robot 80, and an unloader-side substrate transfer unit 90. Hereinafter, the schematic configuration and operation of each of these units will be described.

The loader-side substrate transfer section 10 has a configuration in which substrate arrangement conversion devices, which will be described in detail later, are arranged on the positive side and the negative side of the Y axis. Then, the transport carrier TC containing the unprocessed substrate rows aligned by the operator is loaded into the loader-side substrate transfer unit 10, and the substrate rows are converted into a face-facing arrangement and processed by the processing carrier PC (another carrier). Is transferred to).

The loader-side transfer robot 20 has two openable and closable arms for holding the processing carrier PC, and is configured to be movable in the X-axis direction as indicated by arrows AA and AB. Then, the processing carrier storing the unprocessed substrate row transferred by the loader-side substrate transfer section 10 is set to Y.
The two pieces arranged in the axial direction are simultaneously pinched and conveyed, and transferred to the next loader-side buffer 30.

The loader-side buffer 30 has a carrier feeding mechanism (not shown) below it. Then, the processing carriers PC transferred by the loader side transfer robot 20 are sequentially moved in the X-axis direction.

The processing carrier transfer robot 40 is configured to be movable as indicated by arrows AC and AD similarly to the loader side transfer robot 20. Then, the loader-side buffer 30
Are transported to the first processing tank 50 at the end on the positive side of the X axis in the Y axis direction.

The first processing tank 50 is a processing tank large enough to house two processing carriers PC in the Y-axis direction.
The first processing liquid is stored inside. Then, the processing carrier PC transferred by the processing carrier transport robot 40 is immersed in the first processing liquid there, and the substrate processing of the internal substrate row is performed.

The second processing tank 60 has the same structure as the first processing tank 50 and has a second processing liquid stored therein.
Then, the processing carrier PC on which the substrate processing with the first processing liquid has been completed is taken out of the first processing tank 50 by the processing carrier transport robot 40, immersed in the second processing liquid stored in the second processing tank 60, and Substrate processing with the second processing liquid is performed on the substrate row.

The unloader buffer 70 has the same configuration as the loader buffer 30. Then, the processing carrier PC loaded from the negative side of the X axis is sequentially moved in the positive direction of the X axis.

The unloader side transfer robot 80 includes the loader side transfer robot 20 and the processing carrier transfer robot 40.
As in the case of, it is configured to be movable like arrows AE and AF. Then, the two processing carriers PC arranged in the Y-axis direction at the end of the unloader-side buffer 70 on the positive side of the X-axis are conveyed while being pinched, and are loaded into the unloader-side substrate transfer unit 90.

The unloader-side substrate transfer section 90 has the same configuration as the loader-side substrate transfer section 10. Then, the row of substrates arranged opposite to the face surface in the processing carrier PC loaded from the negative side of the X axis is rearranged so that the face surfaces are aligned in the same original direction, and is prepared on the positive side of the X axis. In the transport carrier TC. Finally, the transport carrier TC in which the substrate row after the substrate processing is stored is carried out by the operator.

The above is the configuration and operation of the substrate processing apparatus 1 according to this embodiment.

Next, the essential parts will be described in more detail.

FIG. 2 is a perspective view of the loader-side substrate transfer section 10. FIG. 3 is a front sectional view of the loader-side substrate transfer unit 10. Hereinafter, the device arrangement of the loader-side substrate transfer unit 10 will be described with reference to these drawings.

The loader-side substrate transfer section 10 includes a housing 11
A substrate array conversion device including a first transport unit 12, a reversing pusher 13, a lifting / lowering pusher 14, a half-substrate chuck 15, an all-substrate chuck 16, and a second transport unit 17 (corresponding to another carrier transport unit) is mounted on the Y-axis. One unit is provided on each of the positive side and the negative side with the same configuration. Hereinafter, only the substrate arrangement conversion device on the negative side of the Y axis will be described. FIG. 3 is a cross-sectional view of the loader-side substrate transfer unit 10 with respect to the substrate arrangement conversion device on the negative side of the Y axis.

The casing 11 is a casing in which the side surfaces on the positive and negative sides of the Y axis are convex, and the upper surface thereof has openings 11h, 1h for the transfer carrier TC and the processing carrier PC to move.
1h. In addition, the partition plate 111 has the opening 11.
h, 11h, are provided in the XZ plane inside, and on both surfaces thereof, reversing pushers 13, 13 and lifting / lowering pushers 14, 14 are provided.

In the first transport section 12, the transport table 1
Reference numeral 21 is a flat plate provided with an opening (not shown) through which a guide 131 described later can pass. The carrier carrier TC can be placed horizontally and held above by a support member 122 provided on the lower surface, and can be placed and fixed above.

The transfer table 121 has openings 11 on the upper surface of the housing 11 on the positive and negative sides of the Y-axis.
It is fitted to rails (not shown) provided on the positive side and the negative side of the Y axis inside h and 11h, and is movable in the positive and negative directions of the X axis. When the air cylinder 125 expands and contracts, the shaft 124 moves in the positive and negative directions of the X axis, and the driving force is transmitted to the transport table 121 through the shaft 123 and the support member 122, so that the transport table 121 and the transport carrier TC move horizontally. I do. Thereby, the first transport unit 12 moves the transport carrier TC to the first stop position P1 (corresponding to the first position) and the second stop position P2 (second
(Corresponding to the position).

In the reversing pusher 13, the guide 13
In 1, an elastic member provided with 26 grooves, which is the same as the total number of substrates, is provided on the upper surface, and supports the substrate row on the upper surface. A shaft 132 is provided at one end on the lower surface thereof, and supports the guide 131. A rotary actuator 133 is provided at the other end of the shaft 132. The drive drives the guide 131 through the shaft 132 to rotate 180 degrees about the vertical axis.
By the rotation of the guide 131, the substrate row supported on its upper surface is rotated and inverted as indicated by an arrow AG.

The rotary actuator 133 is provided with a slide portion 134. The slide portion 134 is fitted to a vertically provided rail 135, and is movable up and down as indicated by an arrow AH. Also,
Partition plate 111 provided at the center of casing 11 in the Y-axis direction
Is provided with a ball screw 136 vertically. Further, the slide portion 134 is screwed into the ball screw 136 at the connection portion 134c, and is driven up and down by rotating the ball screw 136 about a vertical axis by driving of the motor 137. The sliding portion 134 is driven by this elevation drive.
The rotary actuator 133, the shaft 132, the guide 131, and the substrate row supported by the rotary actuator 133 are moved up and down between the first substrate position WP1 and the second substrate position WP2 corresponding to the retreat position.

The lifting / lowering pusher 14 has substantially the same structure as the reversing pusher 13 except that the guide 141 does not rotate, without a rotation driving mechanism. The guide 141, the shaft 142, the rail 143, the slide portion 144, and the ball screw 145 are provided. , A motor 146. Then, while supporting the substrate row in an aligned state on the guide 141, the substrate row is moved up and down as indicated by the arrow AI to push the substrate row from the third substrate position WP3 in the carrier to the fifth substrate position WP5, or conversely. Or in a carrier.

The half-substrate chuck 15 is shown in FIGS. 4A and 4B are projection views of the half-substrate chuck 15 in three directions. FIG. 4A is a front view, FIG. 4B is a side view, and FIG. 4C is a plan view. FIG. 5 is a diagram showing a driving mechanism of the half-substrate chuck 15 and the all-substrate chuck 16. Hereinafter, description will be made with reference to these drawings.

The driving mechanism of the half-substrate chuck 15 is Y
The drive mechanism for the entire substrate chuck 16 is provided on the convex portion of the housing 11 on the negative side of the axis, and the drive mechanism for the entire substrate chuck 16 is provided on the convex portion of the housing 11 on the positive side of the Y axis. For this reason, they are drawn together in one figure.

In the half-substrate chuck 15, as shown in FIG. 4, a guide 153 is provided on the opposite side of the half-substrate chuck main body 152 attached to the rotary shaft 151 from the rotary shaft 151.
Is provided. Also, as shown in FIG.
1, a crank mechanism 154 is provided.
5 is provided vertically, and the other end is provided with an air cylinder 156. The driving force generated by the expansion and contraction of the air cylinder 156 is transmitted through the crank mechanism 154 to the rotation shaft 151.
And the main body 152 and the guide 153 are
The substrate W is rotated around the center 1 as shown by the arrow AJ in FIG.
At the fourth substrate position WP4, which is the holding position.

Further, as shown in FIG. 4, the guide 153 is provided with substrate holding portions 153g, 153g. In the substrate holding portion 153g, holding grooves ID and non-holding grooves ND having different depths are provided alternately. An elastic member is provided in the shallower holding groove ID, and is formed so that the periphery of the substrate W is fitted. Further, no elastic member is provided in the deeper non-pinching groove ND, and is formed so as not to interfere with the substrate W even when the half of the substrate chuck 15 is closed. Since the guide 153 is formed in this manner, when the half-substrate chuck 15 is closed, the fourth substrate position W
The standby substrate row WB, which is a half of every other substrate row among the substrate rows located at P4, can be sandwiched.

The entire substrate chuck 16 is shown in FIGS. 6A and 6B are projection views of the entire substrate chuck 16 in three directions. FIG. 6A is a front view, FIG. 6B is a side view, and FIG. 6C is a plan view. Hereinafter, description will be made with reference to these drawings.

The entire substrate chuck 16 is half the substrate chuck 1
5, the rotation shaft 161, the main body 16
2. Guide 163, crank mechanism 164, shaft 16
5. It is composed of an air cylinder 166. The guide 163 is also provided with substrate holding portions 163g and 163g, but is different from the half-substrate chuck 15 in that the elastic members of the substrate holding portions 163g and 163g have all the substrates in the substrate row one by one. For holding, only the above-described holding groove ID is provided. Therefore, when all the substrate chucks 16 are closed, the entire substrate row WA located at the fifth substrate position WP5 can be held.

The second transport section 17 has the same configuration as the first transport section 12, and includes a transport table 171, a support member 172, a shaft 173, a shaft 174, and an air cylinder 175. The second transport section 17 has a substantially symmetric configuration with respect to the YZ plane. And processing carrier PC
Is transported between the second stop position P2 and the third stop position P3.

The configuration of the substrate arrangement converter on the negative side of the Y-axis of the loader-side substrate transfer section 10 has been described above. The substrate arrangement converter on the positive side of the Y-axis has exactly the same configuration. Further, the unloader-side substrate transfer section 90 is also connected to the loader-side substrate transfer section 10.
The configuration is exactly the same. However, in the unloader-side substrate transfer section 90, the processing carrier PC is provided to the first transfer section 12,
The difference is that the transport carrier TC is set in the second transport section 17.

[0046]

[2. FIG. 7 is a diagram showing a processing procedure of the substrate arrangement converting apparatus. Hereinafter, a processing procedure of the board arrangement conversion processing in the board arrangement conversion apparatus will be described with reference to FIG. The processing described below is performed under predetermined timing control by a control unit (not shown).

As an initial state, as shown in FIG.
The transport carrier TC is located at the first stop position P1, and the processing carrier PC is located at the third stop position P3. Then, the entire substrate row WA is stored in the transport carrier TC and is located at the first substrate position WP1. Further, in this state, it is assumed that all the face surfaces F of all the substrate rows WA face the negative direction of the Y axis.

Next, as shown in FIG. 7 (b), the transport carrier TC moves in the positive direction of the X axis in accordance with the movement of the first transport unit 12, and is located at the second stop position P2, and the entire substrate row WA is It is located at the third substrate position WP3.

Next, as shown in FIG. 7 (c), the entire substrate row WA is raised by raising the lifting / lowering pusher 14, and after being located at the fourth substrate position WP4, the half substrate chuck 15
Is closed, and approximately half of the standby substrate rows WB are sandwiched as described above.

Next, as shown in FIG. 7D, when the lifting pusher 14 descends, the remaining substrate row WC not held by the half-substrate chuck 15 also descends. As a result, the remaining substrate row WC moves to the second stop position P2.
, And is located at the third substrate position WP3.

Next, as shown in FIG. 7 (e), after the transport carrier TC moves in the negative direction of the X-axis in accordance with the movement of the first transport section 12, the transport carrier TC stops at the first stop position P1, and the remaining substrate row WC Is located at the first substrate position WP1.

Next, as shown in FIG. 7 (f), the remaining substrate row WC also rises due to the rise of the reversing pusher 13. Then, after the remaining substrate row WC is located at the second substrate position WP2, the reversing pusher 13 is turned to rotate the remaining substrate row WC.
This means that the back surface B faces in the negative direction of the Y axis.

Next, as shown in FIG. 7G, the remaining substrate row WC also descends as the reversing pusher 13 descends.
It is stored in the transport carrier TC located at the first stop position P1.

Next, as shown in FIG. 7 (h), the transport carrier TC moves in the positive direction of the X-axis according to the movement of the first transport unit 12, and stops at the second stop position P2, and the remaining substrate row W
C is located at the third substrate position WP3.

Next, as shown in FIG. 7 (i), the remaining substrate row WC also rises as the lifting pusher 14 rises.
The standby substrate row WB and the remaining substrate row WC which are inserted between the standby substrate rows WB located at the fourth substrate position WP4 become 1 again.
A set of all the substrate rows WA is formed. Then half the substrate chuck 15
After the entire substrate chuck 16 is closed and the lifting / lowering pusher 14 slightly descends, the remaining substrate column WC of the entire substrate column WA slightly descends to close the fifth substrate position WP5.
In the above, all the substrate chucks 16 are sandwiched.

Next, as shown in FIG. 7 (j), the transport carrier TC moves in the negative direction of the X-axis according to the movement of the first transport unit 12, and stops at the first stop position P1. Then,
The processing carrier PC also moves in the negative direction of the X-axis according to the movement of the second transport unit 17, and stops at the second stop position P2.

The elevating pusher 14 is raised to hold the remaining substrate row WC at the fifth substrate position WP5, and further raised to hold the standby substrate row WB at the fourth substrate position WP4. Thus, the entire substrate row WA is held on the lifting pusher 14.
Then, in a state where all the substrate rows WA are held by the lifting / lowering pushers 14, the half-substrate chuck 15 and the all-substrate chuck 1
Open 6

Next, as shown in FIG. 7 (k), the entire substrate row WA is also lowered in accordance with the lowering of the lifting / lowering pusher 14, and is stored in the processing carrier PC located at the second stop position P2. It is located at the substrate position WP3.

Finally, as shown in FIG. 7 (m), the processing carrier PC moves in the positive direction of the X-axis according to the movement of the second transport section 17, and stops at the third stop position P3. Thus, the substrate arrangement conversion processing ends.

Although the processing procedure of the substrate arrangement conversion apparatus has been described above, the loader-side substrate transfer section 10 is provided with one substrate arrangement conversion apparatus on each of the positive side and the negative side of the Y axis. The above processes are respectively performed in parallel by the substrate array conversion device. At that time, the respective processes are not performed completely simultaneously in parallel, but only the reversing operation of the remaining substrate row WC by the reversing pusher 13 is shifted in timing between the two substrate arrangement converters. This is because in order to perform the reversal operation at the same time, the remaining substrate row WC in both the substrate arrangement conversion devices is used.
It is necessary to make the rotation ranges of the two not to overlap. For this purpose, it is necessary to increase the interval between the two board arrangement conversion devices. However, in the loader side substrate transfer unit 10 of this embodiment, the size reduction of the device is required. For this reason, instead of providing the rotation ranges of the remaining substrate rows WC in the respective substrate arrangement conversion devices close to each other so as to overlap with each other, the timings of the inversion operations are shifted between the two substrate arrangement conversion devices so as not to interfere with each other. .

The processing procedure of the unloader-side substrate transfer section 90 is almost the same as the processing procedure of the loader-side substrate transfer section 10, and the processing carrier PC used for the substrate arrangement conversion processing is used.
The only difference is that the transfer carrier TC is replaced with the transfer carrier TC.

As described above, in the substrate arrangement converting apparatus in the substrate processing apparatus 1 of this embodiment, the half-substrate chuck 15 and the all-substrate chuck 16 do not translate, and the entire substrate row WA or the remaining substrate row WC is not moved. Since the horizontal movement is performed in a state of being housed in the carrier, the reliability of substrate transfer is high. In particular, even when the remaining substrate row WC is inserted between the standby substrate rows WB, since the half-substrate chuck 15 and the entire substrate chuck 16 do not move in translation, there is no need to position them, and the standby substrate row WB and the remaining substrate row WC do not need to be positioned. Can be efficiently contacted with each other without being damaged by contact with each other.

Since the half-substrate chuck 15 and the full-substrate chuck 16 do not move in translation, it is not necessary to secure a space for retreating them even in the two-carrier process, so that the entire apparatus can be downsized.

The first transport section 12 and the reversing pusher 1
3, the lifting pusher 14, the half-substrate chuck 15, the all-substrate chuck 16, and the second transporting unit 17 all only operate between two positions in the translation operation. Easy to adjust.

[0065]

[3. Modification The present invention is not limited to the configuration in which the remaining substrate row WC is inverted at the second substrate position WP2, but by providing the half substrate chuck 15 and the full substrate chuck 16 at higher positions, the fourth substrate position WP4, 5th
After the substrate position WP5 is made higher and the remaining substrate line WC is inverted below the fourth substrate position WP4 and the fifth substrate position WP5 and above the carrier and the like located at the second stop position P2, the standby substrate line WB is formed. A configuration such as insertion may be adopted.

The present invention is not limited to the configuration in which all the substrates of the entire substrate row WA can be clamped by the entire substrate chuck 16, but only the remaining remaining substrate row WC not clamped by the half substrate chuck 15. A configuration may be adopted in which a chuck for holding the entire substrate row WA is provided, and when holding all the substrate rows WA, half of each half is held at the same time to hold all the substrates.

The present invention also relates to a fourth substrate position WP4 for holding the standby substrate row WB of the half substrate chuck 15.
The fifth substrate position WP5 for sandwiching the remaining substrate row WC of the entire substrate chuck 16 is not limited to a different configuration, and the half substrate chuck 15 and the full substrate chuck 16 are prevented from interfering with each other. It is also possible to adopt a configuration in which each is held at the same position.

Further, according to the present invention, the reversing pusher 13 and the lifting drive of the lifting
The present invention is not limited to the configuration in which the ball screw 136 and the ball screw 145 are rotated by the 37 and the motor 144, but may be configured to be driven by an air cylinder or the like. Conversely, the translation driving of the first transport unit 12 and the second transport unit 17 is not limited to the configuration using the air cylinder, but may be performed using a motor or the like.

Further, the present invention is not limited to the configuration in which the substrate row is transferred from the transport carrier TC to the processing carrier PC, but may be a configuration in which the taken-out substrate row is converted into a face-facing arrangement and then returned to the original carrier. Is also good.

[0070]

As described above, according to the substrate arrangement conversion method of the first and second aspects, in the holding step, the standby substrate in the substrate row is held by the chuck and the other than the standby substrate in the substrate row. Since the remaining substrate is retracted to a retracted position that does not interfere with the standby substrate and then turned over, the chuck does not translate in the direction in which the substrates are arranged while holding the sandwiched substrate,
There is no need to secure a space for this, and therefore, it is possible to perform a board arrangement conversion process for converting the arrangement into the space-facing arrangement on the face surface.

In the substrate arrangement conversion method according to the second aspect, when the remaining substrate is retracted from the standby substrate and when the remaining substrate is returned to the holding position again, the remaining substrate is horizontally moved in a state of being stored in the carrier. Configuration
High reliability of substrate transfer.

Further, in the substrate arrangement conversion device according to the third and fourth aspects and the substrate processing apparatus according to the fifth aspect, the carrier transport for transporting the carrier between the first position and the second position separated in a substantially horizontal direction. Means for pushing up the substrate from the carrier in the second position,
Since the remaining substrate is pushed up and inverted from the carrier returned from the second position to the first position, the remaining substrate after the inversion is lowered and the lifting / reversing / inverting means for housing the carrier again is provided separately. Since the remaining substrate is retracted and inverted, there is no need to translate the standby substrate, and thus the first chuck and the second chuck do not need to translate, so that the space for retracting the first chuck and the second chuck is eliminated. Since the device is not required, the size of the device can be reduced. Further, for the same reason, the positioning of the first chuck and the second chuck is unnecessary, so that even when the standby substrate and the remaining substrate are aligned, they do not come into contact with each other to damage the substrate, and the substrate can be efficiently arranged. A conversion process can be performed.

Further, in the substrate arrangement converting apparatus according to the fourth aspect and the substrate processing apparatus according to the fifth aspect, the position between the second position and the third position substantially horizontally separated from the first position across the second position. Since the configuration is provided with another carrier transporting means for transporting another carrier, it is possible to transfer the substrate row in the carrier to a face-facing arrangement and then to another carrier.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the board arrangement conversion device according to the embodiment.

FIG. 3 is a front sectional view of the substrate arrangement conversion device.

FIG. 4 is a projection view of a half substrate chuck in three directions.

FIG. 5 is a diagram showing a driving mechanism of a half-substrate chuck and an all-substrate chuck.

FIG. 6 is a projection view of all substrate chucks in three directions.

FIG. 7 is a diagram showing a processing procedure of the substrate array conversion device.

FIG. 8 is a side view of a conventional device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 10 Loader side substrate arrangement conversion part 12 1st conveyance part 13 Reversal pusher 14 Elevating pusher 15 Half substrate chuck 16 All substrate chuck 17 2nd conveyance part 90 Unloader side substrate arrangement conversion part B Back side F Face side PC processing Carrier TC Transport carrier WA All board rows WB Stand-by board rows WC Residual board rows

Claims (5)

[Claims] 1. A substrate arrangement conversion method for inverting the direction of a part of substrates included in an array of substrates accommodated in a carrier to convert the substrate into an arrangement in which face surfaces or back surfaces of the substrates face each other. In a holding position where the substrate row is located, a holding step of holding a standby substrate, which is a part of the substrate row, by a chuck, and a substrate other than the standby board in the substrate row is a remaining substrate. A retreating step of retreating the remaining substrate to a retreat position that does not interfere with the standby substrate; and an inversion step of reversing the remaining substrate at the retreat position so that the directions of its face surface and back surface are switched. An alignment step of combining the standby substrate and the substrate again to form a set of substrate rows. 2. The substrate arrangement conversion method according to claim 1, wherein the retreating step lowers the remaining substrate from a holding position, stores the remaining substrate in a carrier, horizontally moves the remaining substrate with the carrier, and thereafter moves the remaining substrate out of the carrier. In the retreating position by moving the remaining substrate after the reversing step into the carrier, horizontally moving the remaining substrate with the carrier, and further moving the remaining substrate after the reversing step. A substrate arrangement conversion method, wherein the substrate is raised again and returned to the holding position, whereby the remaining substrate and the standby substrate are combined to form a set of substrate rows again. 3. A substrate array conversion device for converting an orientation of a part of substrates included in an array of substrates accommodated in a carrier into an array in which face surfaces or back surfaces of the substrates are opposed to each other. Carrier transporting means for transporting the carrier between a first position and a second position which are separated in a substantially horizontal direction; and the carrier transported from the first position to the second position by the carrier transporting means. A substrate push-up unit that pushes up a substrate from a first chuck that holds a portion of the substrate in the substrate row at a height pushed up by the substrate push-up unit; When the carrier is returned to the first position, the remaining substrate is pushed up from the carrier and inverted, and then the remaining substrate after the inversion is lowered. Elevating and reversing means for receiving the carrier again from the first position to the second position by the carrier conveying means, and the remaining substrate after the inversion from the carrier by the substrate push-up means. When pushed up, at least the former of the remaining substrate and the part of the substrate after the inversion is sandwiched by the height, whereby the orientation of the face surface and the back surface of the substrate row is switched, and And a second chuck for obtaining a row. 4. The substrate arrangement conversion device according to claim 3, wherein a third position that is substantially horizontally separated from the first position with the second position interposed therebetween is defined, and wherein the second position and the third position are defined. Further comprising another carrier transporting means for transporting another carrier to and from the position, after the converted substrate row is lowered by the elevating means and accommodated in the another carrier, The substrate array conversion device, wherein the converted substrate row is transported to a third position. 5. A substrate transfer unit including a plurality of substrate arrangement conversion devices according to claim 3 or 4, a substrate processing unit for performing processing on each substrate belonging to the substrate row, and the substrate transfer unit. A substrate transport unit that transports each of the substrates to and from the substrate processing unit.