JP3577204B2 - Substrate attitude converter - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus for changing the attitude of a substrate (hereinafter, referred to as “substrate”) such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a substrate for an optical disk.
[0002]
[Related technology]
2. Description of the Related Art Conventionally, in order to perform processing on a plurality of substrates, there is a substrate processing apparatus that carries in a plurality of substrates housed in a carrier, performs processing, and then unloads the substrates. In such a substrate processing apparatus, the substrate processing is sequentially performed in each of the processing units arranged linearly. In these substrate processing apparatuses, the plurality of substrates are processed in a vertical posture, and the substrates are processed in a state where they are arranged and held in parallel with each other.
[0003]
In a conventional transport carrier, as in the case of processing in a substrate processing apparatus, a plurality of substrates are transported in a state where they are arranged in parallel in a vertical attitude, so that the attitude must be changed particularly when loading and unloading. There was no.
[0004]
However, due to the recent increase in the size of the substrate, the substrate is often transported in a horizontal posture when being transported. This is because, when the substrate is transported in the vertical posture, the substrate oscillates in the transport carrier, so that the substrates come into contact with each other and collide with each other, thereby causing the generation of contaminants.
[0005]
On the other hand, in the substrate processing apparatus, it is preferable that the substrate processing apparatus is held in a vertical posture for convenience of processing performed inside the apparatus. Therefore, it is necessary to convert the postures of the plurality of substrates between a horizontal posture and a vertical posture.
[0006]
[Problems to be solved by the invention]
However, such a posture changing mechanism has a problem that contaminants such as particles are generated due to rubbing at the time of posture change and at the time of substrate delivery, and the contaminants adhere to the substrate. When such contaminants adhere to the substrate, there is an adverse effect such as a decrease in the processing quality of the substrate.
[0007]
In view of the above problems, it is an object of the present invention to provide a substrate posture changing device that converts the posture of a substrate between a horizontal posture and a vertical posture, and in which contaminants such as particles are hardly generated. .
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a substrate posture changing device according to claim 1 is a substrate posture changing device for converting the posture of a substrate between a horizontal posture and a vertical posture, and (a) rotating the substrate around a horizontal axis. By moving, the posture of the virtual reference plane passing through the horizontal axis changes between a horizontal posture and a vertical posture, (b) driving means for rotating the rotating body, (c) A pair of first holding means provided on one surface of the rotating body that holds the substrate, and rotated in conjunction with the rotating body, and holding the substrate in a horizontal position when the reference surface is in a horizontal position; (d) provided on one surface of the rotating body holding the substrate, having a plurality of V-shaped holding grooves, rotating in conjunction with the rotating body , and when the reference plane is in a vertical posture. A pair of second holding means for holding the substrate in a vertical posture, and (e) the first holding means in a direction substantially parallel to the reference plane. By changing the relative distance between the holding means and the second holding means, the substrate held in the horizontal position by the first holding means does not come into contact with the state in which it contacts the V-shaped holding groove of the second holding means. A parallel moving means for relatively moving the first holding means and the second holding means in order to switch the state; and (f) the first holding means and the second holding means in a direction substantially perpendicular to the reference plane. (2) changing the relative distance between the first holding means and a state in which the substrate held in a vertical position by the second holding means is in contact with the first holding means and not in contact with the first holding means; And orthogonal moving means for relatively moving the second holding means .
[0011]
The substrate attitude changing apparatus according to claim 2 , wherein the first holding means and the second holding means are capable of holding a plurality of substrates in the substrate attitude changing apparatus according to claim 1 , and (g) the rotating body. A first aligning means provided on one surface of the side for holding the substrate, and extruding and aligning the ends of the plurality of substrates in a direction from the second holding means toward the first holding means. And
[0012]
According to a third aspect of the present invention, there is provided the substrate attitude changing apparatus according to the second aspect , wherein (h) the rotating body is provided on one surface of the rotating body that holds the substrate, and is held by the first holding means. And a second aligning means for aligning the ends of the plurality of substrates.
[0013]
According to a fourth aspect of the present invention , in the substrate attitude changing apparatus according to the third aspect , the first holding means includes: (b-1) a first holding groove for holding a plurality of substrates before processing. An array, and (b-2) an array of second holding grooves for holding the plurality of substrates after the processing, wherein the second holding means (c-1) holds the plurality of substrates before the processing. It is characterized by having an array of three holding grooves and (c-2) an array of fourth holding grooves for holding a plurality of substrates after processing.
[0014]
According to a fifth aspect of the present invention, there is provided the substrate attitude changing apparatus according to the fourth aspect , wherein the first holding unit sets the arrangement of the first holding grooves and the arrangement of the second holding grooves to be different. Wherein the second holding means forms the arrangement of the third holding grooves and the arrangement of the fourth holding grooves on different surfaces, and (i) the first holding means is arranged in a direction facing a plurality of substrates. A first rotating means for rotating the first holding means so as to switch and orient the arrangement of the holding grooves and the arrangement of the second holding grooves; and (j) the third rotating means in a direction facing a plurality of substrates. And a second rotating means for rotating the second holding means so as to switch and orient the holding groove arrangement and the fourth holding groove arrangement.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0016]
<Outline of device>
FIGS. 1, 2 and 3 are views showing a substrate processing apparatus 1 of the present embodiment, and the outline of the apparatus will be described with reference to these figures. FIG. 1 is a plan view illustrating a configuration of the substrate processing apparatus 1 of the present embodiment, and FIG. 2 is a perspective view illustrating a partial configuration of the substrate processing apparatus 1. FIG. 3 is a side view showing the internal configuration of the substrate processing apparatus 1 viewed from the direction of the arrow AP (see FIG. 2).
[0017]
As shown in these drawings, the substrate processing apparatus 1 includes a carrier mounting unit 100, a horizontal transfer robot 200, a posture conversion mechanism 300, a pusher 400, a transfer mechanism 500, and a substrate processing unit 600.
[0018]
A carrier C that stores a plurality of substrates W is mounted on the carrier mounting unit 100, and the substrate W stored in the carrier C is loaded and unloaded with the outside of the substrate processing apparatus 1. At this time, the plurality of substrates W are held in the carrier C in a horizontal posture.
[0019]
The horizontal transfer robot 200 is an articulated transfer robot, and includes an elevating shaft 220 communicating with the inside of the base 210, a first arm 230 having one end connected to an upper end of the elevating shaft 220 above the base 210, A second arm 240 having one end connected to the other end of the one arm 230; and a substrate supporting hand 250 connected to the other end of the second arm 240. It is driven as follows.
[0020]
As shown in FIG. 2, the elevating shaft 220 is vertically movable (Z direction), and the first arm 230 is connected to the elevating shaft 220 in a substantially horizontal plane around the rotation axis A1 at a connection portion with the elevating shaft 220. It can be turned (turned) at any angle. Similarly, the second arm 240 is around a rotation axis A2 at a connection portion with the first arm 230, and the substrate support hand 250 is in a substantially horizontal plane around a rotation axis A3 at a connection portion with the second arm 240. Each can be turned (turned) at any angle. With such a mechanism, the horizontal transfer robot 200 is movable in a predetermined range of three-dimensional space while holding the substrate W with the substrate supporting hand 250, and is mounted on the carrier mounting unit 100. The substrate W is transported between the carrier C and the posture changing mechanism 300.
[0021]
The posture changing mechanism 300 includes a support base 305, a base 310, a rotary base 320, a pair of first holding mechanisms 330 and a pair of second holding mechanisms 340 for holding a substrate, a first alignment device 350, and a second alignment device. 360. The turntable 320 can rotate about the axis A30 in a direction indicated by an arrow AR30 (see FIG. 3), and takes a posture P1 indicated by a solid line and a posture P2 indicated by a two-dot chain line in FIG. It is possible. Further, the first holding mechanism 330 and the second holding mechanism 340 rotate in conjunction with the turntable 320. Therefore, by rotating the turntable 320, the posture changing mechanism 300 changes the posture of the plurality of substrates W held by the first holding mechanism 330 and the second holding mechanism 340 between the horizontal posture and the vertical posture. be able to.
[0022]
The pusher 400 has a base 410, a Y-direction movable section 420, a Z-direction movable section 430, and a holder 440. The Y-direction movable portion 420 is driven by a motor, a ball screw, a rail, and the like (not shown) provided on the base 410, and linearly moves in a predetermined range in the horizontal direction (Y direction) with respect to the base 410 as indicated by an arrow AR42. The Z-direction movable portion 430 is driven by a motor, a ball screw, and a rail (not shown) provided in the Y-direction movable portion 420, and is positioned within a predetermined range in the vertical direction (Z direction) as indicated by an arrow AR40 with respect to the Y-direction movable portion 420. Make a linear motion. Further, the holder 440 is provided above the Z-direction movable portion 430 and can hold a substrate having a vertical posture, and can take the postures P3 and P4 by vertically moving the Z-direction movable portion 430. By using such a mechanism, the pusher 400 can transport a plurality of substrates W having a vertical attitude between the attitude conversion mechanism 300 and the transport mechanism 500. Further, the pusher 400 can transfer a plurality of substrates W having a vertical posture between the posture conversion mechanism 300 and the transport mechanism 500 by the vertical movement.
[0023]
The transport mechanism 500 includes a transport robot 510 that can move horizontally and vertically. Further, the transport mechanism 500 includes a pair of holding mechanisms 520 for holding a plurality of substrates W having a vertical posture. Each of the holding mechanisms 520 has support portions 522 and 524, and each of the support portions 522 and 524 has a plurality of grooves GV for supporting a plurality of substrates. In addition, the holding mechanism 520 can support the substrate W or release the support of the substrate W by rotating in the direction of the arrow AR in FIG. The transport mechanism 500 having such a configuration exchanges a substrate with the pusher 400. Further, it is also possible to exchange a substrate with each of the lifters 550 and 560 provided in the processing unit. The transport mechanism 500 transports or transfers the substrate before, during, and after the cleaning process from one location to another location.
[0024]
The substrate processing section 600 includes a transport mechanism water washing section 610 having cleaning tanks 612 a and 612 b for cleaning the pair of holding mechanisms 520, chemical solution processing sections 620 and 640 having a chemical tank CB for storing a chemical, and pure water. Are provided with washing processing units 630 and 650 each having a washing tank WB for storing the water, and a drying processing unit 660. Note that the transport mechanism rinsing processing unit 610 does not strictly process a substrate, but handles it as one of the substrate processing units 600 for performing a process accompanying the substrate processing for convenience.
[0025]
The plurality of processing units are linearly arranged in the X direction, and the above-described transport mechanism 500 is provided on a side of the linear arrangement. The transport mechanism 500 can move in a linear arrangement direction, and transports a substrate between the processing units as described above.
[0026]
Further, a lifter 550 is disposed behind the chemical processing section 620 and the water washing processing section 630. The lifter 550 can move up and down (in the Z direction) and traverse (in the X direction). Or soak in Similarly, a lifter 560 is disposed behind the chemical processing section 640 and the water washing processing section 650. The lifter 560 can move up and down (in the Z direction) and traverse (in the X direction). Or soak in With such a mechanism, a chemical solution process and a water washing process can be performed in these processing units.
[0027]
The control of each process and the control of each drive mechanism are performed by the control unit CL.
[0028]
<Example of substrate processing>
Next, an example of a processing procedure by such a substrate processing apparatus 1 will be described.
[0029]
The plurality of substrates W to be processed in the substrate processing apparatus 1 are loaded into the carrier mounting unit 100 and placed in the carrier C while being horizontally stored in the carrier C. The horizontal transfer robot 200 takes out a plurality of substrates stored in the carrier at the same time, and transfers the substrates to the posture conversion mechanism 300 having the posture P1 (see FIG. 3). Next, the posture changing mechanism 300 turns the turntable 320 around the horizontal axis A30 by 90 degrees to the posture P2 (see FIG. 3), and converts the plurality of substrates W received in the horizontal posture to the vertical posture.
[0030]
The pusher 400 waiting at the position P3 (see FIG. 3) rises in the direction of the position P4, and receives the substrate in the vertical posture at the time of the rise. Further, the pusher 400 moves the Y direction in the positive direction to allow a part of the Z direction movable portion 430 to enter the gap 614 between the cleaning tanks 612a and 612b, thereby transporting a plurality of substrates to the transfer mechanism. The sheet is conveyed above the section 610. Then, the transport mechanism 500 receives the plurality of substrates having a vertical posture from the pusher 400 and grips them by using the holding mechanism 520.
[0031]
Further, the description will be continued on the assumption that a predetermined process is performed on the substrate in the order of the chemical processing section 620, the rinsing processing section 630, the chemical processing section 640, the rinsing processing section 650, and the drying processing section 660.
[0032]
The transport robot 510 moves the X direction in the positive direction, transports the plurality of substrates above the chemical solution processing unit 620, and transfers the plurality of substrates to the lifter 550. The lifter 550 that has received the substrate descends, and immerses the substrate in the chemical solution tank CB. Then, a predetermined chemical treatment is performed on the substrate.
[0033]
On the other hand, the transfer robot 510 moves to the transfer mechanism washing processing unit 610 in the negative X direction after the transfer is completed. Further, the transport robot 510 descends (moves in the negative direction in the Z direction) to immerse and wash each of the pair of holding mechanisms 520 in the cleaning tanks 612a and 612b. This is because the holding mechanism 520 is preferably cleaned because the nipping mechanism 520 may be contaminated by a chemical atmosphere above the chemical processing section 620.
[0034]
After a predetermined chemical processing is performed on the substrate in the chemical processing section 620, the lifter 550 moves up, and further moves in the X direction to the washing processing section 630 in the negative direction. In order to perform the rinsing process with pure water in the rinsing unit 630, the lifter 550 descends and immerses the substrate in the rinsing tank WB.
[0035]
The transfer robot 510 moves to the rinsing unit 630 after completing the cleaning process of the holding mechanism 520 described above. This is because the substrate is received from the lifter 550 in order to perform the next processing on the substrate in the chemical processing section 640. After receiving the substrate from the lifter 550, the transfer robot 510 moves in the negative direction in the X direction to the position of the chemical processing section 640. Then, the substrate is delivered to the lifter 560 that stands by at the position of the chemical processing section 640. The lifter 560 that has received the substrate descends, immerses the substrate in the chemical solution tank CB of the chemical solution processing unit 640, and performs a predetermined chemical solution process.
[0036]
Then, in the same manner as described above, predetermined processing for the substrate in the chemical liquid processing section 640 and the water washing processing section 650 and cleaning processing for the holding mechanism 520 in the transport mechanism water washing processing section 610 are performed.
[0037]
The transport robot 510 receives the substrate from the lifter 560 in the washing processing unit 650, moves to the drying processing unit 660, and performs the drying process. After the drying process is completed, the transport mechanism 500 transports the substrate to a position above the transport mechanism water washing section 610.
[0038]
The processing in the substrate processing section 600 is performed as described above.
[0039]
The plurality of substrates W that have been subjected to a predetermined series of processing in the substrate processing unit 600 are transferred from the transport mechanism 500 to the pusher 400 above the transport mechanism washing processing unit 610, and then transferred to the attitude conversion mechanism 300. Is done. The posture conversion mechanism 300 converts the posture of the substrate from a vertical posture to a horizontal posture. Further, the horizontal transfer robot 200 stores the plurality of substrates held in the horizontal posture inside the carrier C mounted on the carrier mounting section 100. Then, the plurality of substrates are carried out of the substrate processing apparatus 1 together with the carrier C.
[0040]
<Attitude conversion mechanism>
Next, the structure of the attitude conversion mechanism 300 and the attitude conversion using the attitude conversion mechanism 300 will be described in detail.
[0041]
First, the structure of the posture changing mechanism 300 will be described in detail.
[0042]
4 and 5 are views showing the structure of the posture changing mechanism 300. FIG. FIG. 4 is a schematic sectional view on a plane parallel to the YZ plane, and FIG. 5 is a schematic sectional view on a plane parallel to the XZ plane.
[0043]
As shown in FIGS. 4 and 5, the posture changing mechanism 300 includes a support base 305 (see FIG. 2), a base 310, a rotary base 320, a pair of first holding mechanisms 330 for holding a substrate, and a pair of first holding mechanisms 330. It has a second holding mechanism 340, a first alignment device 350, and a second alignment device 360.
[0044]
The motor M30 is fixed to the base 310, and the rotating shaft of the motor M30 is connected to the turntable 320 by a link mechanism 315. Therefore, the turntable 320 can rotate in the direction indicated by the arrow AR30 around the axis A30 by the rotational drive of the motor M30.
[0045]
Here, a virtual reference plane F (see FIG. 4) is introduced for the following description. The virtual reference plane F is a plane that includes the axis A30 and rotates with the rotation of the turntable 320, and is an XY plane when the turntable 320 is in the posture P1 (see FIG. 3). Is a plane parallel to. Therefore, when the turntable 320 has the posture P2 (see FIG. 3) due to the rotation of the turntable 320, the virtual reference plane F is perpendicular to the XY plane.
[0046]
<First holding mechanism>
The turntable 320 has a pair of first holding mechanisms 330 for holding the substrate. The first holding mechanism 330 has three degrees of freedom, and can perform linear motion perpendicular and horizontal to the virtual reference plane F and rotational movement about an axis perpendicular to the virtual reference plane F. Hereinafter, a mechanism for realizing each of these movements will be described.
[0047]
FIG. 5 is a diagram schematically showing these drive mechanisms. First, a drive mechanism that achieves a linear motion in a direction perpendicular to the virtual reference plane F will be described with reference to FIG. A fixed base 322 is fixed above the rotating base 320 (see FIG. 4), and a part of the fixed base 322 is provided with a linear bush 322a. The elevating base 324 has a portion penetrating the linear bush 322a, and moves with respect to the fixed base 322 in the direction of the arrow AR31, that is, in the direction perpendicular to the virtual reference plane F.
[0048]
The relative movement between the fixed base 322 and the lifting base 324 is performed by converting a horizontal linear movement of the cylinder M31 into a linear movement in the lifting direction. Reference is now made to FIG. The cylinder M31 is fixed to the fixed base 322, and the horizontal linear motion of the movable portion of the cylinder M31 is transmitted as the linear motion of the traversing slider portion 323 in the direction indicated by the arrow AR31a (see FIG. 4). The traversing slider portion 323 has a tapered portion 323a on its upper surface.
[0049]
On the other hand, the elevating base 324 has a roller 324a. The roller 324a is attached to the elevating base 324 via a bearing 324b so as to be rotatable around the axis A31. The roller 324a is disposed on the upper surface of the traversing slider portion 323, and can roll on the tapered portion 323a.
[0050]
The traversing slider portion 323 makes a linear motion (arrow AR31a) by traveling on a rail portion 322b provided above the fixed base 322, and the roller 324a rolls on the taper portion 323a in accordance with the linear motion. As a result, the roller 324a moves up and down according to the inclination of the tapered portion 323a. In response to the vertical movement of the roller 324a, the vertical base 324 performs a linear movement in the direction (vertical direction) indicated by the arrow AR31. The lifting base 324 is urged in a direction approaching the fixed base 322 by an urging means S such as a spring (see FIG. 5). This is to prevent the roller 324a from being separated from the traversing slider portion 323 regardless of the posture of the rotating base 320. Therefore, even when the turntable 320 takes a posture other than the posture P1 (see FIG. 3), the elevating base 324 performs a relative motion according to the inclination of the tapered portion 323a of the traversing slider portion 323.
[0051]
Next, a linear motion performed by the first holding mechanism 330 in the horizontal direction with respect to the virtual reference plane F will be described. This horizontal linear motion is realized by the relative movement between the lifting base 324 and the traversing base 326.
[0052]
On the lifting base 324, a linear rail 324c is provided. The traversing base 326 has a guide 326a, and the guide 326a can slide on the rail 324c in a direction indicated by an arrow AR32. Further, the lifting base 324 includes a cylinder M32 for traversing drive. The linear motion of the cylinder M32 is transmitted to the linear motion of the traversing base 326 in the direction indicated by the arrow AR32. In this way, the traversing base 326 is driven linearly in the direction indicated by the arrow AR32 with respect to the lifting base 324.
[0053]
The traversing base 326 includes a motor M33. The rotation shaft of the motor M33 is connected to the first holding mechanism 330. Therefore, the first holding mechanism 330 can perform a rotary motion as indicated by the arrow AR33 by the rotational driving of the motor M33. In this manner, the first holding mechanism 330 can perform a rotational movement about an axis perpendicular to the virtual reference plane F.
[0054]
Each of the pair of first holding mechanisms 330 has a plurality of holding grooves 332 for holding a plurality of substrates on the surface thereof. The plurality of holding grooves 332 are arranged in the Z direction. FIG. 6 is an enlarged cross-sectional view of a part of the plurality of holding grooves 332 in a state where the substrate W is placed in a horizontal posture. In this manner, the pair of first holding mechanisms 330 can hold a plurality of substrates having a horizontal posture by the pair of holding grooves 332. In addition, it is preferable that these holding grooves 332 are made of fluororesin, especially Teflon (trademark).
[0055]
Further, the plurality of holding grooves 332 have an arrangement of a plurality of holding grooves 332a on one surface of the first holding mechanism 330 and an arrangement of a plurality of holding grooves 332b on the opposite surface. Since the first holding mechanism 330 is rotatable by the rotation mechanism, the holding grooves 332a and 332b for holding the substrate can be switched. For example, the substrate before the substrate processing in the substrate processing unit 600 can be held by the pair of holding grooves 332a, and the substrate after the substrate processing can be held by the pair of holding grooves 332b. If the holding groove for holding the substrate is switched before and after the substrate processing as described above, contaminants that have adhered to the substrate before the substrate processing do not adhere to the substrate that has been subjected to the substrate processing.
[0056]
<Second holding mechanism>
The turntable 320 has a pair of second holding mechanisms 340 for holding the substrate. The second holding mechanism 340 is driven to rotate by a motor M34.
[0057]
Each of the pair of second holding mechanisms 340 has a plurality of holding grooves 342 for holding a plurality of substrates on its surface. The plurality of holding grooves 342 are arranged in the Z direction. FIG. 7 is a cross-sectional view in which a part of the plurality of holding grooves 342 is enlarged in a state where the substrate W is placed in a vertical posture. Each of the holding grooves 342 has a V-shape. The pair of second holding mechanisms 340 can hold a plurality of substrates having a vertical posture by the holding grooves 342 having such a shape. In addition, it is preferable that these holding grooves 342 are made of fluororesin, especially Teflon (trademark).
[0058]
Similarly to the first holding mechanism 330, the second holding mechanism 340 has an array of a plurality of holding grooves on one surface of the second holding mechanism 340, and has an array of a plurality of holding grooves on the opposite surface. . Since the second holding mechanism 340 is rotatable by the motor M34, the holding groove for holding the substrate can be switched. For example, a substrate before substrate processing in the substrate processing unit 600 can be held by a pair of holding grooves on one surface, and a substrate after substrate processing can be held by a pair of holding grooves on the opposite surface. By switching the holding grooves for holding the substrate before and after the substrate processing as described above, contaminants that have adhered to the substrate before the substrate processing do not adhere to the substrate that has been subjected to the substrate processing.
[0059]
<First and second alignment devices>
Further, the turntable 320 has a first alignment device 350 and a second alignment device 360. These are traversed in the X-axis direction by the cylinders M35 and M36, respectively.
[0060]
<Posture conversion operation-conversion operation from horizontal posture to vertical posture>
The posture changing mechanism 300 has the above structure. The attitude conversion mechanism 300 having such a structure can convert the attitude of the plurality of substrates W held by the first holding mechanism 330 and the second holding mechanism 340 between a horizontal attitude and a vertical attitude. Hereinafter, this posture conversion operation will be described.
[0061]
First, an operation of converting a horizontal posture into a vertical posture will be described.
[0062]
8 to 17 are schematic side views of the attitude conversion mechanism 300 for explaining the operation of the attitude conversion mechanism 300 converting a plurality of substrates W from a horizontal attitude to a vertical attitude. FIGS. 18 to 20 are plan views showing states corresponding to FIGS. 8 to 10, respectively.
[0063]
First, as shown in FIGS. 8 and 18, the horizontal transfer robot 200 causes the plurality of substrates W taken out simultaneously from the carrier C to approach the attitude conversion mechanism 300 from the −Y direction of the attitude conversion mechanism 300. Further, the horizontal transfer robot 200 (see FIG. 2) moves these substrates in the direction indicated by the arrow AF1. At this time, the plurality of substrates W move to a predetermined position with respect to the Z-direction position, passing through a gap between the plurality of holding grooves 332 of the first holding mechanism 330. Therefore, the substrate W does not contact the first holding mechanism 330.
[0064]
Then, the horizontal transfer robot 200 lowers the plurality of substrates W in the direction of the arrow AF2 and places the plurality of substrates W on the plurality of holding grooves 332 of the first holding mechanism 330. Thereby, each of the plurality of substrates W is held by the corresponding pair of holding grooves 332 of the pair of first holding mechanisms 330. By the operation as described above, the plurality of substrates W have the states shown in FIGS. However, in this state, the plurality of substrates W have not yet contacted the second holding mechanism 340. After the plurality of substrates W are mounted, the horizontal transfer robot 200 retreats to a position that does not interfere with the subsequent posture changing operation.
[0065]
Next, the first holding mechanism 330 itself moves in the direction indicated by the arrow AF3 with respect to the turntable 320. Therefore, the plurality of substrates W held by the first holding mechanism 330 also move horizontally in the direction indicated by the arrow AF3. Then, the plurality of substrates W move to positions where they contact the second holding mechanism 340 (see FIG. 20), and each of the plurality of substrates W is inserted into each of the V-shaped holding grooves 342 of the second holding mechanism 340. Contact. 10 and 20 are views showing a state after the movement. FIG. 21 shows a state where the substrate W is in contact with the holding groove 342. Therefore, the plurality of substrates W are held by the holding grooves 332 of the first holding mechanism 330 and the holding grooves 342 of the second holding mechanism 340.
[0066]
Then, the turntable 320 rotates 90 degrees in the direction of the arrow AF4. Therefore, the plurality of substrates W held by the first holding mechanism 330 and the second holding mechanism 340 are rotated by 90 degrees in the direction of the arrow AF4 to be in a state shown in FIG. In this state, the plurality of substrates W are mainly held by the pair of second holding mechanisms 340. Further, since the substrate W is supported by the second holding mechanism 340 from the start of rotation, the substrate W does not move relative to the first holding mechanism 330 even during rotation. Therefore, no particles are generated due to the friction between the substrate W and the first holding mechanism 330.
[0067]
Further, the first holding mechanism 330 moves in the direction indicated by the arrow AF5. The moving distance is smaller than the distance D between the substrate arrangements (see FIG. 22), and the first holding mechanism 330 after the movement does not contact the plurality of substrates W. FIG. 22 is a diagram illustrating a relationship between the holding groove 332 of the first holding mechanism 330 and the substrate W. In FIG. 22, the holding groove 332 of the first holding mechanism 330 after the movement is indicated by a solid line, indicating that the holding groove 332 is not in contact with the substrate W. In the drawing, the position of the holding groove 342 of the first holding mechanism 330 before the movement is indicated by a broken line. FIG. 12 is a diagram illustrating a state after the first holding mechanism 330 has moved in the direction of the arrow AF5. In FIG. 12, the plurality of substrates W are held by the holding grooves 342 of the second holding mechanism 340 (see FIG. 7), and do not contact the first holding mechanism 330.
[0068]
Here, the pusher 400 moves up between the pair of the first holding mechanism 330 and the second holding mechanism 340 in the direction of the arrow AF6. FIG. 23 is a diagram illustrating this ascent operation on a plane parallel to the YZ plane. The pusher 400 rises in the direction of the arrow AF6, holds the substrate W by the holder 440, and pushes up the substrate W. Thereby, the contact between the substrate W and the second holding mechanism 340 is released, and the substrate W is held by the holder 440. The pusher 400 further rises between the pair of second holding mechanisms 340 and between the pair of first holding mechanisms 330 to be in the state of FIG. Thus, the substrate W held by the second holding mechanism 340 is transferred to the pusher 400. When the pusher 400 is raised, the plurality of substrates W and the first holding mechanism 330 are not in contact with each other, so that no particles are generated due to contact, rubbing, or the like.
[0069]
After transferring the plurality of substrates W to the pusher 400, the rotary table 320 of the attitude conversion mechanism 300 rotates 90 degrees in the direction of the arrow AF7 to be in the state of FIG. After that, the first holding mechanism 330 moves in the directions of the arrows AF8 and AF9, and enters the state of FIG. On the other hand, the pusher 400 descends from the position shown in FIGS. 13 and 14 to the position shown in FIG. 15 in the direction of arrow AF10 (see FIG. 14). In this way, the plurality of substrates W are converted from the horizontal posture to the vertical posture by the posture conversion mechanism 300 and delivered to the pusher 400. The state in FIG. 15 of the posture changing mechanism 300 is almost the same as the state in FIG.
[0070]
As described above, the arrangement of the plurality of substrates W can be held in the vertical posture, but another arrangement of the plurality of substrates W is inserted between the arrangement of the plurality of substrates W to double the volume. Can be accommodated. This operation is further described below.
[0071]
A plurality of substrates W (hereinafter, referred to as “second substrate group”) different from the plurality of substrates W whose posture has been converted (hereinafter, referred to as “first substrate group”) are subjected to a posture conversion mechanism by the horizontal transfer robot 200. 300, and the same operations as those shown in FIGS. 8 to 11 are repeated. Thus, the attitude of the second substrate group is changed to the state shown in FIG. FIG. 16 is a diagram corresponding to FIG. 12 in the above description.
[0072]
Next, the pusher 400 rises in the direction shown by the arrow AF16, and replaces each of the substrates W of the first substrate group held by the holder 440 with the substrates of the second substrate group held by the second holding mechanism 340. Insert between W. Therefore, it is preferable that the holder 440 of the pusher 400 has grooves G (see FIG. 24) arranged at intervals of D / 2. FIG. 24 is a sectional view showing the structure of the groove G of the holder 440. Here, the interval D represents the interval between the substrates in the first substrate group. The rise of the pusher 400 prevents the first substrate group and the second substrate group from interfering with each other, and D / 2 in the Y direction with respect to the groove G1 that holds the substrate of the first substrate group. In order to hold the second substrate group by the shifted groove G2, the position of the pusher 400 in the Y direction is preferably shifted in advance by D / 2.
[0073]
In order to cause this shift, as shown in FIG. 15, for example, the pusher 400 can move by a distance of D / 2 in the direction of the arrow AF10B. In this case, all the main surfaces of the first substrate group and the second substrate group are aligned in the same direction with respect to the surface of the substrate W on which devices are formed (hereinafter, referred to as “main surface”). Alternatively, it can be rotated 180 degrees around the axis AC in the direction of the arrow AF10C. In this case, the main surfaces of the substrates of the first substrate group and the second substrate group are opposite to each other. Which of these operations is selected can be changed depending on the contents of the subsequent substrate processing and the like. These operations can be performed simultaneously with the descending operation in the direction indicated by the arrow AF10 in FIG.
[0074]
By the above operation, the groove G2 for holding the substrate of the second substrate group can be located at the position where the groove G1 for holding the substrate of the first substrate group was present. In this manner, the holder 440 on which the substrates of the first substrate group are arranged at positions shifted by D / 2 in the Y direction can be lifted in the direction indicated by the arrow AF16 in FIG. Therefore, the substrates of the second substrate group held by the second holding mechanism 340 of the posture changing mechanism 300 are held at the position of the groove G2 of the holder 440 and delivered to the pusher 400 when the pusher 400 is raised. Further, each of the substrates W of the first substrate group held by the holder 440 is inserted between the substrates W of the second substrate group, and contact occurs between the first and second substrate groups. Absent.
[0075]
The pusher 400 that has continued to ascend holds the substrates of the first substrate group and the second substrate group in the groove G, as shown in FIG. Thereafter, the attitude conversion mechanism 300 returns to the state shown in FIG. 8 by, for example, rotating the turntable 320 by 90 degrees in the direction of the arrow AF17.
[0076]
As described above, the substrate W can be accommodated in the pusher 400 at double density.
[0077]
<Posture conversion operation-conversion operation from vertical posture to horizontal posture>
In the above, among the posture conversion operations of the posture conversion mechanism 300, the operation of converting the horizontal posture to the vertical posture (hereinafter, also referred to as “forward conversion operation”) has been described.
[0078]
In the following, the operation of converting the vertical posture to the horizontal posture (hereinafter, also referred to as “inverse conversion operation”) will be described. As for this inverse conversion operation, basically, the inverse operation of the operation of converting from the horizontal posture to the vertical posture may be performed. Therefore, the operations described above with reference to FIGS. 8 to 17 are sequentially reversed. By such an operation, each of the first substrate group and the second substrate group held by the pusher 400 can be converted from the vertical posture to the horizontal posture by the posture conversion mechanism 300.
[0079]
In addition, in the reverse conversion operation, in addition to the reverse operation of the forward conversion operation, an operation for aligning the substrates using the first alignment device 350 and the second alignment device 360 can be added. FIGS. 25 and 26 are schematic side views of the posture changing mechanism 300, and FIGS. 27 and 28 are plan views showing states corresponding to FIGS. 25 and 26, respectively. The operation of the first alignment device 350 and the second alignment device 360 for aligning the substrates when converting the plurality of substrates W received from the pusher 400 from the vertical position to the horizontal position will be described with reference to these drawings. .
[0080]
The plurality of substrates held vertically by the pusher 400 are transferred to the posture changing mechanism 300 and held in a horizontal posture by the rotation of the turntable 320. FIG. 25 is a diagram showing such a state. This state corresponds to FIG. 10 in the description of the forward conversion operation. Therefore, the state shifts to the state shown in FIG. FIG. 26 is a diagram illustrating a state corresponding to FIG. 9, in which the first holding mechanism 330 is moved in a direction indicated by an arrow AF23 (see FIG. 25) opposite to the arrow AF3 (see FIG. 9). ing.
[0081]
Along with this operation, the substrate placed on the first holding mechanism 330 also moves in the direction of the arrow AF23. However, some of the substrates held in the holding grooves 342 of the second holding mechanism 340 in the vertical posture may be fitted into the holding grooves 342 and hardly detached. In such a case, the first alignment device 350 can be used to align the plurality of substrates at predetermined positions with respect to the first holding mechanism 330.
[0082]
The first alignment device 350 moves the first alignment device 350 in the direction of the arrow AF23B in the state of FIGS. 25 and 27. As a result, the first alignment device 350 comes into contact with the ends of the plurality of substrates W held by the second holding mechanism 340, and a force in a direction to separate the plurality of substrates W from the second holding mechanism 340 is applied. Therefore, the plurality of substrates W are extruded in the direction of the arrow AF23B, and the plurality of substrates W are aligned by the first alignment device 350. Then, by moving the first holding mechanism 330 in the direction of the arrow AF23, the plurality of substrates W thus aligned can be moved with the operation of the first holding mechanism 330.
[0083]
Prior to the movement of the first holding mechanism 330, the second alignment device 360 can be moved to a predetermined position in the direction of the arrow AF23C as shown in FIG. The plurality of substrates W moving in the direction of the arrow AF23 can be aligned by the second alignment device 360 located at such a position.
[0084]
By using the first alignment device 350 and the second alignment device 360 as described above, a plurality of substrates can be aligned at a predetermined position. For other operations, the reverse conversion operation can be performed by performing the reverse operation of the forward conversion operation, and the substrate in the vertical position can be converted to the horizontal position.
[0085]
<Other modifications>
In the above-described embodiment, as shown in FIGS. 9 and 10 and the like, an arrow AF3 is used to realize an operation of switching the substrate mounted on the first holding mechanism 330 and the second holding mechanism 340 between contact and non-contact. The first holding mechanism 330 has moved in the direction shown. However, this operation is not limited to this, and the relative movement between the first holding mechanism 330 and the second holding mechanism 340 causes the contact state and the non-contact state between the substrate W and the second holding mechanism 340. It is only necessary to be able to switch between. Therefore, the second holding mechanism 340 may move in the direction of the arrow AF3. Alternatively, the second holding mechanism 340 can be moved in a direction orthogonal to the arrow AF3 to switch between a contact state and a non-contact state with the substrate W.
[0086]
Further, as shown in FIG. 11 and FIG. 12, the substrate held by the second holding mechanism 340 by moving the first holding mechanism 330 in a direction perpendicular to the virtual reference plane F (see an arrow AF5). The contact and non-contact between the W and the first holding mechanism 330 were switched. However, this operation is not limited to this, and the first holding mechanism 330 increases and decreases the relative distance between the first holding mechanism 330 and the second holding mechanism 340 in a direction substantially orthogonal to the virtual reference plane F. It suffices if the contact and non-contact states between the substrate 330 and the substrate W can be switched. For example, when the second holding mechanism 340 moves in a direction orthogonal to the virtual reference plane F (see arrow AF5), contact between the substrate W held by the second holding mechanism 340 and the first holding mechanism 330 and Non-contact may be switched.
[0087]
【The invention's effect】
As described above, according to the substrate posture conversion device of claim 1, the posture of the virtual reference plane passing through the horizontal axis changes between the horizontal posture and the vertical posture, and the rotation body interlocks with the rotation body. A first holding means and a second holding means, which rotate when the reference plane is in a horizontal attitude, and the second holding means holds the substrate in a horizontal attitude when the reference plane is in a horizontal attitude. The substrate is held in a vertical position. Therefore, the posture of the substrate can be converted between the horizontal posture and the vertical posture with a simple configuration.
[0088]
Further, according to the substrate posture changing device according to claim 1, to vary the relative distance between the first holding means and the second holding means in a direction substantially parallel to the reference plane, the first holding means and the second holding By moving the first and second holding means relatively in a state where the reference plane is in a horizontal posture, using a parallel moving means for relatively moving the means, the first holding means makes a horizontal posture. Since the held substrate is switched between a state in which the substrate is in contact with the second holding unit and a state in which the substrate is not in contact with the second holding unit, a state in which the substrate and the second holding unit are in contact with each other can be created as necessary. By rotating, the posture of the substrate can be changed without rubbing between the substrate and the first holding means. Therefore, generation of particles due to rubbing can be prevented.
[0089]
Further, according to the substrate posture changing device according to claim 1, to vary the relative distance between the first holding means and the second holding means in a direction substantially perpendicular to the reference plane, the first holding means and the second holding The first and second holding means are relatively moved in a state in which the reference plane is in the vertical posture by using the orthogonal movement means for relatively moving the means, so that the second holding means moves to the vertical posture. Since the held substrate is switched between a state in which the substrate is in contact with the first holding unit and a state in which the substrate is not in contact with the first holding unit, a state in which the substrate is not in contact with the first holding unit is created when the substrate separates from the second holding unit. be able to. In this case, no rubbing occurs between the substrate and the first holding means, so that generation of particles due to the rubbing can be prevented.
[0090]
According to the substrate posture changing device according to claim 2, a plurality of substrates held by the first holding means and the second holding means, by the first alignment means, the direction from the second holding means toward the first holding means Extruded. Therefore, the contact state between the substrate and the second holding means is reliably released, so that a plurality of substrates can be aligned.
[0091]
According to the substrate posture changing device according to claim 3, the second alignment means may be aligned in a predetermined position with respect to the first holding means the end portions of the plurality of substrates.
[0092]
According to the substrate attitude changing apparatus of the fourth and fifth aspects, the first holding means and the second holding means respectively include an arrangement of holding grooves for holding a plurality of substrates before processing, and an arrangement after processing. Holding grooves for holding a plurality of substrates. By switching the arrangement of the holding grooves before and after processing the substrate, contaminants such as particles that have adhered to the substrate before processing do not adhere to the substrate after processing.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a substrate processing apparatus 1.
FIG. 2 is a perspective view showing a configuration of a part of the substrate processing apparatus 1.
FIG. 3 is a side view showing an internal configuration of the substrate processing apparatus 1.
FIG. 4 is a longitudinal sectional view showing a structure of a posture changing mechanism 300 according to the present invention.
FIG. 5 is another longitudinal sectional view showing the structure of the posture changing mechanism 300.
FIG. 6 is an enlarged view showing a holding groove 332 of the first holding mechanism 330.
FIG. 7 is an enlarged view showing a holding groove 342 of the second holding mechanism 340.
FIG. 8 is a schematic side view of the posture changing mechanism 300.
FIG. 9 is a schematic side view of a posture changing mechanism 300.
FIG. 10 is a schematic side view of a posture changing mechanism 300.
11 is a schematic side view of a posture changing mechanism 300. FIG.
FIG. 12 is a schematic side view of a posture changing mechanism 300.
FIG. 13 is a schematic side view of the posture changing mechanism 300.
FIG. 14 is a schematic side view of a posture changing mechanism 300.
FIG. 15 is a schematic side view of the posture changing mechanism 300.
FIG. 16 is a schematic side view of the posture changing mechanism 300.
17 is a schematic side view of a posture changing mechanism 300. FIG.
FIG. 18 is a schematic plan view of a posture changing mechanism 300 corresponding to the state of FIG.
FIG. 19 is a schematic plan view of the posture changing mechanism 300 corresponding to the state of FIG.
20 is a schematic plan view of the posture changing mechanism 300 corresponding to the state of FIG.
21 is an enlarged view showing a holding groove 342 of the second holding mechanism 340. FIG.
FIG. 22 is a diagram showing a relationship between the holding groove 332 of the first holding mechanism 330 and the substrate W held in the holding groove 342 of the second holding mechanism 340.
FIG. 23 is a diagram showing a relationship between a substrate W held in a holding groove 342 of a second holding mechanism 340 and a pusher 400.
FIG. 24 is an enlarged sectional view showing a part of a holder 440 of the pusher 400.
25 is a schematic side view of a posture changing mechanism 300. FIG.
26 is a schematic side view of a posture changing mechanism 300. FIG.
FIG. 27 is a schematic plan view of a posture changing mechanism 300 corresponding to the state of FIG. 25.
FIG. 28 is a schematic plan view of the posture changing mechanism 300 corresponding to the state of FIG. 26.
[Explanation of symbols]
1 substrate processing apparatus 100 carrier mounting section 200 horizontal transfer robot 300 attitude conversion mechanism 310 base 320 turntable 330 first holding mechanism 340 second holding mechanism 350 first alignment device 360 second alignment device 332, 332a, 332b, 342, 342a, 342b Holding groove 400 Pusher 500 Transfer mechanism 510 Transfer robot 520 Holding mechanism 550, 560 Lifter 600 Substrate processing unit 610 Transfer mechanism Rinsing processing unit 612a, 612b Cleaning tank 614 Void 620 Chemical processing unit 630 Rinse processing unit 640 Processing unit 650 Washing unit 660 Drying unit CB Chemical tank WB Washing tank CL Control unit C Carrier W Substrate S Energizing means

Claims (5)

A board attitude conversion device that converts the attitude of the board between a horizontal attitude and a vertical attitude,
(a) by rotating about a horizontal axis, the attitude of a virtual reference plane passing through the horizontal axis changes between a horizontal attitude and a vertical attitude,
(b) driving means for rotating the rotating body,
(c) a first pair of first members that are provided on one surface of the rotating body that holds the substrate, rotate in conjunction with the rotating body, and hold the substrate in a horizontal position when the reference surface is in a horizontal position. Holding means;
(d) provided on one surface of the rotating body holding the substrate, having a plurality of V-shaped holding grooves, rotating in conjunction with the rotating body , and when the reference plane is in a vertical posture. A pair of second holding means for holding the substrate in a vertical posture,
(e) changing the relative distance between the first holding means and the second holding means in a direction substantially parallel to the reference plane, and holding the substrate held in a horizontal posture by the first holding means; Translation means for relatively moving the first holding means and the second holding means to switch between a state in which the means is in contact with a V-shaped holding groove and a state in which the means is not in contact with the V-shaped holding groove;
(f) changing the relative distance between the first holding means and the second holding means in a direction substantially orthogonal to the reference plane, and holding the substrate held in the vertical posture by the second holding means; Orthogonal moving means for relatively moving the first holding means and the second holding means to switch between a state of contacting the means and a state of not contacting the means;
A substrate attitude conversion device comprising: The substrate posture changing device according to claim 1 ,
The first holding means and the second holding means are capable of holding a plurality of substrates,
(g) first aligning means provided on one surface of the rotating body for holding the substrate, and extruding and aligning the ends of the plurality of substrates in a direction from the second holding means toward the first holding means;
The substrate attitude conversion device further comprising: The substrate posture changing device according to claim 2 ,
(h) second aligning means provided on one surface of the rotating body for holding the substrate and aligning ends of the plurality of substrates held by the first holding means;
The substrate attitude conversion device further comprising: The substrate posture changing device according to claim 3 ,
The first holding means includes:
(b-1) an arrangement of first holding grooves for holding a plurality of substrates before processing;
(b-2) an arrangement of second holding grooves for holding the plurality of substrates after the processing,
The second holding means,
(c-1) an arrangement of third holding grooves for holding a plurality of substrates before processing,
(c-2) an arrangement of fourth holding grooves for holding a plurality of substrates after processing. The substrate posture changing device according to claim 4 ,
The first holding means forms an array of the first holding grooves and an array of the second holding grooves on different surfaces,
The second holding means forms the arrangement of the third holding grooves and the arrangement of the fourth holding grooves on different surfaces,
(i) first rotating means for rotating the first holding means so as to switch and orient the arrangement of the first holding grooves and the arrangement of the second holding grooves in a direction facing a plurality of substrates; ,
(j) second rotating means for rotating the second holding means so as to switch and orient the arrangement of the third holding grooves and the arrangement of the fourth holding grooves in a direction facing a plurality of substrates; ,
The substrate attitude conversion device further comprising:

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