JP3437730B2 - Substrate processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing a substrate using a plurality of processing units when manufacturing a glass substrate or the like (hereinafter referred to as "substrate") used for manufacturing a semiconductor substrate or a liquid crystal display. The present invention relates to a substrate processing apparatus for performing

[0002]

2. Description of the Related Art As an example of a substrate processing apparatus that processes a substrate in a plurality of processing sections, there is a substrate processing apparatus that performs chemical treatment such as etching or resist film peeling on the surface of the substrate.
In such a substrate processing apparatus, a multi-tank type substrate processing apparatus is provided with a chemical solution tank storing a chemical solution and a pure water cleaning tank storing pure water, and the substrate is sequentially immersed in the chemical solution tank and the pure water cleaning tank. Some substrates are processed (hereinafter, the chemical solution tank and the pure water cleaning tank are simply referred to as "chemical solution / pure water cleaning tank"). Further, such a substrate processing apparatus also includes a drying chamber for performing a drying process on the substrate that has been subjected to the final pure water cleaning process.

On the other hand, among the substrate processing apparatuses, as a single tank type substrate processing apparatus, the chemical solution and the pure water are sequentially and alternately supplied to one chemical solution / pure water cleaning tank to sequentially and alternately supply the chemical solution in the chemical solution / pure water cleaning tank. There is also a method in which the chemical solution treatment and the pure water cleaning treatment are carried out without exposing the substrate to the air by sequentially and alternately substituting pure water with pure water.
In addition, such a substrate processing apparatus may be provided with a drying chamber for performing a drying process on the substrate that has been subjected to final deionized water cleaning, or may be subjected to a drying process in the one chemical liquid / deionized water cleaning tank (hereinafter referred to as "drying process"). , Chemical solution treatment, pure water cleaning treatment, and drying treatment are simply referred to as "treatment".)

The substrate processing apparatus as described above has a transfer robot for transferring the substrate to a processing tank or a drying chamber. The substrate holding unit of the transfer robot holds the processed substrate. Each time, the chemical liquid or pure water attached to the substrate is attached. However, even if the substrate is slightly contaminated, the quality of the substrate is greatly affected. Therefore, the holding portion of the transfer robot needs various measures to prevent the substrate from being contaminated.

Therefore, the substrate processing apparatus is provided with a mechanism for cleaning and drying the holding part, and the holding part that has been cleaned and dried is always used to hold the substrate and carry it.

[0006]

However, if the substrate processing apparatus is provided with a mechanism for cleaning and drying the holding portion, the entire substrate processing apparatus becomes large and the apparatus itself becomes complicated. I will end up. Further, if the holding unit is cleaned every time the substrate is held, the throughput will be reduced.

Therefore, the present invention has been made in view of the above-mentioned problems, and by eliminating the need for cleaning and drying the holding portion of the transfer robot, the mechanism of the substrate processing apparatus is not complicated and the apparatus An object of the present invention is to provide a substrate processing apparatus which can be downsized and whose throughput can be improved.

[0008]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for subjecting a substrate to a predetermined series of treatments, which comprises a liquid chemical treating section for subjecting the substrate to a liquid chemical treatment, and washing the substrate with pure water.
A pure water cleaning processing unit that performs a cleaning process and a drying process on the substrate
A plurality of processing units including a drying unit for applying, and first and second convey means for conveying the substrate between the plurality of processing units, its said first and second conveying means
Each of them is a group of holding surfaces that contact and hold the substrate.
With a holding part, and depending on the processing stage of the substrate to be received
And a switching means for switching the plurality of holding surface groups,
Each of the plurality of processing units has a delivery unit that delivers the holding surface group and the substrate, and the plurality of holding surface groups
Holds only the substrate with a specific surface state,
The processed substrate is stored in the first transfer means.
The substrate after being received by the holding surface group and subjected to the pure water cleaning treatment is
It is received by the holding surface group included in the second conveying means .

According to a second aspect of the present invention, there is provided the substrate processing apparatus according to the first aspect , wherein the first transfer means is the chemical liquid processing.
A first holding surface group that holds only the rear substrate and a dry substrate
A second holding surface group for holding only the plate, and the second holding surface group
The transfer means holds only the substrate after the pure water cleaning process.
The third holding surface group and the fourth holding surface that holds only the substrate in a dry state.
And a holding surface group .

A third aspect of the present invention is the substrate processing apparatus according to the second aspect , wherein the delivery means of the chemical liquid processing section is a front
The substrate after the chemical treatment is passed only to the first holding surface group,
The delivery means of the pure water cleaning processing unit is the third holding surface group.
Deliver the substrate after pure water cleaning treatment to
Part of the delivery means is in a dry state only on the fourth holding surface group.
Pass the substrate of .

The invention of claim 4 is the same as claims 1 to 3.
The substrate processing apparatus according to any one of the above, wherein the chemical liquid processing unit
And the deionized water cleaning processing section and the drying processing section are arranged in a predetermined direction, and the first and second conveying means are mutually arranged.
Guided by linear guide means arranged in parallel.
The substrate is conveyed in the predetermined direction by .

According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged above and below each other. Are arranged in parallel with.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and the guiding means of the first and second conveying means are arranged in a stepwise manner. They are arranged in parallel.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the predetermined direction is a horizontal direction, and between the guide means of the first and second transfer means. The plurality of processing units are arranged.

An eighth aspect of the present invention is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the delivery means is an elevating means for elevating and lowering the substrate.

An invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 8, wherein the holding portion is
A pair of rotation axes parallel to each other, which are parallel to each other,
It is attached along each of the rotation axes of
And a pair of holding plates serving as holding surfaces,
The respective holding surfaces of the holding plates are paired to form
It is one holding surface group of a plurality of holding surface groups,
The outer edge portion is in contact with the one holding surface group and the
The lines are oriented so that they are oriented in substantially the same direction as the pair of rotation axes.
The substrate is held, and the switching means holds the pair of holding plates.
Means for respectively rotating about the pair of rotation axes
Is .

According to a tenth aspect of the present invention, a substrate is provided with a predetermined series of
A substrate processing apparatus for performing processing, wherein the substrate is treated with a chemical solution.
The chemical liquid processing part that performs the cleaning process and the pure water cleaning process that cleans the substrate.
Water cleaning processing section and drying processing section that performs drying processing on the substrate
And a plurality of processing units including
First and second transporting means for transporting the substrate by
And the first transfer means is held in contact with the substrate.
A holding portion having three or more pairs of holding surfaces,
Switching means for switching the upper holding surface group, and
The second transfer means is a pair or more for holding and holding the substrate.
Holding part having a holding surface group, and one or more pairs of holding surface groups
Switching means for switching between the plurality of processing units.
Each is a transfer that transfers the holding surface group and the substrate.
Means for holding the three or more pairs of holding surface groups and the one or more pairs of holding surface groups.
The holding surface group holds only the substrate with a specific surface condition.
The substrate after being held and treated with the chemical solution is transferred to the first transfer means.
Before being received only by the holding surface group provided and after the drying process.
The substrate is one of the holding surface groups provided in the second transporting means.
Received only by yourself .

[0018]

[0019]

DETAILED DESCRIPTION OF THE INVENTION

<1. First Embodiment><1.1 Overall Configuration> FIG. 1 is a perspective view showing a substrate processing apparatus 1 according to an embodiment of the present invention. Also, FIG.
FIG. 3 is a diagram schematically showing the arrangement of each component when the substrate processing apparatus 1 is viewed from the (+ X) direction toward the (−X) direction.

The substrate processing apparatus 1 is an apparatus for collectively processing a plurality of substrates W (hereinafter simply referred to as "substrate W"), and this apparatus is set in a cassette C as shown in FIG. A loading / unloading section 2 for transferring the substrate W to and from the outside of the apparatus, a transporting section 3 for receiving and transporting the substrate W loaded in the loading / unloading section 2, a process for receiving the substrate W from the transporting section 3 and performing a predetermined series of processes It is composed of a unit 4.

The carry-in / carry-out unit 2 sets the carried-in (or just before carry-out) substrates W in a cassette C and temporarily places them side by side in the Y direction. The cassette base 21 moves in the Y direction and moves in the Z direction. The transfer robot 2 that can be moved up and down and is rotatable about an axis parallel to the Z axis.
2. The protrusion 2 that pushes up the substrate W from the lower side of the cassette C placed by the transfer robot 22 and transfers it to the transfer unit 3.
3 and a cassette cleaning unit 24 for cleaning an empty cassette C.

The transfer unit 3 is movable only in the X direction, and receives the substrate W received from the protrusion 23 in the processing unit 4.
To the first transfer robot 3a and the second transfer robot 3b for returning the substrate on which the predetermined processing is completed to the protrusion 23.
The second transfer robot 3b is arranged at a position directly above the first transfer robot 3a.

The first and second transfer robots 3a and 3b
Has a pair of holding plates 31 extending in the Y direction, respectively, and holds a plurality of substrates in an upright posture side by side so as to be sandwiched between the pair of holding plates 31. The pair of holding plates 31 are attached to shafts 33 extending in the Y direction (see FIG. 2).
It is designed to rotate around these axes.

3 (a) and 3 (b) are side views of the holding plate 31 holding the substrate W as seen from the (+ Y) direction to the (-Y) direction. As shown by the arrow R1, the two holding plates 31 rotate about the shaft 33 in opposite directions by the same rotation angle, and the holding surfaces 31a and 31b, which are the front and back surfaces of the respective holding plates 31, are opposite to each other. Thus, the substrate W is held. That is,
As shown in FIG. 3A, when one of the holding plates 31 faces the substrate W when holding the substrate W, the other holding plate 31 also always holds the holding surface 31a. When one holding plate 31 faces the holding surface 31b with respect to the substrate W as shown in FIG. 3B, the other holding plate 31 also always holds the holding surface 31b toward the substrate W. It has become. Thereby, for example, the dried substrate W1 is held by using the pair of holding surfaces 31a as shown in FIG. 3A, and the substrate W2 to which the chemical solution is attached is 1 as shown in FIG. 3B.
When the pair of holding surfaces 31b is used for holding, the pair of holding plates 31 is used to hold the two substrates W1 and W2 in the two surface states without considering the adhesion of unnecessary liquid to the substrate W. Is possible.

The two holding surfaces 31a and 31b, which are the front and back surfaces of each holding plate 31, are provided with a plurality of grooves G in the Y direction so that the substrate W is held so that the normal to the principal surface of the holding plate 31 faces the Y direction. Is formed in a direction perpendicular to the
The substrate W is arranged in the state parallel to the Z plane, and then both holding plates 31 are rotated to sandwich and hold the substrate W.

Each holding plate 31 of the first and second transfer robots 3a and 3b is moved by a linear movement means 32 (having both a drive source and a guide means) extending in the X direction via a shaft 33 to X.
It is designed to move in the direction (see FIGS. 1 and 2).
Therefore, the substrate W pushed up at the protrusion 23
Will be held by the first and second transfer robots 3a and 3b and will be transferred on the processing unit 4 in the X direction.

The processing unit 4 includes a chemical liquid processing section 4a for performing chemical processing on the substrate W, a pure water cleaning processing section 4b for performing pure water cleaning processing on the substrate W, a chemical / pure water processing section 4c, and the substrate W.
It is composed of a drying processing section 4d (hereinafter collectively referred to as "processing section") for performing a drying process on the. Also,
These processing units are arranged side by side in the X direction, and the holding plates 3 of the first and second transfer robots 3a and 3b are arranged on the processing units.
1 is moving.

The chemical liquid processing section 4a is a chemical liquid tank 4 for storing the chemical liquid.
3a, and the chemical liquid tank 43a is connected to the processing liquid supply unit 44 for supplying the chemical liquid as shown in FIG. Further, the chemical liquid overflowing from the chemical liquid tank 43a is discharged from the discharge portion 45 and circulated to the chemical liquid tank 43a again through the treatment liquid supply portion 44 through the temperature adjusting means and the filtering means (not shown). Since the chemical solution tank 43a is provided with a temperature adjusting means and circulates the chemical solution, the chemical solution is treated with the chemical solution of relatively high temperature and high concentration.

The pure water cleaning processing section 4b has a pure water cleaning tank 43b. The pure water cleaning tank 43b is designed so that pure water is supplied from the lower part and pure water overflows from the upper part.
When the substrate W that has been subjected to the chemical liquid treatment in a is brought in, the chemical liquid adhering to the substrate W is washed away with pure water and removed.

The chemical / pure water cleaning processing section 4c is a single chemical /
It has a pure water cleaning tank 43c. From the lower part of the chemical / pure water cleaning tank 43c, the chemical and pure water are sequentially and alternately supplied for a predetermined time. As a result, the inside of the chemical / pure water cleaning tank 43c is alternately replaced with the chemical and pure water. Therefore, after the pure water cleaning treatment is performed in the pure water cleaning treatment tank 43b, the substrate W immersed in the chemical / pure water cleaning treatment tank 43c is subjected to the chemical treatment and the pure water cleaning treatment without touching the air. .

Since the chemical liquid and the pure water are alternately replaced in the chemical liquid / pure water cleaning tank 43c, the chemical liquid is treated with a chemical liquid having a lower temperature and a lower concentration than the chemical liquid used in the chemical liquid tank 43a. A drying chamber 43d in which the drying process is performed is provided for the drying processing unit 4d.

Further, a chemical solution tank 43a, a pure water cleaning tank 43b,
The chemical / deionized water cleaning tank 43 c is provided with a holding table 41 for holding the substrate W and a lifting means 42 for vertically moving the holding table 41.
have. Although the dry processing unit 4d also has a different form, it has an elevating means for holding the substrate W in and out of the drying chamber 43d and a holding table (not shown). As a result, each processing unit and the first and second transfer robots 3a and 3b can transfer the substrate W, and the substrate W can be subjected to the chemical treatment, the pure water cleaning treatment, and the drying treatment. It is like this.

<1.2 Operation> Next, the operation of the substrate processing apparatus 1 will be described with reference to FIGS. 1 and 4.

First, as shown in FIG. 1, the substrate W set in the cassette C is transferred from the outside of the apparatus by means such as a transfer vehicle and placed on the cassette table 21. The cassette placed on the cassette table 21 is placed on the protrusion 23 by the transfer robot 22. It should be noted that two cassettes C can be placed on the protrusion 23 at the same time.
After the cassette C is rotated 90 degrees about the axis facing the Z direction, the substrates W in the two cassettes C are simultaneously pushed up and taken out. The emptied cassette C is again gripped by the transfer robot 22 and stored in the cassette cleaning unit 24, and the cleaning process is performed while the substrate W is subjected to a predetermined series of processes.

The substrate W pushed up by the protrusion 23 is carried to the chemical solution processing section 4a as shown by an arrow P11 while being held by the first transfer robot 3a as shown in FIG. At this time, the substrate W is held by the pair of holding surfaces 31a (see FIG. 3A) of the holding plate 31 of the first transfer robot 3a.

The substrate W transferred to the chemical treatment unit 4a is transferred from the first transfer robot 3a to the holding table 41,
It is immersed in the chemical liquid inside the chemical liquid tank 43a by the elevating means 42. Here, the substrate W is subjected to the chemical treatment, and then taken out by the elevating means 42.

The substrate W taken out of the chemical liquid tank 43a is transferred again from the holding table 41 to the first transfer robot 3a.
At this time, the first transfer robot 3a receives the pair of holding surfaces 31b of the holding plate 31 (see FIG. 3B). Therefore, the chemical liquid adhering to the substrate W adheres to the holding surface 31b, but does not adhere to the holding surface 31a.

The first transfer robot 3a having received the substrate W from the chemical treatment unit 4a then conveys the substrate W to the pure water cleaning treatment unit 4b as indicated by an arrow P12, and the chemical treatment unit 4a.
Similar to a, the substrate W is transferred to the holding table 41. Then, the first transfer robot 3a moves again to the protrusion 23 in order to receive the next substrate W to be processed as shown by an arrow P14. The pure water cleaning processing unit 4b performs a pure water cleaning process on the received substrate W to wash away the chemical liquid adhering to the substrate W. Then, the substrate W is transferred to the second transfer robot 3b. At this time, the second transfer robot 3b receives the substrate W on the holding surface 31a, and pure water adheres to the holding surface 31a.

The second transfer robot 3b having received the substrate W from the pure water cleaning processing unit 4b transfers the substrate W to the chemical / pure water cleaning processing unit 4c as indicated by an arrow P13.

As described above, in the first transfer robot 3a,
The pair of holding surfaces 31 a of the holding plate 31 is used only for holding the substrate W immediately after being loaded into the substrate processing apparatus 1,
The pair of holding surfaces 31b is used only for receiving the substrate W after the chemical liquid processing in the chemical liquid processing portion 4a. Therefore, the liquid does not adhere to the holding surface 31a, and only the chemical liquid adheres to the holding surface 31b.

Upon receiving the substrate W from the second transfer robot 3b, the chemical / pure water cleaning unit 4c moves the substrate W up and down to perform another chemical liquid process and pure water cleaning process on the substrate W.
The substrate W is transferred to the second transfer robot 3b. At this time,
The second transfer robot 3b holds the substrate W by using the pair of holding surfaces 31a of the two holding plates 31. At this time, the holding surface 3
Since 1a is in contact with the substrate W transferred from the pure water cleaning processing unit 4b, pure water is adhered thereto, but pure water is also adhered to the substrate W transferred from the chemical / pure water cleaning processing unit 4c. So there is no problem.

The second transfer robot 3b transfers the substrate W received from the chemical / pure water cleaning processing section 4c to above the drying processing section 4d as shown by an arrow P15. Here, the holder of the drying processing unit 4d receives the substrate W, performs the drying process, and transfers the dried substrate W to the second transfer robot 3b again. At this time, the second transfer robot 3b moves the holding plate 31
The substrate W is received using the pair of holding surfaces 31b. That is, in the second transfer robot 3b, the holding surface 31a holds the substrate W to which the pure water has been attached after the pure water cleaning processing unit 4b and the pure water cleaning processing unit 4c perform the pure water cleaning processing. The holding surface 31b is used only for holding the dried substrate W after the drying process. The second transfer robot 3b, which has received the substrate W from the drying processing unit 4d, transfers the substrate W to the protrusion 23 and returns the substrate W to the protrusion 23 as indicated by an arrow P16. Then, the arrow P1 is received to receive the next substrate.
As shown in FIG. 7, it moves to the pure water cleaning processing unit 4b.

At the projecting portion 23, the cassette C cleaned by the cassette cleaning unit 24 is arranged by using the transfer robot 22, and the processed substrate W is stored therein (see FIG. 1). Then, the cassette C on which the processed substrate W is set is placed on the cassette table 21 and carried out to the outside of the apparatus.

<1.3 Effects> The configuration and operation of the substrate processing apparatus 1 according to the first embodiment have been described above, but the substrate processing apparatus 1 is thus configured so that the first and second transfer robots 3a, 3b and each transfer robot has two pairs of holding surfaces for holding the substrate W. Therefore, by properly using these holding surfaces 31a and 31b, each holding surface has a specific surface state. Only the substrate W can be held. As a result, it is possible to prevent the liquid or contaminants that adversely affect the substrate W from adhering without cleaning or drying the holding plate 31 itself. Further, this makes it possible to reduce the size of the device and improve the throughput.

Further, in the substrate processing apparatus 1, since the first and second transfer robots 3a and 3b are arranged vertically, the floor area occupied by the apparatus can be reduced. Further, in this substrate processing apparatus 1, since the respective processing units are arranged in the X direction and the linear moving means 32 and the elevating means 42 are uniaxial moving mechanisms, the positioning at the time of delivering the substrate W is accurately performed. It can be carried out, and quick and reliable delivery can be easily realized.

<1.4 Modification of Arrangement of Transfer Robot> FIG. 5 shows a substrate processing apparatus 1 according to the first embodiment of the present invention.
FIG. 3 is a view showing a modified arrangement (reference numeral 3c in the drawing) of the second transfer robot 3b in FIG. 3 and is a view corresponding to FIG. 2 in the first embodiment.

The second transfer robot 3c is different from the second transfer robot 3b shown in FIG.
The transfer robot 3a is arranged in parallel to the linear movement means 32 of the transfer robot 3a (in parallel to the step). Therefore, the shaft 3 to which the holding plate 31 of the second transfer robot 3c is attached
3 is longer than that of the first transfer robot 3a.

In this way, by arranging the first and second transfer robots 3a and 3c in parallel in different steps, the vertical distance between the holding plates 31 of both transfer robots is set to the substrate processing apparatus 1 of the first embodiment. It can be smaller than. Further, the elevating means 42s provided in each processing unit can be held lower than that of the first embodiment. As a result, this substrate processing apparatus is held lower in the height direction than the substrate processing apparatus 1 of the first embodiment. This overcomes the problem that the total height of the apparatus is high due to having two transfer robots.
Further, the transport path in the height direction of the substrate W is also suppressed to be short, and the throughput is also improved.

Further, in the first embodiment, the number of transfer robots is two, but this is merely two for the sake of convenience of explanation, and of course, it may be three or more. In this case, if a transfer robot that receives a substrate having a specific surface state taken out from a processing unit of a specific type is determined to be a specific one (there may be two or more), cleaning of a portion holding the substrate W is performed. -It is possible to eliminate the need for drying and obtain the above effect. Depending on the processing content, an arbitrary transfer robot may receive it. Even in such a case, the throughput can be improved as the number of transfer robots increases.

<1.5 Modified Example of Processing Unit> FIG. 6 is an operation diagram showing a modified example of the configuration of the processing unit 4 of the substrate processing apparatus 1 according to the first embodiment. In this modification, the processing unit 4 is composed of a chemical solution processing section 4e that performs only chemical solution processing, a pure water cleaning processing section 4f that performs only pure water cleaning processing, and a drying processing section 4d that performs drying processing. The chemical liquid processing unit 4e has a chemical liquid tank as in the first embodiment. Further, the pure water cleaning processing section 4f also has a cleaning tank in which only pure water is supplied and stored. In addition,
The carry-in / carry-out unit 2 and the carrying unit 3 are the same as those in the first embodiment.

In this substrate processing apparatus, the first transfer robot 3a receives the substrate W from the protrusion 23 using the pair of holding surfaces 31a of the holding plate 31, and transfers the substrate W as shown by an arrow P21 to carry out the chemical treatment section 4e. Pass the substrate W to. The substrate W is dipped and processed in the chemical solution tank of the chemical solution processing unit 4e, and then the first
The substrate W is transferred to the transfer robot 3a, but at this time, the first transfer robot 3a holds the substrate W by using the pair of holding surfaces 31b. The first transfer robot 3a transfers the substrate W to the pure water cleaning processing unit 4f as shown by an arrow P22, and receives the next substrate again as shown by an arrow P23 so as to receive the protrusion 23 again.
Move to.

The second transfer robot 3b receives the substrate W, which has been subjected to the pure water cleaning process, from the pure water cleaning processing section 4f using the pair of holding surfaces 31a of the holding plate 31, and transfers the substrate W as shown by an arrow P24. And pass it to the drying processing section 4d. The dried substrate W is transferred to the second transfer robot 3b again, and is transferred to the protrusion 23 as indicated by an arrow P25. At this time, the second transfer robot 3b transfers the substrate W using the pair of holding surfaces 31b. When the substrate W is transferred to the protrusion 23, the substrate W is moved to the pure water cleaning processing section 4f to receive the next substrate as shown by an arrow P26.

As described above, in this modification, the pair of holding surfaces 31a of the pair of holding plates 31 of the first transfer robot 3a are used to transfer the unprocessed substrate W, and the pair of holding surfaces 31a. 31b is used to convey the substrate W after the chemical solution treatment. In addition, the pair of holding surfaces 31a of the pair of holding plates 31 of the second transfer robot 3b is used to transfer the substrate W after the pure water cleaning process, and the pair of holding surfaces 31b is the substrate after the drying process. It is used to convey W.

<2. Second Preferred Embodiment> FIG. 7 shows a substrate processing apparatus according to a second preferred embodiment of the present invention as viewed from the (+ X) direction toward the (-X) direction as in the first preferred embodiment shown in FIG. 2 is a diagram showing only the same components as those in FIG. Further, FIG. 8 is a diagram showing a holder 34 attached in place of the holding plate 31 in the first transfer robot 3d in the first embodiment, and FIG. 9 is similarly attached to the second transfer robot 3e. It is a figure which shows the holding arm 35 which is doing. Further, FIG. 10 is a diagram showing the operation of this substrate processing apparatus.

As shown in FIG. 7, the first transfer robot 3d
In place of the two holding plates 31 in the first embodiment, the two are holding bodies 34 of two equilateral triangular prisms extending in the Y direction. That is, in the holding plate 31, the holding surface 3 which is the front and back surfaces 2
Although 1a and 31b are switched according to the surface state of the substrate W, the holding surfaces 34a, 34b and 34c, which are the three side surfaces of the triangular prism, play the role in this embodiment. This holder 34 is moved from the (+ Y) direction to (-
FIG. 8 shows a state as viewed in the Y) direction.
Each of the three holding surfaces of the two holding bodies 34 is configured to rotate around the shaft 33 in the direction of the arrow R2 to be switched as a pair, similarly to the first embodiment, and each holding surface is retained. A plurality of grooves G are formed on the surface so that the substrate W can be held in an upright posture.

The second transfer robot 3e is provided so as to face the first transfer robot 3d with the processing unit 4 interposed therebetween, and a pair of shafts 33 extending above the elevating means 42s of each processing section extends. A holding arm 35 is attached to each of them. This holding arm 35 (-
FIG. 9 shows a state of looking from the (Y) direction to the (+ Y) direction, and the holding arm 35 opens and closes as shown by an arrow R3 to hold and hold the substrate W. There is.

The processing unit 4 of this substrate processing apparatus is shown in FIG.
As shown in 0, the first chemical liquid processing unit 4g, the first pure water cleaning processing unit 4h, the second chemical liquid processing unit 4i, and the second pure water cleaning processing unit 4
j and the drying processing unit 4d are arranged in this order from the (−X) direction to the (+ X) direction, and the chemical liquid and pure water are stored in each chemical liquid processing unit and each pure water cleaning processing unit. ing. The chemical liquids stored in the first and second chemical liquid processing units 4g and 4i are of the same kind or mixed with each other without causing a problem (such as generating no harmful gas). Moreover, other components are the same as those in the first embodiment.

The operation of this substrate processing apparatus will be described below with reference to FIG.

First, the first transfer robot 3d receives the substrate W from the protrusion 23 using the pair of holding surfaces 34a, transfers the substrate W as shown by an arrow P31, and transfers it to the first chemical liquid processing section 4g. Then, as shown by arrows P32, P33, P34, and P35, the pair of holding surfaces 3 are sequentially arranged from the first chemical liquid processing portion 4g.
The first pure water cleaning processing unit 4h receives the substrate W by using 4b.
And a pair of holding surfaces 34 from the first pure water cleaning processing section 4h.
The substrate W is received using c and is transferred to the second chemical liquid processing unit 4i, the substrate W is received from the second chemical liquid processing unit 4i using the pair of holding surfaces 34b, and is transferred to the second pure water cleaning processing unit 4j. The substrate W is received from the pure water cleaning processing unit 4j using the pair of holding surfaces 34c and passed to the drying processing unit 4d. After that, the process returns to the first chemical liquid processing unit 4g as shown by the arrow P36.

On the other hand, the second transfer robot 3e receives the substrate W from the drying processing section 4d, transfers it to the projecting portion 23 as shown by an arrow P37, and returns it to its original position as shown by an arrow P38.

By carrying out such an operation, the holding surface 34a of the holding body 34 comes into contact only with the unprocessed substrate W, the holding surface 34b comes into contact only with the substrate W to which the chemical solution is attached, and the holding surface 34c is pure. Only the substrate W to which water adheres will come into contact. Further, since the chemicals of the first and second chemical liquid processing sections 4g and 4i are of the same kind or can be mixed, there is no problem even if the holding surface 34b is used to receive the substrate W from these processing sections. Therefore, similarly to the first embodiment, it is not necessary to wash and dry the holding body 34 and the holding arm 35, and the device can be downsized and the throughput can be improved.

In this embodiment, the first and second
Since the transfer robots 3d and 3e can be arranged at a sufficient distance from each other, the position of each transfer robot can be easily determined, and the distance between the substrate W held by the holding body 34 and the holding arm 35 can be reduced. Therefore, the overall height of the device can be kept low and the throughput can be improved by a short vertical movement.

<3. Third Embodiment> FIG. 11 shows a holder 3 of a substrate processing apparatus according to a third embodiment of the present invention.
6 is a diagram showing 6 and FIG. 12 is a diagram showing an operation.

In this substrate processing apparatus, as compared with the substrate processing apparatus 1 of the first embodiment, the first transfer robot 3f is replaced with a holding plate 31 and is held by a square prism having a square bottom surface as shown in FIG. It is different in that it has a body 36, and the processing unit 4 has the same form as that of the second embodiment. However, the chemical liquids stored in the first and second chemical liquid processing portions 4g, 4i must not be mixed with each other such as acid and alkali.

As shown in FIG. 11, since the holder 36 is a quadrangular prism, it has more pairs of holding surfaces than the holder 34 in the second embodiment. That is, each holding body 36 has four holding surfaces 36a, 36b, 36c, 36d, and both holding bodies 36 rotate in opposite directions about the shaft 33 as shown by an arrow R4. Corresponding holding surfaces of both holding members 36 form a pair to hold the substrate W. Therefore, the substrates W having four different surface states can be held.

Further, the second transfer robot 3b has a pair of holding plates 31 having two holding surfaces 31a and 31b as in the first embodiment.

Such first and second transfer robots 3
As shown in FIG. 12, the operation of the substrate processing apparatus provided with f and 3b is as follows.
Receives the substrate W using the pair of holding surfaces 36a, conveys it as shown by an arrow P41, and transfers it to the first chemical liquid processing section 4g. Hereinafter, as indicated by arrows P42, P43, and P44, the first chemical solution treatment unit 4g is conveyed to the first pure water cleaning treatment section 4h using the holding surface 36b, and the first pure water cleaning treatment section 4h is used to convey the second chemical solution. It is conveyed to the processing section 4i using the holding surface 36c,
It is conveyed from the second chemical liquid processing unit 4i to the second pure water cleaning processing unit 4j using the holding surface 36d. After that, in order to receive the next substrate, it moves to the protrusion 23 as shown by an arrow P45.

Next, the second transfer robot 3b moves to the arrow P4.
6, the substrate W is transported from the second pure water cleaning processing section 4j to the drying processing section 4d using the holding surface 31a as shown in P47,
It is conveyed from the drying processing section 4d to the protrusion 23 using the holding surface 31b. Then, to receive the next substrate, arrow P
As indicated by 48, the second pure water cleaning processing unit 4j is moved to.

With the above-described transfer operation, the first and second transfer robots 3 can receive the substrate W from each processing section.
Since it is performed on different holding surfaces of f and 3b,
Also, the substrate W can be safely handled without cleaning the holding body 36 or the holding plate 31 even if the chemical liquids stored in the second chemical liquid processing units 4g and 4i should not be mixed. Of course, as in the first embodiment,
It is possible to reduce the size of the device and improve the throughput.

<4. Modifications> Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.

For example, although the number of transfer robots is two in the above embodiment, it may be three or more as described above. Further, the number of processing units of the processing unit 4 is not limited to the above embodiment. These are appropriately determined according to the processing content.

Further, the holding plate 31 and the holding bodies 34, 36 of the transfer robot are not limited to those in the above-mentioned embodiment, and may be in any form as long as they can transfer substrates having a plurality of surface states. Good. For example, a regular hexagonal column-shaped holder may be used, the distance between the pair of holders may be changed, and the six side surfaces may be switched and held. The distance between the pair of holding bodies can be changed because the distance between the holding bodies is made larger than the diameter of the substrate in order to move the holding bodies below the substrate.

Of course, the processing of the next substrate may be started before the processing of the substrate W is completed.

Further, in the transfer robot having the holding surfaces such as the holding plate 31 and the holding bodies 34, 36, the substrates W having different surface states may be held by the same holding surface if possible. The substrates W having the same surface state may be held on different holding surfaces.

In addition, the processing contents and the transfer of the substrate W to the transfer robot can be appropriately changed.

[0076]

As described above, in the inventions according to claims 1 and 10 , each of the plurality of transfer means transfers the substrate only from the delivery means of a part of the plurality of processing parts which is assigned in advance. Thus, each of the transfer means can transfer only the substrate having a specific surface state after the predetermined processing. As a result, it is possible to eliminate the need for cleaning and drying the holding unit of each transfer unit that holds the substrate, and it is possible to reduce the size of the substrate processing apparatus and improve the throughput. Also, switch the holding surface group to hold the substrate.
Since it holds, it does not contaminate substrates with different surface conditions
It can be easily held by one carrying means.

According to the third aspect of the present invention, since the transfer means of each processing section transfers the substrate to only one specific transfer means, each transfer means transfers only the substrate having the specific surface condition after the predetermined processing. Will be done. As a result, as in the first aspect of the present invention, it is possible to eliminate the need for cleaning and drying the holders for holding the substrates of the respective transfer means, and to reduce the size of the substrate processing apparatus and improve the throughput. You can

In a fourth aspect of the present invention, a plurality of processing sections are arranged in a predetermined direction, and a plurality of transfer means transfers the substrate.
Since the substrate is transported in the predetermined direction, the substrate can be transported to each processing unit with a simple structure.

[0079]

According to the invention of claim 5, the first and second aspects are provided.
Since the guide means of the transfer means are arranged vertically in parallel, the floor area occupied by the substrate processing apparatus can be kept small.

According to the invention of claim 6, the first and second aspects are provided.
Since the guide means of the second transfer means are arranged in parallel in different steps, the vertical distance between the substrate held by the first transfer means and the substrate held by the second transfer means can be reduced. The overall height of the substrate processing apparatus can be kept low, and the distance that the substrate must be moved in order to receive the substrate from each processing unit can be shortened, so that the throughput can be improved.

According to the invention of claim 7, the first and second aspects are provided.
Since a plurality of processing parts are arranged between the guide means of the conveying means, the arrangement of each conveying means can be easily designed in addition to the effect of the invention described in claim 6.

According to the eighth aspect of the invention, since the delivery means is the elevating means for raising and lowering the substrate, the substrate can be accurately positioned when delivering the substrate.

[0084]

In the invention according to claim 9 , since the holding surfaces, which are the front and back surfaces of the pair of holding plates, are switched to hold the substrate,
The two surface states of the substrate can be easily held without contamination.

[0086]

[Brief description of drawings]

FIG. 1 is a perspective view of an entire substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view showing the configuration of the substrate processing apparatus shown in FIG.

FIG. 3 is a side view showing a holding plate.

FIG. 4 is a diagram showing an operation of the substrate processing apparatus shown in FIG.

5 is a side view showing a modification of the substrate processing apparatus shown in FIG.

6 is a diagram showing an operation of another modification of the substrate processing apparatus shown in FIG.

FIG. 7 is a side view showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 8 is a side view showing a holding body.

FIG. 9 is a side view showing a holding arm.

10 is a diagram showing an operation of the substrate processing apparatus shown in FIG.

FIG. 11 is a side view showing a holding body.

FIG. 12 is a diagram showing an operation of the substrate processing apparatus according to the third embodiment of the present invention.

[Explanation of symbols]

1 Substrate processing equipment 3a, 3d, 3f First transfer robot 3b, 3c, 3e Second transfer robot 4 processing units 4a Chemical processing part 4b Pure water cleaning unit 4c Chemical / pure water cleaning processing section 4d Drying processing section 4e Chemical processing unit 4f Pure water cleaning processing section 31 holding plate 31a, 31b holding surface 32 Direct-acting means 33 axes 34 holder 34a, 34b, 34c Holding surface 36 Holder 36a, 36b, 36c, 36d Holding surface 41 holding table 42 Lifting means G groove R1, R2, R3 arrows W board

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Claims (10)

(57) [Claims] 1. A substrate processing apparatus for performing a predetermined series of processing on a substrate, comprising: a chemical liquid processing unit for performing chemical liquid processing on the substrate;
A pure water cleaning processing unit that performs a water cleaning process and a drying process on the substrate.
A plurality of processing units including a drying processing unit that performs processing, and a first transporting unit that transfers the substrate between the plurality of processing units .
And a second conveying means, provided with, each of the first and second transport means, holding with a plurality of holding surface group which holds in contact with the substrate
A holding part and the plurality of holding surfaces depending on the processing stage of the substrate to be received.
Switching means for switching groups, each of the plurality of processing units has a delivery means for delivering the holding surface group and the substrate , and each of the plurality of holding surface groups has a specific surface state. Board of
Only the substrate is held, and the substrate after the chemical solution treatment is not included in the first transfer means.
The substrate, which has been received by the holding surface group and has been subjected to the pure water cleaning treatment, has the second transfer means
The substrate processing apparatus is received by the holding surface group . 2. The substrate processing apparatus according to claim 1, wherein the first transporting unit holds only a first holding surface group that holds only the substrate after the chemical treatment and a substrate that is in a dry state. With a second holding surface group
For example, the second conveying means, third holding surface group which holds only the substrate after the pure water cleaning process
And a fourth holding surface group that holds only the dried substrate.
A substrate processing apparatus, characterized in that that. 3. The substrate processing apparatus according to claim 2 , wherein the delivery means of the chemical liquid processing unit is one of the first holding surface group.
The substrate after the chemical treatment, and the delivery means of the pure water cleaning unit is the third holding surface.
The substrate after the pure water cleaning process is delivered only to the group, and the delivery means of the drying processing unit is configured to operate the substrate of the fourth holding surface group.
The substrate processing apparatus is characterized in that the substrate in a dry state is handed over . 4. The group according to any one of claims 1 to 3.
A plate processing apparatus, wherein the chemical solution processing section, the pure water cleaning processing section, and the drying processing section
And are arranged in a predetermined direction, and the first and second conveying means are arranged in parallel with each other.
By being guided by the linear guide means
A substrate processing apparatus, which conveys the substrate in a predetermined direction . 5. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged in parallel with each other in a vertical direction. A substrate processing apparatus characterized in that. 6. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the guide means of the first and second transfer means are arranged in parallel to each other. A substrate processing apparatus characterized in that. 7. The substrate processing apparatus according to claim 4, wherein the predetermined direction is a horizontal direction, and the plurality of processing units are provided between the guide means of the first and second transfer means. A substrate processing apparatus, wherein: 8. The substrate processing apparatus according to claim 1 , wherein the delivery unit is an elevating unit that elevates and lowers the substrate. 9. The substrate processing apparatus according to claim 1 , wherein the holding unit includes a pair of rotating shafts that are parallel to each other and that face in a horizontal direction, and the pair of rotating shafts. Mounted along the table
And a pair of holding plates each having a back surface serving as a holding surface, and each holding surface of the pair of holding plates forms a pair.
Is a holding surface group of the plurality of holding surface groups, and the outer edge portion of the substrate is in contact with the one holding surface group to
The normal line of the main surface of is oriented in the same direction as the pair of rotation axes
The substrate is held as described above, and the switching means causes the pair of holding plates to move to the pair of rotation shafts.
A substrate processing apparatus, characterized in that it is a means for rotating each of them around a center . 10. A substrate treatment for subjecting a substrate to a predetermined series of treatments.
A management apparatus, and chemical treatment unit for performing the chemical treatment to the substrate, pure the substrate
A pure water cleaning processing unit that performs a water cleaning process and a drying process on the substrate.
A plurality of processing units including a drying processing unit for performing processing, and a first transporting unit between the plurality of processing units.
And a second transfer means, wherein the first transfer means has three or more pairs of holding surface groups for contacting and holding the substrate.
And a switching means for switching the three or more pairs of holding surface groups.
For example, the second conveying means, having a one or more pairs of holding surface group which holds in contact with the substrate
And a switching means for switching the one or more pairs of holding surface groups.
For example, each of the plurality of processing units, comprising a delivery means for performing transfer of the substrate and the holding surface group, the 3 or more pairs of holding surface group and said one or more pairs of the holding surface group
Respectively hold only the substrate having a specific surface state, and the substrate after the chemical treatment is provided in the first transfer means.
The substrate that has been received only by the holding surface group and that has undergone the drying process is provided in the second transfer unit.
A substrate processing apparatus, wherein the substrate processing apparatus is received only by the holding surface group .