JPH11163089A - Wafer attitude converter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a converter for converting the attitude of a wafer between horizontal attitude and vertical attitude while suppressing production of contaminant, e.g. particles. SOLUTION: An attitude converting mechanism 300 comprises a base 310, a rotary base 320, a first holding mechanism 330, and a second holding mechanism 330. A plurality of wafers are held in a plurality of holding grooves in first and second holding mechanisms and the attitude thereof is converted between horizontal attitude and vertical attitude by interlocking with rotation of the rotary base 320 about an axis A30. The first holding mechanism 330 can move in the vertical direction to bring about noncontact state with the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask,
The present invention relates to an apparatus for changing the attitude of a substrate such as an optical disk substrate (hereinafter referred to as a “substrate”).

[0002]

2. Description of the Related Art Conventionally, in order to perform processing on a plurality of substrates, there is a substrate processing apparatus that carries in a plurality of substrates housed in a carrier, performs the processing, and then unloads the substrates. In such a substrate processing apparatus, the substrate processing is sequentially performed in each of the linearly arranged processing units. In these substrate processing apparatuses, the plurality of substrates are each processed in a vertical posture, and the substrates are processed in a state where they are arranged and held in parallel with each other.

In a conventional carrier, as in the case of processing in a substrate processing apparatus, a plurality of substrates are transported in a state of being vertically arranged in parallel with each other. There was no need to convert.

However, due to the recent increase in the size of the substrates, the substrates are often transported in a horizontal posture when being transported. This means that when transported in a vertical position,
This is because the substrates oscillate in the transport carrier, causing the substrates to come into contact with each other and collide with each other, thereby causing generation of contaminants.

On the other hand, in the substrate processing apparatus, it is preferable that the substrate is held in a vertical position for the sake of processing performed inside the apparatus. Therefore, it is necessary to convert the postures of the plurality of substrates between a horizontal posture and a vertical posture.

[0006]

However, in such a posture changing mechanism, contaminants such as particles are generated due to rubbing or the like at the time of changing the posture or at the time of delivery of the substrate, or the contaminants adhere to the substrate. There is such a problem. When such contaminants adhere to the substrate,
There are adverse effects such as a decrease in the processing quality of the substrate.

Accordingly, the present invention has been made in view of the above problems, and has as its object to provide a substrate posture changing device which converts the posture of a substrate between a horizontal posture and a vertical posture, and in which contaminants such as particles are hardly generated. Aim.

[0008]

According to a first aspect of the present invention, there is provided a substrate posture changing device for converting a posture of a substrate between a horizontal posture and a vertical posture. , (A) by rotating about a horizontal axis,
A rotating body whose posture of the virtual reference plane passing through the horizontal axis changes between a horizontal posture and a vertical posture, (b) driving means for rotating the rotating body, and (c) a substrate of the rotating body. It is provided on one surface of the holding side, and rotates in conjunction with the rotating body,
First holding means for holding the substrate in a horizontal position when the reference surface is in a horizontal position, and (d) provided on one surface of the rotating member for holding the substrate, and rotating in conjunction with the rotating member. And
And a second holding means for holding the substrate in a vertical position when the reference plane is in a vertical position.

According to a second aspect of the present invention, there is provided the substrate attitude changing apparatus according to the first aspect, wherein (e) the first holding means and the second holding means in a direction substantially parallel to the reference plane. Parallel moving means for relatively moving the first holding means and the second holding means so as to change a relative distance from the first holding means and the second holding means, wherein the parallel movement is performed in a state where the reference plane is in a horizontal posture. By means of said first and second
By relatively moving the holding means, the substrate held in the horizontal position by the first holding means is switched between a state in which the substrate is in contact with the second holding means and a state in which it is not.

According to a third aspect of the present invention, there is provided the substrate attitude converting apparatus according to the first or second aspect, wherein (f) the first position in a direction substantially perpendicular to the reference plane.
Orthogonal moving means for relatively moving the first holding means and the second holding means so as to change the relative distance between the holding means and the second holding means, wherein the reference plane is vertically oriented; In this state, the first and second holding means are relatively moved by the orthogonal moving means, whereby the substrate held in the vertical position by the second holding means comes into contact with the first holding means. It is characterized by switching between a state and a state not contacting.

According to a fourth aspect of the present invention, there is provided a substrate attitude converting apparatus according to any one of the first to third aspects, wherein the first holding means and the second holding means hold a plurality of substrates. (G) provided on one surface of the rotating body that holds the substrate, and extruding and aligning the ends of the plurality of substrates in the direction from the second holding means toward the first holding means. 1 alignment means.

According to a fifth aspect of the present invention, there is provided the substrate attitude changing apparatus according to the fourth aspect, wherein (h) the first holding means is provided on one surface of the rotating body which holds the substrate. To align the ends of the plurality of substrates held in the second
And arranging means.

According to a sixth aspect of the present invention, in the substrate attitude changing apparatus according to the fifth aspect, the first holding means (b-1) holds a plurality of substrates before processing. An array of holding grooves, and (b-2) an array of second holding grooves for holding the plurality of substrates after the processing, wherein the second holding means includes (c-1)
An array of third holding grooves for holding a plurality of substrates before processing, and (c)
-2) arrangement of fourth holding grooves for holding a plurality of substrates after processing.

According to a seventh aspect of the present invention, in the substrate attitude changing apparatus according to the sixth aspect, the first holding means includes an array of the first holding grooves and an array of the second holding grooves. Are formed on different surfaces, and the second holding means forms the arrangement of the third holding grooves and the arrangement of the fourth holding grooves on different surfaces, and (i) the direction in which the plurality of substrates are opposed to each other. First rotating means for rotating the first holding means so as to switch and orient the arrangement of the first holding grooves and the arrangement of the second holding grooves, and (j) in a direction opposed to the plurality of substrates, The third
Rotating the second holding means so as to switch and align the arrangement of the holding grooves and the arrangement of the fourth holding grooves.
And rotating means.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

<Outline of Apparatus> FIGS. 1, 2 and 3
1 is a diagram showing a substrate processing apparatus 1 of the present embodiment, and an outline of the apparatus will be described with reference to these drawings. FIG. 1 is a plan view illustrating a configuration of the substrate processing apparatus 1 of the present embodiment, and FIG. 2 is a perspective view illustrating a partial configuration of the substrate processing apparatus 1.
FIG. 3 is a side view showing the internal configuration of the substrate processing apparatus 1 viewed from the direction of the arrow AP (see FIG. 2).

As shown in these figures, the substrate processing apparatus 1
Is a carrier mounting unit 100, a horizontal transfer robot 200,
Attitude conversion mechanism 300, pusher 400, transport mechanism 50
0, and a substrate processing unit 600.

On the carrier mounting portion 100, a plurality of substrates W
Is loaded, and the substrate W stored in the carrier C is loaded and unloaded to and from the outside of the substrate processing apparatus 1. At this time, the plurality of substrates W are held in the carrier C in a horizontal posture.

The horizontal transfer robot 200 is an articulated transfer robot, and includes a lifting shaft 22 communicating with the inside of a base 210.
A first arm 230 having one end connected to an upper end of the elevating shaft 220 above the base 210;
0, a second arm 240 having one end connected to the other end, and a substrate support hand 25 connected to the other end of the second arm 240.
0, and each unit is driven as follows by an internal drive mechanism (not shown).

As shown in FIG. 2, the elevating shaft 220 is vertically movable (Z direction), and the first arm 230 is connected to the elevating shaft 220 at a rotational axis A.
1 can be rotated (turned) at an arbitrary angle in a substantially horizontal plane. Similarly, the second arm 240 is substantially in a horizontal plane around the rotation axis A2 at the connection portion with the first arm 230, and the substrate support hand 250 is around the rotation axis A3 at the connection portion with the second arm 240. Each can be rotated (turned) at an arbitrary angle. And, by such a mechanism, the horizontal transfer robot 2
00 is movable within a predetermined range of a three-dimensional space while holding the substrate W with the substrate supporting hand 250, and moves between the carrier C mounted on the carrier mounting unit 100 and the posture changing mechanism 300. The substrate W is transported.

The posture changing mechanism 300 includes a support table 305, a base 310, a rotary table 320, a pair of first holding mechanisms 330 and a pair of second holding mechanisms 34 for holding a substrate.
0, a first aligning device 350, and a second aligning device 360. The turntable 320 has an arrow AR around the axis A30.
It is possible to rotate in the direction indicated by 30 (see FIG. 3), and to take an attitude P1 indicated by a solid line and an attitude P2 indicated by a two-dot chain line in FIG. Further, the first holding mechanism 330 and the second holding mechanism 340 rotate in conjunction with the turntable 320. Therefore, by rotating the turntable 320, the attitude conversion mechanism 300 causes the first holding mechanism 330
In addition, the postures of the plurality of substrates W held by the second holding mechanism 340 can be converted between a horizontal posture and a vertical posture.

The pusher 400 has a base 410, a Y-direction movable section 420, a Z-direction movable section 430, and a holder 440. The Y-direction movable section 420 is driven by a motor, a ball screw, a rail, or the like (not shown) provided on the base 410, and linearly moves in a predetermined range in the horizontal direction (Y direction) with respect to the base 410 as indicated by an arrow AR42. The Z-direction movable portion 430 is driven by a motor, a ball screw, and a rail (not shown) provided in the Y-direction movable portion 420, and is positioned within a predetermined range in the vertical direction (Z direction) as indicated by an arrow AR40 with respect to the Y-direction movable portion 420. Make a linear motion. The holder 440 is provided above the Z-direction movable portion 430, and can hold a substrate having a vertical posture.
The postures P3 and P4 can be taken by the vertical movement of the direction movable part 430. By using such a mechanism, the pusher 400 can transport a plurality of substrates W having a vertical attitude between the attitude conversion mechanism 300 and the transport mechanism 500. The pusher 400 moves up and down,
It is possible to exchange a plurality of substrates W having a vertical posture between the posture conversion mechanism 300 and the transport mechanism 500.

The transport mechanism 500 includes a transport robot 510 that can move horizontally and vertically. Further, the transport mechanism 500 includes a pair of holding mechanisms 520 for holding a plurality of substrates W having a vertical posture. Clamping mechanism 52
0 has support portions 522, 524,
Each of the support portions 522 and 524 has a plurality of grooves GV for supporting a plurality of substrates. In addition, clamping mechanism 5
The substrate 20 can support the substrate W or release the support of the substrate W by rotating in the direction of the arrow AR in FIG. Transport mechanism 50 having such a configuration
0 indicates that the substrate is exchanged with the pusher 400. The lifters 550 and 56 provided in the processing unit
It is also possible to exchange a substrate with each of 0s. The transport mechanism 500 transports or transfers the substrate before, during, and after the cleaning process from one location to another location.

The substrate processing section 600 includes a pair of holding mechanisms 52.
A transport mechanism washing unit 610 having washing tanks 612a and 612b for washing the tank 0, and a chemical tank C for storing a chemical.
B are provided with chemical processing units 620 and 640, washing processing units 630 and 650 having a washing tank WB containing pure water, and a drying unit 660. Note that the transport mechanism washing processing unit 610 does not strictly process a substrate, but handles it as one of the substrate processing units 600 for performing a process accompanying the substrate processing for convenience.

The plurality of processing units are linearly arranged in the X direction, and the above-described transport mechanism 500 is provided beside the linear arrangement. The transport mechanism 500
The substrate can be moved in a linear arrangement direction, and the substrate is transported between the processing units as described above.

Further, the chemical processing section 620 and the water washing section 6
A lifter 550 is arranged behind the 30. The lifter 550 moves up and down (Z direction) and traverse (X direction).
The substrate received from the transport mechanism 500 is immersed in the chemical tank CB of the chemical processing section 620 or immersed in the washing tank WB of the washing section 630. Similarly,
On the rear side of the chemical processing section 640 and the washing processing section 650,
A lifter 560 is provided. The lifter 560 can move up and down (Z direction) and traverse (X direction).
Or soak in With such a mechanism, a chemical solution process and a water washing process can be performed in these processing units.

The control of each process and the control of each drive mechanism are performed by the control unit CL.

<Example of Substrate Processing> Next, an example of a processing procedure by such a substrate processing apparatus 1 will be described.

A plurality of substrates W to be processed in the substrate processing apparatus 1 are carried into the carrier mounting portion 100 and placed in the carrier C while being horizontally accommodated therein. The horizontal transfer robot 200 takes out a plurality of substrates stored in the carrier at the same time, and transfers the substrates to the posture conversion mechanism 300 having the posture P1 (see FIG. 3). Next, the posture conversion mechanism 3
00 turns the turntable 320 around the horizontal axis A30 by 90 degrees to the posture P2 (see FIG. 3), and converts the plurality of substrates W received in the horizontal posture to the vertical posture.

The pusher 400 waiting at the position P3 (see FIG. 3) rises in the direction of the position P4, and receives the substrate in the vertical posture at the time of the rise. Further, the pusher 400
By moving the Y direction in the positive direction and allowing a part of the Z-direction movable section 430 to enter the gap 614 between the cleaning tanks 612a and 612b, a plurality of substrates can be moved above the transport mechanism water-washing processing section 610. And convey. And the transport mechanism 500
Receives a plurality of substrates having a vertical posture from the pusher 400 and grips them by using the holding mechanism 520.

Further, the chemical processing section 620 and the water washing section 6
The description will be continued on the assumption that predetermined processing is performed on the substrate in the order of 30, the chemical processing section 640, the rinsing processing section 650, and the drying processing section 660.

The transfer robot 510 moves the X direction in the positive direction, transfers a plurality of substrates above the chemical processing section 620, and transfers the plurality of substrates to the lifter 550. The lifter 550 that has received the substrate descends, and immerses the substrate in the chemical solution tank CB. Then, a predetermined chemical treatment is performed on the substrate.

On the other hand, after the transfer is completed, the transfer robot 510 moves to the transfer mechanism washing processing section 610 in the negative X direction. Further, the transport robot 510 descends (moves in the negative direction in the Z direction) to immerse and wash each of the pair of holding mechanisms 520 in the cleaning tanks 612a and 612b. This is because the holding mechanism 520 is preferably cleaned because the nipping mechanism 520 may be contaminated by the chemical liquid atmosphere above the chemical liquid processing unit 620.

After a predetermined chemical processing is performed on the substrate in the chemical processing section 620, the lifter 550 rises, and further moves in the X direction to the water washing processing section 630 in the negative direction. In order to perform the rinsing process with pure water in the rinsing unit 630, the lifter 550 descends and immerses the substrate in the rinsing tank WB.

The transfer robot 510 includes the holding mechanism 5 described above.
After finishing the cleaning process of No. 20, the process moves to the water washing section 630. This is because the substrate is received from the lifter 550 in order to perform the next processing on the substrate in the chemical solution processing unit 640. After receiving the substrate from the lifter 550, the transfer robot 510 moves in the negative X direction to the position of the chemical processing section 640. Then, the substrate is delivered to the lifter 560 that stands by at the position of the chemical processing section 640. The lifter 560 that has received the substrate descends, immerses the substrate in the chemical solution tank CB of the chemical solution processing unit 640, and performs a predetermined chemical solution process.

Then, in the same manner as described above, the chemical processing section 6
Predetermined processing on the substrate in the cleaning processing section 40 and the water cleaning processing section 650 and cleaning processing on the holding mechanism 520 in the transport mechanism water cleaning processing section 610 are performed.

The transfer robot 510 includes a washing section 650
In, the substrate is received from the lifter 560 and moved to the drying processing unit 660 to perform the drying process. After the drying process is completed, the transport mechanism 500 transports the substrate to the transport mechanism
10 is transported above.

The processing in the substrate processing section 600 is performed as described above.

A plurality of substrates W which have been subjected to a predetermined series of processing in the substrate processing section 600 are transferred to the transfer mechanism washing processing section 61.
After being transferred from the transport mechanism 500 to the pusher 400 above the position 0, it is transferred to the attitude conversion mechanism 300.
The posture conversion mechanism 300 converts the posture of the substrate from a vertical posture to a horizontal posture. Furthermore, the horizontal transfer robot 200
A plurality of substrates held in a horizontal position are placed on the carrier mounting unit 1.
00 and stored inside the carrier C placed on the carrier C. Then, the plurality of substrates are carried out of the substrate processing apparatus 1 together with the carrier C.

<Attitude Conversion Mechanism> Next, the attitude conversion mechanism 30
A detailed description will be given of the structure of the zero and the posture conversion using the posture conversion mechanism 300.

First, the structure of the posture changing mechanism 300 will be described in detail.

FIGS. 4 and 5 are views showing the structure of the posture changing mechanism 300. FIG. FIG. 4 is a schematic sectional view on a plane parallel to the YZ plane, and FIG. 5 is a schematic sectional view on a plane parallel to the XZ plane.

As shown in FIGS. 4 and 5, the posture changing mechanism 300 includes a support table 305 (see FIG. 2) and a base 31.
0, a turntable 320, a pair of first holding mechanisms 330 and a pair of second holding mechanisms 340 for holding a substrate, a first alignment device 350, and a second alignment device 360.

The motor M30 is fixed to the base 310, and the rotating shaft of the motor M30 is connected to the turntable 320 by a link mechanism 315. Therefore, the rotary table 320 is driven by the rotation of the motor M30 to rotate the axis A.
It is possible to rotate around the center 30 in the direction indicated by the arrow AR30.

Here, for the following description, the virtual reference plane F
(See FIG. 4). The virtual reference plane F is a plane that includes the axis A30 and rotates with the rotation of the turntable 320, and is an XY plane when the turntable 320 is in the posture P1 (see FIG. 3). Is a plane parallel to. Therefore, the rotation of the rotation table 320
Has the posture P2 (see FIG. 3), the virtual reference plane F is perpendicular to the XY plane.

<First Holding Mechanism> The rotating table 320 has a pair of first holding mechanisms 330 for holding the substrate. The first holding mechanism 330 has three degrees of freedom, and can perform linear motion perpendicular to and horizontal to the virtual reference plane F and rotational movement about an axis perpendicular to the virtual reference plane F. Hereinafter, a mechanism for realizing each of these movements will be described.

FIG. 5 is a diagram schematically showing these drive mechanisms. First, a drive mechanism that achieves linear motion in a direction perpendicular to the virtual reference plane F will be described with reference to FIG. On the upper side of the rotating base 320 (see FIG. 4), the fixed base 3 is provided.
22 is fixed, and a linear bush 322 a is provided on a part of the fixing base 322. The lifting base 324 has a portion penetrating the linear bush 322a, and moves with respect to the fixed base 322 in the direction of the arrow AR31, that is, in the direction perpendicular to the virtual reference plane F.

The relative movement between the fixed base 322 and the elevating base 324 is performed by converting the horizontal linear motion of the cylinder M31 into a linear motion in the elevating direction. Reference is now made to FIG. The cylinder M31 is fixed to a fixed base 322. The horizontal linear motion of the movable part of the cylinder M31 is determined by the arrow AR31a of the traversing slider part 323.
(See FIG. 4).
The transverse slider portion 323 has a tapered portion 323 on its upper surface.
a.

On the other hand, the lifting base 324 is
a. The roller 324a is attached to the lifting base 324 via a bearing 324b so as to be rotatable around the axis A31. This roller 324a
Are arranged on the upper surface of the transverse slider portion 323, and can roll on the tapered portion 323a.

The traversing slider section 323 is mounted on the fixed base 3
The roller 324a rolls on the tapered portion 323a in accordance with the linear motion (arrow AR31a) by running on the rail portion 322b provided on the upper side of the roller 22 so that the roller 324a becomes tapered portion 323a.
Performs a vertical movement according to the inclination of. In response to the vertical movement of the roller 324a, the vertical base 324 performs a linear movement in the direction (vertical direction) indicated by the arrow AR31. The lifting base 324 is provided with an urging means S such as a spring.
5 (see FIG. 5), it is urged in a direction approaching the fixed base 322. This is to prevent the roller 324a from being separated from the traversing slider portion 323 regardless of the posture of the turntable 320.
Therefore, even when the turntable 320 takes a posture other than the posture P1 (see FIG. 3), the elevating base 324 performs a relative motion according to the inclination of the tapered portion 323a of the traversing slider portion 323.

Next, the first holding mechanism 330 moves the virtual reference plane F
The following describes a linear motion performed in the horizontal direction with respect to. This horizontal linear motion is realized by relative movement between the lifting base 324 and the traversing base 326.

On the lifting base 324, a linear rail 324c is provided. The traversing base 326 has a guide 326a, and the guide 326a is
4c can be slid in the direction indicated by arrow AR32. The lifting base 324 is provided with a cylinder M for traversing drive.
32. The linear motion of the cylinder M32 is transmitted to the linear motion of the traversing base 326 in the direction indicated by the arrow AR32. In this way, the traversing base 326 is driven linearly in the direction indicated by the arrow AR32 with respect to the lifting base 324.

The traversing base 326 has a motor M33. The rotation axis of the motor M33 is the first holding mechanism 33.
Connected to 0. Therefore, the first holding mechanism 330 can perform a rotating motion as indicated by an arrow AR33 by the rotational driving of the motor M33. In this manner, the first holding mechanism 330 can perform a rotational movement about an axis perpendicular to the virtual reference plane F.

Each of the pair of first holding mechanisms 330 has a plurality of holding grooves 332 on its surface for holding a plurality of substrates. These plurality of holding grooves 332
Are arranged in the Z direction. FIG. 6 shows a plurality of holding grooves 3.
32 is a cross-sectional view in which a part of the substrate W is enlarged in a state where the substrate W is placed on each of the substrates 32 in a horizontal posture. As described above, the pair of first holding mechanisms 330 is formed by the pair of holding grooves 33.
By means of 2, a plurality of substrates having a horizontal posture can be held. Note that these holding grooves 332 are preferably made of a fluororesin, especially Teflon (trademark).

Further, the plurality of holding grooves 332 have an arrangement of a plurality of holding grooves 332a on one surface of the first holding mechanism 330 and an arrangement of a plurality of holding grooves 332b on the opposite surface. Since the first holding mechanism 330 is rotatable by the above-described rotating mechanism, the holding groove 332 holding the substrate is provided.
a and 332b can be switched. For example, the substrate in the substrate processing unit 600 before the substrate processing can be held by the pair of holding grooves 332a, and the substrate after the substrate processing can be held by the pair of holding grooves 332b.
By switching the holding groove for holding the substrate before and after the substrate processing as described above, contaminants that have adhered to the substrate before the substrate processing do not adhere to the substrate that has been subjected to the substrate processing.

<Second Holding Mechanism> The rotating table 320 has a pair of second holding mechanisms 340 for holding the substrate. The second holding mechanism 340 is driven to rotate by a motor M34.

Each of the pair of second holding mechanisms 340
A plurality of holding grooves 3 for holding a plurality of substrates on the surface thereof
42. These plurality of holding grooves 342
It is arranged in the direction. FIG. 7 is an enlarged cross-sectional view of a part of the plurality of holding grooves 342 in a state where the substrate W is placed in a vertical posture. Holding groove 342
Have a V-shaped shape. The pair of second holding mechanisms 340 are provided with a holding groove 342 having such a shape.
Thereby, a plurality of substrates having a vertical posture can be held. Note that these holding grooves 342 are preferably made of a fluororesin, especially Teflon (trademark).

Further, like the first holding mechanism 330, the second
The holding mechanism 340 has an array of a plurality of holding grooves on one surface of the second holding mechanism 340, and has an array of a plurality of holding grooves on the opposite surface. Since the second holding mechanism 340 is rotatable by the motor M34, the holding groove for holding the substrate can be switched. For example, a substrate before substrate processing in the substrate processing unit 600 can be held by a pair of holding grooves on one surface, and a substrate after substrate processing can be held by a pair of holding grooves on the opposite surface. By switching the holding groove for holding the substrate before and after the substrate processing as described above, contaminants that have adhered to the substrate before the substrate processing do not adhere to the substrate that has been subjected to the substrate processing.

<First and Second Alignment Devices> Further, the turntable 320 is provided with a first alignment device 350 and a second alignment device 3.
60. These are traversed in the X-axis direction by the cylinders M35 and M36, respectively.

<Position Conversion Operation—Conversion Operation from Horizontal Position to Vertical Position> The posture conversion mechanism 300 has the above structure. Attitude conversion mechanism 300 having such a structure
Can convert the attitude of the plurality of substrates W held by the first holding mechanism 330 and the second holding mechanism 340 between a horizontal attitude and a vertical attitude. Hereinafter, this attitude conversion operation will be described.

First, an operation for converting a horizontal posture into a vertical posture will be described.

FIGS. 8 to 17 show a posture changing mechanism 300.
Is a schematic side view of an attitude conversion mechanism 300 for explaining an operation of converting a plurality of substrates W from a horizontal attitude to a vertical attitude. FIGS. 18 to 20 are plan views showing states corresponding to FIGS. 8 to 10, respectively.

First, as shown in FIG. 8 and FIG. 18, the horizontal transfer robot 200 moves the plurality of substrates W taken out simultaneously from the carrier C to the attitude conversion mechanism 300 from the −Y direction of the attitude conversion mechanism 300. Further, the horizontal transfer robot 200 (see FIG. 2) moves these substrates by the arrow AF1.
Move in the direction indicated by. At this time, the plurality of substrates W are placed in the plurality of holding grooves 3 of the first holding mechanism 330 with respect to the Z direction position.
32 through the gap between them to a predetermined position. Therefore, the substrate W does not contact the first holding mechanism 330.

Then, the horizontal transfer robot 200 lowers the plurality of substrates W in the direction of the arrow AF2 and places them on the plurality of holding grooves 332 of the first holding mechanism 330. Thus, each of the plurality of substrates W is held by the corresponding pair of holding grooves 332 of the pair of first holding mechanisms 330. By the above operation, the plurality of substrates W are
And the state shown in FIG. However,
In this state, the plurality of substrates W have not yet contacted the second holding mechanism 340. The horizontal transfer robot 20
No. 0 retreats to a position that does not interfere with the subsequent posture changing operation after a plurality of substrates W are placed.

Next, the first holding mechanism 330 itself is turned
It moves in the direction indicated by arrow AF3 with respect to 20. Therefore, the plurality of substrates W held by the first holding mechanism 330 also move horizontally in the direction indicated by the arrow AF3. The plurality of substrates W move to a position where they contact the second holding mechanism 340 (see FIG. 20), and each of the plurality of substrates W is V-shaped holding groove 342 of the second holding mechanism 340.
Contact each of the 10 and 20 are views showing a state after the movement. FIG. 21 shows a state where the substrate W is in contact with the holding groove 342. Accordingly, the plurality of substrates W are held by the holding grooves 332 of the first holding mechanism 330 and the holding grooves 342 of the second holding mechanism 340.

Then, the turntable 320 rotates 90 degrees in the direction of the arrow AF4. Therefore, the plurality of substrates W held by the first holding mechanism 330 and the second holding mechanism 340 are rotated by 90 degrees in the direction of the arrow AF4 to be in a state shown in FIG. In this state, the plurality of substrates W are mainly held by the pair of second holding mechanisms 340. Further, the substrate W is moved from the start of rotation to the second holding mechanism 340.
Therefore, no relative movement occurs with the first holding mechanism 330 during rotation. Therefore, no particles are generated due to the friction between the substrate W and the first holding mechanism 330.

Further, the first holding mechanism 330 has an arrow AF5
Move in the direction shown in. The moving distance is smaller than the distance D between the substrate arrays (see FIG. 22), and the first holding mechanism 330 after the movement does not contact the plurality of substrates W. FIG. 22 is a diagram illustrating a relationship between the holding groove 332 of the first holding mechanism 330 and the substrate W. In FIG. 22, the holding groove 332 of the first holding mechanism 330 after the movement is indicated by a solid line, indicating that the holding groove 332 is not in contact with the substrate W. In the drawing, the position of the holding groove 342 of the first holding mechanism 330 before the movement is indicated by a broken line. FIG. 12 is a diagram illustrating a state after the first holding mechanism 330 has moved in the direction of the arrow AF5. In FIG. 12, the plurality of substrates W are held by the holding grooves 342 of the second holding mechanism 340 (see FIG. 7), and are not in contact with the first holding mechanism 330.

Here, the pusher 400 moves the arrow AF6 between the pair of the first holding mechanism 330 and the second holding mechanism 340.
Rise in the direction of. FIG. 23 is a diagram illustrating this ascent operation on a plane parallel to the YZ plane. The pusher 400 rises in the direction of the arrow AF6, and holds the substrate W by the holder 440 to push up the substrate W. As a result, the contact between the substrate W and the second holding mechanism 340 is released, and the substrate W is held by the holder 440. Pusher 400
Are located between the pair of second holding mechanisms 340 and between the pair of first holding mechanisms 340.
The space between the holding mechanisms 330 is further raised, and the state shown in FIG. 13 is obtained. The substrate W held by the second holding mechanism 340 in this manner is transferred to the pusher 400. When the pusher 400 is raised, the plurality of substrates W are not in contact with the first holding mechanism 330, so that no particles are generated due to contact, rubbing, or the like.

After the plurality of substrates W have been transferred to the pusher 400, the turntable 320 of the posture changing mechanism 300
The image is rotated 90 degrees in the direction of 7, and the state shown in FIG. 14 is obtained. Thereafter, the first holding mechanism 330 moves the arrow AF8 and the arrow AF.
9 and the state of FIG. 15 is obtained. On the other hand, the pusher 400 is moved from the position shown in FIGS.
5 in the direction of arrow AF10 (see FIG. 14). In this way, the plurality of substrates W are converted from the horizontal posture to the vertical posture by the posture conversion mechanism 300 and delivered to the pusher 400. The state in FIG. 15 of the posture changing mechanism 300 is almost the same as the state in FIG.

As described above, the arrangement of a plurality of substrates W can be held in a vertical position. Double the number of substrates W can be accommodated in the volume.
This operation is described further below.

A plurality of substrates W (hereinafter, referred to as a “first substrate group”) different from the plurality of substrates W whose orientation has been changed
The “second substrate group”) is placed on the attitude conversion mechanism 300 by the horizontal transfer robot 200, and the same operations as those shown in FIGS. 8 to 11 are repeated. Thus, the posture of the second substrate group is changed to the state shown in FIG. FIG. 16 is a diagram corresponding to FIG. 12 in the above description.

Next, the pusher 400 is raised in the direction shown by the arrow AF16, and the first pusher 400 held by the holder 440 is moved.
Each of the substrates W of the substrate group is inserted between the substrates W of the second substrate group held by the second holding mechanism 340.
Therefore, it is preferable that the holder 440 of the pusher 400 has grooves G (see FIG. 24) arranged at an interval of D / 2. FIG. 24 is a cross-sectional view showing the structure of the groove G of the holder 440. Here, the interval D represents the interval between the substrates in the first substrate group. The rise of the pusher 400 prevents the first substrate group and the second substrate group from interfering with each other, and D / 2 in the Y direction with respect to the groove G1 for holding the substrate of the first substrate group. In order to hold the second substrate group by the shifted groove G2, it is preferable that the position of the pusher 400 in the Y direction is previously shifted by D / 2.

In order to cause this displacement, as shown in FIG. 15, for example, the pusher 400 can move by a distance of D / 2 in the direction of the arrow AF10B. In this case, the surface of the substrate W on which the device is created
All the main surfaces of the first substrate group and the second substrate group are aligned in the same direction. Alternatively, 180 degrees around the axis AC in the direction of the arrow AF10C.
You can also rotate by degrees. In this case, the main surfaces of the first and second substrate groups are opposite to each other. Which of these operations to select can be changed depending on the contents of the subsequent substrate processing and the like. These operations can be performed simultaneously with the descending operation in the direction indicated by the arrow AF10 in FIG.

By the above operation, the groove G2 for holding the substrate of the second substrate group can be located at the position where the groove G1 for holding the substrate of the first substrate group was present. In this way, the first position is shifted by D / 2 in the Y direction.
The holder 440 on which the substrates of the substrate group are arranged can be raised in the direction indicated by the arrow AF16 in FIG.
Therefore, the second holding mechanism 340 of the posture changing mechanism 300
When the pusher 400 is lifted, the substrate of the second substrate group held by is held at the position of the groove G2 of the holder 440 and transferred to the pusher 400. Further, each of the substrates W of the first substrate group held by the holder 440 is inserted between the substrates W of the second substrate group, and a contact occurs between the first and second substrate groups. Absent.

As shown in FIG. 17, the pusher 400 that has been further raised holds the substrates of the first and second substrate groups in the groove G. Thereafter, the attitude conversion mechanism 300 returns to the state shown in FIG. 8 by, for example, rotating the turntable 320 by 90 degrees in the direction of the arrow AF17.

As described above, the substrate W can be accommodated in the pusher 400 at a double density.

<Posture Conversion Operation—Conversion Operation from Vertical Posture to Horizontal Posture> In the above, of the posture conversion operations of the posture conversion mechanism 300, the operation of converting the horizontal posture to the vertical posture (hereinafter, “forward conversion operation”) (Also referred to as).

In the following, an operation for converting a vertical posture into a horizontal posture (hereinafter, also referred to as "inverse conversion operation") will be described. For this inverse conversion operation, basically, the inverse operation of the conversion operation from the horizontal posture to the vertical posture may be performed. Accordingly, the operations described above with reference to FIGS. 8 to 17 are sequentially reversed. By such an operation, each of the first substrate group and the second substrate group held by the pusher 400 is moved to the posture changing mechanism 300.
Can be converted from a vertical posture to a horizontal posture.

In this reverse conversion operation, in addition to the reverse operation of the forward conversion operation, an operation for aligning substrates using the first alignment device 350 and the second alignment device 360 can be added. FIGS. 25 and 26 are schematic side views of the posture changing mechanism 300, and FIGS. 27 and 28 are plan views showing states corresponding to FIGS. 25 and 26, respectively. Using these figures, the pusher 40
In order to convert the plurality of substrates W received from 0 to a horizontal posture from a vertical posture, a first
The operation of the alignment device 350 and the second alignment device 360 will be described.

The plurality of substrates held vertically by the pusher 400 are transferred to the posture changing mechanism 300,
The horizontal posture is maintained by the rotation of the turntable 320. FIG. 25 is a diagram showing such a state. This state corresponds to FIG. 10 in the description of the forward conversion operation. Therefore, the state shifts to the state of FIG. 9 by the reverse operation of the forward conversion operation. FIG. 26 is a diagram showing a state corresponding to FIG.
A state is shown in which the first holding mechanism 330 has moved in a direction indicated by an arrow AF23 (see FIG. 25) opposite to the arrow AF3 (see FIG. 9).

Along with this operation, the substrate placed on the first holding mechanism 330 also moves in the direction of the arrow AF23. However, some of the substrates held in the holding groove 342 of the second holding mechanism 340 in the vertical posture include the holding groove 342.
There is a case where it is hard to be disengaged by being fitted to. In such a case, the plurality of substrates are
The first alignment device 350 can be used to align the holding mechanism 330 at a predetermined position.

FIG. 25 and FIG.
7, the first aligning device 350 is moved to the arrow AF23B.
Move in the direction of. Accordingly, the first aligning device 350
Is in contact with the ends of the plurality of substrates W held by the second holding mechanism 340, and a force is applied in a direction to separate the plurality of substrates W from the second holding mechanism 340. Therefore, the plurality of substrates W
The plurality of substrates W are extruded in the direction of the arrow AF23B and are aligned by the first alignment device 350. Then, by moving the first holding mechanism 330 in the direction of the arrow AF <b> 23, the plurality of substrates W thus aligned can be moved with the operation of the first holding mechanism 330.

Prior to the movement of the first holding mechanism 330, the second aligning device 360 is moved by the arrow A as shown in FIG.
It can be moved to a predetermined position in the direction of F23C. The second alignment device 36 located at such a position
By 0, the plurality of substrates W moving in the direction of the arrow AF23 can be aligned.

As described above, by using the first alignment device 350 and the second alignment device 360, a plurality of substrates can be aligned at predetermined positions. For other operations, the reverse conversion operation can be performed by performing the reverse operation of the forward conversion operation, and the substrate in the vertical position can be converted to the horizontal position.

<Other Modifications> In the above embodiment, as shown in FIGS. 9 and 10, the contact and non-contact between the substrate mounted on the first holding mechanism 330 and the second holding mechanism 340 are switched. Arrow A to realize the operation
The first holding mechanism 330 has moved in the direction indicated by F3. However, this operation is not limited to this, and the relative movement between the first holding mechanism 330 and the second holding mechanism 340 causes the substrate W and the second holding mechanism 340 to move.
It is only necessary to be able to switch between a contact state and a non-contact state. Therefore, the second holding mechanism 340 is moved to the direction indicated by the arrow AF.
3 may be moved. Alternatively, the second holding mechanism 3
40 can also be moved in a direction orthogonal to the arrow AF3 to switch between a contact state and a non-contact state with the substrate W.

Further, as shown in FIGS. 11 and 12, the first holding mechanism 330 moves in a direction perpendicular to the virtual reference plane F (see the arrow AF5), so that the second holding mechanism 340 holds it. Substrate W and first holding mechanism 3
The contact and non-contact with 30 were switched. However, this operation is not limited to this, and the first holding mechanism 33 in a direction substantially orthogonal to the virtual reference plane F
It is only necessary that the contact and non-contact between the first holding mechanism 330 and the substrate W can be switched by the operation of increasing or decreasing the relative distance between the first holding mechanism 330 and the second holding mechanism 340. For example,
Direction perpendicular to virtual reference plane F (see arrow AF5)
When the second holding mechanism 340 moves, the substrate W held by the second holding mechanism 340 and the first holding mechanism 330
Contact and non-contact may be switched.

[0087]

As described above, according to the substrate attitude converting apparatus of the first aspect, the rotating body in which the attitude of the virtual reference plane passing through the horizontal axis changes between the horizontal attitude and the vertical attitude, A first holding unit and a second holding unit that rotate in association with the rotating body, wherein the first holding unit holds the substrate in a horizontal position when the reference surface is in a horizontal position, and the second holding unit includes a reference surface. Holds the substrate in the vertical position when is in the vertical position. Therefore, the posture of the substrate can be converted between the horizontal posture and the vertical posture with a simple configuration.

According to the substrate posture changing device of the second aspect, the first holding means and the second holding means in a direction substantially parallel to the reference plane are provided.
The first and second holding means are moved in parallel with each other by using a parallel moving means for relatively moving the first holding means and the second holding means so as to change the relative distance to the holding means. By relatively moving the holding means, the state of the substrate held in the horizontal position by the first holding means is switched between a state in which the substrate is in contact with the second holding means and a state in which the substrate is not in contact with the second holding means. It is possible to create a state in which the first holding means is in contact with the second holding means, and further, by rotating the rotating body, it is possible to change the posture of the substrate without causing friction between the substrate and the first holding means. Therefore, generation of particles due to rubbing can be prevented.

According to the third aspect of the present invention, the first holding means and the second holding means can change the relative distance between the first holding means and the second holding means in a direction substantially perpendicular to the reference plane. By using the orthogonal moving means for relatively moving the holding means, the first and second holding means are relatively moved in a state in which the reference plane is in the vertical posture, so that the second movement is performed.
The substrate held in the vertical position by the holding means is the first substrate.
Since the state of contact with the holding unit is switched between the state of contact and the state of non-contact, it is possible to create a state where the substrate does not contact the first holding unit when the substrate separates from the second holding unit. In this case, no rubbing occurs between the substrate and the first holding means, so that generation of particles due to the rubbing can be prevented.

According to the substrate attitude changing device of the fourth aspect, the plurality of substrates held by the first holding means and the second holding means are moved from the second holding means to the first holding means by the first alignment means. Extruded in the direction toward. Therefore, the contact state between the substrate and the second holding means is reliably released, so that a plurality of substrates can be aligned.

According to the substrate attitude changing device of the fifth aspect, the ends of the plurality of substrates can be aligned at predetermined positions with respect to the first holding means by the second aligning means.

According to the substrate attitude changing device of the present invention, the first holding means and the second holding means each include an array of holding grooves for holding a plurality of substrates before processing. And an array of holding grooves for holding a plurality of substrates after processing. By switching the arrangement of the holding grooves before and after the processing of the substrate, contaminants such as particles attached to the substrate before the processing do not adhere to the substrate after the processing.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a substrate processing apparatus 1.

FIG. 2 is a perspective view showing a partial configuration of the substrate processing apparatus 1.

FIG. 3 is a side view showing an internal configuration of the substrate processing apparatus 1.

FIG. 4 is a longitudinal sectional view showing a structure of a posture changing mechanism 300 according to the present invention.

FIG. 5 is another longitudinal sectional view showing the structure of the posture changing mechanism 300.

FIG. 6 is an enlarged view showing a holding groove 332 of the first holding mechanism 330.

FIG. 7 is an enlarged view showing a holding groove 342 of the second holding mechanism 340.

FIG. 8 is a schematic side view of the posture changing mechanism 300.

FIG. 9 is a schematic side view of the posture changing mechanism 300.

FIG. 10 is a schematic side view of a posture changing mechanism 300.

11 is a schematic side view of the posture changing mechanism 300. FIG.

FIG. 12 is a schematic side view of a posture changing mechanism 300.

FIG. 13 is a schematic side view of the posture changing mechanism 300.

FIG. 14 is a schematic side view of a posture changing mechanism 300.

FIG. 15 is a schematic side view of a posture changing mechanism 300.

FIG. 16 is a schematic side view of a posture changing mechanism 300.

17 is a schematic side view of a posture changing mechanism 300. FIG.

FIG. 18 shows a posture changing mechanism 300 corresponding to the state shown in FIG.
It is a schematic plan view of.

19 shows a posture changing mechanism 300 corresponding to the state shown in FIG.
It is a schematic plan view of.

20 shows a posture changing mechanism 30 corresponding to the state shown in FIG.
0 is a schematic plan view.

21 is an enlarged view showing a holding groove 342 of the second holding mechanism 340. FIG.

FIG. 22 is a diagram illustrating a relationship between the holding groove 332 of the first holding mechanism 330 and the substrate W held in the holding groove 342 of the second holding mechanism 340.

FIG. 23 is a diagram illustrating a relationship between a substrate W held in a holding groove 342 of a second holding mechanism 340 and a pusher 400.

FIG. 24 is an enlarged sectional view showing a part of a holder 440 of the pusher 400.

25 is a schematic side view of a posture changing mechanism 300. FIG.

FIG. 26 is a schematic side view of the posture changing mechanism 300.

FIG. 27 shows a posture changing mechanism 30 corresponding to the state shown in FIG.
0 is a schematic plan view.

28 shows a posture changing mechanism 30 corresponding to the state shown in FIG. 26.
0 is a schematic plan view.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 100 Carrier mounting part 200 Horizontal transfer robot 300 Attitude conversion mechanism 310 Base 320 Rotating table 330 First holding mechanism 340 Second holding mechanism 350 First alignment device 360 Second alignment device 332, 332a, 332b, 342, 342a, 34
2b Holding groove 400 Pusher 500 Transfer mechanism 510 Transfer robot 520 Nipping mechanism 550, 560 Lifter 600 Substrate processing unit 610 Transfer mechanism water washing processing unit 612a, 612b Cleaning tank 614 Void 620 Chemical liquid processing unit 630 Water cleaning processing unit 640 Chemical liquid processing unit 650 Water washing Processing unit 660 Drying processing unit CB Chemical bath WB Rinse bath CL Control unit C Carrier W Substrate S Energizing means

Claims (7)

[Claims] 1. A substrate attitude conversion device for converting the attitude of a substrate between a horizontal attitude and a vertical attitude, comprising: (a) a virtual reference plane passing through the horizontal axis by rotating about a horizontal axis; A rotating body whose posture changes between a horizontal posture and a vertical posture, (b) driving means for rotating the rotating body, and (c) provided on one surface of the rotating body that holds a substrate,
A first holding unit that rotates in conjunction with the rotating body and holds the substrate in a horizontal position when the reference surface is in a horizontal position; (d) provided on one surface of the rotating body that holds the substrate. And
A second holding unit that rotates in conjunction with the rotating body and holds the substrate in a vertical position when the reference surface is in a vertical position;
A substrate attitude conversion device comprising: 2. The substrate attitude changing device according to claim 1, wherein: (e) changing a relative distance between the first holding unit and the second holding unit in a direction substantially parallel to the reference plane. A parallel moving unit that relatively moves the first holding unit and the second holding unit, wherein the first and second holding units are moved by the parallel moving unit in a state where the reference plane is in a horizontal posture. Wherein the substrate held in the horizontal position by the first holding means switches between a state of contact with the second holding means and a state of not contacting the second holding means. 3. The substrate posture changing device according to claim 1, wherein (f) changing a relative distance between the first holding unit and the second holding unit in a direction substantially perpendicular to the reference plane. like,
An orthogonal moving means for relatively moving the first holding means and the second holding means, wherein the first and second holding means are provided by the orthogonal moving means while the reference plane is in a vertical posture. A substrate posture changing apparatus characterized in that a substrate held in a vertical position by said second holding means is switched between a state in which said substrate is in contact with said first holding means and a state in which said substrate is not in contact with said first holding means by relatively moving said means. . 4. The substrate attitude changing device according to claim 1, wherein the first holding means and the second holding means are capable of holding a plurality of substrates, and (g) the rotating body. Is provided on one side of the side holding the substrate,
The ends of the plurality of substrates are moved from the second holding means to the first
A substrate orientation conversion device, further comprising first alignment means for extruding and aligning in a direction toward the holding means. 5. The substrate posture changing device according to claim 4, wherein (h) provided on one surface of a side of the rotating body that holds the substrate,
The substrate attitude changing device further comprising a second aligning means for aligning the ends of the plurality of substrates held by the first holding means. 6. The substrate attitude changing apparatus according to claim 5, wherein the first holding means comprises: (b-1) an array of first holding grooves for holding a plurality of substrates before processing; ) An array of second holding grooves for holding a plurality of substrates after processing, wherein the second holding means comprises: (c-1) an array of third holding grooves for holding a plurality of substrates before processing; (c-2) an array of fourth holding grooves for holding a plurality of substrates after processing. 7. The substrate attitude changing device according to claim 6, wherein the first holding unit is configured to arrange the first holding groove with the second holding groove.
The arrangement of the holding grooves is formed on a different surface, and the second holding means includes an arrangement of the third holding grooves and the fourth holding groove.
The arrangement of the holding grooves is formed on a different surface, and (i) the orientation is such that the arrangement of the first holding grooves and the arrangement of the second holding grooves are switched and oriented in a direction facing a plurality of substrates. A first rotating means for rotating the first holding means; and (j) switching and orienting the arrangement of the third holding grooves and the arrangement of the fourth holding grooves in a direction facing the plurality of substrates. And a second rotating means for rotating the second holding means.