TWI293260B - Method of dispensing viscous material onto a substrate from a dispenser - Google Patents
Method of dispensing viscous material onto a substrate from a dispenser Download PDFInfo
- Publication number
- TWI293260B TWI293260B TW093114343A TW93114343A TWI293260B TW I293260 B TWI293260 B TW I293260B TW 093114343 A TW093114343 A TW 093114343A TW 93114343 A TW93114343 A TW 93114343A TW I293260 B TWI293260 B TW I293260B
- Authority
- TW
- Taiwan
- Prior art keywords
- viscous material
- substrate
- length
- viscous
- value
- Prior art date
Links
- 239000011345 viscous material Substances 0.000 title claims description 239
- 238000000034 method Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 title claims description 53
- 230000033001 locomotion Effects 0.000 claims description 45
- 238000012937 correction Methods 0.000 claims description 42
- 238000009826 distribution Methods 0.000 claims description 22
- 230000001186 cumulative effect Effects 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 124
- 239000000853 adhesive Substances 0.000 description 46
- 230000001070 adhesive effect Effects 0.000 description 42
- 230000008569 process Effects 0.000 description 23
- 230000008859 change Effects 0.000 description 17
- 238000002347 injection Methods 0.000 description 15
- 239000007924 injection Substances 0.000 description 15
- 239000012530 fluid Substances 0.000 description 12
- 239000007921 spray Substances 0.000 description 11
- 230000008901 benefit Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 125000001475 halogen functional group Chemical group 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- NCDNCNXCDXHOMX-XGKFQTDJSA-N ritonavir Chemical compound N([C@@H](C(C)C)C(=O)N[C@H](C[C@H](O)[C@H](CC=1C=CC=CC=1)NC(=O)OCC=1SC=NC=1)CC=1C=CC=CC=1)C(=O)N(C)CC1=CSC(C(C)C)=N1 NCDNCNXCDXHOMX-XGKFQTDJSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 208000011580 syndromic disease Diseases 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
- H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47316603P | 2003-05-23 | 2003-05-23 | |
| US10/838,508 US20050001869A1 (en) | 2003-05-23 | 2004-05-04 | Viscous material noncontact jetting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200510076A TW200510076A (en) | 2005-03-16 |
| TWI293260B true TWI293260B (en) | 2008-02-11 |
Family
ID=33101535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093114343A TWI293260B (en) | 2003-05-23 | 2004-05-21 | Method of dispensing viscous material onto a substrate from a dispenser |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US20050001869A1 (cg-RX-API-DMAC7.html) |
| EP (2) | EP1958705B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP4711383B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101057962B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN100441317C (cg-RX-API-DMAC7.html) |
| DE (1) | DE602004022102D1 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI293260B (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI415728B (zh) * | 2009-03-16 | 2013-11-21 | Protec Co Ltd | 分送樹脂的系統與方法 |
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|---|---|---|---|---|
| KR101029550B1 (ko) * | 2003-07-14 | 2011-04-15 | 노드슨 코포레이션 | 이산량의 점성 재료를 분배하기 위한 장치 및 방법 |
| US20050095366A1 (en) * | 2003-10-31 | 2005-05-05 | Liang Fang | Method of conformal coating using noncontact dispensing |
| US20060029724A1 (en) * | 2004-08-06 | 2006-02-09 | Nordson Corporation | System for jetting phosphor for optical displays |
| US20070145164A1 (en) * | 2005-12-22 | 2007-06-28 | Nordson Corporation | Jetting dispenser with multiple jetting nozzle outlets |
| JP4868515B2 (ja) * | 2006-11-01 | 2012-02-01 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法、装置およびプログラム |
| JP4871093B2 (ja) * | 2006-11-01 | 2012-02-08 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法、装置およびプログラム |
| JP5271254B2 (ja) * | 2007-03-08 | 2013-08-21 | 武蔵エンジニアリング株式会社 | 液滴吐出装置および方法 |
| JP2010022881A (ja) | 2007-03-30 | 2010-02-04 | Musashi Eng Co Ltd | 液材吐出装置および液材吐出方法 |
| US8765212B2 (en) * | 2007-09-21 | 2014-07-01 | Nordson Corporation | Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material |
| GB2457220B (en) * | 2007-09-25 | 2011-09-14 | Robert Henry Gill | Dispensing Device |
| US20090095825A1 (en) * | 2007-10-11 | 2009-04-16 | Nordson Corporation | Dispenser nozzle having differential hardness |
| US8255088B2 (en) * | 2007-11-29 | 2012-08-28 | Nordson Corporation | Method for dispensing a viscous material |
| JP5280702B2 (ja) * | 2008-02-18 | 2013-09-04 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、その装置およびそのプログラム |
| CN101234371B (zh) * | 2008-02-29 | 2010-06-09 | 泰州雅马哈动力有限公司 | 一种油脂涂布机 |
| JP4935743B2 (ja) * | 2008-04-08 | 2012-05-23 | 株式会社日立プラントテクノロジー | フラックス形成装置 |
| KR100974925B1 (ko) * | 2008-06-30 | 2010-08-10 | 서울반도체 주식회사 | Led 제조를 위한 현탁액 분배장치 및 분배방법 |
| CN102159492B (zh) * | 2008-09-18 | 2014-06-11 | 诺信公司 | 自动化真空辅助阀灌注系统及使用方法 |
| JP5504645B2 (ja) * | 2009-02-20 | 2014-05-28 | パナソニック株式会社 | 樹脂塗布装置および樹脂塗布用データ作成装置 |
| JP5632838B2 (ja) | 2009-06-15 | 2014-11-26 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、その装置およびそのプログラム |
| JP5535561B2 (ja) * | 2009-09-15 | 2014-07-02 | 日本発條株式会社 | 接着剤塗布装置 |
| US9151646B2 (en) | 2011-12-21 | 2015-10-06 | Deka Products Limited Partnership | System, method, and apparatus for monitoring, regulating, or controlling fluid flow |
| JP5597146B2 (ja) | 2010-03-18 | 2014-10-01 | 日本碍子株式会社 | ハニカムフィルタ製造装置 |
| US8753713B2 (en) | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
| US8531517B2 (en) * | 2010-07-15 | 2013-09-10 | Kai Tao | IV monitoring by video and image processing |
| US20120040477A1 (en) * | 2010-08-13 | 2012-02-16 | Frank Yu | Ai epoxy adjustment |
| EP2632730B1 (en) * | 2010-10-27 | 2019-08-07 | Matthews International Corporation | Valve jet printer with inert plunger tip |
| JP5779353B2 (ja) * | 2011-01-19 | 2015-09-16 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、塗布装置およびプログラム |
| US8616042B2 (en) * | 2011-03-25 | 2013-12-31 | Illinois Tool Works Inc. | Method and apparatus for calibrating dispensed deposits |
| DE102011106137A1 (de) * | 2011-06-10 | 2012-12-13 | Baumer Inspection Gmbh | Vorrichtung und Verfahren zur Regelung einer Menge eines Klebstoffauftrags |
| US9346075B2 (en) | 2011-08-26 | 2016-05-24 | Nordson Corporation | Modular jetting devices |
| KR20130035392A (ko) * | 2011-09-30 | 2013-04-09 | 삼성전기주식회사 | 액적 검사 장치 및 그 동작 방법 |
| CN102441511B (zh) * | 2011-10-28 | 2013-09-18 | 深圳翠涛自动化设备股份有限公司 | 用于led封装的容积式定量点胶系统、装置及其方法 |
| US9061316B2 (en) * | 2011-10-28 | 2015-06-23 | Nordson Corporation | Mountable device for dispensing heated adhesive |
| US8864275B2 (en) * | 2011-12-14 | 2014-10-21 | Xerox Corporation | System for detecting leakage of phase change inks |
| US9746094B2 (en) | 2011-12-21 | 2017-08-29 | Deka Products Limited Partnership | Flow meter having a background pattern with first and second portions |
| US9372486B2 (en) | 2011-12-21 | 2016-06-21 | Deka Products Limited Partnership | System, method, and apparatus for monitoring, regulating, or controlling fluid flow |
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| US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
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| US9057642B2 (en) | 2012-12-03 | 2015-06-16 | Illinois Tool Works Inc. | Method and apparatus for calibrating a dispenser |
| US20140166768A1 (en) * | 2012-12-19 | 2014-06-19 | Dow Agrosciences Llc | Automated device for the application of agricultural management materials |
| US9759343B2 (en) | 2012-12-21 | 2017-09-12 | Deka Products Limited Partnership | Flow meter using a dynamic background image |
| US9187364B2 (en) | 2013-02-28 | 2015-11-17 | Corning Incorporated | Method of glass edge coating |
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| US9789511B2 (en) | 2013-03-12 | 2017-10-17 | Nordson Corporation | Jetting devices |
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| TWI498168B (zh) * | 2013-07-09 | 2015-09-01 | All Ring Tech Co Ltd | Method and device for adjusting cohesive material coating |
| JP6183597B2 (ja) * | 2013-08-05 | 2017-08-23 | Tdk株式会社 | 液滴塗布装置 |
| CN105451950B (zh) | 2013-08-15 | 2019-03-12 | 哈利伯顿能源服务公司 | 支撑剂的加成制造 |
| USD751690S1 (en) | 2013-11-06 | 2016-03-15 | Deka Products Limited Partnership | Apparatus to control fluid flow through a tube |
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| US10082417B2 (en) * | 2013-12-30 | 2018-09-25 | Nordson Corporation | Calibration methods for a viscous fluid dispensing system |
| DE102014207633A1 (de) * | 2014-04-23 | 2015-10-29 | Zf Friedrichshafen Ag | Verfahren zum Schutz eines elektronischen Schaltungsträgers vor Umwelteinflüssen und Schaltungsmodul |
| US10221060B2 (en) * | 2014-05-20 | 2019-03-05 | Engineering System Co., Ltd. | Microvolume-liquid dispensing method and microvolume-liquid dispenser |
| EP2962767B1 (de) * | 2014-06-30 | 2017-04-12 | ABB Schweiz AG | System und Verfahren zur Ermittlung von Prozessparametern für die roboterbasierte Spritzapplikation von viskosen Fluiden |
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- 2004-05-21 EP EP08154827.3A patent/EP1958705B1/en not_active Expired - Lifetime
- 2004-05-21 TW TW093114343A patent/TWI293260B/zh not_active IP Right Cessation
- 2004-05-21 DE DE602004022102T patent/DE602004022102D1/de not_active Expired - Lifetime
- 2004-05-21 JP JP2004151337A patent/JP4711383B2/ja not_active Expired - Fee Related
- 2004-05-21 EP EP04012144A patent/EP1479451B1/en not_active Expired - Lifetime
- 2004-05-24 CN CNB200410038372XA patent/CN100441317C/zh not_active Expired - Fee Related
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2008
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2010
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-
2011
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI415728B (zh) * | 2009-03-16 | 2013-11-21 | Protec Co Ltd | 分送樹脂的系統與方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4970386B2 (ja) | 2012-07-04 |
| KR20040101015A (ko) | 2004-12-02 |
| JP2004344883A (ja) | 2004-12-09 |
| US8257779B2 (en) | 2012-09-04 |
| EP1479451A3 (en) | 2006-12-27 |
| JP4711383B2 (ja) | 2011-06-29 |
| CN100441317C (zh) | 2008-12-10 |
| EP1479451B1 (en) | 2009-07-22 |
| US20110048575A1 (en) | 2011-03-03 |
| EP1958705A2 (en) | 2008-08-20 |
| TW200510076A (en) | 2005-03-16 |
| EP1958705A3 (en) | 2012-07-18 |
| KR101057962B1 (ko) | 2011-08-22 |
| US7939125B2 (en) | 2011-05-10 |
| HK1072393A1 (en) | 2005-08-26 |
| EP1479451A2 (en) | 2004-11-24 |
| JP2009006324A (ja) | 2009-01-15 |
| CN1575862A (zh) | 2005-02-09 |
| US20110184569A1 (en) | 2011-07-28 |
| US20170232465A1 (en) | 2017-08-17 |
| DE602004022102D1 (de) | 2009-09-03 |
| US9636701B2 (en) | 2017-05-02 |
| EP1958705B1 (en) | 2021-05-05 |
| US20050001869A1 (en) | 2005-01-06 |
| US20120285990A1 (en) | 2012-11-15 |
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