JP2014175563A - ペースト塗布装置 - Google Patents
ペースト塗布装置 Download PDFInfo
- Publication number
- JP2014175563A JP2014175563A JP2013048611A JP2013048611A JP2014175563A JP 2014175563 A JP2014175563 A JP 2014175563A JP 2013048611 A JP2013048611 A JP 2013048611A JP 2013048611 A JP2013048611 A JP 2013048611A JP 2014175563 A JP2014175563 A JP 2014175563A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- application
- trial
- substrate
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】基板2を保持する基板保持部としての基板搬送コンベア11、基板2にペーストPstを塗布する塗布ヘッド13、ペーストPstの試し塗布が行われる試し塗布ステージ14、塗布ヘッド13により試し塗布ステージ14に塗布されたペーストPstを側方から撮像する側方撮像カメラ17及び側方撮像カメラ17で撮像された画像を記憶する側方画像記憶部63を備える。
【選択図】図1
Description
2 基板
11 基板搬送コンベア(基板保持部)
13 塗布ヘッド
14 試し塗布ステージ
16 相対移動機構(相対移動手段)
17 側方撮像カメラ(撮像カメラ)
63 側方画像記憶部(記憶部)
66 ペースト側方認識部(ペースト認識部)
Pst ペースト
Claims (4)
- 基板を保持する基板保持部と、
前記基板にペーストを塗布する塗布ヘッドと、
ペーストの試し塗布が行われる試し塗布ステージと、
前記塗布ヘッドにより前記試し塗布ステージに塗布されたペーストを側方から撮像する撮像カメラと、
前記撮像カメラで撮像された画像を記憶する記憶部とを備えたことを特徴とするペースト塗布装置。 - 前記試し塗布ステージと前記撮像カメラを水平方向に相対移動させる相対移動手段を備えたことを特徴とする請求項1に記載のペースト塗布装置。
- 前記撮像カメラは前記塗布ヘッドが下降して前記試し塗布ステージにペーストを付着させた後、上昇し終わる期間に複数の画像を連続して取得し、前記記憶部はその取得した複数の画像を記憶することを特徴とする請求項1又は2に記載のペースト塗布装置。
- 前記撮像カメラで撮像したペーストの画像からそのペーストの高さを計測するペースト認識部を備えたことを特徴とする請求項1〜3の何れかに記載のペースト塗布装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013048611A JP2014175563A (ja) | 2013-03-12 | 2013-03-12 | ペースト塗布装置 |
US14/775,167 US20160030970A1 (en) | 2013-03-12 | 2014-03-06 | Paste application device |
CN201480014289.0A CN105009696A (zh) | 2013-03-12 | 2014-03-06 | 糊剂涂敷装置 |
PCT/JP2014/001252 WO2014141644A1 (ja) | 2013-03-12 | 2014-03-06 | ペースト塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013048611A JP2014175563A (ja) | 2013-03-12 | 2013-03-12 | ペースト塗布装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014175563A true JP2014175563A (ja) | 2014-09-22 |
Family
ID=51536323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013048611A Pending JP2014175563A (ja) | 2013-03-12 | 2013-03-12 | ペースト塗布装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160030970A1 (ja) |
JP (1) | JP2014175563A (ja) |
CN (1) | CN105009696A (ja) |
WO (1) | WO2014141644A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018074232A1 (ja) * | 2016-10-17 | 2018-04-26 | 住友電装株式会社 | 防食剤供給状態検査装置、防食剤供給装置及び端子付電線の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101714627B1 (ko) * | 2015-04-17 | 2017-03-23 | 성안기계 (주) | 슬롯 다이 코팅 장치 |
CN110773384A (zh) * | 2019-11-19 | 2020-02-11 | 和信精密科技(吴江)有限公司 | 一种视觉点胶机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000354811A (ja) * | 1999-04-16 | 2000-12-26 | Juki Corp | 粘性剤吐出制御装置 |
WO2009104398A1 (ja) * | 2008-02-22 | 2009-08-27 | 武蔵エンジニアリング株式会社 | 吐出量補正方法および塗布装置 |
WO2010087314A1 (ja) * | 2009-01-29 | 2010-08-05 | 芝浦メカトロニクス株式会社 | 塗布装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935261A (en) * | 1988-10-17 | 1990-06-19 | Micro Robotics Systems Inc. | Method for controlling accurate dispensing of adhesive droplets |
US5932012A (en) * | 1995-06-23 | 1999-08-03 | Hitachi Techno Engineering Co., Ltd. | Paste applicator having positioning means |
TW409183B (en) * | 1997-06-25 | 2000-10-21 | Hosokawa Micron Kk | The method and the device for measuring the inclination angle of powder/grain material stack |
US6475282B1 (en) * | 1999-01-08 | 2002-11-05 | Fastar, Ltd. | Intelligent control system for extrusion head dispensement |
AU2003266690A1 (en) * | 2002-09-27 | 2004-05-04 | Shimadzu Corporation | Liquid portioning method and device |
US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
JP4869776B2 (ja) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | 印刷検査装置及び印刷装置 |
JP5092649B2 (ja) * | 2007-09-27 | 2012-12-05 | 日本電気株式会社 | 塗布剤の劣化検査装置及び劣化検査方法並びに劣化検査プログラム |
CN101873989A (zh) * | 2007-11-29 | 2010-10-27 | 诺信公司 | 分配粘性材料的方法 |
-
2013
- 2013-03-12 JP JP2013048611A patent/JP2014175563A/ja active Pending
-
2014
- 2014-03-06 CN CN201480014289.0A patent/CN105009696A/zh active Pending
- 2014-03-06 US US14/775,167 patent/US20160030970A1/en not_active Abandoned
- 2014-03-06 WO PCT/JP2014/001252 patent/WO2014141644A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000354811A (ja) * | 1999-04-16 | 2000-12-26 | Juki Corp | 粘性剤吐出制御装置 |
WO2009104398A1 (ja) * | 2008-02-22 | 2009-08-27 | 武蔵エンジニアリング株式会社 | 吐出量補正方法および塗布装置 |
WO2010087314A1 (ja) * | 2009-01-29 | 2010-08-05 | 芝浦メカトロニクス株式会社 | 塗布装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018074232A1 (ja) * | 2016-10-17 | 2018-04-26 | 住友電装株式会社 | 防食剤供給状態検査装置、防食剤供給装置及び端子付電線の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20160030970A1 (en) | 2016-02-04 |
CN105009696A (zh) | 2015-10-28 |
WO2014141644A1 (ja) | 2014-09-18 |
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