IT1313118B1 - Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello - Google Patents

Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello

Info

Publication number
IT1313118B1
IT1313118B1 IT1999MI001834A ITMI991834A IT1313118B1 IT 1313118 B1 IT1313118 B1 IT 1313118B1 IT 1999MI001834 A IT1999MI001834 A IT 1999MI001834A IT MI991834 A ITMI991834 A IT MI991834A IT 1313118 B1 IT1313118 B1 IT 1313118B1
Authority
IT
Italy
Prior art keywords
dry film
vacuum
printed circuit
board
heat
Prior art date
Application number
IT1999MI001834A
Other languages
English (en)
Inventor
R Charles Keil
Osvaldo Novello
Original Assignee
Morton Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Int Inc filed Critical Morton Int Inc
Publication of ITMI991834A0 publication Critical patent/ITMI991834A0/it
Priority to IT1999MI001834A priority Critical patent/IT1313118B1/it
Priority to AT00306950T priority patent/ATE270190T1/de
Priority to EP00306950A priority patent/EP1078734B1/en
Priority to DE60011857T priority patent/DE60011857T2/de
Priority to CNB001262254A priority patent/CN1223248C/zh
Priority to SG200004844A priority patent/SG83814A1/en
Priority to KR1020000049686A priority patent/KR20010021426A/ko
Priority to US09/648,445 priority patent/US6585837B1/en
Priority to JP2000256145A priority patent/JP2001113598A/ja
Priority to TW089117254A priority patent/TW466177B/zh
Publication of ITMI991834A1 publication Critical patent/ITMI991834A1/it
Application granted granted Critical
Publication of IT1313118B1 publication Critical patent/IT1313118B1/it
Priority to US10/190,384 priority patent/US6679307B2/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60In a particular environment
    • B32B2309/68Vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092All laminae planar and face to face
IT1999MI001834A 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello IT1313118B1 (it)

Priority Applications (11)

Application Number Priority Date Filing Date Title
IT1999MI001834A IT1313118B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello
AT00306950T ATE270190T1 (de) 1999-08-25 2000-08-14 Vakuumlaminierungsvorrichtung mit fördereinrichtung und verfahren zum aufbringen eines trockenfilmresists auf eine leiterplatte
EP00306950A EP1078734B1 (en) 1999-08-25 2000-08-14 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
DE60011857T DE60011857T2 (de) 1999-08-25 2000-08-14 Vakuumlaminierungsvorrichtung mit Fördereinrichtung und Verfahren zum Aufbringen eines Trockenfilmresists auf eine Leiterplatte
KR1020000049686A KR20010021426A (ko) 1999-08-25 2000-08-25 컨베이어화된 진공 어플리케이터 및 인쇄 회로 기판에건조 필름 레지스트를 도포하는 방법
SG200004844A SG83814A1 (en) 1999-08-25 2000-08-25 Conveyorized vacuum applicator and method of applying a dry film to a printed circuit board
CNB001262254A CN1223248C (zh) 1999-08-25 2000-08-25 传送带式真空施加器及印刷电路板抗蚀干性膜施加方法
US09/648,445 US6585837B1 (en) 1999-08-25 2000-08-25 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
JP2000256145A JP2001113598A (ja) 1999-08-25 2000-08-25 真空ラミネート装置
TW089117254A TW466177B (en) 1999-08-25 2000-08-25 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
US10/190,384 US6679307B2 (en) 1999-08-25 2002-07-03 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT1999MI001834A IT1313118B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello

Publications (3)

Publication Number Publication Date
ITMI991834A0 ITMI991834A0 (it) 1999-08-25
ITMI991834A1 ITMI991834A1 (it) 2001-02-25
IT1313118B1 true IT1313118B1 (it) 2002-06-17

Family

ID=11383559

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999MI001834A IT1313118B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello

Country Status (10)

Country Link
US (2) US6585837B1 (it)
EP (1) EP1078734B1 (it)
JP (1) JP2001113598A (it)
KR (1) KR20010021426A (it)
CN (1) CN1223248C (it)
AT (1) ATE270190T1 (it)
DE (1) DE60011857T2 (it)
IT (1) IT1313118B1 (it)
SG (1) SG83814A1 (it)
TW (1) TW466177B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016139687A1 (en) 2015-03-05 2016-09-09 Automatic Lamination Technologies S.R.L. Apparatus and method for making a photosensitive film adhere to a multilayer sheet in order to obtain a printed circuit board

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IT1313117B1 (it) * 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di
DE60313980T2 (de) * 2002-09-04 2008-01-17 Koninklijke Philips Electronics N.V. Verfahren und vorrichtung zum verbinden zweier plattenförmiger gegenstände
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
CN100456908C (zh) * 2003-11-28 2009-01-28 顶瑞机械股份有限公司 印刷电路板之保护膜热压着制法
JP4525180B2 (ja) * 2004-05-28 2010-08-18 凸版印刷株式会社 真空積層装置及びこれを用いた絶縁層の形成方法
TW200604060A (en) * 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
KR100583676B1 (ko) * 2004-11-05 2006-05-26 로얄소브린 주식회사 플레이트 방식의 라미네이터
TW200635425A (en) * 2004-12-30 2006-10-01 Du Pont Encapsulation tool and methods
KR100729427B1 (ko) 2005-03-07 2007-06-15 주식회사 디엠에스 미세패턴 형성장치
KR20100025597A (ko) * 2005-05-23 2010-03-09 이비덴 가부시키가이샤 프린트 배선판
CN100505992C (zh) * 2005-11-02 2009-06-24 比亚迪股份有限公司 一种多层柔性线路板真空层压干膜的方法
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
DE102007029762B4 (de) * 2007-06-27 2010-06-24 Eads Deutschland Gmbh Verfahren zur Verbindung eines trockenen Faserbands mit einem trockenen Faserstrang
US8037915B2 (en) * 2007-09-20 2011-10-18 Siemens Energy, Inc. Method and apparatus for forming insulated rotor conductors
KR101047098B1 (ko) * 2008-10-23 2011-07-07 에센하이텍(주) 자동레이업 장치
CN103048826B (zh) * 2012-12-20 2015-06-17 深圳市华星光电技术有限公司 偏光板定位装置及定位方法
CN104465416B (zh) * 2014-12-12 2017-11-07 通富微电子股份有限公司 一种贴干膜机及贴干膜的方法
CN108012462B (zh) * 2017-11-07 2020-03-31 上海御渡半导体科技有限公司 一种具有装夹装置的电路板的压合机构的使用方法
CN111919058B (zh) * 2018-02-08 2023-03-10 田边晓人 面发光体及其制造方法
JP7298864B2 (ja) 2018-12-27 2023-06-27 株式会社 ベアック ラミネート基板製造装置、ラミネート基板製造ライン及びラミネート基板の製造方法
CN110053246A (zh) * 2019-03-18 2019-07-26 苏州领裕电子科技有限公司 一种超薄pi膜自动贴合设备
CN110057246A (zh) * 2019-05-06 2019-07-26 苏州高甲防护科技有限公司 一种插槽式高安全性的防刺面料结构
CN111276790A (zh) * 2020-03-31 2020-06-12 西安理工大学 一种提升丝网印刷rfid读写器天线性能的方法
DE102020119857A1 (de) * 2020-07-28 2022-02-03 Hanwha Q Cells Gmbh Beabstandungsvorrichtung für ein System zum Laminieren
CN114501975A (zh) * 2022-03-04 2022-05-13 王建民 一种电路板生产用覆铜板调位模块

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US4992354A (en) 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
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DE4018177A1 (de) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens
IT1250461B (it) * 1991-08-09 1995-04-07 Morton Int Inc Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
JPH08500214A (ja) * 1993-06-11 1996-01-09 イソボルタ・エスターライヒツシエ・イゾリールシユトツフベルケ・アクチエンゲゼルシヤフト 光電池モジュールの製造方法及びこの方法を実施するための装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016139687A1 (en) 2015-03-05 2016-09-09 Automatic Lamination Technologies S.R.L. Apparatus and method for making a photosensitive film adhere to a multilayer sheet in order to obtain a printed circuit board

Also Published As

Publication number Publication date
DE60011857D1 (de) 2004-08-05
ATE270190T1 (de) 2004-07-15
EP1078734A2 (en) 2001-02-28
JP2001113598A (ja) 2001-04-24
EP1078734A3 (en) 2002-07-17
TW466177B (en) 2001-12-01
CN1223248C (zh) 2005-10-12
US20030051790A1 (en) 2003-03-20
US6585837B1 (en) 2003-07-01
ITMI991834A1 (it) 2001-02-25
SG83814A1 (en) 2001-10-16
KR20010021426A (ko) 2001-03-15
EP1078734B1 (en) 2004-06-30
ITMI991834A0 (it) 1999-08-25
DE60011857T2 (de) 2005-06-30
CN1293534A (zh) 2001-05-02
US6679307B2 (en) 2004-01-20

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