TWI274657B - Transparent member, optical device using transparent member and method of manufacturing optical device - Google Patents

Transparent member, optical device using transparent member and method of manufacturing optical device Download PDF

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Publication number
TWI274657B
TWI274657B TW094133496A TW94133496A TWI274657B TW I274657 B TWI274657 B TW I274657B TW 094133496 A TW094133496 A TW 094133496A TW 94133496 A TW94133496 A TW 94133496A TW I274657 B TWI274657 B TW I274657B
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
optical element
light transmissive
square
Prior art date
Application number
TW094133496A
Other languages
English (en)
Chinese (zh)
Other versions
TW200613123A (en
Inventor
Takeshi Ashida
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200613123A publication Critical patent/TW200613123A/zh
Application granted granted Critical
Publication of TWI274657B publication Critical patent/TWI274657B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Lens Barrels (AREA)
TW094133496A 2004-10-07 2005-09-27 Transparent member, optical device using transparent member and method of manufacturing optical device TWI274657B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004294980A JP5128047B2 (ja) 2004-10-07 2004-10-07 光デバイス及び光デバイスの生産方法

Publications (2)

Publication Number Publication Date
TW200613123A TW200613123A (en) 2006-05-01
TWI274657B true TWI274657B (en) 2007-03-01

Family

ID=36145415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133496A TWI274657B (en) 2004-10-07 2005-09-27 Transparent member, optical device using transparent member and method of manufacturing optical device

Country Status (3)

Country Link
US (3) US20060078246A1 (https=)
JP (1) JP5128047B2 (https=)
TW (1) TWI274657B (https=)

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US8110842B2 (en) 2007-05-18 2012-02-07 Everlight Electronics Co., Ltd. Light-emitting diode module and manufacturing method thereof
US8790939B2 (en) 2008-02-22 2014-07-29 Osram Opto Semiconductors Gmbh Method for producing a plurality of radiation-emitting components and radiation-emitting component

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US8222059B2 (en) 2012-07-17
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US20060078246A1 (en) 2006-04-13
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