FI118158B
(sv)
*
|
1999-10-15 |
2007-07-31 |
Asm Int |
Förfarande för modifiering av utgångsämneskemikalierna i en ALD-prosess
|
TW576873B
(en)
*
|
2000-04-14 |
2004-02-21 |
Asm Int |
Method of growing a thin film onto a substrate
|
FI20001694A0
(fi)
*
|
2000-07-20 |
2000-07-20 |
Asm Microchemistry Oy |
Menetelmä ohutkalvon kasvattamiseksi substraatille
|
US6825447B2
(en)
|
2000-12-29 |
2004-11-30 |
Applied Materials, Inc. |
Apparatus and method for uniform substrate heating and contaminate collection
|
US6765178B2
(en)
|
2000-12-29 |
2004-07-20 |
Applied Materials, Inc. |
Chamber for uniform substrate heating
|
US6878206B2
(en)
|
2001-07-16 |
2005-04-12 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US6660126B2
(en)
|
2001-03-02 |
2003-12-09 |
Applied Materials, Inc. |
Lid assembly for a processing system to facilitate sequential deposition techniques
|
US20030198754A1
(en)
*
|
2001-07-16 |
2003-10-23 |
Ming Xi |
Aluminum oxide chamber and process
|
US8110489B2
(en)
|
2001-07-25 |
2012-02-07 |
Applied Materials, Inc. |
Process for forming cobalt-containing materials
|
US20090004850A1
(en)
|
2001-07-25 |
2009-01-01 |
Seshadri Ganguli |
Process for forming cobalt and cobalt silicide materials in tungsten contact applications
|
US9051641B2
(en)
|
2001-07-25 |
2015-06-09 |
Applied Materials, Inc. |
Cobalt deposition on barrier surfaces
|
US7085616B2
(en)
|
2001-07-27 |
2006-08-01 |
Applied Materials, Inc. |
Atomic layer deposition apparatus
|
US6718126B2
(en)
|
2001-09-14 |
2004-04-06 |
Applied Materials, Inc. |
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
|
US7780785B2
(en)
|
2001-10-26 |
2010-08-24 |
Applied Materials, Inc. |
Gas delivery apparatus for atomic layer deposition
|
US6916398B2
(en)
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
US6773507B2
(en)
|
2001-12-06 |
2004-08-10 |
Applied Materials, Inc. |
Apparatus and method for fast-cycle atomic layer deposition
|
US6729824B2
(en)
|
2001-12-14 |
2004-05-04 |
Applied Materials, Inc. |
Dual robot processing system
|
KR20030058595A
(ko)
*
|
2001-12-31 |
2003-07-07 |
주식회사 하이닉스반도체 |
박막 형성 방법
|
AU2003238853A1
(en)
|
2002-01-25 |
2003-09-02 |
Applied Materials, Inc. |
Apparatus for cyclical deposition of thin films
|
US6998014B2
(en)
|
2002-01-26 |
2006-02-14 |
Applied Materials, Inc. |
Apparatus and method for plasma assisted deposition
|
US6911391B2
(en)
|
2002-01-26 |
2005-06-28 |
Applied Materials, Inc. |
Integration of titanium and titanium nitride layers
|
US6866746B2
(en)
*
|
2002-01-26 |
2005-03-15 |
Applied Materials, Inc. |
Clamshell and small volume chamber with fixed substrate support
|
US6972267B2
(en)
|
2002-03-04 |
2005-12-06 |
Applied Materials, Inc. |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
|
JP4361713B2
(ja)
*
|
2002-03-29 |
2009-11-11 |
株式会社日立国際電気 |
基板処理装置
|
TWI273642B
(en)
*
|
2002-04-19 |
2007-02-11 |
Ulvac Inc |
Film-forming apparatus and film-forming method
|
US7601225B2
(en)
*
|
2002-06-17 |
2009-10-13 |
Asm International N.V. |
System for controlling the sublimation of reactants
|
JP4486794B2
(ja)
*
|
2002-06-17 |
2010-06-23 |
エーエスエム インターナショナル エヌ.ヴェー. |
固体の先駆物質から蒸気を生成する方法、基板処理システム及び混合物
|
US6955211B2
(en)
|
2002-07-17 |
2005-10-18 |
Applied Materials, Inc. |
Method and apparatus for gas temperature control in a semiconductor processing system
|
US7186385B2
(en)
|
2002-07-17 |
2007-03-06 |
Applied Materials, Inc. |
Apparatus for providing gas to a processing chamber
|
US7066194B2
(en)
|
2002-07-19 |
2006-06-27 |
Applied Materials, Inc. |
Valve design and configuration for fast delivery system
|
US6772072B2
(en)
|
2002-07-22 |
2004-08-03 |
Applied Materials, Inc. |
Method and apparatus for monitoring solid precursor delivery
|
EP1525337A2
(en)
*
|
2002-07-30 |
2005-04-27 |
ASM America, Inc. |
Sublimation system employing carrier gas
|
US6936086B2
(en)
*
|
2002-09-11 |
2005-08-30 |
Planar Systems, Inc. |
High conductivity particle filter
|
US6821563B2
(en)
*
|
2002-10-02 |
2004-11-23 |
Applied Materials, Inc. |
Gas distribution system for cyclical layer deposition
|
JP4204840B2
(ja)
*
|
2002-10-08 |
2009-01-07 |
株式会社日立国際電気 |
基板処埋装置
|
US20040069227A1
(en)
|
2002-10-09 |
2004-04-15 |
Applied Materials, Inc. |
Processing chamber configured for uniform gas flow
|
US6905737B2
(en)
|
2002-10-11 |
2005-06-14 |
Applied Materials, Inc. |
Method of delivering activated species for rapid cyclical deposition
|
JP4759916B2
(ja)
*
|
2002-12-13 |
2011-08-31 |
東京エレクトロン株式会社 |
処理装置
|
US6994319B2
(en)
*
|
2003-01-29 |
2006-02-07 |
Applied Materials, Inc. |
Membrane gas valve for pulsing a gas
|
US6868859B2
(en)
*
|
2003-01-29 |
2005-03-22 |
Applied Materials, Inc. |
Rotary gas valve for pulsing a gas
|
TW200420740A
(en)
*
|
2003-01-30 |
2004-10-16 |
Ifire Technology Inc |
Controlled sulfur species deposition process
|
US20040177813A1
(en)
|
2003-03-12 |
2004-09-16 |
Applied Materials, Inc. |
Substrate support lift mechanism
|
CN1777696B
(zh)
*
|
2003-03-14 |
2011-04-20 |
杰努斯公司 |
用于原子层沉积的方法和设备
|
US7342984B1
(en)
|
2003-04-03 |
2008-03-11 |
Zilog, Inc. |
Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character
|
US8152922B2
(en)
*
|
2003-08-29 |
2012-04-10 |
Asm America, Inc. |
Gas mixer and manifold assembly for ALD reactor
|
US20050067103A1
(en)
|
2003-09-26 |
2005-03-31 |
Applied Materials, Inc. |
Interferometer endpoint monitoring device
|
US7156380B2
(en)
*
|
2003-09-29 |
2007-01-02 |
Asm International, N.V. |
Safe liquid source containers
|
US20050252449A1
(en)
|
2004-05-12 |
2005-11-17 |
Nguyen Son T |
Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
|
US8119210B2
(en)
|
2004-05-21 |
2012-02-21 |
Applied Materials, Inc. |
Formation of a silicon oxynitride layer on a high-k dielectric material
|
US8323754B2
(en)
|
2004-05-21 |
2012-12-04 |
Applied Materials, Inc. |
Stabilization of high-k dielectric materials
|
GB0411679D0
(en)
*
|
2004-05-25 |
2004-06-30 |
Boc Group Plc |
Gas supply system
|
US20060019029A1
(en)
*
|
2004-07-20 |
2006-01-26 |
Hamer Kevin T |
Atomic layer deposition methods and apparatus
|
US7253084B2
(en)
*
|
2004-09-03 |
2007-08-07 |
Asm America, Inc. |
Deposition from liquid sources
|
US20120295038A1
(en)
*
|
2005-04-29 |
2012-11-22 |
Ce Ma |
Method and apparatus for using solution based precursors for atomic layer deposition
|
US7402534B2
(en)
|
2005-08-26 |
2008-07-22 |
Applied Materials, Inc. |
Pretreatment processes within a batch ALD reactor
|
US7464917B2
(en)
|
2005-10-07 |
2008-12-16 |
Appiled Materials, Inc. |
Ampoule splash guard apparatus
|
CN101448977B
(zh)
|
2005-11-04 |
2010-12-15 |
应用材料股份有限公司 |
用于等离子体增强的原子层沉积的设备和工艺
|
US7595271B2
(en)
*
|
2005-12-01 |
2009-09-29 |
Asm America, Inc. |
Polymer coating for vapor deposition tool
|
US20070169687A1
(en)
*
|
2006-01-26 |
2007-07-26 |
Caracal, Inc. |
Silicon carbide formation by alternating pulses
|
US7798096B2
(en)
|
2006-05-05 |
2010-09-21 |
Applied Materials, Inc. |
Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
|
US7601648B2
(en)
|
2006-07-31 |
2009-10-13 |
Applied Materials, Inc. |
Method for fabricating an integrated gate dielectric layer for field effect transistors
|
JP5073751B2
(ja)
*
|
2006-10-10 |
2012-11-14 |
エーエスエム アメリカ インコーポレイテッド |
前駆体送出システム
|
US8092695B2
(en)
|
2006-10-30 |
2012-01-10 |
Applied Materials, Inc. |
Endpoint detection for photomask etching
|
US7775508B2
(en)
|
2006-10-31 |
2010-08-17 |
Applied Materials, Inc. |
Ampoule for liquid draw and vapor draw with a continuous level sensor
|
US7571893B2
(en)
|
2006-11-16 |
2009-08-11 |
Asm America, Inc. |
Valve with high temperature rating
|
US8821637B2
(en)
|
2007-01-29 |
2014-09-02 |
Applied Materials, Inc. |
Temperature controlled lid assembly for tungsten nitride deposition
|
US20080241387A1
(en)
*
|
2007-03-29 |
2008-10-02 |
Asm International N.V. |
Atomic layer deposition reactor
|
FI122941B
(fi)
*
|
2008-06-12 |
2012-09-14 |
Beneq Oy |
Sovitelma ALD-reaktorin yhteydessä
|
US8343583B2
(en)
|
2008-07-10 |
2013-01-01 |
Asm International N.V. |
Method for vaporizing non-gaseous precursor in a fluidized bed
|
JP2010024498A
(ja)
*
|
2008-07-18 |
2010-02-04 |
Tokyo Electron Ltd |
成膜装置及び粉体気化装置
|
US8146896B2
(en)
|
2008-10-31 |
2012-04-03 |
Applied Materials, Inc. |
Chemical precursor ampoule for vapor deposition processes
|
US8012876B2
(en)
|
2008-12-02 |
2011-09-06 |
Asm International N.V. |
Delivery of vapor precursor from solid source
|
JP2010219292A
(ja)
*
|
2009-03-17 |
2010-09-30 |
Tokyo Electron Ltd |
成膜方法
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
US20100266765A1
(en)
*
|
2009-04-21 |
2010-10-21 |
White Carl L |
Method and apparatus for growing a thin film onto a substrate
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
KR101084234B1
(ko)
*
|
2009-11-30 |
2011-11-16 |
삼성모바일디스플레이주식회사 |
증착원, 이를 구비하는 증착 장치 및 박막 형성 방법
|
US8778204B2
(en)
|
2010-10-29 |
2014-07-15 |
Applied Materials, Inc. |
Methods for reducing photoresist interference when monitoring a target layer in a plasma process
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
US8961804B2
(en)
|
2011-10-25 |
2015-02-24 |
Applied Materials, Inc. |
Etch rate detection for photomask etching
|
US9574268B1
(en)
|
2011-10-28 |
2017-02-21 |
Asm America, Inc. |
Pulsed valve manifold for atomic layer deposition
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
US8808559B2
(en)
|
2011-11-22 |
2014-08-19 |
Applied Materials, Inc. |
Etch rate detection for reflective multi-material layers etching
|
US8900469B2
(en)
|
2011-12-19 |
2014-12-02 |
Applied Materials, Inc. |
Etch rate detection for anti-reflective coating layer and absorber layer etching
|
US9388492B2
(en)
|
2011-12-27 |
2016-07-12 |
Asm America, Inc. |
Vapor flow control apparatus for atomic layer deposition
|
JP5824372B2
(ja)
*
|
2012-01-25 |
2015-11-25 |
東京エレクトロン株式会社 |
処理装置及びプロセス状態の確認方法
|
US20130255784A1
(en)
*
|
2012-03-30 |
2013-10-03 |
Applied Materials, Inc. |
Gas delivery systems and methods of use thereof
|
US9805939B2
(en)
|
2012-10-12 |
2017-10-31 |
Applied Materials, Inc. |
Dual endpoint detection for advanced phase shift and binary photomasks
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
US8778574B2
(en)
|
2012-11-30 |
2014-07-15 |
Applied Materials, Inc. |
Method for etching EUV material layers utilized to form a photomask
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
US9926202B2
(en)
|
2013-08-16 |
2018-03-27 |
Indian Institute Of Technology Madras |
Graphene quantum dots, their composites and preparation of the same
|
CN103526282A
(zh)
*
|
2013-10-22 |
2014-01-22 |
北京大学东莞光电研究院 |
一种生长氮化物单晶体材料的装置及方法
|
KR101635759B1
(ko)
*
|
2013-11-25 |
2016-07-04 |
주식회사 선익시스템 |
물질이동 가스의 분리장치 및 이를 포함하는 화학기상 증착장치
|
CN106103795B
(zh)
*
|
2014-01-23 |
2019-03-12 |
雅达公司 |
蒸气输送系统
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
US10249511B2
(en)
*
|
2014-06-27 |
2019-04-02 |
Lam Research Corporation |
Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US10662527B2
(en)
|
2016-06-01 |
2020-05-26 |
Asm Ip Holding B.V. |
Manifolds for uniform vapor deposition
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
US10876205B2
(en)
|
2016-09-30 |
2020-12-29 |
Asm Ip Holding B.V. |
Reactant vaporizer and related systems and methods
|
US11926894B2
(en)
|
2016-09-30 |
2024-03-12 |
Asm Ip Holding B.V. |
Reactant vaporizer and related systems and methods
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
KR20180068582A
(ko)
|
2016-12-14 |
2018-06-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US11447861B2
(en)
*
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
US11581186B2
(en)
*
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
KR20180070971A
(ko)
|
2016-12-19 |
2018-06-27 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
KR102491945B1
(ko)
|
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2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
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|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
US10147597B1
(en)
|
2017-09-14 |
2018-12-04 |
Lam Research Corporation |
Turbulent flow spiral multi-zone precursor vaporizer
|
KR102630301B1
(ko)
|
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2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
US10927459B2
(en)
|
2017-10-16 |
2021-02-23 |
Asm Ip Holding B.V. |
Systems and methods for atomic layer deposition
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
WO2019103613A1
(en)
|
2017-11-27 |
2019-05-31 |
Asm Ip Holding B.V. |
A storage device for storing wafer cassettes for use with a batch furnace
|
KR102633318B1
(ko)
|
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2024-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
청정 소형 구역을 포함한 장치
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
CN111630203A
(zh)
|
2018-01-19 |
2020-09-04 |
Asm Ip私人控股有限公司 |
通过等离子体辅助沉积来沉积间隙填充层的方法
|
TWI799494B
(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Asm 智慧財產控股公司 |
沈積方法
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
WO2019158960A1
(en)
|
2018-02-14 |
2019-08-22 |
Asm Ip Holding B.V. |
A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
US11060186B2
(en)
*
|
2018-04-13 |
2021-07-13 |
Massachusetts Institute Of Technology |
In situ generation of gaseous precursors for chemical vapor deposition of a chalcogenide
|
KR20190128558A
(ko)
|
2018-05-08 |
2019-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조
|
TW202349473A
(zh)
|
2018-05-11 |
2023-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
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|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
US11270899B2
(en)
|
2018-06-04 |
2022-03-08 |
Asm Ip Holding B.V. |
Wafer handling chamber with moisture reduction
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
TW202409324A
(zh)
|
2018-06-27 |
2024-03-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於形成含金屬材料之循環沉積製程
|
TW202405221A
(zh)
|
2018-06-27 |
2024-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
用於形成含金屬材料及包含含金屬材料的膜及結構之循環沉積方法
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
TWI751420B
(zh)
|
2018-06-29 |
2022-01-01 |
荷蘭商Asm知識產權私人控股有限公司 |
薄膜沉積方法
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
JP7376278B2
(ja)
|
2018-08-16 |
2023-11-08 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
固体原料昇華器
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR20200030162A
(ko)
|
2018-09-11 |
2020-03-20 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
CN110970344A
(zh)
|
2018-10-01 |
2020-04-07 |
Asm Ip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
US10847365B2
(en)
|
2018-10-11 |
2020-11-24 |
Asm Ip Holding B.V. |
Method of forming conformal silicon carbide film by cyclic CVD
|
US10811256B2
(en)
|
2018-10-16 |
2020-10-20 |
Asm Ip Holding B.V. |
Method for etching a carbon-containing feature
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(ko)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
JP7504584B2
(ja)
|
2018-12-14 |
2024-06-24 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
TWI819180B
(zh)
|
2019-01-17 |
2023-10-21 |
荷蘭商Asm 智慧財產控股公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
KR20200091543A
(ko)
|
2019-01-22 |
2020-07-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
JP2020136678A
(ja)
|
2019-02-20 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための方法および装置
|
JP7509548B2
(ja)
|
2019-02-20 |
2024-07-02 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための周期的堆積方法および装置
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
US11482533B2
(en)
|
2019-02-20 |
2022-10-25 |
Asm Ip Holding B.V. |
Apparatus and methods for plug fill deposition in 3-D NAND applications
|
JP2020133004A
(ja)
|
2019-02-22 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材を処理するための基材処理装置および方法
|
KR20200108248A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
SiOCN 층을 포함한 구조체 및 이의 형성 방법
|
KR20200108242A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
KR20200108243A
(ko)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
US11492701B2
(en)
|
2019-03-19 |
2022-11-08 |
Asm Ip Holding B.V. |
Reactor manifolds
|
KR20200116033A
(ko)
|
2019-03-28 |
2020-10-08 |
에이에스엠 아이피 홀딩 비.브이. |
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|
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|
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|
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|
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|
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|
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*
|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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(en)
|
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|
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(en)
|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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(zh)
|
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|
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|
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|
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|
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|
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|
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|
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(en)
|
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|
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|
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|
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|
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|
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(ko)
|
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|
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|
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|
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|
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|
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(en)
|
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|
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|
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|
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|
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|
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(ko)
|
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|
US11450529B2
(en)
|
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|
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|
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|
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|
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|
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|
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|
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(ja)
|
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|
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|
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|
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|
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에이에스엠 아이피 홀딩 비.브이. |
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|
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(en)
|
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|
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|
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에이에스엠 아이피 홀딩 비.브이. |
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|
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|
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|
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(en)
|
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|
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|
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|
DE102020102076A1
(de)
*
|
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Universität Hamburg |
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|
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|
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|
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|
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|
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(en)
|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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|
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