TW562965B - System and method for reticle protection and transport - Google Patents
System and method for reticle protection and transport Download PDFInfo
- Publication number
- TW562965B TW562965B TW091117896A TW91117896A TW562965B TW 562965 B TW562965 B TW 562965B TW 091117896 A TW091117896 A TW 091117896A TW 91117896 A TW91117896 A TW 91117896A TW 562965 B TW562965 B TW 562965B
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- Prior art keywords
- reticle
- cassette
- photomask
- mask
- removable
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000012636 effector Substances 0.000 claims abstract description 27
- 238000001459 lithography Methods 0.000 claims abstract description 12
- 230000002079 cooperative effect Effects 0.000 claims description 5
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 31
- 235000012431 wafers Nutrition 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- -1 Dedin (trademark) Substances 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001146 hypoxic effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Public Health (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
562965 A7 __________B7_ 五、發明説明(1 ) 發明背景: 發明領域: 本發明係大致有關微影,尤係有關微影光罩之保護。 相關技藝: 微影是一種用來在基材的表面上產生線路區之製程。 此種基材可包括用於平板顯示器、電路板、及各種積體電 路等的裝置製造之那些基材。例如,半導體晶圓可用來作 爲製造積體電路之基材。 在微影期間,利用光罩將一所需的圖樣轉印到基材上 。係由對所用的微影波長爲透明的一材料形成該光罩。例 如,在可見光的情形中,係由玻璃形成該光罩。該光罩上 具有印刷的一圖樣。係針對使用該光罩的特定系統而選擇 該光罩的尺寸。在微影期間,由一晶圓載物臺所支承的一 晶圓接受一影像之曝光,而該影像係以對應於該光罩上印 刷的該影像之方式投射於該晶圓的表面上。 該投射的影像使晶圓表面上沈積的諸如光阻等的一層 之特性產生改變。這些改變對應於在曝光期間投射到晶圓 上的線路區。在曝光之後,可蝕刻該層,以便製作一產生 圖樣的層。該圖樣對應於在曝光期間投射到晶圓上的那些 線路區。然後利用該產生圖樣的層來去除該晶圓內的各下 方結構層(例如導體層、半導體層、或絕緣層)之露出部 分。然後重複該程序並配合其他步驟,直到在晶圓表面上 形成了所需的線路區爲止。由前文的說明可了解,利用微 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) •裝-- (請先閲讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 -4 - 562965 經濟部智慈財產局Μ工消費合作社印製 A7 B7 五、發明説明(2 ) 影製程製作的線路區之準確位置及尺寸係與投射到晶圓上 的影像之精確度及準確度有直接的關係。 除了前文所述的透射性光罩之外,此項技藝中也使用 反射性光罩。例如,反射性光罩係用於短波長的光線,而 此種短波長的光線將會被透射性玻璃光罩所吸收。 在使光罩表面有最少的污染之努力下,係在一 “潔淨 室”中執行微影製程。潔淨室是一個具有一規定受控制的 微粒濃度之密封空間。爲了維持該規定受控制的微粒濃度 ,係將氣體材料提供給該密封空間,並自該密封空間抽出 氣體材料。一可觀的費用係與一潔淨室的維護相關聯。該 費用係與該潔淨室的尺寸及維護該潔淨室所需的設備有部 分的關係。例如,由於光罩係自一微影製程中的某一載物 臺輸送到另一載物臺,所以這些光罩由於製程區內出現的 微粒而易於被污染。爲了儘量減少污染的可能性,通常係 將光罩輸送所在的整個房間保持在一潔淨的狀態。因此, 減少必須保持在潔淨狀態的環境是有一誘因的。減少潔淨 室尺寸的另一誘因是安全性。在某些情形中,潔淨室是處 於缺氧狀態,因而不適於人員的進駐。如果可將潔淨室隔 離到一較小的環境,則可將周圍的區域維持在安全使用的 狀態,且適於人員的進駐。 於 2001年 5月29日將專利權授予 Catey等人 且已讓渡給 Silicon Valley Group,Inc.的美國專利 6,239,863揭示了一種用來保護微影系統中所用的光罩之 抽換式遮蓋物。該抽換式遮蓋物包含一框架、及由該框架 本紙張尺度適用中國國家標準(CNS ) A4規格(210x297公釐) 衣------1T------ (請先閱讀背面之注意事項再填寫本頁) 562965 A7 B7 五、發明説明(3 ) (請先閲讀背面之注意事項再填寫本頁) 所支承的一薄膜。該抽換式遮蓋物可進一步包含至少一個 光罩結件,用以對該光罩施力,因而當該抽換式遮蓋物在 適當的位置時,可避免該抽換式遮蓋物有相對於該光罩的 移動。使用光罩結件時,有從光罩與光罩結件間之接觸點 產生污染的機會。 因此,目前需要一種可進一步減少光罩在輸送期間被 污染的可能性之方法,且此種方法也減少了在一密封空間 內的較大空間中或一較大環境中維持潔淨的需求。 發明槪述: 經濟部智慈財產局員工消費合作社印製 本發明提供了一種光罩保護及輸送系統以及用於微影 工具的方法。該系統包含一索引器,用以儲存複數個光罩 及一抽換式光罩卡匣。該抽換式光罩卡匣包含一內腔及一 外腔。該系統進一步包含一耦合到一機械手臂之末端效應 器。該末端效應器嚙合該等複數個光罩中之一光罩,以便 使該光罩定位在該抽換式光罩卡匣之內,且於隨後進行輸 送。爲了進一步保護該抽換式光罩卡匣內的該光罩,該系 統進一步包含一耦合到該末端效應器及該機械手臂之封閉 物。 爲了輸送該光罩,首先將該光罩裝載於該末端效應器 。然後利用該末端效應器產生使該光罩被裝載在該抽換式 光罩卡匣之一配置。重要的是:該光罩及該抽換式光罩卡 匣並未相互接觸。然後密封該配置,並將該配置自該索引 器輸送到固定架,以便執行微影曝光。一旦完成微影曝光 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -6 - 562965 A7 ______ B7 五、發明説明(4 ) 之後,即將該配置送回到該索引器,此時自該抽換式光罩 卡匣取出該光罩,並儲存該光罩。若參照下文中對本發明 (請先閱讀背面之注意事項再填寫本頁) 之詳細說明,將可易於了解上述至些及其他的優點及特徵 〇 圖式簡述: 現在將參照各附圖而說明本發明。在該等圖式中,相 同的代號指示相同的或功能類似的元件。此外,一代號最 左端的數字標示該代號首次出現的圖式。 圖1示出根據本發明一實施例的一光罩輸送系統。 圖2示出根據本發明一實施例的一抽換式光罩卡匣 〇 圖3示出根據本發明一實施例的一抽換式光罩卡匣 內的一光罩及保護膜之一配置。 圖4及5示出將一光罩裝載到根據本發明一實施 例的一抽換式光罩卡匣之一方法。 經濟部智慧財產局員工消費合作社印製 主要元件對照表 100 光罩輸送系統 105 索引器 109 光罩 110 保護膜 113 末端效應器 111 抽換式光罩卡匣 115 機械手臂 太紙.檨尺麼摘用Φ圃圃定德進f CNS ) A4规抵(210 X 297公婊) 562965 A7 _B7 五、發明説明(5 ) (請先閱讀背面之注意事項再填寫本頁) 117 封閉物 107 門 205 內腔 210 外腔 較佳實施例之詳細說明: 現在將詳細說明本發明的較佳實施例。雖然係說明特 定的特徵、組態、及配置,但是我們當了解,這些說明只 是用於解說。熟習相關技藝者當可了解,在不脫離本發明 的精神及範圍下,亦可使用其他的步驟、組態、以及配置 或裝置來獲致本發明的該等特徵。事實上,爲了說明的簡 潔,本文中可能不會詳細說明半導體裝置的傳統電子知識 及製造、以及該方法/裝置的其他功能性面向(以及裝置 的個別工作組件之組成部分)。 圖1示出一微影工具的一光罩輸送系統(100)。 經濟部智慧財產局員工消費合作社印製 該光罩輸送系統(100)包含一索引器(105)。根據本發 明的一實施例,索引器(105)進一步包含該微影工具內 的一組架子(圖中未示出)。該索引器(105 )內維持有 一惰性氣體。例如,根據一實施例,索引器(105 )充滿 了氮氣及其他必要的氣體材料,以便符合潔淨室的要求。 複數個光罩(109)係儲存在索引器(105)內的各架 子(圖中未示出)上。光罩係用來將一特定的圖樣轉印到 諸如一半導體晶圓、一平板顯示器、及一電路板等的一基 材上。如熟習微影技藝者所了解的,該光罩可以是反射型 本紙乐尺度適用中國國家標準(cns ) A4規格(21〇Χ297公釐) 562965 經濟部智慧財4局員工消費合作社印製 A7 B7 五、發明説明(6 ) 或透射型。爲了使光罩(109)不會受到污染,可將一保 護膜(110)固定在該光罩(109)之上。可配合本發明而 使用的一個保護膜力紫係述於本案發明人所擁有的且於 2000年2月10日提出申請的待審美國非臨時專利申 請案 09/501,180 “Method and Apparatus for a Reticle with Purged Pellicle-to-Reticle Gap”,本發明特此引用該專利 申請案以供參照。 雖然係將圖1所示之該等光罩置於相互垂直的位置 ,但是此種呈現只是供舉例,並非對本發明加以限制。在 替代實施例中,亦可以相互水平之方式儲存該等光罩。同 樣地,在另一實施例中,可在一旋轉盤上儲存該等光罩, 並將該等光罩旋轉到該索引器內的一特定位置。在一較佳 實施例中,係以顛倒之方式儲存光罩(109 )及保護膜( 11 0 )。在此種方式下,落到該光罩上的任何污染物將是 在背面。如果係垂直地儲存光罩(109)及保護膜(110) (如圖1所示),則可將末端效應器(11 3 )作成使該 光罩及保護膜顛倒地旋轉。在參閱本文的揭示事項之後, 熟習相關技藝者將可了解在不脫離本發明範圍下的用來在 索引器(105)內儲存光罩(109)及保護膜(110)的其 他配置。 一抽換式光罩卡匣(111)也是儲存在該索引器(105 )內。該抽換式光罩卡匣(111 )係用來在輸送期間儲存 光罩(109)。抽換式光罩卡匣(111)的環境也是保持在 一"潔淨”狀態。在此種方式下,係在一小很多的空間 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 0^------、玎------9 ί請先閲讀背面之注意事項再填寫本頁} 經濟部智慧財產¾¾工消費合作社印製 562965 A7 B7 五、發明説明(7 ) 中保持潔淨室狀態。雖然圖示之索引器(105)只包含一 個抽換式光罩卡匣(111),但是這只是供舉例,並非在 對本發明加以限制。係由索引器(105 )的空間限制來決 定抽換式光罩卡匣(111)的數目、及所儲存光罩(109) 的數目。係參照一光罩及附著在該光罩的一保護膜而說明 本發明。然而,這只是供舉例,並非在對本發明加以限制 。亦可在不脫離本發明的範圍及精神下,使用並不具有保 護膜的光罩。下文中將參照圖2而提供對抽換式光罩卡 匣(1 11 )的進一步說明。 光罩輸送系統(100)進一步包含一耦合到一機械手 臂(115)之末端效應器(113)。末端效應器(113)嚙 合該等複數個光罩(109)中之一光罩、及保護膜(110) ,以便將光罩(109)及保護膜(110)定位在抽換式光罩 卡匣(111 )之內。在替代實施例中,亦可使用可嚙合該 光罩或保護膜(如果有保護膜)的一竿、或手動、或自動 機械裝置。在一較佳實施例中,末端效應器(11 3 )係經 由靜電吸引而嚙合光罩(109 )及保護膜(110)。在替代 實施例中,末端效應器(11 3 )可經由真空吸引而嚙合光 罩(109)及保護膜(110)。 一封閉物(117)亦係用於光罩輸送系統(100)。封 閉物(117)係用來將該光罩固定在抽換式光罩卡匣(111 )之內。封閉物(117)可以是可將光罩(109)固定在抽 換式光罩卡匣(111)之內同時使污染物不會進入該抽換 式光罩卡匣並使氮氣不會逸出抽換式光罩卡匣(111)的 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇χ 297公釐) --------0^------1Τ-----ΙΦ, (請先閱讀背面之注意事項再填寫本頁) _ 1Π - 562965 A7 B7 五、發明説明(8 ) 任何裝置。例如,封閉物(117 )可以是一真空封閉物或 一磁性封閉物。因此,可配合本發明而使用一真空系統或 一磁性系統等的系統,以便有助於密封的功能。 光罩輸送系統(100)進一步包含一門(107)。該門 (107)係用來使污染物不會進入索引器(1〇5),且使氮 氣不會漏出。在替代實施例中,索引器(105 )可設有一 個以上的門(1 07 )。例如,額外的門可用來進出索引器 (105),以便用手動或自動的方式裝載該等複數個光罩 (109)及該抽換式光罩卡匣(111)。進出索引器(1〇5 )的預見理由還可包括對索引器(105 )的維修、對光罩 (1 09 )的更換、或其他的理由。再者,可將末端效應器 (113)作成在其嚙合光罩(109)之前可通過一個或多個 門(107)。 圖2是根據本發明一實施例的一例示抽換式光罩卡 匣(111 )之一透視圖。在該實施例中,抽換式光罩卡匣 (111)包含一內腔(205)及一外腔(210)。內腔(205 )載有光罩(109 )及保護膜(11 〇 )。在光罩交換期間, 在外腔(2 1 0 )之內係由封閉物(11 7 )密封內腔(205 ) 。外腔(21 0 )係用來存放必要的氮氣及其他的氣體材料 ,以便提供潔淨狀態的環境。 用於抽換式光罩卡匣(111 )的材料應與微影系統所 用的標準潔淨劑相容。該材料不應造成胺或對微影製程有 害的不利物質微粒逸出之產生。再者,該材料應對機械退 化有抗拒力。可用的可能材料的例子包括覆蓋有諸如鋁或 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事 —0 ▼項再填. 裝-- :寫本頁) 經濟部智慧財產苟員工消費合作社印製 -11 - 562965 A7 B7 五、發明説明(9 ) 鈦等的材料之纖維強化的模製聚合物、Dedin (商標)、 PTFE ( Teflon (商標))。 (請先閱讀背面之注意事項再填寫本頁) 根據本發明之實施例,抽換式光罩卡匣(11 1 )可容 納具有任何類型的保護膜之光罩、以及沒有保護膜的光罩 。此外,抽換式光罩卡匣(111 )亦可容納固體或可吸入 的保護膜框架。 圖3示出根據本發明一實施例而準備好可被機械手 臂(11 5 )輸送的在抽換式光罩卡匣(111 )內密封的一光 罩(1 09 )及保護膜(11 0 )之配置。所示之抽換式光罩卡 匣(111 )係嚙合一光罩及保護膜。在替代實施例中,亦 可使用可嚙合光罩或保護膜的一竿、或其他機械、電機械 、或自動機械裝置。在讀取本本發明的揭示事項之後,熟 習相關技藝者易於想出額外的嚙合裝置。現在將參照圖 4及5而說明一種自索引器(105)輸送一光罩(109) 之方法。 經濟部智慧財產局g(工消費合作社印製 請參閱圖4, 一種在一微影系統中自索引器(105) 輸送一光罩(109)之方法開始時係打開門(107),以便 可讓末端效應器(113)接觸索引器(105)之內容物。 末端效應器(113)然後嚙合光罩(109)及保護膜( 11 0 )。根據本發明的實施例,末端效應器(11 3 )可利用 一真空、靜電荷、磁鐵、竿、或其他提升裝置嚙合光罩( 109)及保護膜(110)。一旦將光罩(109)及保護膜( 11 0 )固定到末端效應器(11 3 )之後,即利用機械手臂( 11 5 )來調動末端效應器(11 3 )朝向抽換式光罩卡匣( 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -1?- 經濟部智慧財產局員工消費合作社印製 562965 A7 B7_ 五、發明説明(10) 111 )。在一較佳實施例中,光罩(109 )及保護膜(110 )之方位將使得其顛倒。在此種方式下,任何潛在的污染 將是在光罩的背面。 圖5示出:光罩(109)及保護膜(110)被裝載到 抽換式光罩卡匣(111),且使抽換式光罩卡匣(111)並 未接觸光罩(109)及保護膜(110)。一旦光罩(109) 及保護膜(110)被置於抽換式光罩卡匣(111)內之後, 即利用封閉物(117 )來確保潔淨的環境,因而產生了一 密封的配置。 最後,利用機械手臂(11 5 )將該密封的配置自索引 器(105 )輸送到一固定架,以便執行微影曝光。一旦該 微影曝光完成之後,即根據本發明的實施例,而將該密封 的配置送回到索引器(1 05 )。然後利用前文中參照圖4 及5所述程序之相反程序,自抽換式光罩卡匣(ill) 取出光罩(109)及保護膜(110)。 結論 雖然前文已說明了本發明的各實施例,但是我們當了 解,係只以舉例之方式呈現該等實施例,並未對本發明加 以限制。熟習此項技藝者當可了解,在不脫離最後的申請 專利範圍所界定的本發明的精神及範圍下,可對本發明的 形式及細節作出各種改變。因此,本發明的幅度及範圍不 受任何前文所述實施例的限制,而只根據下列的申請專利 範圍及其等效物界定本發明的幅度及範圍。 本紙張尺度適用中國國家標準(CNS )A4規格(210X297公釐) 一 —
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Claims (1)
- 562965 、 8 8 8 8 ABCD 六、申請專利範圍" l 一種用於一具有一機械手臂的微影工具之光罩輸 送系統,包含: (a) 一索引器,用以儲存複數個光罩及一抽換式光 罩卡匣; (b )耦合到該機械手臂之一末端效應器,用以嚙合 該等複數個光罩中之一光罩,以便使該等複數個光罩中之 該光罩定位在該抽換式光罩卡匣之內,且於隨後進行輸送 ;以及 (c) 一封閉物,用以密封在該抽換式光罩卡匣之內 的該等複數個光罩中之該光罩。 2·如申請專利範圍第1項之光罩輸送系統,其中 該抽換式光罩卡匣包含一內腔及一外腔。 3. 如申請專利範圍第1項之光罩輸送系統,其中 該封閉物係耦合到該末端效應器。 4. 如申請專利範圍第1項之光罩輸送系統,其中 該封閉物係耦合到該機械手臂。 5. 如申請專利範圍第1項之光罩輸送系統,其中 該封閉物包含一真空系統,用以使該抽換式光罩卡匣附著 於該機械手臂。 6·如申請專利範圍第1項之光罩輸送系統,其中 該封閉物包含一磁鐵系統,用以使該抽換式光罩卡匣附著 於該機械手臂。 7. —種在一微影工具中將一光罩自一索引器輸送到 一固定架之方法,包含下列步驟: 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 、1: 經濟部智慧財產局員工消費合作社印製 -1Δ - 562965 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍2 (a )將該索引器中儲存的該光罩裝載到一末端效應 器; (b )將該光罩裝載到該索引器中儲存的一抽換式光 罩卡匣,以便產生該抽換式光罩卡匣並不與該光罩接觸的 一配置;以及 (c )將該配置自該索引器輸送到該固定架,以便執 行微影曝光。 8.如申請專利範圍第 7項之方法,進一步包含下 列步驟:在執行微影曝光之後,將該配置送回到該索引器 〇 9· 一種在一微影工具中輸送一光罩之方法,包含下 列步驟: (a)將複數個光罩及一抽換式光罩卡匣儲存在一索 引器中; (b )將一末端效應器耦合到一機械手臂,該機械手 臂嚙合該等複數個光罩中之一光罩,使該等複數個光罩中 之該光罩定位在該抽換式光罩卡匣內; (c )以一耦合到該末端效應器的封閉物將該等複數 個光罩中之該光罩密封在該抽換式光罩卡匣之內,以便產 生一密封的配置;以及 . (d )輸送該密封的配置。 (請先聞讀背面之注意事項再填寫本頁) i裝· 、11 J0 本紙張尺度適用中國國家標準(CNS ) A4规格(210X297公釐) -15-
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US6619903B2 (en) * | 2001-08-10 | 2003-09-16 | Glenn M. Friedman | System and method for reticle protection and transport |
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CH695494A5 (de) * | 2002-05-28 | 2006-06-15 | Rotzinger Ag | Kettenspeicher sowie Verfahren zu dessen Entladung. |
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US6991416B2 (en) | 2006-01-31 |
JP4717096B2 (ja) | 2011-07-06 |
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EP1414722A4 (en) | 2007-10-31 |
CN1261334C (zh) | 2006-06-28 |
EP1414722A1 (en) | 2004-05-06 |
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US6619903B2 (en) | 2003-09-16 |
JP4741180B2 (ja) | 2011-08-03 |
US20030031545A1 (en) | 2003-02-13 |
JP2008219032A (ja) | 2008-09-18 |
US20060078407A1 (en) | 2006-04-13 |
CN1473129A (zh) | 2004-02-04 |
KR100562803B1 (ko) | 2006-03-23 |
US7249925B2 (en) | 2007-07-31 |
JP2004537867A (ja) | 2004-12-16 |
US20030082030A1 (en) | 2003-05-01 |
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