TW562965B - System and method for reticle protection and transport - Google Patents

System and method for reticle protection and transport Download PDF

Info

Publication number
TW562965B
TW562965B TW091117896A TW91117896A TW562965B TW 562965 B TW562965 B TW 562965B TW 091117896 A TW091117896 A TW 091117896A TW 91117896 A TW91117896 A TW 91117896A TW 562965 B TW562965 B TW 562965B
Authority
TW
Taiwan
Prior art keywords
reticle
cassette
photomask
mask
removable
Prior art date
Application number
TW091117896A
Other languages
English (en)
Inventor
Glenn M Friedman
Michael A Demarco
Jorge S Ivaldi
James A Mcclay
Original Assignee
Asml Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Us Inc filed Critical Asml Us Inc
Application granted granted Critical
Publication of TW562965B publication Critical patent/TW562965B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24—Reflection masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Public Health (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Library & Information Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Description

562965 A7 __________B7_ 五、發明説明（1 ) 發明背景： 發明領域： 本發明係大致有關微影，尤係有關微影光罩之保護。 相關技藝： 微影是一種用來在基材的表面上產生線路區之製程。 此種基材可包括用於平板顯示器、電路板、及各種積體電 路等的裝置製造之那些基材。例如，半導體晶圓可用來作 爲製造積體電路之基材。 在微影期間，利用光罩將一所需的圖樣轉印到基材上 。係由對所用的微影波長爲透明的一材料形成該光罩。例 如，在可見光的情形中，係由玻璃形成該光罩。該光罩上 具有印刷的一圖樣。係針對使用該光罩的特定系統而選擇 該光罩的尺寸。在微影期間，由一晶圓載物臺所支承的一 晶圓接受一影像之曝光，而該影像係以對應於該光罩上印 刷的該影像之方式投射於該晶圓的表面上。 該投射的影像使晶圓表面上沈積的諸如光阻等的一層 之特性產生改變。這些改變對應於在曝光期間投射到晶圓 上的線路區。在曝光之後，可蝕刻該層，以便製作一產生 圖樣的層。該圖樣對應於在曝光期間投射到晶圓上的那些 線路區。然後利用該產生圖樣的層來去除該晶圓內的各下 方結構層（例如導體層、半導體層、或絕緣層）之露出部 分。然後重複該程序並配合其他步驟，直到在晶圓表面上 形成了所需的線路區爲止。由前文的說明可了解，利用微 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） •裝-- (請先閲讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 -4 - 562965 經濟部智慈財產局Μ工消費合作社印製 A7 B7 五、發明説明（2 ) 影製程製作的線路區之準確位置及尺寸係與投射到晶圓上 的影像之精確度及準確度有直接的關係。 除了前文所述的透射性光罩之外，此項技藝中也使用 反射性光罩。例如，反射性光罩係用於短波長的光線，而 此種短波長的光線將會被透射性玻璃光罩所吸收。 在使光罩表面有最少的污染之努力下，係在一 “潔淨 室”中執行微影製程。潔淨室是一個具有一規定受控制的 微粒濃度之密封空間。爲了維持該規定受控制的微粒濃度 ，係將氣體材料提供給該密封空間，並自該密封空間抽出 氣體材料。一可觀的費用係與一潔淨室的維護相關聯。該 費用係與該潔淨室的尺寸及維護該潔淨室所需的設備有部 分的關係。例如，由於光罩係自一微影製程中的某一載物 臺輸送到另一載物臺，所以這些光罩由於製程區內出現的 微粒而易於被污染。爲了儘量減少污染的可能性，通常係 將光罩輸送所在的整個房間保持在一潔淨的狀態。因此， 減少必須保持在潔淨狀態的環境是有一誘因的。減少潔淨 室尺寸的另一誘因是安全性。在某些情形中，潔淨室是處 於缺氧狀態，因而不適於人員的進駐。如果可將潔淨室隔 離到一較小的環境，則可將周圍的區域維持在安全使用的 狀態，且適於人員的進駐。 於 2001年 5月29日將專利權授予 Catey等人 且已讓渡給 Silicon Valley Group，Inc.的美國專利 6,239,863揭示了一種用來保護微影系統中所用的光罩之 抽換式遮蓋物。該抽換式遮蓋物包含一框架、及由該框架 本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） 衣------1T------ (請先閱讀背面之注意事項再填寫本頁) 562965 A7 B7 五、發明説明（3 ) (請先閲讀背面之注意事項再填寫本頁) 所支承的一薄膜。該抽換式遮蓋物可進一步包含至少一個 光罩結件，用以對該光罩施力，因而當該抽換式遮蓋物在 適當的位置時，可避免該抽換式遮蓋物有相對於該光罩的 移動。使用光罩結件時，有從光罩與光罩結件間之接觸點 產生污染的機會。 因此，目前需要一種可進一步減少光罩在輸送期間被 污染的可能性之方法，且此種方法也減少了在一密封空間 內的較大空間中或一較大環境中維持潔淨的需求。 發明槪述： 經濟部智慈財產局員工消費合作社印製 本發明提供了一種光罩保護及輸送系統以及用於微影 工具的方法。該系統包含一索引器，用以儲存複數個光罩 及一抽換式光罩卡匣。該抽換式光罩卡匣包含一內腔及一 外腔。該系統進一步包含一耦合到一機械手臂之末端效應 器。該末端效應器嚙合該等複數個光罩中之一光罩，以便 使該光罩定位在該抽換式光罩卡匣之內，且於隨後進行輸 送。爲了進一步保護該抽換式光罩卡匣內的該光罩，該系 統進一步包含一耦合到該末端效應器及該機械手臂之封閉 物。 爲了輸送該光罩，首先將該光罩裝載於該末端效應器 。然後利用該末端效應器產生使該光罩被裝載在該抽換式 光罩卡匣之一配置。重要的是：該光罩及該抽換式光罩卡 匣並未相互接觸。然後密封該配置，並將該配置自該索引 器輸送到固定架，以便執行微影曝光。一旦完成微影曝光 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -6 - 562965 A7 ______ B7 五、發明説明（4 ) 之後，即將該配置送回到該索引器，此時自該抽換式光罩 卡匣取出該光罩，並儲存該光罩。若參照下文中對本發明 (請先閱讀背面之注意事項再填寫本頁) 之詳細說明，將可易於了解上述至些及其他的優點及特徵 〇 圖式簡述： 現在將參照各附圖而說明本發明。在該等圖式中，相 同的代號指示相同的或功能類似的元件。此外，一代號最 左端的數字標示該代號首次出現的圖式。 圖1示出根據本發明一實施例的一光罩輸送系統。 圖2示出根據本發明一實施例的一抽換式光罩卡匣 〇 圖3示出根據本發明一實施例的一抽換式光罩卡匣 內的一光罩及保護膜之一配置。 圖4及5示出將一光罩裝載到根據本發明一實施 例的一抽換式光罩卡匣之一方法。 經濟部智慧財產局員工消費合作社印製 主要元件對照表 100 光罩輸送系統 105 索引器 109 光罩 110 保護膜 113 末端效應器 111 抽換式光罩卡匣 115 機械手臂 太紙.檨尺麼摘用Φ圃圃定德進f CNS ) A4规抵（210 X 297公婊） 562965 A7 _B7 五、發明説明（5 ) (請先閱讀背面之注意事項再填寫本頁) 117 封閉物 107 門 205 內腔 210 外腔 較佳實施例之詳細說明： 現在將詳細說明本發明的較佳實施例。雖然係說明特 定的特徵、組態、及配置，但是我們當了解，這些說明只 是用於解說。熟習相關技藝者當可了解，在不脫離本發明 的精神及範圍下，亦可使用其他的步驟、組態、以及配置 或裝置來獲致本發明的該等特徵。事實上，爲了說明的簡 潔，本文中可能不會詳細說明半導體裝置的傳統電子知識 及製造、以及該方法/裝置的其他功能性面向（以及裝置 的個別工作組件之組成部分）。 圖1示出一微影工具的一光罩輸送系統（100)。 經濟部智慧財產局員工消費合作社印製 該光罩輸送系統（100)包含一索引器（105)。根據本發 明的一實施例，索引器（105)進一步包含該微影工具內 的一組架子（圖中未示出）。該索引器（105 )內維持有 一惰性氣體。例如，根據一實施例，索引器（105 )充滿 了氮氣及其他必要的氣體材料，以便符合潔淨室的要求。 複數個光罩（109)係儲存在索引器（105)內的各架 子（圖中未示出）上。光罩係用來將一特定的圖樣轉印到 諸如一半導體晶圓、一平板顯示器、及一電路板等的一基 材上。如熟習微影技藝者所了解的，該光罩可以是反射型 本紙乐尺度適用中國國家標準（cns ) A4規格（21〇Χ297公釐） 562965 經濟部智慧財4局員工消費合作社印製 A7 B7 五、發明説明（6 ) 或透射型。爲了使光罩（109)不會受到污染，可將一保 護膜（110)固定在該光罩（109)之上。可配合本發明而 使用的一個保護膜力紫係述於本案發明人所擁有的且於 2000年2月10日提出申請的待審美國非臨時專利申 請案 09/501,180 “Method and Apparatus for a Reticle with Purged Pellicle-to-Reticle Gap”，本發明特此引用該專利 申請案以供參照。 雖然係將圖1所示之該等光罩置於相互垂直的位置 ，但是此種呈現只是供舉例，並非對本發明加以限制。在 替代實施例中，亦可以相互水平之方式儲存該等光罩。同 樣地，在另一實施例中，可在一旋轉盤上儲存該等光罩， 並將該等光罩旋轉到該索引器內的一特定位置。在一較佳 實施例中，係以顛倒之方式儲存光罩（109 )及保護膜（ 11 0 )。在此種方式下，落到該光罩上的任何污染物將是 在背面。如果係垂直地儲存光罩（109)及保護膜（110) (如圖1所示），則可將末端效應器（11 3 )作成使該 光罩及保護膜顛倒地旋轉。在參閱本文的揭示事項之後， 熟習相關技藝者將可了解在不脫離本發明範圍下的用來在 索引器（105)內儲存光罩（109)及保護膜（110)的其 他配置。 一抽換式光罩卡匣（111)也是儲存在該索引器（105 )內。該抽換式光罩卡匣（111 )係用來在輸送期間儲存 光罩（109)。抽換式光罩卡匣（111)的環境也是保持在 一"潔淨”狀態。在此種方式下，係在一小很多的空間 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 0^------、玎------9 ί請先閲讀背面之注意事項再填寫本頁} 經濟部智慧財產¾¾工消費合作社印製 562965 A7 B7 五、發明説明（7 ) 中保持潔淨室狀態。雖然圖示之索引器（105)只包含一 個抽換式光罩卡匣（111)，但是這只是供舉例，並非在 對本發明加以限制。係由索引器（105 )的空間限制來決 定抽換式光罩卡匣（111)的數目、及所儲存光罩（109) 的數目。係參照一光罩及附著在該光罩的一保護膜而說明 本發明。然而，這只是供舉例，並非在對本發明加以限制 。亦可在不脫離本發明的範圍及精神下，使用並不具有保 護膜的光罩。下文中將參照圖2而提供對抽換式光罩卡 匣（1 11 )的進一步說明。 光罩輸送系統（100)進一步包含一耦合到一機械手 臂（115)之末端效應器（113)。末端效應器（113)嚙 合該等複數個光罩（109)中之一光罩、及保護膜（110) ，以便將光罩（109)及保護膜（110)定位在抽換式光罩 卡匣（111 )之內。在替代實施例中，亦可使用可嚙合該 光罩或保護膜（如果有保護膜）的一竿、或手動、或自動 機械裝置。在一較佳實施例中，末端效應器（11 3 )係經 由靜電吸引而嚙合光罩（109 )及保護膜（110)。在替代 實施例中，末端效應器（11 3 )可經由真空吸引而嚙合光 罩（109)及保護膜（110)。 一封閉物（117)亦係用於光罩輸送系統（100)。封 閉物（117)係用來將該光罩固定在抽換式光罩卡匣（111 )之內。封閉物（117)可以是可將光罩（109)固定在抽 換式光罩卡匣（111)之內同時使污染物不會進入該抽換 式光罩卡匣並使氮氣不會逸出抽換式光罩卡匣（111)的 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇χ 297公釐) --------0^------1Τ-----ΙΦ, (請先閱讀背面之注意事項再填寫本頁) _ 1Π - 562965 A7 B7 五、發明説明（8 ) 任何裝置。例如，封閉物（117 )可以是一真空封閉物或 一磁性封閉物。因此，可配合本發明而使用一真空系統或 一磁性系統等的系統，以便有助於密封的功能。 光罩輸送系統（100)進一步包含一門（107)。該門 (107)係用來使污染物不會進入索引器（1〇5)，且使氮 氣不會漏出。在替代實施例中，索引器（105 )可設有一 個以上的門（1 07 )。例如，額外的門可用來進出索引器 (105)，以便用手動或自動的方式裝載該等複數個光罩 (109)及該抽換式光罩卡匣（111)。進出索引器（1〇5 )的預見理由還可包括對索引器（105 )的維修、對光罩 (1 09 )的更換、或其他的理由。再者，可將末端效應器 (113)作成在其嚙合光罩（109)之前可通過一個或多個 門（107)。 圖2是根據本發明一實施例的一例示抽換式光罩卡 匣（111 )之一透視圖。在該實施例中，抽換式光罩卡匣 (111)包含一內腔（205)及一外腔（210)。內腔（205 )載有光罩（109 )及保護膜（11 〇 )。在光罩交換期間， 在外腔（2 1 0 )之內係由封閉物（11 7 )密封內腔（205 ) 。外腔（21 0 )係用來存放必要的氮氣及其他的氣體材料 ，以便提供潔淨狀態的環境。 用於抽換式光罩卡匣（111 )的材料應與微影系統所 用的標準潔淨劑相容。該材料不應造成胺或對微影製程有 害的不利物質微粒逸出之產生。再者，該材料應對機械退 化有抗拒力。可用的可能材料的例子包括覆蓋有諸如鋁或 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事 —0 ▼項再填. 裝-- :寫本頁) 經濟部智慧財產苟員工消費合作社印製 -11 - 562965 A7 B7 五、發明説明（9 ) 鈦等的材料之纖維強化的模製聚合物、Dedin (商標）、 PTFE ( Teflon (商標））。 (請先閱讀背面之注意事項再填寫本頁) 根據本發明之實施例，抽換式光罩卡匣（11 1 )可容 納具有任何類型的保護膜之光罩、以及沒有保護膜的光罩 。此外，抽換式光罩卡匣（111 )亦可容納固體或可吸入 的保護膜框架。 圖3示出根據本發明一實施例而準備好可被機械手 臂（11 5 )輸送的在抽換式光罩卡匣（111 )內密封的一光 罩（1 09 )及保護膜（11 0 )之配置。所示之抽換式光罩卡 匣（111 )係嚙合一光罩及保護膜。在替代實施例中，亦 可使用可嚙合光罩或保護膜的一竿、或其他機械、電機械 、或自動機械裝置。在讀取本本發明的揭示事項之後，熟 習相關技藝者易於想出額外的嚙合裝置。現在將參照圖 4及5而說明一種自索引器（105)輸送一光罩（109) 之方法。 經濟部智慧財產局g(工消費合作社印製 請參閱圖4, 一種在一微影系統中自索引器（105) 輸送一光罩（109)之方法開始時係打開門（107)，以便 可讓末端效應器（113)接觸索引器（105)之內容物。 末端效應器（113)然後嚙合光罩（109)及保護膜（ 11 0 )。根據本發明的實施例，末端效應器（11 3 )可利用 一真空、靜電荷、磁鐵、竿、或其他提升裝置嚙合光罩（ 109)及保護膜（110)。一旦將光罩（109)及保護膜（ 11 0 )固定到末端效應器（11 3 )之後，即利用機械手臂（ 11 5 )來調動末端效應器（11 3 )朝向抽換式光罩卡匣（ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -1?- 經濟部智慧財產局員工消費合作社印製 562965 A7 B7_ 五、發明説明（10) 111 )。在一較佳實施例中，光罩（109 )及保護膜（110 )之方位將使得其顛倒。在此種方式下，任何潛在的污染 將是在光罩的背面。 圖5示出：光罩（109)及保護膜（110)被裝載到 抽換式光罩卡匣（111)，且使抽換式光罩卡匣（111)並 未接觸光罩（109)及保護膜（110)。一旦光罩（109) 及保護膜（110)被置於抽換式光罩卡匣（111)內之後， 即利用封閉物（117 )來確保潔淨的環境，因而產生了一 密封的配置。 最後，利用機械手臂（11 5 )將該密封的配置自索引 器（105 )輸送到一固定架，以便執行微影曝光。一旦該 微影曝光完成之後，即根據本發明的實施例，而將該密封 的配置送回到索引器（1 05 )。然後利用前文中參照圖4 及5所述程序之相反程序，自抽換式光罩卡匣（ill) 取出光罩（109)及保護膜（110)。 結論 雖然前文已說明了本發明的各實施例，但是我們當了 解，係只以舉例之方式呈現該等實施例，並未對本發明加 以限制。熟習此項技藝者當可了解，在不脫離最後的申請 專利範圍所界定的本發明的精神及範圍下，可對本發明的 形式及細節作出各種改變。因此，本發明的幅度及範圍不 受任何前文所述實施例的限制，而只根據下列的申請專利 範圍及其等效物界定本發明的幅度及範圍。 本紙張尺度適用中國國家標準（CNS )A4規格（210X297公釐） 一 —
-H C请先閲讀背面之注意事項蒋填寫本頁) ,ιτ

Claims (1)

  1. 562965 、 8 8 8 8 ABCD 六、申請專利範圍" l 一種用於一具有一機械手臂的微影工具之光罩輸 送系統，包含： (a) 一索引器，用以儲存複數個光罩及一抽換式光 罩卡匣； (b )耦合到該機械手臂之一末端效應器，用以嚙合 該等複數個光罩中之一光罩，以便使該等複數個光罩中之 該光罩定位在該抽換式光罩卡匣之內，且於隨後進行輸送 ;以及 (c) 一封閉物，用以密封在該抽換式光罩卡匣之內 的該等複數個光罩中之該光罩。 2·如申請專利範圍第1項之光罩輸送系統，其中 該抽換式光罩卡匣包含一內腔及一外腔。 3. 如申請專利範圍第1項之光罩輸送系統，其中 該封閉物係耦合到該末端效應器。 4. 如申請專利範圍第1項之光罩輸送系統，其中 該封閉物係耦合到該機械手臂。 5. 如申請專利範圍第1項之光罩輸送系統，其中 該封閉物包含一真空系統，用以使該抽換式光罩卡匣附著 於該機械手臂。 6·如申請專利範圍第1項之光罩輸送系統，其中 該封閉物包含一磁鐵系統，用以使該抽換式光罩卡匣附著 於該機械手臂。 7. —種在一微影工具中將一光罩自一索引器輸送到 一固定架之方法，包含下列步驟： 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 、1: 經濟部智慧財產局員工消費合作社印製 -1Δ - 562965 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍2 (a )將該索引器中儲存的該光罩裝載到一末端效應 器； (b )將該光罩裝載到該索引器中儲存的一抽換式光 罩卡匣，以便產生該抽換式光罩卡匣並不與該光罩接觸的 一配置；以及 (c )將該配置自該索引器輸送到該固定架，以便執 行微影曝光。 8.如申請專利範圍第 7項之方法，進一步包含下 列步驟：在執行微影曝光之後，將該配置送回到該索引器 〇 9· 一種在一微影工具中輸送一光罩之方法，包含下 列步驟： (a)將複數個光罩及一抽換式光罩卡匣儲存在一索 引器中； (b )將一末端效應器耦合到一機械手臂，該機械手 臂嚙合該等複數個光罩中之一光罩，使該等複數個光罩中 之該光罩定位在該抽換式光罩卡匣內； (c )以一耦合到該末端效應器的封閉物將該等複數 個光罩中之該光罩密封在該抽換式光罩卡匣之內，以便產 生一密封的配置；以及 . (d )輸送該密封的配置。 (請先聞讀背面之注意事項再填寫本頁) i裝· 、11 J0 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） -15-
TW091117896A 2001-08-10 2002-08-08 System and method for reticle protection and transport TW562965B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/925,722 US6619903B2 (en) 2001-08-10 2001-08-10 System and method for reticle protection and transport

Publications (1)

Publication Number Publication Date
TW562965B true TW562965B (en) 2003-11-21

Family

ID=25452140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091117896A TW562965B (en) 2001-08-10 2002-08-08 System and method for reticle protection and transport

Country Status (7)

Country Link
US (3) US6619903B2 (zh)
EP (1) EP1414722A4 (zh)
JP (2) JP4741180B2 (zh)
KR (1) KR100562803B1 (zh)
CN (1) CN1261334C (zh)
TW (1) TW562965B (zh)
WO (1) WO2003013993A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415209B (zh) * 2005-04-04 2013-11-11 Entegris Inc 罩幕標準機械介面晶圓盒之環境控制

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6619903B2 (en) * 2001-08-10 2003-09-16 Glenn M. Friedman System and method for reticle protection and transport
US7004715B2 (en) * 2002-01-09 2006-02-28 Asml Holding N.V. Apparatus for transferring and loading a reticle with a robotic reticle end-effector
CH695494A5 (de) * 2002-05-28 2006-06-15 Rotzinger Ag Kettenspeicher sowie Verfahren zu dessen Entladung.
JP4027214B2 (ja) * 2002-11-28 2007-12-26 キヤノン株式会社 搬送装置、デバイス製造装置、搬送方法およびデバイス製造方法
SG115632A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
US7070832B2 (en) * 2003-09-11 2006-07-04 Intel Corporation Sublimating process for cleaning and protecting lithography masks
US7123344B2 (en) * 2003-09-29 2006-10-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005123292A (ja) * 2003-10-15 2005-05-12 Canon Inc 収納装置、当該収納装置を用いた露光方法
WO2005047981A2 (en) * 2003-11-10 2005-05-26 Nikon Corporation Thermophoretic techniques for protecting reticles from contaminants
US6905300B1 (en) * 2004-01-16 2005-06-14 Dmetrix, Inc. Slide feeder with air bearing conveyor
US7248340B2 (en) * 2004-06-24 2007-07-24 Asml Netherlands B.V. Lithographic apparatus and patterning device transport
US7477358B2 (en) * 2004-09-28 2009-01-13 Nikon Corporation EUV reticle handling system and method
US7551265B2 (en) * 2004-10-01 2009-06-23 Nikon Corporation Contact material and system for ultra-clean applications
JP2006128188A (ja) * 2004-10-26 2006-05-18 Nikon Corp 基板搬送装置、基板搬送方法および露光装置
JP4710308B2 (ja) 2004-10-29 2011-06-29 株式会社ニコン レチクル搬送装置、露光装置、及びレチクルの搬送方法
CN101006554A (zh) * 2004-10-29 2007-07-25 株式会社尼康 标线保护构件、标线运送装置、曝光装置及标线运送方法
JP2006245257A (ja) * 2005-03-03 2006-09-14 Canon Inc 処理装置、当該処理装置を有する露光装置、保護機構
JP2006245375A (ja) * 2005-03-04 2006-09-14 Nikon Corp レチクル収納容器、収納室、レチクル搬送設備、及び露光装置
US7400383B2 (en) * 2005-04-04 2008-07-15 Entegris, Inc. Environmental control in a reticle SMIF pod
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US9339900B2 (en) * 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US8267634B2 (en) 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
KR20140091768A (ko) * 2005-11-07 2014-07-22 브룩스 오토메이션 인코퍼레이티드 반도체 작업대상물 공정처리 시스템
TWI417649B (zh) * 2005-12-28 2013-12-01 尼康股份有限公司 十字標記運送裝置、曝光裝置、十字標記運送方法以及十字標記的處理方法
US7808616B2 (en) * 2005-12-28 2010-10-05 Nikon Corporation Reticle transport apparatus, exposure apparatus, reticle transport method, and reticle processing method
US7591624B2 (en) * 2006-01-09 2009-09-22 International Business Machines Corporation Reticle storage pod (RSP) transport system utilizing FOUP adapter plate
US7773198B2 (en) * 2006-03-28 2010-08-10 Nikon Corporation Filtered device container assembly with shield for a reticle
KR100776254B1 (ko) * 2006-03-30 2007-11-15 삼성전자주식회사 레티클 저장장치
US8776841B2 (en) 2006-06-19 2014-07-15 Entegris, Inc. System for purging reticle storage
KR101229020B1 (ko) * 2006-06-22 2013-02-01 엘지디스플레이 주식회사 쉐도우 마스크의 자성제거 방법 및 그 장치
JP4215079B2 (ja) * 2006-07-31 2009-01-28 村田機械株式会社 クリーンストッカと物品の保管方法
KR101707925B1 (ko) 2006-08-18 2017-02-17 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US8297319B2 (en) * 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US20080128303A1 (en) * 2006-12-05 2008-06-05 Nikon Corporation Device container assembly with adjustable retainers for a reticle
DE502007004989D1 (de) * 2007-02-09 2010-10-21 Applied Materials Inc Anlage mit einer Transportvorrichtung zur Behandlung von Substraten
US8146623B2 (en) 2007-02-28 2012-04-03 Entegris, Inc. Purge system for a substrate container
TWI475627B (zh) 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
US10586722B2 (en) * 2007-05-30 2020-03-10 Brooks Automation, Inc. Vacuum substrate storage
US8424703B2 (en) 2008-05-01 2013-04-23 Brooks Automation, Inc. Substrate container sealing via movable magnets
FR2933812B1 (fr) * 2008-07-11 2010-09-10 Alcatel Lucent Dispositif de chargement/dechargement de substrats
WO2011024170A1 (en) * 2009-08-31 2011-03-03 Brightview Systems Ltd. A method and apparatus for thin film quality control in a batch manufacturing layout
JP5794497B2 (ja) * 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム
JP5263274B2 (ja) * 2010-11-30 2013-08-14 株式会社ニコン 露光装置及び方法
US9647523B2 (en) 2010-12-03 2017-05-09 Sri International Levitated-micro manipulator system
US8593016B2 (en) 2010-12-03 2013-11-26 Sri International Levitated micro-manipulator system
US9376267B2 (en) * 2011-05-02 2016-06-28 Murata Machinery, Ltd. Orientation adjustment device and orientation adjustment method
US8956098B2 (en) * 2011-05-02 2015-02-17 Murata Machinery, Ltd. Automated warehouse
US20120288355A1 (en) * 2011-05-11 2012-11-15 Ming-Teng Hsieh Method for storing wafers
EP2727859A4 (en) 2011-06-28 2015-01-21 Murata Machinery Ltd STORAGE DEVICE AND STORAGE METHOD
US20130038852A1 (en) * 2011-08-09 2013-02-14 United Microelectronics Corporation Reticle removing apparatus and reticle removing method using the same
JP5985166B2 (ja) * 2011-09-22 2016-09-06 株式会社日立国際電気 基板搬送治具および基板搬送方法
US9997384B2 (en) * 2011-12-01 2018-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for transporting wafers between wafer holders and chambers
US9164399B2 (en) * 2012-01-10 2015-10-20 Hermes-Microvision, Inc. Reticle operation system
US9524895B2 (en) 2012-12-04 2016-12-20 National Institute Of Advanced Industrial Science And Technology Substrate transfer antechamber mechanism
JP2017520015A (ja) * 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
JP6407629B2 (ja) * 2014-08-29 2018-10-17 株式会社Ｓｃｒｅｅｎホールディングス 搬送装置および基板処理装置
JP6217567B2 (ja) * 2014-09-08 2017-10-25 信越半導体株式会社 半導体製造装置、半導体基板の製造方法及び搬送ロボット
US10861627B2 (en) 2015-04-20 2020-12-08 Sri International Microrobot and microrobotic train self-assembly with end-effectors
JP6428575B2 (ja) * 2015-11-18 2018-11-28 株式会社ダイフク 搬送設備
CN105977192A (zh) * 2016-06-20 2016-09-28 刘玉忠 一种改进型二极管生产用托盘
CN107664921B (zh) 2016-07-29 2019-12-24 上海微电子装备（集团）股份有限公司 可调平的版库设备
CN108628108A (zh) * 2018-04-25 2018-10-09 武汉华星光电技术有限公司 承载装置和曝光机
TWI818800B (zh) * 2018-10-29 2023-10-11 家登精密工業股份有限公司 光罩容器系統及提供該光罩容器系統觀察光罩之方法
DE102019117484B4 (de) * 2019-06-28 2021-07-08 Carl Zeiss Smt Gmbh Verfahren und Anordnung zum Laden einer Komponente in eine Ladeposition in einem optischen System für die Mikrolithographie
CN113264286A (zh) * 2021-06-01 2021-08-17 长鑫存储技术有限公司 光罩保护盒及光罩传送设备
CN114735625B (zh) * 2022-04-13 2024-04-05 浙江大学杭州国际科创中心 一种非晶碳膜加工用惰性物质植入设备
CN115303796A (zh) * 2022-08-17 2022-11-08 深圳市鹏乐智能系统有限公司 一种提篮中晶圆承载铁原片的取放料机构

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283177A (en) * 1975-12-31 1977-07-11 Fujitsu Ltd Electron beam exposure device
JPS61282229A (ja) * 1985-06-05 1986-12-12 Canon Inc 防塵カセツト
US4666479A (en) * 1985-07-18 1987-05-19 Tensho Electric Industrial Co., Ltd. Semiconductor wafer container
JP2539447B2 (ja) * 1987-08-12 1996-10-02 株式会社日立製作所 枚葉キャリアによる生産方法
JP2789198B2 (ja) * 1988-09-06 1998-08-20 キヤノン株式会社 マスクローディング機構
DE68928460T2 (de) * 1988-09-06 1998-04-02 Canon K.K., Tokio/Tokyo Maskenkassetten-Ladevorrichtung
US5149158A (en) * 1989-11-20 1992-09-22 Submicron Systems, Inc. Wafer carrier holder for wafer carriers
ES2101070T3 (es) * 1992-08-04 1997-07-01 Ibm Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector.
ES2078717T3 (es) * 1992-08-04 1995-12-16 Ibm Aparato de reparticion con un sistema de distribucion y alimentacion de gas para manipular y almacenar recipientes transportables estancos a presion.
US5884392A (en) * 1994-12-23 1999-03-23 International Business Machines Corporation Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers
WO1997003222A1 (en) * 1995-07-10 1997-01-30 Asyst Technologies, Inc. Cassette support and rotation assembly
US6317479B1 (en) * 1996-05-17 2001-11-13 Canon Kabushiki Kaisha X-ray mask, and exposure method and apparatus using the same
JPH10163094A (ja) * 1996-12-03 1998-06-19 Nikon Corp 露光装置及び露光方法並びに搬送装置
JP3455072B2 (ja) * 1997-07-31 2003-10-06 株式会社東芝 荷電ビーム描画装置及び方法
US6090176A (en) * 1997-03-18 2000-07-18 Kabushiki Kaisha Toshiba Sample transferring method and sample transfer supporting apparatus
TW408386B (en) * 1997-07-07 2000-10-11 Nikon Corp Container and lithography system
AU3731299A (en) * 1998-05-20 1999-12-06 Nikon Corporation Method and apparatus for wafer transportation, exposure system, micro device, and reticle library
JP3619042B2 (ja) * 1999-01-26 2005-02-09 キヤノン株式会社 半導体製造装置
AU2691800A (en) * 1999-02-26 2000-09-14 Nikon Corporation Exposure system, lithography system and conveying method, and device production method and device
AU2325900A (en) * 1999-03-12 2000-10-04 Nikon Corporation Exposure device, exposure method, and device manufacturing method
JP3005584B1 (ja) * 1999-03-18 2000-01-31 九州日本電気株式会社 レチクルケ―ス搬送装置
JP4302817B2 (ja) * 1999-05-13 2009-07-29 東京エレクトロン株式会社 真空処理システム
US6612797B1 (en) * 1999-05-18 2003-09-02 Asyst Technologies, Inc. Cassette buffering within a minienvironment
US6239863B1 (en) 1999-10-08 2001-05-29 Silicon Valley Group, Inc. Removable cover for protecting a reticle, system including and method of using the same
US6507390B1 (en) 2000-02-10 2003-01-14 Asml Us, Inc. Method and apparatus for a reticle with purged pellicle-to-reticle gap
WO2001081203A1 (en) * 2000-04-25 2001-11-01 Microtome Precision, Inc. Pod for carrying reticle cassette
US6619903B2 (en) 2001-08-10 2003-09-16 Glenn M. Friedman System and method for reticle protection and transport

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415209B (zh) * 2005-04-04 2013-11-11 Entegris Inc 罩幕標準機械介面晶圓盒之環境控制

Also Published As

Publication number Publication date
WO2003013993A9 (en) 2004-12-23
US6991416B2 (en) 2006-01-31
JP4717096B2 (ja) 2011-07-06
KR20030070008A (ko) 2003-08-27
EP1414722A4 (en) 2007-10-31
CN1261334C (zh) 2006-06-28
EP1414722A1 (en) 2004-05-06
WO2003013993A1 (en) 2003-02-20
US6619903B2 (en) 2003-09-16
JP4741180B2 (ja) 2011-08-03
US20030031545A1 (en) 2003-02-13
JP2008219032A (ja) 2008-09-18
US20060078407A1 (en) 2006-04-13
CN1473129A (zh) 2004-02-04
KR100562803B1 (ko) 2006-03-23
US7249925B2 (en) 2007-07-31
JP2004537867A (ja) 2004-12-16
US20030082030A1 (en) 2003-05-01

Similar Documents

Publication Publication Date Title
TW562965B (en) System and method for reticle protection and transport
KR101496076B1 (ko) 기판 반송 장치, 기판 반송 방법 및 노광 장치
US7304720B2 (en) System for using a two part cover for protecting a reticle
US8168959B2 (en) Reticle protection member, reticle carrying device, exposure device and method for carrying reticle
US7065894B2 (en) Apparatus for kinematic registration of a reticle
US7726891B2 (en) Substrate processing apparatus and substrate processing method
TWI279874B (en) Substrate processing apparatus and substrate processing method
TW385497B (en) Resist agent treatment apparatus
US7839489B2 (en) Assembly of a reticle holder and a reticle
US20140144805A1 (en) Lithographic apparatus and device manufacturing method
TWI227507B (en) Method and system for coating and developing process
TW471026B (en) Substrate supporting device and substrate processing device
CN101650528B (zh) 使用两件式盖子保护模版的系统和方法
JP2005109497A (ja) リソグラフィ装置およびデバイス製造方法
TW202323972A (zh) 光罩檢測方法及透明光罩保持容器
Kling Reticle cleanliness and handling issues in submicron wafer fabrication
CN116300296A (zh) 微影方法
Yoshitake et al. New mask blank handling system for the advanced electron-beam writer EX-11
SG193643A1 (en) System and method for using a two part cover for protecting a reticle
SG177023A1 (en) System and method for using a two part cover for protecting a reticle

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent