DE68928460T2 - Maskenkassetten-Ladevorrichtung - Google Patents
Maskenkassetten-LadevorrichtungInfo
- Publication number
- DE68928460T2 DE68928460T2 DE68928460T DE68928460T DE68928460T2 DE 68928460 T2 DE68928460 T2 DE 68928460T2 DE 68928460 T DE68928460 T DE 68928460T DE 68928460 T DE68928460 T DE 68928460T DE 68928460 T2 DE68928460 T2 DE 68928460T2
- Authority
- DE
- Germany
- Prior art keywords
- loading device
- cassette loading
- mask cassette
- mask
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Library & Information Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22126988A JP2789198B2 (ja) | 1988-09-06 | 1988-09-06 | マスクローディング機構 |
JP63221270A JP2743181B2 (ja) | 1988-09-06 | 1988-09-06 | マスクカセット |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68928460D1 DE68928460D1 (de) | 1998-01-08 |
DE68928460T2 true DE68928460T2 (de) | 1998-04-02 |
Family
ID=26524197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68928460T Expired - Fee Related DE68928460T2 (de) | 1988-09-06 | 1989-09-05 | Maskenkassetten-Ladevorrichtung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5026239A (de) |
EP (1) | EP0358443B1 (de) |
DE (1) | DE68928460T2 (de) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69123279T2 (de) * | 1990-04-06 | 1997-04-24 | Canon Kk | Transportvorrichtung für Substrate und Verfahren zur Kontrolle |
DE69129732T2 (de) * | 1990-11-30 | 1998-12-17 | Canon Kk | Verfahren zur Positionsdetektion |
US5232328A (en) * | 1991-03-05 | 1993-08-03 | Semitool, Inc. | Robot loadable centrifugal semiconductor processor with extendible rotor |
US6048655A (en) * | 1992-02-07 | 2000-04-11 | Nikon Corporation | Method of carrying and aligning a substrate |
US6473157B2 (en) * | 1992-02-07 | 2002-10-29 | Nikon Corporation | Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate |
JP3224157B2 (ja) * | 1992-03-31 | 2001-10-29 | キヤノン株式会社 | X線マスクとその製造方法、並びに該x線マスクを用いたデバイス製造方法とx線露光装置 |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
US5364225A (en) * | 1992-06-19 | 1994-11-15 | Ibm | Method of printed circuit panel manufacture |
EP0591706B1 (de) * | 1992-10-06 | 2002-04-24 | Unaxis Balzers Aktiengesellschaft | Kammer für den Transport von Werkstücken |
KR100302012B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크 |
EP0596537A1 (de) * | 1992-11-06 | 1994-05-11 | Applied Materials, Inc. | Ladungsschleuse mit Mikroumgebung und Methode zur Kupplung von einem Mikroumgebungsbehälter mit einer Prozesskammer |
US5378107A (en) * | 1993-04-01 | 1995-01-03 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
JPH07142336A (ja) * | 1993-06-30 | 1995-06-02 | Canon Inc | 露光装置 |
US5538390A (en) * | 1993-10-29 | 1996-07-23 | Applied Materials, Inc. | Enclosure for load lock interface |
US5608773A (en) * | 1993-11-30 | 1997-03-04 | Canon Kabushiki Kaisha | Mask holding device, and an exposure apparatus and a device manufacturing method using the device |
JP3244894B2 (ja) * | 1993-11-30 | 2002-01-07 | キヤノン株式会社 | マスク保持方法、マスク及びマスクチャック、ならびにこれを用いた露光装置とデバイス製造方法 |
US5593800A (en) * | 1994-01-06 | 1997-01-14 | Canon Kabushiki Kaisha | Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus |
DE69505448T2 (de) * | 1994-03-15 | 1999-04-22 | Canon Kk | Maske und Maskenträger |
US5664337A (en) * | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
US5784797A (en) * | 1994-04-28 | 1998-07-28 | Semitool, Inc. | Carrierless centrifugal semiconductor processing system |
US5824577A (en) * | 1995-02-16 | 1998-10-20 | National Semiconductor Corporation | MOSFET with reduced leakage current |
JP3347528B2 (ja) * | 1995-05-23 | 2002-11-20 | キヤノン株式会社 | 半導体製造装置 |
US5741109A (en) * | 1995-07-07 | 1998-04-21 | Pri Automation, Inc. | Wafer transfer system having vertical lifting capability |
US5615988A (en) * | 1995-07-07 | 1997-04-01 | Pri Automation, Inc. | Wafer transfer system having rotational capability |
US5647718A (en) * | 1995-07-07 | 1997-07-15 | Pri Automation, Inc. | Straight line wafer transfer system |
JPH0926176A (ja) * | 1995-07-07 | 1997-01-28 | Canon Inc | 処理システムとこれを用いたデバイス生産方法 |
US5788458A (en) * | 1995-07-10 | 1998-08-04 | Asyst Technologies, Inc. | Method and apparatus for vertical transfer of a semiconductor wafer cassette |
US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
JP3243168B2 (ja) * | 1996-02-06 | 2002-01-07 | キヤノン株式会社 | 原版保持装置およびこれを用いた露光装置 |
US5854819A (en) * | 1996-02-07 | 1998-12-29 | Canon Kabushiki Kaisha | Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same |
US6317479B1 (en) | 1996-05-17 | 2001-11-13 | Canon Kabushiki Kaisha | X-ray mask, and exposure method and apparatus using the same |
US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
TW344847B (en) * | 1996-08-29 | 1998-11-11 | Tokyo Electron Co Ltd | Substrate treatment system, substrate transfer system, and substrate transfer method |
US5964561A (en) * | 1996-12-11 | 1999-10-12 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6540466B2 (en) | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
DE19949005A1 (de) | 1999-10-11 | 2001-05-10 | Leica Microsystems | Einrichtung und Verfahren zum Einbringen verschiedener transparenter Substrate in ein hochgenaues Messgerät |
US6279249B1 (en) * | 1999-12-30 | 2001-08-28 | Intel Corporation | Reduced particle contamination manufacturing and packaging for reticles |
US6515736B1 (en) * | 2000-05-04 | 2003-02-04 | International Business Machines Corporation | Reticle capturing and handling system |
US20020090282A1 (en) | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
US6619903B2 (en) * | 2001-08-10 | 2003-09-16 | Glenn M. Friedman | System and method for reticle protection and transport |
EP1481114A4 (de) | 2001-08-31 | 2005-06-22 | Semitool Inc | Vorrichtung und verfahren zur elektrochemischen verarbeitung von mikroelektronischen werkstücken |
EP1341045A1 (de) * | 2002-03-01 | 2003-09-03 | ASML Netherlands B.V. | Verfahren zur Übergabe einer Maske oder eines Substrats |
SG106129A1 (en) | 2002-03-01 | 2004-09-30 | Asml Netherlands Bv | Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method |
US7114903B2 (en) * | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
SG115631A1 (en) | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, load lock and method for transferring objects |
SG115629A1 (en) | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Method and apparatus for maintaining a machine part |
EP1457832A1 (de) * | 2003-03-11 | 2004-09-15 | ASML Netherlands B.V. | Lithographische Projektionsanordnung, Schleuseneinrichtung und Verfahren zur Übertragung von Gegenständen |
US7123344B2 (en) * | 2003-09-29 | 2006-10-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20070137568A1 (en) * | 2005-12-16 | 2007-06-21 | Schreiber Brian E | Reciprocating aperture mask system and method |
US7763114B2 (en) * | 2005-12-28 | 2010-07-27 | 3M Innovative Properties Company | Rotatable aperture mask assembly and deposition system |
CN101635253A (zh) * | 2008-06-14 | 2010-01-27 | 因特维克有限公司 | 利用可拆除掩模处理基板的系统和方法 |
US20130038852A1 (en) * | 2011-08-09 | 2013-02-14 | United Microelectronics Corporation | Reticle removing apparatus and reticle removing method using the same |
US10390843B1 (en) * | 2015-02-03 | 2019-08-27 | Dartmouth-Hitchcock Clinic | Trajectory and aiming guide for use with fluoroscopy |
US20170226656A1 (en) * | 2016-02-10 | 2017-08-10 | Ebara Corporation | Apparatus and method for supplying plating solution to plating tank, plating system, powder container, and plating method |
JP7330606B2 (ja) * | 2018-11-07 | 2023-08-22 | 株式会社ディスコ | 加工装置及びカセット載置機構 |
CN114735625B (zh) * | 2022-04-13 | 2024-04-05 | 浙江大学杭州国际科创中心 | 一种非晶碳膜加工用惰性物质植入设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4815912A (en) * | 1984-12-24 | 1989-03-28 | Asyst Technologies, Inc. | Box door actuated retainer |
EP0288455B1 (de) * | 1985-12-23 | 1990-05-16 | Asyst Technologies | Durch eine behältertür betätigter halter |
-
1989
- 1989-09-05 EP EP89308963A patent/EP0358443B1/de not_active Expired - Lifetime
- 1989-09-05 DE DE68928460T patent/DE68928460T2/de not_active Expired - Fee Related
- 1989-09-05 US US07/402,601 patent/US5026239A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0358443B1 (de) | 1997-11-26 |
EP0358443A2 (de) | 1990-03-14 |
EP0358443A3 (de) | 1990-11-07 |
DE68928460D1 (de) | 1998-01-08 |
US5026239A (en) | 1991-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |