DE69115292T2 - Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere. - Google Patents

Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere.

Info

Publication number
DE69115292T2
DE69115292T2 DE69115292T DE69115292T DE69115292T2 DE 69115292 T2 DE69115292 T2 DE 69115292T2 DE 69115292 T DE69115292 T DE 69115292T DE 69115292 T DE69115292 T DE 69115292T DE 69115292 T2 DE69115292 T2 DE 69115292T2
Authority
DE
Germany
Prior art keywords
another
controlled atmosphere
transferring objects
transferring
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115292T
Other languages
English (en)
Other versions
DE69115292D1 (de
Inventor
Anthony Bonora
Gilles Guerre
Mihir Parikh
Frederick Rosenquist
Sudhir Jain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASYST TECHNOLOGIES
Original Assignee
ASYST TECHNOLOGIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES filed Critical ASYST TECHNOLOGIES
Application granted granted Critical
Publication of DE69115292D1 publication Critical patent/DE69115292D1/de
Publication of DE69115292T2 publication Critical patent/DE69115292T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
DE69115292T 1990-11-01 1991-09-12 Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere. Expired - Fee Related DE69115292T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/607,898 US5169272A (en) 1990-11-01 1990-11-01 Method and apparatus for transferring articles between two controlled environments
PCT/US1991/006620 WO1992007759A1 (en) 1990-11-01 1991-09-12 Method and apparatus for transferring articles between two controlled environments

Publications (2)

Publication Number Publication Date
DE69115292D1 DE69115292D1 (de) 1996-01-18
DE69115292T2 true DE69115292T2 (de) 1996-06-27

Family

ID=24434168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115292T Expired - Fee Related DE69115292T2 (de) 1990-11-01 1991-09-12 Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere.

Country Status (5)

Country Link
US (3) US5169272A (de)
EP (1) EP0556193B1 (de)
JP (1) JP3576162B2 (de)
DE (1) DE69115292T2 (de)
WO (1) WO1992007759A1 (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277550B2 (ja) * 1992-05-21 2002-04-22 神鋼電機株式会社 可搬式密閉コンテナ用ガスパージユニット
US5746008A (en) * 1992-07-29 1998-05-05 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers
KR100303075B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
EP0596536A1 (de) * 1992-11-06 1994-05-11 Applied Materials, Inc. Transportsysteme und zugehörige Anwendungsmethode
DE4326308C1 (de) * 1993-08-05 1994-10-20 Jenoptik Jena Gmbh Transportvorrichtung für Magazine zur Aufnahme scheibenförmiger Objekte
US5538390A (en) * 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
JP2850279B2 (ja) * 1994-02-22 1999-01-27 ティーディーケイ株式会社 クリーン搬送方法及び装置
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US5664925A (en) * 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US5609459A (en) * 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock
US5588789A (en) * 1995-07-06 1996-12-31 Brooks Automation Load arm for load lock
US5613821A (en) * 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5740845A (en) * 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
SE9503102D0 (sv) * 1995-09-08 1995-09-08 Astra Ab Aseptic transfer
US5967571A (en) * 1995-10-13 1999-10-19 Empak, Inc. Vacuum actuated mechanical latch
EP0854964B1 (de) * 1995-10-13 2004-10-06 Empak, Inc. Vakuumangetriebener mechanischer riegel
US5810537A (en) * 1995-10-18 1998-09-22 Bye/Oasis Engineering Inc. Isolation chamber transfer apparatus
USH1762H (en) * 1995-10-26 1998-12-01 Kaempf; Ulrich Wafer restraining system
DE19540963C2 (de) * 1995-11-03 1999-05-20 Jenoptik Jena Gmbh Transportbehälter für scheibenförmige Objekte
JP3796782B2 (ja) * 1995-11-13 2006-07-12 アシスト シンコー株式会社 機械的インターフェイス装置
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system
FR2747112B1 (fr) * 1996-04-03 1998-05-07 Commissariat Energie Atomique Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
EP0875921A1 (de) * 1997-05-03 1998-11-04 Stäubli AG Pfäffikon Umladevorrichtung für Wafer
US6090176A (en) 1997-03-18 2000-07-18 Kabushiki Kaisha Toshiba Sample transferring method and sample transfer supporting apparatus
US5803696A (en) * 1997-05-16 1998-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Safety interlock device for a standard manufacturing interface arm and equipment
JPH10321714A (ja) * 1997-05-20 1998-12-04 Sony Corp 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
NL1009327C2 (nl) * 1998-06-05 1999-12-10 Asm Int Werkwijze en inrichting voor het overbrengen van wafers.
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6145444A (en) * 1998-12-16 2000-11-14 Wilkinson; Kerry E. Micro clean sealed tubular transporter apparatus
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
US6427096B1 (en) 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US6249990B1 (en) * 1999-03-23 2001-06-26 Alliedsignal, Inc. Method and apparatus for transporting articles
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
US6354781B1 (en) 1999-11-01 2002-03-12 Chartered Semiconductor Manufacturing Company Semiconductor manufacturing system
US6585470B2 (en) 2001-06-19 2003-07-01 Brooks Automation, Inc. System for transporting substrates
US6646720B2 (en) * 2001-09-21 2003-11-11 Intel Corporation Euv reticle carrier with removable pellicle
JP2003168727A (ja) * 2001-11-30 2003-06-13 Dainichi Shoji Kk エクスチェンジャーおよびガス置換方法
JP4168642B2 (ja) * 2002-02-28 2008-10-22 東京エレクトロン株式会社 被処理体収納容器体及び処理システム
EP1341045A1 (de) * 2002-03-01 2003-09-03 ASML Netherlands B.V. Verfahren zur Übergabe einer Maske oder eines Substrats
CN1474233A (zh) * 2002-03-01 2004-02-11 Asml荷兰有限公司 传送贮藏箱中掩模或基片的方法和所用设备及其制造方法
EP1396759A3 (de) * 2002-08-30 2006-08-02 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und damit erzeugter Artikel
EP1394611A1 (de) * 2002-08-30 2004-03-03 ASML Netherlands BV Lithographischer Apparat, Methode zur Herstellung einer Vorrichtung und damit hergestellte Vorrichtung
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6918737B2 (en) * 2002-10-31 2005-07-19 Solo Cup Company System and method for stacking a predetermined number of nestable objects
EP1434094A1 (de) * 2002-12-27 2004-06-30 ASML Netherlands B.V. Behälter für eine Maske
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
US20050169730A1 (en) * 2003-04-30 2005-08-04 Ravinder Aggarwal Semiconductor processing tool front end interface with sealing capability
WO2004102655A1 (ja) * 2003-05-15 2004-11-25 Tdk Corporation クリーンボックス開閉装置を備えるクリーン装置
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
KR100572321B1 (ko) * 2003-10-02 2006-04-19 삼성전자주식회사 반도체 소자 제조 설비 및 방법 그리고 이에 사용되는스토커
WO2005047981A2 (en) * 2003-11-10 2005-05-26 Nikon Corporation Thermophoretic techniques for protecting reticles from contaminants
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US7230702B2 (en) 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
EP2128890B1 (de) * 2004-02-05 2012-10-17 Entegris, Inc. Reinigen von einem Wafertransportcontainer
US7611319B2 (en) 2004-06-16 2009-11-03 Applied Materials, Inc. Methods and apparatus for identifying small lot size substrate carriers
US9010384B2 (en) * 2004-06-21 2015-04-21 Right Mfg. Co. Ltd. Load port
US7409263B2 (en) * 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
KR101233101B1 (ko) 2004-08-19 2013-02-14 브룩스 오토메이션 인코퍼레이티드 저용량 캐리어 및 그 사용방법
EP1803151B1 (de) 2004-08-23 2011-10-05 Murata Machinery, Ltd. Werkzeuglade- und pufferungssystem auf liftbasis
EP1789630A4 (de) * 2004-08-24 2009-07-22 Brooks Automation Inc Beförderungssystem
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
CN101023490A (zh) * 2004-09-17 2007-08-22 齐拉泰克斯技术有限公司 磁盘驱动器装置及机架
US7410340B2 (en) 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
US20090272461A1 (en) * 2005-08-03 2009-11-05 Alvarez Jr Daniel Transfer container
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
JP5105334B2 (ja) 2006-01-11 2012-12-26 アプライド マテリアルズ インコーポレイテッド 基板キャリヤをパージするための方法及び装置
JP4194051B2 (ja) 2006-05-31 2008-12-10 Ｔｄｋ株式会社 防塵機能を備えたロードポート装置及びミニエンバイロンメントシステム
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
EP2122014A4 (de) 2007-02-28 2014-09-17 Entegris Inc Reinigungssystem für einen substratbehälter
US7585142B2 (en) 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
FR2915831B1 (fr) * 2007-05-04 2009-09-25 Alcatel Lucent Sas Interface d'enceinte de transport
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
JP5516968B2 (ja) 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
JP5794497B2 (ja) 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP2012204645A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 蓋体開閉装置
JP5842628B2 (ja) * 2012-01-25 2016-01-13 Tdk株式会社 ガスパージ装置及び該ガスパージ装置を有するロードポート装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
TWI627696B (zh) * 2013-01-22 2018-06-21 布魯克斯自動機械公司 基材運送
US9016998B2 (en) * 2013-03-14 2015-04-28 Varian Semiconductor Equipment Associates, Inc. High throughput, low volume clamshell load lock
JP6561700B2 (ja) * 2015-09-04 2019-08-21 シンフォニアテクノロジー株式会社 ガス注入装置
JP6632403B2 (ja) 2016-02-02 2020-01-22 東京エレクトロン株式会社 基板収納容器の連結機構および連結方法
CN106090222B (zh) * 2016-06-23 2017-09-19 上海中船三井造船柴油机有限公司 一种运动轴的动态密封结构
US10446428B2 (en) 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
JP7125591B2 (ja) * 2018-04-04 2022-08-25 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
US4534389A (en) * 1984-03-29 1985-08-13 Hewlett-Packard Company Interlocking door latch for dockable interface for integrated circuit processing
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
FR2573908B1 (fr) * 1984-11-26 1986-12-26 Cogema Dispositif de transfert a double barriere etanche entre un conteneur et une enceinte de confinement
US4815912A (en) * 1984-12-24 1989-03-28 Asyst Technologies, Inc. Box door actuated retainer
US4759681A (en) * 1985-01-22 1988-07-26 Nissin Electric Co. Ltd. End station for an ion implantation apparatus
JPS61291032A (ja) * 1985-06-17 1986-12-20 Fujitsu Ltd 真空装置
DE3522996A1 (de) * 1985-06-27 1987-01-08 Kolbus Gmbh & Co Kg Verfahren zur abgrenzung steriler raeume gegen austreten von toxischen sterilisationsmitteln oder eindringen von mikroorganismen, vorzugsweise in anwendung fuer fuellmaschinen, und vorrichtung zur durchfuehrung des verfahrens
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US5044871A (en) * 1985-10-24 1991-09-03 Texas Instruments Incorporated Integrated circuit processing system
JPS62222625A (ja) * 1986-03-25 1987-09-30 Shimizu Constr Co Ltd 半導体製造装置
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
DE3637880C2 (de) * 1986-11-06 1994-09-01 Meissner & Wurst Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten
EP0273226B1 (de) * 1986-12-22 1992-01-15 Siemens Aktiengesellschaft Transportbehälter mit austauschbarem, zweiteiligem Innenbehälter
JPH01125821A (ja) * 1987-11-10 1989-05-18 Matsushita Electric Ind Co Ltd 気相成長装置
JP2714833B2 (ja) * 1988-12-18 1998-02-16 日本真空技術株式会社 仕込・取出室
US5056875A (en) * 1989-03-20 1991-10-15 Motorola, Inc. Container for use within a clean environment
US5100287A (en) * 1989-04-27 1992-03-31 Micron Technology, Inc. Method of transferring wafers using vacuum
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5363867A (en) * 1992-01-21 1994-11-15 Shinko Electric Co., Ltd. Article storage house in a clean room

Also Published As

Publication number Publication date
WO1992007759A1 (en) 1992-05-14
DE69115292D1 (de) 1996-01-18
JPH06501815A (ja) 1994-02-24
EP0556193A1 (de) 1993-08-25
EP0556193A4 (en) 1993-11-03
US5547328A (en) 1996-08-20
US5169272A (en) 1992-12-08
US5370491A (en) 1994-12-06
JP3576162B2 (ja) 2004-10-13
EP0556193B1 (de) 1995-12-06

Similar Documents

Publication Publication Date Title
DE69115292T2 (de) Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere.
DE69007285D1 (de) Verfahren und Vorrichtung zum Verpacken von Stapelgütern in einer Lüftungsverpackung.
DE69100959D1 (de) Verfahren und Vorrichtung zum Sortieren und Bündeln von Blumen.
DE69015988T2 (de) Verfahren und Vorrichtung zum Ein- und Auslagern von Artikeln.
DE59007759D1 (de) Verfahren und Vorrichtung zum Verpacken von Gegenständen.
DE59203570D1 (de) Verfahren und vorrichtung zum stapeln.
DE69116709T2 (de) Vorrichtung und Verfahren zum Transport von Bauteilen
DE69203432D1 (de) Vorrichtung und Verfahren zum Transferieren von Gegenständen.
DE3885717D1 (de) Werkzeug und Verfahren zum Formen von komplexen Gegenständen aus Verbundwerkstoff.
DE69218107T2 (de) Vorrichtung und Verfahren zum Übertragen von Abziehbildern
DE59008889D1 (de) Verfahren und Vorrichtung zum Bedrucken von Objekten.
DE69106344T2 (de) Verfahren und vorrichtung zum palettisieren.
DE69204614T2 (de) Vorrichtung und Verfahren zum Verpacken in Ballen.
DE69009983T2 (de) Vorrichtung und Verfahren zum Handhaben von Waren.
DE69011820D1 (de) Verfahren und Vorrichtung zum Handhaben von Artikeln.
DE69111575D1 (de) Verfahren und Vorrichtung zur Erzeugung von Lücken in einer Reissverschlusskette.
DE69007363D1 (de) Verfahren und Vorrichtung zum Löten von Gegenständen.
ATA99791A (de) Verfahren und vorrichtung zum herstellen von vierkantern aus baumstämmen od. dgl.
DE3774864D1 (de) Verfahren und vorrichtung zum transportieren von artikeln.
DE58904274D1 (de) Verfahren und vorrichtung zum verpackungsgerechten gruppenweisen aneinanderruecken von wuersten.
DE68908330D1 (de) Vorrichtung und verfahren zum wiedereinfaerben.
DE69104559D1 (de) Verfahren und Vorrichtung zum Verpacken von elastisch verformbaren Gegenständen.
DE68902013D1 (de) Vorrichtung und verfahren zum stapeln.
DE69105849D1 (de) Verfahren und Vorrichtung zum Befördern von Gegenständen von einer Stelle zu einer anderen.
DE59009279D1 (de) Verfahren und Vorrichtung zum Verarbeiten von in einer Schuppenformation anfallenden Druckereiprodukten.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee