DE69115292D1 - Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere. - Google Patents

Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere.

Info

Publication number
DE69115292D1
DE69115292D1 DE69115292T DE69115292T DE69115292D1 DE 69115292 D1 DE69115292 D1 DE 69115292D1 DE 69115292 T DE69115292 T DE 69115292T DE 69115292 T DE69115292 T DE 69115292T DE 69115292 D1 DE69115292 D1 DE 69115292D1
Authority
DE
Germany
Prior art keywords
another
controlled atmosphere
transferring objects
transferring
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115292T
Other languages
English (en)
Other versions
DE69115292T2 (de
Inventor
Anthony Bonora
Gilles Guerre
Mihir Parikh
Frederick Rosenquist
Sudhir Jain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASYST TECHNOLOGIES
Asyst Technologies Inc
Original Assignee
ASYST TECHNOLOGIES
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES, Asyst Technologies Inc filed Critical ASYST TECHNOLOGIES
Publication of DE69115292D1 publication Critical patent/DE69115292D1/de
Application granted granted Critical
Publication of DE69115292T2 publication Critical patent/DE69115292T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075Handling workpieces outside exposure position, e.g. SMIF box
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69115292T 1990-11-01 1991-09-12 Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere. Expired - Fee Related DE69115292T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/607,898 US5169272A (en) 1990-11-01 1990-11-01 Method and apparatus for transferring articles between two controlled environments
PCT/US1991/006620 WO1992007759A1 (en) 1990-11-01 1991-09-12 Method and apparatus for transferring articles between two controlled environments

Publications (2)

Publication Number Publication Date
DE69115292D1 true DE69115292D1 (de) 1996-01-18
DE69115292T2 DE69115292T2 (de) 1996-06-27

Family

ID=24434168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115292T Expired - Fee Related DE69115292T2 (de) 1990-11-01 1991-09-12 Verfahren und vorrichtung zum überführen von gegenständen aus einer kontrollierten atmosphäre in eine andere.

Country Status (5)

Country Link
US (3) US5169272A (de)
EP (1) EP0556193B1 (de)
JP (1) JP3576162B2 (de)
DE (1) DE69115292T2 (de)
WO (1) WO1992007759A1 (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277550B2 (ja) * 1992-05-21 2002-04-22 神鋼電機株式会社 可搬式密閉コンテナ用ガスパージユニット
US5746008A (en) * 1992-07-29 1998-05-05 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers
KR100303075B1 (ko) 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
EP0596536A1 (de) * 1992-11-06 1994-05-11 Applied Materials, Inc. Transportsysteme und zugehörige Anwendungsmethode
DE4326308C1 (de) * 1993-08-05 1994-10-20 Jenoptik Jena Gmbh Transportvorrichtung für Magazine zur Aufnahme scheibenförmiger Objekte
US5538390A (en) * 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
JP2850279B2 (ja) * 1994-02-22 1999-01-27 ティーディーケイ株式会社 クリーン搬送方法及び装置
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US5664925A (en) * 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US5613821A (en) * 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5588789A (en) * 1995-07-06 1996-12-31 Brooks Automation Load arm for load lock
US5609459A (en) * 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock
US5740845A (en) * 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
SE9503102D0 (sv) * 1995-09-08 1995-09-08 Astra Ab Aseptic transfer
US5967571A (en) * 1995-10-13 1999-10-19 Empak, Inc. Vacuum actuated mechanical latch
EP0854964B1 (de) * 1995-10-13 2004-10-06 Empak, Inc. Vakuumangetriebener mechanischer riegel
US5810537A (en) * 1995-10-18 1998-09-22 Bye/Oasis Engineering Inc. Isolation chamber transfer apparatus
USH1762H (en) * 1995-10-26 1998-12-01 Kaempf; Ulrich Wafer restraining system
DE19540963C2 (de) * 1995-11-03 1999-05-20 Jenoptik Jena Gmbh Transportbehälter für scheibenförmige Objekte
JP3796782B2 (ja) * 1995-11-13 2006-07-12 アシスト シンコー株式会社 機械的インターフェイス装置
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system
FR2747112B1 (fr) * 1996-04-03 1998-05-07 Commissariat Energie Atomique Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
EP0875921A1 (de) * 1997-05-03 1998-11-04 Stäubli AG Pfäffikon Umladevorrichtung für Wafer
US6090176A (en) * 1997-03-18 2000-07-18 Kabushiki Kaisha Toshiba Sample transferring method and sample transfer supporting apparatus
US5803696A (en) * 1997-05-16 1998-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Safety interlock device for a standard manufacturing interface arm and equipment
JPH10321714A (ja) * 1997-05-20 1998-12-04 Sony Corp 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
NL1009327C2 (nl) * 1998-06-05 1999-12-10 Asm Int Werkwijze en inrichting voor het overbrengen van wafers.
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
US6145444A (en) * 1998-12-16 2000-11-14 Wilkinson; Kerry E. Micro clean sealed tubular transporter apparatus
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
US6427096B1 (en) 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US6249990B1 (en) * 1999-03-23 2001-06-26 Alliedsignal, Inc. Method and apparatus for transporting articles
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
US6354781B1 (en) 1999-11-01 2002-03-12 Chartered Semiconductor Manufacturing Company Semiconductor manufacturing system
US6585470B2 (en) 2001-06-19 2003-07-01 Brooks Automation, Inc. System for transporting substrates
US6646720B2 (en) * 2001-09-21 2003-11-11 Intel Corporation Euv reticle carrier with removable pellicle
JP2003168727A (ja) * 2001-11-30 2003-06-13 Dainichi Shoji Kk エクスチェンジャーおよびガス置換方法
JP4168642B2 (ja) * 2002-02-28 2008-10-22 東京エレクトロン株式会社 被処理体収納容器体及び処理システム
SG106129A1 (en) * 2002-03-01 2004-09-30 Asml Netherlands Bv Transfer method for a mask or substrate, storage box, device or apparatus adapted for use in such method, and device manufacturing method comprising such a method
EP1341045A1 (de) * 2002-03-01 2003-09-03 ASML Netherlands B.V. Verfahren zur Übergabe einer Maske oder eines Substrats
EP1396759A3 (de) * 2002-08-30 2006-08-02 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und damit erzeugter Artikel
EP1394611A1 (de) * 2002-08-30 2004-03-03 ASML Netherlands BV Lithographischer Apparat, Methode zur Herstellung einer Vorrichtung und damit hergestellte Vorrichtung
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US6918737B2 (en) * 2002-10-31 2005-07-19 Solo Cup Company System and method for stacking a predetermined number of nestable objects
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
EP1434094A1 (de) * 2002-12-27 2004-06-30 ASML Netherlands B.V. Behälter für eine Maske
US20050169730A1 (en) * 2003-04-30 2005-08-04 Ravinder Aggarwal Semiconductor processing tool front end interface with sealing capability
US7674083B2 (en) * 2003-05-15 2010-03-09 Tdk Corporation Clean device with clean box-opening/closing device
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Tdk株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
KR100572321B1 (ko) * 2003-10-02 2006-04-19 삼성전자주식회사 반도체 소자 제조 설비 및 방법 그리고 이에 사용되는스토커
US20070211232A1 (en) * 2003-11-10 2007-09-13 Phillips Alton H Thermophoretic Techniques for Protecting Reticles from Contaminants
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US7230702B2 (en) 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
WO2005078771A2 (en) * 2004-02-05 2005-08-25 Entegris Inc. Purging of a wafer conveyance container
US7611319B2 (en) 2004-06-16 2009-11-03 Applied Materials, Inc. Methods and apparatus for identifying small lot size substrate carriers
US9010384B2 (en) * 2004-06-21 2015-04-21 Right Mfg. Co. Ltd. Load port
US7409263B2 (en) 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
CN101044074B (zh) * 2004-08-19 2014-04-02 布鲁克斯自动化公司 容量减小的运载器和使用方法
KR20070054683A (ko) 2004-08-23 2007-05-29 브룩스 오토메이션 인코퍼레이티드 승강기 기반의 도구 적재 및 버퍼링 시스템
JP2008510673A (ja) * 2004-08-24 2008-04-10 ブルックス オートメーション インコーポレイテッド 搬送システム
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
KR20070062521A (ko) * 2004-09-17 2007-06-15 지라텍스 테크놀로지 리미티드 디스크 드라이브를 위한 하우징 및 장치
US7410340B2 (en) 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
JP2009503899A (ja) * 2005-08-03 2009-01-29 インテグリス・インコーポレーテッド 移送容器
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
JP5105334B2 (ja) 2006-01-11 2012-12-26 アプライド マテリアルズ インコーポレイテッド 基板キャリヤをパージするための方法及び装置
JP4194051B2 (ja) 2006-05-31 2008-12-10 Tdk株式会社 防塵機能を備えたロードポート装置及びミニエンバイロンメントシステム
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP5674314B2 (ja) 2007-02-28 2015-02-25 インテグリス・インコーポレーテッド レチクルsmifポッド又は基板コンテナ及びそのパージ方法
US7585142B2 (en) 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
FR2915831B1 (fr) * 2007-05-04 2009-09-25 Alcatel Lucent Sas Interface d'enceinte de transport
US9105673B2 (en) * 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
JP5794497B2 (ja) 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム
JP5516968B2 (ja) 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
JP5617708B2 (ja) 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP2012204645A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 蓋体開閉装置
JP5842628B2 (ja) * 2012-01-25 2016-01-13 Tdk株式会社 ガスパージ装置及び該ガスパージ装置を有するロードポート装置
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
TWI627696B (zh) 2013-01-22 2018-06-21 布魯克斯自動機械公司 基材運送
US9016998B2 (en) * 2013-03-14 2015-04-28 Varian Semiconductor Equipment Associates, Inc. High throughput, low volume clamshell load lock
JP6561700B2 (ja) * 2015-09-04 2019-08-21 シンフォニアテクノロジー株式会社 ガス注入装置
JP6632403B2 (ja) * 2016-02-02 2020-01-22 東京エレクトロン株式会社 基板収納容器の連結機構および連結方法
CN106090222B (zh) * 2016-06-23 2017-09-19 上海中船三井造船柴油机有限公司 一种运动轴的动态密封结构
US10446428B2 (en) 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
JP7125591B2 (ja) * 2018-04-04 2022-08-25 シンフォニアテクノロジー株式会社 ロードポート及びefem

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US4534389A (en) * 1984-03-29 1985-08-13 Hewlett-Packard Company Interlocking door latch for dockable interface for integrated circuit processing
FR2573908B1 (fr) * 1984-11-26 1986-12-26 Cogema Dispositif de transfert a double barriere etanche entre un conteneur et une enceinte de confinement
US4815912A (en) * 1984-12-24 1989-03-28 Asyst Technologies, Inc. Box door actuated retainer
US4759681A (en) * 1985-01-22 1988-07-26 Nissin Electric Co. Ltd. End station for an ion implantation apparatus
JPS61291032A (ja) * 1985-06-17 1986-12-20 Fujitsu Ltd 真空装置
DE3522996A1 (de) * 1985-06-27 1987-01-08 Kolbus Gmbh & Co Kg Verfahren zur abgrenzung steriler raeume gegen austreten von toxischen sterilisationsmitteln oder eindringen von mikroorganismen, vorzugsweise in anwendung fuer fuellmaschinen, und vorrichtung zur durchfuehrung des verfahrens
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US5044871A (en) * 1985-10-24 1991-09-03 Texas Instruments Incorporated Integrated circuit processing system
JPS62222625A (ja) * 1986-03-25 1987-09-30 Shimizu Constr Co Ltd 半導体製造装置
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
DE3637880C2 (de) * 1986-11-06 1994-09-01 Meissner & Wurst Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten
DE3776118D1 (de) * 1986-12-22 1992-02-27 Siemens Ag Transportbehaelter mit austauschbarem, zweiteiligem innenbehaelter.
JPH01125821A (ja) * 1987-11-10 1989-05-18 Matsushita Electric Ind Co Ltd 気相成長装置
JP2714833B2 (ja) * 1988-12-18 1998-02-16 日本真空技術株式会社 仕込・取出室
US5056875A (en) * 1989-03-20 1991-10-15 Motorola, Inc. Container for use within a clean environment
US5100287A (en) * 1989-04-27 1992-03-31 Micron Technology, Inc. Method of transferring wafers using vacuum
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5363867A (en) * 1992-01-21 1994-11-15 Shinko Electric Co., Ltd. Article storage house in a clean room

Also Published As

Publication number Publication date
US5169272A (en) 1992-12-08
JP3576162B2 (ja) 2004-10-13
US5547328A (en) 1996-08-20
EP0556193A4 (en) 1993-11-03
EP0556193A1 (de) 1993-08-25
EP0556193B1 (de) 1995-12-06
JPH06501815A (ja) 1994-02-24
US5370491A (en) 1994-12-06
DE69115292T2 (de) 1996-06-27
WO1992007759A1 (en) 1992-05-14

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