DE69007363D1 - Verfahren und Vorrichtung zum Löten von Gegenständen. - Google Patents

Verfahren und Vorrichtung zum Löten von Gegenständen.

Info

Publication number
DE69007363D1
DE69007363D1 DE90307780T DE69007363T DE69007363D1 DE 69007363 D1 DE69007363 D1 DE 69007363D1 DE 90307780 T DE90307780 T DE 90307780T DE 69007363 T DE69007363 T DE 69007363T DE 69007363 D1 DE69007363 D1 DE 69007363D1
Authority
DE
Germany
Prior art keywords
soldering objects
soldering
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90307780T
Other languages
English (en)
Other versions
DE69007363T2 (de
Inventor
John R Morris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23526061&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69007363(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of DE69007363D1 publication Critical patent/DE69007363D1/de
Publication of DE69007363T2 publication Critical patent/DE69007363T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
DE69007363T 1989-07-27 1990-07-17 Verfahren und Vorrichtung zum Löten von Gegenständen. Expired - Fee Related DE69007363T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/386,548 US5046658A (en) 1989-07-27 1989-07-27 Method and apparatus for soldering articles

Publications (2)

Publication Number Publication Date
DE69007363D1 true DE69007363D1 (de) 1994-04-21
DE69007363T2 DE69007363T2 (de) 1994-06-23

Family

ID=23526061

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69007363T Expired - Fee Related DE69007363T2 (de) 1989-07-27 1990-07-17 Verfahren und Vorrichtung zum Löten von Gegenständen.

Country Status (5)

Country Link
US (1) US5046658A (de)
EP (1) EP0410623B1 (de)
JP (1) JPH0783930B2 (de)
KR (1) KR910002551A (de)
DE (1) DE69007363T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3103410B2 (ja) * 1991-12-20 2000-10-30 大阪酸素工業株式会社 特殊雰囲気ガスを用いたはんだ付け方法
US5249733A (en) * 1992-07-16 1993-10-05 At&T Bell Laboratories Solder self-alignment methods
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
WO1994014563A1 (en) * 1992-12-25 1994-07-07 Nippon Sanso Corporation Soldering method and apparatus
US5958151A (en) * 1996-07-22 1999-09-28 Ford Global Technologies, Inc. Fluxing media for non-VOC, no-clean soldering
JP3397313B2 (ja) * 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法
TW570856B (en) * 2001-01-18 2004-01-11 Fujitsu Ltd Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
JP5262045B2 (ja) * 2007-09-27 2013-08-14 富士通セミコンダクター株式会社 電極の形成方法及び半導体装置の製造方法
WO2012099771A1 (en) * 2011-01-17 2012-07-26 Orthodyne Electronics Corporation Systems and methods for processing ribbon and wire in ultrasonic bonding systems
JP5884448B2 (ja) * 2011-12-01 2016-03-15 富士電機株式会社 はんだ接合装置およびはんだ接合方法
CN108145268A (zh) * 2018-01-19 2018-06-12 南京利景盛电子有限公司 基于空气回流的pcb板与金属壳体对焊的焊接工艺
US11465225B1 (en) 2021-08-31 2022-10-11 Yield Engineering Systems, Inc. Method of using processing oven

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2898255A (en) * 1958-06-30 1959-08-04 Ibm Soldering flux composition
US3970239A (en) * 1975-08-14 1976-07-20 General Instrument Corporation Fluxing technique for removing lead oxide
US4022371A (en) * 1976-06-14 1977-05-10 International Business Machines Corporation Vapor bonding method
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4600137A (en) * 1985-02-21 1986-07-15 Hollis Automation, Inc. Method and apparatus for mass soldering with subsequent reflow soldering
US4739920A (en) * 1986-03-19 1988-04-26 Rca Corporation Soldering process
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4919970A (en) * 1986-09-15 1990-04-24 International Business Machines Corporation Solder deposition control
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus

Also Published As

Publication number Publication date
JPH0360861A (ja) 1991-03-15
EP0410623B1 (de) 1994-03-16
EP0410623A1 (de) 1991-01-30
JPH0783930B2 (ja) 1995-09-13
DE69007363T2 (de) 1994-06-23
US5046658A (en) 1991-09-10
KR910002551A (ko) 1991-02-25

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN

8339 Ceased/non-payment of the annual fee