TW471026B - Substrate supporting device and substrate processing device - Google Patents

Substrate supporting device and substrate processing device Download PDF

Info

Publication number
TW471026B
TW471026B TW089114733A TW89114733A TW471026B TW 471026 B TW471026 B TW 471026B TW 089114733 A TW089114733 A TW 089114733A TW 89114733 A TW89114733 A TW 89114733A TW 471026 B TW471026 B TW 471026B
Authority
TW
Taiwan
Prior art keywords
substrate
glass substrate
supporting
support
positioning
Prior art date
Application number
TW089114733A
Other languages
Chinese (zh)
Inventor
Tsunehiko Amamiya
Yasuo Aoki
Yuuri Nakamura
Original Assignee
Nippon Kogaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk filed Critical Nippon Kogaku Kk
Application granted granted Critical
Publication of TW471026B publication Critical patent/TW471026B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

To provide a device which can support a substrate without depending on the mounting direction, and suppresses distortion in the substrate during carrying process including an exchanging process. The device is equipped with a supporting part (20) having a plurality of openings (21) to support a substrate (P), and with positioning parts (22a) to (22c) formed on the supporting part (20) to position the substrate (P) in a first direction and a second direction different from the first direction respectively.

Description

471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(/ ) [技術領域] 本發明係有關用以支持基板之基板支持裝置,及對被 該基板支持裝置所支持之基板進行既定處理之基板處理裝 置,特別是有關用以支持在液晶顯示器之製造等所使用之 薄基板之基板支持裝置,及在該基板進行曝光處理等之基 板處理裝置。 [習知技術] 習知,例如在製造液晶顯示器之工程,使用各種裝置 ,例如曝光裝置或檢查裝置等之大型基板之處理裝置。在 使用這些處理裝置之曝光工程及檢查工程,係使用將大型 基板(玻璃基板)安裝於處理裝置之作業及拆卸作業自動進 行之基板交換裝置。 圖14係表示用於液晶用曝光裝置之基板交換裝置之槪 略構成之一例。在此圖中所示之基板交換裝置,其中玻璃 基板P係如以下所述而被載置於基板固定器43。 ⑴以機器人手臂42將玻璃基板P由下方保持並搬送至 基板固定器43上方。 ⑵在此狀態下,將設於基板固定器43且用於基板交接 之多數之支持棒44,透過設於基板固定器43上面之開口 而由固定器上面突出及上升,並將玻璃基板由下方往上抬 起(或於由固定器43上面突出並停止之支持棒44上載置玻 璃基板P,而使機器人手臂42下降)。在此場合,支持棒 44爲使玻璃基板P不致產生較大之彎曲,而支持玻璃基板 P之中央部附近及周邊部而予以配置。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) - -- - - ---- - - - - — I I l· I 1 I 訂--- ------ 線 i (請先閱讀背面之注意事項再填寫本頁) 471026 A7 經濟部智慧財產局員工消費合作社印製 ____B7______ 五、發明說明(上) ⑶其次,使支持棒44上升既定量,當由機器人手臂 42上面僅以既定量藉由支持棒44將玻璃基板P往上抬高 時,使機器人手臂42避免接觸到玻璃基板P、支持棒44 及基板固定器43而自玻璃基板P下方移開。 ⑷其後,在將玻璃基板P由下方支持之狀態,使支持 棒44下降,並往比基板固定器43上面更下側伸入,僅使 玻璃基板P接觸基板固定器43上面之狀態而載置。其次, 藉由基板固定器43以設於基板固定器43上面之多數之吸 氣孔(未圖示)將玻璃基板P吸著固定。此時,必須提升玻 璃基板P之平坦性(平面度),而使玻璃基板P保持平衡而 被吸著於基板固定器43。其後,玻璃基板P係邊與基板固 定器43同時移動,邊以曝光裝置進行曝光處理。又,在將 玻璃基板P由基板固定43拆卸之場合:係以上述⑴〜⑷ 所說明之相反順序進行。 但,作爲平面顯示器製造用之基板,例如,由於使用 500mmX600mm且厚度爲〇.7mm程度之薄玻璃基板,此玻 璃基板容易破損,即使僅產生較大之彎曲,即會造成破損 。因此,在上述習知之基板交換裝置,爲使該薄玻基板不 * 、 、 , - · 參 會損傷且由機器人手臂交接至基板固定器,因此有必要在 - . 玻璃基板之中央及周邊部之臂部未接觸之部份,配置多數 ^ ' 之支持棒,在玻璃基板下面取得平衡而支持之狀態下進行 基板交換。 此處,爲使基板能更安定地衷持,則不得不增加支持 棒之數量,但當支持.棒之數量增加時,該支持棒之上下動 4 本Ϊ氏張尺度適用中國國家標準(CNS)A4&格297公釐1 ' ----- -------* I 1--Γ I I I -------- i (請先閱讀背面之注意事項再填寫本頁) 471026 A7 B7 五、發明說明(3) i機構不僅複雜且大型化,同時,基板固定器之位置控制性心 亦更1化。因此’必須限制支持楱之數量,結果’對基板 而言會產生某些程度之彎曲,形成此彎曲之原因,而無法 將基板全體同時與基板固定器抵接或由基板固定器剝離, 因此’在基板固定器上面造成部份磨損之問題。 « J i . 進而,在上述習知之基板交換裝置,機器人手臂係避 免與支持棒干涉而於移動方向形成梳齒狀之單端固定橫樑 構造,並且,爲使基板避免破損而支持,而必須在基板之 1中央部附近支持。即,爲了在基板與基板固定器之間可確 4保僅機器人手臂伸入之空間,因此支持棒必須將基板往上 抬高。但,例如在液晶用之曝患裝置ξ場合,圖14所示之 投影光學系統與基板固定器吼之空隙(所謂的X作距離) ,由於具有隨著投影光學系兢之大N.A.(Numerical Aperture 數値_孔徑)化而之傾向,因此,形成無法確保上述之機 器人手臂僅可伸入之空間。因此,藉由液晶用之曝光裝置 ^ ,具有在將基板固定器自投影光學系統移開之虞移動而必 須進行基板交接之場合,由於基板固定器之移動距離變大 ,不但增加基板之交接時間,同時亦造成裝置之設備面積 變大之問題。 此處,本案申請人爲解決上述問題’已提出有基板支 持裝置(日本專利特願平10-042835號)。此基板亥持裝置, 係由具有與外周部之內側一體設置用以支持基板之支持部 之碟狀所構成,該支持部:ί系在支持基板並防止基板造成彎 曲之狀態下,與基板支t寺裝置一體進行基板之搬送、交換 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公髮) (請先閱讀背面之注意事項再填寫本頁) 裝---- 訂---------線 經濟部智慧財產局員工消費合作社印製 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(4) 〇 [發明所欲解決之課題] 但,上述習知之基板支持裝置及基板處理裝置,存在 有如下之問題。 曝光於上述玻璃基板之元件圖案之形狀依其大小,在 一變更玻璃基板方向之狀態下而載置於基板固定罨上,對圖 案之配置上哮f利。又’在更換製造批*時,繼通常方向 之玻璃基板,接著將變更方向後之玻璃基板載置於基板周 定器上。又,在一台曝光裝置所使用之玻璃基板大小並,不 限聆一種,對應於元件而存在有多乾之大小。 基板支持裝置通常係與玻璃基板一起搬送,由於對一 台曝光裝置而被多數使用,以消耗品方式處理而定期交換 ,若配合上述之特定方向或大小而製作,,則對玻璃基板之 4方向及每一大小而言,必須設計及製作基板支持裝置,因 j而造成成本提高。進而,在切換玻璃基板之方向、大小時 ,依此而必須更換基板支持裝置,因而造成增加作業時間 、作業量之問題。因此,當基板支持裝置之4價袼上升,同 1 vj η 時,亦產生曝光裝置之運作成本提高之問題。 r 〆 又,由於使用上述之基板支持裝置,雖然在工作距離 較窄之場所亦可容易進行玻璃基板之搬送,但當以機器人 手臂支持基板支持裝置之兩端時,則會因搬考時之本體重 量及玻璃基板之重量而造成彎曲。換t言之,由於基板I:持 裝置之實質厚度增加,對工作距離無法充份取得之問題。 另一方面,除曝光裝置外,例如由塗料展開機所搬入 Λ------------- -----„-----訂 *--------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(γ) 之玻璃基板之位置精確度不甚良好,因此在將玻璃基板載 置於基板支持裝置時,必須有前對岸機構,然而,由於並 w無法獲得使用基板支持裝置苳適當的前對準撵構/,因此仍 有待開發。又,對載置於基板支持裝置之玻璃琴板亦須有 j定每機構,但由於基板支持裝置係自工作台或機器人獨立 之構成,因此,對於必須由外部供給電力1、空壓等之機構 j的設置十分困難。 進而,在使用基板支持裝置於玻璃基板搬送之場合, 必須考慮到玻璃基板及基板裝置兩者之移動,因而會有順 序之模式增加之傾向。特別是搬、送裝置具有一對搬送臂, 所謂雙臂2:場合,在某一交接位置進行搬入之臂部,及以 N , 、 準行搬、出之臂部在每一週期進行交換,使對導引作業雙方 進行等’對順序之構成不僅增加極大負擔,亦使機器人之 ^調整’故障發生時之霞I吳處理程式之作成遊谓變長之問題 〇 本發明有鑑於此,其第1目的係提供不限於載置之方 〜向皆可支持基板,又,包含交換之搬送時,可抑制基板彎-曲之基板支持裝置及基板處理裝置。又,本發明之第2目 的係提供即使基板之大小變更,亦可邊抑制基板之彎曲, 邊予以支持之基板支持裝置及基板處理裝置。又,本發明、 之第3目的係提供在將基板載羃於基板支持裝置之前,可 4進行適當之前對準之基板處理裝置。又,本發明之第4目 的係提供對於載置於基板支持裝置後之基板,不必使用複 雜之機構,而可簡單地定位固定之基板支持裝置及基板處 --------^---- 裝-----Γ ----—訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) 經濟部智慧財產局員工消費合作社印製 471026 A7 -------B7 五、發明說明() 理裝置。又’本發明之第5目的係提供使在利用雙臂而搬 送基板之場合,亦可使順序簡化之基板處理裝置。 [解決課題之手段] 爲達成上述目的.,本發明係採用圖1至圖12所對應之 實施形態之以下構成。 本發明之基板支持裝置,係支持基板(P、PS)之基板支 持裝置(17),其特徵係具有:支持部(20),具有多數之開口 部(21),並支持基板(P、PS);及定位部(22a〜22c、24a〜 24c),設於支持部(20),並將基板(P、PS)分別定位於第1方 向及與第1方向相異之第2方向。 因此,在本發明之基板支持裝置,由於在支持部(20) 設置多數開口部(21),因此在將基板支持裝置(17)與基板(P 、PS)—體搬送時,可抑制彎曲及由此所造成之破損。又, 在此基板支持裝置,藉由定位部(22a〜22c、24a〜24c),可 將基板(P、PS)分別定位於第1方向、第2方向之相異方向 而支持。 又,本發明之基板支持裝置,係支持基板(P、PS)之基 板支持裝置(17),其特徵係具有:支持部(20),具有多數之 開口部(21),並支持基板(P、PS);定位部(22a〜22c、24a〜 24c),突設於支持部(20),並將基板(P、PS)定位;及固定 部(25),設置爲多數在支持部(20),將定位部(22a〜22c、 24a〜24c)以裝拆自如方式固定。 因此,在本發明之基板支持裝置,由於在支持部(20) 設置多數之開口部(21),因而形成不僅可將基板(P、PS)以 8 張尺度適用中國國家標準(CNS)A4規格(210 X 297公;^ "~^~~一. ------------- 裝 -----Γ 1---訂---------線 I (請先閱讀背面之注意事項再填寫本頁) 471026 Α7 -:----Β7 五、發明說明(7 ) 點支持’亦可以線或面而支持。因此,在將基板支持裝置 (17)與基板(P、PS)~體搬送時,可抑制基板之彎曲及由此 所造成之破損。又,在此基板支持裝置,在變更基板(P、 PS)之時,可藉由將定位部(22a〜22c、24a〜24c)由一旦固 定部(25)移開而安裝於對應基板(p、ps)大小之固定部(25), 而可將多數大小之基板(p、PS)定位而支持。 其次’本發明之基板處理裝置,具有用以保持基板(P 、PS)之基板固定器(9、16);及對被保持於基板固定器(9、 16)之基板(P、PS)進行既定處理之處理部(PL),之基板處理 裝置(3、6),其特徵係:在基板固定器(9、16),形成申請 專利範圍第1〜7項中之任一項所述之基板支持裝置(17)之 支持部(20)所嵌合之溝部(9a、16a)。 因此,在本發明之基板處理裝置,由於藉由將支持部 (20)嵌合於溝部(9a、16b),而使支持部(20)沈入,因此可將 被支持於基板支持部(17)之基板(P、PS)保持在基板固定器 (9、16)。又,對在此基板固定器(9、16)上之基板(P、PS)可 進行既定之處理。此時,定位部(22a〜22c、24a〜24c)藉由 自基板固定器(9、16)突出,對定位部(22a〜22c、24a〜24c) 之基板(P、PS)之定位不必解除,而可維持基板(P、PS)之定 位狀態。又,在使用一對搬送臂(12A、12B)之場合,由於 藉由將交接部(9、14 ' 15、16)設置偶數處所,而可使對交 接部(9、14、15、16)之基板(P、PS)之搬入、搬出之分擔固 定在各搬送臂(12A、12B)而設定’因此,可將各動作之導 引作業及錯誤處理程式僅在對應各動作之搬送臂(12A、 9 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公ί")· (請先閱讀背面之注意事項再填寫本頁) 裝-----:----訂----- 線 經濟部智慧財產局員工消費合作社印製 471026 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(?) 12B)實行,準備即可。 [發明之實施形態] 以下,參照圖1至圖8,說明本發明之基板支持裝置 及基板處理裝置之第.1實施形態。此處,係使用作爲基板 處理裝置,對被塗布感光劑之基板進行液晶顯示元件用圖 案曝光之曝光裝置,及對曝光圖案之基板,在圖案領域周 邊進行曝光處理之周邊曝光裝置之例予以說明。又,將使 用基板之液晶顯示板製造之角形玻璃基板(例如,700mmx 900mm,t=:0.8mm)之例予以說明。在這些圖中,與作爲習 知例之圖14具有同一構成要素並附有同一符號,其說明則 省略。 圖2係曝光裝置1之截面平面圖。曝光裝置1,係被 高度淨化並於以既定溫度調整後之容器2內,具有曝光裝 置本體(基板處理裝置)3、搬送機器人(搬送部)4、搬出入部 5、周邊曝光裝置(基板處理裝置)6及處擬埠(交接部)7所構 成。 圖3係曝光裝置本體3之外觀立體圖。曝光裝置本體 3,具有將作爲光罩之網線R以曝光用照明光IL照明之未 圖示之照明系統、將形成有液晶顯示元件用圖案之網線R 保持之未圖示之網線台、配置於該網線台下方之投影光學 系統PL、及在投影光學系統PL下方,作爲使基座8上往 XY2次元方向移動之作爲基板固定器之板固定器(交接部)9 等。又,照明系統及投影光學系統PL,係構成在玻璃基板 P進行曝光處理之處理部。 10 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱1 ---------I--II -----r I---訂---------線 I (請先閱讀背面之注意事項再填寫本!) 471026 A7 經濟部智慧財產局員工消費合作社印製 ___B7__ 五、發明說明(f ) 投影光學系統PL ’使用將等倍之正立正像投影之光學 系統。在此曝光裝置本體3 ’在將長方形之玻璃基板p載 置於板固定器9上之狀態進行分段掃描(step and scan)方式 之曝光,形成於網線R之圖案依序轉印於玻璃基板P上之 多數例如4個曝光領域(圖案領域)。即,在此曝光領域本 體3,透過來自照明系統之曝光用之照明光IL照明網線R 上之切口之照明領域之狀態下,以未圖示之控制器透過未 圖示之驅動系統,使保持網線台及保持玻璃基板P之板固 定器9同步,以同一速度及方向往既定之掃描方向(此處設 爲Y方向),使網線R之圖案依序轉印於玻璃基板P上之1 個曝光領域,亦即進行掃描曝光。 在此1個曝光領域之掃描曝光結束後,藉由控制器進 行使板固定器9至其次之曝光領域之掃描開始位置爲止往 既定量X方向移動之分段動作。其次,在曝光裝置本體3 ,藉由重複進行此種掃描曝光及分段動作,依序將網線R 之圖案轉印於4個曝光領域。 搬送機器人4,具有水平關節型構造,與曝光裝置本 體3 '搬出入部5、周邊曝光裝置6及虛擬埠7對向配置, 並具有介由垂直關節軸連結爲多數部份所形成之臂部10 ; 設於此臂部10先端而具有2支爪部11之搬送臂12A ;及 驅動臂部10之驅動裝置13。又,此搬送機器人4,雖爲方 便起見而未表示於圖3,其亦具有設於搬送臂12A下方, 與搬送臂12A具有同樣機構並可獨立驅動之搬送臂ΠΒ之 雙臂構造。 II 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公爱)~" ------II----- ----^--訂-—-------I (請先閱讀背面之注意事項再填寫本頁) 471026 A7 —__ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(〆) 搬出入部5,係以與曝光裝置1鄰接配置之塗料展開 機(未圖示)將感光劑塗布於玻璃基板P,將該玻璃基板P搬 入及交接,並且調整該被搬入之玻璃基板P的溫度之搬入 埠(交接部)14 ;及配置於搬入埠14上方,將被曝光裝置本 體3施以曝光處理後之玻璃基板P交換之搬出埠(交接部 )15所槪略構成(又,圖2中並未圖示搬入埠14)。又,搬出 入部5係可沿Z軸周圍旋轉。 周邊曝光裝置6,係具有將被曝光裝置本體3進行曝 光處理後之玻璃基板P予以保持之作爲基板固定器之板固 定器(交接部)16 ;及在此玻璃基板P之圖案領域周邊進行 曝光處理之處理部(未圖示)。此處,被曝光處理後之玻璃 基板P,係於圖案領域周邊所塗布之感光劑予以曝光。又 ,在曝光裝置本體3之曝光處理,亦可ΪΙ先進行藉由周邊 曝光裝置6之周邊曝光(非圖案部之曝光)。 虛擬璋7,係在曝光裝置1未搭載周邊曝光裝置6之 場合,或即使搭載周邊曝光裝置6而未使用之場合,皆可 使用,其係如後述之將搬送途中之基板支持裝置(盤)17暫 時保持之構成。 在圖3中,其係表示在支持玻璃基板P之基板支持裝 置17四邊分別突設2個合計8個翼部18中,對向邊之翼 部18係被搬送機器人4之爪部11由下方保持,並以搬送 臂12A保持基板支持裝置17之狀態。 如圖1所示,基板支持裝置17,具有縱橫(及部份傾 斜)以既定間隔格子狀張開之多數線狀部件19作爲全體而 12 ------------^-----Γ —--訂----------線 , (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 471026 A7 B7 五、發明說明(II ) 形成略矩形狀之支持部20。又,在以多數線狀部件19所 構成之各格子內部,形成任何一個皆玻璃基板P小之四角 形之多數開口部21。這些多數線狀部件.19在此處係彼此 熔接,或組合爲格子狀。 其次,上述翼部18係由支持部20之四邊分別以2個 突設,並構成支持部20之一部份。在各翼部18之下面側 ,張開既定間隔而形成圚錐狀之凹部18a、18b。在定位於 外側之凹部18a,透過嵌合設於搬送臂12A、12B之爪部11 之半球狀的突部(未圖示),使基板支持裝置保持於搬臂12A 、12B。在定位於內側之凹部18b,透過嵌合分別設於板固 定器9、16、搬入璋14、搬出埠15及虛擬埠7,之半球狀 的突部(未圖示,又,板固定器9、16之突部爲符號9b、 16b,參考圖4),而保持基板支持裝置17。 另一方面,在支持部20之上面側,突設圓柱狀之多數 定位部22a、22b、22c ’將支持於此支持部20之玻璃基板 P之側面保持及定位。定位部22a,係當玻璃基板P在支持 部20上以縱向(第1方向)之姿勢pV載置時,被配置在由 側方保持玻璃基板P之兩短邊之位置。定位部22c,係當 玻璃基板P在支持部20上以與姿勢pv大致彼此垂直交叉 之橫向(第2方向)之姿勢PH載置時,被配置在由側方保持 玻璃基板P之兩短邊之位置。又,定位部22b,係當玻璃 基板P以縱向之姿勢PV或橫向之姿勢ph載置時,被配置 在由兩側方保持任何方向皆爲玻璃基p之長邊之位置。又 ’亦可在支持部20上之線狀部件19交叉之處所接著(或螺 13 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -----Γ ----訂---------線 丨- 經濟部智慧財產局員工消費合作社印製 471026 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明) 合)由縮醛樹脂(delrin)等之塑膠所形成之部件,透過此多數 之縮醛樹脂,以多數點支持玻璃基板P。在此場合,可使 縮醛樹脂之高度設定低於定位部22a、22b、22c。 其次,如圖2及.圖3所示,在曝光裝置本體3之板固 定器9上面,對應線狀部件19之配置,形成上述支持部 20所嵌合之溝部9a。如圖4(a)、(b)所示,溝部9a之深度 係設定爲當支持部20嵌合沈入時,定位部22a〜22c由板 固定器9上面突出,並不使其由被載置於支持部20上之玻 璃基板P上面突出之尺寸。又,此板固定器9上面係使其 具有較佳之平面度以除去玻璃基板P之彎曲。進而,在板 固定器9上面,設置用以配合該面而使玻璃基板P密接之 吸氣孔(未圖示)對應多數之開口部21。 又,在曝光裝置1,當將玻璃基板P,載置於基板支持 裝置Π之支持部20時,對定位部22a〜22c,設置將玻璃 基板P預先對位之前對準裝置。如圖5U)所示,前對準裝 置(對位裝置)23,係由連接至未圖示之驅動部,並對基板 支持裝置17離開靠近自如地水平移動之基部23a;由此基 部23a下方突出,並在支持裝置17由側方壓著之壓著部 23b ;及設於基部23a先端上方,而與玻璃基板P之側面抵 接之抵接部23c所構成,並配設於基板支持裝置20之四邊 之每一邊。 抵接部23c,避免使玻璃基板P損傷而以橡皮等軟彈 性材料所形成,又,當壓著部23b被壓著於基板支持裝置 17側面時,如圖5(b)所示,以既定之精確度設定玻璃基板 14 ^紙張λ度適用中國國家標準(CNS)A4規格(210 X 297公釐) '" -------------t-----r J---訂--------緩 I <請先閲讀背面之注意事項再填寫本頁) 471026 A7 __ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(G ) P對定位部22a〜22c對位之大小、位置。又,即使在基板 支持裝置17,其側面與定位部22a〜22c之位置關係亦設定 既定之精確度。又,如圖5(c)所示,抵接部23c係設定爲 比定位部22a〜22c更上方而與玻璃基板P抵接之高度。 以下,說明上述構成之基板支持裝置及其作用。首先 ,說明將玻璃基板P載置於基板支持裝置17,並以搬送機 器人4往曝光裝置本體3搬入、搬出之順序。又,相對於 基板支持裝置17之玻璃基板P之交接,係包含例如前述習 知例之支持棒及其上下動機構般之構成部份,在基板支持 裝置17上方一旦支持玻璃基板P並下降,以及透過將玻璃 基板P移載至基板支持裝置17之交接裝置而進行。又,此 處,係將玻璃基板P以縱向之姿勢PV而載置於支持部20 上。· 當塗布有感光劑之玻璃基板P由塗料展開機搬送至搬 入埠14時,則搬出入部5旋轉,使在搬入埠14上之基板 支持裝置17對應縱向之姿勢PV而定位。又,當將玻璃基 板P以橫向之姿勢PH載置時,可使搬出入部5之旋轉角 偏移90°。 當使基板支持裝置17定位時,交接裝置之支持棒通過 基板支持裝置17之開口部21並上升,在基板支持裝置17 上方,由下方吸著支持玻璃基板P。其次,玻璃基板P之 高度係如圖5(c)所示,其係高於定位部22a〜22c,並且在 變爲與前對準裝置23之抵接部23c相同高度之前使支持棒 下降,則解除對玻璃基板P之吸著。 15 (請先閱讀背面之注意事項再填寫本頁) i ----------訂---------線 丨· 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(#) 其次’藉由驅動部之作動使基部23a往基板支持裝置 17接近移動’壓著部23b壓著於基板支持裝置17之側面, 同時’抵接部23c抵接於玻璃基板p之側面,使玻璃基板 P移動至既定位置。此時,抵接部23c爲使玻璃基板P之 四邊同時對位,玻璃基板P係正確地對位於基板支持裝置 17之上方。其後,藉由支持棒邊吸著玻璃基板p邊下降, 使玻璃基板P在被定位部22a、22b定位之狀態下,被支持 在支持部20上。此處,將玻璃基板p調整爲實施曝光處理 之溫度。 接著’在搬送機器人4,以驅動裝置13,透過臂部1〇 而驅動搬送臂12A,並將基板支持裝置17與溫度調整後之 玻璃基板P予以一體保持。其次,搬送臂12A使玻璃基板 P與曝光裝置本體3之板固定器9對向而改變方向,將基 板支持裝置17搬送至板固定器9之上方爲止。此時,在驅 動裝置13 ’使構成支持部20之格子之各線狀部件與板固 定器9之溝部9a對向而調整搬送臂12A之位置。 其次,以驅動裝置13使搬送臂12A下降驅動既定量 ,結果,構成支持部20之格子之各線狀部件19嵌合於板 固定器9之溝部9a,支持部20係由板固定器9之上面下降 ,玻璃基板P則被載置於板固定器9上面。此時,如圖 4(a)、(b)所示,雖然支持部20沈入於溝部9a,由於定位部 22a、22b係由板定位器9之上面突出,因此對玻璃基板p 之定位被維持。其次,藉由控制器使真空泵開始吸引,透 過在板固定器9對應於多數之開口部21而形成之各吸氣孔 16 --------------- 裝·-------- -\叮 --------1 I (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(ίί) ,使玻璃基板P之下面吸著固定在板固定器9。 當結束對板固定器9之玻璃基板P的交接時’以驅動 裝置13驅動搬送臂12A,並由板固定器9上方移開。在圖 6係表示將此搬送臂12A由板固定器9移開結束後之狀態 。又,此圖6係表不由板固定器9上方開始將玻璃基板P 搬出前之狀態。 其次,說明在曝光處理後,自板固定器9將玻璃基板 P之搬出動作。又,玻璃基板P之搬出係藉由位於搬送臂 12A下方之搬送臂12B而進行。 當結束曝光處理時,以驅動裝置13驅動搬送臂12B, 在被載置於板固定器9上之基板支持裝置17下方,於板固 定器9之X方向兩側,將搬送臂12B之2支爪部11由一 Y 方向側插入。與此同時,藉由控制器解障真空泵之吸引, 藉由板固定器9之玻璃基板P之吸著亦被解除。 其次,以驅動裝置13依既定量往上方驅動搬送臂12B 時,透過搬送臂12B之爪部11而抵接於基板支持裝置17 之翼部18下面,進而當將搬送臂12B往上方驅動時,透過 翼部.18而將支持玻璃基板P之基板支持裝置17往板固定 器9上方抬高,並解除支持部20與溝部9a之嵌合。此處 ,由於定位部22a、22b維持在對玻璃基板P之定位狀態, 因此’當將基板支持裝置17往上方移動之後,可將玻璃基 板P平順地載置於支持部20上。 ' 在支持部20與溝部9a之嵌合解除結束位置爲止將基 板支持裝置17抬高之時點,以驅動裝置驅動搬送臂12B, ------------ 裴·--------訂---------. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用.中國國家標準(CNS〉A4規格(210 X 297公釐) 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(A) 而保持玻璃基板p之基板支持裝置17則自板固定器9上移 開。如此,結束對曝光裝置本體3之玻璃基板P的搬出動 作。又,藉由搬送機器人4對周邊曝光裝置6之板固定器 16,玻璃基板P之搬入、搬出動作係由搬送臂12A進行搬 出,而由搬送臂12B進行搬入動作以外,進行與上述曝光 裝置本體3之板固定器9之搬入、搬出相同之動作。 接著,以圖7及圖8說明將上述玻璃基板P搬送至曝 光裝置1內之順序。又,在這些圖中,簡略圖示曝光裝置 本體3、搬送機器人4、搬出入部5、周邊曝光裝置6及虛 擬璋7。又,由於在搬送機器人之搬送臂12A、12B,及在 搬出入部5之搬入捧14、搬出部15係上下方向配置,因 此,在圖7及圖8中,爲方便起見而將挪向一邊。又,有 關玻璃基板,由塗料展開機而被搬送至曝光裝置1之順序 係附上PI、P2,.·之符號。 [使用周邊曝光裝置6之場合] 在此場合,由於未使用虛擬璋7,因此,藉由搬送機 器人4進行玻璃基板P之交接係在搬入埠14、搬出埠15、 板固定器9、16等4個地點進行。以下,使用圖7,依搬 送順序說明之。又,在此搬送中,若無另外之說明,玻璃 基板P1〜P5係與基板支持裝置17 —體搬送。 首先,新規之玻璃基板P5係自塗料展開機搬入至搬入 埠14而載置於基板支持裝置17上(圖7(a))。其次,已經透 過曝光裝置本體3、周邊曝光裝置6進行曝光處理且被載 置於搬出埠15之玻璃基板P1,係由塗料展開機側之搬送 18 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂—-------線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明(β ) 臂(未圖不)搬出而留下基板支置17。其次’在搬送機 器人4,搬送臂12B係自曝光裝置本體3之板固定器9將 玻璃基板P3搬出之後(圖7(c)),搬送臂12A係將溫度調整 後之玻璃基板P4搬入至板固定器9上(圖7(d))。 接著,搬送臂12A旋轉90°且往與周邊曝光裝置6對 向之位置移動之後(圖7(e)),自周邊曝光裝置6之板固定器 16搬出玻璃基板P2(圖7(f))。其次,搬送臂12B係將之前 自曝光裝置本體3搬出之玻璃基板P3往周邊曝光裝置6搬 入後(圖7(g)),旋轉180° (圖7(h)),並搬出在搬出埠15上 之空的基本支持裝置17(圖7(1))。 搬送臂12A,係將之前自周邊曝光裝置6搬出之玻璃 基板P2往搬出埠15上搬入後(圖7G)),於搬入埠14將溫 度調整後之玻璃基板P5搬出(圖7(k))。其次,當搬送臂 12B將空的基板支持裝置17往搬入埠14搬入時(圖7(〇), 搬送臂12A、12B旋轉90° ,並藉由往與曝光裝置本體3 對向之位置移動(圖7(m)),而回到圖7(a)所示之初期狀態 。以下,透過重複進行上述動作,使玻璃基板P依序曝光 〇 [未使用周邊曝光裝置6之場合] 在曝光裝置1,於未搭載周邊曝光裝置6之場合或即 使搭載亦未使用之場合,由於使用虛擬埠7,因此,藉由 搬送機器人4進行玻璃基板P之交接,係在搬入埠14、搬 出埠15、板固定器9、虛擬埠7等4個地點進行。以下’ 使用圖8依搬送順序說明之。 19 I-----------裝------Γ——訂---------線 Γ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 經濟部智慧財產局員工消費合作社印製 471026 A7471026 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (/) [Technical Field] The present invention relates to a substrate supporting device for supporting a substrate, and a predetermined substrate supported by the substrate supporting device. A substrate processing apparatus for processing, particularly a substrate supporting apparatus for supporting a thin substrate used in the manufacture of a liquid crystal display, etc., and a substrate processing apparatus for performing exposure processing on the substrate. [Knowledge technology] It is known that, for example, in the process of manufacturing a liquid crystal display, various devices such as an exposure device or an inspection device are used to process large substrates. In the exposure process and inspection process using these processing devices, a substrate exchange device that automatically performs the work of mounting and disassembling a large substrate (glass substrate) on the processing device is used. Fig. 14 shows an example of a schematic configuration of a substrate exchange apparatus used in an exposure apparatus for a liquid crystal. In the substrate exchange device shown in this figure, a glass substrate P is placed on a substrate holder 43 as described below. (2) The glass substrate P is held by the robot arm 42 from below and transferred to the substrate holder 43. ⑵In this state, most of the supporting rods 44 provided on the substrate holder 43 and used for substrate transfer are projected and raised from the upper surface of the holder through the opening provided on the substrate holder 43 and the glass substrate is lowered from below. Lift up (or place the glass substrate P on the support rod 44 protruding and stopped from the holder 43 and lower the robot arm 42). In this case, the support rod 44 is arranged so as to prevent the glass substrate P from being greatly bent, and to support the vicinity of the central portion and the peripheral portion of the glass substrate P. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)--------------II l · I 1 I order --- ------ i (Please read the precautions on the back before filling this page) 471026 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ____B7______ V. Description of the Invention (Top) ⑶ Secondly, the support rod 44 will be raised to a fixed amount. When the upper surface of the 42 is lifted up by the support rod 44 only by the predetermined amount, the robot arm 42 avoids contact with the glass substrate P, the support rod 44 and the substrate holder 43 and moves away from below the glass substrate P. ⑷ Thereafter, in a state in which the glass substrate P is supported from below, the support rod 44 is lowered, and it is extended to a lower side than the upper surface of the substrate holder 43, and only the glass substrate P is brought into contact with the upper surface of the substrate holder 43 and loaded. Home. Next, the glass substrate P is suction-fixed by the substrate holder 43 through a plurality of suction holes (not shown) provided on the substrate holder 43. At this time, it is necessary to improve the flatness (flatness) of the glass substrate P so that the glass substrate P is held in balance and attracted to the substrate holder 43. Thereafter, the glass substrate P is subjected to exposure processing by an exposure device while moving simultaneously with the substrate holder 43. When the glass substrate P is detached from the substrate fixing 43, it is performed in the reverse order as described in ⑴ to ⑴. However, as a substrate for manufacturing a flat display, for example, a thin glass substrate having a thickness of about 0.7 mm is used because it is 500 mm × 600 mm, and the glass substrate is easily broken, and even if it has a large bending, it may cause damage. Therefore, in the above-mentioned conventional substrate exchange device, in order to prevent the thin glass substrate from being damaged by the conference and handed over to the substrate holder by the robot arm, it is necessary to place it in the center of the glass substrate and its peripheral parts. The part that is not in contact with the arm is provided with a plurality of support rods, and the substrate is exchanged in a state where the glass substrate is balanced and supported. Here, in order to make the substrate more stable and sincere, the number of support rods has to be increased, but when the number of support rods is increased, the support rods are moved up and down. 4 The Zhang's scale is applicable to Chinese national standards (CNS ) A4 & 297mm 1 '----- ------- * I 1--Γ III -------- i (Please read the precautions on the back before filling this page) 471026 A7 B7 V. Description of the invention (3) The i mechanism is not only complicated and large-scale, but also the position control of the substrate holder is also improved. Therefore, 'the amount of support must be limited, and as a result,' there will be some degree of bending for the substrate, the reason for this bending, and the entire substrate cannot be contacted with the substrate holder at the same time or peeled off by the substrate holder, so ' Part of the problem of wear on the substrate holder. «J i. Furthermore, in the conventional substrate exchange device described above, the robot arm avoids interfering with the support rod and forms a comb-shaped single-end fixed beam structure in the moving direction, and in order to prevent the substrate from being damaged, it must be supported in It is supported near the central part of the base plate 1. In other words, in order to ensure the space between the substrate and the substrate holder, only the robot's arm can reach, the support rod must raise the substrate upward. However, for example, in the case of an exposure device for a liquid crystal, the gap between the projection optical system and the substrate holder shown in FIG. 14 (the so-called X distance) is due to the large NA (Numerical Aperture) that follows the projection optical system. Since the number of holes is smaller than the number of holes, it is impossible to ensure that the above-mentioned robot arm can only extend into the space. Therefore, with the exposure device for liquid crystal ^, there is a case where the substrate transfer must be performed when the substrate holder is moved away from the projection optical system, because the moving distance of the substrate holder becomes longer, which not only increases the substrate transfer time. At the same time, it also causes a problem that the equipment area of the device becomes larger. Here, the applicant of this case has proposed a substrate support device (Japanese Patent Application No. 10-042835) in order to solve the above-mentioned problem. The substrate holding device is composed of a dish having a supporting portion integrally provided with the inner side of the outer peripheral portion to support the substrate. The supporting portion: is supported by the substrate while supporting the substrate and preventing the substrate from being bent. The t temple device integrates the substrate transfer and exchange. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297). (Please read the precautions on the back before filling this page.) ------- Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 A7 B7 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (4) 〇 [Questions to be Solved by the Invention] However, the above The conventional substrate supporting apparatus and substrate processing apparatus have the following problems. The shape of the element pattern exposed on the above-mentioned glass substrate is placed on the substrate fixing frame in a state where the direction of the glass substrate is changed according to its size, which is beneficial to the layout of the pattern. In addition, when replacing the manufacturing lot *, the glass substrate following the normal orientation is placed on the substrate perimeter after the glass substrate with the changed orientation is placed. In addition, the size of the glass substrate used in an exposure device is not limited to one type, and there are many sizes corresponding to the components. The substrate supporting device is usually transported together with the glass substrate. Because it is mostly used for an exposure device, it is handled as a consumable and periodically exchanged. If it is produced in accordance with the specific direction or size described above, it will be 4 directions for the glass substrate. For each size, it is necessary to design and fabricate a substrate supporting device, which causes cost increase due to j. Furthermore, when the direction and size of the glass substrate are switched, the substrate supporting device must be replaced accordingly, which causes problems such as an increase in operation time and workload. Therefore, when the price of the substrate support device rises to the same value as 1 vj η, the problem of an increase in the operating cost of the exposure device also arises. r 〆 Also, because the above-mentioned substrate support device is used, although glass substrates can be easily transported in places with narrow working distances, when the robot arm is used to support both ends of the substrate support device, the Bending caused by the weight of the body and the weight of the glass substrate. In other words, since the substantial thickness of the substrate I: holding device is increased, the working distance cannot be obtained sufficiently. On the other hand, in addition to the exposure device, for example, Λ ------------- ----- „----- Order * ------- -Line (please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 471026 A7 B7 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Note (γ) The position accuracy of the glass substrate is not very good. Therefore, when placing the glass substrate on the substrate support device, there must be a front-to-shore mechanism. However, it is not possible to obtain a proper front alignment using the substrate support device. The standard structure is still to be developed. In addition, the glass piano board placed on the substrate supporting device must also have a fixed mechanism. However, since the substrate supporting device is independent from the workbench or robot, It is very difficult to install the mechanism j that supplies power, air pressure, etc. from the outside. Furthermore, when using a substrate support device to transport glass substrates, the movement of both the glass substrate and the substrate device must be considered, so there will be a sequential pattern. Increasing tendency. The transfer and transfer device has a pair of transfer arms, so-called two arms: occasionally, the arms that are carried in at a certain transfer position, and the arms that are carried in and out of N, are exchanged in each cycle so that Waiting for both sides of the guidance operation not only adds a great burden to the configuration of the sequence, but also makes the creation of the Xia I Wu processing program at the time of the malfunction of the robot become longer. The present invention has been made in view of this. The purpose of 1 is to provide a substrate supporting device and a substrate processing device that can support substrates not only by placing the substrate, but also from all directions, and that can prevent the substrate from bending and warping during transfer including transfer. In addition, the second object of the present invention is to provide Even if the size of the substrate is changed, a substrate supporting device and a substrate processing device that can support the substrate while suppressing the bending of the substrate can be provided. In addition, the third object of the present invention is to provide a substrate before the substrate is supported on the substrate supporting device. A substrate processing apparatus that performs proper pre-alignment. In addition, a fourth object of the present invention is to provide a substrate that is placed behind the substrate supporting device without using a complicated mechanism, and can be easily determined. Fixed substrate support device and base board -------- ^ ---- Install ----- Γ ----- Order --------- line (please read the back first Please pay attention to this page, please fill in this page) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 471026 A7 ------- B7 V. Invention Explanation () A processing device. Also, a fifth object of the present invention is to provide a substrate processing device that can simplify the procedure when the substrate is transferred by using both arms. [Means for Solving the Problems] To achieve the above-mentioned object, the present invention The invention adopts the following configuration corresponding to the embodiment shown in Fig. 1 to Fig. 12. The substrate supporting device of the present invention is a substrate supporting device (17) for supporting a substrate (P, PS), and is characterized by having a supporting section (20) With a large number of openings (21) and supporting substrates (P, PS); and positioning portions (22a ~ 22c, 24a ~ 24c), which are provided in the supporting portion (20), and the substrates (P, PS) are respectively positioned In the first direction and a second direction different from the first direction. Therefore, in the substrate supporting device of the present invention, since a large number of openings (21) are provided in the supporting portion (20), it is possible to suppress bending and the like when the substrate supporting device (17) and the substrate (P, PS) are transported as a single body. Damage due to this. In this substrate supporting device, the substrates (P, PS) can be positioned and supported in different directions from the first direction and the second direction by positioning portions (22a to 22c, 24a to 24c), respectively. The substrate support device of the present invention is a substrate support device (17) for supporting substrates (P, PS), and is characterized by having a support portion (20), a plurality of opening portions (21), and supporting the substrate (P , PS); the positioning part (22a ~ 22c, 24a ~ 24c) is protruded on the support part (20) and positions the substrate (P, PS); and the fixing part (25) is set as most of the support part (20 ), Fix the positioning portions (22a to 22c, 24a to 24c) in a removable manner. Therefore, in the substrate supporting device of the present invention, since a large number of openings (21) are provided in the supporting portion (20), it is possible to apply the Chinese National Standard (CNS) A4 specification not only to the substrate (P, PS) at 8 scales (210 X 297 male; ^ " ~ ^ ~~ 一. ------------- Install ----- Γ 1 --- Order --------- line I (Please read the precautions on the back before filling this page) 471026 Α7-: ---- B7 V. Description of the invention (7) Point support can also be supported by wire or surface. Therefore, the substrate support device (17 ) And the substrate (P, PS) ~ body, can suppress the bending of the substrate and the damage caused by it. In addition, when this substrate support device, when the substrate (P, PS) is changed, it can be positioned by The parts (22a ~ 22c, 24a ~ 24c) can be mounted on the fixing part (25) corresponding to the size of the substrate (p, ps) once the fixing part (25) is removed, and the substrates (p, PS) of most sizes can be positioned Secondly, the substrate processing apparatus of the present invention has a substrate holder (9, 16) for holding the substrate (P, PS); and a substrate (P, 4) held in the substrate holder (9, 16). PS) Processing part (PL) that performs predetermined processing, substrate The processing device (3, 6) is characterized in that the substrate holder (9, 16) forms a supporting part (20) of the substrate supporting device (17) according to any one of claims 1 to 7 in the scope of patent application. ) The groove portion (9a, 16a) to be fitted. Therefore, in the substrate processing apparatus of the present invention, the support portion (20) is sunk by fitting the support portion (20) to the groove portion (9a, 16b). Therefore, the substrates (P, PS) supported by the substrate support (17) can be held in the substrate holder (9, 16). Furthermore, the substrates (P, PS) on the substrate holder (9, 16) can be held. PS) can perform a predetermined process. At this time, the positioning portion (22a ~ 22c, 24a ~ 24c) protrudes from the substrate holder (9, 16), and the substrate (22a ~ 22c, 24a ~ 24c) of the positioning portion (22a ~ 22c, 24a ~ 24c) protrudes. The positioning of P, PS) does not need to be released, but the positioning state of the substrate (P, PS) can be maintained. Moreover, when a pair of transfer arms (12A, 12B) are used, since the transfer section (9, 14 '15 , 16) The even-numbered spaces are provided, so that the loading and unloading of the substrates (P, PS) of the transfer section (9, 14, 15, 16) can be fixed to each of the transfer arms (12A, 12B). Can guide each action The operation and error handling program is only applicable to the transfer arm corresponding to each action (12A, 9 paper sizes are applicable to China National Standard (CNS) A4 specifications (210 X 297) ") · (Please read the precautions on the back before filling this page ) Pack -----: ---- Order ----- Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (? ) 12B) Implement and prepare. [Embodiment of the invention] Hereinafter, the first embodiment of the substrate supporting apparatus and the substrate processing apparatus of the present invention will be described with reference to Figs. 1 to 8. Here, an example of an exposure device that is used as a substrate processing device to pattern-expose a liquid crystal display element on a substrate to which a photosensitizer is applied, and a peripheral exposure device that exposes a pattern-exposed substrate to the periphery of a pattern area will be described. . An example of an angular glass substrate (for example, 700 mm x 900 mm, t =: 0.8 mm) manufactured by a liquid crystal display panel using a substrate will be described. In these figures, the same components as those in FIG. 14 as a conventional example are given the same reference numerals, and descriptions thereof are omitted. FIG. 2 is a cross-sectional plan view of the exposure apparatus 1. The exposure device 1 is highly purified and contained in a container 2 adjusted at a predetermined temperature. The exposure device 1 has an exposure device body (substrate processing device) 3, a transfer robot (conveying section) 4, a loading / unloading section 5, and a peripheral exposure device (substrate processing device). ) 6 and the proposed port (transfer department) 7. FIG. 3 is an external perspective view of the exposure device body 3. The exposure device main body 3 includes a lighting system (not shown) that illuminates the network line R as a mask with exposure illumination light IL, and a network line table (not shown) that holds the network line R on which a pattern for a liquid crystal display element is formed. , A projection optical system PL disposed below the network cable table, and a plate holder (transfer portion) 9 as a substrate holder that moves the base 8 in the XY2 dimension direction below the projection optical system PL. The illumination system and the projection optical system PL are processing units configured to perform exposure processing on the glass substrate P. 10 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 Public Love 1 --------- I--II ----- r I --- Order ------ --- Line I (Please read the notes on the back before filling in this!) 471026 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ___B7__ V. Description of the invention (f) The projection optical system PL 'will be used at equal times Optical system for erect image projection. Here, the exposure device body 3 'performs step and scan exposure in a state where a rectangular glass substrate p is placed on the plate holder 9, and is formed on the network cable R. Most of the patterns are sequentially transferred on the glass substrate P, for example, 4 exposure areas (pattern areas). That is, in this exposure area body 3, the slits on the network line R are illuminated by the illumination light IL from the illumination system for exposure. In the state of the lighting field, a controller (not shown) is used to synchronize the plate holder 9 that holds the network cable stage and the glass substrate P through the drive system (not shown), and to the predetermined scanning direction at the same speed and direction (this Set the Y direction), so that the pattern of the network line R is sequentially transferred to one exposure on the glass substrate P Area, that is, scanning exposure. After the scanning exposure of this one exposure area is completed, the controller moves the plate holder 9 to the scanning start position of the next exposure area to the predetermined X direction by the controller. Secondly, in the exposure device body 3, by repeating such scanning exposure and segmentation operations, the pattern of the network line R is sequentially transferred to the four exposure areas. The transfer robot 4 has a horizontal joint type structure and exposure The main body 3 ′ of the loading and unloading unit 5, the peripheral exposure device 6 and the virtual port 7 are arranged opposite to each other, and has an arm portion 10 formed by being connected to a majority by a vertical joint axis; The transport arm 12A of the claw portion 11 and the driving device 13 of the drive arm portion 10. Also, this transport robot 4 is not shown in FIG. 3 for convenience, and it also has a lower portion and a transport arm provided below the transport arm 12A. 12A has a dual-arm structure with the same mechanism and independent drive of the transport arm IIB. II This paper size applies the Chinese National Standard (CNS) A4 specification (21〇X 297 public love) ~ " ------ II-- --- ---- ^-Order ---------- I (Please (Please read the precautions on the back before filling this page) 471026 A7 —__ B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (〆) The loading and unloading unit 5 is a paint spreader (adjacent to the exposure device 1) ( (Not shown) a photosensitizer is applied to the glass substrate P, and the glass substrate P is carried in and transferred, and the temperature is adjusted at a loading port (transfer portion) 14 of the loaded glass substrate P; and it is disposed above the loading port 14, The carrying-out port (transfer part) 15 for exchanging the exposed substrate body 3 with the glass substrate P after being subjected to the exposure processing is schematically formed (in addition, the carrying-in port 14 is not shown in FIG. 2). The loading / unloading unit 5 is rotatable around the Z axis. The peripheral exposure device 6 is provided with a plate holder (transfer portion) 16 as a substrate holder that holds the glass substrate P after the exposure device body 3 is subjected to exposure processing; and performs exposure around the pattern area of the glass substrate P Processing unit (not shown). Here, the glass substrate P after the exposure process is exposed by a photosensitizer applied around the pattern area. Also, in the exposure processing of the exposure device main body 3, the peripheral exposure (exposure to the non-patterned portion) by the peripheral exposure device 6 may be performed first. The virtual frame 7 can be used when the exposure device 1 is not equipped with the peripheral exposure device 6, or even when the peripheral exposure device 6 is not used, and it is a substrate support device (disc) that will be transported as described later. 17 The composition of temporary retention. In FIG. 3, it is shown that the substrate supporting device 17 supporting the glass substrate P has two total eight wings 18 protruding from each of the four sides, and the opposing sides of the wings 18 are the claws 11 of the robot 4 from below. The substrate holding device 17 is held by the transfer arm 12A. As shown in FIG. 1, the substrate supporting device 17 has a plurality of linear members 19 which are opened in a vertical and horizontal (and partially inclined) lattice shape at a predetermined interval as a whole and 12 ------------ ^ --- --Γ --- order ---------- line, (Please read the notes on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) ) 471026 A7 B7 V. Description of the invention (II) Form a slightly rectangular support 20. Further, a plurality of openings 21 each having a rectangular shape with a small glass substrate P are formed in each of the cells formed by the plurality of linear members 19. These most linear parts .19 are here welded to each other or combined into a grid. Next, the above-mentioned wing portion 18 is formed by two protrusions on the four sides of the support portion 20 and constitutes a part of the support portion 20. On the lower surface side of each wing portion 18, recesses 18a and 18b having a tapered cone shape are opened at a predetermined interval. The substrate supporting device is held on the carrying arms 12A and 12B by the hemispherical protrusions (not shown) fitted in the claws 11 of the transfer arms 12A and 12B in the recessed portions 18a positioned on the outside. Hemispherical protrusions (not shown, plate holder 9) provided in the recessed portions 18b positioned on the inside are fitted to the plate holders 9, 16, the carry-in port 14, the carry-out port 15, and the virtual port 7, respectively. The protrusions of 16 and 16 are reference numerals 9b and 16b (refer to FIG. 4), and the substrate supporting device 17 is held. On the other hand, on the upper surface side of the support portion 20, a plurality of cylindrical positioning portions 22a, 22b, 22c 'are projected to hold and position the sides of the glass substrate P supported by the support portion 20. When the glass substrate P is placed on the support portion 20 in the vertical (first direction) posture pV, the positioning portion 22a is disposed at a position where the two short sides of the glass substrate P are held by the sides. The positioning portion 22c is placed on the two short sides that hold the glass substrate P sideways when the glass substrate P is placed on the support portion 20 in a lateral (second direction) posture PH that intersects with each other approximately perpendicularly to the posture pv. Its location. The positioning portion 22b is arranged at a position where the glass substrate P is placed on the long side of the glass substrate p in either direction when the glass substrate P is placed in a vertical posture PV or a horizontal posture ph. It can also be continued at the intersection of the linear member 19 on the support 20 (or the 13 paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)) (Please read the precautions on the back before (Fill in this page) ----- Γ ---- Order --------- line 丨-Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention) A) A part formed of a plastic such as an acetal resin, and the glass substrate P is supported by the majority of the acetal resin. In this case, the height of the acetal resin can be set lower than the positioning portions 22a, 22b, and 22c. Next, as shown in Figs. 2 and 3, a groove portion 9a to which the support portion 20 is fitted is formed on the plate holder 9 of the exposure apparatus body 3 corresponding to the arrangement of the linear member 19. As shown in FIGS. 4 (a) and (b), the depth of the groove portion 9a is set so that when the support portion 20 is fitted and sunk, the positioning portions 22a to 22c protrude from the upper surface of the plate holder 9 so that they are not carried by the load. The glass substrate P placed on the supporting portion 20 has a size protruding from the upper surface. In addition, the upper surface of the plate holder 9 is made to have a better flatness to remove the bending of the glass substrate P. Furthermore, a large number of openings 21 are provided on the upper surface of the plate holder 9 so as to fit a large number of suction holes (not shown) to fit the glass substrate P in close contact with the surface. Further, in the exposure apparatus 1, when the glass substrate P is placed on the support portion 20 of the substrate supporting device Π, the positioning portions 22a to 22c are provided with an alignment device before the glass substrate P is aligned in advance. As shown in FIG. 5U), the front alignment device (alignment device) 23 is connected to a driving portion (not shown), and moves away from the base support device 17 horizontally and freely from the base portion 23a; thus the base portion 23a is below It protrudes and is formed on the supporting device 17 by a crimping portion 23b crimped laterally; and a contact portion 23c provided above the leading end of the base portion 23a and abutting the side surface of the glass substrate P, and is arranged on the substrate supporting device 20 of each of the four sides. The contact portion 23c is formed of a soft elastic material such as rubber to avoid damaging the glass substrate P. When the pressing portion 23b is pressed against the side of the substrate supporting device 17, as shown in FIG. 5 (b), The precision setting of the glass substrate 14 ^ paper λ degree applies to China National Standard (CNS) A4 specification (210 X 297 mm) '" ------------- t ----- r J --- Order -------- Slow I < Please read the notes on the back before filling this page) 471026 A7 __ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention (G) The size and position of the alignment of the P positioning parts 22a ~ 22c. Further, even in the substrate supporting device 17, the positional relationship between the side surface and the positioning portions 22a to 22c is set to a predetermined accuracy. As shown in FIG. 5 (c), the contact portion 23c is set to a height higher than the positioning portions 22a to 22c and abutting on the glass substrate P. Hereinafter, the substrate supporting device configured as described above and its function will be described. First, the procedure of placing the glass substrate P on the substrate supporting device 17 and carrying the robot 4 into and out of the exposure device body 3 will be described. In addition, the transfer of the glass substrate P with respect to the substrate support device 17 includes components such as the support rods and the upward and downward movement mechanisms of the conventional example. Once the glass substrate P is supported above the substrate support device 17 and lowered, And, it is performed by transferring the glass substrate P to the transfer device of the substrate support device 17. Here, the glass substrate P is placed on the support portion 20 in a vertical posture PV. When the glass substrate P coated with the photosensitizer is transferred to the loading port 14 by the paint spreader, the loading and unloading section 5 rotates, and the substrate supporting device 17 on the loading port 14 is positioned corresponding to the vertical posture PV. When the glass substrate P is placed in a horizontal posture PH, the rotation angle of the carry-in / out portion 5 can be shifted by 90 °. When the substrate support device 17 is positioned, the support rod of the transfer device passes through the opening 21 of the substrate support device 17 and rises, and the glass substrate P is sucked and supported above the substrate support device 17 from below. Next, as shown in FIG. 5 (c), the height of the glass substrate P is higher than the positioning portions 22a to 22c, and the support rod is lowered before it becomes the same height as the contact portion 23c of the front alignment device 23. Then, the suction of the glass substrate P is released. 15 (Please read the precautions on the back before filling out this page) i ---------- Order --------- Line 丨 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 471026 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (#) Secondly, the base 23a is moved closer to the substrate supporting device 17 by the action of the drive unit, and the crimping unit 23b While pressing on the side surface of the substrate supporting device 17, the abutting portion 23c abuts on the side surface of the glass substrate p to move the glass substrate P to a predetermined position. At this time, the abutting portion 23c aligns the four sides of the glass substrate P at the same time, and the glass substrate P is correctly positioned above the substrate supporting device 17. Thereafter, the glass substrate p is lowered while sucking the glass substrate p by the support rod, and the glass substrate P is supported on the support portion 20 in a state where the glass substrate P is positioned by the positioning portions 22a and 22b. Here, the glass substrate p is adjusted to a temperature at which the exposure process is performed. Next, in the conveying robot 4, the conveying arm 12A is driven by the drive device 13 through the arm portion 10, and the substrate supporting device 17 and the temperature-adjusted glass substrate P are held integrally. Next, the transfer arm 12A changes the direction of the glass substrate P and the plate holder 9 of the exposure apparatus main body 3, and transfers the substrate supporting device 17 above the plate holder 9. At this time, in the driving device 13 ', each linear member constituting the grid of the support portion 20 is opposed to the groove portion 9a of the plate holder 9 to adjust the position of the transport arm 12A. Next, the driving arm 13A lowers and drives the conveying arm 12A by a predetermined amount. As a result, each linear member 19 constituting the grid of the support portion 20 is fitted to the groove portion 9 a of the plate holder 9, and the support portion 20 is formed on the plate holder 9. The glass substrate P is lowered and placed on the plate holder 9. At this time, as shown in FIGS. 4 (a) and (b), although the support portion 20 is sunk in the groove portion 9a, since the positioning portions 22a and 22b protrude from the upper surface of the plate positioner 9, the positioning of the glass substrate p is performed. maintain. Next, the vacuum pump is started to be sucked by the controller, and the suction holes 16 formed in the plate holder 9 corresponding to the plurality of openings 21 are installed. --------\ 叮 -------- 1 I (Please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 male) 〉 471026 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (ίί), so that the glass substrate P is fixed to the plate holder 9 by suction. When the glass substrate P of the plate holder 9 is finished, At the time of transfer, the conveying arm 12A is driven by the driving device 13 and removed from above the plate holder 9. The state after removing the conveying arm 12A from the plate holder 9 is shown in FIG. 6. The table shows the state before the glass substrate P is carried out from above the plate holder 9. Next, the operation of carrying out the glass substrate P from the plate holder 9 after the exposure process is described. The glass substrate P is carried out by being located It is carried out by the conveying arm 12B below the arm 12A. When the exposure process is ended, the conveying arm 12B is driven by the drive device 13, The two claw portions 11 of the conveying arm 12B are inserted below the substrate supporting device 17 on the plate holder 9 from both sides of the plate holder 9 in the X direction. At the same time, by The controller removes the suction of the vacuum pump, and the suction of the glass substrate P by the plate holder 9 is also released. Next, when the driving device 13 drives the conveying arm 12B upward by the predetermined amount, it passes through the claw 11 of the conveying arm 12B. And it abuts under the wing portion 18 of the substrate support device 17, and when the conveying arm 12B is driven upward, the substrate support device 17 that supports the glass substrate P is raised above the plate holder 9 through the wing portion 18. And the fitting of the support portion 20 and the groove portion 9a is released. Here, since the positioning portions 22a and 22b are maintained in the positioning state with respect to the glass substrate P, 'the glass substrate P can be smoothed after the substrate support device 17 is moved upward The ground is placed on the support portion 20. 'When the substrate support device 17 is raised until the mating release end position of the support portion 20 and the groove portion 9a is reached, the conveying arm 12B is driven by the driving device, -------- ---- Pei · -------- Order ---------. (Please read the back first Note: Please fill in this page again.) This paper size is applicable. Chinese National Standard (CNS> A4 size (210 X 297 mm) 471026 A7 B7 Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs. The substrate supporting device 17 of the glass substrate p is removed from the plate holder 9. In this way, the carrying out of the glass substrate P of the exposure device body 3 is ended. Moreover, the plate holder of the peripheral exposure device 6 is conveyed by the transfer robot 4 16. The loading and unloading operations of the glass substrate P are carried out by the transfer arm 12A, and the loading and unloading operations are performed by the transfer arm 12B, and the same operations as those of the plate holder 9 of the exposure apparatus body 3 described above are carried out. Next, the procedure for transferring the glass substrate P into the exposure apparatus 1 will be described with reference to Figs. 7 and 8. In these figures, the exposure device main body 3, the transport robot 4, the carry-in / out section 5, the peripheral exposure device 6, and the virtual frame 7 are shown in brief. In addition, since the conveying arms 12A and 12B of the conveying robot and the conveying arms 14 and 15 of the conveying and receiving part 5 are arranged in the up-down direction, in FIGS. 7 and 8, they are moved to the side for convenience. . The order in which the glass substrate is transported to the exposure apparatus 1 by a paint spreader is indicated by the symbols PI, P2, .... [When using the peripheral exposure device 6] In this case, since the virtual cymbal 7 is not used, the transfer of the glass substrate P by the transfer robot 4 is carried in the port 14, the port 15, the plate holders 9, 16 and the like. 4 locations. Hereinafter, description will be given in the order of transfer using FIG. 7. In addition, in this conveyance, unless otherwise stated, glass substrates P1 to P5 are conveyed integrally with the substrate supporting device 17. First, the newly-specified glass substrate P5 is carried in from a paint spreader to a carry-in port 14 and placed on a substrate supporting device 17 (Fig. 7 (a)). Secondly, the glass substrate P1 that has been exposed through the exposure device body 3 and the peripheral exposure device 6 and is placed on the carry-out port 15 is transported by the paint spreader 18 (please read the precautions on the back before filling this page) ) Packing -------- Order ----------- The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 471026 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs System V. Description of the Invention (β) The arm (not shown) is carried out and the substrate support 17 is left. Next, 'in the transfer robot 4, the transfer arm 12B is the plate holder 9 of the exposure apparatus body 3 and the glass substrate P3 is carried out (FIG. 7 (c)), and the transfer arm 12A is the temperature-adjusted glass substrate P4 into the plate On the holder 9 (Fig. 7 (d)). Next, after the transfer arm 12A rotates 90 ° and moves to a position opposite to the peripheral exposure device 6 (FIG. 7 (e)), the glass substrate P2 is carried out from the plate holder 16 of the peripheral exposure device 6 (FIG. 7 (f)). . Next, the transfer arm 12B is the glass substrate P3 previously carried out from the exposure device body 3 into the peripheral exposure device 6 (Fig. 7 (g)), rotated 180 ° (Fig. 7 (h)), and carried out at the take-out port 15 The upper empty basic support device 17 (FIG. 7 (1)). The transfer arm 12A is the glass substrate P2 previously carried out from the peripheral exposure device 6 into the carry-out port 15 (Figure 7G)), and the temperature-adjusted glass substrate P5 is carried out in the carry-in port 14 (Figure 7 (k)) . Next, when the transfer arm 12B carries the empty substrate support device 17 into the transfer port 14 (FIG. 7 (0), the transfer arms 12A and 12B rotate 90 ° and move to a position opposite to the exposure device body 3 ( Fig. 7 (m)), and return to the initial state shown in Fig. 7 (a). Hereinafter, the glass substrate P is sequentially exposed by repeating the above operation. [When the peripheral exposure device 6 is not used] In the exposure device 1. When the peripheral exposure device 6 is not installed or when the peripheral exposure device 6 is not used, since the virtual port 7 is used, the transfer of the glass substrate P by the transfer robot 4 is carried in the port 14, the port 15, Board holder 9, virtual port 7 and other four locations. The following will be described in accordance with the transfer order using Figure 8. 19 I ----------- install ------ Γ—— order- -------- Line Γ (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 471026 A7

五、發明說明(J) 首先’新規之玻璃基板P5係自塗料展開機往搬入增 14搬入而載置於基板支持裝置17上(圖8(a))。其次,將已 經在曝光裝置本體3進行曝光處理且被載置於搬出j:阜15之 玻璃基板P1,係藉由在塗料展開機側之搬送臂搬出而留下 基板支持裝置17(圖8(b))。其次,在搬送機器人4,在搬送 臂12B自曝光裝置本體3之板固定器9將玻璃基板P3搬出 後(圖8(c)) ’搬送臂12A係將溫度調整後之玻璃基板P3往 板固定器9上搬入(圖8(d))。 接著,在搬送臂12A旋轉90°且往與虛擬埠7對向之 位置移動之(圖8(e)),自虛擬璋7將玻璃基板P2搬出(圖 8(f))。其次,搬送臂12B,係將之前自曝光裝置本體3搬 出之玻璃基板P3往虛擬埠7搬入後(圖8(g)),將搬出埠15 上之空的基板支持裝置17搬出(圖8(h))。. 搬送臂12A,係在將之前自虛擬埠7搬出之玻璃基板 P2往搬出埠15上搬入之後(圖8(i)),於搬入埠14將溫度調 整後之玻璃基板P5搬出(圖8G))。其次,當搬送臂12B將 空的基板支持裝置17往搬入璋14搬入時(圖8(k)),藉由搬 送臂12A旋轉90°且往與曝光裝置本體3對向之位置移動( 圖8(彳))而回到圖8(a)所示之初期狀態。以下,藉由重複上 述動作,而使玻璃基板P依序曝光。 如以上所述,在本實施形態之基板支持裝置,當以支 持部20支持玻璃基板P時,玻璃基板P並非以點而是以線 承受,又,由於各開口部21之大小係小於玻璃基板p,因 此可將玻璃基板P幾乎全面支持,即使玻璃基板P大型化 20 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) " · --------------一装---------訂---------線 < ί請先閱讀背面之注意事項再填寫本頁) 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明((?) ,在包含交換搬送時,可防止玻璃基板P彎曲,及由此所 造成之破損。又,在此基板支持裝置17,藉由選擇性地使 用定位部22a〜22c,可將玻璃基板P以幾乎垂直交叉之縱 向姿勢PV與橫向姿勢PH而載置。 因此,在本實施形態之基板處理裝置,藉由在板固定 器9、16設置支持部20所嵌合之溝部9a、16a,可對與上 述基板支持裝置Π —體搬送之玻璃基板P進行曝光處理, 在將矩形的玻璃基板P進行曝光時,對應於被曝光之元件 圖案,可選擇最適當之方向而使玻璃基板P容易地被載置 於板固定器9、16,對應各方向而準備基板支持裝置,由 於不必交換基板支持裝置,因此,可實現降低成本及削減 作業時間、作業量。 又’藉由使用可防止玻璃基板P彎曲之基板支持裝置 17,即使在工作距離具有變得非常小的傾向之周邊曝光裝 置6,亦可快速且安全地搬送玻璃基板p。因此,即使在周 邊曝光裝置6,亦可不必爲了玻璃基板P之交換而移動板 固定器16,可使移動距離縮小,而可獲得因縮短玻璃基板 P之交換時間而提升產能及縮小裝置之設置面積。 又’在本實施形態,藉由在基板支持裝置Π之支持部 20突設非可動式之定位部22a〜22c,可將玻璃基板p對基 板支持裝置17而定位,因此,不必由外部供給電力、空壓 等’而可以簡更且廉價之機構而實施玻璃基板P之定位。 進而’即使在將基板支持裝置17之支持部20嵌合在板固 定器9、16之溝部9a、16a時,由於這些定位部22a〜22c 21 n «^1 n 1^1 I— n n B^i f— I t* an 訂i flfl en ^^1 n ^^1 I (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 B7 五、發明說明(/) 係由板固定器9、16上面突出,因此可維持對玻璃基板P 之定位狀態,即使在將玻璃基板P與基板支持裝置17 —起 由板固定器9、16搬出之際,亦不必重新定位,可迅速進 行搬出作業。進而,雖然定位部22a〜22c由板固定器9、 16上面突出,但由於設定使其低於玻璃基板P,因此,即 使在工作距離較小之裝置,亦不會對玻璃基板P之搬送或 曝光處理造成任何障礙。 又,在本實施形態之基板處理裝置,在將玻璃基板P 保持於上述之定位部22a〜22c之際,自塗料展開機搬入之 玻璃基板P之位置精確度即使不甚良好,亦可透過前對準 裝置23確實且容易地進行玻璃基板P之對位,並可平順地 進行將玻璃基板P載置於基板支持裝置17之動作。特別是 由於此前對準裝置23係將壓著部23b壓著於基板支持裝置 17之支持部20,並將抵接部23c抵接於玻璃基板P,因此 ,可確實且廉價地實施以支持部20作基準之玻璃基板P之 對位。又,前對準裝置23對支持部20雖爲接觸式,但其 並不僅限於此,例如,亦可將其與支持部20之距離以近接 感應器等予以檢出,並依該檢出結果而使抵接部23c抵接 於玻璃基板P之非接觸式。 進而,在本實施形態之基板處理裝置,由於藉由搬送 機器人4之玻璃基板P之交接係在4個地點之多數處所進 行,因此,即使是使用雙臂方式之搬送機器人,在各交接 部之搬送臂12A、12B之搬出、搬入動作不必交換,而可 將其固定。因此,可使搬送順序簡化,動作交換之設定, 22 (請先閱讀背面之注意事項再填寫本頁) 裝---------訂—-------- 經濟部智慧財產局員工.消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規袼(21〇 X 297公爱) 471026 A7 B7 五、發明說明(>/ ) 在兩搬送臂12A、12B進行導引作業及機器人調整,故障 發生時之錯誤處理程式作成時間之節省。 .又,在本實施形態,由於即使在未使用周邊曝光裝置 6 ’亦可藉由使用虛擬埠7,而將玻璃基板P之交接部設定 在多數處所,因此,可將搬送臂12A、12B之搬入、搬出 動作固定,如上述般,可降低順序之複雜化。 圖9至圖12係表示本發明之基板支持裝置及基板處理 裝置之第2實施形態。在這些圖中,與圖1至圖8所示之 第1實施形態之構成要素相同之要素且具有相同符號者, 該說明則省略之。第2實施形態與上述第1實施形態之相 異點爲基板支持裝置17之構成。 即,本發明之基板支持裝置17,可將玻璃基板P以縱 向之姿勢PV及橫向之姿勢PH載置於支符部20上,此外 ,如圖9所示,在各姿勢亦可載置多數大小之玻璃基板P 。具體言之,如上述第1實施形態所述,由於大型的玻璃 基板P對基板支持裝置係以縱向之姿勢PV而定位,因此 在支持部20之上面側,設定由側方保持玻璃基板P之兩短 邊之定位部22a,及由側方保持兩長邊之定位部22b,爲了 以橫向之姿勢PH而定位,設定由側方保持玻璃基板P之 兩短邊之定位部22c,及由側方保持兩長邊之定位部22b。 另一方面,爲了將小型的玻璃基板PS對基板支持裝 置Π定位,因此在支持部20之上面側設定定位部24a、 24b、24c。定位部24a係當玻璃基板PS以縱向之姿勢PV 載置於支持部20上之後,配置在由側方保持此玻璃基板 23 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -------------^--- (請先閱讀背面之注意事項再填寫本頁) ---訂·--------線 經濟部智慧財產局員工消費合作社印製 471026 Α7 Β7 五、發明說明(>>) (請先閱讀背面之注意事項再填寫本頁) PS之兩短邊之位置。定位部24c係當玻璃基板PS以橫向 之姿勢PH載置於支持部20上之後,配置在由側方保持此 玻璃基板PS兩短邊之位置。又,定位部24b係當將玻璃基 板PS以縱向之姿勢PV或以橫向之姿勢PH載置之後,配 置在由兩側方保持任一方向之坡璃基板PS長邊之位置。 這些定位部22a〜22c、24a〜24c,可對應將上述玻璃 基板P、PS依方向、大小而予以保持之位置,分別以可裝 拆自如方式固定於多數設置在支持部20之如圖10(b)所示 之固定部25。各固定部25係開口於支持部20之上面側, 並且由高精確度之孔徑及位置所形成之孔部25a ;及形成 於該孔部25a下方之母螺絲部25b所構成。其次,各定位 部22a〜22c、24a〜24c,係由嵌合於孔部25a之嵌合部26a ;與設於嵌合部26a下方之母螺絲25b螺合之公螺絲部26b ;及設於嵌合部26a上方且大於嵌合部26a之直徑,如圖 10(a)所示,在其周面由側方保持玻璃基板P、PS之圓柱部 26c所構成。 經濟部智慧財產局員工消費合作社印削衣 又,此基板支持裝置17之支持部20,係在以搬送臂 12A、12B之爪部11而支持兩側時,對應於自體重及由玻 璃基板P、PS之重量所造成之彎曲,如圖11所示,中央側 係事先往上方鼓出彎曲所形成。其他之構成則與上述第1 實施形態相同。 在上述之基板支持裝置及基板處理裝置,於玻璃基板 P、PS曝光之元件圖案及對應玻璃基板P、PS大小之位置 之固定部25,藉由將既定之定位部之嵌合部26a嵌合於孔 24 本紙張尺度適用中國國家標準(CNS)A4~規格(210 X 297H) " 一 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(w) 部25a ’並使公螺絲部26b螺合於母螺絲部25b,而可將圓 柱部26c定位、固定於既定之位置。其次,在變更玻璃基 板之大小或方向時,藉由旋轉圓柱部26,暫時使定位部由 固定部25脫離,並以上述之順序安裝於對應玻璃基板之大 小或方向之位置之固定部25。 在本實施形態之基板支持裝置及基板處理裝置,除了 可獲得與上述第1實施形態同樣效果之外,並可藉由將定 位部22a〜22c、24a〜24c安裝於既定之固定部25,即使改 變玻璃基板之大小或載置玻璃基板之方向部25,亦可以一 種類之基板支持裝置17而將玻璃基板定位、支持。 又,在本實施形態之基板支持裝置及基板處理裝置, 由於其基板支持裝置17之支持部對應於自體重及玻璃基板 之重量而往上方鼓起,因此,可與以搬送臂12A、12B之 爪部11將支持部20予以支持後所產生之彎曲相抵銷。因 此,在將玻璃基板與基板支持裝置17 —體搬送時,可使基 板支持裝置17之實質厚度變小,並可充份確保對工作距離 之緩衝。 又,在上述實施形態,雖將玻璃基板P、PS之定位以 圓柱狀之定位部進行而構成,其並不僅限於此,例如圖 12(a)、(b)所示,亦可使用具有長方體形狀之定位部22a〜 22c、24a〜24c之構成。在此場合,爲使定位部22a〜22c、 24a〜24c定位於支持部20,因此較佳係在支持部20設置 具有與玻璃基板之邊平行之邊之凹部26 ’並以密接狀態將 定位部22a〜22c、24a〜24c安裝於凹部26之邊。定位部 25 (請先閱讀背面之注意事項再填寫本頁) 衮 訂---------線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 B7 _一 五、發明說明(以) 22a〜22c、24a〜24c之固定方法,可自支持部20之下面側 螺合固定。又’在此場合之定位部22a〜22c、24a〜24c由 支持部20突出之高度亦設定爲與上述圓柱狀之場合同樣之 尺寸。進而,作爲玻璃基板之定位部,亦可設置不必由支 持部20突出,而可設置爲例如往縱方向及橫方向延伸,設 置與玻璃基板之大小對應之寬度之十字形溝,並將玻璃基 板嵌入於此溝中而定位之構成。 又,作爲基板處理裝置,除了上述曝光裝置或周邊曝 光裝置之外,亦可適用各種檢查裝置或計測裝置。 又,上述實施形態之虛擬埠7,可設置於產生異常順 序等時,將基板支持裝置17保管之支架鎖之構成。又,上 述基板支持裝置17可能因落下時之衝擊及洗淨而變形,因 此若在變形狀態載置玻璃基板,則會造成玻璃基板破損之 顧慮。因此,在上述之曝光裝置1,可設置檢查基板支持 裝置Π之變形之檢查裝置。例如,並不必透過虛擬部7之 有無’可設置上述之支架鎖,爲了保管而對被搬送後之基 板支持裝置17實施變形檢查。作爲檢查方法,例如可設置 與板固定器9、16同樣地具有支持部20所嵌合之溝部之檢 查台,用以確認支持部20是否嵌合於此溝部及有無變形之 嵌合檢查;或設置描繪支持部20之線狀部件19之外緣形 狀之檢查台,透過將基板支持裝置Π載置於該檢查台,而 以目視確認被描繪之外緣形狀是否與實際之支持部20 —致 之外觀檢查;進而,在保管時,於豎立基板支持裝置之棚 的背景上描繪上述線狀部件19之外緣形狀時,當基板支持 26 本紙張尺度適用中國國家標準(CNS)A4規$ (210 X 297公釐) '· (請先閱讀背面之注意事項再填寫本頁) ^--------訂---------線 經濟部智慧財產局員工消費合作社印制农 471026 A7 B7 五、發明說明(v5 ) 裝置17豎立後亦可以目視確認之。又,作爲其他之外觀檢 查方法,亦可於賽瑕珞(celluloul)紙等之光透過之投影圖面 上描繪線狀部件19之外緣形狀,同時,將檢查光照射於支 持部20,以透過支持部20之檢查光與投影圖面而檢查是 否變形之投影檢查。 又,特別是不論構成上述支持部20之各線狀部件19 之截面的形狀、尺寸等,例如截面爲圓形、矩形、細長之 矩形等任一形狀皆可。又,支持部20可如上述般將多數之 線狀部件19配置爲格子狀並將其熔接、接著而連結形成格 子狀,但其並不僅限於此,亦可一體成形而形成格子狀。 又,格子之間隔,係避免因玻璃基板P變大而彎曲、破損 ,可依玻璃基板P之大小、厚度而決定。進而,支持部20 並不限於格子狀,亦可爲蜂窩狀等其他形,狀。 當將玻璃基板P自基板支持裝置17拆下時,因剝離帶 電所產生之靜電會使形成於玻璃基板P_之圖案造成破損。 爲將此由剝離帶電所產生之靜電接地,基板支持裝置17之 支持部20必須具有導電性。例如,可以鋁構成支持部20 ,並使搬送機器人4具有適當之導電性,而將因剝離帶電 所產生之靜電接地。具體言之,可在搬送機器人4之搬送 臂12A設置與基板支持裝置Π之支持部20之接點,使搬 送機器人4與基板支持裝置Π具有同電位,並將搬送機器 人4與工廠內之接地連接即可。 又,當將鋁以黑耐酸鋁進行表面處理時,會導致導電 性消失。因此,可使支持部20之中與玻璃基板P接觸部份 27 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公爱) (請先閱讀背面之注意事項再填寫本頁) · I I ---. — I . I I — - ---- 經濟部智慧財產局員工消費合作社印制衣 471026 A7 B7 五、發明說明(d) 避開黑耐酸鋁之表面處理,或介由具有導電性之聚縮酸樹 脂,使玻璃基板P與支持部20接觸即可。 又,作爲本實施形態之基板,不僅爲液晶顯示裝置用 之玻璃基板P、PS,亦可適用於半導體裝置用之半導體晶 圓、薄膜磁頭用之陶瓷晶圓或用於曝光裝置之光罩或網線 之原版(合成石英、矽晶圓)等。 作爲曝光裝置1,除了使網線R與玻璃基板P、PS同 步移動,並將網線R之圖案予以掃描曝光之分段掃描(Step and scan)方式之掃描型曝光裝置之外,亦可適用於使網線 R與玻璃基板P、PS靜止之狀態下,曝光網線R之圖案, 並使玻璃基板依序移動之分段重複(step and repeat)方式之 投影曝光裝置亦可。 作爲曝光裝置1之種類,並不限於將液晶顯示裝置圖 案曝光於玻璃基板P、PS之液晶顯示裝置製造用之曝光裝 置,其亦可適用將半導體裝置圖案曝光於晶圓之半導體裝 置製造用之曝光裝置、薄膜磁頭,或用以製造攝影元件 (CCD)或網線等之曝光裝置。 又,作爲照明光IL之光源,不僅可使用由超高壓水銀 燈所產生之光線(g線(436nm)、h線(404.7nm)、i線(365nm) 、KrF準分子雷射(248nm)、ArF準分子雷射(193nm)、F2雷 射(157nm),亦可使用X線或電子線等帶電粒子線。例如, 在使用電子線之場合,可使用熱電子放射型之六硼化鑭、 鉬作爲電子槍。進而,在使用電子線之場合,可使用網線 R之構成,或不使用網線R,而直接將圖案形成於玻璃基 28 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) '装---------訂---------線 經濟部智慧財產局員工消費合作社印製 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(4) 板上之構成亦可。又,亦可使用釔鋁石榴石(YAG)雷射或 半導體雷射等之高周波。 投影光學系統PL之倍率,不限於等倍系統,亦可使 用縮小系統或放大系統。又,作爲投影光學系統PL,在使 用準分子雷射等遠紫外線之場合,可使用石英或螢石等遠 紫外線透過之材料作爲矽材料,在使用F2電射或X線之場 合,可使用反射折射系統或折射系統之光學系統,又,在 使用電子線之場合,可使用由電子透鏡及偏向器所形成之 電子光學系統作爲光學系統。又,電子線通過之光路可設 爲真空狀態。又,不使用投影光學系統PL,而可將網線R 與玻璃基板P、PS密接,並將網線r之圖案予以曝光之近 接曝光裝置亦可適用。 在使用線性馬達於板固定器9、16或網線台之場合, 可利用使用空氣軸承之空氣浮上型,或使用洛倫茲 (Lorentz)力或電抗力之磁氣浮上型。又,各板固定器9、16 或網線台可爲沿導件移動型,或未設導件之無導件型亦可 〇 作爲各板固定器9、16或網線台之驅動機構,可使用 在二次元配置磁鐵之磁鐵單元(永久磁鐵)及在二次元配置 線圈之電機子單元,使兩者對向,透過電磁力驅動各板固 定器9、16或網線台之平面馬達。在此場合,可將磁鐵單 元與電機子單元之任何一方連接於板固定器9、16或網線 台,而將磁鐵單元及電機子單元之另一方設於板固定器9 、16或網線台之移動面側。 29 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 言 Γ 良 經濟部智慧財產局員工消費合作社印製 471026 A7 B7 五、發明說明(d) 爲使因板固定器9、16之移動所產生之反作用力不致 傳達至投影光學系統PL,如日本專利特開平8-166475號公 報所揭示,可使用框體部件而機械性地往床(大地)流散。 本發明在使用具有如此構造之曝光裝置亦可適用。 爲使因網線台之移動所產生之反作用力不致傳達至投 影光爲系統PL,如日本專利特開平8-330224號公報所揭示 ,可使用框體部件而機械性地往床(大地)流散。本發明在 使用具有如此構造之曝光裝置亦可適用。 以上作爲本發明實施形態之基板處理裝置之曝光裝置 1,係將包含申請專利範圍所揭示之各構成要素之各種副系 統保持既定之機械的精確度、電氣的精確度及光學的精確 度而組立製造。爲確保各種精確度,於組立前後,在各種 光學系統進行爲達成光學的精確度之調整,在各種機械系 統進行爲達成機械的精確度之調整,在各種電氣系統進行 爲達成電氣的精確度之調整。由各種副系統組立於曝光裝 置之工程,包含各種副系統相互之機械的連接、電氣電路 之配線連接及氣壓電路之配管連接等。在將各種副系統組 立於曝光裝置之工程前,具有各副系統之組立工程。當各 種系統組立於曝光裝置之工程結束後,進行綜合調整而確 保曝光裝置全體之各種精確度。又,曝光裝置之製造較佳 係在溫度及潔淨度受到管理之無塵室進行。 液晶顯示裝置或半導體裝置等之裝置,如圖13所示, 可經由進行液晶顯示裝置等之機能、性能設計之步驟201 、依此設計步驟製作網線R(光罩)之步驟202、由石英等製 30 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ---------I I ---- ----^ --------- (請先閱讀背面之注意事項再填寫本頁) 471026 A7 經濟部智慧財產局員工消費合作社印製 ____B7___ 五、發明說明(4) 作玻璃基板P或由矽材料製作晶圓之步驟203、藉由上述 實施形態之曝光裝置1將網線R之圖案曝光於玻璃基板P 、PS(或晶圓)之步驟204、組立液晶顯示裝置等之步驟2〇5( 包含在晶圓之場合,切割工程、接線工程及封裝工程)、檢 查步驟206等而製造。 [發明效果] 如以上所述,申請專利範圍第1項之基板支持裝置, 係以设於支ί寸部之疋位部將基板分別定位於第1方向及第 2方向之構成。 依此,在此基板支持裝置,即使基板大型化,亦可防 止在包含交換之搬送時基板彎曲及由此所造成之破損,並 且’藉由選擇性地使用定位部,可將基板以幾乎彼此垂直 交叉之縱向之姿勢與橫向之姿勢簡便地定位載置,因此, 可獲得降低成本及減少基板支持裝置交換作業之效果。 申請專利範圍第2項之基板支持裝置,係第1方向與 第2方向彼此幾乎呈垂直交叉之方向之構成。 依此’在此基板支持裝置,特別是於矩形之基板曝光 時’可獲得容易地進行依所曝光之裝置圖案,選擇最適當 之方向載置基板之效果。 申請專利範圍第3項之基板支持裝置,係以裝拆自如 方式固定定位部之多數之固定部設於支持部之構成。 依此,在此基板支持裝置,藉由將定位部選擇性地固 定於既定之固定部,即使基板之大小及載置基板之方向變 更,亦可以一種類之基板支持裝置將基板定位支持,因此 31 (請先閱讀背面之注意事項再填寫本頁) 裝------^---訂----- 線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明( ,可獲得降低成本及減少基板支持裝置之交換作業之效果 〇 申請專利範圍第4項之基板支持裝置,其中固定部係 對應基板之大小而設置爲多數之構成。 依此,在此基板支持裝置,藉由將定位部選擇性地固 定於既定之固定部,即使變更基板之大小,亦可以一種類 之基板支持裝置將基板定位支持,因此,可獲得降低成本 及減少基板支持裝置之交換作業之效果。 申請專利範圍第6項之基板支持裝置,其中多數之開 口部係分別以小於基板之構成。 依此,在此基板支持裝置,可獲得使基板幾乎全面均 等而確實地支持之效果。 申請專利範圍第8項之基板支持裝覃,係如申請專利 範圍第1〜7項中之任一項所述之基板支持裝置之支持部所 嵌合之溝部,形成於基板固定器之構成。 依此,在此基板處理裝置,對於被申請專利範圍第1 〜7項中之任一項所述之基板支持裝置所支持之基板,可 進行既定之處理,因此,可獲得降底成本及減少基板支持 裝置之交換作業之效果。 申請專利範圍第9項之基板處理裝置,係將支持部嵌 合於溝部之後,定位部自基板固定器突出之構成。 依此,在此基板處理裝置,可將基板保持於基板固定 器,並可維持基板與基板支持裝置之定位狀態,在將基板 與基板支持裝置一起自基板固定器搬出時,不必再度進行 ..32 (請先閱讀背面之注意事項再填寫本頁) 装-----Γ —--訂--------線 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 471026 經濟部智慧財產局員工消費合作社印製 A7 B7 一 - ,丨 1一 "" --------—-------- — 五、發明說明丨) 定位,因此,可獲得迅速地實施搬出作業之效果。 申請專利範圍第10項之基板處裝置,其中對位裝置係 使基板對於對位部事先予以對位之構成。 依此,在此基板處理裝置,即使被搬入之基板的位置 精確度不甚良好,但亦可確實且容易地進行基板之對位, 因此,可獲得平順地進行將基板載置於基板支持裝置上2 動作之效果。 申請專利範圍第11項之基板處理裝置,其中對位裝s 係使用支持部進行基板對位之構成。 依此,在此基板處理裝置,可獲以支持部作基準而確 實且廉價地實施基板對位之效果。 申請專利範圍第12項之基板處理裝置,其中以一對搬 送臂搬送基板時,進行基板交接之交接部具有偶數處所之 構成。 依此,在此基板處理裝置,即使在使用雙臂方式之搬 送部之場合,由於不必更換在各交接部之搬送臂之搬出' 搬入動作,因此,可獲得簡化搬送順序,想定更換之動作 ,及節省在兩搬送臂之導引作業’以及節省機器人調整、 故障發生時之錯誤處理程式之作成時間之效果。 申請專利範圍第13項之基板處理裝置,其中處理部係 在基板之圖案領域周邊進行曝光處理之構成。 依此,在此基板處理裝置,即使在具有工作距離非常 小之傾向之周邊曝光裝置,亦可快速且安全地搬送基板。 因此,即使在周邊曝光裝置,亦可不必爲了基板之交換而 33 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ^ -----r -------------I f請先閱讀背面之注音?事項再填寫本頁) 471026 A7 _ B7 _ 五、發明說明(η) 移動基板固定器,並可縮短移動距離,及因基板之交接時 間縮短而提升產能及縮小裝置之設置面積。 申請專利範圍第14項之基板處理裝置,其中處理部係 使圖案曝光於基板之圖案領域之構成。. 依此,在此基板處理裝置,即使在具有工作距離非常 小之傾向之曝光裝置,亦可快速且安全地搬送基板。因此 ’即使在曝光裝置,亦可不必爲了基板之交換而移動基板 固定器,並可縮短移動距離,及因縮短基板之交接時間而 提升產能及縮小裝置之設置面積。 [圖面之簡單說明] [圖1]係表不本發明之第1實施形態,具有定位部之基 板支持裝置之平面圖。 [圖2]係在基板進行曝光處理之曝光裝置之截面平面圖 [圖3]係構成該曝光裝置之曝光裝置本體之外觀立體圖 0 [圖4]係板固定器之溝部嵌合基板支持裝置之⑷爲正 面截面圖,(b)爲彳頁截面圖。 [圖5]係基板支持裝置與玻璃基板抵接,並將玻璃基板 予以對位之前對準裝置,⑷爲正面圖;(b)爲平面圖;(c)爲 側面圖。 [圖6]係以搬送機器人使玻璃基板與基板支持裝置一體 載置於板固定器之外觀立體圖。 [圖7]係表示本發明之實施形態,在使用周邊曝光裝置 34 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝----l·. 一;.一口、I I ! I . 經濟部智慧財產局員工消費合作社印製 471026 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(β) 之場合,玻璃基板之連續搬送動作依序表示之動作圖。 [圖8]係表示本發明之實施形態,在未使用周邊曝光裝 置之場合’玻璃基板之連繪搬送動作依序表示之動作圖。 [圖9]係表示本發明之第2實施形態,具有可對應多數 大小玻璃基板之定位部之基板支持裝置之平面圖。 [圖10]係定位於以裝拆自如方式固定在固定部之⑷爲 平面圖;(b)爲截面圖。 [圖11]係表示本發明之第2實施形態,對應彎曲而事 先予以彎曲所形成之基板支持裝置之正面圖。 [圖12]係表示定位部之另一實施形態,⑻爲平面圖; (b)爲正面圖。 [圖13]係表示液晶顯示裝置之製造工程之一例之流程 圖。 [圖14]係表示習知之基板支持裝置及基板處理裝置之 一例之外觀立體圖。 玻璃基板(基板) 曝光裝置本體 搬送機器人(搬送部) 周邊曝光裝置(基板處理裝置) 虛擬埠(交接部) 板固定器(基板固定器、交接部) 溝部 搬送臂 35V. Description of the invention (J) First of all, the new specification of the glass substrate P5 is carried in from the paint spreader and loaded on the substrate supporting device 17 (Fig. 8 (a)). Next, the glass substrate P1 that has been exposed to the exposure device body 3 and is placed on the unloading j: fu 15 is removed by the transfer arm on the paint spreader side, leaving the substrate support device 17 (Figure 8 ( b)). Next, in the transfer robot 4, after the glass arm P3 is carried out from the plate holder 9 of the exposure device body 3, the glass substrate P3 is carried out (FIG. 8 (c)). The 'carrying arm 12A fixes the glass substrate P3 after temperature adjustment to the plate Device 9 (Figure 8 (d)). Next, the transfer arm 12A is rotated 90 ° and moved to a position facing the virtual port 7 (Fig. 8 (e)), and the glass substrate P2 is carried out from the virtual frame 7 (Fig. 8 (f)). Next, the transfer arm 12B carries the glass substrate P3 previously carried out from the exposure apparatus body 3 into the virtual port 7 (Fig. 8 (g)), and carries out the empty substrate support device 17 on the carry-out port 15 (Fig. 8 ( h)). . The transfer arm 12A is after the glass substrate P2 previously carried out from the virtual port 7 is moved into the carry-out port 15 (Figure 8 (i)), and the temperature-adjusted glass substrate P5 is carried out at the carry-in port 14 (Figure 8G). ). Next, when the transfer arm 12B carries the empty substrate support device 17 into the transfer 璋 14 (Figure 8 (k)), the transfer arm 12A rotates 90 ° and moves to a position opposite to the exposure device body 3 (Figure 8 (Ii)) and returns to the initial state shown in FIG. 8 (a). Hereinafter, the above-mentioned operations are repeated to sequentially expose the glass substrate P. As described above, in the substrate supporting device of this embodiment, when the glass substrate P is supported by the supporting portion 20, the glass substrate P is not supported by dots but by lines, and since the size of each opening portion 21 is smaller than that of the glass substrate p, so the glass substrate P can be almost fully supported, even if the glass substrate P is large-sized. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) " · --------- ----- One-Pack --------- Order --------- line < Please read the notes on the back before filling this page) 471026 A7 B7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the employee consumer cooperative. 5. Description of the invention ((?)) When the exchange and transportation are included, the glass substrate P can be prevented from being bent and damaged. Also, the substrate support device 17 is used selectively. The positioning portions 22a to 22c can place the glass substrate P in a vertical posture PV and a horizontal posture PH that cross almost perpendicularly. Therefore, in the substrate processing apparatus of this embodiment, a support portion is provided in the plate holders 9 and 16 The 20 fitted groove portions 9a and 16a can be integrated with the substrate supporting device Π. The conveyed glass substrate P is subjected to exposure processing. When the rectangular glass substrate P is exposed, the most appropriate direction can be selected according to the pattern of the element being exposed, so that the glass substrate P can be easily placed on the plate holder 9, 16. Prepare a substrate support device for each direction. Since there is no need to exchange substrate support devices, it is possible to reduce costs, work time, and workload. Also, by using the substrate support device 17 that prevents the glass substrate P from bending, The peripheral exposure device 6 that tends to become very small at the working distance can also quickly and safely transport the glass substrate p. Therefore, even in the peripheral exposure device 6, it is not necessary to move the plate holder for the exchange of the glass substrate P 16, the moving distance can be reduced, and the production capacity can be increased and the installation area of the device can be reduced by shortening the exchange time of the glass substrate P. Also, in this embodiment, the support portion 20 of the substrate supporting device Π is suddenly provided The movable positioning portions 22a to 22c can position the glass substrate p to the substrate supporting device 17, so it is not necessary to supply power from the outside. Force, air pressure, etc. 'can be used to locate the glass substrate P in a simpler and cheaper mechanism. Furthermore, even when the support portion 20 of the substrate support device 17 is fitted to the groove portions 9a, 16a of the plate holders 9, 16 As these positioning sections 22a ~ 22c 21 n «^ 1 n 1 ^ 1 I— nn B ^ if— I t * an order flfl en ^^ 1 n ^^ 1 I (Please read the precautions on the back before filling (This page) This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 471026 A7 B7 V. Description of the invention (/) Protruded from the plate holders 9 and 16, so it can maintain the glass substrate P In the positioning state, even when the glass substrate P and the substrate support device 17 are moved out of the plate holders 9 and 16 together, it is not necessary to reposition, and the unloading operation can be performed quickly. Furthermore, although the positioning portions 22a to 22c protrude from the upper surfaces of the plate holders 9 and 16, since the positioning portions 22a to 22c are set lower than the glass substrate P, the glass substrate P will not be transported or moved even in a device with a small working distance. Exposure processing creates any obstacles. Moreover, in the substrate processing apparatus of this embodiment, when the glass substrate P is held at the above-mentioned positioning portions 22a to 22c, the positional accuracy of the glass substrate P carried in from the paint spreader can pass through the front even if it is not very good. The alignment device 23 accurately and easily performs the alignment of the glass substrate P, and can smoothly perform the operation of placing the glass substrate P on the substrate support device 17. In particular, since the alignment device 23 has previously pressed the pressing portion 23b against the supporting portion 20 of the substrate supporting device 17, and abutting portion 23c against the glass substrate P, the supporting portion can be reliably and inexpensively implemented. The alignment of the glass substrate P as a reference. In addition, although the front alignment device 23 is a contact type to the support portion 20, it is not limited to this. For example, the distance between the front alignment device 23 and the support portion 20 may be detected by a proximity sensor or the like, and the detection result may be determined according to the detection result. In the non-contact type, the abutting portion 23c is in contact with the glass substrate P. Furthermore, in the substrate processing apparatus of this embodiment, the transfer of the glass substrate P by the transfer robot 4 is performed at a plurality of locations in four places. Therefore, even if a transfer robot using a dual-arm method is used in each transfer section, The loading and unloading operations of the transfer arms 12A and 12B do not need to be replaced, but can be fixed. Therefore, it can simplify the conveying order and set the action exchange. 22 (Please read the precautions on the back before filling this page) Employees of the Property Bureau. The paper size printed by the consumer cooperative is applicable to the Chinese National Standard (CNS) A4 Regulations (21〇X 297 Public Love) 471026 A7 B7 V. Description of the Invention (> /) Guide on the two transfer arms 12A, 12B Induction operation and robot adjustment, the error processing program can save time when a fault occurs. Also, in this embodiment, even if the peripheral exposure device 6 'is not used, the transfer portion of the glass substrate P can be set in a plurality of places by using the virtual port 7. Therefore, the transfer arms 12A, 12B can be The loading and unloading operations are fixed. As described above, the complexity of the sequence can be reduced. 9 to 12 show a second embodiment of the substrate supporting apparatus and the substrate processing apparatus of the present invention. In these figures, the same components as those of the first embodiment shown in Figs. 1 to 8 and the same reference numerals are used, and the description is omitted. The difference between the second embodiment and the first embodiment is the configuration of the substrate supporting device 17. That is, the substrate supporting device 17 of the present invention can place the glass substrate P on the support portion 20 in a vertical posture PV and a horizontal posture PH. In addition, as shown in FIG. 9, a large number can be placed in each posture. The size of the glass substrate P. Specifically, as described in the first embodiment, since the large-sized glass substrate P is positioned with the substrate supporting device in a vertical posture PV, the upper side of the support portion 20 is set to hold the glass substrate P sideways. The positioning portions 22a of the two short sides and the positioning portions 22b of the two long sides held by the sides are set to hold the positioning portions 22c of the two short sides of the glass substrate P by the side for positioning in the lateral posture PH, and by the side The two sides hold the positioning portions 22b on both long sides. On the other hand, in order to position the small-sized glass substrate PS on the substrate supporting device Π, positioning portions 24a, 24b, and 24c are provided on the upper surface side of the supporting portion 20. The positioning portion 24a is arranged after the glass substrate PS is placed on the support portion 20 in a vertical posture PV, and the glass substrate is held by the side. 23 This paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm). ) ------------- ^ --- (Please read the notes on the back before filling out this page) --- Order · -------- Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employee Consumer Cooperative 471026 Α7 Β7 V. Description of the invention (> >) (Please read the notes on the back before filling this page) Position of the two short sides of the PS. The positioning portion 24c is placed on the supporting portion 20 after the glass substrate PS is placed in a horizontal posture PH, and then the positioning portions 24c are arranged to hold the two short sides of the glass substrate PS sideways. In addition, the positioning portion 24b is placed on the long side of the sloped glass substrate PS that is held in either direction by both sides after the glass substrate PS is placed in a vertical posture PV or in a horizontal posture PH. These positioning portions 22a to 22c and 24a to 24c can be fixed to the majority of the support portions 20 provided in a removable and detachable manner as shown in FIG. 10 (corresponding to the positions where the above-mentioned glass substrates P and PS are held according to direction and size). b) shown fixed portion 25. Each fixing portion 25 is opened on the upper side of the support portion 20, and is composed of a hole portion 25a formed by a highly accurate hole and position; and a female screw portion 25b formed below the hole portion 25a. Next, each of the positioning portions 22a to 22c and 24a to 24c is a fitting portion 26a fitted into the hole portion 25a; a male screw portion 26b screwed with a female screw 25b provided below the fitting portion 26a; and The fitting portion 26a is larger than the fitting portion 26a and has a diameter larger than that of the fitting portion 26a. As shown in FIG. 10 (a), a cylindrical portion 26c holding the glass substrates P and PS laterally is formed on the peripheral surface. The consumer support cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints clothes, and the support unit 20 of the substrate support device 17 supports both sides with the claws 11 of the transfer arms 12A and 12B, corresponding to the self-weight and the glass substrate P. As shown in FIG. 11, the bending caused by the weight of PS is formed by bulging the bending upwards in advance. The other structures are the same as those of the first embodiment. In the above-mentioned substrate support device and substrate processing device, the element pattern exposed on the glass substrate P and PS and the fixing portion 25 corresponding to the position of the glass substrate P and PS are fitted with the fitting portion 26a of the predetermined positioning portion. Yu Kong 24 This paper size applies Chinese National Standard (CNS) A4 ~ Specification (210 X 297H) " 471026 A7 B7 Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (w) Department 25a The screw portion 26b is screwed to the female screw portion 25b, and the cylindrical portion 26c can be positioned and fixed at a predetermined position. Next, when changing the size or direction of the glass substrate, the positioning portion is temporarily separated from the fixing portion 25 by rotating the cylindrical portion 26, and is mounted on the fixing portion 25 corresponding to the size or direction of the glass substrate in the order described above. The substrate supporting apparatus and the substrate processing apparatus of this embodiment can obtain the same effects as those of the first embodiment described above, and the positioning portions 22a to 22c and 24a to 24c can be mounted on the predetermined fixing portion 25. By changing the size of the glass substrate or the orientation portion 25 on which the glass substrate is placed, the glass substrate may be positioned and supported by a kind of substrate support device 17. In addition, in the substrate supporting device and the substrate processing device of this embodiment, since the supporting portion of the substrate supporting device 17 bulges upward according to its own weight and the weight of the glass substrate, it can be used with the carrying arms 12A, 12B. The claw portion 11 offsets the bending generated after the support portion 20 is supported. Therefore, when the glass substrate and the substrate supporting device 17 are transported as a single body, the substantial thickness of the substrate supporting device 17 can be reduced, and the buffering of the working distance can be sufficiently ensured. Furthermore, in the above-mentioned embodiment, although the positioning of the glass substrates P and PS is configured by a cylindrical positioning portion, it is not limited to this. For example, as shown in FIGS. 12 (a) and (b), a rectangular parallelepiped may be used. The shape of the positioning portions 22a to 22c and 24a to 24c. In this case, in order to position the positioning portions 22a to 22c and 24a to 24c on the support portion 20, it is preferable that the support portion 20 be provided with a recessed portion 26 'having a side parallel to the side of the glass substrate and the positioning portion is in a tight contact state. 22a to 22c and 24a to 24c are attached to the sides of the recessed portion 26. Positioning section 25 (Please read the precautions on the back before filling in this page) Customized --------- The size of thread paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) 471026 A7 B7 _15. Description of the invention The fixing methods of 22a to 22c and 24a to 24c can be screwed and fixed from the lower side of the support portion 20. In addition, the heights of the positioning portions 22a to 22c and 24a to 24c protruding from the support portion 20 in this case are also set to the same dimensions as in the case of the above-mentioned cylindrical shape. Furthermore, as the positioning portion of the glass substrate, it is not necessary to protrude from the support portion 20, but it may be provided to extend in the longitudinal direction and the lateral direction, for example, to provide a cross-shaped groove having a width corresponding to the size of the glass substrate, and The structure is embedded in this groove and positioned. As the substrate processing apparatus, in addition to the above-mentioned exposure apparatus or peripheral exposure apparatus, various inspection apparatuses and measuring apparatuses can be applied. In addition, the virtual port 7 of the above embodiment may be configured with a bracket lock for storing the substrate support device 17 when an abnormal sequence or the like occurs. In addition, the substrate supporting device 17 may be deformed due to impact and cleaning when dropped. Therefore, if the glass substrate is placed in a deformed state, the glass substrate may be damaged. Therefore, in the above-mentioned exposure apparatus 1, an inspection apparatus for inspecting the deformation of the substrate supporting apparatus Π can be provided. For example, it is not necessary to install the above-mentioned bracket lock through the presence or absence of the dummy section 7, and the substrate support device 17 after the transport is inspected for deformation for storage. As an inspection method, for example, an inspection table having a groove portion to which the supporting portion 20 is fitted as in the plate holders 9 and 16 can be provided to confirm whether the supporting portion 20 is fitted to the groove portion and whether there is a deformation fitting inspection; or An inspection table for drawing the outer edge shape of the linear member 19 of the support portion 20 is provided, and by placing the substrate support device Π on the inspection table, it is visually confirmed whether or not the drawn outer edge shape matches the actual support portion 20. In addition, when the shape of the outer edge of the linear member 19 is described on the background of the shed where the substrate supporting device is erected during storage, when the substrate supports 26 paper standards, the Chinese National Standard (CNS) A4 rules apply ( 210 X 297 mm) '· (Please read the notes on the back before filling out this page) ^ -------- Order --------- Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Farming 471026 A7 B7 V. Description of the Invention (v5) The device 17 can also be visually confirmed after it is erected. In addition, as another visual inspection method, the shape of the outer edge of the linear member 19 may be drawn on a projection plane through which light such as celluloul paper passes, and the inspection light may be irradiated to the support portion 20 to Projection inspection to check whether the inspection light and projection plane of the support unit 20 are deformed. In addition, regardless of the shape, size, etc. of the cross section of each linear member 19 constituting the supporting portion 20, any shape such as a circular, rectangular, or elongated rectangular cross section may be used. In addition, the support portion 20 may arrange a plurality of linear members 19 in a grid shape as described above, weld them, and then connect them to form a grid shape. However, the support portion 20 is not limited to this, and may be integrally formed into a grid shape. In addition, the interval between the lattices is to avoid bending and breakage due to the large glass substrate P, and can be determined according to the size and thickness of the glass substrate P. Furthermore, the support portion 20 is not limited to a lattice shape, and may have other shapes such as a honeycomb shape. When the glass substrate P is detached from the substrate supporting device 17, the static electricity generated by the peeling and charging can damage the pattern formed on the glass substrate P_. In order to ground the static electricity generated by the peeling and charging, the supporting portion 20 of the substrate supporting device 17 must have conductivity. For example, the support portion 20 may be made of aluminum, and the transfer robot 4 may have appropriate conductivity to ground the static electricity generated by the peeling and charging. Specifically, a contact point with the support portion 20 of the substrate support device Π may be provided on the transfer arm 12A of the transfer robot 4 so that the transfer robot 4 and the substrate support device Π have the same potential, and the transfer robot 4 is grounded in the factory. Just connect. In addition, when aluminum is surface-treated with black acid-resistant aluminum, the conductivity is lost. Therefore, the contact portion of the support portion 20 with the glass substrate P can be made 27. The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 x 297 public love) (Please read the precautions on the back before filling this page). II ---. — I. II —----- Printed clothing by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 A7 B7 V. Description of the invention (d) Avoid the surface treatment of black alumite, or via conductive materials It is sufficient that the polyacrylic resin is made to contact the glass substrate P and the support portion 20. In addition, the substrate of this embodiment is not only glass substrates P and PS for liquid crystal display devices, but also semiconductor wafers for semiconductor devices, ceramic wafers for thin-film magnetic heads, or photomasks for exposure devices or The original version of the network cable (synthetic quartz, silicon wafer), etc. As the exposure device 1, in addition to a step-and-scan type scanning exposure device that moves the network line R synchronously with the glass substrates P and PS and scans and exposes the pattern of the network line R, it can also be applied. In a state where the network line R and the glass substrates P and PS are stationary, a pattern exposure method of step and repeat for exposing the pattern of the network line R and sequentially moving the glass substrate may be used. The type of the exposure device 1 is not limited to an exposure device for manufacturing a liquid crystal display device in which a liquid crystal display device pattern is exposed on a glass substrate P, PS, and it can also be applied to a semiconductor device manufacturing in which a semiconductor device pattern is exposed on a wafer. Exposure device, thin film magnetic head, or exposure device used to make photographic elements (CCD) or network cables. In addition, as the light source of the illumination light IL, not only the light (g-line (436nm), h-line (404.7nm), i-line (365nm), KrF excimer laser (248nm), ArF) Excimer laser (193nm) and F2 laser (157nm) can also use X-rays or electron beams. For example, in the case of electron beams, thermionic emission type lanthanum hexaboride and molybdenum can be used. As an electron gun, in the case of using an electronic wire, the network wire R can be used, or the pattern can be directly formed on a glass substrate without using the network wire 28. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) 'Packing --------- Order --------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (4) The structure on the board can also be used. Also, high frequency waves such as yttrium aluminum garnet (YAG) laser or semiconductor laser can be used. The magnification of the optical system PL is not limited to the equal magnification system, and a reduction system or an enlargement system can also be used. In addition, as the projection optical system PL, when far-ultraviolet rays such as excimer lasers are used, materials that transmit far-ultraviolet rays such as quartz or fluorite can be used as silicon materials, and when F2 radioscopy or X-rays are used, reflection The refracting system or the optical system of the refracting system, and in the case of using an electron beam, an electron optical system formed by an electron lens and a deflector can be used as the optical system. Moreover, the optical path through which the electron beam passes can be set to a vacuum state. The proximity exposure device that can use the projection optical system PL to closely connect the network cable R to the glass substrate P and PS and expose the pattern of the network cable r is also applicable. When using linear motors on the plate holders 9, 16 In the case of a network cable station, an air-floating type using air bearings or a magnetic air-floating type using Lorentz force or reactance can be used. In addition, each plate holder 9, 16 or the network cable table can be It can also be moved along the guide, or without the guide without the guide. As the drive mechanism of each plate holder 9, 16 or the network cable table, a magnet unit (permanent magnetic) Iron) and a motor sub-unit with a coil arranged in the second element, so that the two are opposed to each other and drive each plate holder 9, 16 or a flat surface of the network cable platform by electromagnetic force. In this case, the magnet unit and the motor sub-unit can be used. Either one of them is connected to the plate holder 9, 16 or the network cable table, and the other unit of the magnet unit and the motor sub-unit is set to the moving surface side of the plate holder 9, 16 or the network cable table. 29 This paper standard applies to China National Standard (CNS) A4 Specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Γ Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 471026 A7 B7 V. Description of Invention (d) In order to prevent the reaction force generated by the movement of the plate holders 9 and 16 to be transmitted to the projection optical system PL, as disclosed in Japanese Patent Laid-Open No. 8-166475, a frame member can be used to mechanically move the bed (the ground) ) Diaspora. The present invention is also applicable to an exposure apparatus having such a structure. In order to prevent the reaction force generated by the movement of the network cable from being transmitted to the projected light as the system PL, as disclosed in Japanese Patent Laid-Open No. 8-330224, a frame member can be used to mechanically disperse to the bed (the earth). . The present invention is also applicable to an exposure apparatus having such a structure. The exposure apparatus 1 as the substrate processing apparatus according to the embodiment of the present invention is constituted by maintaining various mechanical systems, electrical accuracy, and optical accuracy including various sub-systems including the constituent elements disclosed in the scope of the patent application. Manufacturing. In order to ensure various precisions, before and after assembly, adjustments are made to achieve optical accuracy in various optical systems, adjustments to achieve mechanical accuracy are performed in various mechanical systems, and electrical accuracy is achieved in various electrical systems. Adjustment. Various sub-systems are assembled into the exposure device, including mechanical connections of various sub-systems, wiring connections of electrical circuits, and piping connections of pneumatic circuits. Before the various sub-systems are assembled in the project of the exposure device, the sub-systems are assembled. After the various systems are assembled in the exposure device, the overall adjustment is performed to ensure the accuracy of the entire exposure device. The manufacturing of the exposure device is preferably performed in a clean room in which temperature and cleanliness are controlled. As shown in FIG. 13, a device such as a liquid crystal display device or a semiconductor device can be designed by performing function 201 of the liquid crystal display device and the like, performing step 202 of making a network cable R (photomask) according to the design steps, and using quartz. Equal system 30 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --------- II ---- ---- ^ --------- (Please read the precautions on the back before filling this page) 471026 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ____B7___ V. Description of the invention (4) Step 203 of making glass substrate P or making wafers from silicon materials, borrow Step 204 of exposing the pattern of the network line R to the glass substrate P, PS (or wafer), step 204 of assembling the liquid crystal display device, etc. by the exposure device 1 of the above embodiment (including the wafer, cutting process , Wiring engineering and packaging engineering), inspection step 206 and so on. [Effects of the Invention] As described above, the substrate supporting device of the first scope of the patent application has a configuration in which the substrate is positioned in the first direction and the second direction by the positioning portion provided in the support unit. Accordingly, even if the substrate is enlarged, the substrate supporting device can prevent the substrate from being bent and damaged during the transportation including the exchange, and the substrates can be almost mutually used by selectively using the positioning portions. The vertical and horizontal postures and the horizontal postures can be easily positioned and placed. Therefore, it is possible to obtain the effects of reducing costs and reducing the substrate supporting device exchange operation. The substrate supporting device of the second patent application scope is a structure in which the first direction and the second direction are almost perpendicular to each other. According to this, "the substrate supporting device, especially when a rectangular substrate is exposed", can obtain the effect of easily placing the substrate according to the exposed device pattern and selecting the most appropriate direction. The substrate support device of the third scope of the patent application has a structure in which a large number of fixing portions that fix the positioning portion in a detachable manner are provided on the supporting portion. According to this, in this substrate supporting device, by selectively fixing the positioning portion to a predetermined fixing portion, even if the size of the substrate and the direction in which the substrate is placed can be changed, a substrate supporting device can be used to position and support the substrate. 31 (Please read the precautions on the back before filling out this page) Loading ------ ^ --- Order ----- The size of thread paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) ) 471026 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (, can obtain the effect of reducing costs and reducing the exchange operation of the substrate support device. According to the size of the substrate, a large number of structures are provided. Accordingly, the substrate supporting device here selectively fixes the positioning portion to a predetermined fixing portion. Even if the size of the substrate is changed, a type of substrate supporting device can be used. Substrate positioning support, therefore, it is possible to obtain the effect of reducing costs and reducing the exchange operation of the substrate support device. The substrate support device in the scope of patent application No. 6 is mostly The number of openings is smaller than that of the substrate. Accordingly, the substrate supporting device can obtain the effect of making the substrate almost uniform and surely supported. The substrate supporting device of the eighth patent application scope is as applied The groove portion to which the supporting portion of the substrate supporting device described in any one of the patent scope items 1 to 7 is formed is formed in the substrate holder. Accordingly, in this substrate processing equipment, the scope of The substrates supported by the substrate support device described in any one of items 1 to 7 can be subjected to predetermined processing, so that the effect of reducing the bottom cost and reducing the exchange operation of the substrate support device can be obtained. Item 9 of the scope of patent application The substrate processing device is a structure in which the positioning portion protrudes from the substrate holder after the support portion is fitted into the groove portion. Accordingly, in this substrate processing device, the substrate can be held in the substrate holder, and the substrate and the substrate support can be maintained. The positioning state of the device does not need to be carried out again when the substrate and the substrate supporting device are removed from the substrate holder. 32 (Please read the precautions on the back first Please fill in this page again.) ----- Γ --------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Bureau employee consumer cooperatives printed A7 B7 A-, 丨 1 a " " -------------------- 5. Description of the invention 丨) Positioning, therefore, can be quickly obtained The effect of carrying out the operation. The device for substrate processing according to item 10 of the patent application, wherein the alignment device is a structure in which the substrate is aligned with the alignment portion in advance. According to this, in this substrate processing apparatus, even if the position accuracy of the substrate being carried is not very good, the alignment of the substrate can be surely and easily performed. Therefore, the substrate can be smoothly placed on the substrate supporting device. Effect of 2 actions. In the substrate processing apparatus of the scope of application for patent No. 11, the positioning device s is a structure for substrate positioning using a supporting part. Accordingly, in this substrate processing apparatus, it is possible to obtain the effect of accurately and inexpensively performing substrate alignment using the support portion as a reference. In the substrate processing apparatus according to the scope of application for patent No. 12, when the substrates are transferred by a pair of transfer arms, the transfer section for transferring substrates has an even number of locations. According to this, in this substrate processing apparatus, even when a two-arm transfer unit is used, it is not necessary to replace the carry-out operation of the transfer arms at each transfer unit. Therefore, a simplified transfer sequence can be obtained, and the replacement operation can be determined. It also saves the guidance operation of the two transfer arms, and saves the time required for the robot to adjust and create error processing programs when a fault occurs. The substrate processing apparatus according to item 13 of the patent application, wherein the processing section is configured to perform exposure processing around the pattern area of the substrate. Accordingly, the substrate processing apparatus can quickly and safely transfer a substrate even in a peripheral exposure apparatus having a tendency to have a very small working distance. Therefore, even in the peripheral exposure device, it is not necessary to exchange the paper for the 33 substrates. The Chinese paper standard (CNS) A4 (210 X 297 mm) is applicable. ^ ----- r ------- ------ I f Please read the Zhuyin on the back? Please fill in this page again for details) 471026 A7 _ B7 _ V. Description of the invention (η) Move the substrate holder and shorten the moving distance, and increase the productivity and reduce the installation area of the device because the substrate transfer time is shortened. The substrate processing apparatus of the scope of application for patent No. 14 wherein the processing section is a structure that exposes a pattern to the pattern area of the substrate. Based on this, the substrate processing apparatus can quickly and safely transfer substrates even in an exposure apparatus that tends to have a very small working distance. Therefore, even in the exposure device, it is not necessary to move the substrate holder for the substrate exchange, and the moving distance can be shortened, and the productivity can be increased and the installation area of the device can be reduced due to the shortened substrate transfer time. [Brief description of the drawing] [Fig. 1] A plan view showing a substrate supporting device having a positioning portion according to the first embodiment of the present invention. [Fig. 2] Sectional plan view of an exposure device that performs exposure processing on a substrate [Fig. 3] Appearance perspective view of an exposure device body constituting the exposure device 0 [Fig. 4] The groove of a plate holder is fitted with a substrate supporting device Is a front cross-sectional view, and (b) is a front cross-sectional view. [Fig. 5] The substrate supporting device is in contact with the glass substrate, and the device is aligned before the glass substrate is aligned. ⑷ is a front view; (b) is a plan view; (c) is a side view. [Fig. 6] An external perspective view of a glass substrate and a substrate supporting device integrated on a plate holder by a transfer robot. [Figure 7] It shows the embodiment of the present invention. When using a peripheral exposure device, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Equipment ---- l .. One; one, II! I. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 471026 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Operation diagrams showing sequential conveyance operations of glass substrates. [Fig. 8] Fig. 8 is an operation diagram showing the sequential drawing and conveying operation of the glass substrate when the peripheral exposure device is not used in the embodiment of the present invention. [Fig. 9] A plan view showing a substrate supporting device having a positioning portion capable of supporting a large number of glass substrates according to a second embodiment of the present invention. [Fig. 10] A plan view positioned at a position fixed to the fixing portion in a detachable manner; (b) is a sectional view. [Fig. 11] is a front view showing a substrate supporting device formed by bending in advance in response to a second embodiment of the present invention. [FIG. 12] It shows another embodiment of a positioning part, (1) is a plan view, (b) is a front view. [Fig. 13] A flowchart showing an example of a manufacturing process of a liquid crystal display device. [Fig. 14] An external perspective view showing an example of a conventional substrate supporting device and a substrate processing device. Glass substrate (substrate) Exposure device body Transfer robot (transport section) Peripheral exposure device (substrate processing device) Virtual port (transfer section) Plate holder (substrate holder, transfer section) Groove section Transfer arm 35

[符號說明] P、PS 3 4 6 7 9、16 9a 、 16a 12A 、 12B 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公餐) <請先閱讀背面之注意事項再填寫本頁) 裝·----r ----訂--------- 471026 A7 _B7 五、發明說明(?)0 經濟部智慧財產局員工消費合作社印製 14 搬入埠(交接部) 15 搬出埠(交接部) 17 基板支持裝置 20 支持部 21 開口部 22a〜22c、24a〜24c 定位部 23 前對準裝置(對位裝置) 25 固定部 6 3 -------------- -----r ----訂—--------線 (請先閱讀背面之注意事項再填冩本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)[Symbols] P, PS 3 4 6 7 9, 16 9a, 16a 12A, 12B This paper size is applicable to China National Standard (CNS) A4 specification (21〇X 297 meals) < Please read the precautions on the back first (Fill in this page) Installation · ---- r ---- Order --------- 471026 A7 _B7 V. Description of the invention (?) 0 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 14 Moved into the port ( (Transferring section) 15 Carry-out port (Transferring section) 17 Board supporting device 20 Supporting section 21 Opening sections 22a ~ 22c, 24a ~ 24c Positioning section 23 Front alignment device (alignment device) 25 Fixing section 6 3 ------ -------- ----- r ---- Order --------- line (please read the precautions on the back before filling this page) This paper size applies to Chinese national standards (CNS) A4 size (210 X 297 mm)

Claims (1)

471026 90 10. 2 年月口修正赫参丰 Α8 Β8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 1.一種基板支持裝置,用於支持基板,其特徵具有: 支持部,具有多數之開口部,並支持前述基板;及 定位部,設於該支持部,將前述基板分別定位於第i 方向及與第1方向相異之第2方向。 2·如申請專利範圍第1項之基板支持裝置,其中前述 第1方向與前述第2方向係彼此呈垂直交叉之方向。 3. —種基板支持裝置,用於支持基板,其特徵具有: 支持部,具有多數之開口部,並支持前述基板; 定位部,突設於該支持部,並將前述基板定位;及 固定部,設置爲多數使前述定位部以裝拆自如方式固 定於前述支持部。 4. 如申請專利範圍第3項之基板支持裝置,其中前述 固定部係對應前述基板大小而設置爲多數。 5. 如申請專利範圍第3或4項之基板支持裝置,其中 前述固定部係對應前述基板定位之方向而設置爲多數。 6. 如申請專利範圍第1項之基板支持裝置,其中前述 多數之開口部係分別小於前述基板。 7. 如申請專利範圍第1項之基板支持裝置,其中前述 支持部具有對應彎曲之形狀。 8. —種基板處理裝置,具有用以保持基板之基板固定 器;及對被保持於該基板固定器之基板進行既定處理之處 理部,其特徵係: 將包含具有多數之開口部並支持前述i板之支持部; 及設於該支持部並將前述基板分別定位於第1方向及與第 1 1紙張尺度i中國國家標準(CNS)A4規格(210 x 297公^ ~ I ---— I--I 1 ? ------I ItT> -----I I I I (請先閱讀背面之注意事項再填寫本頁) 471026 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 1方向相異之第2方向之定位部之基板支持裝置,將其前 述支持部所嵌合之溝部設置於前述基板固定器。 9. 如申請專利範圍第8項之基板處理裝置,其中前述 定位部係在前述支持部嵌合於前述溝部時,由前述基板固 定器突出。 10. 如申請專利範圍第8項之基板處理裝置,其更具有 對位裝置,在將前述基板搬送至前述基板支持裝置時,使 前述基板預先與前述定位部對位。 11. 如申請專利範圍第10項之基板處理裝置,其中前 述對位裝置係使用前述支持部進行前述基板之對位。 •12.如申請專利範圍第8項之基板處理裝置,其更具有 搬送部,以一對搬送臂,透過前述基板支持裝置進行 前述基板之搬送;及 偶數處所之交接部,在與前述搬送部之間進行前述基 板之交接。 13.如申請專利範圍第8項之基板處理裝置,其中前述 處理部係在圖案被曝光之前述基板之圖案領域周邊進行曝 光處理。 M.如申請專利範圍第8項之基板處理裝置,其中前述 處理部係將圖案曝光於前述基板之曝光領域。 2 ------------------- (請先閱讀背面之注意事項再填寫本頁) 訂--------—線- 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)471026 90 10. Revised Heshenfeng A8, B8, C8, D8 printed in February, 2012. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Scope of patent application 1. A substrate support device for supporting substrates. It has a plurality of openings and supports the substrate; and a positioning portion is provided on the supporting portion, and positions the substrate in the i-th direction and a second direction different from the first direction, respectively. 2. The substrate supporting device according to item 1 of the patent application range, wherein the first direction and the second direction are perpendicular to each other. 3. A substrate supporting device for supporting a substrate, which is characterized by: a supporting portion having a plurality of openings and supporting the aforementioned substrate; a positioning portion protrudingly provided on the supporting portion and positioning the aforementioned substrate; and a fixing portion Is provided so that the positioning portion is fixed to the supporting portion in a removable manner. 4. For the substrate supporting device of the third scope of the application for a patent, wherein the aforementioned fixing portion is provided in a plurality corresponding to the size of the aforementioned substrate. 5. For the substrate supporting device of the third or fourth aspect of the patent application, wherein the fixing portion is provided in a plurality corresponding to the direction in which the substrate is positioned. 6. For the substrate support device of the scope of patent application, the openings of most of the foregoing are smaller than the aforementioned substrates, respectively. 7. The substrate supporting device according to the first patent application range, wherein the aforementioned supporting portion has a correspondingly curved shape. 8. A substrate processing apparatus having a substrate holder for holding a substrate; and a processing section for performing predetermined processing on a substrate held by the substrate holder, which is characterized in that it will include a plurality of openings and support the foregoing a support portion of the i-plate; and the support plate provided in the support portion and positioning the aforementioned substrates in the first direction and the first paper size i Chinese National Standard (CNS) A4 specification (210 x 297 mm ^ ~ I ----- I--I 1? ------ I ItT > ----- IIII (Please read the notes on the back before filling out this page) 471026 A8 B8 C8 D8 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs For the substrate supporting device of the positioning part in the second direction where the direction of the patent application is different from the second direction, the groove part to which the aforementioned supporting part is fitted is set in the aforementioned substrate holder. Wherein, the positioning portion is protruded by the substrate holder when the supporting portion is fitted into the groove portion. 10. For a substrate processing apparatus of the eighth aspect of the patent application, it further has an alignment device to transport the substrate. To the aforementioned base When supporting the device, the substrate is aligned with the positioning part in advance. 11. For a substrate processing device with the scope of application for item 10, the positioning device uses the support to perform the positioning of the substrate. The substrate processing apparatus of the scope of application for patent No. 8 further has a conveying section for conveying the substrate with a pair of conveying arms through the substrate supporting device; and a transfer section for an even number of places to perform the foregoing Substrate handover. 13. The substrate processing device according to item 8 of the scope of patent application, wherein the aforementioned processing unit performs exposure processing around the pattern area of the substrate to which the pattern is exposed. M. Substrate processing such as item 8 of the scope of patent application Device, in which the aforementioned processing section exposes the pattern to the exposure area of the aforementioned substrate. 2 ------------------- (Please read the precautions on the back before filling this page) Order ---------- Line-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)
TW089114733A 1999-07-26 2000-07-24 Substrate supporting device and substrate processing device TW471026B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21139299 1999-07-26

Publications (1)

Publication Number Publication Date
TW471026B true TW471026B (en) 2002-01-01

Family

ID=16605216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089114733A TW471026B (en) 1999-07-26 2000-07-24 Substrate supporting device and substrate processing device

Country Status (3)

Country Link
JP (1) JP2001100169A (en)
KR (1) KR100825691B1 (en)
TW (1) TW471026B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100825691B1 (en) * 1999-07-26 2008-04-29 가부시키가이샤 니콘 Apparatus for supporting substrate and apparatus of processing substrate
JP4197498B2 (en) * 2004-01-22 2008-12-17 シャープ株式会社 Liquid crystal display
KR20060033554A (en) 2004-10-15 2006-04-19 삼성에스디아이 주식회사 Laser induced thermal imaging apparatus and method of fabricating electroluminescence display device using the same
JP2007114570A (en) * 2005-10-21 2007-05-10 Nikon Corp Substrate holder, exposure device and method for manufacturing device
JP4425903B2 (en) * 2006-12-14 2010-03-03 日本精工株式会社 Work chuck and control method thereof
JP4425944B2 (en) * 2007-03-19 2010-03-03 日本精工株式会社 Work chuck and control method thereof
JP4425943B2 (en) * 2007-03-19 2010-03-03 日本精工株式会社 Work chuck
JP4702313B2 (en) * 2007-03-22 2011-06-15 ウシオ電機株式会社 Stage equipment
JP5469852B2 (en) * 2008-11-21 2014-04-16 株式会社ニコン Conveying apparatus, conveying method, exposure apparatus, exposure method, and device manufacturing method
TW201135372A (en) 2009-10-20 2011-10-16 Nikon Corp Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method
TW201132570A (en) 2009-10-28 2011-10-01 Nikon Corp Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device
JP5938904B2 (en) * 2009-12-16 2016-06-22 株式会社ニコン Substrate support member, substrate transfer apparatus, substrate transfer method, exposure apparatus, and device manufacturing method
JP5915521B2 (en) * 2010-02-17 2016-05-11 株式会社ニコン Conveying apparatus, conveying method, exposure apparatus, and device manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142555A (en) * 1993-06-29 1995-06-02 Hitachi Ltd Wafer chuck
JP3136898B2 (en) * 1994-04-13 2001-02-19 株式会社村田製作所 Dicing equipment
JPH1126550A (en) * 1997-07-04 1999-01-29 Tokyo Electron Ltd Substrate conveyer and apparatus for treating substrate, using the same
AU2186099A (en) * 1998-02-09 1999-08-23 Nikon Corporation Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same
KR100825691B1 (en) * 1999-07-26 2008-04-29 가부시키가이샤 니콘 Apparatus for supporting substrate and apparatus of processing substrate

Also Published As

Publication number Publication date
KR100825691B1 (en) 2008-04-29
KR20010015066A (en) 2001-02-26
JP2001100169A (en) 2001-04-13

Similar Documents

Publication Publication Date Title
TW412783B (en) Substrate supporting apparatus, substrate carrying apparatus and its manufacturing method, substrate exchanging method and, the exposure apparatus and its manufacturing method
TW471026B (en) Substrate supporting device and substrate processing device
KR102172551B1 (en) Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method
JP6245308B2 (en) Substrate transport method, device manufacturing method, substrate transport apparatus, and exposure apparatus
CN109791370B (en) Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method
TWI667549B (en) Exposure apparatus, device manufacturing method, flat panel display manufacturing method, and exposure method
CN110114725B (en) Transfer apparatus, exposure apparatus, method for manufacturing flat panel display, and method for manufacturing device
JP6708233B2 (en) Object moving apparatus, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP2017085167A (en) Exposure device, method for producing flat panel display, method for producing device, and exposure method
TW202030827A (en) Substrate-replacement method
JP2004001924A (en) Conveying device and exposure device
JP2003258078A (en) Substrate supporting device and transport device using it
JP5741926B2 (en) Object exchange system, exposure apparatus, flat panel display production method, device production method, and object exchange method
TWI727355B (en) Processing system and method of processing substrates
JP2001332600A (en) Carrying method, exposing apparatus
JP4674467B2 (en) Substrate transport method, substrate transport apparatus, exposure method, exposure apparatus, and microdevice manufacturing method
JP6186678B2 (en) Object exchange method, object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP7207096B2 (en) Substrate transport apparatus, exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method
JP6440104B2 (en) Object exchange method, object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
TWI765999B (en) Object exchange device, object handling device, manufacturing method of flat panel display, component manufacturing method, object exchange method, and object processing method
JP7025165B2 (en) Manufacturing method of exposure equipment, transport equipment and articles
KR20110021653A (en) Exposure apparatus, and device manufacturing method using same
JP7196734B2 (en) Substrate transport apparatus, exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method
JP6015983B2 (en) Object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP2000260859A (en) Substrate housing device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent