TW201723069A - 一種環氧樹脂組合物以及使用其之預浸料及層壓板 - Google Patents
一種環氧樹脂組合物以及使用其之預浸料及層壓板 Download PDFInfo
- Publication number
- TW201723069A TW201723069A TW105111251A TW105111251A TW201723069A TW 201723069 A TW201723069 A TW 201723069A TW 105111251 A TW105111251 A TW 105111251A TW 105111251 A TW105111251 A TW 105111251A TW 201723069 A TW201723069 A TW 201723069A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- component
- composition according
- weight
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 110
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 102
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 101
- 150000002148 esters Chemical class 0.000 claims abstract description 42
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 29
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical group O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical group CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 20
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 18
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 18
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 15
- -1 carboxylic acid aromatic compound Chemical class 0.000 claims description 14
- 239000003063 flame retardant Substances 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 9
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 8
- 229910002113 barium titanate Inorganic materials 0.000 claims description 8
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 8
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052794 bromium Inorganic materials 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920000570 polyether Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 239000012779 reinforcing material Substances 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- 239000012766 organic filler Substances 0.000 claims description 4
- 239000000454 talc Substances 0.000 claims description 4
- 229910052623 talc Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 150000002989 phenols Chemical group 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims description 3
- YYRHIWOOLJRQOA-UHFFFAOYSA-N (2,6-dimethylphenyl)-[3-(2,6-dimethylphenyl)phosphanylphenyl]phosphane Chemical compound CC1=CC=CC(C)=C1PC1=CC=CC(PC=2C(=CC=CC=2C)C)=C1 YYRHIWOOLJRQOA-UHFFFAOYSA-N 0.000 claims description 2
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 2
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 150000002923 oximes Chemical class 0.000 claims description 2
- RERMPCBBVZEPBS-UHFFFAOYSA-N tris(2,6-dimethylphenyl)phosphane Chemical group CC1=CC=CC(C)=C1P(C=1C(=CC=CC=1C)C)C1=C(C)C=CC=C1C RERMPCBBVZEPBS-UHFFFAOYSA-N 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- GXIPHHIBYMWSMN-UHFFFAOYSA-N 6-phenylbenzo[c][2,1]benzoxaphosphinine 6-oxide Chemical compound O1C2=CC=CC=C2C2=CC=CC=C2P1(=O)C1=CC=CC=C1 GXIPHHIBYMWSMN-UHFFFAOYSA-N 0.000 claims 1
- RCAJMBWLWNPVJZ-UHFFFAOYSA-N C1(C=CC(N1)=O)=O.C1(C=CC(N1)=O)=O.[P] Chemical compound C1(C=CC(N1)=O)=O.C1(C=CC(N1)=O)=O.[P] RCAJMBWLWNPVJZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 125000001246 bromo group Chemical group Br* 0.000 claims 1
- 239000000378 calcium silicate Substances 0.000 claims 1
- 229910052918 calcium silicate Inorganic materials 0.000 claims 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims 1
- 150000004820 halides Chemical class 0.000 claims 1
- 238000005470 impregnation Methods 0.000 claims 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 36
- 238000010521 absorption reaction Methods 0.000 abstract description 27
- 230000000052 comparative effect Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 230000000704 physical effect Effects 0.000 description 11
- 239000003292 glue Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- 239000013022 formulation composition Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 239000004744 fabric Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 6
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 5
- 125000006840 diphenylmethane group Chemical group 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000002195 synergetic effect Effects 0.000 description 4
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 3
- 239000001354 calcium citrate Substances 0.000 description 3
- 239000004643 cyanate ester Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 235000013337 tricalcium citrate Nutrition 0.000 description 3
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- WXANAQMHYPHTGY-UHFFFAOYSA-N cerium;ethyne Chemical compound [Ce].[C-]#[C] WXANAQMHYPHTGY-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- WYNCHZVNFNFDNH-UHFFFAOYSA-N Oxazolidine Chemical compound C1COCN1 WYNCHZVNFNFDNH-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- ZKEYULQFFYBZBG-UHFFFAOYSA-N lanthanum carbide Chemical compound [La].[C-]#[C] ZKEYULQFFYBZBG-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- ADJMNWKZSCQHPS-UHFFFAOYSA-L zinc;6-methylheptanoate Chemical compound [Zn+2].CC(C)CCCCC([O-])=O.CC(C)CCCCC([O-])=O ADJMNWKZSCQHPS-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
- B32B2264/0257—Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fluid Mechanics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明涉及一種環氧樹脂組合物,其包括如下組分:(A)含有噁唑烷酮結構的環氧樹脂,其具有式(1)的結構;(B)活性酯固化劑;(C)固化促進劑。本發明提供的環氧組合物,以及使用該環氧樹脂組合物製作的預浸料、層壓板及印製電路板,具有低熱膨脹係數、低介質損耗因子Df值□0.0084、低吸水率且耐濕熱性能優異的特點。
Description
本發明屬於覆銅板技術領域,具體係關於一種環氧樹脂組合物以及使用其之預浸料、層壓板及印製電路板。
近年來,隨著資訊通訊設備高性能化、高功能化以及網路化的發展,為了高速傳輸及處理大容量資訊,操作訊號趨向於高頻化,同時,為了滿足各類電子產品的發展趨勢要求,電路板向著高多層、高佈線密度的方向發展,因此要求基板材料不僅具有較低且穩定介電常數及介質損耗因子來滿足訊號高頻傳輸的需要,而且要求其具有良好的耐熱性來滿足多層印製電路板可靠性的需求。
CN101815734A提出一種透過多官能環氧樹脂與二異氰酸酯化合物反應合成異氰酸酯改性環氧的方法,該樹脂具有粉末塗料所需的高軟化點;CN102666633A提出一種環氧噁唑烷酮,其包括二乙烯基芳烴二氧化物,和過量的多異氰酸酯的反應產物和可固化的環氧樹脂組合物,其包含衍生自二乙烯基苯二氧化物(DVBDO)的二乙烯基芳烴二氧化物及多異氰酸酯的環氧噁唑烷酮,至少一種固化劑;及/或催化劑,組合物具有低黏度高耐熱性的特點。
CN1333791A公開一種由多環氧化物與多異氰酸酯及擴鏈劑製成的黏結劑組合物,該組合物有利於增強銅箔與層壓板之間的黏合性。
CN101695880A提出一種聚噁唑烷酮層壓板的製作方法,其採用二異氰酸酯與環氧在咪唑催化劑下反應生成聚噁唑烷酮,然後利用生成的聚噁唑烷酮製作層壓板,其製作出的層壓板具有更好的機械強度及耐熱性。
日本專利特開2003-252958提出採用聯苯型環氧樹脂及活性酯固化劑,可以得到降和介質損耗因子的固化產物,但是由於採用的環氧樹脂為雙官能度,其與活性酯固化劑的交聯密度低,固化物的玻璃化轉變溫度低。
以上現有專利技術中,雖然都提出了異氰酸酯改性環氧或聚噁唑烷酮自身及其組合物具有良好的黏結性、耐熱性及韌性,但均存在耐濕熱性能欠佳、可靠性較低,介電損耗因子相對較高等缺點,限制其在高速材料中的應用。
針對已有技術的問題,本發明的目的在於提供一種環氧樹脂組合物以及使用其之預浸料及層壓板。使用該樹脂組合物製造的層壓板具有低介質損耗因子、低吸水性且具有優異的耐濕熱性能,滿足高頻高速時代對印製層壓板的性能要求。
本發明發明人研究發現:含有噁唑烷酮結構的環氧樹脂、活
性酯固化劑及固化促進劑,及其他可選地組分適當混合得到的組合物,可實現上述目的。
一種環氧樹脂組合物,其包括如下組分:
式(1)中,m及n各自獨立地選自0、1、2;X的結構獨立地選自:
R及R’各自獨立地選自任意的有機基團;(B)活性酯固化劑;(C)固化促進劑。
本發明所採用的含有噁唑烷酮結構的環氧樹脂,主鏈中含有C、N、O的五元雜環噁唑烷酮結構,其分子鏈剛性大,膨脹係數低但其吸水率較高,而活性酯的引入在固化過程中降低二次羥基的形成,降低吸水
率的同時,保證組合物充分發揮噁唑烷酮自身結構具有低介電損耗因子的特點。本發明提供的環氧樹脂組合物利用含有噁唑烷酮結構的環氧樹脂與活性酯的協同作用,保證了前述環氧樹脂組合物比一般單一使用異氰酸酯或活性酯的組合物具有更低的介電損耗因子同時具有更低的吸水率,從而保證組合物具有高可靠性。
本發明利用上述三種必要組分之間的相互配合以及相互協同促進作用,得到了如上的環氧樹脂組合物。採用該環氧樹脂組合物製成的預浸料及層壓板,具有低熱膨脹係數、低介質損耗因子、低吸水率及優異的耐濕熱性能。
理想地,式(1)的結構中,m=0且n=0,前述組分(A)含有噁唑烷酮結構的環氧樹脂具有式(2)的結構:
式(2)中,R及R’具有與申請專利範圍第1項相同的範圍;理想地,式(1)及式(2)中,R及R’各自獨立地選自如下結構中的任意1種:
理想地,前述R及R’相同。
理想地,前述組分(A)含有噁唑烷酮結構的環氧樹脂為具有雙酚A及/或四溴雙酚A結構的含噁唑烷酮結構環氧樹脂。
理想地,前述含有噁唑烷酮結構的環氧樹脂環氧當量與活性酯固化劑的酯基當量的比值為1:0.9~1.1,例如1:0.92、1:0.94、1:0.96、1:0.98、1:1、1:1.02、1:1.04、1:1.06或1:1.08。
理想地,前述組分(B)活性酯固化劑是由一種通過脂肪環烴結構連接的酚類化合物、二官能度羧酸芳香族化合物或酸性鹵代物及一種單羥基化合物反應而得。前述二官能羧酸芳香族化合物或酸性鹵化物用量為1mol,通過脂肪環烴結構連接的酚類化合物用量為0.05~0.75mol,單羥基化合物用量為0.25~0.95mol。
更理想地,前述組分(B)活性酯固化劑包括如式(3)結構的活性酯:
Y為苯基或者萘基,j為0或1,k為0或1,n表示重複單元為0.25~1.25。
由於前述活性酯固化劑的特殊結構,其中的苯基、萘基、環戊二烯等剛性結構賦予該活性酯高的耐熱性,同時由於其結構的規整性及與環氧樹脂反應過程中無二次羥基產生,賦予其良好的電性能及低吸水性:理想地,本發明前述組分(C)固化促進劑選自4-二甲胺基吡啶、2-甲基咪唑、2-乙基4-甲基咪唑或2-苯基咪唑中的任意1種或者至少2種的混合物。
前述組分(C)固化促進劑的示例性混合物可以是4-二甲胺基吡啶和2-甲基咪唑的混合物,2-甲基咪唑和2-乙基4-甲基咪唑或2-苯基咪唑的混合物,4-二甲胺基吡啶、2-甲基咪唑和2-苯基咪唑的混合物等。
理想地,以組分(A)含噁唑烷酮結構的環氧樹脂及組分(B)活性酯固化劑添加量之和為100重量份計,前述組分(C)固化促進劑的添加量為0.05~1重量份,例如0.08重量份、0.1重量份、0.15重量份、0.2重量份、0.25重量份、0.3重量份、0.35重量份、0.4重量份、0.45重量份、0.5重量份、0.55重量、0.60重量份、0.65重量份、0.7重量份、0.75重量份、0.8重量份、0.85重量份、0.9重量份或0.95重量份,較佳為0.5~0.8重量份。
理想地,本發明前述環氧樹脂組合物還包括氰酸酯樹脂。
氰酸酯樹脂能很好地提高組合物的玻璃化轉變溫度及降低組合物的熱膨脹係數。
理想地,以組分(A)含噁唑烷酮結構的環氧樹脂、組分(B)活性酯固化劑及組分(C)固化促進劑添加量之和為100重量份計,前述氰酸酯樹脂的添加量為50重量份以下,例如12重量份、15重量份、25重量份、30重量份、35重量份、38重量份、43重量份、48重量份等,較佳為40重量份以下,更佳為20~30重量份。
理想地,以組分(A)含噁唑烷酮結構的環氧樹脂、組分(B)活性酯固化劑及組分(C)固化促進劑添加量之和為100重量份計,前述阻燃劑的添加量為5~50重量份,例如5重量份、10重量份、15重量份、25重量份、30重量份、35重量份、40重量份或45重量份等。
理想地,前述含溴阻燃劑選自十溴二苯乙烷、溴化聚苯乙
烯、乙撐雙四溴鄰苯二甲醯亞胺或含溴環氧樹脂中的任意1種或者至少2種的混合物。
理想地,前述無鹵阻燃劑為三(2,6-二甲基苯基)膦、10-(2,5-二羥基苯基)-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、2,6-二(2,6-二甲基苯基)膦基苯、10-苯基-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、苯氧基膦腈化合物、硼酸鋅、氮磷系膨脹型、有機聚合物阻燃劑、含磷酚醛樹脂或含磷雙馬來醯亞胺、聚膦酸酯、膦酸酯與碳酸酯的共聚物中的任意1種或者至少2種的混合物。
理想地,如有需要,前述環氧樹脂組合物進一步包含填料,前述填料為有機填料或/及無機填料,其主要用來調整組合物的一些物性效果,如降低熱膨脹係數(CTE)、降低吸水率及提高熱導率等。
理想地,以組分(A)含噁唑烷酮結構的環氧樹脂、組分(B)活性酯固化劑及組分(C)固化促進劑的添加量之和為100重量份計,前述填料的添加量為100重量份以下,較佳為50重量份以下,例如為0.5重量份、1重量份、5重量份、10重量份、15重量份、20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份、85重量份、90重量份或95重量份等,更佳為20~40重量份。
理想地,前述無機填料選自熔融二氧化矽、結晶型二氧化矽、球型二氧化矽、空心二氧化矽、氫氧化鋁、氧化鋁、滑石粉、氮化鋁、氮化硼、碳化矽、硫酸鋇、鈦酸鋇、鈦酸鍶、碳酸鈣、矽酸鈣、雲母或玻璃纖維粉中的任意一種或者至少兩種的混合物。前述混合物例如熔融二氧
化矽及結晶型二氧化矽的混合物,球型二氧化矽及空心二氧化矽的混合物,氫氧化鋁及氧化鋁的混合物,滑石粉及氮化鋁的混合物,氮化硼及碳化矽的混合物,硫酸鋇及鈦酸鋇的混合物,鈦酸鍶及碳酸鈣的混合物,矽酸鈣、雲母及玻璃纖維粉的混合物,熔融二氧化矽、結晶型二氧化矽及球型二氧化矽的混合物,空心二氧化矽、氫氧化鋁及氧化鋁的混合物,滑石粉、氮化鋁及氮化硼的混合物,碳化矽、硫酸鋇及鈦酸鋇的混合物,鈦酸鍶、碳酸鈣、矽酸鈣、雲母及玻璃纖維粉的混合物。
理想地,前述有機填料選自聚四氟乙烯粉末、聚苯硫醚或聚醚碸粉末中的任意一種或者至少兩種的混合物。前述混合物例如聚四氟乙烯粉末及聚苯硫醚的混合物,聚醚碸粉末及聚四氟乙烯粉末的混合物,聚苯硫醚及聚醚碸粉末的混合物,聚四氟乙烯粉末、聚苯硫醚及聚醚碸粉末的混合物。
理想地,前述填料為二氧化矽,填料的粒徑中度值為1~15μm,優選填料的粒徑中度值為1~10μm。
本發明前述的“包括”,意指其除前述組份外,還可以包括其他組份,這些其他組份賦予前述環氧樹脂組合物不同的特性。除此之外,本發明前述的“包括”,還可以替換為封閉式的“為”或“由......組成”。
例如,前述環氧樹脂組合物還可以含有各種添加劑,作為具體例,可以舉出抗氧劑、熱穩定劑、抗靜電劑、紫外線吸收劑、顏料、著色劑或潤滑劑等。這些各種添加劑可以單獨使用,也可以兩種或者兩種以上混合使用。
本發明的樹脂組合物的常規製作方法:取一容器,先將固體
組分放入,然後加入液體溶劑,攪拌直至完全溶解後,加入液體樹脂、填料、阻燃劑、固化促進劑,繼續攪拌均勻即可,最後用溶劑調整液體固含量至60%~80%而製成膠液。
本發明的目的之二在於提供一種預浸料,其包括增強材料及經過含浸乾燥後附著其上的如上前述的環氧樹脂組合物。
示例性的增強材料如無紡織物或/及其他織物,例如天然纖維、有機合成纖維以及無機纖維。
使用該膠液含浸增強材料如玻璃布等織物或有機織物,將含浸好的增強材料在155℃的烘箱中加熱乾燥5~10分鐘即可得到預浸料。
本發明的目的之三在於提供一種層壓板,其包括至少一張如上前述的預浸料。
本發明的目的之四在於提供了一種能夠降低Df值及吸水率的層壓板,前述層壓板含有至少一張如第二方面前述的預浸料;為達到此發明目的,本發明採用以下技術手段:
與現有技術相比,本發明具有以下功效:
(1)本發明的環氧樹脂組合物採用分子結構含有噁唑烷酮結構的環氧樹脂,其在主鏈中引入剛性大的五元環結構,分子鏈剛性大,使固化物具有低膨脹係數。
(2)本發明的環氧樹脂組合物以活性酯作為固化劑,充分發揮了活性酯在與環氧樹脂反應不生成二次羥基等極性基團,使著固化物具有低吸水性。
(3)本發明的環氧組合物利用組分之間相互協同促進作用克服了含噁唑烷酮的環氧樹脂與酚醛固化劑、胺類固化劑等固化劑的組合物體系耐濕熱性能差,介電損耗因子高的缺點,使用該環氧樹脂組合物製作的預浸料、層壓板及印製電路板,具有低熱膨脹係數、低介質損耗因子Df值0.0084、低吸水率吸水率0.46%且耐濕熱性能優異的特點。
以下透過具體實施方式來進一步說明本發明的技術手段。
本領域技術人員應該明瞭,前述實施例僅僅是幫助理解本發明,不應視為對本發明的具體限制。
根據上述所製成的一種環氧樹脂組合物覆金屬箔層壓板,測試其玻璃化轉變溫度、熱分解溫度、熱膨脹係數、介電常數、介質損耗因子因子、PCT及PCT吸水率,如下述實施例加於詳細說明與描述,其中有機樹脂的質量份按有機固形物質量份計。
參照美國專利US5112932中公開的採用傳統環氧樹脂與多異氰酸酯反應製備含噁唑烷酮結構的環氧樹脂的方法合成製備如申請專利範圍第1項所記載之不同結構的環氧樹脂。
合成例1:含雙酚A結構及二苯基甲烷結構環氧樹脂的合成含雙酚A結構及二苯基甲烷結構環氧樹脂的結構如下:
其中,X=,R及R’均為
在裝有攪拌器、溫度計、冷凝回流器的三口瓶(1000mL)中加入400g雙酚A型環氧樹脂,在氮氣保護下升溫至145~150℃,加入2-苯基咪唑(0.175g)後升溫至160℃,在160℃下30min內向上述混合溶液中逐滴加入100g二苯基甲烷二異氰酸酯(MDI),待MDI加入完畢後,在氮氣保護下於160℃恆溫反應15min後停止反應。將反應後的溶液緩慢注入攪拌的蒸餾水中,使聚合物析出,過濾後水洗乾燥,然後再用甲醇浸泡24h後過濾,真空乾燥得到產物。
合成例2:含四溴雙酚A結構及二苯基甲烷結構環氧環氧樹脂的合成
含四溴雙酚A結構及二苯基甲烷結構環氧環氧樹脂的結構如下:
其中,X=,R=R’=
在裝有攪拌器、溫度計、冷凝回流器的三口瓶(1000mL)中加入245g雙酚A型環氧樹脂及185g四溴雙酚A環氧樹脂,在氮氣保護下升溫至145-150℃,加入0.2g 2-苯基咪唑後升溫至160℃,在160℃下30min內向上述混合溶液中逐滴加入90g二苯基甲烷二異氰酸酯(MDI),待MDI加入完畢後,在氮氣保護下於160℃恆溫反應15min後停止反應。將反應後的溶液緩慢注入攪
拌的蒸餾水中,使聚合物析出,過濾後水洗乾燥,然後再用甲醇浸泡24h後過濾,真空乾燥得到產物。
合成例3:含雙酚A結構及2,4-甲苯結構環氧樹脂的合成含雙酚A結構及2,4-甲苯結構環氧樹脂的結構如下:
其中,X=,R及R’均為
在裝有攪拌器、溫度計、冷凝回流器的三口瓶(1000mL)中加入400g雙酚A型環氧樹脂;在氮氣保護下,升溫至135-140℃;加入2-苯基咪唑(0.175g)後升溫至160℃,在160℃下30min內向上述混合溶液中逐滴加入100g甲苯-2,4-二異氰酸酯(TDI),待TDI加入完畢後,在氮氣保護下於160℃恒溫反應15min後停止反應。將反應後的溶液緩慢注入攪拌的蒸餾水中,使聚合物析出,過濾後水洗乾燥,然後再用甲醇浸泡24h後過濾,真空乾燥得到產物。
合成例4:含四溴雙酚A結構及2,4-甲苯結構環氧環氧樹脂的合成
含四溴雙酚A結構及2,4-甲苯結構環氧環氧樹脂如下:
其中,X=,R=,R’=
在裝有攪拌器、溫度計、冷凝回流器的三口瓶(1000mL)中加入245g雙酚A型環氧樹脂及185g四溴雙酚A環氧樹脂,在氮氣保護下升溫至135-140℃,加入2-苯基咪唑(0.2g)後升溫至160℃,在160℃下30min內向上述混合溶液中逐滴加入90g甲苯-2,4-二異氰酸酯(TDI),待TDI加入完畢後,在氮氣保護下於160℃恆溫反應15min後停止反應。將反應後的溶液緩慢注入攪拌的蒸餾水中,使聚合物析出,過濾後水洗乾燥,然後再用甲醇浸泡24h後過濾,真空乾燥得到產物。
取一容器,加入60重量份的合成例1,加入適量的MEK攪拌至完全溶解,隨後加入活性酯、提前溶解好的固化促進劑DMAP,繼續攪拌均勻,最後用溶劑調整液體固含量至60%~80%,從而製成膠液。用玻璃纖維布浸漬上述膠液,並控制至適當厚度,然後烘乾除去溶劑得到預浸料。使用數張所製得的預浸料相互疊合,在其兩側分別壓覆一張RTF銅箔,放進熱壓機中固化製成前述的環氧樹脂覆銅箔層壓板。配方組成及其物性資料如表1所示。
取一容器,加入65重量份的合成例1,加入適量的MEK攪拌至完全溶解,隨後加入活性酯、提前溶解好的固化促進劑DMAP,繼續攪拌均勻,再加入氰酸酯及提前預溶好的異辛酸鋅,最後用溶劑調整液體固含量至
60%~80%,從而製成膠液。用玻璃纖維布浸漬上述膠液,並控制至適當厚度,然後烘乾除去溶劑得到預浸料。使用數張所製得的預浸料相互疊合,在其兩側分別壓覆一張RTF銅箔,放進熱壓機中固化製成前述的環氧樹脂覆銅箔層壓板。配方組成及其物性資料如表1所示。
製作工藝與實施例2相同,配方組成及其物性指標如表1所示
製作工藝與實施例1相同,配方組成及其物性指標如表1所示
取一容器,加入60重量份的合成例1,加入適量的MEK攪拌至完全溶解,隨後加入活性酯、提前溶解好的固化促進劑DMAP,再加如相應比例的填料繼續攪拌均勻,最後用溶劑調整液體固含量至60%~80%,從而製成膠液。用玻璃纖維布浸漬上述膠液,並控制至適當厚度,然後烘乾除去溶劑得到預浸料。使用數張所製得的預浸料相互疊合,在其兩側分別壓覆一張RTF銅箔,放進熱壓機中固化製成前述的環氧樹脂覆銅箔層壓板。配方組成及其物性資料如表1所示。
製作工藝與實施例9相同,配方組成及其物性指標如下表1所示
取一容器,加入65重量份的合成例1,加入適量的MEK攪拌至完全溶解,隨後加入活性酯、提前溶解好的固化促進劑DMAP,繼續攪拌均勻,再加入氰酸酯及提前預溶好的異辛酸鋅,再加入相應比例的填料,最後用溶
劑調整液體固含量至60%~80%,從而製成膠液。用玻璃纖維布浸漬上述膠液,並控制至適當厚度,然後烘乾除去溶劑得到預浸料。使用數張所製得的預浸料相互疊合,在其兩側分別壓覆一張RTF銅箔,放進熱壓機中固化製成前述的環氧樹脂覆銅箔層壓板。配方組成及其物性資料如表1所示。
製作工藝與實施例11相同,配方組成及其物性指標如下表1所示
製作工藝與實施例1相同,配方組成及其物性指標如表2所示。
製作工藝與實施例2相同,配方組成及其物性指標如表2所示。
實施例1~8的配方組成及部分性能測試結果如表1所示;實施例9~14的配方組成及部分性能測試結果如表2所示;實施例1及對比例的配方組成及部分性能測試結果如表3所示;
在表1、表2及表3中,當配方中主體樹脂組分為雙組分時,固化劑比例以環氧樹脂的當量比關係表示;當配方中主體樹脂為多組分(超過兩組分)時,固化劑比例以環氧組分的固體重量比關係表示。
表1及表2列舉的材料具體如下:
環氧樹脂1:聯苯型酚醛環氧樹脂NC-3000H(日本化藥商品名)。
環氧樹脂2:雙環戊二烯型酚醛環氧樹脂HP-7200HHH(日本DIC商品名)。
酚醛樹脂1:線性酚醛固化劑KPH-2002(KOLON商品名)
活性酯:活性酯交聯劑HPC-8000-65T(日本DIC商品名)
氰酸酯:雙酚A型氰酸酯樹脂CE01PS(揚州天啟商品名)。
DMAP:固化促進劑,4-二甲胺基吡啶(廣榮化學商品名)。
異辛酸鋅:固化促進劑,(阿法埃莎商品名)。
以上特性的測試方法如下:
(1)熱膨脹係數(CTE):根據熱機械分析儀(TMA),按照IPC-TM-650 2.4.24.6所規定的TMA方法進行測定。
(2)介電常數和介質損耗因子:按照IPC-TM-6502.5.5.13的方法進行測試,測試頻率為10GHz。
(3)PCT後耐浸焊性評價:將覆銅板表面的銅箔蝕刻後,評價基板;將基板放置壓力鍋中,在120℃、105KPa條件下處理2h;後浸漬在288℃的錫爐中,當基板分層爆板時記錄相應時間;當基板在錫爐中超過5min還沒出現氣泡或分層時即可結束評價。3塊中如有0,1,2,3塊出現氣泡或分層現象記為0/3,1/3,2/3,3/3。
(4)PCT吸水率:將覆銅板表面的銅箔蝕刻後,稱重並記錄為m1,將基板放置壓力鍋中,在120℃、105KPa條件下處理2h後取出,用乾布擦乾試樣後立即稱重,記錄為m2。則PCT吸水率%=(m2-m1)/m1×100%。
(1)實施例2、實施例3及實施例1相比可知,實施例2及實施例3的熱膨脹係數、介質損耗因子比實施例1的更低,但吸水率比實施例1更高,說明氰酸酯的引入可以降低組合物的熱膨脹係數、介質損耗因子但也帶來組合物吸水率地升高。
(2)實施例2及實施例3相比可知,實施例3的熱膨脹係數、介質損耗因子比實施例2的更低,但吸水率高,說明隨著引入氰酸酯含量地提高,組合物具有更低的介電損耗因子及更高的吸水率。
(3)實施例6、實施例7、實施例8與實施例1相比,均具有相近的介電損耗因子及吸水率。但是含有Br元素的組分,其吸水率及介電損耗因子相對較大。此外,含有二苯基甲烷結構的環氧樹脂相對於甲基結構的環氧樹脂具有更好的對稱性,因而具有更低的介電損耗因子。
(4)實施例9~14說明加入填料後組合物的熱膨脹係數及介電損耗因子降低,但吸水率增加,但仍具有良好的耐濕熱性能;相對於熔融矽微粉,球形矽微粉能帶來更低的介電損耗因子及吸水率。
(5)由比較例2及比較例3可知,比較例3中含噁唑烷酮環氧樹脂與酚醛樹脂組合物出現PCT爆板現象,說明其耐濕熱性差,而比較例2中聯苯環氧與酚醛樹脂組合物未出現PCT爆板現象,且相對於比較例3該組合物體系具有更低的介電損耗因子及吸水率;而實施例1及實施例6~8中含噁唑烷酮環氧樹脂與活性酯組合物相對於比較例1中的聯苯環氧與活性酯組合物及比較例4中的雙環戊二烯環氧與活性酯組合物,實施例1及實施例6~8中未出現PCT爆板現象,並且相對於比較例1及比較例4的其他兩類組合
物,含噁唑烷酮環氧樹脂與活性酯組合物具有更低的介電損耗因子及更低的吸水率。由此可知,含噁唑烷酮結構的環氧樹脂與活性酯兩者能夠發揮協同作用,保證組合物相對于使用單一組分的組合物具有更低的介電損耗因子,更低的膨脹係數及吸水率的同時,保證組合物的耐濕熱性能。
(6)將實施例2、實施例3與比較例5、比較例6對比可知,其熱膨脹係數、介質損耗因子及吸水率相對於比較例4、比較例5的要低,說明氰酸酯地引入仍能發揮三者的協同作用,使組合物具有更低的損耗因子,膨脹係數及吸水率。
(7)從實施例1~14可以看出,採用本發明的組合物在PCT後耐浸焊性評價中,所有實驗樣本均不存在分層氣泡及爆板現象,說明其具有優異的耐濕熱性能。
如上前述,與一般的層壓板相比,本發明具有低熱膨脹係數、低介質損耗因子、低吸水率且耐濕熱性能優異的特點。
以上前述,僅為本發明的較佳實施例,對於該領域通常知識者而言,可以根據本發明的技術手段及技術構思做出其他各種相應的改變及變形,而所有這些改變及變形都應屬於本發明申請專利範圍。
申請人聲明,本發明透過上述實施例來說明本發明的詳細方法,但本發明並不局限於上述詳細方法,即不意味著本發明必須依賴上述詳細方法才能實施。所屬技術領域的技術人員應該明瞭,對本發明的任何改進,對本發明產品各原料的等效置換及輔助成分的添加、具體方式的選擇等,均落在本發明的保護範圍及公開範圍之內。
Claims (21)
- 一種環氧樹脂組合物,其特徵係其包括如下組成:(A)含有噁唑烷酮結構的環氧樹脂,其具有式(1)的結構;
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,式(1)之結構中,m=0且n=0,前述組分(A)含有噁唑烷酮結構的環氧樹脂具有式(2)之結構:
- 如申請專利範圍第1或2項所記載之環氧樹脂組合物,其中,式(1)及式(2)中,R及R’各自獨立地選自如下結構中之任意1種:
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述R及R’相同。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述組分(A)含有噁唑烷酮結構之環氧樹脂為具有雙酚A及/或四溴雙酚A結構之含噁唑烷酮結構的環氧樹脂。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述組分(A)含有噁唑烷酮結構的環氧樹脂之環氧當量與組分(B)活性酯固化劑的酯基當量的比值為1:0.9~1.1。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述組分(B)活性酯固化劑是由一種通過脂肪環烴結構連接的酚類化合物、二官能度羧酸芳香族化合物或酸性鹵代物及一種單羥基化合物反應而得。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述組分 (B)活性酯固化劑為包括式(3)結構之活性酯:
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述組分(C)固化促進劑為4-二甲胺基吡啶、2-甲基咪唑、2-乙基4-甲基咪唑或2-苯基咪唑中之任意1種或者至少2種之混合物。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,以組分(A)含有噁唑烷酮結構之環氧樹脂及組分(B)活性酯固化劑添加量之和為100重量份計,前述組分(C)固化促進劑之添加量為0.05~1重量份。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述環氧樹脂組合物進一步包括氰酸酯樹脂;以組分(A)含有噁唑烷酮結構之環氧樹脂、組分(B)活性酯固化劑及組分(C)固化促進劑添加量之和為100重量份計,前述氰酸酯樹脂之添加量為50重量份以下。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述環氧樹脂組合物進一步包括阻燃劑;前述阻燃劑為含溴阻燃劑或/及無鹵阻燃劑;以組分(A)、組分(B)及組分(C)添加量之和為100重量份計,前述阻燃劑的添加量為5~50重量份。
- 如申請專利範圍第12項所記載之環氧樹脂組合物,其中,前述含溴 阻燃劑選自十溴二苯乙烷、溴化聚苯乙烯、乙撐雙四溴鄰苯二甲醯亞胺或含溴環氧樹脂中之任意一種或者至少兩種的混合物。
- 如申請專利範圍第12項所記載之環氧樹脂組合物,其中,前述無鹵阻燃劑為三(2,6-二甲基苯基)膦、10-(2,5-二羥基苯基)-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、2,6-二(2,6-二甲基苯基)膦基苯、10-苯基-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、苯氧基膦腈化合物、硼酸鋅、氮磷系膨脹型、有機聚合物阻燃劑、含磷酚醛樹脂或含磷雙馬來醯亞胺、聚膦酸酯、膦酸酯與碳酸酯的共聚物中之任意1種或者至少2種的混合物。
- 如申請專利範圍第1項所記載之環氧樹脂組合物,其中,前述環氧樹脂組合物進一步包含填料,前述填料為有機填料或/及無機填料;以組分(A)含有噁唑烷酮結構的環氧樹脂、組分(B)活性酯固化劑及組分(C)固化促進劑之添加量之和為100重量份計,前述填料之添加量為100重量份以下。
- 如申請專利範圍第15項所記載之環氧樹脂組合物,其中,前述無機填料選自熔融二氧化矽、結晶型二氧化矽、球型二氧化矽、空心二氧化矽、氫氧化鋁、氧化鋁、滑石粉、氮化鋁、氮化硼、碳化矽、硫酸鋇、鈦酸鋇、鈦酸鍶、碳酸鈣、矽酸鈣、雲母或玻璃纖維粉中之任意一種或者至少兩種之混合物。
- 如申請專利範圍第15項所記載之環氧樹脂組合物,其中,前述有機填料選自聚四氟乙烯粉末、聚苯硫醚或聚醚碸粉末中之任意一種或者至少兩種之混合物。
- 如申請專利範圍第15項所記載之環氧樹脂組合物,其中,前述填料 為二氧化矽,填料的粒徑中度值為1~15μm。
- 一種預浸料,其特徵係包括增強材料及通過含浸乾燥後附著其上的如申請專利範圍第1至18項中任一項所記載之環氧樹脂組合物。
- 一種層壓板,其特徵係包括至少一張如申請專利範圍第19項所記載之預浸料。
- 一種印製電路板,其特徵係包括至少一張如申請專利範圍第19項所記載之層壓板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511019388.0A CN106916282B (zh) | 2015-12-28 | 2015-12-28 | 一种环氧树脂组合物以及使用其的预浸料和层压板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI588204B TWI588204B (zh) | 2017-06-21 |
TW201723069A true TW201723069A (zh) | 2017-07-01 |
Family
ID=59224343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105111251A TWI588204B (zh) | 2015-12-28 | 2016-04-11 | An epoxy resin composition and a prepreg and a laminate using the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US10544255B2 (zh) |
EP (1) | EP3211035B1 (zh) |
CN (1) | CN106916282B (zh) |
AU (1) | AU2016247084B2 (zh) |
TW (1) | TWI588204B (zh) |
WO (1) | WO2017113522A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103834168B (zh) | 2014-02-25 | 2016-09-07 | 广东生益科技股份有限公司 | 一种无卤阻燃型树脂组合物 |
CN105778414B (zh) | 2014-12-26 | 2018-05-29 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
JP6795349B2 (ja) * | 2015-11-10 | 2020-12-02 | Nok株式会社 | キャリアフィルム付きガスケットの取り扱い方法 |
US10899871B2 (en) * | 2019-04-23 | 2021-01-26 | Chang Chun Plastics Co., Ltd. | Phosphorous containing epoxy resins and process for synthesis |
CN112538155A (zh) * | 2020-11-02 | 2021-03-23 | 建滔(江苏)化工有限公司 | 一种含磷无卤环氧树脂及其制备方法和应用 |
Family Cites Families (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH634558A5 (de) | 1978-04-06 | 1983-02-15 | Ciba Geigy Ag | Verfahren zur herstellung von aliphatischen n-substituierten maleinimiden. |
ZA839459B (en) * | 1982-12-30 | 1985-08-28 | Mobil Oil Corp | Polyoxazolidone powder coating compositions |
JPH068298B2 (ja) | 1985-01-21 | 1994-02-02 | 住友化学工業株式会社 | 芳香族系イミドエポキシエ−テル |
US4927736A (en) | 1987-07-21 | 1990-05-22 | Hoechst Celanese Corporation | Hydroxy polyimides and high temperature positive photoresists therefrom |
JPH01319528A (ja) | 1988-06-20 | 1989-12-25 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
GB8912952D0 (en) | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
JPH1152567A (ja) | 1997-08-08 | 1999-02-26 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
GB9827367D0 (en) | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
US6096853A (en) | 1998-12-21 | 2000-08-01 | General Electric Company | Synthesis of phenolic monomers containing imide or diimide moieties and high heat carbonate polymers prepared therefrom |
JP2000186133A (ja) | 1998-12-22 | 2000-07-04 | Mitsui Chemicals Inc | エポキシ樹脂組成物およびその用途 |
JP3721950B2 (ja) | 2000-06-06 | 2005-11-30 | 松下電工株式会社 | エポキシ樹脂組成物、プリプレグ、多層プリント配線板 |
JP2003231753A (ja) | 2001-10-30 | 2003-08-19 | Mitsui Chemicals Inc | 新規ポリイミド、該ポリイミドからなる耐熱性接着剤、ポリイミドフィルム、接着性絶縁テープおよび金属積層体 |
US20040247882A1 (en) * | 2001-11-07 | 2004-12-09 | Shinji Kouchi | Epoxy resin compositions for fiber-reinforced composite materials, process for production of the materials and fiber-reinforced composite materials |
JP4058672B2 (ja) * | 2002-02-28 | 2008-03-12 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物およびその硬化物 |
KR20070009570A (ko) * | 2004-03-02 | 2007-01-18 | 도레이 가부시끼가이샤 | 섬유강화 복합재료용 에폭시 수지 조성물, 프리프레그, 및섬유강화 복합재료 |
CN100560631C (zh) | 2004-06-29 | 2009-11-18 | 旭化成电子材料株式会社 | 阻燃环氧树脂组合物 |
CN100351254C (zh) | 2005-01-13 | 2007-11-28 | 吉林大学 | 含有酰亚胺结构双酚单体的合成方法 |
KR101051865B1 (ko) * | 2006-09-14 | 2011-07-25 | 파나소닉 전공 주식회사 | 프린트 배선판용 에폭시 수지 조성물, 수지 조성물 바니시,프리프레그, 금속 피복 적층체, 프린트 배선판 및 다층 프린트 배선판 |
US20100096173A1 (en) * | 2007-02-23 | 2010-04-22 | Kentaro Fujino | Epoxy resin composition, prepreg, and laminate and printed wiring board |
EP2197929A1 (en) | 2007-10-05 | 2010-06-23 | Dow Global Technologies Inc. | Isocyanate modified epoxy resin and epoxy powder coating composition thereof |
JP5628678B2 (ja) * | 2007-10-31 | 2014-11-19 | ダウ グローバル テクノロジーズ エルエルシー | 融着エポキシ樹脂用の非焼結イソシアネート改質エポキシ樹脂 |
CN101244645B (zh) | 2007-12-07 | 2010-10-13 | 中电电气集团有限公司 | 噁唑烷酮环氧玻璃布层压板的制造方法 |
JP5181769B2 (ja) * | 2008-03-26 | 2013-04-10 | Dic株式会社 | エポキシ樹脂組成物、及びその硬化物 |
JP5304106B2 (ja) | 2008-08-28 | 2013-10-02 | 三菱化学株式会社 | ビスイミドフェノール化合物及びその製造方法 |
JP5304105B2 (ja) | 2008-08-28 | 2013-10-02 | 三菱化学株式会社 | ビスイミドフェノール化合物及びその製造方法 |
JP5655284B2 (ja) | 2008-09-11 | 2015-01-21 | 三菱化学株式会社 | 可溶性イミド骨格樹脂、可溶性イミド骨格樹脂溶液組成物、硬化性樹脂組成物、およびその硬化物 |
JP2010100802A (ja) | 2008-09-24 | 2010-05-06 | Sekisui Chem Co Ltd | エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板 |
CN101695880A (zh) | 2009-10-30 | 2010-04-21 | 衡阳恒缘电工材料有限公司 | 聚噁唑烷酮层压板的生产方法 |
CN105713179A (zh) | 2009-11-12 | 2016-06-29 | 陶氏环球技术有限责任公司 | 聚噁唑烷酮树脂 |
JP2011173827A (ja) | 2010-02-24 | 2011-09-08 | Mitsubishi Chemicals Corp | ビスイミドフェノール誘導体及びその製造方法並びに高分子化合物 |
KR101642518B1 (ko) | 2010-03-29 | 2016-07-26 | 삼성전기주식회사 | 열경화성 조성물 및 그를 이용하는 인쇄회로기판 |
CN102206397B (zh) | 2010-03-29 | 2012-11-28 | 台光电子材料股份有限公司 | 树脂组合物及包含其的半固化胶片、层合板和电路板 |
US20130126217A1 (en) | 2010-04-23 | 2013-05-23 | Panasonic Corporation | Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
CN101831051B (zh) | 2010-05-07 | 2012-01-04 | 黄山市善孚化工有限公司 | 含萘环、双环戊二烯环和酰亚胺结构的耐高温环氧树脂及其制备方法 |
CN102399415B (zh) | 2010-09-14 | 2014-03-26 | 联茂电子股份有限公司 | 预浸体组合物及应用该预浸体组合物所制成的胶片和基板 |
US20120129414A1 (en) * | 2010-11-24 | 2012-05-24 | Chung-Hao Chang | Thermosetting resin composition and prepreg or laminate using the same |
US8663803B2 (en) | 2010-11-29 | 2014-03-04 | Iteq Corporation | Varnish composition, and pre-impregnated manufacture thereof |
CN102051022A (zh) * | 2010-12-09 | 2011-05-11 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与层压板 |
CN102134375B (zh) | 2010-12-23 | 2013-03-06 | 广东生益科技股份有限公司 | 无卤高Tg树脂组合物及用其制成的预浸料与层压板 |
KR101236642B1 (ko) | 2011-01-06 | 2013-02-22 | 주식회사 두산 | 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 |
KR101868190B1 (ko) | 2011-03-16 | 2018-06-15 | 도레이 카부시키가이샤 | 에폭시 수지 조성물 및 그의 제조 방법 및 그것을 사용한 반도체 장치 |
US20140037939A1 (en) * | 2011-04-27 | 2014-02-06 | Toray Industries, Inc. | Prepreg and fiber reinforced composite material, and process for producing prepreg |
CN102977551B (zh) | 2011-09-02 | 2014-12-10 | 广东生益科技股份有限公司 | 无卤树脂组合物以及使用其制作覆铜板的方法 |
WO2013056411A1 (zh) * | 2011-10-18 | 2013-04-25 | 广东生益科技股份有限公司 | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 |
CN102443138A (zh) * | 2011-10-18 | 2012-05-09 | 广东生益科技股份有限公司 | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 |
CN102516541B (zh) | 2011-11-22 | 2013-08-07 | 中国航空工业集团公司北京航空材料研究院 | 一种含酚羟基的聚酰亚胺 |
US9005761B2 (en) | 2011-12-22 | 2015-04-14 | Elite Material Co., Ltd. | Halogen-free resin composition and its application for copper clad laminate and printed circuit board |
CN102558858B (zh) | 2011-12-22 | 2014-03-26 | 云南云天化股份有限公司 | 覆铜层压板用树脂组合物及半固化片 |
CN103421273B (zh) | 2012-05-22 | 2016-02-10 | 中山台光电子材料有限公司 | 无卤素树脂组成物 |
CN102732029B (zh) | 2012-06-21 | 2014-01-08 | 广东生益科技股份有限公司 | 无卤树脂组合物及粘结片与覆铜箔层压板 |
CN102850722B (zh) * | 2012-09-07 | 2015-08-19 | 广东生益科技股份有限公司 | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 |
WO2014040261A1 (zh) * | 2012-09-14 | 2014-03-20 | 广东生益科技股份有限公司 | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 |
CN102850545A (zh) | 2012-10-10 | 2013-01-02 | 四川大学 | 一种高韧性高耐热性聚苯并噁嗪/双马来酰亚胺共混树脂及其制备方法 |
TWI572665B (zh) * | 2012-10-17 | 2017-03-01 | Dainippon Ink & Chemicals | 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜 |
BR112015010973A2 (pt) * | 2012-11-14 | 2017-08-29 | Bayer Materialscience Ag | Método para a produção de compostos de oxazolidinona |
JP6314456B2 (ja) | 2012-12-06 | 2018-04-25 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 |
US20140228483A1 (en) * | 2013-02-13 | 2014-08-14 | Momentive Specialty Chemicals Inc. | Compositions useful for preparing composites and composites produced therewith |
WO2014148538A1 (ja) * | 2013-03-22 | 2014-09-25 | 日本ゼオン株式会社 | 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体 |
JP6278951B2 (ja) * | 2013-03-29 | 2018-02-14 | Jxtgエネルギー株式会社 | プリプレグ、繊維強化複合材料及び粒子含有樹脂組成物 |
CN103265791B (zh) | 2013-05-29 | 2015-04-08 | 苏州生益科技有限公司 | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 |
CN103382242B (zh) | 2013-06-25 | 2015-06-24 | 江苏雅克科技股份有限公司 | 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物 |
CN103540220A (zh) * | 2013-09-26 | 2014-01-29 | 上海海隆石油化工研究所 | 一种管道用耐磨型环氧粉末涂料 |
CN103834168B (zh) | 2014-02-25 | 2016-09-07 | 广东生益科技股份有限公司 | 一种无卤阻燃型树脂组合物 |
WO2015179232A1 (en) * | 2014-05-21 | 2015-11-26 | Icl-Ip America Inc. | Halogen-free active ester curing agent compound for epoxy resins, flame retardant composition comprising same, articles made therefrom and method of making said compound |
CN103992621B (zh) | 2014-06-04 | 2016-06-01 | 苏州生益科技有限公司 | 一种热固性树脂组合物及使用其制作的半固化片和层压板 |
CN107266639B (zh) | 2014-08-15 | 2019-08-27 | 江苏雅克科技股份有限公司 | 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物 |
CN105778414B (zh) | 2014-12-26 | 2018-05-29 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
CN105778413B (zh) | 2014-12-26 | 2018-11-27 | 广东生益科技股份有限公司 | 一种无卤环氧树脂组合物以及使用它的预浸料和层压板 |
CN105295041B (zh) | 2015-12-03 | 2017-07-25 | 苏州太湖电工新材料股份有限公司 | 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用 |
CN105440263A (zh) | 2015-12-15 | 2016-03-30 | 广东广山新材料有限公司 | 一种环氧树脂固化剂及其制备方法和用途 |
CN105482076A (zh) | 2015-12-15 | 2016-04-13 | 广东广山新材料有限公司 | 一种异氰酸酯改性环氧树脂及用途 |
-
2015
- 2015-12-28 CN CN201511019388.0A patent/CN106916282B/zh active Active
-
2016
- 2016-03-29 US US15/305,759 patent/US10544255B2/en not_active Expired - Fee Related
- 2016-03-29 EP EP16785078.3A patent/EP3211035B1/en active Active
- 2016-03-29 AU AU2016247084A patent/AU2016247084B2/en not_active Ceased
- 2016-03-29 WO PCT/CN2016/077730 patent/WO2017113522A1/zh active Application Filing
- 2016-04-11 TW TW105111251A patent/TWI588204B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN106916282A (zh) | 2017-07-04 |
AU2016247084B2 (en) | 2018-03-15 |
EP3211035A4 (en) | 2018-01-10 |
US10544255B2 (en) | 2020-01-28 |
CN106916282B (zh) | 2019-07-26 |
WO2017113522A1 (zh) | 2017-07-06 |
EP3211035B1 (en) | 2020-01-15 |
US20180016387A1 (en) | 2018-01-18 |
AU2016247084A1 (en) | 2017-07-13 |
TWI588204B (zh) | 2017-06-21 |
EP3211035A1 (en) | 2017-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7232915B2 (ja) | 熱硬化性樹脂組成物、並びにそれを含むプリプレグ、金属箔張積層板および印刷回路基板 | |
TWI588204B (zh) | An epoxy resin composition and a prepreg and a laminate using the same | |
CN106700548B (zh) | 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板 | |
KR101738291B1 (ko) | 시아네이트 수지 조성물 및 그 용도 | |
WO2016101539A1 (zh) | 一种环氧树脂组合物以及使用它的预浸料和层压板 | |
TWI619766B (zh) | Halogen-free thermosetting resin composition and laminate for use thereof and prepreg and printed circuit board | |
CN108250675A (zh) | 一种含磷活性酯及其无卤组合物与覆铜箔基板 | |
TWI579332B (zh) | 一種環氧樹脂組合物以及含有其之預浸料、層壓板及印刷電路板 | |
CN109988298A (zh) | 一种改性聚苯醚树脂、热固性树脂组合物及其用途 | |
CN112250865A (zh) | 改性马来酰亚胺树脂预聚物及其制备方法、树脂组合物、半固化片、层压板和印刷电路板 | |
CN103724999A (zh) | 一种氰酸酯树脂组合物及其用途 | |
JP2019531262A (ja) | リン含有活性エステル、そのノンハロゲン組成物及び銅張積層板 | |
CN108047718A (zh) | 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板 | |
TW201420675A (zh) | 氰酸酯樹脂組合物及使用其製作的預浸料、層壓材料與覆金屬箔層壓材料(一) | |
ES2740952T3 (es) | Composición de resina epoxi y sustrato de circuito electrónico de alta frecuencia fabricado usando la misma | |
TW201420676A (zh) | 氰酸酯樹脂組合物及使用其製作的預浸料、層壓材料與覆金屬箔層壓材料(二) | |
TWI648336B (zh) | Halogen-free epoxy resin composition and prepreg and laminate using the same | |
CN108117723A (zh) | 一种热固性树脂组合物及使用它的预浸料和印制电路用层压板 | |
KR20160097278A (ko) | 열경화성 에폭시 수지 조성물 및 그 용도 | |
CN109661422B (zh) | 用于半导体封装的树脂组合物、使用其的预浸料和金属包层层合体 | |
TWI617614B (zh) | Epoxy resin composition and prepreg and copper clad laminate prepared using same | |
KR20160007600A (ko) | 시아네이트 수지 조성물 및 그 용도 | |
TWI710596B (zh) | 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |