TWI710596B - 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板 - Google Patents

一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板 Download PDF

Info

Publication number
TWI710596B
TWI710596B TW108119832A TW108119832A TWI710596B TW I710596 B TWI710596 B TW I710596B TW 108119832 A TW108119832 A TW 108119832A TW 108119832 A TW108119832 A TW 108119832A TW I710596 B TWI710596 B TW I710596B
Authority
TW
Taiwan
Prior art keywords
weight
parts
resin
resin composition
epoxy resin
Prior art date
Application number
TW108119832A
Other languages
English (en)
Other versions
TW201936777A (zh
Inventor
何烈相
曾耀德
楊中強
楊宇
潘華林
許永靜
Original Assignee
大陸商廣東生益科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商廣東生益科技股份有限公司 filed Critical 大陸商廣東生益科技股份有限公司
Publication of TW201936777A publication Critical patent/TW201936777A/zh
Application granted granted Critical
Publication of TWI710596B publication Critical patent/TWI710596B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B32B5/265—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary characterised by one fibrous or filamentary layer being a non-woven fabric layer
    • B32B5/266—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary characterised by one fibrous or filamentary layer being a non-woven fabric layer next to one or more non-woven fabric layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/527—Cyclic esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供了一種樹脂組合物以及包含其的預浸料、層壓板和印刷電路板。該樹脂組合物包含：48-54重量份的無鹵環氧樹脂；16-31重量份的由式（I）表示的化合物，其中n為2-15，Ac表示乙醯基；和15-32重量份的氰酸酯樹脂。採用該樹脂組合物製成的預浸料、層壓板和印刷電路板具有低熱膨脹係數。

Description

一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板
本發明屬於印刷電路板技術領域，具體涉及一種樹脂組合物和包含其的預浸料以及層壓板和印刷電路板。
近年來，資訊通訊設備變得具有更高性能、更多功能並且可以在網路中工作。為了高速傳輸及處理大容量資訊，操作信號趨向於高頻化。同時，為了滿足各類電子產品的發展要求，電路板向著更多層、更高佈線密度的方向發展。這就要求基板材料不僅具有良好的介電常數和介質損耗因數來滿足信號高頻傳輸的需要，而且要求其具有良好的耐熱性來滿足多層印刷電路板可靠性的需求。特別地，基板材料需要有儘量低的熱膨脹係數。
樹脂預浸料常在印刷電路板中作為基板材料。為此，已經開發了一些樹脂組合物，其中採用氰酸酯和活性酯作為複合固化劑固化聯苯型酚醛環氧樹脂、亞芳烷基環氧樹脂或萘酚環氧樹脂。不過，上述樹脂組合物的熱膨脹係數（CTE）仍有待提高。
在一個方面，本發明提供一種樹脂組合物，其特徵在於，所述樹脂組合物包含： 無鹵環氧樹脂：48-54重量份； 由式（I）表示的化合物：16-31重量份，
Figure 02_image001
（I） 其中n為2-15，Ac表示乙醯基；和 氰酸酯樹脂：15-32重量份。
可選地，所述無鹵環氧樹脂選自由以下各項組成的組：聯苯酚醛環氧樹脂、DCPD型酚醛環氧樹脂、亞烷基酚醛環氧樹脂、雙酚A型酚醛環氧樹脂、雙酚AP型環氧樹脂、雙酚TMC型環氧樹脂、和它們的組合。
可選地，所述樹脂組合物包含16-22重量份的所述由式（I）表示的化合物，25-32重量份的所述氰酸酯樹脂。
可選地，所述氰酸酯樹脂選自由以下各項組成的組：雙酚A型氰酸酯樹脂、雙酚F型氰酸酯樹脂、雙環戊二烯型氰酸酯樹脂、苯酚酚醛型氰酸酯樹脂、和它們的組合。
可選地，所述樹脂組合物還包括固化促進劑。
可選地，所述樹脂組合物還包括無鹵阻燃劑。
可選地，所述樹脂組合物還包含填料。
在另一個方面，本發明提供一種預浸料，所述預浸料是通過對增強材料浸漬或塗佈根據上述樹脂組合物並將其半固化得到的。
在另一個方面，本發明提供一種層壓板，其包含至少一張如上述的預浸料。
在另一個方面，本發明提供一種印刷電路板，其包含至少一張如上所述的預浸料或層壓板。
本發明的目的在於提供一種樹脂組合物。使用該樹脂組合物製備的預浸料、層壓板和印刷電路板，具有低熱膨脹係數。
本發明的發明人出人意料地發現，使用由式（I）表示的化合物代替活性酯樹脂與氰酸酯一起作為複合固化劑，與無鹵環氧樹脂組合，可以得到具有低的熱膨脹係數的環氧樹脂體系。
一種環氧樹脂組合物，其包括如下組分： 無鹵環氧樹脂：48-54重量份； 由式（I）表示的化合物：16-31重量份，
Figure 02_image001
（I） 其中n為2-15，Ac表示乙醯基；和 氰酸酯樹脂：15-32重量份。
本發明利用上述三種必要組分之間的相互配合以及相互協同促進作用，得到了如上的樹脂組合物。採用該樹脂組合物製成的預浸料、層壓板以及印刷電路板，具有低熱膨脹係數。
無鹵環氧樹脂成分中是不含鹵素的環氧樹脂。本發明對無鹵環氧樹脂的種類沒有特別的限定。
無鹵環氧樹脂的量為48-54重量份，例如48重量份、49重量份、50重量份、51重量份、53重量份或54重量份。
優選地，所述無鹵環氧樹脂選自由以下各項組成的組：聯苯酚醛環氧樹脂、DCPD型酚醛環氧樹脂、亞烷基酚醛環氧樹脂、雙酚A型酚醛環氧樹脂、雙酚AP型環氧樹脂、雙酚TMC型環氧樹脂、和它們的組合。這些無鹵環氧樹脂的優點在於具有低的熱膨脹係數。
優選地，由式（I）表示的化合物可以為16-22重量份，例如16重量份、18重量份、20重量份或22重量份；所述氰酸酯樹脂可以為25-32重量份，例如25重量份、26重量份、28重量份、30重量份或32重量份。選用以上組分可以很好地降低無鹵環氧樹脂組合物的熱膨脹係數。
由式（I）表示的化合物的聚合度n為2-15，n可以為例如3、7、11或15。在本發明中，組合物中由式（I）表示的化合物中n可以不為整數，其表示由式（I）表示的化合物的平均聚合度。例如，當組合物中的由式（I）表示的化合物中的一半數量具有3個重複單元且另一半數量具有4個重複單元時，可以認為n=3.5。當平均聚合度小於2時，組合物固化後熱學性能差。而當平均聚合度大於15時，組合物的浸潤性差，影響層壓板或印刷電路板的性能。式（I）表示的化合物的數均分子量相應地為約1300至7800。
優選地，所述氰酸酯樹脂選自由以下各項組成的組：雙酚A型氰酸酯樹脂、雙酚F型氰酸酯樹脂、雙環戊二烯型氰酸酯樹脂、苯酚酚醛型氰酸酯樹脂、和它們的組合。選用這些氰酸酯樹脂的優點在於具有更低的熱膨脹係數。
優選地，所述樹脂組合物還可進一步包括固化促進劑，其使樹脂固化並加快樹脂固化速度。以無鹵環氧樹脂、由式（I）表示的化合物和氰酸酯樹脂的總量為100重量份計，所述固化促進劑的量為0.05-1重量份，例如0.08重量份、0.1重量份、0.15重量份、0.2重量份、0.25重量份、0.3重量份、0.35重量份、0.4重量份、0.45重量份、0.5重量份、0.55重量、0.60重量份、0.65重量份、0.7重量份、0.75重量份、0.8重量份、0.85重量份、0.9重量份或0.95重量份。
優選地，所述固化促進劑選自由以下各項組成的組：異辛酸鋅、4-二甲氨基吡啶、2-甲基咪唑、2-乙基4-甲基咪唑、2-苯基咪唑、和它們的組合。
優選地，如有需要，所述環氧樹脂組合物還包括阻燃劑，使環氧樹脂樹脂組合物具有阻燃特性，符合UL 94 V-0要求。對視需要而添加的阻燃劑並無特別限定。優選地，該阻燃劑為無鹵阻燃劑。
阻燃劑的量根據固化產物達到UL 94 V-0級別要求而定，並無特別的限定。優選地，以無鹵環氧樹脂、由式（I）表示的化合物和氰酸酯樹脂的總量為100重量份計，所述阻燃劑的量為5-50重量份，例如5重量份、10重量份、15重量份、25重量份、30重量份、35重量份、40重量份或45重量份。
優選地，所述無鹵阻燃劑選自由以下各項組成的組：三（2,6-二甲基苯基）膦、10-（2,5-二羥基苯基）-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、2,6-二（2,6-二甲基苯基）膦基苯、10-苯基-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、苯氧基膦腈化合物、硼酸鋅、氮磷系膨脹型、有機聚合物無鹵阻燃劑、含磷酚醛樹脂、和它們的組合。
優選地，如有需要，所述樹脂組合物還包含填料，所述填料為有機填料和/或無機填料，其主要用來調整環氧樹脂組合物的一些物性效果，如進一步降低熱膨脹係數（CTE）、降低吸水率和提高熱導率等。
填料的添加量並無特別限定。優選地，以無鹵環氧樹脂、由式（I）表示的化合物和氰酸酯樹脂的總量為100重量份計，所述填料的量為100重量份以下，優選50重量份以下。所述填料的量例如為0.5重量份、1重量份、5重量份、10重量份、15重量份、20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份、85重量份、90重量份或95重量份。
優選地，所述無機填料選自由以下各項組成的組：熔融二氧化矽、結晶型二氧化矽、球型二氧化矽、空心二氧化矽、氫氧化鋁、氧化鋁、滑石粉、氮化鋁、氮化硼、碳化矽、硫酸鋇、鈦酸鋇、鈦酸鍶、碳酸鈣、矽酸鈣、雲母、玻璃纖維粉、和它們的組合。它們的組合例如熔融二氧化矽和結晶型二氧化矽的混合物，球型二氧化矽和空心二氧化矽的混合物，氫氧化鋁和氧化鋁的混合物，滑石粉和氮化鋁的混合物，氮化硼和碳化矽的混合物，硫酸鋇和鈦酸鋇的混合物，鈦酸鍶和碳酸鈣的混合物，矽酸鈣、雲母和玻璃纖維粉的混合物，熔融二氧化矽、結晶型二氧化矽和球型二氧化矽的混合物，空心二氧化矽、氫氧化鋁和氧化鋁的混合物，滑石粉、氮化鋁和氮化硼的混合物，碳化矽、硫酸鋇和鈦酸鋇的混合物，鈦酸鍶、碳酸鈣、矽酸鈣、雲母和玻璃纖維粉的混合物。
優選地，所述有機填料選自由以下各項組成的組：聚四氟乙烯粉末、聚苯硫醚、聚醚碸粉末、和它們的組合。它們的組合例如聚四氟乙烯粉末和聚苯硫醚的混合物，聚醚碸粉末和聚四氟乙烯粉末的混合物，聚苯硫醚和聚醚碸粉末的混合物，聚四氟乙烯粉末、聚苯硫醚和聚醚碸粉末的混合物。
優選地，所述填料為二氧化矽，填料的粒徑中度值為0.1-15μm，優選填料的粒徑中度值為0.1-10μm。
本發明所述的“包含”，意指其除所述組分外，還可以包含其他組分，這些其他組分賦予所述樹脂組合物不同的特性。除此之外，本發明所述的“包含”，還可以替換為封閉式的“為”或“由……組成”。
例如，所述樹脂組合物還可以含有各種添加劑，作為具體例，可以舉出抗氧劑、熱穩定劑、抗靜電劑、紫外線吸收劑、顏料、著色劑或潤滑劑等。這些各種添加劑可以單獨使用，也可以兩種或者兩種以上混合使用。
本發明的樹脂組合物的常規製作方法是：取一容器，先將固體組分放入，然後加入溶劑，攪拌直至完全溶解後，再加入液體樹脂、填料、阻燃劑和固化促進劑，繼續攪拌均勻即可，最後用溶劑調整液體固含量至60%-80%而製成膠液。
本發明的目的之二在於提供一種預浸料，其包含增強材料及通過含浸乾燥後附著其上的如上所述的環氧樹脂組合物。
示例性的增強材料如無紡織物和/或其他織物，例如天然纖維、有機合成纖維以及無機纖維。
使用該膠液含浸增強材料如玻璃布等織物或有機織物，將含浸好的增強材料在155-170℃的烘箱中加熱乾燥5-10分鐘即可得到預浸料。
本發明的目的之三在於提供一種層壓板，其包含至少一張如上所述的預浸料。
本發明的目的之四在於提供一種印刷電路板，其包含至少一張如上所述的預浸料或層壓板。
本發明利用上述三種必要組分之間的相互配合以及相互協同促進作用，得到了如上的樹脂組合物。採用該樹脂組合物製成的預浸料、層壓板以及印刷電路板，具有低熱膨脹係數。
下面通過具體實施例來進一步說明本發明的技術方案。
根據上述所製成的樹脂組合物覆金屬箔層壓板，測試其熱膨脹係數，如下述實施例加以詳細說明與描述，其中有機樹脂的重量份按有機固形物重量份計。
本發明實施例中所用列舉的材料具體如下：
KES-7695M75：含有DCPD結構的環氧樹脂（得自KOLON）。
NC-3000H：聯苯型酚醛環氧樹脂（得自日本化藥）。
E15-152T：由式（I）表示的化合物（得自ICL），其中n為約3.0。
HM1100：膦酸酯聚合物（得自FRX Polymers公司）。
HPC-8000-65T：活性酯樹脂（得自日本DIC）。
CE01PS：雙酚A型氰酸酯樹脂（得自揚州天啟）。
PT60S：酚醛型氰酸酯樹脂（得自LONZA）。
DMAP：固化促進劑，4-二甲氨基吡啶（得自廣榮化學）。
異辛酸鋅：固化促進劑（得自阿法埃莎）。
熱膨脹係數（CTE）的測試方法如下：根據熱機械分析儀（TMA），按照IPC-TM-650 2.4.24.6所規定的TMA方法進行測定。
實施例1
取一容器，加入54重量份的環氧樹脂KES-7695M75和31重量份的由式（I）表示的化合物E15-152T，加入適量的甲基乙基酮（MEK）和二甲基甲醯胺（DMF）攪拌至完全溶解，隨後加入15重量份的氰酸酯樹脂CE01PS、提前溶解好的固化促進劑DMAP和異辛酸鋅，繼續攪拌均勻，最後用溶劑調整液體固含量至70%，從而製成膠液。用玻璃纖維布浸漬上述膠液，並控制至適當厚度，然後烘乾除去溶劑得到預浸料。使用6張所製得的預浸料相互疊合，在其兩側分別壓覆一張銅箔，放進熱壓機中固化製成所述的環氧樹脂覆銅箔層壓板。物性數據如表1所示。
實施列2-7
製作工藝和實施例1相同，配方組成及其物性指標如表1所示。
比較例1-7
製作工藝與實施例1相同，配方組成及其物性指標如表1所示。
表1各實施例的配方組成及其物性資料
Figure 108119832-A0304-0001
註：表中皆以固體組分重量份計。
實施例1-7相比於比較例1-3，其各組分含量均在本發明限定的範圍內，特定含量比例的環氧樹脂、氰酸酯與由式（I）表示的化合物具有協同作用，具有更優的熱膨脹係數。實施例4-7的組分含量均在本發明優選的範圍內，相比於其他實施例具有更低的熱膨脹係數。
比較例4-7不使用具有式（I）表示的化合物，也能實現固化和阻燃的作用，但其熱膨脹係數最高可達到3.7%。
因此，本發明的樹脂組合物提供了具有低熱膨脹係數的包含氰酸酯的環氧樹脂。相應地，本發明的預浸料、層壓板和印刷電路板也具有低熱膨脹係數。
顯然，本領域的技術人員可以對本發明實施例進行各種改動和變型而不脫離本發明的精神和範圍。這樣，倘若本發明的這些修改和變型屬於本發明申請專利範圍及其等同技術的範圍之內，則本發明也意圖包含這些改動和變型在內。
Figure 108119832-A0101-11-0001-2

Claims (9)

  1. 一種樹脂組合物，其特徵在於，所述樹脂組合物包含：無鹵環氧樹脂：48-54重量份；由式(I)表示的化合物：16-31重量份，
    Figure 108119832-A0305-02-0012-1
     其中n為2-15，Ac表示乙醯基；和氰酸酯樹脂：15-32重量份，其中所述氰酸酯樹脂選自由以下各項組成的組：雙酚A型氰酸酯樹脂、雙酚F型氰酸酯樹脂、雙環戊二烯型氰酸酯樹脂、苯酚酚醛型氰酸酯樹脂、和它們的組合。
  2. 如請求項1所述的樹脂組合物，其中所述無鹵環氧樹脂選自由以下各項組成的組：聯苯酚醛環氧樹脂、DCPD型酚醛環氧樹脂、亞烷基酚醛環氧樹脂、雙酚A型酚醛環氧樹脂、雙酚AP型環氧樹脂、雙酚TMC型環氧樹脂、和它們的組合。
  3. 如請求項1所述的樹脂組合物，其中所述樹脂組合物包含16-22重量份的所述由式(I)表示的化合物，25-32重量份的所述氰酸酯樹脂。
  4. 如請求項1所述的樹脂組合物，所述樹脂組合物還包括固化促進劑。
  5. 如請求項1所述的樹脂組合物，所述樹脂組合物還包括無鹵阻燃劑。
  6. 如請求項1所述的樹脂組合物，所述樹脂組合物還包含填料。
  7. 一種預浸料，所述預浸料是通過對增強材料浸漬或塗佈根據請求項1所述的樹脂組合物並將其半固化得到的。
  8. 一種層壓板，所述層壓板包含至少一張如請求項7所述的預浸料。
  9. 一種印刷電路板，所述印刷電路板包含：至少一張如請求項7所述的預浸料，或至少一張如請求項8所述的層壓板。
TW108119832A 2019-03-18 2019-06-06 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板 TWI710596B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201910205606.1A CN110016206B (zh) 2019-03-18 2019-03-18 一种树脂组合物、包含其的预浸料以及层压板和印制电路板
CN201910205606.1 2019-03-18
??201910205606.1 2019-03-18

Publications (2)

Publication Number Publication Date
TW201936777A TW201936777A (zh) 2019-09-16
TWI710596B true TWI710596B (zh) 2020-11-21

Family

ID=67189683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119832A TWI710596B (zh) 2019-03-18 2019-06-06 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板

Country Status (8)

Country Link
US (1) US20220135788A1 (zh)
EP (1) EP3943548B1 (zh)
JP (1) JP7270057B2 (zh)
KR (1) KR102623336B1 (zh)
CN (1) CN110016206B (zh)
FI (1) FI3943548T3 (zh)
TW (1) TWI710596B (zh)
WO (1) WO2020186572A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201816006A (zh) * 2016-08-11 2018-05-01 美商Ｉｃｌ Ｉｐ美國股份有限公司 可固化環氧組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100869380B1 (ko) * 2005-08-26 2008-11-19 주식회사 엘지화학 비할로겐계 및 비인계 난연성 수지 조성물, 이를 이용한프리프레그 및 동박 적층판
CN102020830B (zh) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 无卤阻燃性树脂组合物及其应用
CN105283507B (zh) * 2013-06-13 2018-06-05 普立万公司 完全非卤化的阻燃聚碳酸酯配混物
CN103304963B (zh) * 2013-06-20 2015-06-17 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片及层压板
WO2015096116A1 (zh) * 2013-12-27 2015-07-02 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
TWI685540B (zh) * 2014-12-15 2020-02-21 日商迪愛生股份有限公司 熱硬化性樹脂組成物、其硬化物、及用於其之活性酯樹脂
TWI721024B (zh) * 2015-11-13 2021-03-11 美商Ｉｃｌ Ｉｐ美國股份有限公司 用於熱固性樹脂之活性酯類固化劑化合物、包含彼之阻燃劑組成物、及由其所製成之物件
CN106893258B (zh) * 2015-12-17 2019-03-19 广东生益科技股份有限公司 一种环氧树脂组合物以及含有它的预浸料、层压板和印制电路板
JP6808945B2 (ja) * 2016-02-19 2021-01-06 昭和電工マテリアルズ株式会社 多層プリント配線板用の接着フィルム
CN108164685B (zh) * 2016-12-07 2019-08-27 广东生益科技股份有限公司 一种热固性树脂组合物
CN108864410B (zh) * 2017-05-08 2021-05-11 广东生益科技股份有限公司 含有tcpd结构的环氧树脂、环氧树脂组合物、预浸料、层压板和印刷电路板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201816006A (zh) * 2016-08-11 2018-05-01 美商Ｉｃｌ Ｉｐ美國股份有限公司 可固化環氧組成物

Also Published As

Publication number Publication date
US20220135788A1 (en) 2022-05-05
EP3943548A4 (en) 2023-01-04
CN110016206B (zh) 2020-10-27
WO2020186572A1 (zh) 2020-09-24
TW201936777A (zh) 2019-09-16
FI3943548T3 (fi) 2024-02-21
CN110016206A (zh) 2019-07-16
JP2022522845A (ja) 2022-04-20
JP7270057B2 (ja) 2023-05-09
EP3943548B1 (en) 2024-01-10
KR102623336B1 (ko) 2024-01-09
KR20210125053A (ko) 2021-10-15
EP3943548A1 (en) 2022-01-26

Similar Documents

Publication Publication Date Title
JP7232915B2 (ja) 熱硬化性樹脂組成物、並びにそれを含むプリプレグ、金属箔張積層板および印刷回路基板
KR101798810B1 (ko) 무할로겐 에폭시 수지 조성물 및 이를 사용한 프리프레그와 적층판
EP3392286B1 (en) Epoxy resin composition and prepreg, laminated board and printed-circuit board comprising same
AU2016247084B2 (en) An epoxy resin composition, prepreg and laminate prepared therefrom
TWI669340B (zh) 無鹵熱固性樹脂組合物及使用它的預浸料、層壓板、覆金屬箔層壓板和印刷電路板
TWI669329B (zh) 無鹵熱固性樹脂組合物及使用它的預浸料、層壓板、覆金屬箔層壓板和印刷電路板
TWI710596B (zh) 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板
TWI706980B (zh) 一種樹脂組合物、包含其的預浸料以及層壓板和印刷電路板
CN114106514B (zh) 一种环氧树脂组合物、包含其的预浸料以及层压板和印制电路板
CN113121957A (zh) 一种无卤热固性树脂组合物及使用它的预浸料、层压板及印制电路板