TW201241206A - Film-forming apparatus - Google Patents
Film-forming apparatus Download PDFInfo
- Publication number
- TW201241206A TW201241206A TW100147759A TW100147759A TW201241206A TW 201241206 A TW201241206 A TW 201241206A TW 100147759 A TW100147759 A TW 100147759A TW 100147759 A TW100147759 A TW 100147759A TW 201241206 A TW201241206 A TW 201241206A
- Authority
- TW
- Taiwan
- Prior art keywords
- base portion
- film forming
- lower side
- mask
- moving base
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 221
- 239000000758 substrate Substances 0.000 claims abstract description 193
- 238000001704 evaporation Methods 0.000 claims abstract description 100
- 230000008020 evaporation Effects 0.000 claims abstract description 100
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 68
- 238000012546 transfer Methods 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 56
- 230000008878 coupling Effects 0.000 claims description 28
- 238000010168 coupling process Methods 0.000 claims description 28
- 238000005859 coupling reaction Methods 0.000 claims description 28
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 206010036790 Productive cough Diseases 0.000 claims 4
- 210000003802 sputum Anatomy 0.000 claims 4
- 208000024794 sputum Diseases 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 2
- 238000005422 blasting Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 25
- 230000037431 insertion Effects 0.000 description 25
- 230000032258 transport Effects 0.000 description 14
- 230000007723 transport mechanism Effects 0.000 description 13
- 239000012528 membrane Substances 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003708 ampul Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000013643 reference control Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010293492A JP2012140671A (ja) | 2010-12-28 | 2010-12-28 | 成膜装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201241206A true TW201241206A (en) | 2012-10-16 |
Family
ID=46382864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100147759A TW201241206A (en) | 2010-12-28 | 2011-12-21 | Film-forming apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012140671A (enExample) |
| CN (1) | CN103339281A (enExample) |
| TW (1) | TW201241206A (enExample) |
| WO (1) | WO2012090753A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI477627B (zh) * | 2012-11-09 | 2015-03-21 | Sumitomo Heavy Industries | Film forming device |
| TWI688141B (zh) * | 2017-02-24 | 2020-03-11 | 美商應用材料股份有限公司 | 用於一基板載體及一遮罩載體之定位配置、用於一基板載體及一遮罩載體之傳送系統、應用其之真空處理系統、及用於其之方法 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171811A (ja) * | 2012-02-23 | 2013-09-02 | Hitachi High-Technologies Corp | 成膜装置 |
| JP2014025098A (ja) * | 2012-07-25 | 2014-02-06 | Canon Tokki Corp | 蒸着装置 |
| JP6076098B2 (ja) * | 2013-01-15 | 2017-02-08 | 株式会社アルバック | アラインメント装置、及びアラインメント方法 |
| CN103290364B (zh) * | 2013-05-23 | 2015-11-18 | 深圳市生波尔机电设备有限公司 | 连续式真空蒸发镀膜装置 |
| CN105280842B (zh) * | 2014-07-25 | 2017-07-25 | 上海和辉光电有限公司 | 用于在oled制程中量测子像素偏移量的方法 |
| JP6582059B2 (ja) * | 2015-04-01 | 2019-09-25 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | アライナ構造及びアライン方法 |
| CN104862664B (zh) * | 2015-05-19 | 2017-12-01 | 南通大学 | 一种图形化的氧化铝超薄薄膜的制备方法 |
| TW201732997A (zh) * | 2016-01-18 | 2017-09-16 | Ｈｏｙａ股份有限公司 | 基板保持裝置、描繪裝置、光罩檢查裝置、及光罩之製造方法 |
| KR20180100563A (ko) * | 2017-02-03 | 2018-09-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 나란히 있는 기판들을 갖는 연속적인 증발을 위한 장치 및 방법 |
| US20200083452A1 (en) * | 2017-02-24 | 2020-03-12 | Applied Materials, Inc. | Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber |
| KR102111722B1 (ko) * | 2017-03-17 | 2020-05-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법 |
| JP6461235B2 (ja) * | 2017-05-22 | 2019-01-30 | キヤノントッキ株式会社 | 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法 |
| CN109563609B (zh) * | 2017-07-24 | 2021-04-13 | 应用材料公司 | 用于在真空腔室中处理基板的设备与系统和在真空腔室中运输载体的方法 |
| WO2019020166A1 (en) * | 2017-07-24 | 2019-01-31 | Applied Materials, Inc. | APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR ALIGNING A SUBSTRATE CARRIER WITH A MASK CARRIER |
| KR101952521B1 (ko) * | 2017-10-31 | 2019-02-26 | 캐논 톡키 가부시키가이샤 | 성막장치, 성막방법, 및 전자 디바이스 제조방법 |
| CN110557953B (zh) * | 2018-04-03 | 2021-10-29 | 应用材料公司 | 用于在真空腔室中的载体对准的设备和真空系统以及对准载体的方法 |
| WO2019192677A1 (en) * | 2018-04-03 | 2019-10-10 | Applied Materials, Inc. | Carrier for supporting a substrate or a mask |
| US20210328146A1 (en) * | 2018-04-03 | 2021-10-21 | Applied Materials, Inc. | Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier |
| JP2020518122A (ja) * | 2018-04-03 | 2020-06-18 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法 |
| WO2020030252A1 (en) * | 2018-08-07 | 2020-02-13 | Applied Materials, Inc. | Material deposition apparatus, vacuum deposition system and method of processing a large area substrate |
| JP7379072B2 (ja) * | 2019-01-11 | 2023-11-14 | キヤノントッキ株式会社 | 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置 |
| KR102179271B1 (ko) * | 2019-01-11 | 2020-11-16 | 캐논 톡키 가부시키가이샤 | 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법 |
| JP7170016B2 (ja) * | 2020-10-06 | 2022-11-11 | キヤノントッキ株式会社 | 成膜装置 |
| JP7379396B2 (ja) * | 2021-01-08 | 2023-11-14 | キヤノントッキ株式会社 | 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3257056B2 (ja) * | 1992-09-04 | 2002-02-18 | 石川島播磨重工業株式会社 | 真空蒸着装置 |
| TW490714B (en) * | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
| JP2001270691A (ja) * | 2000-03-28 | 2001-10-02 | Shin Meiwa Ind Co Ltd | 物体移送装置 |
| JP2003347047A (ja) * | 2002-05-28 | 2003-12-05 | Sony Corp | 有機膜形成装置 |
| JP2004091913A (ja) * | 2002-07-10 | 2004-03-25 | Sony Corp | 成膜装置および成膜方法 |
| JP2004079349A (ja) * | 2002-08-19 | 2004-03-11 | Sony Corp | 薄膜形成装置 |
| JP4685404B2 (ja) * | 2003-10-15 | 2011-05-18 | 三星モバイルディスプレイ株式會社 | 有機電界発光素子の垂直蒸着方法，その装置，及び有機電界発光素子の垂直蒸着装置に使用される蒸着源 |
| JP2005154903A (ja) * | 2003-11-26 | 2005-06-16 | Samsung Sdi Co Ltd | 蒸着膜形成方法及び蒸着膜形成装置 |
| JP4384109B2 (ja) * | 2005-01-05 | 2009-12-16 | 三星モバイルディスプレイ株式會社 | 蒸着システム用蒸着源の駆動軸及びこれを具備した蒸着システム |
| CN100587103C (zh) * | 2005-08-25 | 2010-02-03 | 日立造船株式会社 | 真空蒸镀用校准装置 |
| KR100729097B1 (ko) * | 2005-12-28 | 2007-06-14 | 삼성에스디아이 주식회사 | 증발원 및 이를 이용한 박막 증착방법 |
| JP2007332458A (ja) * | 2006-05-18 | 2007-12-27 | Sony Corp | 蒸着装置および蒸着源ならびに表示装置の製造方法 |
| JP4705526B2 (ja) * | 2006-06-27 | 2011-06-22 | トッキ株式会社 | アライメント装置及び方法 |
| CN101667630A (zh) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | 有机el设备制造装置和其制造方法以及成膜装置和成膜方法 |
| JP5074368B2 (ja) * | 2008-12-15 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
| TWI401832B (zh) * | 2008-12-15 | 2013-07-11 | Hitachi High Tech Corp | Organic electroluminescent light making device, film forming apparatus and film forming method, liquid crystal display substrate manufacturing apparatus, and calibration apparatus and calibration method |
| JP5337632B2 (ja) * | 2009-02-13 | 2013-11-06 | 株式会社日立ハイテクノロジーズ | 成膜装置及び有機ｅｌデバイス製造装置 |
| JP5277060B2 (ja) * | 2009-04-16 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 真空蒸着装置 |
| JP5452178B2 (ja) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法 |
-
2010
- 2010-12-28 JP JP2010293492A patent/JP2012140671A/ja active Pending
-
2011
- 2011-12-19 WO PCT/JP2011/079329 patent/WO2012090753A1/ja not_active Ceased
- 2011-12-19 CN CN2011800635466A patent/CN103339281A/zh active Pending
- 2011-12-21 TW TW100147759A patent/TW201241206A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI477627B (zh) * | 2012-11-09 | 2015-03-21 | Sumitomo Heavy Industries | Film forming device |
| TWI688141B (zh) * | 2017-02-24 | 2020-03-11 | 美商應用材料股份有限公司 | 用於一基板載體及一遮罩載體之定位配置、用於一基板載體及一遮罩載體之傳送系統、應用其之真空處理系統、及用於其之方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103339281A (zh) | 2013-10-02 |
| JP2012140671A (ja) | 2012-07-26 |
| WO2012090753A1 (ja) | 2012-07-05 |
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