JP2012140671A - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP2012140671A
JP2012140671A JP2010293492A JP2010293492A JP2012140671A JP 2012140671 A JP2012140671 A JP 2012140671A JP 2010293492 A JP2010293492 A JP 2010293492A JP 2010293492 A JP2010293492 A JP 2010293492A JP 2012140671 A JP2012140671 A JP 2012140671A
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JP
Japan
Prior art keywords
film forming
mask
substrate
base portion
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010293492A
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English (en)
Japanese (ja)
Other versions
JP2012140671A5 (enExample
Inventor
Mitsuyuki Tajima
三之 田島
Keiji Uchida
敬自 内田
Masanao Fujitsuka
正直 藤塚
悌二 ▲たか▼橋
Teiji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
Original Assignee
Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2010293492A priority Critical patent/JP2012140671A/ja
Priority to PCT/JP2011/079329 priority patent/WO2012090753A1/ja
Priority to CN2011800635466A priority patent/CN103339281A/zh
Priority to TW100147759A priority patent/TW201241206A/zh
Publication of JP2012140671A publication Critical patent/JP2012140671A/ja
Publication of JP2012140671A5 publication Critical patent/JP2012140671A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2010293492A 2010-12-28 2010-12-28 成膜装置 Pending JP2012140671A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010293492A JP2012140671A (ja) 2010-12-28 2010-12-28 成膜装置
PCT/JP2011/079329 WO2012090753A1 (ja) 2010-12-28 2011-12-19 成膜装置
CN2011800635466A CN103339281A (zh) 2010-12-28 2011-12-19 成膜装置
TW100147759A TW201241206A (en) 2010-12-28 2011-12-21 Film-forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010293492A JP2012140671A (ja) 2010-12-28 2010-12-28 成膜装置

Publications (2)

Publication Number Publication Date
JP2012140671A true JP2012140671A (ja) 2012-07-26
JP2012140671A5 JP2012140671A5 (enExample) 2014-02-20

Family

ID=46382864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010293492A Pending JP2012140671A (ja) 2010-12-28 2010-12-28 成膜装置

Country Status (4)

Country Link
JP (1) JP2012140671A (enExample)
CN (1) CN103339281A (enExample)
TW (1) TW201241206A (enExample)
WO (1) WO2012090753A1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014160744A (ja) * 2013-01-15 2014-09-04 Ulvac Japan Ltd アラインメント装置、及びアラインメント方法
JP2018517054A (ja) * 2015-04-01 2018-06-28 ヴィエヌアイ ソルーション カンパニー リミテッド アライナ構造及びアライン方法
WO2019020167A1 (en) * 2017-07-24 2019-01-31 Applied Materials, Inc. APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR TRANSPORTING A CARRIER IN A VACUUM CHAMBER
WO2019020166A1 (en) * 2017-07-24 2019-01-31 Applied Materials, Inc. APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR ALIGNING A SUBSTRATE CARRIER WITH A MASK CARRIER
JP2019510129A (ja) * 2017-02-03 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 隣り合う基板を有する連続蒸発のための装置及び方法
JP2019081950A (ja) * 2017-10-31 2019-05-30 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイス製造方法
KR20190116970A (ko) * 2018-04-03 2019-10-15 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버에서의 캐리어 정렬을 위한 장치 및 진공 시스템, 및 캐리어의 정렬 방법
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
KR20200087624A (ko) * 2019-01-11 2020-07-21 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
JP2020111824A (ja) * 2019-01-11 2020-07-27 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
JP2022107430A (ja) * 2021-01-08 2022-07-21 キヤノントッキ株式会社 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171811A (ja) * 2012-02-23 2013-09-02 Hitachi High-Technologies Corp 成膜装置
JP2014025098A (ja) * 2012-07-25 2014-02-06 Canon Tokki Corp 蒸着装置
JP5832985B2 (ja) * 2012-11-09 2015-12-16 住友重機械工業株式会社 成膜装置
CN103290364B (zh) * 2013-05-23 2015-11-18 深圳市生波尔机电设备有限公司 连续式真空蒸发镀膜装置
CN105280842B (zh) * 2014-07-25 2017-07-25 上海和辉光电有限公司 用于在oled制程中量测子像素偏移量的方法
CN104862664B (zh) * 2015-05-19 2017-12-01 南通大学 一种图形化的氧化铝超薄薄膜的制备方法
TW201732997A (zh) * 2016-01-18 2017-09-16 Ｈｏｙａ股份有限公司 基板保持裝置、描繪裝置、光罩檢查裝置、及光罩之製造方法
US20200083452A1 (en) * 2017-02-24 2020-03-12 Applied Materials, Inc. Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber
JP6602465B2 (ja) * 2017-02-24 2019-11-06 アプライド マテリアルズ インコーポレイテッド 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法
KR102111722B1 (ko) * 2017-03-17 2020-05-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법
JP6461235B2 (ja) * 2017-05-22 2019-01-30 キヤノントッキ株式会社 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
WO2019192677A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Carrier for supporting a substrate or a mask
US20210328146A1 (en) * 2018-04-03 2021-10-21 Applied Materials, Inc. Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier
JP2020518122A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法
JP7170016B2 (ja) * 2020-10-06 2022-11-11 キヤノントッキ株式会社 成膜装置

Citations (6)

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JPH0688233A (ja) * 1992-09-04 1994-03-29 Ishikawajima Harima Heavy Ind Co Ltd 真空蒸着装置
JP2001270691A (ja) * 2000-03-28 2001-10-02 Shin Meiwa Ind Co Ltd 物体移送装置
JP2004091913A (ja) * 2002-07-10 2004-03-25 Sony Corp 成膜装置および成膜方法
JP2005120476A (ja) * 2003-10-15 2005-05-12 Samsung Sdi Co Ltd 有機電界発光素子の垂直蒸着方法，その装置，及びそれに使用される蒸着源
JP2010140840A (ja) * 2008-12-15 2010-06-24 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びに液晶表示基板製造装置
JP2010248584A (ja) * 2009-04-16 2010-11-04 Hitachi High-Technologies Corp 真空蒸着装置

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TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
JP2003347047A (ja) * 2002-05-28 2003-12-05 Sony Corp 有機膜形成装置
JP2004079349A (ja) * 2002-08-19 2004-03-11 Sony Corp 薄膜形成装置
JP2005154903A (ja) * 2003-11-26 2005-06-16 Samsung Sdi Co Ltd 蒸着膜形成方法及び蒸着膜形成装置
JP4384109B2 (ja) * 2005-01-05 2009-12-16 三星モバイルディスプレイ株式會社 蒸着システム用蒸着源の駆動軸及びこれを具備した蒸着システム
CN100587103C (zh) * 2005-08-25 2010-02-03 日立造船株式会社 真空蒸镀用校准装置
KR100729097B1 (ko) * 2005-12-28 2007-06-14 삼성에스디아이 주식회사 증발원 및 이를 이용한 박막 증착방법
JP2007332458A (ja) * 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
JP4705526B2 (ja) * 2006-06-27 2011-06-22 トッキ株式会社 アライメント装置及び方法
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法
TWI401832B (zh) * 2008-12-15 2013-07-11 Hitachi High Tech Corp Organic electroluminescent light making device, film forming apparatus and film forming method, liquid crystal display substrate manufacturing apparatus, and calibration apparatus and calibration method
JP5337632B2 (ja) * 2009-02-13 2013-11-06 株式会社日立ハイテクノロジーズ 成膜装置及び有機ｅｌデバイス製造装置
JP5452178B2 (ja) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688233A (ja) * 1992-09-04 1994-03-29 Ishikawajima Harima Heavy Ind Co Ltd 真空蒸着装置
JP2001270691A (ja) * 2000-03-28 2001-10-02 Shin Meiwa Ind Co Ltd 物体移送装置
JP2004091913A (ja) * 2002-07-10 2004-03-25 Sony Corp 成膜装置および成膜方法
JP2005120476A (ja) * 2003-10-15 2005-05-12 Samsung Sdi Co Ltd 有機電界発光素子の垂直蒸着方法，その装置，及びそれに使用される蒸着源
JP2010140840A (ja) * 2008-12-15 2010-06-24 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びに液晶表示基板製造装置
JP2010248584A (ja) * 2009-04-16 2010-11-04 Hitachi High-Technologies Corp 真空蒸着装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014160744A (ja) * 2013-01-15 2014-09-04 Ulvac Japan Ltd アラインメント装置、及びアラインメント方法
JP2018517054A (ja) * 2015-04-01 2018-06-28 ヴィエヌアイ ソルーション カンパニー リミテッド アライナ構造及びアライン方法
JP2019510129A (ja) * 2017-02-03 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 隣り合う基板を有する連続蒸発のための装置及び方法
WO2019020167A1 (en) * 2017-07-24 2019-01-31 Applied Materials, Inc. APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR TRANSPORTING A CARRIER IN A VACUUM CHAMBER
WO2019020166A1 (en) * 2017-07-24 2019-01-31 Applied Materials, Inc. APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR ALIGNING A SUBSTRATE CARRIER WITH A MASK CARRIER
JP7018375B2 (ja) 2017-10-31 2022-02-10 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイス製造方法
JP2019081950A (ja) * 2017-10-31 2019-05-30 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイス製造方法
JP2022060259A (ja) * 2017-10-31 2022-04-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイス製造方法
JP7429723B2 (ja) 2017-10-31 2024-02-08 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイス製造方法
KR20190116970A (ko) * 2018-04-03 2019-10-15 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버에서의 캐리어 정렬을 위한 장치 및 진공 시스템, 및 캐리어의 정렬 방법
KR102167534B1 (ko) * 2018-04-03 2020-10-19 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버에서의 캐리어 정렬을 위한 장치 및 진공 시스템, 및 캐리어의 정렬 방법
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
KR20200087624A (ko) * 2019-01-11 2020-07-21 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
JP2020111824A (ja) * 2019-01-11 2020-07-27 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
KR102179271B1 (ko) 2019-01-11 2020-11-16 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
JP7379072B2 (ja) 2019-01-11 2023-11-14 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
JP2022107430A (ja) * 2021-01-08 2022-07-21 キヤノントッキ株式会社 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法
JP7379396B2 (ja) 2021-01-08 2023-11-14 キヤノントッキ株式会社 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法

Also Published As

Publication number Publication date
TW201241206A (en) 2012-10-16
CN103339281A (zh) 2013-10-02
WO2012090753A1 (ja) 2012-07-05

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