JP6602465B2 - 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 - Google Patents
基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 Download PDFInfo
- Publication number
- JP6602465B2 JP6602465B2 JP2018509839A JP2018509839A JP6602465B2 JP 6602465 B2 JP6602465 B2 JP 6602465B2 JP 2018509839 A JP2018509839 A JP 2018509839A JP 2018509839 A JP2018509839 A JP 2018509839A JP 6602465 B2 JP6602465 B2 JP 6602465B2
- Authority
- JP
- Japan
- Prior art keywords
- track
- carrier
- substrate
- mask
- substrate carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Mechanical Conveyors (AREA)
Description
Claims (15)
- 基板キャリア(150)およびマスクキャリア(160)を真空チャンバ内で位置決めするための位置決め装置(100)であって、
基板表面を有する基板を保持するように構成された前記基板キャリア(150)の搬送用に構成された、第1の方向に延びる第1のトラック(110)と、
前記マスクキャリア(160)の搬送用に構成された、前記第1の方向に延びる第2のトラック(120)であって、前記第1のトラック(110)と前記第2のトラック(120)が、前記基板表面と同一平面内のオフセット距離(D)だけオフセットされている、第2のトラック(120)と、
前記マスクキャリア(160)を保持するように構成された保持装置(130)であって、前記第1のトラック(110)と前記第2のトラック(120)との間に配置されている保持装置(130)と
を備える位置決め装置(100)。 - 前記第1のトラック(110)が、前記基板キャリア(150)の非接触搬送用に構成され、前記第2のトラックが、前記マスクキャリア(160)の非接触搬送用に構成されている、請求項1に記載の位置決め装置(100)。
- 前記保持装置(130)が、基板搬送方向とは異なる移動方向に移動可能であるように構成された少なくとも1つの保持要素(131)を含む、請求項2に記載の位置決め装置(100)。
- 前記マスクキャリア(160)に対して前記基板キャリア(150)を位置合わせするように構成された位置合わせシステム(140)をさらに含む、請求項1から3のいずれか一項に記載の位置決め装置(100)。
- 前記第1のトラック(110)が、第1の距離(D1)だけ離間した第1の案内構造(111)と第1の駆動構造(112)を含む、請求項1から4のいずれか一項に記載の位置決め装置(100)。
- 前記第2のトラック(120)が、第2の距離(D2)だけ離間した第2の案内構造(121)と第2の駆動構造(122)を含む、請求項1から5のいずれか一項に記載の位置決め装置(100)。
- 前記第1の距離(D1)が、前記第2の距離(D2)より小さい、請求項5に従属する請求項6に記載の位置決め装置(100)。
- 前記第1の案内構造(111)が、第1の磁気案内構造であり、前記第1の駆動構造(112)が、第1の磁気駆動構造であり、および/または前記第2の案内構造(121)が、第2の磁気案内構造であり、前記第2の駆動構造(122)が、第2の磁気駆動構造である、請求項5に従属する請求項6、又は請求項7に記載の位置決め装置(100)。
- 処理システム内で基板キャリア(150)およびマスクキャリア(160)を搬送するための搬送システム(200)であって、
基板表面を有する基板を保持するように構成された前記基板キャリアの非接触搬送用の、第1の方向に延びる第1のトラック(110)と、
前記マスクキャリアの非接触搬送用に構成された、前記第1の方向に延びる第2のトラック(120)と
を備え、
前記第1のトラック(110)と前記第2のトラックが、前記基板表面と同一平面内のオフセット距離(D)だけオフセットされている、
搬送システム(200)。 - 前記第1のトラック(110)が、第1の距離(D1)だけ離間した第1の案内構造(111)と第1の駆動構造(112)を含む、請求項9に記載の搬送システム(200)。
- 前記第2のトラック(120)が、第2の距離(D2)だけ離間した第2の案内構造(121)と第2の駆動構造(122)を含む、請求項9または10に記載の搬送システム(200)。
- 前記第1の距離(D1)が、前記第2の距離(D2)より小さい、請求項10に従属する請求項11に記載の搬送システム(200)。
- 真空処理システム(300)であって、
請求項1から8のいずれか一項に記載の位置決め装置(100)を有する真空処理チャンバ(310)と、
請求項9から12のいずれか一項に記載の搬送システム(200)を有する少なくとも1つのさらなるチャンバ(320)と
を備える真空処理システム(300)。 - 基板キャリア(150)をマスクキャリア(160)に対して位置決めするための方法(400)であって、
前記基板キャリアの非接触搬送用に構成された第1のトラック(110)を用いて、前記基板キャリア(150)を第1の位置に位置決めすることと、
前記マスクキャリアの非接触搬送用に構成された第2のトラック(120)を用いて、前記マスクキャリア(160)を第2の位置に位置決めすることと、
前記第1のトラック(110)と前記第2のトラック(120)との間に配置された保持装置(130)を用いて、前記マスクキャリアを保持することと、
前記基板キャリア(150)を前記マスクキャリア(160)に対して位置合わせすることと
を含む方法(400)。 - 基板キャリア(150)およびマスクキャリア(160)を処理システムを通って搬送するための方法(500)であって、
基板表面を有する基板を保持するように構成された前記基板キャリア(150)の非接触搬送用に構成された第1のトラック(110)上で前記基板キャリアを搬送することと、
前記マスクキャリア(160)の非接触搬送用に構成された第2のトラック(120)上で前記マスクキャリア(160)を搬送することと
を含み、
前記第1のトラック(110)と前記第2のトラック(120)が、前記基板表面と同一平面内のオフセット距離(D)だけオフセットされている、
方法(500)。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/054356 WO2018153480A1 (en) | 2017-02-24 | 2017-02-24 | Positioning arrangement for a substrate carrier and a mask carrier, transportation system for a substrate carrier and a mask carrier, and methods therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019512159A JP2019512159A (ja) | 2019-05-09 |
JP6602465B2 true JP6602465B2 (ja) | 2019-11-06 |
Family
ID=58277248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018509839A Active JP6602465B2 (ja) | 2017-02-24 | 2017-02-24 | 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190368024A1 (ja) |
JP (1) | JP6602465B2 (ja) |
KR (1) | KR102069018B1 (ja) |
CN (1) | CN109563608A (ja) |
TW (1) | TWI688141B (ja) |
WO (1) | WO2018153480A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200017381A (ko) * | 2018-08-06 | 2020-02-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 마스크 정렬기를 갖는 증착 장치, 기판을 마스킹하기 위한 마스크 어레인지먼트, 및 기판을 마스킹하기 위한 방법 |
KR20210057117A (ko) * | 2018-10-22 | 2021-05-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 재료 증착 장치, 진공 증착 시스템, 및 대면적 기판을 프로세싱하는 방법 |
US11538706B2 (en) | 2019-05-24 | 2022-12-27 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
US10950441B1 (en) * | 2019-09-03 | 2021-03-16 | Kyoka Utsumi Mimura | Low energy e-beam contact printing lithography |
JP7374684B2 (ja) * | 2019-09-24 | 2023-11-07 | キヤノントッキ株式会社 | 成膜装置および成膜方法、情報取得装置、アライメント方法、ならびに電子デバイスの製造装置および製造方法 |
WO2021197621A1 (en) * | 2020-04-03 | 2021-10-07 | Applied Materials, Inc. | Material deposition apparatus, vacuum deposition system and method of processing a large area substrate |
KR20240035659A (ko) * | 2022-09-08 | 2024-03-18 | 삼성디스플레이 주식회사 | 스테이지 유닛, 이를 포함하는 증착 설비, 및 표시 패널 제조 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478455A (en) * | 1993-09-17 | 1995-12-26 | Varian Associates, Inc. | Method for controlling a collimated sputtering source |
US5874820A (en) * | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
US6753534B2 (en) * | 2000-12-08 | 2004-06-22 | Nikon Corporation | Positioning stage with stationary and movable magnet tracks |
US20030230729A1 (en) * | 2000-12-08 | 2003-12-18 | Novak W. Thomas | Positioning stage with stationary and movable magnet tracks |
US6927505B2 (en) * | 2001-12-19 | 2005-08-09 | Nikon Corporation | Following stage planar motor |
JP4685404B2 (ja) * | 2003-10-15 | 2011-05-18 | 三星モバイルディスプレイ株式會社 | 有機電界発光素子の垂直蒸着方法,その装置,及び有機電界発光素子の垂直蒸着装置に使用される蒸着源 |
KR101119814B1 (ko) * | 2004-06-07 | 2012-03-06 | 가부시키가이샤 니콘 | 스테이지 장치, 노광 장치 및 노광 방법 |
EP1715076B1 (de) * | 2005-04-20 | 2009-07-22 | Applied Materials GmbH & Co. KG | Verfahren und Vorrichtung zur Maskenpositionierung |
CN100361287C (zh) * | 2006-03-10 | 2008-01-09 | 友达光电股份有限公司 | 基板传送装置 |
JP5639431B2 (ja) * | 2010-09-30 | 2014-12-10 | キヤノントッキ株式会社 | 成膜装置 |
JP2012140671A (ja) * | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | 成膜装置 |
KR20140053625A (ko) * | 2012-10-26 | 2014-05-08 | 삼성디스플레이 주식회사 | 유기물 증착 장치 |
US9640372B2 (en) * | 2012-11-15 | 2017-05-02 | Applied Materials, Inc. | Method and system for maintaining an edge exclusion shield |
EP3187618A1 (en) * | 2013-12-10 | 2017-07-05 | Applied Materials, Inc. | Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material |
KR102192244B1 (ko) * | 2013-12-30 | 2020-12-17 | 삼성디스플레이 주식회사 | 기판 이송장치 |
KR101985922B1 (ko) * | 2014-02-04 | 2019-06-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 캐리어에 의해 지지되는 기판 상에 하나 또는 그 초과의 층들을 증착하기 위한 시스템 및 그러한 시스템을 사용하는 방법 |
JP6704348B2 (ja) * | 2014-03-21 | 2020-06-03 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 有機材料用の蒸発源 |
WO2016112951A1 (en) * | 2015-01-12 | 2016-07-21 | Applied Materials, Inc. | Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier |
-
2017
- 2017-02-24 JP JP2018509839A patent/JP6602465B2/ja active Active
- 2017-02-24 WO PCT/EP2017/054356 patent/WO2018153480A1/en active Application Filing
- 2017-02-24 KR KR1020187006213A patent/KR102069018B1/ko active IP Right Grant
- 2017-02-24 US US15/748,885 patent/US20190368024A1/en not_active Abandoned
- 2017-02-24 CN CN201780007472.1A patent/CN109563608A/zh active Pending
-
2018
- 2018-02-23 TW TW107106122A patent/TWI688141B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI688141B (zh) | 2020-03-11 |
CN109563608A (zh) | 2019-04-02 |
US20190368024A1 (en) | 2019-12-05 |
KR20180114888A (ko) | 2018-10-19 |
JP2019512159A (ja) | 2019-05-09 |
TW201842694A (zh) | 2018-12-01 |
WO2018153480A1 (en) | 2018-08-30 |
KR102069018B1 (ko) | 2020-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6602465B2 (ja) | 基板キャリア及びマスクキャリアの位置決め装置、基板キャリア及びマスクキャリアの搬送システム、並びにそのための方法 | |
KR102161185B1 (ko) | 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버에서의 기판 캐리어 및 마스크 캐리어의 운송을 위한 방법 | |
TWI635192B (zh) | 用於傳輸載具或基板的設備及方法 | |
JP6681977B2 (ja) | 基板を真空処理するための装置、基板を真空処理するためのシステム、及び、真空チャンバ内で基板キャリアとマスクキャリアを搬送するための方法 | |
JP6840232B2 (ja) | 真空チャンバ内でキャリアをアライメントするための装置、真空システム、ならびに真空チャンバ内でキャリアをアライメントする方法 | |
CN110527972B (zh) | 用于沉积源的非接触输送的装置和方法 | |
KR102154706B1 (ko) | 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치 | |
TWI678421B (zh) | 真空腔室內加工基板之設備和系統及真空腔室內運輸載體之方法 | |
CN110557955B (zh) | 用于支撑基板或掩模的载体 | |
TW201931510A (zh) | 用以非接觸懸浮一遮蔽裝置之方法及設備 | |
TW202025336A (zh) | 用於在一真空腔室中之一第一載體及一第二載體的傳送之設備、用以垂直地處理一基板的處理系統、在一真空腔室中傳送一第一載體及一第二載體的方法及在一真空腔室中調整一第一載體及一第二載體之間的一距離的方法 | |
TW202025535A (zh) | 用以在一真空腔室中沈積材料於一基板上之材料沈積設備、真空處理系統及用以處理一垂直定向之大面積基板的方法 | |
JP2020518123A (ja) | 真空チャンバ内でキャリアを位置合わせするための装置および真空システム、ならびにキャリアを位置合わせする方法 | |
WO2021197586A1 (en) | Carrier transportation apparatus, carrier transport system, processing system and method of transporting a carrier |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180531 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190814 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190910 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191008 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6602465 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |