TW201134590A - Laser processing method and laser processing device - Google Patents
Laser processing method and laser processing device Download PDFInfo
- Publication number
- TW201134590A TW201134590A TW100105771A TW100105771A TW201134590A TW 201134590 A TW201134590 A TW 201134590A TW 100105771 A TW100105771 A TW 100105771A TW 100105771 A TW100105771 A TW 100105771A TW 201134590 A TW201134590 A TW 201134590A
- Authority
- TW
- Taiwan
- Prior art keywords
- defect
- irradiation
- laser light
- region
- laser
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 45
- 238000003672 processing method Methods 0.000 title claims abstract description 19
- 230000007547 defect Effects 0.000 claims abstract description 116
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 230000001678 irradiating effect Effects 0.000 claims abstract description 8
- 238000012937 correction Methods 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 9
- 238000009313 farming Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 17
- 238000003384 imaging method Methods 0.000 description 10
- 238000005286 illumination Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 6
- 238000009966 trimming Methods 0.000 description 6
- 238000007667 floating Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000008439 repair process Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000003252 repetitive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
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- 230000010365 information processing Effects 0.000 description 1
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- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010063312A JP5495875B2 (ja) | 2010-03-18 | 2010-03-18 | レーザ加工方法、及び、レーザ加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201134590A true TW201134590A (en) | 2011-10-16 |
Family
ID=44598678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100105771A TW201134590A (en) | 2010-03-18 | 2011-02-22 | Laser processing method and laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5495875B2 (enExample) |
| KR (1) | KR20110105339A (enExample) |
| CN (1) | CN102189332A (enExample) |
| TW (1) | TW201134590A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5818721B2 (ja) * | 2012-03-06 | 2015-11-18 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| KR101821239B1 (ko) | 2015-09-04 | 2018-01-24 | 주식회사 이오테크닉스 | 접착제 제거장치 및 방법 |
| CN115351426B (zh) * | 2022-08-11 | 2025-04-25 | 莆田市雷腾激光数控设备有限公司 | 一种鞋底激光打标方法及系统 |
| WO2025002322A1 (zh) | 2023-06-28 | 2025-01-02 | 广州童心制物科技有限公司 | 加工元素的限位方法、装置、设备、程序介质和数控机器 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138588A (ja) * | 1982-02-12 | 1983-08-17 | Hitachi Ltd | 光照射加工装置 |
| JPH02241686A (ja) * | 1989-03-14 | 1990-09-26 | Nec Corp | レーザ加工装置用結像光学系 |
| JPH0542381A (ja) * | 1991-08-09 | 1993-02-23 | Nec Corp | レーザ加工装置を用いた欠陥修正方法 |
| JP3042155B2 (ja) * | 1992-03-05 | 2000-05-15 | 日本電気株式会社 | フォトマスク修正装置およびフォトマスク修正方法 |
| JP2809134B2 (ja) * | 1995-06-20 | 1998-10-08 | 日本電気株式会社 | 液晶表示用カラーフィルタの欠陥修正方法および装置 |
| JP3858571B2 (ja) * | 2000-07-27 | 2006-12-13 | 株式会社日立製作所 | パターン欠陥検査方法及びその装置 |
| JP4335422B2 (ja) * | 2000-07-31 | 2009-09-30 | Ntn株式会社 | パターン修正装置 |
| KR100457565B1 (ko) * | 2002-07-29 | 2004-11-18 | 엘지전자 주식회사 | 레이저 수리 장치 및 방법 |
| JP4646805B2 (ja) * | 2003-05-09 | 2011-03-09 | オリンパス株式会社 | 欠陥修正装置及びその欠陥修正方法 |
| JP2005103581A (ja) * | 2003-09-29 | 2005-04-21 | Olympus Corp | リペア方法及びその装置 |
| JP4688525B2 (ja) * | 2004-09-27 | 2011-05-25 | 株式会社 日立ディスプレイズ | パターン修正装置および表示装置の製造方法 |
| CN101147093B (zh) * | 2005-03-24 | 2011-10-05 | 奥林巴斯株式会社 | 维修方法及其装置 |
| JP5036144B2 (ja) * | 2005-06-28 | 2012-09-26 | オリンパス株式会社 | レーザ加工装置 |
| JP4947933B2 (ja) * | 2005-07-26 | 2012-06-06 | オリンパス株式会社 | レーザリペア装置 |
| TWI408358B (zh) * | 2006-07-03 | 2013-09-11 | Olympus Corp | 缺陷修正裝置 |
| JP4951323B2 (ja) * | 2006-12-08 | 2012-06-13 | オリンパス株式会社 | 欠陥修正方法及び欠陥修正装置 |
| JP5064778B2 (ja) * | 2006-12-11 | 2012-10-31 | オリンパス株式会社 | レーザ加工装置 |
| JP2008153024A (ja) * | 2006-12-15 | 2008-07-03 | Ntn Corp | 微細パターン修正方法 |
| JP5114943B2 (ja) * | 2006-12-25 | 2013-01-09 | ソニー株式会社 | 欠陥修正装置及び欠陥修正方法 |
| JP5110894B2 (ja) * | 2007-02-05 | 2012-12-26 | 株式会社ジャパンディスプレイウェスト | 欠陥修正装置、配線基板の製造方法、ディスプレイ装置の製造方法 |
| JP4955425B2 (ja) * | 2007-03-08 | 2012-06-20 | オリンパス株式会社 | レーザ加工装置 |
| JP4937185B2 (ja) * | 2008-05-15 | 2012-05-23 | Ntn株式会社 | パターン修正方法 |
| JP5331421B2 (ja) * | 2008-09-12 | 2013-10-30 | オリンパス株式会社 | レーザリペア装置およびレーザリペア方法 |
| JP5730528B2 (ja) * | 2010-03-05 | 2015-06-10 | オリンパス株式会社 | 欠陥修正装置および欠陥追跡方法 |
-
2010
- 2010-03-18 JP JP2010063312A patent/JP5495875B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-22 TW TW100105771A patent/TW201134590A/zh unknown
- 2011-03-11 KR KR1020110021815A patent/KR20110105339A/ko not_active Withdrawn
- 2011-03-11 CN CN2011100598721A patent/CN102189332A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP5495875B2 (ja) | 2014-05-21 |
| JP2011194432A (ja) | 2011-10-06 |
| KR20110105339A (ko) | 2011-09-26 |
| CN102189332A (zh) | 2011-09-21 |
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