TW200801847A - Immersion lithography fluid control system - Google Patents

Immersion lithography fluid control system

Info

Publication number
TW200801847A
TW200801847A TW096127403A TW96127403A TW200801847A TW 200801847 A TW200801847 A TW 200801847A TW 096127403 A TW096127403 A TW 096127403A TW 96127403 A TW96127403 A TW 96127403A TW 200801847 A TW200801847 A TW 200801847A
Authority
TW
Taiwan
Prior art keywords
fluid
immersion lithography
control system
fluid control
immersion
Prior art date
Application number
TW096127403A
Other languages
English (en)
Chinese (zh)
Inventor
Derek Coon
Andrew J Hazelton
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200801847A publication Critical patent/TW200801847A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW096127403A 2003-04-09 2004-04-09 Immersion lithography fluid control system TW200801847A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46214203P 2003-04-09 2003-04-09
PCT/US2004/009911 WO2004093159A2 (en) 2003-04-09 2004-03-29 Immersion lithography fluid control system

Publications (1)

Publication Number Publication Date
TW200801847A true TW200801847A (en) 2008-01-01

Family

ID=33299914

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096127403A TW200801847A (en) 2003-04-09 2004-04-09 Immersion lithography fluid control system
TW093109876A TWI372412B (en) 2003-04-09 2004-04-09 Immersion lithography fluid control system

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW093109876A TWI372412B (en) 2003-04-09 2004-04-09 Immersion lithography fluid control system

Country Status (5)

Country Link
US (6) US7339650B2 (enExample)
JP (3) JP4488004B2 (enExample)
KR (2) KR20110104084A (enExample)
TW (2) TW200801847A (enExample)
WO (1) WO2004093159A2 (enExample)

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* Cited by examiner, † Cited by third party
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US8497973B2 (en) 2013-07-30
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US20070268468A1 (en) 2007-11-22
US20070263184A1 (en) 2007-11-15
US8797500B2 (en) 2014-08-05
US20070115453A1 (en) 2007-05-24
US20090075212A1 (en) 2009-03-19
US8102501B2 (en) 2012-01-24
US20060023184A1 (en) 2006-02-02
JP5428909B2 (ja) 2014-02-26
JP5679023B2 (ja) 2015-03-04
US9618852B2 (en) 2017-04-11
JP2010161383A (ja) 2010-07-22
WO2004093159A2 (en) 2004-10-28

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