TW200638500A - Flexible printed wiring board - Google Patents

Flexible printed wiring board

Info

Publication number
TW200638500A
TW200638500A TW094143797A TW94143797A TW200638500A TW 200638500 A TW200638500 A TW 200638500A TW 094143797 A TW094143797 A TW 094143797A TW 94143797 A TW94143797 A TW 94143797A TW 200638500 A TW200638500 A TW 200638500A
Authority
TW
Taiwan
Prior art keywords
flexible printed
wiring board
printed wiring
wiring pattern
insulating layer
Prior art date
Application number
TW094143797A
Other languages
English (en)
Inventor
Kota Hagiwara
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200638500A publication Critical patent/TW200638500A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
TW094143797A 2004-12-16 2005-12-12 Flexible printed wiring board TW200638500A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004364739 2004-12-16
JP2005352611A JP4485460B2 (ja) 2004-12-16 2005-12-06 フレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
TW200638500A true TW200638500A (en) 2006-11-01

Family

ID=36594271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143797A TW200638500A (en) 2004-12-16 2005-12-12 Flexible printed wiring board

Country Status (4)

Country Link
US (2) US7336499B2 (zh)
JP (1) JP4485460B2 (zh)
KR (1) KR20060069277A (zh)
TW (1) TW200638500A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496224B (zh) * 2008-03-12 2015-08-11 Memjet Technology Ltd 附接線接迴路以減小迴路高度的方法

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KR101259844B1 (ko) * 2011-01-31 2013-05-03 엘지이노텍 주식회사 리드 크랙이 강화된 전자소자용 탭 테이프 및 그의 제조 방법
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JP6044080B2 (ja) * 2011-07-06 2016-12-14 株式会社リコー インクジェット式記録ヘッド、インクジェット式記録装置、インクジェット式記録ヘッドの製造装置
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KR101396433B1 (ko) * 2012-08-13 2014-05-19 스템코 주식회사 연성 회로 기판, 이를 포함한 반도체 패키지 및 디스플레이 장치
JP6011169B2 (ja) 2012-09-04 2016-10-19 ブラザー工業株式会社 液滴吐出装置
US9136168B2 (en) * 2013-06-28 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive line patterning
JP6191991B2 (ja) * 2014-03-31 2017-09-06 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
KR102371358B1 (ko) 2015-01-23 2022-03-08 삼성전자주식회사 반도체 패키지 및 이를 사용하는 패키지 모듈
CN107920751B (zh) * 2015-09-04 2020-09-22 国立研究开发法人科学技术振兴机构 连接器基板、传感器系统以及可穿戴的传感器系统
KR102502077B1 (ko) 2015-10-19 2023-02-22 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11259406B2 (en) * 2018-11-21 2022-02-22 Synaptics Incorporated Flexible connector for a display device
KR102269743B1 (ko) * 2019-03-05 2021-06-25 매그나칩 반도체 유한회사 이너 리드 패턴 그룹을 포함하는 반도체 패키지 및 그 방법
KR20210074489A (ko) 2019-12-12 2021-06-22 엘지디스플레이 주식회사 플렉서블 표시장치
TWI712136B (zh) 2020-02-26 2020-12-01 頎邦科技股份有限公司 覆晶接合結構及其線路基板
JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
TWI750755B (zh) * 2020-07-31 2021-12-21 頎邦科技股份有限公司 軟性電路板之佈線結構
TWI746349B (zh) 2021-01-11 2021-11-11 頎邦科技股份有限公司 軟性電路板
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496224B (zh) * 2008-03-12 2015-08-11 Memjet Technology Ltd 附接線接迴路以減小迴路高度的方法

Also Published As

Publication number Publication date
US7701722B2 (en) 2010-04-20
KR20060069277A (ko) 2006-06-21
US7336499B2 (en) 2008-02-26
JP2006196878A (ja) 2006-07-27
US20060131064A1 (en) 2006-06-22
JP4485460B2 (ja) 2010-06-23
US20080023217A1 (en) 2008-01-31

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