TWI712136B - 覆晶接合結構及其線路基板 - Google Patents

覆晶接合結構及其線路基板 Download PDF

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Publication number
TWI712136B
TWI712136B TW109106351A TW109106351A TWI712136B TW I712136 B TWI712136 B TW I712136B TW 109106351 A TW109106351 A TW 109106351A TW 109106351 A TW109106351 A TW 109106351A TW I712136 B TWI712136 B TW I712136B
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width
area
branch line
line segment
circuit substrate
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TW109106351A
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English (en)
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TW202133370A (zh
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馬宇珍
黃信豪
周文復
許國賢
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頎邦科技股份有限公司
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Priority to TW109106351A priority Critical patent/TWI712136B/zh
Priority to US17/038,237 priority patent/US11322437B2/en
Priority to JP2020170601A priority patent/JP7030166B2/ja
Priority to KR1020200130021A priority patent/KR102375544B1/ko
Priority to CN202011077836.3A priority patent/CN113133183A/zh
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Publication of TWI712136B publication Critical patent/TWI712136B/zh
Publication of TW202133370A publication Critical patent/TW202133370A/zh

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

本發明揭露一種覆晶接合結構，其具有一線路基板，該線路基板具有一載板、複數個內引腳、一T型線路及一虛設金屬圖案，該些內引腳、該T型線路及該虛設金屬圖案位於該載板之一內接合區，該T型線路具有一主線段、一連接段及一支線段，該連接段連接該主線段及該支線段，該主線段沿著一橫軸方向延伸，該支線段沿著一縱軸方向延伸，該虛設金屬圖案位於該連接段及該些內引腳之間。

Description

覆晶接合結構及其線路基板
本發明關於一種覆晶接合結構，其晶片接合於具有T型線路及虛設金屬圖案之線路基板。
線路蝕刻製程係藉由蝕刻液蝕刻圖案化光阻顯露的金屬層，將圖案轉移至金屬層以形成精細線路圖案，蝕刻液係於圖案化光阻之間流動，以均勻蝕刻顯露的金屬層，然而當蝕刻液流動至被三面光阻圍繞的空間時，蝕刻液流動性會降低而蓄積於被光阻三面圍繞的空間中，蝕刻液停留時間過長，可能導致過度蝕刻，使得精細線路斷線而失效。
本發明之目的在於提供一覆晶接合結構及其線路基板，於T型線路周圍設置虛設金屬圖案，以避免T型線路因蝕刻液過度蝕刻而斷線。
本發明揭露一種線路基板，其包含一載板、複數個內引腳、至少一T型線路及至少一虛設金屬圖案，該載板具有一表面，該表面定義有一內接合區，該內接合區具有一第一區及一第二區，該第一區位於該第二區外側，該些內引腳位於該第一區，該T型線路位於該第二區且具有一主線段、一連接段及一支線段，該主線段連接該連接段並沿著一橫軸方向延伸，該支線段連接該連接段並沿著一縱軸方向朝該第一區延伸，該支線段用以接合一凸塊，該虛設金屬圖案位於該連接段及該些內引腳之間，該虛設金屬圖案未電性連接該些內引腳及該T型線路。
本發明另揭露一種覆晶接合結構，其包含一線路基板、一晶片及一焊料層，該線路基板具有一載板、複數個內引腳、至少一T型線路及至少一虛設金屬圖案，該載板之一表面定義有一內接合區，該內接合區具有一第一區及一第二區，該第一區位於該第二區外側，該些內引腳位於該第一區，該T型線路位於該第二區且具有一主線段、一連接段及一支線段，該主線段連接該連接段並沿著一橫軸方向延伸，該支線段連接該連接段並沿著一縱軸方向朝該第一區延伸，該虛設金屬圖案位於該連接段及該些內引腳之間，且未電性連接該些內引腳及該T型線路，該晶片設置於該內接合區且具有複數個第一凸塊及至少一第二凸塊，該焊料層位於該線路基板及該晶片之間，用以接合該些第一凸塊及該些內引腳之該內引腳，並用以接合該第二凸塊及該支線段。
本發明於該連接段及該些內引腳之間設置該虛設金屬圖案，使該虛設金屬圖案位於該連接段、該支線段及該些內引腳所圍繞的空間中，因此蝕刻液不會蓄積於該連接段及該支線段周圍，可避免蝕刻液過度蝕刻該T型線路而導致該連接段及/或該支線段斷線。
請參閱第1至3圖，本發明揭露一種線路基板100，該線路基板100具有一載板110及一線路層120，該線路層120位於該載板110之一表面111，該表面111定義有一外接合區112及一內接合區113，該線路層120具有複數個外引腳121及複數個內引腳122，該些外引腳121位於該外接合區112，該些內引腳122位於該內接合區113，該些外引腳121及該些內引腳122沿著一橫軸方向X分別排列於該外接合區112及該內接合區113，該內接合區113具有一第一區113a及一第二區113b，該第一區113a位於該第二區113b外側，在本實施例中，該內接合區113具有兩個第一區113a，該第二區113b位於該些第一區113a之間，該些內引腳122位於該些第一區113a。
較佳地，該載板110可由聚醯亞胺(polyimide, PI)、聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)、玻璃、陶瓷、金屬或其他材料所製成，該線路層120之材質可為銅、鎳、金或其他金屬或合金。
請參閱第2圖，較佳地，該線路基板100另具有一防焊層130，該防焊層130覆蓋該線路層120，但未覆蓋該些外引腳121及該些內引腳122，該防焊層130用以保護該線路層120，而顯露之該些外引腳121及該些內引腳122分別用以接合一電子裝置及一晶片(圖未繪出)。
請參閱第3及4圖，該線路基板100另具有至少一T型線路140，位於該內接合區113之該第二區113b，該T型線路140用以接地或接電源，與該些內引腳122無電性連接，該T型線路140具有一主線段141、一連接段142及一支線段143，該主線段141連接該連接段142並沿著該橫軸方向X延伸，該支線段143連接該連接段142並沿著一縱軸方向Y朝該第一區113a延伸，該支線段143係用以接合一凸塊，在本實施例中，相互連接之該主線段141及該連接段142呈直線狀，而相互連接之該連接段142及該支線段143彼此垂直，但本發明不以此為限制，該主線段141及該連接段142可呈非直線狀，該連接段142及該支線段143之間的夾角可大於、小於或實質上等於90度。
較佳地，該線路基板100具有複數個T型線路140，該些T型線路140之該主線段141沿著該橫軸方向X延伸並彼此連接，該些T型線路140之該支線段143沿著該縱軸方向Y朝向該內接合區113之該第一區113a延伸，以分別接合一凸塊。
請參閱第3及4圖，該線路基板100另具有至少一虛設金屬圖案(dummy pattern)150，該虛設金屬圖案150位於該連接段142及該些內引腳122之間，且未電性連接該T型線路140及該些內引腳122，本發明不限制該虛設金屬圖案150的形狀，可配合周圍線路配置進行調整，該虛設金屬圖案150係用以保護該T型線路140，特別是避免該連接段142及該支線段143因過度蝕刻而斷線，較佳地，該線路基板100具有兩個虛設金屬圖案150，分別位於該支線段143兩側，該些虛設金屬圖案150可為相同圖案，對稱地位於該支線段143兩側，或是不同圖案，不對稱地位於該支線段143兩側。
在本實施例中，該線路層120、該T型線路140及該虛設金屬圖案150係經由同一金屬蝕刻製程形成於該載板110，該虛設金屬圖案150位於該連接段142、該支線段143及該些內引腳122所圍繞的空間內，可避免蝕刻液蓄積在該連接段142及該支線段143周圍，因此可防止該連接段142及該支線段143因過度蝕刻而斷線的情形發生。
第4至8圖分別為不同態樣之該T型線路140，不同於第4圖，第5圖所示之該支線段143沿著該縱軸方向Y朝其中之一該內引腳122延伸，第6圖所示之該支線段143則沿著該縱軸方向Y延伸至相鄰兩個該內引腳122之間，較佳地，該支線段143及該內引腳122之線寬實質上相同，第7圖所示之該支線段143具有一第一端143a及一第二端143b，該第一端143a連接該連接段142，該第二端143b用以接合一凸塊，其中該第一端143a之線寬大於該第二端143b之線寬，以避免該連接段142及該支線段143之間發生斷裂，在本實施例中，該第二端143b位於相鄰兩個該內引腳122之間，不同於第4至7圖，第8圖所示之該支線段143呈非直線狀，該第一端143b及該第二端143b彼此垂直。
請參閱第2及9圖(第9圖為第7圖之剖視圖)，本發明另揭露一種覆晶接合結構I，其包含該線路基板100、一晶片200及一焊料層300，該晶片200設置於該載板110之該內接合區113，且具有複數個第一凸塊210及至少一第二凸塊220，該焊料層300位於該線路基板100及該晶片200之間，用以接合該些第一凸塊210及該些內引腳122，並用以接合該第二凸塊220及該支線段143，較佳地，該焊料層300之厚度不大於0.30μm，更佳地，該焊料層300之厚度不大於0.20μm，在本實施例中，該焊料層300形成於該些內引腳122及該T型線路140上，厚度為0.16±0.4 μm，將該晶片200設置於該內接合區113後進行熱壓合製程，該焊料層300受熱軟化後用以接合該晶片200及該線路基板100。
由於該焊料層300受熱軟化後會具有流動性，當該第二凸塊220接合於該支線段143時，位於該T型線路140上的該焊料層300會從不同方向流向該支線段143，而增加該焊料層300溢流的發生率，因此可選擇性地變更該T型線路140之設計，以避免焊料溢流而導致橋接短路。
請參閱4圖，該主線段141沿著該縱軸方向Y具有一第一寬度W1，該連接段142沿著該縱軸方向Y具有一第二寬度W2，較佳地，該第二寬度W2小於該第一寬度W1，縮小該連接段142寬度可有效降低自該連接段142流向該支線段143的焊料量，以避免過多的焊料流向該第二凸塊220而發生溢流，此外，該支線段143沿著該橫軸方向X具有一第三寬度W3，該第二寬度W2與該第三寬度W3之比值大於或等於0.5(
Figure 02_image001
)，當比值介於0.5及1之間(
Figure 02_image003
)，表示該第二寬度W2小於該第三寬度W3，當比值等於1(
Figure 02_image005
)，表示該第二寬度W2等於該第三寬度W3，當比值大於1(
Figure 02_image007
)，表示該第二寬度W2大於該第三寬度W3。
除了限制該主線段141、該連接段142及該支線段143之間的線寬比例，亦可根據該第二凸塊220的尺寸調整該連接段142的線寬，請參閱第5圖，較佳地，該第二凸塊220沿著該橫軸方向X具有一第四寬度W4，該第二寬度W2與該第四寬度W4之比值小於2(
Figure 02_image009
)，當比值介於1及2之間(
Figure 02_image011
)，表示該第二寬度W2大於該第四寬度W4，但小於兩倍的該第四寬度W4，當比值等於1(
Figure 02_image013
)，表示該第二寬度W2等於該第四寬度W4，當比值小於1(
Figure 02_image015
)，表示該第二寬度W2小於該第四寬度W4。
請參閱第6圖，該連接段142沿著該橫軸方向X具有一第一長度L1，該第二凸塊220沿著該縱軸方向Y具有一第二長度L2，較佳地，該連接段142長度不小於4倍的該第二凸塊220長度，因此該第一長度L1與該第二長度L2之比值大於或等於4(
Figure 02_image017
)，可根據該第二凸塊220之長度決定需要縮小寬度的該連接段142長度，在本實施例中，該支線段143位於該連接段142中央，該支線段143至該連接段142兩端的最短距離實質上相同，但本發明不以此為限制，該支線段143根據不同佈線設計需求選擇性地偏向該連接段142的其中一側。
請參閱第6圖，該連接段142至該第二凸塊220之間具有一直線距離LD，該直線距離LD為該連接段142與該第二凸塊220之間的最短距離，該直線距離LD與該第二寬度W2之比值(
Figure 02_image019
)與該焊料層300之厚度成正比，當第二寬度W2固定不變，但該焊料層300之厚度增加時，需要拉長該直線距離LD，以避免過多的焊料流動至該支線段143而造成橋接短路，較佳地，當該焊料層300厚度實質上等於0.16μm時，該直線距離LD須大於或等於3倍的該第二寬度W2，因此該直線距離LD與該第二寬度W2之比值大於或等於3(
Figure 02_image021
)，當該焊料層300厚度實質上等於0.18μm時，該直線距離LD須大於或等於4倍的該第二寬度W2，因此該直線距離LD與該第二寬度W2之比值大於或等於4(
Figure 02_image023
)。
第4至7圖所示之實施例中，該第二凸塊220沿著該橫軸方向X具有該第四寬度W4，沿著該縱軸方向Y具有該第二長度L2，且位於該支線段143兩側的該些虛設金屬圖案150為相同圖案，彼此鏡射對稱，不同於第4至7圖，在第8圖所示之實施例中，該第二凸塊220沿著該縱軸方向Y具有該第四寬度W4，沿著該橫軸方向X具有該第二長度L2，且位於該支線段143兩側的該些虛設金屬圖案150為不同圖案，彼此不對稱。
本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。
100:線路基板 110:載板 111:表面 112:外接合區 113:內接合區 113a:第一區 113b:第二區 120:線路層 121:外引腳 122:內引腳 130:防焊層 140:T型線路 141:主線段 142:連接段 143:支線段 143a:第一端 143b:第二端 150:虛設金屬圖案 200:晶片 210:第一凸塊 220:第二凸塊 300:焊料層 400:封裝膠體 I:覆晶接合結構 L1:第一長度 L2:第二長度 LD:直線長度 W1:第一寬度 W2:第二寬度 W3:第三寬度 W4:第四寬度 X:橫軸方向 Y:縱軸方向
第1圖：依據本發明之一實施例，一載板之上視圖。 第2圖：依據本發明之一實施例，一覆晶接合結構之上視圖。 第3圖：依據本發明之一實施例，一線路基板之內接合區之局部上視圖。 第4圖：第3圖之局部放大圖。 第5圖：第3圖之局部放大圖。 第6圖：第3圖之局部放大圖。 第7圖：依據本發明之一實施例，一線路基板之內接合區之局部上視圖。 第8圖：依據本發明之一實施例，一線路基板之內接合區之局部上視圖。 第9圖：依據本發明之一實施例，一覆晶接合結構之剖視圖。
111:表面
113a:第一區
113b:第二區
122:內引腳
140:T型線路
141:主線段
142:連接段
143:支線段
150:虛設金屬圖案
210:第一凸塊
220:第二凸塊
W1:第一寬度
W2:第二寬度
W3:第三寬度
X:橫軸方向
Y:縱軸方向

Claims (19)

  1. 一種線路基板，其包含： 一載板，具有一表面，該表面定義有一內接合區，該內接合區具有一第一區及一第二區，該第一區位於該第二區外側； 複數個內引腳，位於該第一區； 至少一T型線路，位於該第二區，該T型線路具有一主線段、一連接段及一支線段，該主線段連接該連接段並沿著一橫軸方向延伸，該支線段連接該連接段並沿著一縱軸方向朝該第一區延伸，該支線段用以接合一凸塊；以及 至少一虛設金屬圖案，位於該連接段及該些內引腳之間，該虛設金屬圖案未電性連接該些內引腳及該T型線路。
  2. 如請求項1之線路基板，其中該主線段沿著該縱軸方向具有一第一寬度，該連接段沿著該縱軸方向具有一第二寬度，該第二寬度小於該第一寬度。
  3. 如請求項2之線路基板，其中該支線段沿著該橫軸方向具有一第三寬度，該第二寬度與該第三寬度之比值不小於0.5。
  4. 如請求項1之線路基板，其中該支線段沿著該縱軸方向朝其中之一該內引腳延伸。
  5. 如請求項1之線路基板，其中該支線段沿著該縱軸方向延伸至相鄰兩個該內引腳之間。
  6. 如請求項1之線路基板，其中該支線段具有一第一端及一第二端，該第一端連接該連接段，該第二端用以接合該凸塊，該第一端之線寬大於該第二端之線寬。
  7. 如請求項1之線路基板，其中該支線段具有一第一端及一第二端，該第一端連接該連接段，該第二端用以接合該凸塊，該第一端及該第二端彼此垂直。
  8. 如請求項1之線路基板，其具有二虛設金屬圖案，該些虛設金屬圖案分別位於該支線段兩側。
  9. 一種覆晶接合結構，其包含： 一線路基板，具有一載板、複數個內引腳、至少一T型線路及至少一虛設金屬圖案，該載板之一表面定義有一內接合區，該內接合區具有一第一區及一第二區，該第一區位於該第二區外側，該些內引腳位於該第一區，該T型線路位於該第二區且具有一主線段、一連接段及一支線段，該主線段連接該連接段並沿著一橫軸方向延伸，該支線段連接該連接段並沿著一縱軸方向朝該第一區延伸，該虛設金屬圖案位於該連接段及該些內引腳之間，該虛設金屬圖案未電性連接該些內引腳及該T型線路； 一晶片，設置於該內接合區，該晶片具有複數個第一凸塊及至少一第二凸塊；以及 一焊料層，位於該線路基板及該晶片之間，該焊料層用以接合該些第一凸塊及該些內引腳，且該焊料層用以接合該第二凸塊及該支線段。
  10. 如請求項9之覆晶接合結構，其中該主線段沿著該縱軸方向具有一第一寬度，該連接段沿著該縱軸方向具有一第二寬度，該第二寬度小於該第一寬度。
  11. 如請求項10之覆晶接合結構，其中該支線段沿著該橫軸方向具有一第三寬度，該第二寬度與該第三寬度之比值不小於0.5。
  12. 如請求項9之覆晶接合結構，其中該支線段沿著該縱軸方向朝其中之一該內引腳延伸。
  13. 如請求項9之覆晶接合結構，其中該支線段沿著該縱軸方向延伸至相鄰兩個該內引腳之間。
  14. 如請求項9之覆晶接合結構，其中該支線段具有一第一端及一第二端，該第一端連接該連接段，該第二端用以接合該第二凸塊，該第一端之線寬大於該第二端之線寬。
  15. 如請求項9之覆晶接合結構，其中該支線段具有一第一端及一第二端，該第一端連接該連接段，該第二端用以接合該第二凸塊，該第一端及該第二端彼此垂直。
  16. 如請求項9之覆晶接合結構，其中該線路基板具有二虛設金屬圖案，該些虛設金屬圖案分別位於該支線段兩側。
  17. 如請求項10之覆晶接合結構，其中該第二凸塊具有一第四寬度，該第二寬度與該第四寬度之比值小於2。
  18. 如請求項10之覆晶接合結構，其中該連接段沿著該橫軸方向具有一第一長度，該第二凸塊具有一第二長度，該第一長度與該第二長度之比值不小於4。
  19. 如請求項10之覆晶接合結構，其中該連接段至該第二凸塊之間具有一直線距離，該直線距離與該第二寬度之比值不小於3。
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US17/038,237 US11322437B2 (en) 2020-02-26 2020-09-30 Flip chip interconnection and circuit board thereof
JP2020170601A JP7030166B2 (ja) 2020-02-26 2020-10-08 フリップチップボンディング構造体及びその回路基板
KR1020200130021A KR102375544B1 (ko) 2020-02-26 2020-10-08 플립칩 접합 구조 및 그 회로 기판
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