TW200636899A - Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program - Google Patents

Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program

Info

Publication number
TW200636899A
TW200636899A TW095102491A TW95102491A TW200636899A TW 200636899 A TW200636899 A TW 200636899A TW 095102491 A TW095102491 A TW 095102491A TW 95102491 A TW95102491 A TW 95102491A TW 200636899 A TW200636899 A TW 200636899A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate
substrate processing
adopted
program
Prior art date
Application number
TW095102491A
Other languages
English (en)
Other versions
TWI382482B (zh
Inventor
Noriaki Shimizu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200636899A publication Critical patent/TW200636899A/zh
Application granted granted Critical
Publication of TWI382482B publication Critical patent/TWI382482B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B17/00—Wheels characterised by rail-engaging elements
    • B60B17/0006—Construction of wheel bodies, e.g. disc wheels
    • B60B17/0013—Construction of wheel bodies, e.g. disc wheels formed by two or more axially spaced discs
    • B60B17/0017—Construction of wheel bodies, e.g. disc wheels formed by two or more axially spaced discs with insonorisation means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B17/00—Wheels characterised by rail-engaging elements
    • B60B17/0006—Construction of wheel bodies, e.g. disc wheels
    • B60B17/0024—Construction of wheel bodies, e.g. disc wheels with noise reducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61F—RAIL VEHICLE SUSPENSIONS, e.g. UNDERFRAMES, BOGIES OR ARRANGEMENTS OF WHEEL AXLES; RAIL VEHICLES FOR USE ON TRACKS OF DIFFERENT WIDTH; PREVENTING DERAILING OF RAIL VEHICLES; WHEEL GUARDS, OBSTRUCTION REMOVERS OR THE LIKE FOR RAIL VEHICLES
    • B61F13/00—Rail vehicles characterised by wheel arrangements, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B2900/00—Purpose of invention
    • B60B2900/10—Reduction of
    • B60B2900/133—Noise
TW095102491A 2005-01-24 2006-01-23 A substrate processing apparatus, and a substrate processing apparatus TWI382482B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005016174A JP4569956B2 (ja) 2005-01-24 2005-01-24 基板処理装置の復旧処理方法，基板処理装置，プログラム

Publications (2)

Publication Number Publication Date
TW200636899A true TW200636899A (en) 2006-10-16
TWI382482B TWI382482B (zh) 2013-01-11

Family

ID=36919041

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102491A TWI382482B (zh) 2005-01-24 2006-01-23 A substrate processing apparatus, and a substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4569956B2 (zh)
KR (1) KR100724173B1 (zh)
CN (1) CN100383919C (zh)
TW (1) TWI382482B (zh)

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TWI767617B (zh) * 2020-05-11 2022-06-11 大陸商中微半導體設備（上海）股份有限公司 半導體處理系統

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TWI533394B (zh) * 2007-06-21 2016-05-11 尼康股份有限公司 Conveying method and conveying device
JP4503088B2 (ja) * 2007-11-05 2010-07-14 株式会社日立国際電気 基板処理装置及び基板処理装置の表示方法
JP5511190B2 (ja) * 2008-01-23 2014-06-04 株式会社荏原製作所 基板処理装置の運転方法
JP5635270B2 (ja) * 2009-02-13 2014-12-03 株式会社日立国際電気 基板処理装置及び基板処理システム及び基板処理装置の表示方法及び基板処理装置のパラメータ設定方法及び記録媒体
WO2011078270A1 (ja) * 2009-12-24 2011-06-30 株式会社アルバック 真空処理装置の運用方法
CN103382554B (zh) * 2012-05-04 2015-08-19 无锡华润上华科技有限公司 常压化学气相沉积机台异常监控方法及系统
JP6169365B2 (ja) 2013-02-07 2017-07-26 株式会社日立国際電気 半導体装置の製造方法及び基板処理装置
JP6224359B2 (ja) 2013-06-20 2017-11-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のためのスケジュール作成方法およびスケジュール作成プログラム
CN104699019B (zh) * 2013-12-09 2019-09-17 中芯国际集成电路制造(上海)有限公司 机台恢复检验系统以及机台恢复检验方法
JP6165658B2 (ja) * 2014-03-20 2017-07-19 株式会社東芝 製造装置管理システム及び製造装置管理方法
JP6259698B2 (ja) 2014-03-28 2018-01-10 株式会社荏原製作所 基板処理方法
US10024825B2 (en) * 2014-12-26 2018-07-17 Axcelis Technologies, Inc. Wafer clamp detection based on vibration or acoustic characteristic analysis
KR102063322B1 (ko) 2016-05-27 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
JP6773497B2 (ja) * 2016-09-20 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理管理装置、基板処理管理方法および基板処理管理プログラム
CN106373913B (zh) * 2016-10-31 2019-02-19 北京北方华创微电子装备有限公司 一种半导体立式炉设备异常恢复的方法
CN107507788B (zh) * 2017-07-21 2019-11-08 志圣科技（广州）有限公司 晶圆加工机及其加工处理方法
JP6435388B2 (ja) * 2017-10-04 2018-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102204024B1 (ko) * 2018-03-15 2021-01-18 세메스 주식회사 기판 처리 장치 및 방법
JP7109287B2 (ja) * 2018-07-09 2022-07-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、および制御プログラム
JP7113722B2 (ja) * 2018-11-05 2022-08-05 東京エレクトロン株式会社 基板処理装置、基板収容容器の蓋を開閉する方法、及びプログラム
JP7303678B2 (ja) 2019-07-08 2023-07-05 東京エレクトロン株式会社 基板処理システム及び基板処理方法
CN110983301B (zh) * 2019-12-23 2022-08-05 通威太阳能（安徽）有限公司 一种镀膜管p设备高频自动补镀方法
JP2021166275A (ja) 2020-04-08 2021-10-14 株式会社ディスコ 加工装置及び加工方法
CN113658885B (zh) * 2021-08-12 2023-09-08 长鑫存储技术有限公司 制备腔室的确定方法及装置
CN116159809A (zh) * 2022-12-28 2023-05-26 深圳市纳设智能装备有限公司 晶圆传输方法
KR102607442B1 (ko) 2023-06-19 2023-11-29 주식회사 유니온스틸코퍼레이션 개선된 압축 성능의 고철 압축 및 절단 장치

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767617B (zh) * 2020-05-11 2022-06-11 大陸商中微半導體設備（上海）股份有限公司 半導體處理系統

Also Published As

Publication number Publication date
TWI382482B (zh) 2013-01-11
JP4569956B2 (ja) 2010-10-27
KR20060085590A (ko) 2006-07-27
JP2006203145A (ja) 2006-08-03
CN100383919C (zh) 2008-04-23
KR100724173B1 (ko) 2007-05-31
CN1819112A (zh) 2006-08-16

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