WO2009011166A1 - 真空処理装置および真空処理方法 - Google Patents

真空処理装置および真空処理方法 Download PDF

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Publication number
WO2009011166A1
WO2009011166A1 PCT/JP2008/059244 JP2008059244W WO2009011166A1 WO 2009011166 A1 WO2009011166 A1 WO 2009011166A1 JP 2008059244 W JP2008059244 W JP 2008059244W WO 2009011166 A1 WO2009011166 A1 WO 2009011166A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum processing
vacuum
processing chamber
section
supported
Prior art date
Application number
PCT/JP2008/059244
Other languages
English (en)
French (fr)
Inventor
Yusuke Fukuoka
Katsushi Kishimoto
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to US12/668,542 priority Critical patent/US20100187201A1/en
Priority to EP08764403A priority patent/EP2175482A4/en
Publication of WO2009011166A1 publication Critical patent/WO2009011166A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0209—Pretreatment of the material to be coated by heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　第１の処理室（１０１）内において被処理物（１０７）に真空処理を施している間に、次に処理されるべき被処理物が第２の処理室（１０２）の搬入部（１０８）において加熱される。真空処理された後の被処理物が第２の処理室の搬出部（１１９）に搬出される。搬入部および搬出部は、搬送機構（２０２Ａ）による被処理物の搬送方向（Ｘ）と垂直な配列方向（Ｙ）へと移動する。搬入部にて支持されている被処理物が第１の処理室内に搬入される。真空処理が施されている間に、新たな被処理物が搬入部に支持されて、搬出部に支持されている被処理物が第２の真空室から取出され、新たな被処理物が予備加熱される。
PCT/JP2008/059244 2007-07-13 2008-05-20 真空処理装置および真空処理方法 WO2009011166A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/668,542 US20100187201A1 (en) 2007-07-13 2008-05-20 Vacuum processing device and vacuum processing method
EP08764403A EP2175482A4 (en) 2007-07-13 2008-05-20 VACUUM PROCESSING DEVICE AND VACUUM PROCESSING METHOD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-184317 2007-07-13
JP2007184317A JP4280785B2 (ja) 2007-07-13 2007-07-13 真空処理装置および真空処理方法

Publications (1)

Publication Number Publication Date
WO2009011166A1 true WO2009011166A1 (ja) 2009-01-22

Family

ID=40259509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059244 WO2009011166A1 (ja) 2007-07-13 2008-05-20 真空処理装置および真空処理方法

Country Status (4)

Country Link
US (1) US20100187201A1 (ja)
EP (1) EP2175482A4 (ja)
JP (1) JP4280785B2 (ja)
WO (1) WO2009011166A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108950514A (zh) * 2018-08-28 2018-12-07 洛阳尚德太阳能电力有限公司 晶硅太阳能电池管式pecvd预热储舟装置及镀膜方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101452828B1 (ko) * 2012-08-28 2014-10-23 주식회사 유진테크 기판처리장치
WO2014142934A1 (en) * 2013-03-14 2014-09-18 Stones Bryon Apparatus for improved recovery of latent fingerprints
DE102013105896A1 (de) * 2013-06-07 2014-12-11 Aixtron Se Fertigungseinrichtung mit einem Magnetschienentransportsystem
CN104251250B (zh) * 2013-06-25 2016-03-02 英属开曼群岛商精曜有限公司 群集式真空接合系统
US20150087082A1 (en) * 2013-09-24 2015-03-26 Applied Materials, Inc. Selective heating during semiconductor device processing to compensate for substrate uniformity variations
CN115254551B (zh) * 2022-08-12 2023-06-13 广州思而特科技有限公司 一种玻璃侧边自动涂胶设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145929A (ja) * 1997-05-30 1999-02-16 Sharp Corp プラズマ処理装置
JP2001239144A (ja) 2000-02-29 2001-09-04 Shimadzu Corp ロードロック式真空装置
WO2005074020A1 (ja) 2004-01-30 2005-08-11 Sharp Kabushiki Kaisha 半導体製造装置およびそれを用いた半導体製造方法
JP2006054284A (ja) * 2004-08-11 2006-02-23 Shimadzu Corp 真空処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296735B1 (en) * 1993-05-03 2001-10-02 Unaxis Balzers Aktiengesellschaft Plasma treatment apparatus and method for operation same
US6468918B1 (en) * 1995-09-29 2002-10-22 Taiwan Semiconductor Manufacturing Company In situ photoresist hot bake in loading chamber of dry etch

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145929A (ja) * 1997-05-30 1999-02-16 Sharp Corp プラズマ処理装置
JP2001239144A (ja) 2000-02-29 2001-09-04 Shimadzu Corp ロードロック式真空装置
WO2005074020A1 (ja) 2004-01-30 2005-08-11 Sharp Kabushiki Kaisha 半導体製造装置およびそれを用いた半導体製造方法
JP2006054284A (ja) * 2004-08-11 2006-02-23 Shimadzu Corp 真空処理装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2175482A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108950514A (zh) * 2018-08-28 2018-12-07 洛阳尚德太阳能电力有限公司 晶硅太阳能电池管式pecvd预热储舟装置及镀膜方法

Also Published As

Publication number Publication date
JP2009021487A (ja) 2009-01-29
JP4280785B2 (ja) 2009-06-17
US20100187201A1 (en) 2010-07-29
EP2175482A4 (en) 2013-02-20
EP2175482A1 (en) 2010-04-14

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