WO2009025257A1 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
WO2009025257A1
WO2009025257A1 PCT/JP2008/064702 JP2008064702W WO2009025257A1 WO 2009025257 A1 WO2009025257 A1 WO 2009025257A1 JP 2008064702 W JP2008064702 W JP 2008064702W WO 2009025257 A1 WO2009025257 A1 WO 2009025257A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
substrate processing
substrate
conveyance
processing device
Prior art date
Application number
PCT/JP2008/064702
Other languages
English (en)
French (fr)
Inventor
Noritomo Tada
Yoshiaki Sasaki
Takashi Horiuchi
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2009025257A1 publication Critical patent/WO2009025257A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　本発明は、複数枚の基板を収納した搬送容器が搬入される搬入ポート（１２）と、前記搬入ポート（１２）に搬入された搬送容器（１０）から前記基板を取り出して搬送する基板搬送手段（１７）と、前記基板搬送手段（１７）によって搬送された前記基板に対して、所定の処理を行う処理部（５１）と、前記基板の裏面の滑り度合いの情報に基づいて、前記基板搬送手段（１７）による基板の搬送速度を設定する制御部（２）と、を備えたことを特徴とする基板処理装置である。
PCT/JP2008/064702 2007-08-20 2008-08-18 基板処理装置及び基板処理方法 WO2009025257A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007214062A JP2009049200A (ja) 2007-08-20 2007-08-20 基板処理装置、基板処理方法及び記憶媒体
JP2007-214062 2007-08-20

Publications (1)

Publication Number Publication Date
WO2009025257A1 true WO2009025257A1 (ja) 2009-02-26

Family

ID=40378159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064702 WO2009025257A1 (ja) 2007-08-20 2008-08-18 基板処理装置及び基板処理方法

Country Status (2)

Country Link
JP (1) JP2009049200A (ja)
WO (1) WO2009025257A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113808978A (zh) * 2020-06-17 2021-12-17 株式会社国际电气 基板处理装置、半导体装置的制造方法及存储介质

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5428556B2 (ja) * 2009-06-08 2014-02-26 東京エレクトロン株式会社 処理装置
US9149936B2 (en) * 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
JP6316742B2 (ja) * 2014-12-24 2018-04-25 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
JP7074977B2 (ja) 2015-03-12 2022-05-25 パーシモン テクノロジーズ コーポレイション エンドエフェクタの従動運動を伴うロボット
TWI743512B (zh) * 2018-07-06 2021-10-21 日商川崎重工業股份有限公司 基板搬送機器人及其控制方法
JP2020017645A (ja) * 2018-07-26 2020-01-30 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置
JP7412208B2 (ja) * 2020-02-17 2024-01-12 東京エレクトロン株式会社 搬送装置、処理システム及び搬送方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10124132A (ja) * 1996-10-21 1998-05-15 Tokico Ltd ロボット制御装置及びロボット
JPH11345857A (ja) * 1998-06-02 1999-12-14 Toshiba Corp 搬送装置
JP2001022423A (ja) * 1999-07-08 2001-01-26 Matsushita Electric Ind Co Ltd 搬送ロボットの動作速度・加速度最適化方法
JP2001289773A (ja) * 2000-04-07 2001-10-19 Mitsubishi Materials Silicon Corp 半導体ウェーハの滑り度測定方法およびその装置
JP2002110764A (ja) * 2000-09-28 2002-04-12 Hitachi Kokusai Electric Inc 基板処理装置
JP2006080198A (ja) * 2004-09-08 2006-03-23 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10124132A (ja) * 1996-10-21 1998-05-15 Tokico Ltd ロボット制御装置及びロボット
JPH11345857A (ja) * 1998-06-02 1999-12-14 Toshiba Corp 搬送装置
JP2001022423A (ja) * 1999-07-08 2001-01-26 Matsushita Electric Ind Co Ltd 搬送ロボットの動作速度・加速度最適化方法
JP2001289773A (ja) * 2000-04-07 2001-10-19 Mitsubishi Materials Silicon Corp 半導体ウェーハの滑り度測定方法およびその装置
JP2002110764A (ja) * 2000-09-28 2002-04-12 Hitachi Kokusai Electric Inc 基板処理装置
JP2006080198A (ja) * 2004-09-08 2006-03-23 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113808978A (zh) * 2020-06-17 2021-12-17 株式会社国际电气 基板处理装置、半导体装置的制造方法及存储介质
CN113808978B (zh) * 2020-06-17 2024-03-01 株式会社国际电气 基板处理装置、半导体装置的制造方法及存储介质

Also Published As

Publication number Publication date
JP2009049200A (ja) 2009-03-05

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