TW200613586A - Leveler compounds - Google Patents

Leveler compounds

Info

Publication number
TW200613586A
TW200613586A TW094124026A TW94124026A TW200613586A TW 200613586 A TW200613586 A TW 200613586A TW 094124026 A TW094124026 A TW 094124026A TW 94124026 A TW94124026 A TW 94124026A TW 200613586 A TW200613586 A TW 200613586A
Authority
TW
Taiwan
Prior art keywords
plating baths
layer
methods
diffusion coefficient
copper
Prior art date
Application number
TW094124026A
Other languages
English (en)
Other versions
TWI321167B (zh
Inventor
Deyan Wang
Robert D Mikkola
Chunyi Wu
George G Barclay
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200613586A publication Critical patent/TW200613586A/zh
Application granted granted Critical
Publication of TWI321167B publication Critical patent/TWI321167B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
TW094124026A 2004-07-22 2005-07-15 Leveler compounds TW200613586A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59039604P 2004-07-22 2004-07-22

Publications (2)

Publication Number Publication Date
TW200613586A true TW200613586A (en) 2006-05-01
TWI321167B TWI321167B (zh) 2010-03-01

Family

ID=35107035

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124026A TW200613586A (en) 2004-07-22 2005-07-15 Leveler compounds

Country Status (6)

Country Link
US (1) US7510639B2 (zh)
EP (2) EP2327814B1 (zh)
JP (2) JP5020486B2 (zh)
KR (1) KR101203217B1 (zh)
CN (1) CN1733978B (zh)
TW (1) TW200613586A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707989B (zh) * 2018-08-28 2020-10-21 日商傑希優股份有限公司 電鍍銅浴
TWI787534B (zh) * 2018-08-28 2022-12-21 日商傑希優股份有限公司 硫酸銅鍍敷液及使用其之硫酸銅鍍敷方法

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JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
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JP5497261B2 (ja) * 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
WO2008142770A1 (ja) * 2007-05-21 2008-11-27 C. Uyemura & Co., Ltd. 電気銅めっき浴
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JP5952738B2 (ja) 2009-11-27 2016-07-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 平滑化剤を含む金属電気メッキのための組成物
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US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
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SG185736A1 (en) 2010-06-01 2012-12-28 Basf Se Composition for metal electroplating comprising leveling agent
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JP5595301B2 (ja) * 2011-02-22 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
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CN105018977B (zh) * 2015-07-17 2017-09-12 深圳市板明科技有限公司 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液
CN105002527B (zh) * 2015-07-31 2017-06-16 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
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TWI608132B (zh) 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
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JP6579888B2 (ja) * 2015-09-29 2019-09-25 石原ケミカル株式会社 電気銅メッキ浴の製造方法並びに当該銅メッキ方法
JP6797193B6 (ja) * 2015-10-08 2021-01-20 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ アミン、ポリアクリルアミド、及びビスエポキシドの反応生成物を含有する銅電気めっき浴
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
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KR102483615B1 (ko) * 2018-01-24 2023-01-03 삼성전기주식회사 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법
CN110642731A (zh) * 2019-10-30 2020-01-03 苏州清飙科技有限公司 盲孔全铜电镀用整平剂及其制备方法、以及电镀液
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707989B (zh) * 2018-08-28 2020-10-21 日商傑希優股份有限公司 電鍍銅浴
TWI787534B (zh) * 2018-08-28 2022-12-21 日商傑希優股份有限公司 硫酸銅鍍敷液及使用其之硫酸銅鍍敷方法

Also Published As

Publication number Publication date
US20060016693A1 (en) 2006-01-26
EP2327814B1 (en) 2013-03-20
JP2006037232A (ja) 2006-02-09
JP2012149351A (ja) 2012-08-09
CN1733978A (zh) 2006-02-15
US7510639B2 (en) 2009-03-31
CN1733978B (zh) 2011-09-14
JP5020486B2 (ja) 2012-09-05
JP5518925B2 (ja) 2014-06-11
EP1619274A3 (en) 2010-08-11
EP1619274A2 (en) 2006-01-25
EP1619274B1 (en) 2011-11-23
KR101203217B1 (ko) 2012-11-20
EP2327814A1 (en) 2011-06-01
KR20060053908A (ko) 2006-05-22
TWI321167B (zh) 2010-03-01

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