WO2008142770A1 - 電気銅めっき浴 - Google Patents
電気銅めっき浴 Download PDFInfo
- Publication number
- WO2008142770A1 WO2008142770A1 PCT/JP2007/060364 JP2007060364W WO2008142770A1 WO 2008142770 A1 WO2008142770 A1 WO 2008142770A1 JP 2007060364 W JP2007060364 W JP 2007060364W WO 2008142770 A1 WO2008142770 A1 WO 2008142770A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper electroplating
- electroplating bath
- leveller
- water
- holes
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800530449A CN101796221B (zh) | 2007-05-21 | 2007-05-21 | 铜电镀浴 |
US12/599,436 US8679317B2 (en) | 2007-05-21 | 2007-05-21 | Copper electroplating bath |
TW096117961A TWI441955B (zh) | 2007-05-21 | 2007-05-21 | Electroplating copper bath |
EP07743798A EP2161355A4 (en) | 2007-05-21 | 2007-05-21 | ELECTROLYTIC COPPER BATH |
KR1020097025134A KR101417986B1 (ko) | 2007-05-21 | 2007-05-21 | 전기 구리 도금욕 |
PCT/JP2007/060364 WO2008142770A1 (ja) | 2007-05-21 | 2007-05-21 | 電気銅めっき浴 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/060364 WO2008142770A1 (ja) | 2007-05-21 | 2007-05-21 | 電気銅めっき浴 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008142770A1 true WO2008142770A1 (ja) | 2008-11-27 |
Family
ID=40031497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/060364 WO2008142770A1 (ja) | 2007-05-21 | 2007-05-21 | 電気銅めっき浴 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8679317B2 (ja) |
EP (1) | EP2161355A4 (ja) |
KR (1) | KR101417986B1 (ja) |
CN (1) | CN101796221B (ja) |
TW (1) | TWI441955B (ja) |
WO (1) | WO2008142770A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7888784B2 (en) * | 2008-09-30 | 2011-02-15 | Intel Corporation | Substrate package with through holes for high speed I/O flex cable |
JP5637671B2 (ja) * | 2009-09-16 | 2014-12-10 | 上村工業株式会社 | 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法 |
JP6031319B2 (ja) * | 2012-10-04 | 2016-11-24 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
KR20140092626A (ko) * | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법 |
CN103060860B (zh) * | 2013-01-22 | 2016-01-20 | 中南大学 | 一种印制线路板酸性镀铜电镀液及其制备和应用方法 |
CN104470260B (zh) * | 2013-09-13 | 2018-03-06 | 珠海方正科技高密电子有限公司 | 盲孔电镀填孔方法和电路板 |
CN103572336B (zh) * | 2013-11-20 | 2016-06-22 | 东莞市富默克化工有限公司 | 一种pcb盲孔电镀铜溶液及其制备方法和电镀方法 |
CN103732011B (zh) * | 2013-12-24 | 2016-06-08 | 广州兴森快捷电路科技有限公司 | 印制线路板盲孔的制作方法 |
JP6509635B2 (ja) * | 2015-05-29 | 2019-05-08 | 東芝メモリ株式会社 | 半導体装置、及び、半導体装置の製造方法 |
US10100420B2 (en) | 2015-12-29 | 2018-10-16 | Hong Kong Applied Science and Technology Research Institute Company Limtied | Plating leveler for electrodeposition of copper pillar |
KR20180086073A (ko) * | 2017-01-20 | 2018-07-30 | 삼성전기주식회사 | 기판 도금용 조성물 및 이를 이용한 도금 방법 |
CN109920798B (zh) * | 2019-02-01 | 2021-04-09 | 云谷(固安)科技有限公司 | 阵列基板及其制作方法和显示面板 |
TWI816388B (zh) * | 2021-05-17 | 2023-09-21 | 美商麥克達米德恩索龍股份有限公司 | 在印刷電路板或其它基板上填充穿孔的單步電解法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57114685A (en) * | 1981-01-07 | 1982-07-16 | Kuraray Co Ltd | Brightener for plating bath |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
JP2004068088A (ja) * | 2002-08-07 | 2004-03-04 | C Uyemura & Co Ltd | 硫酸銅めっき浴及び電気銅めっき方法 |
JP2005029818A (ja) * | 2003-07-09 | 2005-02-03 | Ebara Corp | めっき方法 |
JP2006057177A (ja) * | 2004-07-23 | 2006-03-02 | C Uyemura & Co Ltd | 電気銅めっき浴及び電気銅めっき方法 |
JP2007138265A (ja) * | 2005-11-21 | 2007-06-07 | C Uyemura & Co Ltd | 電気銅めっき浴 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE322956B (ja) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
KR100659544B1 (ko) | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | 비아 필링 방법 |
US20050006245A1 (en) | 2003-07-08 | 2005-01-13 | Applied Materials, Inc. | Multiple-step electrodeposition process for direct copper plating on barrier metals |
KR100366631B1 (ko) * | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
TWI228156B (en) | 2001-05-09 | 2005-02-21 | Ebara Udylite Kk | Copper-plating bath, method for electroplating substrate by using the same, and additives for the bath |
JP4793530B2 (ja) | 2001-07-02 | 2011-10-12 | 上村工業株式会社 | 硫酸銅めっき浴 |
US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
EP1422320A1 (en) | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
US20050072683A1 (en) * | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
JP2005126803A (ja) | 2003-10-27 | 2005-05-19 | Ebara Corp | めっき方法 |
US20050126919A1 (en) * | 2003-11-07 | 2005-06-16 | Makoto Kubota | Plating method, plating apparatus and a method of forming fine circuit wiring |
JP2005139516A (ja) | 2003-11-07 | 2005-06-02 | Ebara Corp | めっき方法およびめっき装置 |
TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
JP4499502B2 (ja) | 2004-08-05 | 2010-07-07 | 荏原ユージライト株式会社 | めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法 |
DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
-
2007
- 2007-05-21 CN CN2007800530449A patent/CN101796221B/zh active Active
- 2007-05-21 WO PCT/JP2007/060364 patent/WO2008142770A1/ja active Application Filing
- 2007-05-21 TW TW096117961A patent/TWI441955B/zh active
- 2007-05-21 US US12/599,436 patent/US8679317B2/en active Active
- 2007-05-21 EP EP07743798A patent/EP2161355A4/en not_active Withdrawn
- 2007-05-21 KR KR1020097025134A patent/KR101417986B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57114685A (en) * | 1981-01-07 | 1982-07-16 | Kuraray Co Ltd | Brightener for plating bath |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
JP2004068088A (ja) * | 2002-08-07 | 2004-03-04 | C Uyemura & Co Ltd | 硫酸銅めっき浴及び電気銅めっき方法 |
JP2005029818A (ja) * | 2003-07-09 | 2005-02-03 | Ebara Corp | めっき方法 |
JP2006057177A (ja) * | 2004-07-23 | 2006-03-02 | C Uyemura & Co Ltd | 電気銅めっき浴及び電気銅めっき方法 |
JP2007138265A (ja) * | 2005-11-21 | 2007-06-07 | C Uyemura & Co Ltd | 電気銅めっき浴 |
Also Published As
Publication number | Publication date |
---|---|
KR20100017562A (ko) | 2010-02-16 |
KR101417986B1 (ko) | 2014-07-09 |
TW200846506A (en) | 2008-12-01 |
TWI441955B (zh) | 2014-06-21 |
EP2161355A1 (en) | 2010-03-10 |
EP2161355A4 (en) | 2012-01-25 |
US8679317B2 (en) | 2014-03-25 |
CN101796221A (zh) | 2010-08-04 |
CN101796221B (zh) | 2012-07-04 |
US20100219081A1 (en) | 2010-09-02 |
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