JPS57114685A - Brightener for plating bath - Google Patents

Brightener for plating bath

Info

Publication number
JPS57114685A
JPS57114685A JP150881A JP150881A JPS57114685A JP S57114685 A JPS57114685 A JP S57114685A JP 150881 A JP150881 A JP 150881A JP 150881 A JP150881 A JP 150881A JP S57114685 A JPS57114685 A JP S57114685A
Authority
JP
Japan
Prior art keywords
brightener
modified pva
contg
copolymer
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP150881A
Other languages
Japanese (ja)
Other versions
JPS6364519B2 (en
Inventor
Tohei Moriya
Junnosuke Yamauchi
Makoto Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Priority to JP150881A priority Critical patent/JPS57114685A/en
Publication of JPS57114685A publication Critical patent/JPS57114685A/en
Publication of JPS6364519B2 publication Critical patent/JPS6364519B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To provide a brightener made of modified PVA contg. a cationic group in a molecule and giving a plated surface with superior brightness when added to an alkaline or acidic plating bath free from highly toxious cyanide.
CONSTITUTION: Modified PVA contg. a cationic group in a molecule including a copolymerization unit represented by the formula is manufactured as follows: vinyl acetate is copolymerized with a copolymerizable monomer corresponding to the copolymerization unit in the presence of a radical polymn. initiator, and by allowing an alkali or acid catalyst to act on an alcoholic soln. of the rsulting copolymer, vinyl ester units in the copolymer are saponified to the desired degree to form vinyl alcohol units. The modified PVA shows a remarkable effect in various kinds of plating baths as a brightener when added by about 0.1W20g/l.
COPYRIGHT: (C)1982,JPO&Japio
JP150881A 1981-01-07 1981-01-07 Brightener for plating bath Granted JPS57114685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP150881A JPS57114685A (en) 1981-01-07 1981-01-07 Brightener for plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP150881A JPS57114685A (en) 1981-01-07 1981-01-07 Brightener for plating bath

Publications (2)

Publication Number Publication Date
JPS57114685A true JPS57114685A (en) 1982-07-16
JPS6364519B2 JPS6364519B2 (en) 1988-12-12

Family

ID=11503414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP150881A Granted JPS57114685A (en) 1981-01-07 1981-01-07 Brightener for plating bath

Country Status (1)

Country Link
JP (1) JPS57114685A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127887A (en) * 1984-11-26 1986-06-16 Kawasaki Steel Corp Acidic galvanizing bath
JP2003193286A (en) * 2001-12-27 2003-07-09 Ishihara Chem Co Ltd Gold - tin alloy plating bath
JP2004307991A (en) * 2002-11-11 2004-11-04 Toppan Printing Co Ltd Copper plating hardness maintaining agent and copper plating method, and gravure plate and lens die using the method
WO2005010239A1 (en) * 2003-07-29 2005-02-03 Nikko Materials Co., Ltd. Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith
JP2006057177A (en) * 2004-07-23 2006-03-02 C Uyemura & Co Ltd Electrolytic copper-plating bath and electrolytic copper-plating method
JP2007517140A (en) * 2003-12-22 2007-06-28 エントン インコーポレイテッド Copper electrodeposition in microelectronics.
JP2008533224A (en) * 2005-03-11 2008-08-21 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Polyvinylammonium compound, method for producing polyvinylammonium compound, acidic solution containing polyvinylammonium compound and method for electrolytically depositing copper plating
WO2008142770A1 (en) * 2007-05-21 2008-11-27 C. Uyemura & Co., Ltd. Copper electroplating bath
JP2013503968A (en) * 2009-09-08 2013-02-04 アトテック・ドイチュラント・ゲーエムベーハー Polymers having terminal amino groups and their use as additives for zinc or zinc alloy electrodeposition baths
JP5524833B2 (en) * 2008-05-28 2014-06-18 三井金属鉱業株式会社 Copper foil roughening treatment method and copper foil for printed wiring board obtained by the roughening treatment method
WO2014162875A1 (en) * 2013-04-02 2014-10-09 株式会社Adeka Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004059040A1 (en) * 2002-12-25 2004-07-15 Nikko Materials Co., Ltd. Copper electrolytic solution containing quaternary amine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127887A (en) * 1984-11-26 1986-06-16 Kawasaki Steel Corp Acidic galvanizing bath
JPH0533318B2 (en) * 1984-11-26 1993-05-19 Kawasaki Seitetsu Kk
JP2003193286A (en) * 2001-12-27 2003-07-09 Ishihara Chem Co Ltd Gold - tin alloy plating bath
JP4534460B2 (en) * 2002-11-11 2010-09-01 凸版印刷株式会社 Copper plating hardness maintenance agent, copper plating method, and gravure plate and lens mold using the same
JP2004307991A (en) * 2002-11-11 2004-11-04 Toppan Printing Co Ltd Copper plating hardness maintaining agent and copper plating method, and gravure plate and lens die using the method
WO2005010239A1 (en) * 2003-07-29 2005-02-03 Nikko Materials Co., Ltd. Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith
JP2007517140A (en) * 2003-12-22 2007-06-28 エントン インコーポレイテッド Copper electrodeposition in microelectronics.
JP2006057177A (en) * 2004-07-23 2006-03-02 C Uyemura & Co Ltd Electrolytic copper-plating bath and electrolytic copper-plating method
JP2008533224A (en) * 2005-03-11 2008-08-21 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Polyvinylammonium compound, method for producing polyvinylammonium compound, acidic solution containing polyvinylammonium compound and method for electrolytically depositing copper plating
WO2008142770A1 (en) * 2007-05-21 2008-11-27 C. Uyemura & Co., Ltd. Copper electroplating bath
US8679317B2 (en) 2007-05-21 2014-03-25 C. Uyemura & Co., Ltd. Copper electroplating bath
JP5524833B2 (en) * 2008-05-28 2014-06-18 三井金属鉱業株式会社 Copper foil roughening treatment method and copper foil for printed wiring board obtained by the roughening treatment method
JP2013503968A (en) * 2009-09-08 2013-02-04 アトテック・ドイチュラント・ゲーエムベーハー Polymers having terminal amino groups and their use as additives for zinc or zinc alloy electrodeposition baths
WO2014162875A1 (en) * 2013-04-02 2014-10-09 株式会社Adeka Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath
CN105102687A (en) * 2013-04-02 2015-11-25 株式会社Adeka Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath

Also Published As

Publication number Publication date
JPS6364519B2 (en) 1988-12-12

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