JPS57114685A - Brightener for plating bath - Google Patents
Brightener for plating bathInfo
- Publication number
- JPS57114685A JPS57114685A JP150881A JP150881A JPS57114685A JP S57114685 A JPS57114685 A JP S57114685A JP 150881 A JP150881 A JP 150881A JP 150881 A JP150881 A JP 150881A JP S57114685 A JPS57114685 A JP S57114685A
- Authority
- JP
- Japan
- Prior art keywords
- brightener
- modified pva
- contg
- copolymer
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To provide a brightener made of modified PVA contg. a cationic group in a molecule and giving a plated surface with superior brightness when added to an alkaline or acidic plating bath free from highly toxious cyanide.
CONSTITUTION: Modified PVA contg. a cationic group in a molecule including a copolymerization unit represented by the formula is manufactured as follows: vinyl acetate is copolymerized with a copolymerizable monomer corresponding to the copolymerization unit in the presence of a radical polymn. initiator, and by allowing an alkali or acid catalyst to act on an alcoholic soln. of the rsulting copolymer, vinyl ester units in the copolymer are saponified to the desired degree to form vinyl alcohol units. The modified PVA shows a remarkable effect in various kinds of plating baths as a brightener when added by about 0.1W20g/l.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP150881A JPS57114685A (en) | 1981-01-07 | 1981-01-07 | Brightener for plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP150881A JPS57114685A (en) | 1981-01-07 | 1981-01-07 | Brightener for plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57114685A true JPS57114685A (en) | 1982-07-16 |
JPS6364519B2 JPS6364519B2 (en) | 1988-12-12 |
Family
ID=11503414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP150881A Granted JPS57114685A (en) | 1981-01-07 | 1981-01-07 | Brightener for plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57114685A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127887A (en) * | 1984-11-26 | 1986-06-16 | Kawasaki Steel Corp | Acidic galvanizing bath |
JP2003193286A (en) * | 2001-12-27 | 2003-07-09 | Ishihara Chem Co Ltd | Gold - tin alloy plating bath |
JP2004307991A (en) * | 2002-11-11 | 2004-11-04 | Toppan Printing Co Ltd | Copper plating hardness maintaining agent and copper plating method, and gravure plate and lens die using the method |
WO2005010239A1 (en) * | 2003-07-29 | 2005-02-03 | Nikko Materials Co., Ltd. | Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith |
JP2006057177A (en) * | 2004-07-23 | 2006-03-02 | C Uyemura & Co Ltd | Electrolytic copper-plating bath and electrolytic copper-plating method |
JP2007517140A (en) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | Copper electrodeposition in microelectronics. |
JP2008533224A (en) * | 2005-03-11 | 2008-08-21 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Polyvinylammonium compound, method for producing polyvinylammonium compound, acidic solution containing polyvinylammonium compound and method for electrolytically depositing copper plating |
WO2008142770A1 (en) * | 2007-05-21 | 2008-11-27 | C. Uyemura & Co., Ltd. | Copper electroplating bath |
JP2013503968A (en) * | 2009-09-08 | 2013-02-04 | アトテック・ドイチュラント・ゲーエムベーハー | Polymers having terminal amino groups and their use as additives for zinc or zinc alloy electrodeposition baths |
JP5524833B2 (en) * | 2008-05-28 | 2014-06-18 | 三井金属鉱業株式会社 | Copper foil roughening treatment method and copper foil for printed wiring board obtained by the roughening treatment method |
WO2014162875A1 (en) * | 2013-04-02 | 2014-10-09 | 株式会社Adeka | Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004059040A1 (en) * | 2002-12-25 | 2004-07-15 | Nikko Materials Co., Ltd. | Copper electrolytic solution containing quaternary amine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith |
-
1981
- 1981-01-07 JP JP150881A patent/JPS57114685A/en active Granted
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127887A (en) * | 1984-11-26 | 1986-06-16 | Kawasaki Steel Corp | Acidic galvanizing bath |
JPH0533318B2 (en) * | 1984-11-26 | 1993-05-19 | Kawasaki Seitetsu Kk | |
JP2003193286A (en) * | 2001-12-27 | 2003-07-09 | Ishihara Chem Co Ltd | Gold - tin alloy plating bath |
JP4534460B2 (en) * | 2002-11-11 | 2010-09-01 | 凸版印刷株式会社 | Copper plating hardness maintenance agent, copper plating method, and gravure plate and lens mold using the same |
JP2004307991A (en) * | 2002-11-11 | 2004-11-04 | Toppan Printing Co Ltd | Copper plating hardness maintaining agent and copper plating method, and gravure plate and lens die using the method |
WO2005010239A1 (en) * | 2003-07-29 | 2005-02-03 | Nikko Materials Co., Ltd. | Copper electrolytic solution containing polymer having dialkylamino group of specified structure and organic sulfur compound as additive and electrolytic copper foil produced therewith |
JP2007517140A (en) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | Copper electrodeposition in microelectronics. |
JP2006057177A (en) * | 2004-07-23 | 2006-03-02 | C Uyemura & Co Ltd | Electrolytic copper-plating bath and electrolytic copper-plating method |
JP2008533224A (en) * | 2005-03-11 | 2008-08-21 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Polyvinylammonium compound, method for producing polyvinylammonium compound, acidic solution containing polyvinylammonium compound and method for electrolytically depositing copper plating |
WO2008142770A1 (en) * | 2007-05-21 | 2008-11-27 | C. Uyemura & Co., Ltd. | Copper electroplating bath |
US8679317B2 (en) | 2007-05-21 | 2014-03-25 | C. Uyemura & Co., Ltd. | Copper electroplating bath |
JP5524833B2 (en) * | 2008-05-28 | 2014-06-18 | 三井金属鉱業株式会社 | Copper foil roughening treatment method and copper foil for printed wiring board obtained by the roughening treatment method |
JP2013503968A (en) * | 2009-09-08 | 2013-02-04 | アトテック・ドイチュラント・ゲーエムベーハー | Polymers having terminal amino groups and their use as additives for zinc or zinc alloy electrodeposition baths |
WO2014162875A1 (en) * | 2013-04-02 | 2014-10-09 | 株式会社Adeka | Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath |
CN105102687A (en) * | 2013-04-02 | 2015-11-25 | 株式会社Adeka | Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath |
Also Published As
Publication number | Publication date |
---|---|
JPS6364519B2 (en) | 1988-12-12 |
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