TW200603332A - Sucking equipment - Google Patents

Sucking equipment

Info

Publication number
TW200603332A
TW200603332A TW094112783A TW94112783A TW200603332A TW 200603332 A TW200603332 A TW 200603332A TW 094112783 A TW094112783 A TW 094112783A TW 94112783 A TW94112783 A TW 94112783A TW 200603332 A TW200603332 A TW 200603332A
Authority
TW
Taiwan
Prior art keywords
sucking
dicing tape
trench
wafer
equipment
Prior art date
Application number
TW094112783A
Other languages
English (en)
Chinese (zh)
Other versions
TWI355709B (enExample
Inventor
Kenji Kobayashi
Masaki Tsujimoto
Takahisa Yoshioka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200603332A publication Critical patent/TW200603332A/zh
Application granted granted Critical
Publication of TWI355709B publication Critical patent/TWI355709B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
TW094112783A 2004-04-23 2005-04-21 Sucking equipment TW200603332A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004128214A JP4297829B2 (ja) 2004-04-23 2004-04-23 吸着装置

Publications (2)

Publication Number Publication Date
TW200603332A true TW200603332A (en) 2006-01-16
TWI355709B TWI355709B (enExample) 2012-01-01

Family

ID=35197263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112783A TW200603332A (en) 2004-04-23 2005-04-21 Sucking equipment

Country Status (7)

Country Link
US (1) US7798195B2 (enExample)
EP (1) EP1742254A1 (enExample)
JP (1) JP4297829B2 (enExample)
KR (1) KR20070004027A (enExample)
CN (1) CN100437928C (enExample)
TW (1) TW200603332A (enExample)
WO (1) WO2005104201A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4688728B2 (ja) * 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
JP2009043771A (ja) * 2007-08-06 2009-02-26 Disco Abrasive Syst Ltd チャックテーブル機構および被加工物の保持方法
JP5147425B2 (ja) * 2007-08-14 2013-02-20 株式会社東京精密 ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
WO2009022495A1 (ja) * 2007-08-14 2009-02-19 Tokyo Seimitsu Co., Ltd. ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
JP5203827B2 (ja) * 2008-07-14 2013-06-05 リンテック株式会社 保持装置
US20100059183A1 (en) * 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine
JP2010067782A (ja) * 2008-09-10 2010-03-25 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離装置
JP5159650B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5159649B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5381821B2 (ja) * 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
KR102043656B1 (ko) * 2010-06-07 2019-11-12 니폰 덴키 가라스 가부시키가이샤 판 형상 부재의 이송 장치 및 흡착 패드
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
JP6076856B2 (ja) * 2013-08-09 2017-02-08 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP5996347B2 (ja) * 2012-09-24 2016-09-21 リンテック株式会社 シート剥離装置及び剥離方法、並びに、シート貼替装置及び貼替方法
US20140238617A1 (en) * 2013-02-28 2014-08-28 General Electric Company System and method for removal of a layer
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101969092B1 (ko) * 2013-04-10 2019-04-16 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
CN103317824A (zh) * 2013-06-19 2013-09-25 深圳市华星光电技术有限公司 离型纸剥离装置
JP6104075B2 (ja) * 2013-06-28 2017-03-29 日本特殊陶業株式会社 真空吸着装置およびその製造方法
JP6340249B2 (ja) * 2014-05-28 2018-06-06 株式会社荏原製作所 テープ貼り付け装置およびテープ貼り付け方法
JP2016147342A (ja) * 2015-02-12 2016-08-18 株式会社ディスコ 加工装置のチャックテーブル
JP6704794B2 (ja) * 2016-05-30 2020-06-03 株式会社ディスコ 保護膜形成装置
JP2017224671A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 剥離装置
KR102898051B1 (ko) * 2020-03-13 2025-12-10 삼성전자주식회사 펠리클 전사 장치 및 펠리클 전사 방법
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
JP7766467B2 (ja) * 2021-10-26 2025-11-10 株式会社ディスコ 剥離治具、剥離治具を用いたシート剥離方法及びシート剥離装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930631A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 吸着保持装置
US5180000A (en) * 1989-05-08 1993-01-19 Balzers Aktiengesellschaft Workpiece carrier with suction slot for a disk-shaped workpiece
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2001319906A (ja) * 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP4739584B2 (ja) * 2001-07-05 2011-08-03 リンテック株式会社 剥離装置
JP4026680B2 (ja) * 2001-12-07 2007-12-26 株式会社ディスコ 板状物支持部材及びその使用方法
JP2003209082A (ja) * 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
JP2004128115A (ja) * 2002-10-01 2004-04-22 Hitachi Chem Co Ltd 減圧固定用フィルム、ウエハ保護フィルム、ダイシングフィルム及び半導体装置の製造方法
JP2005175384A (ja) * 2003-12-15 2005-06-30 Nitto Denko Corp 保護テープの貼付方法及び剥離方法

Also Published As

Publication number Publication date
EP1742254A1 (en) 2007-01-10
CN100437928C (zh) 2008-11-26
KR20070004027A (ko) 2007-01-05
TWI355709B (enExample) 2012-01-01
US7798195B2 (en) 2010-09-21
CN1947226A (zh) 2007-04-11
JP4297829B2 (ja) 2009-07-15
US20070169895A1 (en) 2007-07-26
EP1742254A8 (en) 2007-02-21
WO2005104201A1 (ja) 2005-11-03
JP2005311176A (ja) 2005-11-04

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MM4A Annulment or lapse of patent due to non-payment of fees