MY173967A - Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism - Google Patents
Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanismInfo
- Publication number
- MY173967A MY173967A MYPI2015002168A MYPI2015002168A MY173967A MY 173967 A MY173967 A MY 173967A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY 173967 A MY173967 A MY 173967A
- Authority
- MY
- Malaysia
- Prior art keywords
- sucking
- sucking mechanism
- vacuum
- sucking member
- holes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Jigs For Machine Tools (AREA)
Abstract
In an sucking member of a cutting apparatus, a vibration absorbing material is used to increase a frictional force on the surface of the sucking member. [Solution] In a cutting apparatus, a base (17) with a vacuum sucking jig (7) attached thereon is used as a cutting table (16). On the cutting table (16), a plurality of suction holes (13) formed in a sucking member (9), a plurality of through holes (14) formed in a metal plate (18), and a space (18) present on the base (17) are in communication with one another. By using a vacuum pump (21), air is suctioned sequentially via the space (18), through holes (14), and suction holes (13) to suck a sealed substrate (1) or a plurality of product regions (6). A vibration absorbing material is used in the sucking member (9) to lessen vibration on the surface of the sucking member (9) to consequently increase a frictional force on the surface of the vacuum sucking jig (7). This may allow the vacuum sucking jig (7) to hold the sealed substrate (1) or the product regions (6) with a greater holding power.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014180254A JP6382039B2 (en) | 2014-09-04 | 2014-09-04 | Cutting apparatus, adsorption mechanism and apparatus using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MY173967A true MY173967A (en) | 2020-02-28 |
Family
ID=55471207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015002168A MY173967A (en) | 2014-09-04 | 2015-09-03 | Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6382039B2 (en) |
KR (1) | KR20160028953A (en) |
CN (1) | CN105405805A (en) |
MY (1) | MY173967A (en) |
TW (1) | TWI566291B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101899653B1 (en) * | 2016-10-05 | 2018-09-18 | 주식회사 포스코 | Workpiece setting apparatus |
JP6791581B2 (en) * | 2016-11-11 | 2020-11-25 | 株式会社ディスコ | Jig table for cutting package substrate |
JP6626027B2 (en) * | 2017-03-16 | 2019-12-25 | Towa株式会社 | Manufacturing apparatus and electronic component manufacturing method |
JP2019016700A (en) * | 2017-07-07 | 2019-01-31 | Towa株式会社 | Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component |
JP6886379B2 (en) * | 2017-09-28 | 2021-06-16 | Towa株式会社 | Holding member, manufacturing method of holding member, inspection device and cutting device |
JP7102157B2 (en) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | Cutting device and manufacturing method of cut products |
CN108435714B (en) * | 2018-04-12 | 2023-08-29 | 环维电子(上海)有限公司 | Novel dry ice cleaning base and cleaning method thereof |
JP6746756B1 (en) * | 2019-05-24 | 2020-08-26 | Towa株式会社 | Suction plate, cutting device and cutting method |
JP7390855B2 (en) * | 2019-10-24 | 2023-12-04 | 株式会社ディスコ | Chuck table of cutting equipment |
JP7423161B2 (en) | 2020-06-30 | 2024-01-29 | 株式会社ディスコ | chuck table |
WO2022195931A1 (en) * | 2021-03-18 | 2022-09-22 | Towa株式会社 | Processing apparatus and processed article manufacturing method |
US11993066B2 (en) * | 2021-03-31 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck, lamination process, and manufacturing method of semiconductor package using the same |
WO2024084715A1 (en) * | 2022-10-21 | 2024-04-25 | 株式会社東光高岳 | Workpiece inspection device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62234686A (en) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | Cutting method for working material |
JPS62234685A (en) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | Cutting method for working material |
KR20040084128A (en) * | 2003-03-26 | 2004-10-06 | 한미반도체 주식회사 | Chuck table of Sawing equipment |
JP2004330417A (en) * | 2003-04-30 | 2004-11-25 | Towa Corp | Board cutting method, board cutting device and board sucking and fixing mechanism |
JP2006229129A (en) * | 2005-02-21 | 2006-08-31 | Fujitsu Ltd | Vacuum suction apparatus |
JP2006344827A (en) * | 2005-06-09 | 2006-12-21 | Renesas Technology Corp | Method for manufacturing semiconductor device |
FR2893873B1 (en) * | 2005-11-25 | 2008-12-12 | Air Liquide | PROCESS FOR CUTTING WITH A STAINLESS STEEL FIBER LASER |
JP2008221391A (en) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | Board sucking and fixing mechanism |
JP5086690B2 (en) * | 2007-05-18 | 2012-11-28 | 日本特殊陶業株式会社 | Manufacturing method of ceramic substrate |
JP5117772B2 (en) * | 2007-06-28 | 2013-01-16 | 株式会社ディスコ | Cutting equipment |
JP2011040542A (en) | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | Dividing method of package substrate |
JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
-
2014
- 2014-09-04 JP JP2014180254A patent/JP6382039B2/en active Active
-
2015
- 2015-08-11 CN CN201510490571.2A patent/CN105405805A/en active Pending
- 2015-08-12 TW TW104126196A patent/TWI566291B/en active
- 2015-08-20 KR KR1020150117404A patent/KR20160028953A/en not_active Application Discontinuation
- 2015-09-03 MY MYPI2015002168A patent/MY173967A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2016054256A (en) | 2016-04-14 |
JP6382039B2 (en) | 2018-08-29 |
TWI566291B (en) | 2017-01-11 |
TW201616566A (en) | 2016-05-01 |
CN105405805A (en) | 2016-03-16 |
KR20160028953A (en) | 2016-03-14 |
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