JP2016054256A5 - - Google Patents
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- JP2016054256A5 JP2016054256A5 JP2014180254A JP2014180254A JP2016054256A5 JP 2016054256 A5 JP2016054256 A5 JP 2016054256A5 JP 2014180254 A JP2014180254 A JP 2014180254A JP 2014180254 A JP2014180254 A JP 2014180254A JP 2016054256 A5 JP2016054256 A5 JP 2016054256A5
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- suction
- absorbing material
- holes
- vibration absorbing
- temperature range
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- 235000020127 ayran Nutrition 0.000 claims description 16
- 230000000875 corresponding Effects 0.000 claims description 5
- 239000011358 absorbing material Substances 0.000 claims 16
- 230000000149 penetrating Effects 0.000 claims 3
- 239000006096 absorbing agent Substances 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
例えば、常温の２０℃〜２５℃の範囲で加工水を使用する場合には、この温度範囲においては図４の（ａ）で示される制振ゴムの損失係数tanδが最も大きいので、（ａ）の制振ゴムを使用することが望ましい。冷却して５℃〜１５℃の範囲で加工水を使用する場合には、この温度範囲においては（ｃ）で示される制振ゴムの損失係数tanδが最も大きいので、（ｃ）の制振ゴムを使用することが望ましい。また、１５℃〜２０℃の範囲で加工水を使用する場合には、この温度範囲の大部分においては（ｂ）で示される制振ゴムの損失係数tanδが大きいので、（ｂ）の制振ゴムを使用することが望ましい。したがって、使用する加工水の温度によって、最適な制振ゴムを選択することが重要である。切断装置において、加工水を使用する温度範囲において損失係数tanδが大きい制振ゴムを用いることによって、切断用テーブル１６の吸着部材９の表面における摩擦力を大きくすることができる。したがって、封止済基板１、又は、製品に相当する各領域６を切断用テーブル１６に保持する保持力を大きくすることができる。
For example, when processing water is used in the range of 20 ° C. to 25 ° C. at normal temperature, the loss coefficient tan δ of the damping rubber shown in FIG. 4A is the largest in this temperature range. It is desirable to use a vibration-damping rubber. When processing water is used in the range of 5 ° C. to 15 ° C. after cooling, the damping coefficient tan δ of the damping rubber indicated by (c) is the largest in this temperature range. It is desirable to use When the processing water is used in the range of 15 ° C. to 20 ° C., since the loss coefficient tan δ of the vibration damping rubber shown in (b) is large in most of this temperature range, the vibration damping of (b) It is desirable to use rubber. Therefore, it is important to select an optimal vibration damping rubber depending on the temperature of the processing water to be used. In the cutting device, by using a vibration-damping rubber having a large loss coefficient tan δ in the temperature range where the processing water is used, the frictional force on the surface of the suction member 9 of the cutting table 16 can be increased. Accordingly, the holding force for holding the sealed substrate 1 or each region 6 corresponding to a product on the cutting table 16 can be increased.
Claims (22)
前記テーブルが有する基台と、
前記基台の上に取り付けられた吸着治具と、
前記吸着治具が有するプレートと、
前記プレートの上に設けられた吸着部材と、
前記吸着部材に設けられ前記複数の領域にそれぞれ対応する複数の突起と、
前記複数の突起のそれぞれにおける上面から前記吸着部材の底面まで貫通する複数の吸着孔と、
前記プレートに設けられ前記複数の吸着孔にそれぞれ連通する複数の貫通孔と、
前記基台に設けられ前記複数の貫通孔につながる空間とを備え、
前記吸着部材は振動吸収材からなり、少なくとも前記空間と前記複数の貫通孔と前記複数の吸着孔とを順次経由して前記吸引機構が前記被切断物又は前記複数の製品を吸引することによって、前記被切断物又は前記複数の製品が前記吸着治具に吸着されることを特徴とする切断装置。 A table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is placed, a suction mechanism for sucking the workpiece, a cutting means for cutting the workpiece, the table, and the cutting A cutting mechanism for use in manufacturing a plurality of products corresponding to each of the plurality of regions by dividing the object to be cut into pieces,
A base of the table;
A suction jig mounted on the base;
A plate of the suction jig;
An adsorbing member provided on the plate;
A plurality of protrusions provided on the adsorption member and corresponding to the plurality of regions,
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction member;
A plurality of through holes provided in the plate and respectively communicating with the plurality of suction holes;
A space provided in the base and connected to the plurality of through holes,
The suction member is made of a vibration absorbing material, and the suction mechanism sucks the object to be cut or the plurality of products through at least the space, the plurality of through holes, and the plurality of suction holes in order, The cutting apparatus, wherein the object to be cut or the plurality of products are sucked by the suction jig.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが最大値を有することを特徴とする切断装置。 The cutting device according to claim 1, wherein
The cutting device, wherein the loss coefficient tan δ of the vibration absorbing material has a maximum value in a temperature range of 5 ° C to 30 ° C.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．５以上であることを特徴とする切断装置。 The cutting device according to claim 2, wherein
A cutting apparatus characterized in that a loss coefficient tan δ of the vibration absorbing material is 0.5 or more in a temperature range of 5 ° C to 30 ° C.
温度が１０℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．７以上であることを特徴とする切断装置。 The cutting device according to claim 2, wherein
A cutting device characterized in that a loss coefficient tan δ of the vibration absorbing material is 0.7 or more in a temperature range of 10 ° C to 30 ° C.
温度が１５℃〜２５℃の範囲において前記振動吸収材の損失係数tanδが１．０以上であることを特徴とする切断装置。 The cutting device according to claim 2, wherein
A cutting device characterized in that a loss coefficient tan δ of the vibration absorbing material is 1.0 or more in a temperature range of 15 ° C to 25 ° C.
前記振動吸収材のショア硬さがＡ４０〜Ａ６０であることを特徴とする切断装置。 In the cutting device according to any one of claims 1 to 5,
The cutting device characterized in that the Shore hardness of the vibration absorbing material is A40 to A60.
前記テーブルが有する基台と、
前記基台の上に取り付けられた吸着治具と、
前記吸着治具が有するプレートと、
前記プレートの上に設けられた吸着部材と、
前記吸着部材に設けられ前記複数の対象物にそれぞれ対応する複数の突起と、
前記複数の突起のそれぞれにおける上面から前記吸着部材の底面まで貫通する複数の吸着孔と、
前記プレートに設けられ前記複数の吸着孔にそれぞれ連通する複数の貫通孔と、
前記基台に設けられ前記複数の貫通孔につながり、かつ、吸引機構につながることができる空間とを備え、
前記吸着部材は振動吸収材からなり、少なくとも前記空間と前記複数の貫通孔と前記複数の吸着孔とを順次経由して前記複数の対象物が吸引されることによって、前記複数の対象物が前記吸着治具に吸着されることを特徴とする吸着機構。 A suction mechanism having a table for sucking a plurality of objects,
A base of the table;
A suction jig mounted on the base;
A plate of the suction jig;
An adsorbing member provided on the plate;
A plurality of protrusions provided on the suction member and respectively corresponding to the plurality of objects;
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction member;
A plurality of through holes provided in the plate and respectively communicating with the plurality of suction holes;
A space provided in the base, connected to the plurality of through holes, and connected to a suction mechanism;
The suction member is made of a vibration absorbing material, and the plurality of objects are sucked through the space, the plurality of through holes, and the plurality of suction holes in order, so that the plurality of objects are A suction mechanism characterized by being sucked by a suction jig.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが最大値を有することを特徴とする吸着機構。 The adsorption mechanism according to claim 7,
The adsorption mechanism characterized in that the loss coefficient tan δ of the vibration absorber has a maximum value in the temperature range of 5 ° C to 30 ° C.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．５以上であることを特徴とする吸着機構。 The adsorption mechanism according to claim 8,
The adsorption mechanism, wherein a loss coefficient tan δ of the vibration absorbing material is 0.5 or more in a temperature range of 5 ° C to 30 ° C.
温度が１０℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．７以上であることを特徴とする吸着機構。 The adsorption mechanism according to claim 8,
An adsorption mechanism, wherein a loss coefficient tan δ of the vibration absorbing material is 0.7 or more in a temperature range of 10 ° C to 30 ° C.
温度が１５℃〜２５℃の範囲において前記振動吸収材の損失係数tanδが１．０以上であることを特徴とする吸着機構。 The adsorption mechanism according to claim 8,
The adsorption mechanism, wherein a loss coefficient tan δ of the vibration absorbing material is 1.0 or more in a temperature range of 15 ° C to 25 ° C.
前記振動吸収材のショア硬さがＡ４０〜Ａ６０であることを特徴とする吸着機構。 In the adsorption mechanism according to any one of claims 7 to 11,
An adsorption mechanism, wherein the vibration absorbing material has a Shore hardness of A40 to A60.
前記テーブルは、
基台と、
前記基台の上に取り付けられた吸着治具と、
前記吸着治具が有するプレートと、
前記プレートの上に設けられた吸着部材と、
前記吸着部材に設けられ前記複数の対象物にそれぞれ対応する複数の突起と、
前記複数の突起のそれぞれにおける上面から前記吸着部材の底面まで貫通する複数の吸着孔と、
前記プレートに設けられ前記複数の吸着孔にそれぞれ連通する複数の貫通孔と、
前記基台に設けられ前記複数の貫通孔につながる空間とを備え、
前記吸着部材は振動吸収材からなり、少なくとも前記空間と前記複数の貫通孔と前記複数の吸着孔とを順次経由して前記吸引機構が前記複数の対象物を吸引することによって、前記複数の対象物が前記吸着治具に吸着されることを特徴とする装置。 An apparatus comprising a table for sucking a plurality of objects, a suction mechanism having the table, and a suction mechanism for sucking the plurality of objects,
The table is
The base,
A suction jig mounted on the base;
A plate of the suction jig;
An adsorbing member provided on the plate;
A plurality of protrusions provided on the suction member and respectively corresponding to the plurality of objects;
A plurality of suction holes penetrating from the top surface of each of the plurality of protrusions to the bottom surface of the suction member;
A plurality of through holes provided in the plate and respectively communicating with the plurality of suction holes;
A space provided in the base and connected to the plurality of through holes,
The suction member is made of a vibration absorbing material, and the suction mechanism sucks the plurality of objects through at least the space, the plurality of through holes, and the plurality of suction holes in order, thereby the plurality of objects. An apparatus in which an object is adsorbed by the adsorbing jig.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが最大値を有することを特徴とする装置。 The apparatus of claim 13.
The apparatus characterized in that the loss coefficient tan δ of the vibration absorber has a maximum value in a temperature range of 5 ° C. to 30 ° C.
温度が５℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．５以上であることを特徴とする装置。 The apparatus of claim 14, wherein
A device characterized in that a loss coefficient tan δ of the vibration absorbing material is 0.5 or more in a temperature range of 5 ° C. to 30 ° C.
温度が１０℃〜３０℃の範囲において前記振動吸収材の損失係数tanδが０．７以上であることを特徴とする装置。 The apparatus of claim 14, wherein
A device characterized in that a loss coefficient tan δ of the vibration absorbing material is 0.7 or more in a temperature range of 10 ° C. to 30 ° C.
温度が１５℃〜２５℃の範囲において前記振動吸収材の損失係数tanδが１．０以上であることを特徴とする装置。 The apparatus of claim 14, wherein
A device characterized in that a loss coefficient tan δ of the vibration absorbing material is 1.0 or more in a temperature range of 15 ° C. to 25 ° C.
前記振動吸収材のショア硬さがＡ４０〜Ａ６０であることを特徴とする装置。 An apparatus according to any of claims 13 to 17,
The apparatus according to claim 1, wherein the vibration absorbing material has a Shore hardness of A40 to A60.
前記装置は組立装置であることを特徴とする装置。The apparatus is an assembly apparatus.
前記装置は搬送装置であることを特徴とする装置。The apparatus is a transport apparatus.
前記装置は測定装置又は検査装置であることを特徴とする装置。The apparatus is a measuring apparatus or an inspection apparatus.
前記装置は加工装置であることを特徴とする装置。The apparatus is a processing apparatus.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014180254A JP6382039B2 (en) | 2014-09-04 | 2014-09-04 | Cutting apparatus, adsorption mechanism and apparatus using the same |
| CN201510490571.2A CN105405805A (en) | 2014-09-04 | 2015-08-11 | Cutting apparatus, adsorption mechanism and apparatus equipped with adsorption mechanism |
| TW104126196A TWI566291B (en) | 2014-09-04 | 2015-08-12 | A cutting device, an adsorption mechanism and a device having an adsorption mechanism |
| KR1020150117404A KR20160028953A (en) | 2014-09-04 | 2015-08-20 | Cutting apparatus, adsorption mechanism and apparatus equpped with adsorption mechanism |
| MYPI2015002168A MY173967A (en) | 2014-09-04 | 2015-09-03 | Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014180254A JP6382039B2 (en) | 2014-09-04 | 2014-09-04 | Cutting apparatus, adsorption mechanism and apparatus using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016054256A JP2016054256A (en) | 2016-04-14 |
| JP2016054256A5 true JP2016054256A5 (en) | 2017-08-24 |
| JP6382039B2 JP6382039B2 (en) | 2018-08-29 |
Family
ID=55471207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014180254A Active JP6382039B2 (en) | 2014-09-04 | 2014-09-04 | Cutting apparatus, adsorption mechanism and apparatus using the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6382039B2 (en) |
| KR (1) | KR20160028953A (en) |
| CN (1) | CN105405805A (en) |
| MY (1) | MY173967A (en) |
| TW (1) | TWI566291B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101899653B1 (en) * | 2016-10-05 | 2018-09-18 | 주식회사 포스코 | Workpiece setting apparatus |
| JP6791581B2 (en) * | 2016-11-11 | 2020-11-25 | 株式会社ディスコ | Jig table for cutting package substrate |
| JP6626027B2 (en) * | 2017-03-16 | 2019-12-25 | Ｔｏｗａ株式会社 | Manufacturing apparatus and electronic component manufacturing method |
| JP2019016700A (en) * | 2017-07-07 | 2019-01-31 | Ｔｏｗａ株式会社 | Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component |
| JP6886379B2 (en) * | 2017-09-28 | 2021-06-16 | Ｔｏｗａ株式会社 | Holding member, manufacturing method of holding member, inspection device and cutting device |
| JP7102157B2 (en) * | 2018-02-08 | 2022-07-19 | Ｔｏｗａ株式会社 | Cutting device and manufacturing method of cut products |
| CN108435714B (en) * | 2018-04-12 | 2023-08-29 | 环维电子(上海)有限公司 | Novel dry ice cleaning base and cleaning method thereof |
| JP6746756B1 (en) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | Suction plate, cutting device and cutting method |
| JP7390855B2 (en) * | 2019-10-24 | 2023-12-04 | 株式会社ディスコ | Chuck table of cutting equipment |
| JP7423161B2 (en) | 2020-06-30 | 2024-01-29 | 株式会社ディスコ | chuck table |
| KR20230135661A (en) * | 2021-03-18 | 2023-09-25 | 토와 가부시기가이샤 | Processing equipment and manufacturing methods of processed products |
| US11993066B2 (en) * | 2021-03-31 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck, lamination process, and manufacturing method of semiconductor package using the same |
| JP7262693B1 (en) * | 2022-10-21 | 2023-04-21 | 株式会社東光高岳 | Work inspection device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62234685A (en) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | Cutting method for working material |
| JPS62234686A (en) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | Cutting method for working material |
| KR20040084128A (en) * | 2003-03-26 | 2004-10-06 | 한미반도체 주식회사 | Chuck table of Sawing equipment |
| JP2004330417A (en) * | 2003-04-30 | 2004-11-25 | Towa Corp | Board cutting method, board cutting device and board sucking and fixing mechanism |
| JP2006229129A (en) * | 2005-02-21 | 2006-08-31 | Fujitsu Ltd | Vacuum suction apparatus |
| JP2006344827A (en) * | 2005-06-09 | 2006-12-21 | Renesas Technology Corp | Method for manufacturing semiconductor device |
| FR2893873B1 (en) * | 2005-11-25 | 2008-12-12 | Air Liquide | PROCESS FOR CUTTING WITH A STAINLESS STEEL FIBER LASER |
| JP2008221391A (en) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | Board sucking and fixing mechanism |
| JP5086690B2 (en) * | 2007-05-18 | 2012-11-28 | 日本特殊陶業株式会社 | Manufacturing method of ceramic substrate |
| JP5117772B2 (en) * | 2007-06-28 | 2013-01-16 | 株式会社ディスコ | Cutting equipment |
| JP2011040542A (en) | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | Dividing method of package substrate |
| JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
-
2014
- 2014-09-04 JP JP2014180254A patent/JP6382039B2/en active Active
-
2015
- 2015-08-11 CN CN201510490571.2A patent/CN105405805A/en active Pending
- 2015-08-12 TW TW104126196A patent/TWI566291B/en active
- 2015-08-20 KR KR1020150117404A patent/KR20160028953A/en not_active Application Discontinuation
- 2015-09-03 MY MYPI2015002168A patent/MY173967A/en unknown
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