KR20040084128A - Chuck table of Sawing equipment - Google Patents

Abstract

PURPOSE: A chuck table for semiconductor sawing apparatus is provided to modify a shape of an absorbing table according to a shape of a processing target by installing a modification unit at a chuck table. CONSTITUTION: A table base(110) includes a vacuum pressure distribution hole(111) having an open top side and a vacuum pressure supply hole(112) connected to the vacuum pressure distribution hole. A support table(120) is loaded on the table base. An absorbing hole(131) is connected to the vacuum pressure distribution hole. An absorbing table(130) is inserted into the support table. A modification unit is installed at a chuck table in order to modify a shape of the absorbing table according to a shape of a processing target and fix the processing target to the absorbing table.

Description

Chuck table of semiconductor sawing device

The present invention relates to a chuck table installed in a semiconductor sawing device for cutting a semiconductor package strip in the form of a ball grid array (BGA).

With the development of information and communication technology, high integration of semiconductor packages is required.In order to achieve this, semiconductor package production using solder ball type strips that can be highly integrated instead of the traditional lead frame is expanding. 1 and 2 of the Republic of Korea Patent No. 366922 may be representative. Such a conventional solder ball type strip is adsorbed by a manipulator which is an articulated robot as shown in FIG. 6 of Korean Patent Registration No. 3,692,22 and is then cut by a cutting device after being moved to a cutting device, or the Republic of Korea Utility Model Registration As disclosed in 304725, the chuck table and the cutting device may be cut while being interlocked with the chuck table of the semiconductor sawing device and moved to the cutting device.

The chuck table serves to fix the workpiece placed on the chuck table when the workpiece is cut by the cutting saw blade, so as not to flow, the conventional chuck table is as shown in Figures 1 and 2, for convenience of The servomotor and ball screw related to rotation and reciprocation are omitted.

According to this, the conventional chuck table includes: a table base 110 having a vacuum pressure distribution groove 111 having an upper surface opened therein and a vacuum pressure supply hole 112 communicating therewith; A support table 120 mounted on the table base 110; Adsorption holes 131 are formed in communication with the vacuum pressure distribution groove 111 is formed of the suction table 130 is inserted into the support table 120 and fixed. The support table 120 is provided with a seating groove 121 on which the suction table 130 is seated, and a vacuum pressure transmission hole 122 for communicating the vacuum pressure distribution groove 111 and the suction hole 131 with each other. The vacuum pressure supply hole 112 of the table base 110 is connected in communication with an external vacuum line (not shown).

Referring to the operation state, first, the workpiece 200 is adsorbed through a separate transfer mechanism (not shown) in the state in which the table base 110, the support table 120 and the suction table 130 are assembled together. When placed on the table 130, the vacuum pressure from the external vacuum line is transferred to the vacuum pressure supply hole 112 → vacuum distribution groove 111 → vacuum pressure transmission hole 122 → suction hole 131, Air is forcibly sucked into the chuck table 100 through the suction hole 131, thereby maintaining the state in which the workpiece 200 seated on the suction table 130 is attached to the suction table 130 at a predetermined pressure. Done.

Thereafter, the chuck table 100 is rotated in the left-right direction (X-axis direction) and the horizontal direction (θ direction) by the combination of the ball screw and the servo motor, so that the saw blade 300 is combined with the ball screw and the servo motor. Thereby, the workpiece 200 is cut by the cutting saw blade 300 by linear movement in the front-rear direction (Y-axis direction) and vertical direction (Z-axis direction).

When the cutting operation of the workpiece 200 is completed, the vacuum pressure supply to the chuck table 100 is cut off, and the workpiece 200 is merely placed on the suction table 130, and in this state, separate transfer is performed. The workpiece 200 cut through the instrument (not shown) is discharged from the chuck table 100.

The operation is then repeated.

Here, the suction table 130 of the chuck table 100, while being able to stably support the workpiece 200 so as not to change the position during the cutting operation, so as to prevent damage to the workpiece 200 seated Some soft properties and physical properties with a certain degree of adhesion is required so that the workpiece 200 does not slip well, and a polymer synthetic rubber material is usually used.

However, according to the prior art, the adsorption table 130 is inserted into the seating groove 121 of the support table 120 to be directly mounted on the fixed structure, so as to be mounted on the adsorption table 130 to be opposed to When the workpiece 200 is twisted or bent as shown in FIG. 2, the workpiece 200 comes into contact with the adsorption table 130 only partially, and thus, the workpiece 200 and some adsorption holes 131. A gap is maintained between them, and outside air continuously flows into the suction hole 131 through this gap. Therefore, since the proper vacuum pressure is not formed in the chuck table 100, the workpiece 200 is not attached to the suction table 130 at a predetermined pressure, and thus the workpiece 200 is cut by the cutting saw blade 300. ) When the workpiece 200 is moved by the cutting saw blade 300, the workpiece is damaged.

In order to solve the above problems under the conventional structure, the adsorption table 130 should be made of a material which can be easily deformed according to the shape of the workpiece 200. However, the rigidity of the adsorption table 130 is weakened. Therefore, as the suction table 130 is deformed by the external force applied when the workpiece 200 is cut by the saw blade 300, the position of the workpiece 200 is changed, so that the cutting defect of the strip is more serious. Is brought about.

Accordingly, an object of the present invention is to provide a chuck table of a semiconductor sawing device that can be appropriately fixed while accommodating deformation of a workpiece.

1 is a perspective view showing a chuck table;

2 is a cross-sectional view taken along line A-A of FIG. 1 as a conventional chuck table;

3a and 3b show a first embodiment of a chuck table according to the invention,

4a and 4b show a second embodiment of the chuck table according to the invention,

5A and 5B show a third embodiment of the chuck table according to the present invention;

6a and 6b show a fourth embodiment of the chuck table according to the invention,

7a and 7b show a fifth embodiment of the chuck table according to the invention,

8A and 8B show a sixth embodiment of the chuck table according to the present invention;

9a and 9b show a seventh embodiment of a chuck table according to the invention,

10A and 10B show a modification of the chuck table shown in FIGS. 9A and 9B;

11A and 11B show an eighth embodiment of a chuck table according to the present invention.

-Explanation of terms for main parts of attached drawings-

10,20; Fixing member, 100; Chuck Table,

110; Table base, 111; Vacuum distribution groove,

112; Vacuum supply hole 120; Support Table,

121; Seating groove, 122; Vacuum transfer hole,

123; Through hole, 130; Adsorption table,

131; Adsorption holes, 132; Deformation Induction Hole,

140; Support plate, 150; Reinforcement Plate,

151; Vacuum transfer hole, 160; Sponge,

161; Vacuum transfer hole, 170; Leaf Spring,

181; Moving plate, 182; O-Ring,

183; Coil spring, 184; Pneumatic cylinder,

200; Workpiece, 300; Cutting Saw Blade,

G1, G2; gap.

The present invention for achieving the above object, the table base is formed with a vacuum pressure distribution groove, the upper surface is opened, and a vacuum pressure supply hole communicated therewith; A support table mounted on this table base; A chuck table of a semiconductor sawing device, comprising a suction table formed with suction holes communicating with a vacuum distribution groove and inserted into and fixed to a support table, wherein the deformation receiving means for causing the suction table to be properly deformed according to the shape of the workpiece is provided. It is provided, the structure is characterized in that the workpiece is closely fixed to the suction table while the suction table is deformed to correspond to the shape of the workpiece.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

3A and 3B, a table base 110 having a vacuum pressure distribution groove 111 having an upper surface opened therein and a vacuum pressure supply hole 112 communicating therewith; A support table 120 mounted on the table base 110; Adsorption hole 131 is formed in communication with the vacuum pressure distribution groove 111 is formed of the suction table 130 is fixed to the support table 120, the suction table 130 is seated on the support table 120 The mounting groove 121 is formed, and the vacuum pressure transmission hole 122 for communicating the vacuum pressure distribution groove 111 and the suction hole 131 with each other is formed between the bottom surface of the suction table 130 and the mounting groove 121. A gap G1 is formed in the deformation receiving means.

Referring to the operation state of the first, when the workpiece 200 placed on the suction table 130 is normal, as shown in Figure 3a, the suction table 130 is maintained in a circular shape and the workpiece 200 is Adsorbed to the adsorption table 130.

However, when the workpiece 200 placed on the suction table 130 is abnormal, the suction table 130 is deformed to correspond to the workpiece 200 by the pressure at the suction, as shown in FIG. 3B. Thus, the workpiece 200 is tightly fixed to the suction table 130.

4A and 4B, a through hole 123 is formed in the support table 120, and an adsorption table 130 is fitted to the upper part of the through hole 123 and is attached to the support plate 140. ) Is fixed to the bottom of the support table 120 and is installed in the vacuum pressure distribution groove 111, and the reinforcing plate 150 having the pneumatic pressure transmission hole 151 is inserted into the bottom of the through hole 123, thereby supporting the support plate ( It is mounted on the fixed 140, it may be such that the gap (G2) is a deformation receiving means between the bottom of the suction table 130 and the support plate 140.

In the case of the second embodiment, since the support plate 140 or the reinforcement plate 150 is required, there is a disadvantage in that the number of members is increased, but the gap G2 can be appropriately adjusted and the precision of the gap G2 can be improved. There is an advantage.

The gap G2 of the first and second embodiments is such that the suction table 130 can sufficiently support the workpiece 200 and can be flexibly deformed according to the shape of the workpiece 200. Adjust accordingly.

On the other hand, as in the third embodiment shown in Figures 5a and 5b, it is also possible to insert a sponge 160 that can accommodate the deformation of the suction table 130 in the gap (G1), in this case a sponge ( By changing the material of 160, it is possible to easily adjust the holding force and deformation degree and the original recovery force of the adsorption table 130.

In the fourth embodiment of the present invention, as shown in FIGS. 6A and 6B, a through hole 123 is formed in the support table 120, and a plate that is a deformation receiving means on the bottom of the support table 120. The spring 170 is fixed to the bottom of the support table 120 to be installed in the vacuum pressure distribution groove 111, and the suction table 130 is supported so that the bottom of the suction table 130 contacts the leaf spring 170. A structure is inserted and fixed in the through hole 123 of the table 120.

According to the fourth embodiment, the bearing force and the degree of deformation of the suction table 130 are adjusted by the leaf spring 170. The leaf spring 170 is disposed between the suction holes 131 such that the vacuum pressure distribution groove 111 and the suction holes 131 communicate with each other, and the number thereof is appropriately adjustable.

7A to 10B, through holes 123 are formed in the support table 120, and are installed in the vacuum pressure distribution groove 111 of the table base 110 so as to be movable upward and downward. Adsorption table using a moving plate 181 and an elastic body that supports the moving plate 181 upwardly and elastically as a deformation receiving means so that the bottom surface of the suction table 130 is in contact with the moving plate 181. The 130 may be inserted into and fixed to the through hole 123 of the support table 120.

In the present embodiment, the elastic body may be an O-ring 182 made of synthetic rubber or synthetic resin as shown in FIGS. 7A and 7B, or a coil spring 183 as shown in FIGS. 8A and 8B, or FIG. 9A. Although the pneumatic cylinder 184 as shown in FIG. 10B is used, the present invention is not limited thereto. Of course, all the known ones that can support the moving plate 181 in one direction can be used as an elastic body. .

Here, the pneumatic cylinder 184 is installed in the support table 120, as shown in Figure 9a and 9b, or is installed in the table base 110 as shown in Figure 10a and 10b, vacuum pressure It may be installed in the distribution groove 111.

Referring to the operating state of this embodiment, first, when the workpiece 200 placed on the suction table 130 is normal, as shown in Figs. 7a and 8a, 9a and 10a, the suction table 130 is The workpiece 200 is adsorbed to the adsorption table 130 while maintaining a circular shape.

However, when the workpiece 200 placed on the suction table 130 is abnormal, as shown in FIGS. 7B and 8B, 9A and 10B, the suction table 130 is prevented by the pressure at the time of suction. The workpiece 200 is deformed to correspond to the work piece 200, and thus, the elastic body 182; 182; 184 is compressed or tensioned, and the movable plate 181 moves downward corresponding to the deformation of the suction table 130. The workpiece 200 is tightly fixed to the suction table 130.

On the other hand, in the present embodiment, although the pneumatic cylinder 184 is completely sealed and supported in one direction so as to maintain a constant internal pressure, if necessary, a pneumatic cylinder 184 can be used to control operation in one or two directions. It may be. When using the pneumatic cylinder 184 is operated in both directions as described above, a separate sensor that can detect whether the workpiece 200 placed on the suction table 130 of the chuck table 100 is normal or abnormal (not shown) ) Can be used together.

11A and 11B, when the lower portion of the suction hole 131 of the suction table 130 is enlarged in diameter to form the deformation guide hole 132, the deformation of the suction table 130 is more smoothly performed. There is an advantage that is made.

In the eighth embodiment, the deformation guide hole 132 is applied to the chuck table 100 according to the fourth embodiment. However, the deformation guide hole 132 is not limited thereto. Of course, all of the examples can be applied.

According to the present invention as described above, the chuck table is provided with a deformation receiving means for appropriately deforming the adsorption table according to the shape of the workpiece, the workpiece is adsorbed while the adsorption table is naturally deformed to correspond to the shape of the workpiece. Since it is tightly fixed to the table, there is an effect that can be performed more stable and precise cutting work.

Claims (8)

A table base 110 having a vacuum pressure distribution groove 111 having an upper surface opened therein and a vacuum pressure supply hole 112 communicating therewith; A support table 120 mounted on the table base 110; In the chuck table of the semiconductor sawing device, the suction hole 131 is formed in communication with the vacuum pressure distribution groove 111 is formed, the suction table 130 is inserted into and fixed to the support table 120, Deformation receiving means is provided to allow the suction table 130 to be properly deformed according to the shape of the workpiece 200, the workpiece 200 is deformed in accordance with the shape of the workpiece 200, the workpiece 200 ) Is a chuck table of the semiconductor sawing device, characterized in that closely attached to the suction table (130). According to claim 1, wherein the support grooves 120, the seating groove 121 on which the suction table 130 is seated, and the vacuum pressure transmission hole for communicating the vacuum pressure distribution groove 111 and the suction hole 131 with each other ( 122 is formed, the chuck table of the semiconductor sawing device, characterized in that the gap (G1) is formed between the bottom of the suction table 130 and the seating groove (121). The method of claim 1, wherein the through hole 123 is formed in the support table 120, the suction table 130 is fitted to the upper portion of the through hole 123, the support plate 140 is the support table 120 The reinforcing plate 150, which is fixed to the bottom surface of the vacuum pressure distribution groove 111 and is formed in the air pressure transmission hole 151, is mounted on the support plate 140 and fixed to the bottom surface of the suction table 130 and the support plate ( Chuck table of the semiconductor sawing device, characterized in that the gap (G2) is formed between the strain receiving means. 4. The chuck table according to claim 2 or 3, wherein a sponge (160) capable of accommodating deformation of the suction table (130) is inserted into the gap (G1; G2). According to claim 1, The through-hole 123 is formed in the support table 120, the leaf spring 170, which is a deformation receiving means on the bottom of the support table 120 is fixed to the bottom of the support table 120 The suction table 130 is inserted into and fixed in the through hole 123 of the support table 120 so that the bottom surface of the suction table 130 contacts the leaf spring 170. A chuck table for a semiconductor sawing device, characterized in that. The method of claim 1, wherein the deformation receiving means, the movable plate 181 and the movable plate 181, which is installed in the vacuum pressure distribution groove 111 of the table base 110 to be movable in the vertical direction, the upward direction. The adsorption table 130 is formed of an elastic body supporting elasticity, and a through hole 123 is formed in the support table 120 so that the bottom surface of the adsorption table 130 contacts the moving plate 181. The chuck table of a semiconductor sawing device, characterized in that the insertion hole is fixed to the through-hole 123 of 120. 7. The chuck table according to claim 6, wherein the elastic body is an O-ring (182), a coil spring (183), or a pneumatic cylinder (184) made of synthetic rubber or synthetic resin. The method according to any one of claims 1 to 3 and 5 to 8, characterized in that the lower portion of the suction hole 131 of the suction table 130 is enlarged in diameter to form a deformation guide hole (132). Chuck table of semiconductor sawing device.