TW200506077A - Sputtering target and method for production thereof - Google Patents
Sputtering target and method for production thereofInfo
- Publication number
- TW200506077A TW200506077A TW093122376A TW93122376A TW200506077A TW 200506077 A TW200506077 A TW 200506077A TW 093122376 A TW093122376 A TW 093122376A TW 93122376 A TW93122376 A TW 93122376A TW 200506077 A TW200506077 A TW 200506077A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- production
- sputtering target
- sintering
- produced
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C16/00—Alloys based on zirconium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/10—Alloys based on aluminium with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/02—Amorphous alloys with iron as the major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/10—Amorphous alloys with molybdenum, tungsten, niobium, tantalum, titanium, or zirconium or Hf as the major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/053—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with zinc as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003286876 | 2003-08-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200506077A true TW200506077A (en) | 2005-02-16 |
TWI296013B TWI296013B (zh) | 2008-04-21 |
Family
ID=34113984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093122376A TW200506077A (en) | 2003-08-05 | 2004-07-27 | Sputtering target and method for production thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US8430978B2 (zh) |
EP (1) | EP1652960B1 (zh) |
JP (4) | JP4351212B2 (zh) |
KR (2) | KR100812943B1 (zh) |
CN (1) | CN100457963C (zh) |
TW (1) | TW200506077A (zh) |
WO (1) | WO2005012591A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI821944B (zh) * | 2021-03-12 | 2023-11-11 | 南韓商可隆股份有限公司 | 濺鍍靶、其製造方法以及製造合金薄膜的方法 |
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EP1813344B1 (en) * | 2004-11-15 | 2014-08-13 | JX Nippon Mining & Metals Corporation | Hydrogen separation membrane, sputtering target for forming of hydrogen separation membrane, and process for producing the same |
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WO2007097396A1 (ja) * | 2006-02-22 | 2007-08-30 | Nippon Mining & Metals Co., Ltd. | 高融点金属からなる焼結体スパッタリングターゲット |
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JP2008155333A (ja) * | 2006-12-25 | 2008-07-10 | Japan Science & Technology Agency | 金属ガラスを用いたマイクロマシン及びそれを用いたセンサ並びにその製造方法 |
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2004
- 2004-07-14 JP JP2005512480A patent/JP4351212B2/ja active Active
- 2004-07-14 EP EP04747777.3A patent/EP1652960B1/en active Active
- 2004-07-14 KR KR1020077014504A patent/KR100812943B1/ko active IP Right Grant
- 2004-07-14 KR KR1020067002328A patent/KR100749658B1/ko active IP Right Grant
- 2004-07-14 WO PCT/JP2004/010361 patent/WO2005012591A1/ja active Application Filing
- 2004-07-14 CN CNB2004800219920A patent/CN100457963C/zh active Active
- 2004-07-14 US US10/566,116 patent/US8430978B2/en active Active
- 2004-07-27 TW TW093122376A patent/TW200506077A/zh unknown
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2009
- 2009-05-15 JP JP2009118277A patent/JP5133940B2/ja active Active
- 2009-05-15 JP JP2009118276A patent/JP5122515B2/ja active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI821944B (zh) * | 2021-03-12 | 2023-11-11 | 南韓商可隆股份有限公司 | 濺鍍靶、其製造方法以及製造合金薄膜的方法 |
Also Published As
Publication number | Publication date |
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KR100749658B1 (ko) | 2007-08-14 |
KR100812943B1 (ko) | 2008-03-11 |
US8430978B2 (en) | 2013-04-30 |
KR20070070264A (ko) | 2007-07-03 |
TWI296013B (zh) | 2008-04-21 |
KR20060037420A (ko) | 2006-05-03 |
EP1652960B1 (en) | 2017-08-30 |
CN1829820A (zh) | 2006-09-06 |
JP5122514B2 (ja) | 2013-01-16 |
CN100457963C (zh) | 2009-02-04 |
JP2009263795A (ja) | 2009-11-12 |
WO2005012591A1 (ja) | 2005-02-10 |
JP4351212B2 (ja) | 2009-10-28 |
EP1652960A4 (en) | 2007-11-07 |
JP5133940B2 (ja) | 2013-01-30 |
JP2009242947A (ja) | 2009-10-22 |
JPWO2005012591A1 (ja) | 2006-09-21 |
JP5122515B2 (ja) | 2013-01-16 |
JP2009263796A (ja) | 2009-11-12 |
EP1652960A1 (en) | 2006-05-03 |
US20060185771A1 (en) | 2006-08-24 |
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